JP2017214625A - Mask for vapor deposition, and production method of organic el panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mask for vapor deposition capable of performing vapor deposition stably regardless of area enlargement or definition heightening of an organic EL panel; and to provide a production method of the organic EL panel.SOLUTION: A tabular mask 2 for vapor deposition having a plurality of opening hole parts 2a for allowing a vapor deposition material 4 evaporated from a vapor deposition source 3 to vapor-deposit on a light-transmissible substrate 1 in a prescribed pattern, includes a first recess 2b formed on a surface on the light-transmissible substrate 1 side, and enclosing the plurality of opening hole parts 2a in view from a surface direction, a second recess 2c formed on a bottom surface of the first recess 2b, and adjacent to the plurality of opening hole parts 2a in view from the surface direction, and the plurality of opening hole parts 2a formed so as to penetrate a surface on the vapor deposition source 3 side from the bottom surface of the first recess 2b.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a deposition mask and an organic EL panel, which are disposed in a deposition apparatus and deposit a deposition material on a substrate.

  Conventionally, as an organic EL panel, a transparent electrode serving as an anode by ITO (Indium Tin Oxide) or the like, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport on a translucent substrate made of a glass material. A glass layer is formed by sequentially laminating a functional layer composed of a layer and an electron injection layer and a non-translucent back electrode such as aluminum (Al) serving as a cathode to form a laminated organic EL element, and covering the laminated body There is known one in which a sealing member made of a material is disposed on a translucent substrate. Such an organic EL panel is disclosed in Patent Document 1, for example.

  Such an organic EL panel is a vapor deposition apparatus having a plurality of vapor deposition chambers corresponding to each layer (hole injection layer, hole transport layer, light emitting layer, electron transport layer, electron injection layer, back electrode) constituting the organic EL element. The light-transmitting substrate on which the transparent electrode is formed is put in and formed by forming each layer. Each vapor deposition chamber in the vapor deposition apparatus is maintained at a high vacuum by, for example, a vacuum pump, and a crucible for storing a vapor deposition material, a heating coil and a crucible wound around the crucible, A vapor deposition source having a heat shielding member disposed so as to surround the heating coil is disposed, and a current is supplied to the heating coil to vaporize the vapor deposition material. On the other hand, a substrate holder having a translucent substrate and a mask holder having a deposition mask disposed behind the substrate holder are disposed above each deposition chamber. The vapor deposition mask provided in the mask holder is made of a metal material, a plurality of opening holes for forming a predetermined vapor deposition pattern on the translucent substrate, and a mask for preventing the formation of the vapor deposition pattern on the translucent substrate A predetermined vapor deposition pattern is formed on the translucent substrate by passing the evaporated vapor deposition material through each opening hole provided in the vapor deposition mask. Yes. Such a vapor deposition mask is disclosed in, for example, Patent Document 2.

  Further, Patent Document 3 discloses a deposition mask in which a projection is provided by projecting the surface of a plate body constituting the deposition mask by pressing deformation in order to keep a gap with the substrate constant. . According to this, the vapor deposition film and other components are not damaged when the vapor deposition mask is attached or detached.

JP 2001-267066 A JP 2000-192224 A JP 2004-2104015 A

  However, the vapor deposition mask in which the protruding portion is formed by pressing deformation has low processing accuracy and the vapor deposition accuracy is lowered, and there is a risk of contact with the constituent members due to deflection. For this reason, there is room for further improvement in that the organic EL panel cannot sufficiently cope with the increase in area and definition and cannot be stably deposited.

  Focusing on the above-described problems of the present invention, to provide a deposition mask and an organic EL panel manufacturing method capable of performing stable deposition regardless of the increase in area or definition of the organic EL panel. With the goal.

The vapor deposition mask of the present invention solves the aforementioned problems,
A plate-shaped vapor deposition mask having a plurality of opening holes for vapor-depositing a vapor deposition material evaporated from a vapor deposition source on a substrate in a predetermined pattern,
A first recess formed on the substrate-side surface and surrounding the plurality of openings as viewed from the surface direction;
A second recess formed on the bottom surface of the first recess and adjacent to the plurality of opening holes when viewed from the surface direction;
The plurality of opening holes formed so as to penetrate the deposition source side surface from the bottom surface of the first recess;
It is characterized by comprising.

More preferably, the vapor deposition mask of the present invention includes a first metal plate in which a first opening constituting the first recess is formed;
A second metal plate in which a second opening constituting the second recess and a plurality of third openings constituting the plurality of opening holes are formed;
A third metal plate formed with a plurality of fourth openings forming the plurality of opening holes;
Are stacked in order from the vapor deposition member side.

More preferably, the vapor deposition mask of the present invention has a plurality of regions in which the plurality of opening holes are formed,
A plurality of the first recesses are formed corresponding to each of the plurality of regions.
It is characterized by that.

  More preferably, in the vapor deposition mask of the present invention, the plurality of opening holes have a cross-section narrowing toward the substrate side.

In order to solve the above-described problems, the organic EL panel manufacturing method of the present invention is formed by forming an organic EL element having a functional layer including at least an organic light emitting layer between a pair of electrodes on the substrate. A method of manufacturing an EL panel,
Including the step of forming at least one of the functional layers by vapor deposition using the vapor deposition mask of the present invention described above.
It is characterized by that.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to manufacture an organic electroluminescent panel stably irrespective of the enlargement of area or high definition of an organic electroluminescent panel.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. The exploded sectional view showing the mask for vapor deposition in the embodiment same as the above. The top view which shows an example of the mask for vapor deposition in embodiment same as the above. The schematic sectional drawing which shows an example of an organic electroluminescent panel.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a cross-sectional view schematically showing a vapor deposition chamber of a general vapor deposition apparatus. In the vapor deposition chamber, a translucent substrate 1, a vapor deposition mask 2, and a vapor deposition source 3 are arranged.

  The translucent substrate 1 is a rectangular plate member made of a transparent glass material. On the translucent substrate 1, the vapor deposition material 4 that is vaporized from the vapor deposition source 3 is vapor-deposited in a predetermined pattern via the vapor deposition mask 2.

  The vapor deposition mask 2 is a plate-like member having a thickness of about 50 μm to 200 μm (which can be further increased when the size is increased), and is disposed between the translucent substrate 1 and the vapor deposition source 3. . The vapor deposition mask 2 is formed by stacking a plurality of metal plates such as SUS430 and SUS304, and in the present embodiment, four metal plates 21, 22, 23, and 24 are stacked. The vapor deposition mask 2 includes a plurality of opening holes 2a for vapor deposition (evaporation or sublimation) of the vapor deposition material 4 from the vapor deposition source 3 on the translucent substrate 1 in a predetermined pattern. Of the vapor deposition mask 2, a portion other than the plurality of opening holes 2 a is formed as a mask portion (shielding portion) that blocks the vapor deposition material 4.

  The vapor deposition source 3 is a container in which the vapor deposition material 4 is accommodated. For example, a crucible for accommodating the vapor deposition material 4, a heating coil wound around the crucible, and the crucible and the heating coil are surrounded. And a heat shielding member disposed on the surface. By supplying an electric current to the heating coil, the vapor deposition material 4 is vaporized and directed to the translucent substrate 1 through the vapor deposition path 4a.

  Next, features of the vapor deposition mask 2 will be described. The vapor deposition mask 2 is formed on the plurality of opening holes 2a and the surface on the translucent substrate 1 side, and includes a first recess 2b and a first recess 2b surrounding the plurality of opening holes 2a when viewed from the surface direction. And a second recess 2c adjacent to the plurality of opening holes 2a when viewed from the surface direction.

  The plurality of opening holes 2a are formed so as to penetrate the surface on the side of the vapor deposition source 3 from the bottom surface of the first recess 2b, and the cross section is narrower from the vapor deposition source 3 side toward the translucent substrate 1 side. It is formed in the trapezoid shape. Although the planar shape of the plurality of opening holes 2a is arbitrary according to the vapor deposition pattern, it is formed in, for example, a square or rectangular rectangle or circle. Since the opening hole 2a is formed in this way, it is possible to suppress the vapor deposition material 4 from being blocked by the edge of the opening hole 2a on the vapor deposition source 3 side, and to form a fine vapor deposition pattern with high accuracy. In addition, as long as the cross-sectional shape of the opening hole part 2a becomes a width | variety narrow toward the translucent board | substrate 1, the step shape etc. may be sufficient besides a trapezoid shape.

  The first recess 2b is formed by vapor deposition material 4 (deposition film) formed on the translucent substrate 1 and components of the organic EL panel on the translucent substrate 1 such as electrodes, wiring, insulating films, and partition walls. It is desirable to form deeper than the height of these components so as not to contact the surface of the mask 2. Thereby, the space | interval with the translucent board | substrate 1 can be kept constant. In the case where the vapor deposition material 4 is separately applied using a plurality of types of vapor deposition masks 2, the first recess 2 b surrounds the plurality of opening holes 2 a and the organic EL element of the translucent substrate 1. It is desirable to form it so as to be larger than the light emitting region 1a which is a region where the (light emitting part) is formed.

  The second recessed portion 2c is located on the bottom surface of the first recessed portion 2b so as to be positioned between the plurality of opening hole portions 2a and between the opening hole portion 2a and the side surface of the first recessed portion 2b. Each is formed. Thus, since the 2nd recessed part 2c was provided in the bottom face of the 1st recessed part 2b so that it might adjoin with the several opening hole part 2a seeing from a surface direction, the enlargement of area and high definition of an organic electroluminescent panel were carried out. As a result, even if the deposition mask 2 becomes larger in area and higher in definition and some deflection occurs, the deposition mask 2 (the bottom surface of the first recess 2b) contacts the constituent members on the translucent substrate 1. This can be avoided and deposition can be performed stably.

  As shown in FIG. 2, the vapor deposition mask 2 is formed by stacking metal plates 21, 22, 23, and 24 in order from the translucent substrate 1 side. The metal plates 21 to 24 are fixed to each other by a method such as welding or adhesion. The metal plate 21 (an example of a first metal plate) is formed with a first opening 21a that constitutes the first recess 2b. The first opening 21a is formed by etching, for example. The metal plates 22 and 23 (an example of the second metal plate) include second openings 22a and 23a that constitute the second recess 2c, and a plurality of third openings that constitute the plurality of opening holes 2a. 22b and 23b are formed. The second openings 22a and 23a and the third openings 22b and 23b are formed by etching, for example. In the metal plate 24 (an example of a third metal plate), a plurality of fourth openings 24a constituting the plurality of opening holes 2a are formed. The fourth opening 24a is formed by etching, for example. The vapor deposition mask 2 is formed by overlapping metal plates 21 to 24 each having openings 21a, 22a, 23a, 22b, 23b, and 24a formed in advance. Thus, since the vapor deposition mask 2 is formed by overlapping the plurality of metal plates 21 to 24 each having the openings 21a, 22a, 23a, 22b, 23b, and 24a, the plurality of opening holes 2a and the first are accurately formed. The recess 2b and the second recess 2c can be provided and can be deposited with high accuracy.

  In addition, when performing what is called multiple chamfering which manufactures several organic electroluminescent panel from one translucent board | substrate 1, as shown to Fig.3 (a), as for the mask 2 for vapor deposition, several opening part 2a is formed. A plurality of regions 25 are formed, and a plurality of first recesses 2 b are formed so as to correspond to each of the plurality of regions 25. Further, as shown in FIG. 3B, one first recess 2 b may be formed so as to surround a plurality of regions 25.

FIG. 4 is a schematic cross-sectional view showing an example of the organic EL panel 100 manufactured using the above-described vapor deposition mask 2.
An organic EL panel 100 includes a transparent electrode (anode) 11 made of a transparent conductive material such as ITO, an insulating film 12 made of an insulating resin, a functional layer 13, and a low-resistance metal such as aluminum on a translucent substrate 1. And a back electrode (cathode) 14 made of a material. The transparent electrode 11 and the back electrode 14 function as a pair of electrodes, and the portion where the functional layer 13 is laminated between the electrodes 11 and 14 becomes the organic EL element 10 which is a light emitting portion. The insulating film 12 is formed so that the edge overlaps the transparent electrode 11 so as to define the shape of the organic EL element 10, and ensures insulation of the electrodes 11 and 14 other than the organic EL element 10. The functional layer 13 is composed of one or more layers including at least an organic light emitting layer. As an example, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer are formed in this order from the transparent electrode 11 side. Is done.
In the organic EL panel 100, for example, the organic light emitting layer in the functional layer 13 is formed by vapor deposition using the vapor deposition mask 2 described above. In the step of forming the organic light emitting layer, first, the transparent substrate 1 on which the transparent electrode 11, the insulating film 12, and a part of the functional layer 13 (in the above example, a hole injection layer and a hole transport layer) are formed. Is placed in the vapor deposition chamber where the vapor deposition mask 2 is disposed, and is disposed and fixed to a substrate holder (not shown) in the vapor deposition chamber so as to face the vapor deposition mask 2 (see FIG. 1). And the said crucible of the vapor deposition source 3 which accommodated the organic material used as an organic light emitting layer as the vapor deposition material 4 is heated, and the vapor deposition material 4 is vaporized. The vaporized vapor deposition material 4 reaches the vapor deposition mask 2 through the vapor deposition path 4a, and further passes through the plurality of opening holes 2a to be vapor deposited on the translucent substrate 1, thereby forming an organic light emitting layer in a predetermined pattern. The In addition, when the organic light emitting layer is formed by separately coating layers of three colors, for example, red, green, and blue, the evaporation mask 2 in which a plurality of opening holes 2a corresponding to the pattern of the light emitting layer of each color is formed. Is used for each color light emitting layer. In the step of forming the functional layer 13 other than the organic light emitting layer, vapor deposition using the vapor deposition mask 2 may be performed.

  Note that the above-described embodiment shows an example of the present invention, and it is needless to say that modifications (including deletion of components) can be made as appropriate without departing from the gist of the present invention.

  INDUSTRIAL APPLICABILITY The present invention is suitable for a deposition mask and an organic EL panel manufacturing method that are disposed in a deposition apparatus and deposit a deposition material in a predetermined pattern on a substrate.

1 Translucent substrate (substrate)
DESCRIPTION OF SYMBOLS 1a Light emission area | region 2 Mask for vapor deposition 2a Opening hole 2b 1st recessed part 2c 2nd recessed part 3 Deposition source 4 Deposition material 4a Deposition route 10 Organic EL element 11 Transparent electrode 12 Insulating film 13 Functional layer 14 Back surface electrode 21 Metal plate 21a 1st opening part 22 Metal plate 22a 2nd opening part 22b 3rd opening part 23 Metal plate 23a 2nd opening part 23b 3rd opening part 24 Metal plate 24a 4th opening part 25 Several opening hole part Region where 100 was formed 100 Organic EL panel

Claims (5)

A plate-shaped vapor deposition mask having a plurality of opening holes for vapor-depositing a vapor deposition material evaporated from a vapor deposition source on a substrate in a predetermined pattern,
A first recess formed on the substrate-side surface and surrounding the plurality of opening holes as viewed from the surface direction;
A second recess formed on the bottom surface of the first recess and adjacent to the plurality of opening holes when viewed from the surface direction;
The plurality of opening holes formed so as to penetrate the deposition source side surface from the bottom surface of the first recess;
A vapor deposition mask characterized by comprising: A first metal plate formed with a first opening constituting the first recess;
A second metal plate in which a second opening constituting the second recess and a plurality of third openings constituting the plurality of opening holes are formed;
A third metal plate formed with a plurality of fourth openings forming the plurality of opening holes;
The vapor deposition mask according to claim 1, wherein the layers are stacked in order from the vapor deposition member side. A plurality of regions in which the plurality of opening holes are formed;
A plurality of the first recesses are formed corresponding to each of the plurality of regions.
The vapor deposition mask according to claim 1.   The deposition mask according to claim 1, wherein a cross section of each of the plurality of opening holes becomes narrower toward the substrate side. A method for producing an organic EL panel, wherein an organic EL element is formed by sandwiching a functional layer including at least an organic light emitting layer between a pair of electrodes on the substrate,
Including a step of forming at least one of the functional layers by vapor deposition using the vapor deposition mask according to any one of claims 1 to 4.
An organic EL panel manufacturing method characterized by the above.

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