JP2017220486A - Conductive ball mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently mount a conductive ball on a substrate.SOLUTION: A conductive ball mounting device 10 has a cup 20 and a blowout nozzle 30. The cup 20 opens at an upper part, and stores a conductive ball 130. The blowout nozzle 30 is arranged in the inside of the cup 20. The blowout nozzle 30 is supported so as to separate a lower surface 31 and outside surfaces 32 and 33 respectively from a bottom surface 21 of the cup 20 and inside surfaces 22 and 23. The cup 20 and the blowout nozzle 30 form a collection passage collecting the conductive ball 130 on the bottom surface 21 of the cup 20. The blowout nozzle 30 has a blowout hole 40 penetrating an area between an upper surface 34 and the lower surface 31, and the blowout hole 40 has a suck-up portion 41 decreased in a diameter from a substantially center portion to the lower surface 31. The blowout nozzle 30 has a rectification passage 45 which is formed so as to be opened on the suck-up portion 41 decreased in diameter in the blowout hole 40, and to blow out air supplied from the outside upward in the inside of the blowout hole 40.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a conductive ball mounting apparatus.

  Conventionally, a semiconductor element is mounted on a wiring board by, for example, flip chip mounting. The wiring board is provided with electrodes (pads), and semiconductor elements are connected using bumps on the electrodes. The bump is formed by mounting a minute conductive ball (microball) on an adhesive material (for example, flux) on the electrode and melting the conductive ball. For example, a conductive ball is stored in a container with an open top, the container is moved in the vertical direction, and the conductive material adheres to the adhesive on the wiring board placed above the container by the inertial force of the conductive ball caused by the movement of the container. A ball is attached (see, for example, Patent Document 1).

JP 2009-44140 A

  Incidentally, in recent years, the diameter of the conductive ball has been reduced along with the downsizing of the semiconductor element. For this reason, it is desired to efficiently mount a small-diameter conductive ball on an electrode (pad). When the container containing the conductive balls is moved in the vertical direction as described above, the small-diameter conductive balls are difficult to move toward the wiring board, and the conductive balls may not be efficiently mounted.

  According to one aspect of the present invention, there is provided a conductive ball mounting device for mounting a conductive ball on a substrate provided with a pad, the cup being opened at the top and containing the conductive ball, and disposed inside the cup. A blowout nozzle that is supported so that a lower surface and an outer surface are spaced apart from a bottom surface and an inner surface of the cup, and forms a collection passage for collecting the conductive ball on the bottom surface of the cup between the cups; The blowing nozzle penetrates between the upper surface and the lower surface, opens to a blowing hole having a diameter reduced toward the lower surface, and a side surface having a reduced diameter at the blowing hole, and is supplied from the outside A rectifying hole formed so as to blow upward toward the inside of the blowing hole.

  According to one aspect of the present invention, a small-diameter conductive ball can be efficiently mounted on a substrate.

The schematic sectional drawing of an electroconductive ball mounting apparatus. The partial perspective sectional view of a conductive ball mounting device. The partially transparent perspective view which shows the baffle plate arrange | positioned at the blowing nozzle. The schematic sectional drawing which shows the effect | action of an electroconductive ball mounting apparatus.

Hereinafter, each embodiment will be described.
In the accompanying drawings, components may be shown in an enlarged manner for easy understanding. The dimensional ratios of the components may be different from the actual ones or in other drawings. Further, in the cross-sectional view, some components may not be hatched for easy understanding.

As shown in FIG. 1, the conductive ball mounting device 10 is disposed below the substrate holding device 100.
First, the substrate holding device 100 will be described.

  The board holding device 100 holds the wiring board 110. The wiring board 110 is a board used for forming a plurality of wiring boards in a lump. The wiring board 110 is arranged with the pad 111 coated with the adhesive 112 facing downward. The adhesive 112 is formed, for example, by a printing method using a coating mask. As the adhesive 112, a flux, an adhesive, a conductive paste, or the like can be used. The substrate holding device 100 holds the wiring substrate 110 from above by suction or mechanical holding means (for example, a clamp).

  A mask 120 is disposed on the lower surface of the wiring board 110. The mask 120 has an opening 121 at a position corresponding to the pad 111. The opening 121 is formed in such a size that one conductive ball 130 can pass through. The diameter of the conductive ball 130 is, for example, 10 to 60 μm (for example, 40 μm). Examples of the material of the conductive ball 130 include an alloy of tin (Sn) and gold (Au), an alloy of Sn and copper (Cu), an alloy of Sn and silver (Ag), an alloy of Sn, Ag and Cu, and the like. A conductive material can be used. Further, as the conductive ball 130, a spherical body in which the surface of a resin or metal core (core) is coated with a conductive material can be used.

Next, the conductive ball mounting apparatus 10 will be described.
The conductive ball mounting apparatus 10 includes a cup 20, a blowout nozzle 30, a supply port 81, and suction ports 82 and 83.

  As shown in FIG. 2, the cup 20 is open at the top, and is formed in an inverted truncated cone shape whose diameter is increased from the bottom toward the top. As shown in FIG. 1, a conductive ball 130 is accommodated in the cup 20.

  The cup 20 has a lower inner side surface 22 that increases in diameter from the bottom surface 21 along the shape of the cup 20 and a cylindrical upper inner side surface 23 that extends from the upper end of the lower inner side surface toward the opening end. doing.

A suction passage 24 is recessed in the cup 20 from the upper inner side surface 23 toward the radially outer side. The suction passage 24 is formed in an annular shape along the upper inner side surface 23 of the cup 20.
A communication passage 25 and a buffer passage 26 are formed below the suction passage 24. The suction passage 24 and the buffer passage 26 are communicated with each other by a communication passage 25 extending in the vertical direction of the cup 20 (the vertical direction in FIG. 1). The communication passage 25 and the buffer passage 26 are formed in an annular shape. Accordingly, the suction passage 24 and the buffer passage 26 each formed in an annular shape are connected to each other over the entire circumference of the cup 20 by the communication passage 25. The communication passage 25 is formed narrower than the suction passage 24 and the buffer passage 26.

  As shown in FIG. 2, suction ports 82 and 83 are formed at predetermined positions on the cup 20. The suction ports 82 and 83 are arranged on a straight line passing through the center of the cup 20. The suction ports 82 and 83 are connected to the buffer passage 26. The suction ports 82 and 83 are connected to the exhaust pump 92.

  The air inside the cup 20 is exhausted by the exhaust pump 92 through the suction passage 24, the communication passage 25, the buffer passage 26, and the suction ports 82 and 83. The communication passage 25 is formed narrower than the suction passage 24 and the buffer passage 26. Accordingly, the flow path from the inside of the cup 20 toward the buffer passage 26 is once restricted by the communication passage 25.

  As shown in FIG. 1, a cylindrical filter 28 is disposed on the upper inner side surface 23 of the cup 20 so as to cover the suction passage 24. The filter 28 is formed so that gas (air) can pass through and the conductive balls 130 do not pass through. In FIG. 2, the filter 28 is omitted.

A blower nozzle 30 is disposed inside the cup 20.
The blowing nozzle 30 is formed so as to be separated from the inner surface at a predetermined interval in accordance with the inner surface of the cup 20. More specifically, the blowing nozzle 30 has a substantially circular lower surface 31, a lower outer surface 32 whose diameter is increased upward from the outer end portion of the lower surface, and a substantially constant diameter from the upper end of the lower outer surface 32. And an upper outer surface 33 extending upward.

  The cup 20 and the blow-off nozzle 30 have a recovery passage between them, that is, the opening of the cup 20, that is, the upper end of the upper inner surface 23, and the bottom surface 21 of the cup 20 along the inner surfaces 23 and 22 of the cup 20. 60 is formed. The distance between the cup 20 and the blowing nozzle 30 is set to a value larger than the diameter of the conductive ball 130.

  The upper surface 34 of the blowing nozzle 30 is located below the upper surface 27 of the cup 20. Further, the blowout nozzle 30 is formed so that the upper surface outer peripheral portion 35 is inclined so as to be positioned downward toward the radially outer side.

At the center of the blow nozzle 30, a blow hole 40 penetrating the blow nozzle 30 in the vertical direction is formed.
The blowout hole 40 has a suction part 41 that extends from approximately the center to the lower surface 31 of the blower nozzle 30 and a blowout part 42 that extends from approximately the center to the upper surface 34. The siphoning portion 41 is increased in diameter from the lower surface 31 toward the upper side, in other words, from the approximate center to the lower surface 31. The opening at the lower end of the blowout hole 40, that is, the opening at the lower end of the suction part 41 is formed larger than the diameter of the conductive ball 130. The blowing portion 42 is formed with a substantially constant diameter from the substantially center to the upper surface 34.

  Further, an intake passage 43 is formed in the blowing nozzle 30. The intake passage 43 includes a circulation passage 44 provided at the lower end of the blow nozzle 30 and a rectification passage 45 connected to the circulation passage 44. The circulation passage 44 is formed in an annular shape and is connected to the supply port 81. The supply port 81 is formed in a cylindrical shape that penetrates the blowing nozzle 30 and the cup 20 and extends in a predetermined direction (left direction in FIG. 1), and is connected to the supply pump 91. The gas (compressed air) supplied from the supply pump 91 is supplied to the circulation passage 44 of the intake passage 43 via the supply port 81.

  The rectifying passage 45 is formed in an annular shape. The rectifying passage 45 is reduced in diameter as it goes upward from the circulation passage 44, and opens to the suction portion 41. The air supplied to the circulation passage 44 is blown out obliquely upward through the rectifying plate 50 from the opening to the inside of the blowing hole 40 by the rectifying passage 45 having a diameter reduced toward the upper side.

  As shown in FIG. 3, a plurality (four in this embodiment) of rectifying plates 50 are arranged in the rectifying passage 45. Each rectifying plate 50 is formed in the same shape. The plurality of rectifying plates 50 divide the rectifying passage 45 into a plurality (four in the present embodiment) of flow paths 46. Further, the side surface 51 of each rectifying plate 50 is formed to be inclined in the circumferential direction. Thereby, each baffle plate 50 forms the substantially spiral flow path 46 inclined in the circumferential direction. The air supplied to the rectifying passage 45 by the flow path 46 formed in this way rises while rotating inside the blowout hole 40 due to the inclination of the flow path 46. In this way, the rectifying plate 50 forms an air flow that rises spirally inside the blowout hole 40.

As shown in FIG. 1, the cup 20 is connected to the vibration device 93. The vibration device 93 gives a slight vibration to the cup 20.
Next, the operation of the conductive ball mounting apparatus will be described.

  As shown in FIG. 4, the wiring substrate 110 is held by the substrate holding device 100 with the surface on which the mask 120 is disposed facing down. An adhesive 112 is disposed on the pad 111 of the wiring board 110. A conductive ball mounting device 10 is disposed below the wiring board 110.

  The conductive ball mounting apparatus 10 has a cup 20. In the conductive ball mounting apparatus 10, the cup 20 is disposed at a predetermined interval from the wiring board 110. The space | interval of the cup 20 and the wiring board 110 is 100-200 micrometers, for example.

  Compressed air is supplied from a supply pump 91 to the blowing nozzle 30 disposed inside the cup 20. In FIG. 4, the air flow is indicated by arrows. The air is supplied from the rectifying passage 45 of the blowing nozzle 30 upward inside the blowing hole 40. The rectifying passage 45 opens at the suction part 41 of the blowing nozzle 30, and the suction part 41 is reduced in diameter toward the lower surface 31 of the blowing nozzle 30. Therefore, a negative pressure is generated by the venturi effect at the lower end of the blowing hole 40, that is, at a portion below the opening of the rectifying passage 45 in the suction portion 41 by the air supplied into the blowing hole 40. Due to the negative pressure, the small-diameter conductive ball 130 is sucked into the blowout hole 40. The conductive ball 130 moves to the upper part of the cup 20 by the air supplied from the rectifying passage 45 to the blowout hole 40 and reaches the wiring board 110. Then, it enters the opening 121 of the mask 120 disposed on the wiring substrate 110 and adheres to the adhesive 112 disposed on the pad 111 of the wiring substrate 110. In this way, the conductive balls 130 are mounted on the pads 111 of the wiring board 110.

  Of the conductive balls 130 moved by the air in the blowing holes 40, those that did not adhere to the adhesive 112 (remaining conductive balls) are radially outward from the blowing holes 40 by the air blown from the blowing holes 40. Move towards.

  A suction passage 24 is recessed in the upper inner side surface 23 of the cup 20, and the suction passage 24 is connected to suction ports 82 and 83 via a communication passage 25 and a buffer passage 26, and the suction ports 82 and 83 are An exhaust pump 92 is connected. The exhaust pump 92 sucks air from the inside of the cup 20 through the intake passage 43. For this reason, the air which goes to the radial direction outer side from the blowing hole 40, ie, the edge part of the cup 20, flows below the cup 20 by the suction | inhalation by the suction passage 24. Due to this air flow, the remaining conductive balls 130 move downward, that is, away from the wiring board 110. For this reason, the remaining conductive balls 130 do not jump out of the cup 20 from between the cup 20 and the wiring board 110.

  The remaining conductive balls 130 are collected to the bottom of the cup 20 by the collection passage 60. Then, it is sucked up from the bottom of the cup 20 into the blowing hole 40 of the blowing nozzle 30 and blown up toward the wiring board 110. In this way, a circulation of air circulating from the blowing hole 40 of the blowing nozzle 30 to the upper portion of the cup 20, the recovery passage 60 between the cup 20 and the blowing nozzle 30, and the blowing hole 40 is formed. The conductive ball 130 moves and is mounted on the pad 111 of the wiring board 110.

  A plurality of rectifying plates 50 are disposed in the rectifying passage 45 of the blowout nozzle 30. The rectifying plate 50 divides the rectifying passage 45 to form a flow path 46, and the air supplied to the rectifying passage 45 is raised by the flow path 46 while rotating in the blowing hole 40. The rotating and rising air causes the plurality of conductive balls 130 to be separated from each other without being solidified and move straight toward the wiring board 110 toward the wiring board 110. Accordingly, the conductive ball 130 can easily enter the opening 121 of the mask 120.

  A fine vibration is given to the cup 20 by the vibration device 93. This slight vibration is transmitted to the blowing nozzle 30 and the filter 28 disposed in the cup 20. Due to this slight vibration, the conductive ball 130 is separated from the inner surface of the cup 20 and the surface of the blow-off nozzle 30, and moves to the bottom of the cup 20 by the air flow in the collection passage 60.

As described above, according to the present embodiment, the following effects can be obtained.
(1) The conductive ball mounting device 10 is disposed below the substrate holding device 100 that holds the wiring substrate 110. The conductive ball mounting apparatus 10 has a cup 20 and a blowout nozzle 30. The cup 20 is open at the top and accommodates the conductive balls 130. The blowing nozzle 30 is disposed inside the cup 20. The blowing nozzle 30 is supported such that the lower surface 31 and the outer surfaces 32 and 33 are separated from the bottom surface 21 and the inner surfaces 22 and 23 of the cup 20, respectively. The cup 20 and the blowing nozzle 30 form a collection passage for collecting the conductive ball 130 on the bottom surface 21 of the cup 20. Further, the blowing nozzle 30 has a blowing hole 40 penetrating between the upper surface 34 and the lower surface 31. The blowout hole 40 has a suction portion 41 that is reduced in diameter from the substantially center to the lower surface 31. Further, the blowing nozzle 30 has a rectifying passage 45. The rectifying passage 45 opens to the suction portion 41 having a reduced diameter in the blow hole 40 and is formed so as to blow air supplied from the outside upward in the blow hole 40.

  Due to the air supplied from the rectifying passage 45 into the blowing hole 40, a negative pressure is generated at the lower end of the blowing hole 40, that is, at a portion below the opening of the rectifying passage 45 in the suction portion 41 due to the venturi effect. Due to the negative pressure, the small-diameter conductive ball 130 is sucked into the blowout hole 40. The conductive ball 130 moves to the upper part of the cup 20 by the air supplied from the rectifying passage 45 to the blowout hole 40 and reaches the wiring board 110. Then, it enters the opening 121 of the mask 120 disposed on the wiring substrate 110 and adheres to the adhesive 112 disposed on the pad 111 of the wiring substrate 110. For this reason, the small-diameter conductive ball 130 can be moved toward the wiring board 110, and the conductive ball 130 can be efficiently mounted on the wiring board 110.

  (2) The cup 20 has a suction passage 24 recessed in the inner surface 23 along the opening. The suction passage 24 is connected to a suction port 82.83 connected to the exhaust pump 92. The exhaust pump 92 sucks air from the inside of the cup 20 through the intake passage 43. For this reason, the air which goes to the radial direction outer side from the blowing hole 40, ie, the edge part of the cup 20, flows below the cup 20 by the suction | inhalation by the suction passage 24. Due to this air flow, the remaining conductive balls 130 move downward, that is, away from the wiring board 110. For this reason, it is possible to prevent the remaining conductive balls 130 from jumping out from between the cup 20 and the wiring board 110 to the outside of the cup 20, and the conductive balls 130 can be collected.

  (3) In the cup 20, a communication path 25 and a buffer path 26 are provided below the suction path 24. The communication path 25 and the buffer path 26 are formed in an annular shape. The communication passage 25 is formed narrower than the suction passage 24 and the buffer passage 26. The air inside the cup 20 is exhausted by the exhaust pump 92 via the two suction ports 82.83 to which the buffer passage 26 is connected. Since the flow of air exhausted by the communication path 25 is throttled, the conductive ball 130 is sucked into the cup 20 by sucking air toward the communication path 25 with substantially the same force on the entire circumference of the cup 20. can do.

  (4) A plurality of rectifying plates 50 are arranged in the rectifying passage 45. The rectifying plate 50 divides the rectifying passage 45 to form a flow path 46, and the air supplied to the rectifying passage 45 is raised by the flow path 46 while rotating in the blowing hole 40. The rotating and rising air causes the plurality of conductive balls 130 to be separated from each other without being solidified and move straight toward the wiring board 110 toward the wiring board 110. As a result, the conductive balls 130 can easily enter the openings 121 of the mask 120, and the conductive balls 130 can be easily mounted.

  (5) The cup 20 is given a slight vibration by the vibration device 93. Due to this slight vibration, the conductive ball 130 is separated from the inner surface of the cup 20 and the surface of the blow-off nozzle 30, and moves to the bottom of the cup 20 by the air flow in the collection passage 60. For this reason, the adhesion volume of the conductive ball 130 can be prevented.

In addition, you may implement each said embodiment in the following aspects.
In the above embodiment, a film may be formed on the inner surface of the cup 20, the blow nozzle 30, and the outer surface of the filter 28. As the film, a conductive film such as a fluorine-based film can be used. Such a coating reduces the adhesion of the conductive balls 130 to the surfaces of the cup 20 and the blowing nozzle 30 and allows the conductive balls 130 to circulate appropriately.

In the above embodiment, the vibration device 93 may be omitted.
In the above embodiment, the rectifying plate 50 may be omitted.
In the above embodiment, the exhaust pump 92 may be omitted.

In the above embodiment, the number of suction ports may be appropriately changed to one, three or more.
-In the said embodiment, you may change the shape of the blowing hole 40 suitably. For example, you may form so that a diameter may be gradually expanded from the lower surface of the blowing nozzle 30 to an upper end.

-In the said embodiment, you may change the shape of the supply port 81 suitably. For example, you may form so that compressed air may be supplied in the cup 20 from the downward direction of the cup 20. FIG.
-In the said embodiment, you may change the external shape of the cup 20 suitably.

  In the above embodiment, the wiring substrate 110 is shown as an example of a substrate on which the conductive balls 130 are mounted. However, an apparatus for mounting the conductive balls 130 on a package substrate, a wafer, or the like may be used as the substrate.

DESCRIPTION OF SYMBOLS 10 Conductive ball mounting apparatus 20 Cup 21 Bottom surface 22 Lower inner side surface 23 Upper inner side surface 24 Suction passage 25 Communication passage 26 Buffer passage 30 Blow nozzle 31 Lower surface 34 Upper surface 40 Blow hole 45 Rectification passage 50 Rectification plate 60 Recovery passage 81 Supply port 82 , 83 Suction port 93 Vibration device 110 Wiring board (board)
130 Conductive ball

Claims (5)

A conductive ball mounting device for mounting a conductive ball on a substrate having a pad,
A cup with an open top and containing a conductive ball;
A recovery passage disposed inside the cup, the lower surface and the outer surface being supported so as to be separated from the bottom surface and the inner surface of the cup, respectively, and collecting the conductive balls on the bottom surface of the cup between the cups Blowing nozzle to form,
Including
The blowing nozzle is
A blowout hole that penetrates between the upper surface and the lower surface and is reduced in diameter toward the lower surface,
A rectifying passage that is opened to the side surface reduced in diameter in the blowout hole and is formed so as to blow out air supplied from the outside upward in the blowout hole;
Having
Conductive ball mounting device. The cup
A suction passage recessed in the inner surface along the opening;
A suction port in communication with the suction passage and connected to an exhaust pump;
Having
The conductive ball mounting device according to claim 1. The cup
An annular buffer passage provided below the suction passage and connected to the suction port;
Connecting the suction passage and the buffer passage, a connection passage formed narrower than the suction passage and the buffer passage;
Having
The conductive ball mounting apparatus according to claim 2.   It has a plurality of baffle plates which are arranged along the circumferential direction of the rectification passage formed in the rectification passage and are formed in an annular shape, and whose side surfaces are inclined in the circumferential direction of the rectification passage. Item 4. The conductive ball mounting device according to any one of Items 1 to 3.   The conductive ball mounting device according to claim 1, further comprising a vibration device that applies fine vibration to the cup.

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