JP2017533476A - Arrangement method of fluorescent layer - Google Patents

Abstract

The present invention provides a phosphor layer manufacturing method comprising: a vertical frame; and a plurality of phosphor layer pattern holes in which a shape of the phosphor layer pattern is penetrated in a vertical direction of the vertical frame in a predetermined region of the vertical frame. Preparing the equipment, and filling each of the plurality of phosphor layer pattern holes of the phosphor layer manufacturing equipment with a phosphor layer material solution containing phosphor, silicon and filler, and then drying the filled phosphor layer material solution. A phosphor layer, and a light emitting diode separated from the phosphor 11 below the phosphor present in any one of the plurality of phosphor layer pattern holes of the phosphor layer manufacturing equipment. A step of positioning and applying a force in a vertical direction from the top to the bottom of the phosphor existing in the phosphor layer pattern hole, so that the phosphor becomes the phosphor layer It provides a method for arranging fluorescent layer comprising the steps arranged on the upper surface of the light emitting diode from the turn hole and pulled out vertically downward, the.

Description

  The present invention relates to a method of arranging a fluorescent layer, and more specifically, when a fluorescent layer is separated and placed on the upper surface of a light emitting diode, the fluorescent layer is efficiently disposed at a desired location while suppressing damage to the fluorescent material. The present invention relates to a method for arranging fluorescent layers that can be arranged.

  In recent years, light-emitting diodes in which Al or In is added to GaN have attracted attention because they have advantages such as longer life, lower power consumption, superior brightness, and gentleness to the environment that are harmless to the human body compared to conventional incandescent lamps. In particular, light emitting diode chips that employ a fluorescent layer to provide white light are still in the spotlight.

  This type of light-emitting diode is used in automobile lighting, traffic signal lights, backlight units (BLU: Back Light Unit) of liquid crystal display devices, and the like due to the above-described advantages.

  Recently, a MacAdam Rule has been proposed as an index for evaluating whether the color coordinates measured with an artificial light source are the same as the color coordinates as seen by the human eye. Such Macadam rules provide four levels of standards. In the Mishu region, the current situation is that artificial light sources that do not meet the three-stage criteria of the Macadam Rules are not allowed to be sold. In order to satisfy the three stages of the Macadam rule, it is very important to reduce the color variation of white light.

  On the other hand, a fluorescent film in which a fluorescent material is formed on a film surface of a resin material has been proposed (see, for example, Patent Document 1 below), and in order to dispose the above-described fluorescent film on the upper surface of a light emitting diode. A process of peeling or cutting off the fluorescent film is necessary. When the above-described fluorescent film is peeled off or cut off, the fluorescent material may be damaged by an electrostatic force or an adhesive force between the fluorescent material and the resin material film, or may be damaged on the upper surface of the light emitting diode. Since it is not arranged efficiently, it is very difficult to reduce the color variation of white light.

Korean Published Patent No. 10-2008-0070193

  Therefore, the present invention has been devised in order to eliminate the disadvantages of the prior art, and the technical problem to be solved by the present invention is when the fluorescent layer is separated and disposed on the upper surface of the light emitting diode. It is an object of the present invention to provide a fluorescent layer arranging method capable of efficiently arranging a fluorescent layer at a desired location while suppressing breakage of the fluorescent substance.

  The technical problem to be solved by the present invention is not limited to the technical problem described above, and other technical problems that are not mentioned are known in the technical field to which the present invention belongs from the following description. It should be clearly understood by those who have

  An arrangement method of a fluorescent layer according to an embodiment of the present invention devised to solve the technical problem described above includes a vertical frame and a fluorescent layer in a vertical direction of the vertical frame within a predetermined region of the vertical frame. Preparing a phosphor layer manufacturing equipment having a plurality of phosphor layer pattern holes through which the shape of the pattern is perforated, and phosphor, silicon in each of the plurality of phosphor layer pattern holes of the phosphor layer manufacturing equipment And filling the phosphor layer material solution containing the filler and then drying the filled phosphor layer material solution to produce a phosphor layer, and any one of a plurality of phosphor layer pattern holes of the phosphor layer production equipment A step of positioning a light-emitting diode at a lower portion of the phosphor existing in one phosphor layer pattern hole, and separating the phosphor from the phosphor; By force is applied vertically downward from parts, comprising the steps of: said phosphor is disposed on an upper surface of the light emitting diode and pulled out vertically downward from the fluorescent layer pattern holes.

  According to an embodiment of the present invention, in the step of arranging the phosphor on the upper surface of the light emitting diode, the phosphor layer is added in a vertical direction from the top to the bottom of the phosphor present in the phosphor layer pattern hole. The applied force may be transmitted by an object having a flat bottom surface.

  A method of arranging a fluorescent layer according to another embodiment of the present invention devised to solve the technical problem described above includes a vertical frame, and a fluorescent layer in a vertical direction of the vertical frame within a predetermined region of the vertical frame. Preparing a phosphor layer manufacturing equipment having a plurality of phosphor layer pattern holes that are perforated through the shape of the layer pattern; and a phosphor in each of the plurality of phosphor layer pattern holes of the phosphor layer manufacturing equipment, After filling the phosphor layer material solution containing silicon and filler, drying the filled phosphor layer material solution to produce a phosphor layer, and any one of the plurality of phosphor layer pattern holes of the phosphor layer production equipment An upper guider is positioned at a lower part of the phosphor existing in one of the phosphor layer pattern holes and spaced apart from the phosphor 11, and a phosphor is formed above the phosphor present in the phosphor layer pattern hole. A step of positioning the vacuum chuck away from the body, and the upper guider applies a force in the vertical direction from the lower side to the upper side of the phosphor existing in the phosphor layer pattern hole so that the phosphor becomes the phosphor layer. A step of removing the pattern hole vertically upward and placing it on the lower surface of the vacuum chuck, and the pressure of the phosphor placed on the lower surface of the vacuum chuck is kept below a predetermined pressure by the vacuum chuck. A step of adsorbing the phosphor on the lower surface of the vacuum chuck; and a step of moving the phosphor adsorbed on the lower surface of the vacuum chuck and disposing the phosphor on the upper surface of the light emitting diode.

  In another embodiment of the present invention, the fluorescent layer may be arranged such that the upper surface of the upper guider is flat.

  According to the present invention, the fluorescent layer disposing method according to the embodiment of the present invention includes a fluorescent layer pattern hole formed in a vertical frame region without forming a fluorescent material on a film surface of a resin material. Efficiently cuts off the electrostatic force and adhesive force generated between the fluorescent material and the resin material film by simply pulling the fluorescent layer manufactured by filling the fluorescent material solution in the vertical direction. Therefore, the fluorescent material can be disposed on the upper surface of the light emitting diode at a desired location without being damaged.

  Meanwhile, according to another embodiment of the present invention, the fluorescent layer is disposed in the fluorescent layer pattern hole formed in the vertical frame region without forming the fluorescent material on the film surface of the resin material. The fluorescent layer produced by filling the solution is simply pulled apart by applying an upward force in the vertical direction, and adsorbed using a vacuum chuck, thereby generating electrostatic force and adhesion between the fluorescent material and the resin film. Since the force can be cut off efficiently, the fluorescent material can be disposed on the upper surface of the light emitting diode at a desired location without being damaged.

It is a top view of the fluorescent layer manufacturing equipment used for the arrangement method of the fluorescent layer by the embodiment of the present invention. It is a perspective view of the fluorescent layer manufacturing equipment used for the arrangement method of the fluorescent layer by the embodiment of the present invention. FIG. 3 is a perspective view showing that a fluorescent layer is manufactured by the fluorescent layer manufacturing equipment of FIG. 2. as well as It is sectional drawing for demonstrating the detailed step of the arrangement | positioning method of the fluorescent layer by one Embodiment of this invention. It is sectional drawing for demonstrating the detailed step of the arrangement | positioning method of the fluorescent layer by other embodiment of this invention. It is sectional drawing for demonstrating the detailed step of the arrangement | positioning method of the fluorescent layer by other embodiment of this invention. It is sectional drawing for demonstrating the detailed step of the arrangement | positioning method of the fluorescent layer by other embodiment of this invention. It is sectional drawing for demonstrating the detailed step of the arrangement | positioning method of the fluorescent layer by other embodiment of this invention.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  As shown in FIG. 1 or FIG. 2, the phosphor layer manufacturing equipment used in the method for arranging the phosphor layer according to the embodiment of the present invention includes a vertical frame 1100 and a vertical region of the vertical frame 1100 within a predetermined region of the vertical frame 1100. You may comprise so that it may have many fluorescent layer pattern holes 1111-1114, 1121-1124, 1131-1134, 1141-1144 in which the shape of the fluorescent layer pattern penetrates in the direction.

  Here, the multiple phosphor layer pattern holes 1111 to 1114, 1121 to 1124, 1131 to 1134, and 1141 to 1144 may each have the shape of a pad electrode. Specifically, as shown in FIG. 1 or FIG. 2, a rectangular shape is included on each of the upper left side and the upper right side of each of the plurality of fluorescent layer pattern holes 1111-1114, 1121-1124, 1131-1134, 1141-1144. As a result, when the fluorescent layer is manufactured by filling the fluorescent layer pattern holes 1111 to 1114, 1121 to 1124, 1131 to 1134, and 1141 to 1144 with the fluorescent substance solution, respectively, Pad electrodes can be arranged on the right side.

  On the other hand, as shown in FIG. 1 or 2, the number of the phosphor layer pattern holes 1111 to 1114, 1121 to 1124, 1131 to 1134, and 1141 to 1144 does not necessarily have the shape of the pad electrode on the upper left side and the upper right side. The shape of the pad electrode may be included at various locations such as the upper center, the lower left side, the lower center, and the lower right side as needed.

  Further, as shown in FIG. 1 or FIG. 2, the large number of fluorescent layer pattern holes 1111 to 1114, 1121 to 1124, 1113 to 1134, and 1141 to 1144 do not necessarily include only square pad electrodes, Various pad electrode shapes such as a circle, a triangle, a pentagon, and a hexagon may be included as required.

  Here, the vertical frame 1100 may be formed of a non-transmissive material that does not transmit light. Specifically, it may be formed of a non-permeable metal material such as aluminum or stainless steel (SUS: Steel Use Stainless) or a non-permeable insulating material such as silicon or silicon oxide. As described above, when the vertical frame 1100 is formed of a non-transparent material that does not transmit light, the fluorescent layer dried in the fluorescent layer pattern holes 1111 to 1114, 1121 to 1124, 1131 to 1134, and 1141 to 1144 emits light as it is. The light emitted from the light emitting diode is not transmitted to the vertical frame 1100 when the light emitted from the light emitting diode is transmitted through the fluorescent layer after being positioned on the diode and the characteristics of the light passing through the fluorescent layer are tested. Since it is transmitted only through the fluorescent layer, the test described later can be performed efficiently.

  Meanwhile, the fluorescent layer pattern holes 1111 to 1114, 1121 to 1124, 1131 to 1134, and 1141 to 1144 are filled with a fluorescent substance solution having a viscosity of about 1,000 cP to 300,000 cP to manufacture a fluorescent layer. May be. When the fluorescent substance solution having the viscosity in the above-described range is used, the fluorescent substance solution is efficiently held in the multiple fluorescent layer pattern holes 1111 to 1114, 1121 to 1124, 1131 to 1134, and 1141 to 1144, respectively. Yield is kept stable.

  Hereinafter, a method for manufacturing a fluorescent layer using the fluorescent layer manufacturing equipment used in the fluorescent layer arranging method according to the embodiment of the present invention will be described.

  First, a plurality of phosphor layer patterns are formed using a phosphor solution containing phosphor, silicon, filler, etc., which converts the light provided by the light emitting diode into white light by changing the wavelength of the light provided by the light emitting diode. The holes 1111 to 1114, 1121 to 1124, 1131 to 1134, and 1141 to 1144 are filled, respectively.

  Then, the upper and lower parts of the vertical frame 1100 filled with the phosphor material solution are flattened.

  Next, when the vertical frame 1100 filled with the phosphor material solution is baked and dried at a temperature of 50 ° C. to 200 ° C. for about 5 to 100 minutes, as shown in FIG. 3, the phosphor layer pattern holes 1111 to 1114 and 1121 ˜1124, 1131 to 1134, 1141 to 1144, the fluorescent layers 11 to 14, 21 to 24, 31 to 34, and 41 to 44 are positioned.

  Next, the fluorescent layers 11 to 14, 21 to 24, 31 to 34, and 41 to 44 that are dried in the fluorescent layer pattern holes 1111 to 1114, 1121 to 1124, 1113 to 1134, and 1141 to 1144 are directly placed on the top of the light emitting diode. After being positioned, the light emitted from the light emitting diode is transmitted through the fluorescent layers 11 to 14, 21 to 24, 31 to 34, and 41 to 44 to test the identification of the light that has passed through the fluorescent layer.

  Hereinafter, a method for arranging fluorescent layers according to an embodiment of the present invention will be described.

  First, as described above, the vertical frame 1100 and a plurality of fluorescent layer pattern holes in which the shape of the fluorescent layer pattern is penetrated in the vertical direction of the vertical frame in a predetermined region of the vertical frame. A fluorescent layer manufacturing equipment 1000 is prepared.

  Next, as described above, the phosphor layer material solution including phosphor, silicon and filler is filled in each of the plurality of phosphor layer pattern holes of the phosphor layer manufacturing equipment 1000, and then the filled phosphor layer material solution is dried. To produce a fluorescent layer.

  Next, as shown in FIG. 4, the phosphor layer manufacturing equipment 1000 emits light separated from the phosphor 11 at the lower portion of the phosphor 11 existing in any one of the phosphor layer pattern holes 1111. A diode 1300 is positioned.

  Next, as shown in FIG. 5, a force is applied in the vertical direction from the top to the bottom of the phosphor 11 existing in the phosphor layer pattern hole 1111 so that the phosphor 11 moves downward from the phosphor layer pattern hole 1111. The light emitting diode 1300 is disposed on the top surface of the light emitting diode 1300 in the vertical direction. Here, the force applied in the vertical direction from the top to the bottom of the phosphor 11 existing in the phosphor layer pattern hole 1111 may be transmitted by the lower guider 1200 having a flat bottom surface.

  Hereinafter, a method for arranging fluorescent layers according to another embodiment of the present invention will be described.

  First, as described above, the vertical frame 1100 and a plurality of fluorescent layer pattern holes in which the shape of the fluorescent layer pattern is penetrated in the vertical direction of the vertical frame in a predetermined region of the vertical frame. A fluorescent layer manufacturing equipment 1000 is prepared.

  Next, as described above, the phosphor layer material solution including phosphor, silicon and filler is filled in each of the plurality of phosphor layer pattern holes of the phosphor layer manufacturing equipment 1000, and then the filled phosphor layer material solution is dried. To produce a fluorescent layer.

  Next, as shown in FIG. 6, the phosphor layer manufacturing equipment 1000 is spaced apart from the phosphor 11 at the lower part of the phosphor 11 existing in any one of the many phosphor layer pattern holes 1111. The guider 2200 is positioned, and the vacuum chuck 2400 is positioned apart from the phosphor 11 on the phosphor 11 existing in the phosphor layer pattern hole 1111.

  Next, as shown in FIG. 7, the upper guider 2200 applies a force in the vertical direction upward from the lower portion of the phosphor 11 existing in the phosphor layer pattern hole 1111, so that the phosphor 11 has the phosphor layer pattern. The vacuum chuck 2400 is placed on the lower surface of the vacuum chuck 2400 by being pulled out from the hole 1111 in the vertical direction. Here, as the upper guider 2200, a flat upper surface can be used.

  Next, as shown in FIG. 8, the pressure of the phosphor placed on the lower surface of the vacuum chuck 2400 is kept below a predetermined pressure by the vacuum chuck, and the phosphor 11 is attracted to the lower surface of the vacuum chuck 2400. Is done.

  Next, as shown in FIG. 9, the phosphor 11 adsorbed on the lower surface of the vacuum chuck 2400 is moved and disposed on the upper surface of the light emitting diode 2300.

  While the invention has been described and illustrated in connection with a preferred embodiment for illustrating the principles of the invention, the invention is limited to the precise construction and operation as shown and described. is not.

  Rather, it will be appreciated by those skilled in the art that many variations and modifications may be made to the invention without departing from the spirit and scope of the appended claims.

  Accordingly, all such appropriate changes and modifications and equivalents should also be considered within the scope of the present invention.

Claims (4)

A phosphor layer manufacturing equipment having a vertical frame and a plurality of phosphor layer pattern holes in which a shape of the phosphor layer pattern is penetrated in a vertical direction of the vertical frame in a predetermined region of the vertical frame is prepared. Steps,
A step of manufacturing a fluorescent layer by filling each of the plurality of fluorescent layer pattern holes of the fluorescent layer manufacturing equipment with a fluorescent layer material solution containing phosphor, silicon and filler, and then drying the filled fluorescent layer material solution; When,
A step of positioning the light emitting diode at a lower part of the phosphor existing in one of the plurality of phosphor layer pattern holes of the phosphor layer manufacturing equipment and spaced from the phosphor;
When a force is applied in the vertical direction from the top to the bottom of the phosphor existing in the phosphor layer pattern hole, the phosphor is pulled out from the phosphor layer pattern hole in the vertical direction and the upper surface of the light emitting diode is removed. And arranging the fluorescent layer. In the step of placing the phosphor on the top surface of the light emitting diode,
The method for arranging fluorescent layers according to claim 1, wherein the force applied in the vertical direction from the top to the bottom of the phosphor existing in the fluorescent layer pattern hole is transmitted by an object having a flat bottom surface. A phosphor layer manufacturing equipment having a vertical frame and a plurality of phosphor layer pattern holes in which a shape of the phosphor layer pattern is penetrated in a vertical direction of the vertical frame in a predetermined region of the vertical frame is prepared. Steps,
A step of manufacturing a fluorescent layer by filling each of the plurality of fluorescent layer pattern holes of the fluorescent layer manufacturing equipment with a fluorescent layer material solution containing phosphor, silicon and filler, and then drying the filled fluorescent layer material solution; When,
The upper guider is located at the lower part of the phosphor existing in the phosphor layer pattern hole of any one of the plurality of phosphor layer pattern holes of the phosphor layer manufacturing equipment, and is located in the phosphor layer pattern hole. Placing a vacuum chuck on the top of the phosphor to be spaced apart from the phosphor;
The upper guider applies a force in the vertical direction upward from the lower part of the phosphor existing in the phosphor layer pattern hole, so that the phosphor is pulled out from the phosphor layer pattern hole in the vertical direction upward. A step placed on the underside of the vacuum chuck;
The pressure of the phosphor placed on the lower surface of the vacuum chuck is kept below a predetermined pressure by the vacuum chuck, and the phosphor is adsorbed on the lower surface of the vacuum chuck;
Moving the phosphor adsorbed on the lower surface of the vacuum chuck and disposing the phosphor on the upper surface of the light emitting diode.   The method for arranging a fluorescent layer according to claim 3, wherein the upper surface of the upper guider is flat.

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