JP2017517889A - 液体冷却用の内部空洞を備えるヒートシンク - Google Patents
液体冷却用の内部空洞を備えるヒートシンク Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
- F28F3/044—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element the deformations being pontual, e.g. dimples
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
- F28F3/046—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element the deformations being linear, e.g. corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20872—Liquid coolant without phase change
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0077—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for tempering, e.g. with cooling or heating circuits for temperature control of elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/08—Fastening; Joining by clamping or clipping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49352—Repairing, converting, servicing or salvaging
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (22)
- 液体冷却用の内部空洞を備えるヒートシンクであって、
内部空洞内に延びるフィンの第1のグループを有する第1の部分と、
内部空洞内に延び、かつ前記フィンの第1のグループの間に適合するように構成される、フィンの第2のグループを有する第2の部分であって、内部空洞が形成されるような前記第1の部分に取り付けられる第2の部分と、
第1および第2の部分の少なくとも一方の内部空洞内への注入口と、
第1および第2の部分の少なくとも一方の内部空洞からの排出口と
を備えるヒートシンク。 - 前記フィンの第1のグループは第1のアレイに配置された第1のピンを備え、
前記フィンの第2のグループは第2のアレイに配置された第2のピンを備える請求項1に記載のヒートシンク。 - 第1のアレイは、第2のアレイ内の列からずらして配置された列を有し、かつ前記第1のアレイは前記第2のアレイのカラムからずれているカラムを有する請求項2に記載のヒートシンク。
- 前記第1のアレイ内のカラムのうちの1つがN個の完全なピンを有し、前記第2のアレイ内の対応するカラムはN−1個の完全なピンおよび2つのハーフピンを有し、前記2つのハーフピンは前記N−1個の完全なピンの上方および下方にそれぞれ位置する請求項3に記載のヒートシンク。
- 前記第1の部分は内部空洞を有し、かつ、前記第2の部分が前記第1の部分に取り付けられるとき内部空洞を閉じるように前記第2の部分は実質的に平らな蓋である請求項1に記載のヒートシンク。
- 前記注入口と前記排出口が前記第1の部分上に配置されている請求項5に記載のヒートシンク。
- 前記注入口は、内部空洞に到達する前に旋回し、かつ前記ヒートシンクが前記旋回においてフィンを有する請求項1に記載のヒートシンク。
- 前記排出口は、前記内部空洞の後に旋回し、かつ前記ヒートシンクが前記旋回においてフィンを有する請求項1に記載のヒートシンク。
- 実質的に平坦であって第1および第2の部分によって形成されるハウジングを備え、前記ヒートシンクは、前記ハウジングの端のタブをさらに備え、前記タブは、電気部品を保持するためのハウジング上にばねを位置決めするために備えられる請求項1に記載のヒートシンク。
- 各ばねが、ハウジングの各側に1つずつ一対の電気部品を保持するためのクリップを備える請求項9に記載のヒートシンク。
- 前記フィンの第1のグループは前記ピンの第2のグループに対して反対の位置に向けられる請求項1に記載のヒートシンク。
- 前記フィンの第1のグループおよび前記フィンの第2のグループは、互いに完全に重なる請求項11に記載のヒートシンク。
- 前記フィンの第1および第2のグループは同一の形状を有する請求項1に記載のヒートシンク。
- 前記フィンがピンであって、かつ同一の形状が楕円形の外形を備える請求項13のヒートシンク。
- 前記フィンの第1および第2のグループの各々はピンであって、かつ前記ピンの各々がドラフトを有する請求項1に記載のヒートシンク。
- 注入口は、少なくとも取り付けられたもう一方のヒートシンクを有する第1のマニホールドに接続するように構成されており、排出口もまた、少なくとも取り付けられた他のヒートシンクを有する第2のマニホールドに接続するように構成され、前記第1および第2のマニホールドは、前記ヒートシンクおよび前記他のヒートシンクを通して冷却剤のパラレルフローを提供する請求項1に記載のヒートシンク。
- 第1及び第2の部分は、各々第1および第2の鋳造部品からなる請求項1に記載のヒートシンク。
- 第1および第2の部分は、アルミニウムで作られる請求項1に記載のヒートシンク。
- 内部空洞内に延びるフィンの第1のグループを有する第1の部分を鋳造し、
前記内部空洞が形成されるように、前記第1の部分に取り付けられるように構成された第2の部分を鋳造し、前記第2の部分は、内部空洞内に延びるフィンの第2のグループを有し、かつ前記フィンの第1のグループの間に適合するように構成されており、内部空洞への注入口は、少なくとも第1および第2の部分の一方上に位置され、内部空洞からの排出口は、少なくとも第1および第2の部分の一方上に位置され、
そして、前記第1の部分に前記第2の部分を取り付ける、液体冷却用の内部空洞を備えるヒートシンクを製造する方法。 - 前記フィンの第1のグループは、第1のアレイ内に配置された第1のピンを備え、
前記フィンの第2のグループは、第2のアレイ内に配置された第2のピンを備え、
前記第1のアレイは、前記第2のアレイ内の列からずれた列を有し、
前記第1のアレイは、前記第2のアレイ内のカラムからずれたカラムを有する、請求項19に記載の方法。 - 前記第1のアレイ内のカラムのうちのひとつがN個の完全なピンを有し、かつ前記第2のアレイ内の対応するカラムがN−1個の完全なピンと前記N−1個の完全なピンの上下にそれぞれ2つのハーフピンを有する、請求項20に記載の方法。
- 前記第1および第2の部分がアルミニウムから鋳造される、請求項19に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/286,670 US10178805B2 (en) | 2014-05-23 | 2014-05-23 | Heatsink with internal cavity for liquid cooling |
US14/286,670 | 2014-05-23 | ||
PCT/US2015/031396 WO2015179306A1 (en) | 2014-05-23 | 2015-05-18 | Heatsink with internal cavity for liquid cooling |
Publications (1)
Publication Number | Publication Date |
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JP2017517889A true JP2017517889A (ja) | 2017-06-29 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016569372A Pending JP2017517889A (ja) | 2014-05-23 | 2015-05-18 | 液体冷却用の内部空洞を備えるヒートシンク |
Country Status (6)
Country | Link |
---|---|
US (1) | US10178805B2 (ja) |
EP (1) | EP3146818A4 (ja) |
JP (1) | JP2017517889A (ja) |
KR (1) | KR101865635B1 (ja) |
CN (1) | CN106465563A (ja) |
WO (1) | WO2015179306A1 (ja) |
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Also Published As
Publication number | Publication date |
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WO2015179306A1 (en) | 2015-11-26 |
US10178805B2 (en) | 2019-01-08 |
CN106465563A (zh) | 2017-02-22 |
KR20160142343A (ko) | 2016-12-12 |
EP3146818A1 (en) | 2017-03-29 |
KR101865635B1 (ko) | 2018-06-08 |
EP3146818A4 (en) | 2018-01-24 |
US20150342092A1 (en) | 2015-11-26 |
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