JP2017209692A - Machine tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a machine tool capable of properly machining a material even if there is a variation in a plate thickness and a composition in the material.SOLUTION: A machining condition table holding part 121 holds a machining condition table indicating a machining condition made to correspond to a plurality of sets of a material quality and a plate thickness of a material to be machined by a laser beam machine body 11. An operation-display part 13 selects the sets of the material quality and the plate thickness of the material of a machining object to be machined by the laser beam machine body 11 from a machining condition table. A machining condition correction part 123 refers to material quality data obtained by analyzing the material quality of the material of the machining object and plate thickness data obtained by measuring the plate thickness of the material of the machining object to correct the machining condition read out from the machining condition table holding part 121 selected by the operation-display part 13. A machining control part 124 controls the laser beam machine body 11 to machine the material of the machining object based on the machining condition corrected by the machining condition correction part 123.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a machine tool for processing a metal material.

  As machine tools for processing metal materials, there are laser processing machines that cut materials with laser light, bending machines that fold materials by sandwiching them between punch dies and die dies, and laser welding machines that weld materials with laser light. It is popular.

Japanese Patent No. 2800946 JP-A-9-136181

  A machine tool is required to process a material under processing conditions according to the material and thickness of the material to be processed. The operator selects the material and plate thickness of the material and sets them on the machine tool, and the machine tool processes the material under the processing conditions corresponding to the selected material and plate thickness. Thereby, the machine tool can process material appropriately.

  However, strictly speaking, for example, when processing a material with a thickness of 10 mm, if the actual thickness of the material is a plate material with a width of less than 1600 mm according to the Japanese Industrial Standard (JIS), a variation in thickness of ± 0.55 mm is acceptable. Therefore, the material may not be processed properly. Further, if there is a variation in the composition of the metal that is the material (component composition or ratio), the material may not be processed appropriately as well. That is, even if the material shows the same plate thickness or material, the plate thickness or composition varies depending on the country or region or the steel material manufacturing company. The operator must finely adjust the processing conditions according to variations in the thickness or composition of the material.

  An object of the present invention is to provide a machine tool capable of appropriately processing a material even when the thickness or composition of the material varies.

  The present invention provides a processing condition table holding unit for holding a processing condition table indicating processing conditions corresponding to a plurality of sets of material and plate thickness of a material processed by the processing machine body, and processing by the processing machine body. An operation unit that selects a set of material and plate thickness of the material to be processed from the processing condition table, material data obtained by analyzing the material of the material to be processed, and measurement of the plate thickness of the material to be processed The processing condition correction unit that corrects the processing condition selected by the operation unit and read from the processing condition table holding unit with reference to the plate thickness data, and the processing condition corrected by the processing condition correction unit And a processing control unit that controls to process the material to be processed by the processing machine main body.

  The present invention also includes a material analyzer for analyzing the material of the material to be processed, a plate thickness measuring device for measuring the plate thickness of the material to be processed, and the material and plate thickness of the material processed by the processing machine body. A processing condition table holding unit for holding a processing condition table indicating processing conditions corresponding to a plurality of sets, and a set of material and plate thickness of a material to be processed to be processed by the processing machine body. The operation unit selected from the condition table, and the set of the material and the plate thickness selected by the operation unit were measured by the material and the plate thickness measuring instrument analyzed by the material analyzer. There is provided a machine tool comprising a match / mismatch determination unit that determines whether or not the set matches the thickness of the material to be processed.

  According to the machine tool of the present invention, the material can be processed appropriately even if the material has a variation in plate thickness or composition.

1 is a block diagram illustrating an example of an overall configuration of a machine tool according to an embodiment. It is a block diagram which shows the preferable structural example of a laser beam machine among the machine tools of one Embodiment. FIG. 5 is a block diagram illustrating another example of the configuration of the machine tool according to the embodiment, in which a laser processing machine and a laser welding machine are extracted. It is a block diagram which shows the functional internal structure of NC apparatus with which a laser beam machine is provided. It is a figure which shows the specific structural example of a laser beam machine. It is a partial side view for demonstrating operation | movement of the material analyzer and plate | board thickness measuring device with which a laser beam machine is equipped. It is a figure which shows the structural example of the laser oscillator with which a laser beam machine is provided. It is a flowchart for demonstrating operation | movement of the machine tool of one Embodiment.

  Hereinafter, a machine tool according to an embodiment will be described with reference to the accompanying drawings. In FIG. 1, a machine tool according to an embodiment includes a laser processing machine 10 that cuts a metal plate material with a laser beam, a bending machine 20 that folds the material between a punch die and a die die, and a material. It is at least one of the laser welding machine 30 which welds with a laser beam. Note that a laser processing machine, a bending machine, and a laser welding machine are all examples of processing machines in a broad sense.

  The laser processing machine 10, the bending machine 20, and the laser welding machine 30 are connected to the server 40 and are connected to each other via the server 40. The laser beam machine 10, the bending machine 20, and the laser welding machine 30 may be directly connected without using the server 40. A printer 50 is connected to the server 40. For example, the laser processing machine 10, the bending machine 20, and the laser welding machine 30 are installed at a processing site, and the server 40 and the printer 50 are installed in an office.

  The server 40 may be connected to an external server 70 via a network 60 such as the Internet. The server 70 may be a server managed by a machine tool manufacturer.

  The material cut into a predetermined shape by the laser processing machine 10 is bent into a predetermined shape by the bending machine 20. The material bent by the bending machine 20 is welded at a predetermined location by the laser welding machine 30 to become a product.

  The laser processing machine 10 includes a laser processing machine main body 11, an NC device 12 that controls the laser processing machine main body 11, an operation unit that is operated for predetermined input to the NC device 12, and a display unit that displays various information. Is provided with an operation / display unit 13. The operation / display unit 13 may have a separate operation unit and display unit. Further, predetermined input data generated by a computer (not shown) installed separately may be input to the NC device 12 via the server 40.

  The laser processing machine 10 further includes a material analyzer 151 that analyzes the material of the material to be processed that is to be processed by the laser processing machine body 11, and a plate thickness measuring device 152 that measures the thickness of the material to be processed. Prepare.

  The material analyzer 151 is a fluorescent X-ray analyzer as an example. As for the X-ray fluorescence analyzer, for example, Rigaku Co., Ltd. sells a Niton portable component analyzer XL2 series, and HORIBA, Ltd. sells a handheld X-ray fluorescence analyzer MESA-800. The material analyzer 151 can be realized by applying these products. The plate thickness measuring device 152 is an ultrasonic thickness meter as an example. The ultrasonic thickness meter is commercially available from Olympus Corporation as an ultrasonic thickness meter 45MG, for example. The plate thickness measuring device 152 can be realized by applying this product.

  The material analyzer 151 analyzes the composition of the metal that is the material (component configuration, component amount, and component ratio), and supplies material data indicating the metal composition to the NC device 12 and the plate thickness measuring device 152. The plate thickness measuring device 152 obtains the speed of ultrasonic waves propagating through the material based on the material data, and measures the plate thickness of the material. Therefore, the plate thickness measuring device 152 can accurately measure the plate thickness of the material. The plate thickness measuring device 152 supplies plate thickness data indicating the plate thickness of the measured material to the NC device 12.

  When the thickness of the material can be accurately measured without using the material data as the thickness measuring device 152, the material data is supplied to the thickness measuring device 152. There is no need.

  When the laser processing machine body 11 processes a material, the NC device 12 corrects the processing conditions based on at least one of the material data and the plate thickness data, and causes the laser to process the material based on the corrected processing conditions. The processing machine body 11 may be controlled.

  The NC device 12 supplies material data and sheet thickness data to the server 40. When the laser processing machine 10 processes a plurality of different materials, the NC device 12 supplies the material data and plate thickness data of each material to the server 40. The server 40 holds material data and sheet thickness data of the supplied material.

  A preferred configuration example of the laser processing machine 10 will be described with reference to FIG. In FIG. 2, the laser processing machine 10 includes a surface state measuring device 153, a film thickness measuring device 154, and a non-contact type thermometer 155 in addition to the material analyzer 151 and the plate thickness measuring device 152.

  The surface state measuring device 153 measures at least one of the color, gloss, and light reflectance of the material to be processed, and supplies the surface state measurement data to the NC device 12. The film thickness measuring device 154 measures the film thickness of the film formed on the surface of the material to be processed and supplies the film thickness measurement data to the NC device 12. The coating formed on the surface of the material is, for example, a coating for rust prevention. The non-contact type thermometer 155 measures the temperature of the material to be processed and supplies temperature data to the NC device 12.

  The surface state measuring device 153 is, for example, a spectrocolorimeter or an appearance analyzer. The spectrocolorimeter is commercially available from Konica Minolta, Inc. as CM-700d or CM-600d, for example. An appearance analyzer, for example, Konica Minolta Co., Ltd. is sold as Rhopoint IQ-S. The surface state measuring device 153 can be realized by applying these products.

  The film thickness measuring device 154 is, for example, a reflection spectral film thickness measuring device, an electromagnetic film thickness meter, or an eddy current film thickness meter. The reflection spectral film thickness measuring instrument is commercially available as a hybrid laser microscope from Lasertec Corporation, for example. An electromagnetic film thickness meter and an eddy current film thickness meter are available from, for example, Sanko Electronics Laboratory. The film thickness measuring device 154 can be realized by applying these products.

  The non-contact type thermometer 155 is a non-contact type infrared radiation temperature sensor as an example. Non-contact infrared radiation temperature sensors are available from, for example, Sentec Corporation. The non-contact type thermometer 155 can be realized by applying this product.

  When the laser processing machine body 11 processes the material, the NC device 12 corrects the processing conditions based on at least one of the surface state measurement data and the temperature data in addition to at least one of the material data and the plate thickness data. The laser processing machine main body 11 may be controlled to process the material based on the corrected processing conditions.

  The NC device 12 supplies the server 40 with material data, plate thickness data, and film thickness measurement data. When the laser processing machine 10 processes a plurality of different materials, the NC device 12 supplies the server 40 with material data, plate thickness data, and film thickness measurement data for each material. The server 40 holds material data, plate thickness data, and film thickness measurement data of the supplied material. The film thickness measurement data is used in the laser welding machine 30.

  Since the film thickness measurement data output from the film thickness measuring device 154 is used in the laser welding machine 30, the film thickness measuring device 154 may be provided in the laser welding machine 30 as shown in FIG.

  Returning to FIG. 1, the bending machine 20 includes a bending machine body 21, an NC device 22 that controls the bending machine body 21, an operation unit that operates for predetermined input to the NC device 22, and various types of information. And an operation / display unit 23 integrated with a display unit for display. In the operation / display unit 23, the operation unit and the display unit may be separate. Similarly, predetermined input data generated by a separately installed computer (not shown) may be input to the NC device 22 via the server 40.

  When the operation / display unit 23 instructs to read material data and plate thickness data of the material to be processed, the NC device 22 reads the material data and plate thickness data of the material to be processed from the server 40 and holds the data.

  When the bending machine body 21 bends the material, the NC device 22 corrects the processing condition based on at least one of the material data and the plate thickness data, and causes the material to be bent based on the corrected processing condition. The bending machine main body 21 may be controlled.

  Instead of the NC device 22 reading the material data and plate thickness data of the material to be processed from the server 40, the NC device 22 includes a material analyzer 151 and a plate thickness measuring device 152 to analyze the material of the material to be processed. The plate thickness may be measured. If the NC device 22 reads the material data and the plate thickness data of the material to be processed from the server 40, the NC device 22 does not need to include the material analyzer 151 and the plate thickness measuring device 152. It is preferable to read out material data and thickness data of the material.

  The laser welder 30 includes a laser welder main body 31, an NC device 32 that controls the laser welder main body 31, an operation unit that operates for predetermined input to the NC device 32, and a display unit that displays various types of information. Is provided with an operation / display unit 33 that is integrated. In the operation / display unit 33, the operation unit and the display unit may be separate. The laser welding machine main body 31 is also included in the processing machine main body. Similarly, predetermined input data generated by a separately installed computer (not shown) may be input to the NC device 32 via the server 40.

  When the laser processing machine 10 is configured as shown in FIG. 2, when the operation / display unit 33 instructs to read material data, plate thickness data, and film thickness measurement data of the material to be processed, the NC device 32. Reads and holds the data from the server 40. When the laser welding machine 30 is configured as shown in FIG. 3, the NC device 32 reads the material data and the plate thickness data from the server 40 and holds the film thickness measurement data output from the film thickness measuring device 154.

  When the laser welding machine body 31 welds the material, the NC device 32 corrects the processing conditions based on the material data, the plate thickness data, and the film thickness measurement data, and welds the materials based on the corrected processing conditions. The laser welder main body 31 may be controlled.

  The functional configuration and operation of the NC device 12 of the laser processing machine 10 will be described with reference to FIG. FIG. 4 shows a case where the laser processing machine 10 is configured as shown in FIG. As shown in FIG. 4, the NC device 12 includes a machining condition table holding unit 121 that holds a machining condition table in which machining conditions are associated with a set of a plurality of materials and plate thicknesses.

  The material here refers to the kind of metal of the material, such as a mild steel plate, a stainless steel plate, and an aluminum plate. The processing condition is at least laser power when processing the material. The processing conditions may include at least one of a laser beam moving speed, a type of condensing lens, focal position correction, a nozzle diameter, an assist gas type, and an assist gas pressure in addition to the laser power.

  The operation / display unit 13 displays a set of a plurality of materials and plate thicknesses. For example, when cutting a mild steel plate having a thickness of 10 mm, the operator selects a mild steel plate as the material and 10 mm as the thickness.

  The material analyzer 151 and the plate thickness measuring device 152 analyze the material of the material to be processed arranged in the laser processing machine main body 11 in advance and measure the plate thickness to determine whether the material data and the plate thickness data match or not. To the unit 122 and the processing condition correction unit 123. The match / mismatch determination unit 122 and the processing condition correction unit 123 hold material data and plate thickness data.

  When the operator selects the material and the plate thickness, the information indicating the material and the plate thickness is supplied to the coincidence / non-coincidence determining unit 122, and the machining conditions corresponding to the selected material and the plate thickness are supplied to the machining condition correcting unit 123. .

  If the operator selects a mild steel plate and the material data supplied from the material analyzer 151 indicates, for example, aluminum, the operator may select the material disposed in the laser processing machine body 11 to be incorrect. That is wrong. In this case, the coincidence / non-coincidence determining unit 122 determines that the material of the set of the material and the plate thickness is inconsistent, and causes the operation / display unit 13 to display warning information.

  If the operator selects the plate thickness of 10 mm, and the plate thickness data supplied from the plate thickness measuring device 152 indicates, for example, 20.5 mm, the material disposed in the laser processing machine body 11 is erroneously set. Or the operator's choice of material is wrong. As described above, when the plate thickness is different from the allowable variation, the match / mismatch determination unit 122 determines that the plate thickness of the set of the material and the plate thickness does not match, and the operation / Warning information is displayed on the display unit 13.

  The operator can recognize from the warning information displayed on the operation / display unit 13 that the wrong material is arranged or that the processing conditions are wrongly selected. If the match / mismatch determination unit 122 determines that the material or the plate thickness does not match, it is preferable to control the processing control unit 124 so that the material is not processed even if a processing command is issued.

  If the material specified by the operator or the material different from the plate thickness is mistakenly placed on the machine tool, and the material is machined without noticing that the wrong material is placed, not only will the material not be properly machined, There is also a risk of damaging the parts. In the laser processing machine 10, the nozzle provided at the tip of the processing head may be damaged. Providing the coincidence / non-coincidence determination unit 122 can prevent erroneous processing of a material different from the designated material or plate thickness.

  If the coincidence / non-coincidence determining unit 122 determines that the material and the plate thickness match, the coincidence / non-coincidence determining unit 122 supplies information indicating the fact to the machining condition correcting unit 123. The strict processing conditions for processing materials appropriately differ between a mild steel plate having a thickness of 10.0 mm, a mild steel plate having a thickness of 10.2 mm, and a mild steel plate having a thickness of 9.8 mm. The processing conditions set at a plate thickness of 10 mm in the processing condition table define the processing conditions when the plate thickness is, for example, 10.0 mm as a representative value.

  The processing condition correction unit 123 corrects the processing conditions according to the thickness of the material indicated by the thickness data. Specifically, the processing condition correction unit 123, for example, slightly increases or slightly decreases the laser power. Depending on the thickness of the material indicated by the thickness data, the processing condition correction unit 123 may not correct the processing conditions. The processing condition correction unit 123 may correct processing conditions other than the laser power.

  Even if the name of the material is the same mild steel plate, the strict processing conditions for appropriately processing the material are different if the composition of the material is different. Preferably, the processing condition correction unit 123 corrects the processing conditions according to the composition of the material indicated by the material data. More preferably, the processing condition correction unit 123 corrects the processing conditions in accordance with both the thickness and composition of the material.

  An optimum machining condition corresponding to the plate thickness or composition is obtained in advance, and the machining condition correction unit 123 sets the optimum machining condition read from the machining condition table holding unit 121 according to the plate thickness data or material data. What is necessary is just to correct to processing conditions.

  The machining program holding unit 125 holds a machining program for machining a material in advance. The machining program is constituted by a machine control code for controlling the laser beam machine main body 11. When the operator instructs the processing of the material to be processed by the operation / display unit 13, a processing command signal is supplied from the operation / display unit 13 to the processing control unit 124. The processing control unit 124 controls the laser processing machine body 11 to process the material to be processed based on the processing program and the processing conditions corrected by the processing condition correcting unit 123.

  When the laser beam machine 10 is configured as shown in FIG. 2 or FIG. 3, the machining condition correction unit 123 responds to at least one of the plate thickness data, material data, surface state measurement data, and temperature data. The machining conditions may be modified. The machining condition correction unit 123 may be configured such that the operator manually fine-tunes the machining conditions.

  When machining conditions are specified in the machining program, the operator selects a machining program to be machined by the operation / display unit 13. The material analyzer 151 and the plate thickness measuring device 152 analyze the material of the material to be processed arranged in the laser processing machine main body 11 and measure the plate thickness. When the coincidence / non-coincidence determining unit 122 determines that the material or the plate thickness does not match, warning information is displayed on the operation / display unit 13. When the operator operates the operation / display unit 13 so as to finely adjust the processing conditions manually, the processing condition correction unit 123 may be configured to finely adjust the processing conditions in accordance with the manual adjustment operation of the processing conditions. .

  The NC device 22 of the bending machine 20 and the NC device 32 of the laser welding machine 30 are configured similarly to FIG. The machining condition table in the NC device 22 may hold the machining conditions necessary for the bending process corresponding to each set of a plurality of materials and plate thicknesses. The machining condition correction unit in the NC device 22 may correct the machining conditions according to the plate thickness data or material data. The bending processing conditions include at least one of mold information selected from bending angle, bending length, V width, depth, pressure, etc., and bending extension allowance (shrinkage allowance) in addition to the material and plate thickness. May be included.

  The machining condition table in the NC device 32 may hold the machining conditions necessary for welding in correspondence with each set of a plurality of materials and plate thicknesses. The machining conditions in the machining condition table of the NC device 32 are substantially the same as the machining conditions in the machining condition table of the NC device 12, and in addition to the laser power, the moving speed of the laser beam, the type of the condenser lens, the focal position correction, It may include at least one of nozzle diameter and shield gas information. The processing condition correction unit in the NC device 32 may correct the processing conditions in accordance with the plate thickness data, material data, or film thickness measurement data.

  A specific configuration example of the laser processing machine 10 will be described with reference to FIGS. In FIG. 5, the laser processing machine main body 11 includes a laser oscillator 101 that generates and emits a laser beam LB, a laser processing unit 103, and a process fiber 102 that transmits the laser beam LB to the laser processing unit 103.

  The NC device 12 controls the laser oscillator 101 and the laser processing unit 103. The laser processing machine main body 11 cuts the plate material W, which is a material to be processed, with the laser light LB emitted from the laser oscillator 101 based on the control by the NC device 12.

  The laser oscillator 101 is a fiber laser oscillator or a direct diode laser oscillator (DDL oscillator). The process fiber 102 is mounted along X-axis and Y-axis cable ducts (not shown) arranged in the laser processing unit 103.

  The laser processing unit 103 includes a processing table 104 on which the plate material W is placed, a portal X-axis carriage 105 that is movable in the X-axis direction on the processing table 104, and a Y-axis that is perpendicular to the X-axis on the X-axis carriage 105. And a Y-axis carriage 106 that is movable in the direction. Further, the laser processing unit 103 has a collimator unit 107 fixed to the Y-axis carriage 106.

  The collimator unit 107 collimates the laser light LB emitted from the output end of the process fiber 102 into a parallel light to make a substantially parallel light beam, and the laser light LB converted into a substantially parallel light beam on the X axis and the Y axis. And a bend mirror 109 that reflects downward in the vertical Z-axis direction. Further, the collimator unit 107 includes a condenser lens 110 that condenses the laser light LB reflected by the bend mirror 109 and a processing head 111.

  The collimator lens 108, the bend mirror 109, the condenser lens 110, and the processing head 111 are fixed in the collimator unit 107 with the optical axis adjusted in advance. In order to correct the focal position, the collimating lens 108 may be configured to move in the X-axis direction.

  The collimator unit 107 is fixed to a Y-axis carriage 106 that is movable in the Y-axis direction. The Y-axis carriage 106 is provided on an X-axis carriage 105 that is movable in the X-axis direction. Therefore, the laser processing unit 103 can move the position at which the laser beam LB emitted from the processing head 111 is applied to the plate material W in the X-axis direction and the Y-axis direction.

  With the above configuration, the laser processing machine 10 can transmit the laser beam LB emitted from the laser oscillator 101 to the laser processing unit 103 through the process fiber 102 and irradiate the plate material W to cut the plate material W. .

  When cutting the plate material W, an assist gas for removing the melt is injected onto the plate material W. In FIG. 5, the illustration of the configuration for injecting the assist gas is omitted.

  A material analyzer 151 and a plate thickness measuring device 152 are attached to the collimator unit 107. As shown in FIG. 6, the material analyzer 151 and the plate thickness measuring device 152 are configured such that the respective detection units 1510 and 1520 are separated from the main body and descend. When the material analyzer 151 analyzes the material of the plate material W and the plate thickness measuring device 152 measures the plate thickness of the plate material W, the detection units 1510 and 1520 are brought close to or in contact with the plate material W as shown in FIG. Descend.

  The whole of the material analyzer 151 and the plate thickness measuring device 152 may be configured to descend so as to approach or contact the plate material W. The material analyzer 151 and the plate thickness measuring device 152 are not attached to the collimator unit 107 and may be provided at different positions. When the material analyzer 151 and the plate thickness measuring device 152 are attached to the collimator unit 107, the material analyzer 151 and the plate thickness measuring device 152 can be moved in the X-axis direction and the Y-axis direction by the above configuration. Therefore, it is possible to analyze the material at a plurality of locations of the plate material W and measure the plate thickness.

  When the laser processing machine 10 includes the surface state measuring device 153, the film thickness measuring device 154, and the non-contact type thermometer 155, the surface state measuring device 153, the film thickness measuring device 154, and the non-contact type are similarly installed in the collimator unit 107. A thermometer 155 may be attached, or may be provided at another position.

  Since the surface state measuring device 153, the film thickness measuring device 154, and the non-contact type thermometer 155 do not need to contact the plate material W, the surface state measuring device 153, the film thickness measuring device 154, and the non-contact type thermometer 155 are operated. What is necessary is just to be located in the suitable distance with respect to the board | plate material W when making it.

  FIG. 7 shows a schematic configuration when the laser oscillator 101 is a fiber laser oscillator. In FIG. 7, a plurality of laser diodes 1011 each emit laser light having a wavelength λ. The excitation combiner 1012 combines the laser beams emitted from the plurality of laser diodes 1011 with a spatial beam.

  Laser light emitted from the pump combiner 1012 is incident on a Yb-doped fiber 1014 between two fiber Bragg gratings (FBGs) 1013 and 1015. The Yb-doped fiber 1014 is a fiber in which a rare earth Yb (ytterbium) element is added to the core.

  The laser light incident on the Yb-doped fiber 1014 repeatedly reciprocates between the FBGs 1013 and 1015, and laser light having a wavelength λ ′ (1 μm band) of approximately 1060 nm to 1080 nm different from the wavelength λ is emitted from the FBG 1015. Laser light emitted from the FBG 1015 is incident on the process fiber 102 via the feeding fiber 1016 and the beam coupler 1017. The beam coupler 1017 has lenses 10148 and 1019.

  The operation of the machine tool of this embodiment will be described again using the flowchart shown in FIG. The machine tool may be any of the laser processing machine 10, the bending machine 20, and the laser welding machine 30.

  In FIG. 8, the NC device 12 reads out the processing conditions corresponding to the material and the plate thickness selected by the operator in step S1. In step S2, the NC device 12 (match / mismatch determination unit 122) determines whether the material and plate thickness of the material to be processed correspond to the selected material and plate thickness. Taking the plate thickness as an example, the plate thickness of the material to be processed corresponds to the selected plate thickness means that they are close to each other within an allowable variation range.

  If it corresponds (YES), NC device 12 (machining condition correction part 123) will correct processing conditions in Step S3, and will shift processing to Step S4. If not compatible (NO), the NC device 12 (match / mismatch determination unit 122) displays warning information on the operation / display unit 13 and ends the processing.

  In step S4, the NC device 12 (machining control unit 124) determines whether or not a machining instruction has been given by inputting a machining command signal. If the machining instruction is not given (NO), the NC device 12 (machining control unit 124) repeats the process of step S4. If the machining instruction is given (YES), the process proceeds to step S5.

  In step S5, the NC device 12 (processing control unit 124) starts processing the material according to the processing program and the corrected processing conditions. In step S6, the NC device 12 (processing control unit 124) determines whether or not processing of the material is finished. The NC device 12 (processing control unit 124) repeats the process of step S6 if the processing of the material is not completed (NO), and ends the processing of the processing if the processing of the material is completed (YES).

  Here, the processing by the NC device 12 of the laser processing machine 10 has been described as an example, but the processing by the NC device 22 of the bending machine 20 and the NC device 32 of the laser welding machine 30 is the same.

  By the way, when the plate thickness measuring device 152 measures the plate thickness at a plurality of locations of the plate material W, the plate thickness may differ depending on the position of the plate material W. In general, the plate thickness is thick at the central portion of the plate material W and thin at the peripheral portion. As described above, when the plate thickness varies depending on the position of the plate material W, when the machining condition correction unit 123 corrects the processing condition in step S3, the degree of correction of the processing condition may vary depending on the position of the plate material W. preferable. The processing condition correction unit 123 may change the degree of correction of the processing conditions according to the representative value of the thickness of each region when the plate material W is divided into a plurality of regions.

  In FIG. 1, a mill sheet (material certificate) may be printed by the printer 50 based on the material information supplied to the server 40 and attached to the processed product. The machining conditions manually corrected by the operator may be uploaded to the server 70 managed by the machine tool manufacturer. In this way, the machine tool manufacturer improves the correction accuracy in which the uploaded data is automatically corrected by the processing condition correction unit 123 of the NC device 12 and the processing condition correction unit of the NC device 22 or 32. Available for.

  The present invention is not limited to the embodiment described above, and various modifications can be made without departing from the scope of the present invention. 1 and 5, the laser processing machine 10 includes the material analyzer 151 and the plate thickness measuring device 152. However, the material analyzing device 151 and the plate thickness measuring device 152 may be provided in a material exchange device (shuttle or shelf). Good. Similarly, the surface state measuring device 153 and the film thickness measuring device 154 may be provided in the material exchange device. The non-contact type thermometer 155 is preferably provided in a machine tool because it preferably measures the temperature immediately before the material is processed.

10 Laser processing machine (machine tool)
11 Laser processing machine body 12, 22, 32 NC device 13, 23, 33 Operation / display unit (operation unit, display unit)
20 Bending machine (machine tool)
21 Bending machine body 30 Laser welding machine (machine tool)
DESCRIPTION OF SYMBOLS 31 Laser welding machine main body 121 Processing condition table holding | maintenance part 122 Matching / non-matching determination part 123 Processing condition correction part 124 Processing control part 125 Processing program holding part 151 Material analyzer 152 Plate thickness measuring device 153 Surface state measuring device 154 Film thickness measuring device 155 Non-contact thermometer

Claims (13)

A processing condition table holding unit for holding a processing condition table indicating processing conditions corresponding to a plurality of sets of material and plate thickness of the material processed by the processing machine body;
An operation unit for selecting a set of material and plate thickness of a material to be processed to be processed by the processing machine body from the processing condition table;
The material data obtained by analyzing the material of the material to be processed and the plate thickness data obtained by measuring the plate thickness of the material to be processed are selected by the operation unit and read from the processing condition table holding unit. A machining condition correction unit for correcting the processed conditions,
Based on the processing conditions corrected by the processing condition correction unit, a processing control unit that controls to process the material to be processed by the processing machine body, and
A machine tool comprising:   The processing condition correction unit, in addition to the material data and the plate thickness data, surface state measurement data obtained by measuring at least one of the color, gloss, and light reflectance of the material to be processed, The machine tool according to claim 1, wherein the machining condition read from the machining condition table holding unit is corrected with reference to at least one of temperature data obtained by measuring the temperature of the material to be machined.   The machine tool according to claim 1, wherein the machine tool is a laser processing machine that cuts the material to be processed with a laser beam.   The processing condition correction unit refers to the film thickness measurement data obtained by measuring the film thickness of the film formed on the surface of the material to be processed in addition to the material data and the plate thickness data. The machine tool according to claim 1, wherein the machining conditions read from the table holding unit are corrected.   The machine tool according to claim 1, wherein the machine tool is a bending machine that bends the material to be processed.   The machine tool according to claim 4, wherein the machine tool is a laser welding machine that welds the material to be processed with a laser beam. The laser beam machine
A material analyzer that analyzes the material of the material to be processed and outputs the material data;
A plate thickness measuring device for measuring the plate thickness of the material to be processed with reference to the material data, and outputting the plate thickness data;
The machine tool according to claim 3, comprising: The machine tool is
A laser processing machine for cutting the material to be processed with a laser beam;
A bending machine for bending the material cut by the laser beam machine;
Including
The laser beam machine
A material analyzer that analyzes the material of the material to be processed and outputs the material data;
A plate thickness measuring device for measuring the plate thickness of the material to be processed with reference to the material data, and outputting the plate thickness data;
With
The processing condition correcting unit provided in the bending machine refers to the material data output from the material analyzer and the plate thickness data output from the plate thickness measuring device, and the processing provided in the bending machine. The machine tool according to claim 1, wherein the machining condition read from the condition table holding unit is corrected. The machine tool is
A laser processing machine for cutting the material to be processed with a laser beam;
A laser welding machine for welding the material cut by the laser processing machine;
Including
The laser beam machine
A material analyzer that analyzes the material of the material to be processed and outputs the material data;
A thickness measuring device for measuring the thickness of the material to be processed with reference to the material data and outputting the thickness data;
A film thickness measuring instrument that measures the film thickness of the film formed on the surface of the material to be processed and outputs film thickness measurement data; and
With
The processing condition correction unit provided in the laser welding machine includes the material data output from the material analyzer, the plate thickness data output from the plate thickness measuring device, and the film thickness measurement output from the film thickness measuring device. 2. The machine tool according to claim 1, wherein the machining condition read from the machining condition table holding unit included in the laser welding machine is corrected with reference to data. The machine tool is
A laser processing machine for cutting the material to be processed with a laser beam;
A bending machine for bending the material cut by the laser beam machine;
A laser welding machine for welding the material bent by the bending machine;
Including
The laser beam machine
A material analyzer that analyzes the material of the material to be processed and outputs the material data;
A plate thickness measuring device for measuring the plate thickness of the material to be processed with reference to the material data, and outputting the plate thickness data;
A film thickness measuring instrument that measures the film thickness of the film formed on the surface of the material to be processed and outputs film thickness measurement data; and
With
The processing condition correcting unit provided in the bending machine refers to the material data output from the material analyzer and the plate thickness data output from the plate thickness measuring device, and the processing provided in the bending machine. Modify the machining conditions read from the condition table holding unit,
The processing condition correction unit provided in the laser welding machine includes the material data output from the material analyzer, the plate thickness data output from the plate thickness measuring device, and the film thickness measurement output from the film thickness measuring device. 2. The machine tool according to claim 1, wherein the machining condition read from the machining condition table holding unit included in the laser welding machine is corrected with reference to data.   Match / mismatch determination for displaying warning information on the display unit when the set of material and plate thickness selected by the operation unit is different from the set of material and plate thickness indicated by the material data and the plate thickness data The machine tool according to claim 1, further comprising a section. A material analyzer for analyzing the material of the material to be processed;
A thickness measuring device for measuring the thickness of the material to be processed;
A processing condition table holding unit for holding a processing condition table indicating processing conditions corresponding to a plurality of sets of material and plate thickness of the material processed by the processing machine body;
An operation unit for selecting a set of material and plate thickness of a material to be processed to be processed by the processing machine body from the processing condition table;
The set of the material and the plate thickness selected by the operation unit includes the material of the material to be processed analyzed by the material analyzer and the plate thickness of the material to be processed measured by the plate thickness measuring instrument. A match / mismatch determination unit that determines whether or not the set matches,
A machine tool comprising:   The machine tool according to claim 12, wherein the machine tool is a laser processing machine that cuts the material to be processed with a laser beam.

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