JP2017224752A - Electronic apparatus and power converter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus in which heating electronic components and a circuit board housed in a housing can be cooled efficiently.SOLUTION: An electronic apparatus includes a circuit board 10 mounted with a plurality of electronic components, a heat sink 7 being installed on the circuit board and having an air intake port 17 formed at one ends of air passages 20a to 20e, and an air outlet port 18 formed at the other ends of air passages, a fan 8, and a housing 2. Just before the air outlet port, first heating electronic components 15, 16 being in contact with cooling air blown out from the air outlet port, and increasing blowing resistance of the air outlet port are disposed. Further, a second heating electronic component 14 is disposed near a sidewall 7a of the heat sink. At a position of the sidewall of the heat sink facing the second heating electronic component, a first air jet port 21 communicating with the air passages and jetting the cooling air to the second heating electronic component is formed.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic device and a power conversion device in which a device for cooling an electronic component that generates heat is housed in a casing.

For example, Patent Document 1 is known as an electronic device in which a device for cooling an electronic component that generates heat is housed in a casing.
In the device of Patent Document 1, a circuit board on which a plurality of electronic components including a heat generating electronic component are mounted, a cylindrical heat sink, and a fan are housed in a housing, and the heat sink is installed on the substrate. And a fan is connected to the intake of the heat sink. When the fan is driven, the air that has entered the heat sink inlet from the outside of the housing passes through the ventilation path of the heat sink and is blown out from the outlet on the opposite side of the inlet.

  And the apparatus of patent document 1 arrange | positions the coil component which is an electronic component which generate | occur | produces in the blower outlet of a heat sink, cools a coil component with the air blown from the blower outlet, and the air which changed direction by hitting a coil component By circulating inside the casing, other electronic components that generate heat are cooled.

Japanese Patent No. 4655987

By the way, in the device of Patent Document 1, high-temperature air after cooling from the air outlet of the heat sink and cooling the coil components circulates inside the housing, so that other heat generating electronic components and circuit boards can be efficiently used. It cannot be cooled.
Therefore, an object of the present invention is to provide an electronic device and a power conversion device that can efficiently cool a heat generating electronic component and a circuit board housed in a housing.

  In order to achieve the above object, an electronic device according to one embodiment of the present invention includes a circuit board on which a plurality of electronic components including heat generating electronic components such as a semiconductor element, a coil, and a magnetic component are mounted, and one end of a ventilation path. An air intake port is formed in the air passage, an air outlet is formed at the other end of the ventilation path, and the cylindrical heat sink installed on the circuit board and the cooling air that is attached to the air intake port of the heat sink and taken in from the outside A fan that blows out to the air outlet through the ventilation path, and a housing that houses a plurality of electronic components, a circuit board, a heat sink, and the fan, from the air outlet immediately before the air outlet of the heat sink A first heat generating electronic component that contacts the blown cooling air and increases the blowing resistance of the air blowing port is disposed near the side wall of the heat sink. The second heat generating electronic component is disposed, and a first air jet that injects cooling air to the second heat generating electronic component in communication with the ventilation path at a position facing the second heat generating electronic component on the side wall of the heat sink. An exit is formed.

  In addition, a power conversion device according to one embodiment of the present invention is a device that includes the electronic device described above and converts DC power into AC power.

  According to the electronic device and the power conversion device of the present invention, the heat generating electronic components and the circuit board housed in the housing can be efficiently cooled.

It is a perspective view showing the outline of the power converter of a 1st embodiment concerning the present invention. It is a figure which shows one side of the power converter device of 1st Embodiment. It is a figure which shows the circuit board, heat sink, and fan which mounted the electronic component accommodated in the housing | casing in 1st Embodiment. It is a perspective view which shows the heat sink of 1st Embodiment. It is a perspective view of the direction different from FIG. 4 which shows the heat sink of 1st Embodiment. It is sectional drawing which shows the 1st air jet nozzle formed in the heat sink of 1st Embodiment. It is a perspective view which shows the state which fixed the fan to the heat sink of 1st Embodiment, and contacted the semiconductor device. It is the perspective view which showed the heat sink, the fan, and the semiconductor device from the direction different from FIG. It is a figure which shows the circuit board, heat sink, and fan which mounted the electronic component accommodated in the housing | casing in the power converter device of 2nd Embodiment which concerns on this invention. It is a figure which shows the circuit board, heat sink, and fan which mounted the electronic component accommodated in the housing | casing in the power converter device of 3rd Embodiment which concerns on this invention. It is a perspective view which shows the heat sink used with the power converter device of 3rd Embodiment. It is a figure which shows the 3rd air jet formed in the heat sink of 4th Embodiment which concerns on this invention. It is a figure which shows the 4th air jet formed in the heat sink of 5th Embodiment which concerns on this invention.

  Next, first to fifth embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  Further, the following first to fifth embodiments exemplify apparatuses and methods for embodying the technical idea of the present invention, and the technical idea of the present invention is the material of a component, The shape, structure, arrangement, etc. are not specified below. The technical idea of the present invention can be variously modified within the technical scope defined by the claims described in the claims.

[Power Converter of First Embodiment]
Hereinafter, 1st Embodiment of a power converter device provided with the cooling device which concerns on this invention is described with reference to FIGS.
As shown in FIG. 1, the power conversion device 1 is a device used as a DC / AC converter, and has a rectangular parallelepiped housing 2.

The housing 2 includes a case 3 having a bottomed box shape and a rectangular shape in plan view, and a lid 4 that closes an upper opening of the case 3.
A plurality of ventilation holes 5 are formed in one side wall on the short side of the case 3 as shown in FIG. 2, and the short side facing the one side wall as shown in FIG. A number of ventilation holes 6 are also formed on the other side wall.

The case 2 (case 3) has a built-in power conversion control unit. When a control signal is input to the control connector (not shown), the DC power input to the input connector (not shown) is converted into power. It is converted from direct current to alternating current by a conversion control unit and output as alternating current power from an output connector (not shown).
As shown in FIG. 1, a power conversion control unit, a heat sink 7 and a fan 8 are housed inside the case 3.

As shown in FIG. 3, the power conversion control unit includes a circuit board 10, a reactor 11, a first electrolytic capacitor 12, a second electrolytic capacitor 13, a transformer 14, choke coils 15 and 16, and a plurality of semiconductor devices (for example, MOS-FETs). ) It has a control part such as D1 to D8.
The circuit board 10 has a rectangular shape smaller than the planar shape of the bottom portion of the case 3, and is fixed by bolting on a support base (not shown) formed on the upper surface of the bottom portion of the case 3.

On the circuit board 10, the reactor 11, the first electrolytic capacitor 12, the second electrolytic capacitor 13, the transformer 14, the choke coils 15 and 16, and the plurality of semiconductor devices D1 to D8 are mounted, and a heat sink. 7 is fixed.
As shown in FIGS. 4 and 5, the heat sink 7 is a rectangular parallelepiped member having a high thermal conductivity, for example, formed by extruding aluminum or an aluminum alloy, and cutting both ends in the longitudinal direction. Thus, an air inlet 17 is formed at one end in the longitudinal direction, and an air outlet 18 is formed at the other end in the longitudinal direction.

Between the air intake port 17 and the air outlet port 18, a plurality of ventilation paths 20 a to 20 e are formed in parallel via a plurality of fins 19.
A first air outlet 21 communicating with the ventilation path 20b is formed at the upper part of one side wall 7a at a position near the air outlet 18 of the heat sink 7.
As shown in FIG. 6, the first air jet port 21 is formed so as to penetrate one side wall 7a while being orthogonal to the one side wall 7a.

As shown in FIGS. 7 and 8, the fan 8 is integrally fixed to the heat sink 7 so as to cover the air intake port 17.
As shown in FIGS. 1 and 3, the heat sink 7 is installed on the circuit board 10 with the fan 8 facing the many ventilation holes 5 of the case 3.
Further, as shown in FIG. 3, the choke coils 15 and 16 are mounted on the circuit board 10 near the air outlet 18 of the heat sink 7.

The transformer 14 is mounted on the circuit board 10 near the first air jet port 21 of the heat sink 7.
The semiconductor devices D1 to D4 are mounted on the circuit board in a state where they are in contact with the other side wall 7b of the heat sink 7. Further, as shown in FIGS. 7 and 8, the semiconductor devices D5 to D8 are mounted on the circuit board 10 in contact with one side wall 7a of the heat sink.

The first electrolytic capacitor 12 is mounted on the circuit board 10 at a position facing the other side wall 7 b of the heat sink 7. The second electrolytic capacitor 13 is mounted on the circuit board 10 at a position facing one side wall 7 a of the heat sink 7.
The first heat generating electronic component according to the present invention corresponds to the choke coils 15 and 16, the second heat generating electronic component according to the present invention corresponds to the transformer 14, and the first air jet port according to the present invention is provided. Corresponds to the first air outlet 21.

Next, operation | movement of the power converter device 1 of this 1st Embodiment is demonstrated.
In the power conversion device 1 of this embodiment, when a control signal is input to the control connector, the DC power input to the input connector is converted into AC by the power conversion control unit, and is output as AC power from the output connector.
At this time, control components such as the power conversion control unit in the case 3 generate heat, and in particular, the self-heating of the semiconductor devices D1 to D8, the transformer 14, and the choke coils 15 and 16 increases.

In the power conversion device 1, when the fan 8 is driven, the cold air taken in from the outside through the ventilation holes 5 of the case 3 is shown in FIG. The air enters the ventilation paths 20 a to 20 e and blows out from the air outlet 18.
The temperature of the heat sink 7 decreases as the cold air flows through the ventilation paths 20a to 20e, and the semiconductor devices D1 to D1 mounted on the circuit board 10 are in contact with the one side wall 7a and the other side wall 7b of the heat sink 7. D8 is cooled.

Further, when the cool air blows out from the air blowing port 18, the cold air directly contacts the choke coils 15 and 16 mounted on the circuit board 10 near the air blowing port 18.
Here, since the choke coils 15 and 16 are disposed near the air outlet 18 of the heat sink 7 and the air blowing resistance of the air outlet 18 is increased, the pressure of the ventilation paths 20a to 20e on the air outlet 18 side is increased. Get higher.

In this way, when the pressure of the air passages 20a to 20e on the air outlet 18 side is increased, cold air is ejected from the first air outlet 21 having a lower pressure than the air outlet 18 side.
The cold air ejected from the first air ejection port 21 directly contacts the transformer 14 mounted on the circuit board 10 near the first air ejection port 21.
Next, the effect of the power converter device 1 of 1st Embodiment is demonstrated.

When the cool air taken from the outside air by driving the fan 8 flows into the ventilation paths 20a to 20e of the heat sink 7, the temperature of the heat sink 7 decreases, so that the heat sink 7 is in contact with one side wall 7a and the other side wall 7b. Thus, the semiconductor devices D1 to D8 mounted on the circuit board 10 can be efficiently cooled.
Further, since the cold air blown out from the air blowout port 18 of the heat sink 7 directly contacts the choke coils 15 and 16, the choke coils 15 and 16 can also be efficiently cooled.

Further, the choke coils 15 and 16 are arranged near the air outlet 18 of the heat sink 7 to increase the resistance of the air outlet 18 to cool air and increase the pressure of the air passages 20a to 20e on the air outlet 18 side. Thus, the cool air is ejected from the first air ejection port 21, and the cold air ejected from the first air ejection port 21 is directly applied to the transformer 14 mounted on the circuit board 10 near the first air ejection port 21. Therefore, the transformer 14 can also be efficiently cooled.
Thus, the power conversion device 1 of the first embodiment can efficiently cool the semiconductor devices D1 to D8, the transformer 14, and the choke coils 15 and 16 that have high self-heating.

[Power Converter of Second Embodiment]
Next, FIG. 9 shows a power conversion device 30 of the second embodiment. In addition, the same code | symbol is attached | subjected to the component same as the structure shown in FIGS. 1-8, and the description is abbreviate | omitted.
The power converter 30 according to the second embodiment is different from the power converter 1 according to the first embodiment in that a deflecting plate 31 is first attached to the other side wall 7b of the edge of the air outlet 18 of the heat sink 7. It has been.

Further, the choke coils 15 and 16 arranged near the air outlet 18 in the first embodiment are arranged near the transformer 14 in the second embodiment.
In the second embodiment, the reactor 11 is arranged near the air outlet 18, and the first electrolytic capacitor 12 is also arranged near the air outlet 18. Here, although not specifically described in FIG. 9, a large number of ventilation holes are formed on one side wall on the long side constituting the case 3 located near the choke coils 15 and 16. Yes.

The first heat generating electronic component according to the present invention corresponds to the choke coils 15 and 16, the second heat generating electronic component according to the present invention corresponds to the transformer 14, and the first air jet port according to the present invention is the first air outlet. Corresponding to one air outlet 21.
Next, operation | movement of the power converter device 30 of this 2nd Embodiment is demonstrated.
When the fan 8 is driven, cold air taken from outside through the ventilation holes 5 of the case 3 enters the ventilation paths 20 a to 20 e of the heat sink 7 through the air intake port 17 and blows out from the air blowing port 18.

The temperature of the heat sink 7 decreases as the cold air flows through the ventilation paths 20a to 20e, and the semiconductor devices D1 to D1 mounted on the circuit board 10 are in contact with the one side wall 7a and the other side wall 7b of the heat sink 7. D8 is cooled.
The cold air blown out from the air blowing port 18 hits the deflecting plate 31 attached to the other side wall 7 b of the air blowing port 18, is deflected toward the choke coils 15, 16, and directly to the choke coils 15, 16. To touch.

Here, since the deflecting plate 31 is attached to the edge of the air outlet 18 of the heat sink 7, the resistance of the air outlet 18 to cool air increases, so the pressure of the ventilation paths 20 a to 20 e on the air outlet 18 side is increased. Becomes higher.
In this way, when the pressure of the air passages 20a to 20e on the air outlet 18 side is increased, cold air is ejected from the first air outlet 21 having a lower pressure than the air outlet 18 side.

The cold air ejected from the first air ejection port 21 directly contacts the transformer 14 mounted on the circuit board 10 near the first air ejection port 21.
Next, effects of the power conversion device 30 according to the second embodiment will be described.
According to the power conversion device 30 of the second embodiment, the cold air blown from the air blowing port 18 of the heat sink 7 is deflected by the deflection plate 31 attached to the edge of the air blowing port 18 and directly to the choke coils 15 and 16. Since it contacts, the choke coils 15 and 16 can be cooled efficiently.

  Further, by attaching a deflecting plate 31 to the edge of the air outlet 18 of the heat sink 7 to increase the resistance of the air outlet 18 to cool air, the pressure of the air passages 20a to 20e on the air outlet 18 side is increased. Since the cold air is ejected from the first air jet port 21 and the cold air jetted from the first air jet port 21 is directly applied to the transformer 14 mounted on the circuit board 10 near the first air jet port 21. The transformer 14 can also be efficiently cooled.

Further, since the temperature of the heat sink 7 in which the cool air flows through the ventilation paths 20a to 20e is lowered, the semiconductor devices D1 to D8 mounted on the circuit board 10 in a state of being in contact with the one side wall 7a and the other side wall 7b are also included. It can be cooled efficiently.
Thus, the power converter 30 of the second embodiment can also efficiently cool the semiconductor devices D1 to D8, the transformer 14, and the choke coils 15 and 16 that have high self-heating.

[Power Converter of Third Embodiment]
Next, FIG.10 and FIG.11 shows the power converter device 32 of 3rd Embodiment.
In the power conversion device 32 of the third embodiment shown in FIG. 10, a part of the cold air taken in from the outside by the fan 8 is first from the second air injection ports 34 and 35 formed on the air intake port 17 side of the heat sink 7. It ejects toward the electrolytic capacitor 12 and the second electrolytic capacitor 13.

FIG. 11 shows the heat sink 7 of the third embodiment. The edge on the one side wall 7a side and the edge on the other side wall 7b side of the air intake port 17 are at an angle of approximately 45 degrees in the vertical direction. The air introduction surfaces 7c and 7d are formed by cutting.
The second air injection ports 34 and 35 are formed by fixing the fan 8 integrally to the air intake port 17 formed with the air introduction surfaces 7c and 7d of the heat sink 7 of the third embodiment.
The third heat generating electronic component according to the present invention corresponds to the first electrolytic capacitor 12 and the second electrolytic capacitor 13, and the second air ejection port according to the present invention corresponds to the second air injection ports 34 and 35. Yes.

According to the power conversion device 32 of the third embodiment, the cold air taken from the outside by driving the fan 8 enters the ventilation paths 20a to 20e of the heat sink 7 through the air intake port 17, and part of the cold air is The air is ejected from the second air injection ports 34 and 35 toward the first electrolytic capacitor 12 and the second electrolytic capacitor 13.
The first electrolytic capacitor 12 and the second electrolytic capacitor 13 are also electronic components that increase self-heating when used for a long period of time, and cool air blown out from the second air injection ports 34 and 35 directly contacts and cools efficiently. be able to.

[Power Converters of Fourth and Fifth Embodiments]
Next, FIG.12 and FIG.13 shows the principal part of the power converter device of 4th, 5th embodiment.
The power conversion device according to the fourth embodiment shown in FIG. 12 is a modification of the second embodiment in which the deflection plate 31 is attached to the edge of the air outlet 18 of the heat sink 7.

In the heat sink 7 of the fourth embodiment, a third air ejection port 36 communicating with the ventilation path 20b is formed.
The third air jet port 36 is formed so as to penetrate diagonally on the air outlet 18 side with respect to the surface direction of the one side wall 7a, and the cold air jetted from the ventilation path 20b is transformed into the transformer 14 and the choke coil 15. , 16 are made to flow to both.

As described above, in the power conversion device of the fourth embodiment, the cold air ejected from the third air ejection port 36 formed in the heat sink 7 directly contacts the choke coils 15 and 16. Cooling efficiency can be increased.
Further, in the power conversion device of the fifth embodiment shown in FIG. 13, a fourth air outlet 37 communicating with the ventilation path 20 b is formed on one side wall 7 a of the heat sink 7.

The fourth air ejection port 37 is formed so as to penetrate obliquely downward with respect to the surface direction of the one side wall 7a, so that the cold air ejected from the ventilation path 20b flows toward the circuit board 10. .
As described above, in the power conversion device of the fifth embodiment, the cold air ejected from the fourth air ejection port 37 formed in the heat sink 7 is in direct contact with the circuit board 10. Electronic components that generate heat can also be efficiently cooled.

The third air jet port according to the present invention corresponds to the third air jet port 36, and the fourth heat generating electronic component according to the present invention corresponds to the transformer 14 and the choke coils 15 and 16, and the third air jet port according to the present invention. The four air outlets correspond to the fourth air outlet 37.
The first air jet port 21, the third air jet port 36, and the fourth air jet port 27 formed in the heat sink 7 in the first, third, and fourth embodiments are provided on one side wall 7a and the ventilation path. Although it formed so that it might communicate with 20b, it is not restricted to this, You may form in the other side wall 7b, and you may form in communication with other ventilation path 20a, 20c-20e.
In addition, the internal structure of the heat sink 7 is not limited to a structure in which a plurality of ventilation paths 20 a to 20 e are formed in parallel vertically via a plurality of fins 19.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Case 3 Case 4 Lid 5 Ventilation hole 6 Ventilation hole 7 Heat sink 7a One side wall 7b The other side wall 7c, 7d Air introduction surface 8 Fan 10 Circuit board 11 Reactor 12 First electrolytic capacitor 13 Second electrolysis Capacitor 14 Transformers 15 and 16 Choke coils D1 to D8 Semiconductor device 17 Air intake port 18 Air outlet port 19 Fins 20a to 20e Ventilation path 21 First air outlet port 30 Power converter 31 Deflector plate 32 Power converters 34 and 35 Second Air outlet 36 Third air outlet 37 Fourth air outlet

Claims (6)

A circuit board on which a plurality of electronic components including heat generating electronic components such as semiconductor elements, coils, and magnetic components are mounted;
A cylindrical heat sink formed on the circuit board with an air inlet formed at one end of the ventilation path and an air outlet formed at the other end of the ventilation path;
A fan attached to the air intake port of the heat sink, and blowing out cooling air taken from the outside to the air outlet through the ventilation path;
A housing for housing the plurality of electronic components, the circuit board, the heat sink, and the fan;
Immediately before the air outlet of the heat sink, a first heat generating electronic component that is in contact with the cooling air blown from the air outlet and increases the blowing resistance of the air outlet is disposed,
A second heat generating electronic component is disposed near a side wall of the heat sink;
A first air outlet that communicates with the ventilation path and injects cooling air into the second heat generating electronic component is formed at a position facing the second heat generating electronic component on the side wall of the heat sink. Electronic equipment characterized by A circuit board on which a plurality of electronic components including heat generating electronic components such as semiconductor elements, coils, and magnetic components are mounted;
A cylindrical heat sink formed on the circuit board with an air inlet formed at one end of the ventilation path and an air outlet formed at the other end of the ventilation path;
A fan attached to the air intake port of the heat sink, and blowing out cooling air taken from the outside to the air outlet through the ventilation path;
A housing for housing the plurality of electronic components, the circuit board, the heat sink, and the fan;
The cooling heat is deflected to the first heat generating electronic component arranged at a position away from the air blowing port on the air blowing port side of the heat sink, and the blowing resistance of the cooling air blown out from the air blowing port A deflection plate is arranged to increase
A second heat generating electronic component is disposed near a side wall of the heat sink;
A first air outlet that communicates with the ventilation path and injects cooling air into the second heat generating electronic component is formed at a position facing the second heat generating electronic component on the side wall of the heat sink. Electronic equipment characterized by A third heat generating electronic component is arranged around the air intake near the heat sink;
2. The second air jet port is formed in the side wall of the heat sink on the side of the air intake port and communicates with the ventilation path and jets cooling air to the third heat generating electronic component. The electronic device according to 1 or 2.   A third air injection port is formed in the side wall of the heat sink so as to penetrate the side wall from the oblique direction on the air intake side or the air outlet side and communicate with the ventilation path. The cooling air ejected from the ejection port is in contact with the fourth heat generating electronic component disposed on the air intake side or the air outlet side around the side wall of the heat sink. The electronic device according to any one of claims 1 to 3.   A fourth air outlet is formed in the side wall of the heat sink from the oblique lower side so as to pass through the side wall and communicate with the ventilation path. Cooling air ejected from the fourth air outlet is supplied to the circuit board. The electronic device according to claim 1, wherein the electronic device is in contact with each other.   A power conversion device comprising the electronic device according to any one of claims 1 to 5, wherein DC power is converted into AC power.

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