JP2017213870A - Substrate for liquid discharge head, liquid discharge head and liquid discharge device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress a difference of a drive condition of an element in respective element arrays to a small level even when the number of element arrays increases.SOLUTION: A plurality of heaters 304 constitutes a plurality of heater arrays L between pad arrays 201a, 201b. A heater array L positioned near a pad array 201a relative to a pad array 201b is connected to the pad array 201a, while a heater array L positioned near the pad array 201b relative to the pad array 201a is connected to the pad array 201b.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a liquid discharge head substrate including a plurality of elements that generate discharge energy for discharging a liquid, a liquid discharge head using the same, and a liquid discharge apparatus.

  In Patent Document 1, as a substrate for an inkjet recording head (a substrate for a liquid discharge head), a plurality of element rows formed by a plurality of elements that generate discharge energy and one terminal formed by a plurality of connection terminals And a substrate with a row. The elements in each element row are electrically connected to connection terminals in one terminal row.

JP 2013-49277 A

  Since the substrate described in Patent Document 1 is provided with only one terminal row for a plurality of element rows, each element is determined depending on the positional relationship between the plurality of element rows and one terminal row. The difference in the distance between the row and the terminal row is increased. In particular, when the number of element rows increases, the difference in the distance between the element rows and the terminal rows becomes significantly large. Such a difference appears as a difference in wiring resistance between the element row and the terminal row, and there is a possibility that the driving conditions of the elements in each element row are greatly different.

  An object of the present invention is to provide a liquid discharge head substrate, a liquid discharge head, and a liquid discharge apparatus capable of suppressing a difference in driving conditions of elements in each element row even when the number of element rows increases. There is to do.

  The substrate for a liquid discharge head according to the present invention includes a first terminal row in which a plurality of first terminals are arranged, and a second terminal row in which a plurality of second terminals are arranged along the arrangement direction of the first terminal rows. A first element row that is adjacent to the first terminal row and is arranged between the first terminal row and the second terminal row along the arrangement direction of the first terminal row. And a second element in which a plurality of second elements are arranged between the first terminal row and the second terminal row, adjacent to the second terminal row and along the arrangement direction of the second terminal row. A third element row in which a plurality of third elements are arranged between the first element row and the second element row; and the plurality of first terminals and the plurality of first elements connected to each other. A first wiring that connects the plurality of second terminals to the plurality of second elements, a plurality of the first terminals, and the plurality of second terminals. Characterized in that it comprises a third wire connecting the at least one said plurality of third elements, the.

  According to the present invention, a plurality of element rows are connected to one of the two terminal rows, or connected to both of the two terminal rows, thereby reducing the wiring resistance difference between the element row and the terminal row. Thus, the difference in the driving conditions of the elements in each element row is kept small.

(A) is explanatory drawing of the structural example of the liquid discharge apparatus in the 1st Embodiment of this invention, (b) is a perspective view of the principal part of the liquid discharge head in Fig.1 (a). FIG. 2A is a plan view of the recording element substrate in FIG. 1B, and FIG. 2B is an enlarged sectional view taken along line IIb-IIb in FIG. It is explanatory drawing of the other structural example of a recording element board | substrate. (A), (b), (c) is explanatory drawing of the other another structural example of a recording element board | substrate. It is explanatory drawing of the distribution method of image data. (A) is a top view of the recording element board | substrate in the 2nd Embodiment of this invention, (b) is sectional drawing which follows the VIb-VIb line | wire of (a). FIG. 6 is a plan view of a recording element substrate in a third embodiment of the present invention. It is a top view of the other example of the recording element board | substrate in the 3rd Embodiment of this invention. (A) is a top view of the recording element board | substrate in the 4th Embodiment of this invention, (b) is sectional drawing which follows the IXb-IXb line | wire of (a). It is sectional drawing of the recording element board | substrate in the 5th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1A is a schematic perspective view for explaining a configuration example of an inkjet recording apparatus (liquid ejection apparatus) using the inkjet recording head (liquid ejection head) of the present embodiment. The recording apparatus of this example is a so-called full line system, and uses a long recording head 120 that extends over the entire width direction of the recording medium P. The recording medium P is continuously transported in the direction of arrow A by the transport mechanism 110 using a transport belt or the like. An image is recorded on the recording medium P by ejecting ink (liquid) from the recording head 120 while conveying the recording medium P in the direction of arrow A. In the case of this example, as the recording head 120, recording heads 120C, 120M, 120Y, and 120Bk that discharge cyan (C), magenta (M), yellow (Y), and black (K) inks are used. Images can be recorded.

  FIG. 1B is a perspective view of the recording head 120. The recording head 120 of this example has a plurality of recording element substrates (liquid ejection head substrates) 101 along a direction intersecting (substantially orthogonal in this example) with the conveyance direction (arrow A direction) of the recording medium P. Is a full multi-head arranged in series. As will be described later, the substrate 101 includes an electrothermal conversion element (heater) as a discharge energy generation element (discharge energy generation element) for discharging ink. Various elements such as a piezo element can be used as the ejection energy generating element. Further, a discharge port corresponding to a heater (element) is formed in a top plate (not shown), and a pressure chamber is formed between the top plate and the substrate 101. A plurality of heaters are provided so as to form a plurality of heater rows (element rows), and similarly, a plurality of discharge ports corresponding to these heaters form a plurality of discharge port rows. The heater generates heat by being energized through a pad (connection terminal) and a flexible substrate, which will be described later, to foam the ink, and ink is ejected from the corresponding ejection port using the foaming energy. The substrate 101 may include a top plate on which discharge ports are formed.

  In the substrate 101, a pad row (terminal row) is arranged on each of the two sides 101A and 101B substantially parallel to the heater row, and the flexible substrate 102 having the same wiring pattern is formed in these pad rows. One end is electrically connected. A head substrate 103 on which the same wiring pattern is formed is connected to the other end of the flexible substrate 102. The substrate 101 is disposed on a flow path member 104 that forms an ink flow path. In this example, one substrate 101 is bonded to one flow path member 104. A full multi-head is configured by arranging a plurality of components in which the flow path member 104 and the substrate 101 are integrated on the head base 105. In the case of this example, these constituents are bonded onto the head substrate.

  In this example, the flexible substrate 102 is connected to the pad of the substrate 101. However, the connection destination of the substrate 101 is not limited to the flexible substrate 102 and can be connected to a rigid substrate such as the head substrate 103.

  FIG. 2A is a schematic diagram for explaining the configuration of the heater row and the pad row of the substrate 101. A plurality of heater rows (element rows) L in which a plurality of heaters are arranged is formed on the substrate 101, and a heater row group (first element row group) 202a and a heater row group (second element row group) 202b. Each include a plurality of heater rows. The heater located at the right end (segment “0”) in FIG. 2A in the heater row group 202a is represented by a large black circle and is located at the left end (segment “0”) in FIG. 2A in the heater row group 202b. The heater to be represented is represented by a large black circle. In addition, on the two sides 101A and 101B of the substrate 101 substantially parallel to the heater row L, there are a pad row (first terminal row) 201a and a pad row (second terminal row) 201b in which a plurality of pads 302 are arranged. It is arranged. The heater row L that is shorter than the other heater rows, that is, the heater row L adjacent to the pad row 201a is also referred to as a first element row. The heater row L that is closer to the pad row 201b than the other heater rows, that is, the heater row adjacent to the pad row 201b is also referred to as a second element row. Further, the heater row L other than the first and second element rows is also referred to as a third element row. In the case of this example, the arrangement direction of the pads 302 and the heaters in the pad rows 201a and 201b and the heater row L is the left-right direction in FIG.

  FIG. 2B is a cross-sectional view (a cross-sectional view in a direction orthogonal to the heater array L) taken along line IIb-IIb in FIG. On the upper surface side of the substrate 101 in the figure, a pad 302, a wiring 303, and a heater 304 for forming a heater row L are formed. A plurality of flow paths 305 are formed on the lower surface side of the substrate 101 in FIG. The flow paths 305 are formed so as to correspond to the heater rows L, and distribute ink from the flow path members 104 (see FIG. 1B) to the respective heater rows L. The supply port 306 introduces ink from the flow path 305 into a pressure chamber corresponding to each of the plurality of heaters 304. The supply port 306 is formed so as not to interfere with the wiring 303. In FIG. 2B, for simplification of explanation, a discharge port facing the heater 304 and a component member (nozzle member) of a flow path communicating with the discharge port are not shown.

  In this example, as shown in FIG. 2A, the number of heater rows L corresponding to one color of ink is 24 rows, and 24 ejection port rows are formed so as to correspond thereto. By performing recording by appropriately assigning recording data to these heater arrays L, extremely high-speed recording becomes possible. Further, when ink ejection failure occurs at the ejection port, interpolation is performed from ejection ports in other ejection port arrays at positions corresponding to the ejection ports with the ejection failure in the conveyance direction (arrow A direction) of the recording medium P. Thus, ink can be discharged. As a result, the reliability of the recording operation is improved, and is particularly suitable for commercial printing.

  In the substrate 101 in this example, the left and right portions in FIG. 2B with the center line 203 as a boundary are electrically separated. That is, the heater 304 forming the heater row L included in the heater row group 202a is connected to the data input terminal constituted by the pad 302 included in the pad row 201a, and the data input to the data input terminal It is selectively driven accordingly. That is, the heater 304 to be driven is selected from the heater array group 202a according to the data. The heater 304 forming the heater row L of the heater row group 202a is connected to a heater power supply terminal constituted by the pad 302 included in the pad row 201a, and a drive current is supplied from the heater power supply terminal. On the other hand, the heater 304 forming the heater row L included in the heater row group 202b is connected to the data input terminal constituted by the pad 302 included in the pad row 201b, and the data input to the data input terminal is converted to data. It is selectively driven accordingly. That is, the heater 304 to be driven is selected from the heater array group 202b according to the data. The heater 304 forming the heater row L of the heater row group 202b is connected to a heater power supply terminal constituted by the pad 302 included in the pad row 201b, and a drive current is supplied from the heater power supply terminal.

  As described above, among the plurality of heater rows L on the substrate 101, the heaters 304 in the heater row group 202a located near the pad row 201a provided on one side 101A of the substrate 101 are connected. On the other hand, to the pad row 201b provided on the other side 101B of the substrate 101, the heater 304 in the heater row group 202b located near the pad row 201b is connected. In this way, the pad rows 201a and 201b are associated with the heater row groups 202a and 202b.

  With such a configuration of the substrate 101, the voltage drop difference due to the wiring resistance between the pad row and the heater row can be reduced as compared with the case where the pad row is arranged only on one side of the substrate 101. it can. If the pad row is arranged only on one side of the substrate 101, the voltage drop due to the wiring resistance between the heater row near one side is small and the heater row located near the other side The voltage drop due to the wiring resistance between them becomes large, and the difference between these voltage drops becomes large. In addition, since the pad rows 201a and 201b are arranged on the same substrate as in the present embodiment, the number of substrates is smaller than when they are arranged on different substrates, so that the alignment of the substrates can be performed. Less. Therefore, according to the present embodiment, it is possible to easily ensure the positional accuracy between the heater rows L in those heater row groups.

  In the present embodiment, the pad row 201 a provided on one side 101 </ b> A of the substrate 101 and the heater row L (first element row) adjacent thereto are provided on the side 303 </ b> A side of the center line 203. They are connected via (first wiring). Similarly, a pad row 201b provided on the other side 101B of the substrate 101 and a heater row L (second element row) adjacent to the pad row 201b are provided on the side 101B side from the center line 203 (first line 303B). 2 wiring). In order to reduce the difference in voltage drop caused by the wiring resistance between the pad row and the heater row, at least the pad row 201a and the first element row are connected in this way, and the pad row 201b and the second row are connected. It is only necessary that the element array is connected.

  Further, the heater array L (third element array) excluding the first element array and the second element array is connected to one of the pad array 201a and the pad array 201b via a wiring 303 (third wiring). Here, the third wiring for connecting the third element row and the pad row 201a included in the heater row group 202a is connected to the pad row 201a via the first wiring. The third wiring for connecting the third element row and the pad row 201b included in the heater row group 202b is connected to the pad row 201b via the second wiring. In order to reduce the wiring resistance between the pad row and the heater row, it is preferable to connect the heater row to the pad row arranged on the near side.

  The heater row L is not limited to the form in which the heaters 304 are arranged in a straight line as shown in FIG. 1B, and a part of the heater row L may be shifted in the substrate 101. FIG. 3 is an enlarged view of a portion in the vicinity of the pad row 201b for explaining an example in which a part of the heater row L is shifted in the substrate 101. FIG. In the example of FIG. 3, the heater row L is shifted between the heater 304 arrangement regions (heater arrangement regions) 701 and 702. Similar to the configuration of FIG. 2A, in the heater arrangement regions 701 and 702 in such an example, the heater row L (first element row) located near the pad row 201a is connected to the pad row 201a. ing. Further, a heater row L (second element row) located in the vicinity of the pad row 201b is connected to the pad row 201b.

  FIG. 4 is an explanatory diagram of a specific arrangement example of the pads 302. In FIG. 4A, pads 302 each having a subscript of 1 to n added to D are data input terminals for inputting data signals for selective driving of the heater 304. Further, VH and GND are a power supply pad and a ground pad of the heater 304 that constitute a heater power supply terminal. NC is an unconnected pad, and TEST is a test terminal used for an electrical test of the substrate 101.

  As shown in FIG. 4A, in the pad rows 201a and 201b arranged on the sides 101A and 101B of the substrate 101, the data input terminals (D1 to Dn) and the heater power supply terminals (VH and GND) are generally the substrate. They are arranged rotationally symmetric with respect to the center of 101. In the pad row 201a and the pad row 201b, the arrangement order of the data input terminals (D1 to Dn) and the heater power supply terminals (VH, GND) is opposite in the extending direction of the pad row.

  In the pad rows 201a and 201b, when the pads 302 having the same function are connected by a broken line 501, the broken line 501 almost intersects at the center of the recording substrate. With such a configuration, the flexible substrate 102 connected to the substrate 101 in FIG. 1B and the flexible substrate 102 connected to the substrate 101 in FIG. 4A can be shared. Specifically, it is assumed that the same data is input to the data input terminals (D1 to Dn) of the pad rows 201a and 201b. In this case, the position of the heater 304 to be driven in the heater array group 202a and the position of the heater 304 to be driven in the heater array group 202b rotate around the position between the heater array groups 202a and 202b. It becomes symmetric. This rotationally symmetric center is also substantially the center of the recording element substrate 101. Thus, the data input terminals (D1 to Dn) in each of the pad rows 201a and 201b are arranged. With such an arrangement, as described later, normal image data is distributed to one of the heater array groups 202a and 202b, and inverted image data is distributed to the other of the heater array groups 202a and 202b. It is possible to record in a plurality of heater rows L.

  Further, the connection conditions for electrically connecting the substrate and the flexible substrate by wire bonding or the like can be made common. Note that the test terminals and the unconnected terminals (TEST, NC) that do not affect the selective driving of the heater 304 need not be arranged symmetrically.

  FIG. 4B is an explanatory diagram of another arrangement example of the pad 302. In the arrangement example of FIG. 4B, the relationship of the symmetrical arrangement of the pads 302 in FIG. 4A is slightly shifted. In the case of this example, only in the pad row 201a on the side 101A side of the substrate 101, the test terminal (TEST) is arranged between the data input terminal D2 and the data input terminal D3. In such a configuration, when the pads 302 in the pad rows 201a and 201b having the same function are connected by the broken line 501, the intersection between them is not one point. Also in this configuration, a flexible substrate connected to the substrate can be shared as in the case of FIG. The reason is that wire bonding wires can be obliquely connected to the same flexible substrate if the order of arrangement of data input terminals (D1 to Dn) and heater power supply terminals (VH, GND) is maintained. is there.

  FIG. 4C is an explanatory diagram of still another arrangement example of the pads 302. In the case of this example, in the pad row 201a on the side 101A side of the substrate 101, a total of 2 is provided between the data input terminal D1 and the data input terminal D2 and between the data input terminal D2 and the data input terminal D3. Two test terminals (TEST) are arranged. Furthermore, the arrangement pitch between the data input terminal D1, the test terminal (TEST), and the data input terminal D2 adjacent to each other is different from the arrangement pitch of the other pads 302. Even in such a configuration, wire bonding wires can be obliquely connected to the same flexible substrate as long as the order of arrangement of the heater power supply terminals (VH, GND) is maintained.

  Furthermore, the layout of the electric circuit connected to each of the heater array groups 202 a and 202 b on the substrate 101 can also have a rotationally symmetric relationship with respect to the approximate center of the substrate 101. Thus, the circuit design load can be reduced by making the layout of the electric circuit have a rotationally symmetric relationship.

  Furthermore, the recording speed can be improved by distributing image data corresponding to the same color ink to the plurality of heater rows L in the substrate 101 and discharging the same color ink from the heater rows L. . In this case, in the plurality of substrates 101 arranged in the length direction of the recording head 120, the heater rows L in the substrates 101 adjacent to each other are mutually in the conveyance direction (arrow A direction) of the recording medium P corresponding to the raster direction. Arranged to overlap. As a result, images on the same raster are recorded using a plurality of heaters 304 in the heater row L that overlap on the substrates 101 adjacent to each other. That is, images on the same raster are recorded by ink ejected from a plurality of ejection openings corresponding to a plurality of heaters 304 that overlap each other.

  FIG. 5 is a conceptual diagram of such a recording operation by distributing image data. The image data is divided so as to correspond to a plurality of heater arrays L. For example, when the image data input to one pad row 201a out of the pad rows 201a and 201b arranged in a rotationally symmetrical manner as described above is normal rotation, the image data is applied to the other pad row 201b. Is distributed with respect to the segment arrangement. As a result, the image data is distributed to the heater arrays so that the images on the same raster are recorded by the plurality of heater arrays L in one substrate 101.

(Second Embodiment)
FIG. 6A is an enlarged plan view of the heater row L portion of the printing element substrate 101 according to the second embodiment of the present invention, and FIG. 6B is a cross section taken along the line VIb-VIb of FIG. FIG. The same parts as those in the first embodiment described above are denoted by the same reference numerals, and the description thereof is omitted.

  In the substrate 101 of this embodiment, an arbitrary heater array L is positioned between two supply port arrays La and Lb in which ink supply ports 306 are arranged. That is, two supply port rows La and Lb are provided for one heater row L. With respect to the pressure chamber between the discharge port 307 formed in the top plate and the heater 304 corresponding thereto, ink can be circulated from one of the supply port arrays La and Lb to the other. That is, the ink in the pressure chamber is circulated between the outside thereof. In this example, ink is introduced into the pressure chamber through the flow channel 305 and the supply port 306 on the supply port row La side as indicated by an arrow 401, and the supply port 306 ( The ink in the pressure chamber is led out through the discharge port) and the flow path 305. By circulating the ink in this way, it is possible to suppress thickening of the ink in the vicinity of the ejection port 307 and sticking of the thickened ink to the ejection port 307. Further, by removing foreign matter such as dust in the discharge port 307 and the pressure chamber along with the circulation of the ink, it is possible to suppress the occurrence of defective ink discharge caused by the foreign matter.

  The arrangement area of the wiring 303 is limited to a portion where the supply port 306 is avoided. Therefore, the arrangement region of the wiring 303 between the supply ports 306 is narrowed, and a constricted portion 303A of the wiring 303 exists as shown in FIG. For example, when the heater row L in FIG. 6 is connected to the pad row located on the left side of FIGS. 6A and 6B by the wiring 303, the number of heater rows L connected to the pad row. As the number increases, the constricted portion 303A exists between the pad row and the heater row. That is, as the number of heater rows L increases, the total length of the constricted portion 303A between the heater rows and the pad row to which they are connected increases, and as a result, the wiring resistance between them increases. Will increase. In the present embodiment, similarly to the above-described embodiment, the heater row L located near the pad row 201a is connected to the pad row 201a, and the heater row L located near the pad row 201b is connected to the pad row 201b. Connected to. Therefore, when the ink circulation configuration is employed as in the present embodiment, an increase in wiring resistance due to the constricted portion 303A can be suppressed.

(Third embodiment)
FIG. 7 is a schematic diagram for explaining a configuration of heater rows and pad rows of the printing element substrate 101 according to the third embodiment of the present invention. The same parts as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  In the first embodiment, the wiring for selectively driving the heater 304 and the power wiring for supplying a power source current to the heater 304 are both electrically separated with the center line 203 as a boundary. In the present embodiment, the wiring for selectively driving the heater is electrically separated with the center line 203 as a boundary, as in the first embodiment. However, the power supply wiring of the heater 304 is separated into the pad row 201a side and the pad row 201b side with the other boundary line 204 as a boundary.

  In the case where the heater power supply terminals (VH, GND) are arranged near the center of the sides 101A, 101B of the substrate 101 in the pad rows 201a, 201b, depending on the heater 304 in the heater row L near the center line 203, There is a difference in wiring distance. That is, since the plane of the substrate 101 is a parallelogram, in the heater row L near the center line 203, the segment on the opposite side of the heater 304 on the segment “0” side is the heater 304 and the pad 302. The distance between becomes longer. That is, as compared with the heater 304 on the segment “0” side, the heater 304 of the segment on the opposite side tends to have higher wiring resistance. Therefore, in the present embodiment, regarding the power supply wiring, unlike the wiring for selectively driving the heater, the pad row 201a side and the pad row 201b side are bordered by the boundary line 204 partially exceeding the center line 203. And to separate. The boundary line 204 in this example is formed in a staircase shape. The reason is that a boundary is provided for each group in order to divide the plurality of heaters 304 into groups and drive them in a time-sharing manner.

  In this example, the plane of the substrate 101 is a parallelogram having an inner angle that is not a right angle. However, the shape of the substrate 101 is not limited. For example, in the case of the substrate 101 having a rectangular plane as shown in FIG. 8, even when the heater power supply terminals (VH, GND) are in a deviated position in the pad rows 201a, 201b, It is effective to separate the power supply wiring.

(Fourth embodiment)
FIG. 9A is a schematic diagram for explaining the configuration of the heater row and the pad row of the substrate 101 in the fourth embodiment of the present invention. In the present embodiment, the wiring for selectively driving the heater is separated with the center line 203 as a boundary, while the power wiring for the heater 304 is electrically common.

  FIG. 9B is a cross-sectional view (a cross-sectional view in a direction orthogonal to the heater array L) along the line IXb-IXb in FIG. The wiring 303 is laminated so as to form four wiring layers. Of the four layers, the power supply current is supplied to the heater on two layers on the surface side of the substrate 101 (upper surface side in FIG. 9B). A power supply wiring for flowing a current is formed. In this example, the power supply wiring is formed so as to straddle the center line 203. Accordingly, the pad rows 201a and 201b are connected by the power supply wiring in the substrate 101, and the power supply current flowing through the heater flows through the power supply terminals (VH and GND) in the respective pad rows 201a and 201b. As a result, the wiring resistance becomes smaller than when the power supply wiring is separated, and a voltage drop due to the wiring resistance can be suppressed.

(Fifth embodiment)
FIG. 10 is a cross-sectional view (cross-sectional view in a direction orthogonal to the heater array L) of the substrate 101 according to the fifth embodiment of the present invention. The wiring 303 is laminated so as to form four wiring layers, and a power supply current is supplied to the heater in two layers on the front surface side (upper surface side in FIG. 10) of the substrate 101 among the four layers. Power supply wiring is formed. Of these two layers, the power wiring of one layer is formed so as to straddle the center line 203, and the power wiring end of the other layer is separated with the center line 203 as a boundary. The former power supply wiring formed so as to straddle the center line 203 is a ground wiring connected to the ground terminal GND, and the latter power supply wiring separated with the center line 203 as a boundary is connected to the power supply terminal VH. Power supply wiring.

  The ground wiring in this example serves as a reference potential for a driver transistor (not shown). If the reference potential of the driver transistor changes greatly due to the current flowing through the parasitic resistance of the wiring, the characteristics of the transistor may change and the heater may not be driven stably. Therefore, in this example, by connecting the ground terminals GND of the pad rows 201a and 201b within the substrate 101, the resistance of the ground wiring is reduced and the fluctuation of the reference potential of the driver transistor is suppressed.

  By the way, when the power supply wirings of the pad rows 201a and 201b are connected in the substrate 101, a current is distributed and flows to the pad rows 201a and 202b. In addition, the heater 304 as a recording element is supplied with electric power from the main body side of the recording apparatus via wiring in another flexible substrate and a rigid substrate. When the wiring resistance other than the heater 304 is relatively large, the energization time of the heater 304 may be adjusted to compensate for the voltage drop in the wiring other than the heater 304. However, when the power supply wiring is shared inside the recording element substrate 101, it is possible to grasp the current flowing through the wiring of the flexible substrate and the rigid substrate that are separately connected to the pad rows 201a and 201b. It becomes difficult. For this reason, there is a concern that the adjustment accuracy of the energization time of the heater 304 is lowered.

  From this point of view, in this example, as described above, the resistance of the ground wiring is reduced, while the power supply wiring is separated in the substrate 101 with the center line 203 as a boundary, so that the heater 304 energization time is reduced. Increase adjustment accuracy. Note that the ground wiring may be separated in the substrate 101, the power supply wiring may be shared without being separated in the substrate 101, and the power supply wiring may be used as the reference potential of the driver transistor. In addition, regardless of the reference potential of the driver transistor, a certain effect can be obtained by making one of the ground wiring and the power supply wiring common as the power wiring and separating the other.

(Other embodiments)
The present invention can be applied not only to a full-line recording apparatus but also to various types of recording apparatuses such as a so-called serial scan system.

  The present invention can be widely applied to a substrate for a liquid discharge head capable of discharging various liquids, a liquid discharge head, and a liquid discharge apparatus. The present invention also provides a liquid discharge device that performs various processes (recording, processing, application, irradiation, reading, inspection, etc.) on various media (including sheets) using a liquid discharge head capable of discharging liquid. The present invention can also be applied to a device. The medium (including the recording medium) includes various media to which a liquid containing ink is applied regardless of the material, such as paper, plastic, film, fabric, metal, and flexible substrate.

101 Recording element substrate (substrate for liquid discharge head)
105 Head substrate 201a, 201b Pad row (terminal row)
202a, 202b Heater row group (element row group)
302 Pad (connection terminal)
303 Wiring 304 Heater (element)

Claims (16)

A first terminal row in which a plurality of first terminals are arranged;
A second terminal row in which a plurality of second terminals are arranged along the arrangement direction of the first terminal row;
Between the first terminal row and the second terminal row, a first element row adjacent to the first terminal row and having a plurality of first elements arranged along the arrangement direction of the first terminal row; ,
Between the first terminal row and the second terminal row, a second element row adjacent to the second terminal row and having a plurality of second elements arranged along the arrangement direction of the second terminal row; ,
A third element row in which a plurality of third elements are arranged between the first element row and the second element row;
A first wiring connecting the plurality of first terminals and the plurality of first elements;
A second wiring connecting the plurality of second terminals and the plurality of second elements;
A third wiring connecting at least one of the plurality of first terminals and the plurality of second terminals and the plurality of third elements;
A substrate for a liquid discharge head, comprising:   The third wiring is connected to at least one of the plurality of first terminals and the plurality of second terminals via at least one of the first wiring and the second wiring. The liquid discharge head substrate according to claim 1.   The third wiring is connected to one of the plurality of first terminals and the plurality of second terminals via one of the first wiring and the second wiring. Item 3. The liquid discharge head substrate according to Item 2.   The liquid discharge head substrate according to claim 2, wherein the third wiring connects the first wiring and the second wiring. An interval between the third element row and the first terminal row is different from an interval between the third element row and the second terminal row,
The third wiring line connects the third element row to a side closer to the third element row of the first terminal row and the second terminal row. The substrate for a liquid discharge head according to any one of the above. The third element row is located closer to the first element row than the second element row and forms a first element row group together with the first element row, and the first element row An element row that is located closer to the second element row than to the element row and forms a second element row group together with the second element row, and
The third wiring includes a wiring that connects the first element array group and the first terminal array, and a wiring that connects the second element array group and the second terminal array. The liquid discharge head substrate according to any one of claims 1 to 3.   The third element row includes the plurality of third elements connected only to the plurality of first terminals, and the plurality of third elements connected only to the plurality of second terminals. The substrate for a liquid discharge head according to any one of claims 1 to 3. The first terminal array includes a plurality of first input terminals for inputting data for selecting a first element to be driven from the first element array group, and a first power supply terminal,
The second terminal array includes a plurality of second input terminals for inputting data for selecting a second element to be driven from the second element array group, and a second power supply terminal. Item 7. The liquid discharge head substrate according to Item 6.   The arrangement order of the first input terminal and the first power supply terminal in the first terminal row is opposite to the arrangement order of the second input terminal and the second power supply terminal in the second terminal row. The liquid discharge head substrate according to claim 8, wherein the substrate is a liquid discharge head substrate.   When the same data is input to the plurality of first input terminals and the plurality of second input terminals, the position of the first element driven in the first element array group and the drive in the second element array group The plurality of first input terminals and the plurality of second input terminals so that the positions of the second elements are rotationally symmetric about a position between the first element row and the second element row. The liquid discharge head substrate according to claim 8, wherein the liquid discharge head substrate is arranged.   The liquid ejection head substrate according to claim 1, wherein the third wiring includes at least one of a power supply wiring and a ground wiring.   12. The liquid discharge head according to claim 1, wherein the plurality of first elements, the plurality of second elements, and the plurality of third elements are electrothermal conversion elements. Substrate.   A liquid discharge head comprising the liquid discharge head substrate according to claim 1. The liquid discharge head substrate includes a pressure chamber in which any of the first, second, and third elements is provided,
The liquid discharge head according to claim 13, wherein the liquid in the pressure chamber is circulated between the pressure chamber and the outside.   15. The liquid discharge head according to claim 13, further comprising a head substrate on which a plurality of the liquid discharge head substrates are arranged.   A liquid ejection apparatus comprising: a liquid ejection head including the liquid ejection head substrate according to claim 1; and a supply unit configured to supply liquid to the liquid ejection head.

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