JP2017208160A - LED lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting device capable of brightly illuminating a wall surface.SOLUTION: An LED lighting device 1 has: a first light source substrate 15 including a plurality of LED elements 15b as a main light source to irradiate light; a second light source substrate 20 including a plurality of LED elements 20a as a sub light source to irradiate light; and a heat radiating plate 14 for dissipating heat of the first light source substrate 15 and the second light source substrate 20. In the heat sink 14, the first light source substrate 15 is arranged on the lower surface side of the heat sink so as to irradiate light downwardly. The second light source substrate 20 and a light guiding cover 21 above the second light source substrate 20 are arranged on the upper surface side of the heat sink so as to irradiate the light upwardly.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an LED lighting device including an LED (Light Emitting Diode) element as a light source.

  2. Description of the Related Art Conventionally, lighting fixtures that have a light source different from the main light source on the ceiling side and have a function as indirect lighting are known.

  Indirect lighting requires a device to irradiate the wall surface with light emitted from the light source on the ceiling side. For example, Patent Document 1 discloses that indirect illumination is realized by inclining a light source substrate on the ceiling side toward the wall surface side, thereby enhancing the performance.

Japanese Patent No. 5366309

  In the conventional lighting apparatus described in Patent Document 1, the light source substrate on the ceiling side is inclined with respect to the ceiling in order to spread light from the ceiling surface toward the wall surface. The light source substrate cannot be brought into close contact with a sheet metal part having good heat dissipation. For this reason, there is a fear that heat dissipation is poor, a large number of LEDs cannot be mounted, a large current cannot flow, and the amount of light cannot be increased.

  This invention solves the above-mentioned subject and provides the LED lighting fixture which can illuminate a wall surface brightly.

  The present invention includes a first light source substrate that includes a plurality of LED elements as a main light source and irradiates light, a second light source substrate that includes a plurality of LED elements as a sub light source and irradiates light, and the first light source substrate. A LED lighting device comprising: a light source board and a heat radiating plate that radiates heat from the second light source board; and a light guide cover that guides light emitted from the second light source board to an outer peripheral side, The heat radiating plate has the first light source substrate disposed on the lower surface side of the heat radiating plate so as to emit light downward, and the upper surface side of the heat radiating plate is irradiated with light upward. A second light source substrate is disposed, and the light guide cover is disposed on the second light source substrate.

  The present invention can provide an LED lighting apparatus that can brightly illuminate a wall surface while suppressing the number of LED elements and power consumption.

It is a figure which shows the LED illuminating device which concerns on embodiment of this invention, and is an external appearance perspective view which shows a state when it sees from diagonally downward. It is an external appearance perspective view which shows a state when seeing a LED lighting apparatus from diagonally upward. It is a disassembled perspective view which shows a state when seeing a LED lighting apparatus from diagonally downward. It is a center longitudinal cross-sectional view of an LED lighting apparatus. It is a perspective view which shows the LED illuminating device which removed the shade and cut off a part of LED cover. It is a perspective view which shows a state when the LED illuminating device which sectioned a part of light guide cover is seen from diagonally upward direction. It is a bottom view which shows an example of an LED light source board | substrate. It is a perspective view which shows a state when the LED lighting apparatus which removed the light guide cover and the sensor unit was seen from diagonally upward direction. It is a figure which shows the wiring state of an electric wire, and is a principal part expansion schematic sectional drawing of the LED lighting apparatus which removed the light guide cover. It is the A section enlarged view of FIG. It is a figure which shows the modification of an indirect light source board | substrate, and is a perspective view which shows the LED lighting apparatus which removed the light guide cover.

  Next, an LED lighting device (LED ceiling light) according to an embodiment of the present invention will be described in detail with reference to the drawings as appropriate. In the present embodiment, an example of the LED lighting device 1 will be described by taking a circular shape as an example in plan view. However, the shape is not limited to this, and for example, a rectangle, a hexagon, an octagon It can also be applied to polygonal shapes such as. In the present embodiment, the LED illumination device 1 using LEDs as the main illumination light source will be described below, but the main illumination light source is not limited to the LEDs.

  The LED lighting device 1 shown in FIGS. 1 and 2 is, for example, via an attachment adapter (not shown) that engages with an indoor wiring device (not shown) such as a hanging rosette or a hanging ceiling provided on the ceiling surface of a house. Thus, it is connected to an external power source and fixed to a predetermined position on the ceiling surface for use. The LED lighting device 1 is made of, for example, a round shape or a square shape (in this embodiment, a round shape). In the following description, the upper side of the paper is the ceiling side (upper surface side) and the lower side of the paper is the floor side (lower surface side) with reference to the state where the LED lighting device 1 is attached to the ceiling surface.

  As shown in FIG. 3, the LED lighting device 1 includes a backbone 11, an adapter receiving portion 12 (insulating plate), a power supply substrate 13, a heat radiating plate 14, an LED light source substrate 15 (first light source substrate), an LED cover 16, and a center cover. 17, a ring member 18, a shade 19, an indirect light source substrate 20 (second light source substrate), a light guide cover 21 (upper cover), a sensor unit 22, and the like.

  The backbone 11 is a base member obtained by processing and forming a steel plate (for example, SECC (electrogalvanized steel plate)) into a substantially circular shape, and is formed in a substantially concave shape (dish shape) so that the concave surface faces the floor side. In addition, an adapter mounting hole 11a in which a mounting adapter (not shown) is locked is formed in the center of the backbone 11.

  The adapter receiving portion 12 is formed of a constituent resin having flame retardancy and electrical insulation (for example, PP: polypropylene resin) and is fixed to the lower surface of the backbone 11 with a ring shape fixing portion 12a, and the fixing portion. And a cylindrical portion 12b extending from the inner peripheral edge of 12a to the floor side (downward).

  As shown in FIG. 3, the power supply board 13 includes a lighting circuit board including a control unit and is screwed to the backbone 11 via an adapter receiving part 12 (insulating plate). Thereby, the power supply board 13 is arrange | positioned in the heat dissipation space enclosed by the backbone 11 and the heat sink 14 mentioned later in the state which maintained electrical insulation.

  The power supply board 13 is electrically connected to an attachment adapter (not shown) via an electric wire 24 connected to a power supply connector 13b fixed to the lower surface of the power supply board 13.

  The power connector 13 a is used to connect the power substrate 13, the LED light source substrate 15, and the indirect light source substrate 20 with electric wires 23.

  Thus, the LED lighting device 1 is configured to be fed with power through the indoor wiring device (not shown), the mounting adapter (not shown), the electric wires 23 and 24, and the power supply board 13.

  The heat radiating plate 14 is a metal member that plays the role of radiating and cooling the heat of the power source board 13 that generates heat during operation, the control board, the LED light source board 15 on which a plurality of LEDs are mounted, and the indirect light source board 20. . The LEDs of the LED element group 15b to be described later are susceptible to heat. In addition, when LED is used, it emits high-intensity light by flowing a large current at a low voltage, so the LED itself and surrounding members deteriorate due to the heat generated by this light emission. Appropriate heat dissipation is required to achieve reliability.

  The heat radiating plate 14 is formed by processing a steel plate into a substantially circular shape, and has a truncated cone-shaped substrate support portion 14a that protrudes toward the floor. Moreover, the heat sink 14 is comprised using metal with favorable heat conductivity, such as a galvanized steel plate, for example, and is shape | molded integrally by performing a squeezing process, and the strength improvement is achieved. Further, the heat radiating plate 14 is formed to have a larger diameter than the backbone 11 and is attached to the backbone 11 so as to protrude radially outward from the backbone 11. The heat radiating plate 14 has an LED light source substrate 15 (the light source substrate of title 1) arranged on the lower surface side of the heat radiating plate 14 so that a plurality of LED elements (LED element group 15b) of the main light source emit light downward, An indirect light source substrate 20 (second light source substrate) is disposed on the upper surface side of the heat radiating plate 14 so that a plurality of LED elements 20a of a sub-light source, which will be described later, emit light upward. Supplementally, the LED light source substrate 15 is disposed on the lower surface side of the heat radiating plate 14 along the lower surface. Further, the indirect light source substrate 20 is disposed on the upper surface side of the heat radiating plate 14 (upper surface of an annular portion 14c described later) along the upper surface. For this reason, since the LED light source substrate 15 and the indirect light source substrate 20 (second light source substrate) are arranged in close contact with the heat radiating plate 14, heat dissipation can be ensured, and a large number of LEDs can be mounted. A large current can be passed, and a large amount of light can be realized.

  A circular through hole 14b is formed in the radial center of the heat sink 14 at a position corresponding to the cylindrical portion 12b of the adapter receiving portion 12. Moreover, the outer peripheral part of the heat sink 14 has the circular annular part 14c formed horizontally, and the cover attaching part 14e formed in the outer peripheral part of the annular part 14c. 14 d (refer FIG. 3) for hooking the shade 19 mentioned later is attached to the lower surface of the annular part 14c at three places at intervals of 120 °.

  As shown in FIG. 3, an indirect light source substrate 20 screwed to the upper side of the annular portion 14 c and a light guide cover 21 are disposed on the indirect light source substrate 20 on the upper surface side of the annular portion 14 c. Has been.

  As shown in FIG. 10, the cover attachment portion 14 e is a portion to which the light guide cover 21 is attached, and is formed to expand in a substantially tapered shape on the outer peripheral portion of the heat radiating plate 14. An indirect light source substrate 20 is mounted in a ring shape on the annular portion 14c (the outer peripheral portion of the heat radiating plate 14) at the top of the cover mounting portion 14e, and a large number of LED elements 20a serving as sub-light sources are arranged.

  As shown in FIGS. 5 and 9, the wire insertion hole 14 f is a through-hole drilled in the outer peripheral wall of the housing recess 14 h formed in a recessed shape inclined so as to expand toward the upper side. A plurality of electric wires 23 are wired in the electric wire insertion hole 14f.

  The electric wire insertion hole 14g is a through-hole drilled in the annular portion 14c, and the electric wire 23 drawn from the electric wire insertion hole 14f is wired.

  The storage recess 14h is a storage space in which the power supply board 13 to which the electric wire 23 is connected is provided.

  The LED light source substrate 15 (first light source substrate) includes a ring-shaped wiring substrate 15a disposed on the lower surface side of the backbone 11 with a heat sink 14 interposed therebetween, and one surface side (floor surface side) of the wiring substrate 15a. A main light source LED element group 15b on which a plurality of concentrically arranged LEDs are mounted by soldering or the like. Details of the LED element group 15b will be described later.

  For example, the wiring board 15a is formed by forming an insulating layer and a copper foil pattern on a substantially annular metal plate made of an aluminum alloy, or a flat plate made of a resin having good thermal conductivity (for example, a polyimide resin). It is comprised by forming a copper foil pattern, a solder resist, etc. on the top. The wiring board 15a is screwed to the heat sink 14.

  In the present embodiment, the power supply board 13 and the LED light source board are provided by increasing the volume of the heat radiating space (increasing the amount of air in the heat radiating space) by including the backbone 11 and the heat radiating plate 14 configured as described above. The heat dissipation efficiency of 15 is improved. As a result, the luminous efficiency of the LED element group 15b can be increased.

  The LED light source substrate 15 shown in FIGS. 3 and 7 shows an example of an 18-mat LED array pattern. As shown in FIG. 7, the LED element group 15b includes a plurality of daylight white LEDs 15b1 that emit daylight color (D color), a plurality of light bulb color LEDs 15b2 that emit light bulb color (L color), and blue light. The main illumination light source includes a plurality of blue LEDs 15b3 that emit light and LEDs 15b4 for security and the like. Further, at the outer peripheral end of the LED light source substrate 15, a substantially arc-shaped protruding piece 15c formed to protrude outward, and an electric wire insertion hole 15d (see FIG. 3) formed at the base end portion of the protruding piece 15c. , The protruding piece 15c, and three connector portions 15e (see FIG. 5) that are mounted and connected to the electric wire 23.

  The daylight color LED 15b1 has a peak wavelength of 430 nm to 460 nm, and is formed in a plurality of rows (for example, 9 rows) concentrically from the outer peripheral side to the inner peripheral side.

  The light bulb color LED 15b2 has a peak wavelength of 550 nm to 650 nm, and is arranged in a plurality of concentrically arranged rows with the daylight color LED 15b1 interposed therebetween. In other words, the light bulb color LEDs 15b2 are arranged in the circumferential direction with two daylight color LEDs 15b1 sandwiched therebetween in each concentric row. The light bulb color LEDs 15b2 in the second row from the inner peripheral side are arranged with one or two daylight color LEDs 15b1 interposed therebetween. The daylight color LED 15b1 and the light bulb color 15b2 are arranged at equal intervals or substantially equal intervals in the circumferential direction in each concentric row.

  The blue LED 15b3 has a peak wavelength of 470 nm to 480 nm, and is circular with a space in the circumferential direction between the daylight color LED 15b1 arranged in a plurality of concentric circles and the outermost and innermost circumferences of the light bulb color LED 15b2. It is arranged in a ring. In the embodiment of FIG. 7, the row in which the daylight color LED 15b1 and the light bulb color LED 15b2 are arranged is arranged in five rows concentrically on the inner peripheral side of the blue LED 15b3 arranged in an annular shape and four concentrically on the outer peripheral side. It is a column arrangement.

  The LED element group 15b shown in FIG. 7 includes, for example, 275 condensing color LEDs 15b1, 142 light bulb color LEDs 15b2, and 41 blue LEDs 15b3. The number of blue LEDs 15b3 is preferably about 10% of the total number of daylight color LEDs 15b1 and light bulb color LEDs 15b2.

  The radiator plate 14 and the LED light source substrate 15 are subjected to reflection coating with a white paint that reflects light from the LED element group 15b to the floor side.

  The LED cover 16 has a function of guiding light beams emitted from the plurality of LED element groups 15b to the surface side (floor side), a function of pressing the LED light source substrate 15 so as to be in close contact with the heat radiating plate 14, and a main illumination. It has a function of covering the entire lower surface side of the LED element group 15b that is a light source for use.

  The LED cover 16 is integrally molded by injection molding or the like using a resin having translucency and electrical insulation, such as polystyrene (PS), polycarbonate (PC), and acrylic (PMMA). In particular, it is preferable to use polystyrene in terms of transparency, cost, and moldability. The material used for the LED cover 16 is not limited to resin as long as it has translucency and electrical insulation, and may be glass or the like.

  As shown in FIG. 5, the LED cover 16 includes a substantially circular LED cover portion 16a that covers the entire light emitting surface (the surface on which the LED element group 15b is mounted) of the LED light source substrate 15, and an outside of the LED cover portion 16a. Accommodates a cylindrical wall portion 16b extending from the peripheral portion toward the back side (ceiling side), a flange portion 16c projecting radially outward from the upper end (back side) of the wall portion 16b, and the LED light source substrate 15. And a substrate storage portion 16d.

  In the LED cover 16, the LED cover portion 16 a is screwed to the substrate support portion 14 a of the heat sink 14, and the collar portion 16 c is screwed to the annular portion 14 c of the heat sink 14.

  The wall portion 16b is formed to extend in a direction substantially perpendicular to the LED cover portion 16a. Further, a notch (not shown) is formed in the wall portion 16b so that heat in the LED cover 16 can be released to the outside. Thereby, it can prevent that a user touches the LED light source board | substrate 15 directly with a hand (finger).

  The collar portion 16 c is a fixing portion that fixes the LED cover 16 to the heat sink 14 on the outer peripheral side of the LED light source substrate 15. The collar portion 16c extends along the circumferential direction and is divided into three portions.

  The substrate housing portion 16d is formed in a state of being inclined and recessed from the collar portion 16c, and the LED light source substrate 15 is horizontally disposed on the inner bottom portion thereof to house the LED element group 15b.

  FIG. 5 is a perspective view showing an example of a state in which the LED cover 16 having a partial cross section is attached to the lower side of the LED light source substrate 15. The LEDs of the LED element group shown in FIG. 7 are configured to emit light to the floor side through a plurality of corresponding dome-shaped portions 16a2 in the LED cover 16 shown in FIG. In this embodiment, one LED group is accommodated in one dome-shaped portion 16a2, but the number of LEDs accommodated in the dome-shaped portion 16a2 is not limited to this. For example, one example is a daylight color LED 15b1 and the other is a light bulb color LED 15b2 among a set of two LEDs arranged in one dome-shaped portion 16a2.

  The center cover 17 is a member that covers a mounting adapter (not shown) exposed at the center of the apparatus main body, and is formed of, for example, a synthetic resin having flame retardancy (for example, PP: polypropylene resin). The center cover 17 is formed in a disc shape and is detachably attached to the LED cover 16.

  The ring member 18 is configured such that the inner peripheral side of the ring portion is held on the outer peripheral side of the shade 19 that is transparent, and the outer peripheral side of the ring protrudes more outward than the outer periphery of the shade 19. The ring member 18 is made of a light transmissive material.

  As shown in FIG. 4 (and as shown in FIG. 3 together), the LED cover portion 16a has a circular through hole 16a1 formed in the central portion in the radial direction. In the LED cover portion 16a, dome-shaped portions 16a2 are formed at positions corresponding to the LED element groups 15b (daylight color LEDs 15b1, light bulb color LEDs 15b2, and blue LEDs 15b3) of the LED light source substrate 15, respectively. The dome-shaped portion 16a2 has a lens function, and is a member that diffuses the luminous flux from the daylight color LED 15a1, the light bulb color LED 15b2, and the blue LED 15b3.

  The shade 19 is a translucent cover made of resin (for example, acrylic, polystyrene, etc.) having translucency (including transparent, translucent, or milky white), and has a dome shape. The shade 19 diffuses the light beam emitted from the light source (LED element group 15b) to reduce glare when the user looks directly at the LED lighting device 1, or in the space where the LED lighting device 1 is installed. It plays the role of equalizing the brightness. The shade 19 is detachably engaged and held by a receiver 14d of the heat radiating plate 14.

  As shown in FIG. 8, the indirect light source substrate 20 (second light source substrate) is disposed on the outer peripheral portion on the upper surface side of the heat radiating plate so as to irradiate light from the entire position of the outer peripheral portion. The indirect light source substrate 20 is configured by arranging and connecting three substantially fan-shaped substrates in a C shape, and LED elements 20a as a plurality of sub-light sources are mounted thereon. The indirect light source substrate 20 includes a board connecting connector 20b provided at an end in the circumferential direction, a board connecting electric wire 20c wired between the connectors 20b, a power supply connecting electric wire 23, and the electric wires. 23, and a power connection connector 20d attached in the vicinity of the wiring notch 20e (in this example, the indirect light source substrate 20 has an arcuate shape 3). Two substrates are connected). The indirect light source substrate 20 is screwed and disposed on the annular portion 14 c on the peripheral portion on the upper surface side of the heat radiating plate 14.

  For this reason, as shown in FIG. 10, the LED element 20 a is arranged so as to irradiate light from the position of the entire peripheral portion on the upper surface side of the heat radiating plate 14. In addition, the LED element 20 a is disposed on the outer peripheral side of the outer peripheral portion of the LED light source substrate 15.

  On the upper side of the indirect light source substrate 20 (second light source substrate), a light guide cover 21 (upper cover) made of an annular translucent resin that covers the indirect light source substrate 20 from above is provided ( (See FIG. 3). The light guide cover 21 includes an incident portion 21a that receives light emitted from the LED element 20a serving as a sub-light source, a light guide portion 21b that guides the incident light, and directs the guided light toward the outer periphery. The light emitting part 21 c that emits light, the legs 21 d and 21 e for holding the indirect light source substrate 20, and the substrate housing part 21 f that covers the upper surface of the indirect light source substrate 20 are provided. The indirect light source substrate 20 is pressed by the legs 21d and 21e of the light guide cover 21 to be brought into contact with the heat radiating plate 14 and heat dissipation can be improved. The light guide cover 21 is fixed to the heat sink 14 by screws or the like.

  As shown in FIG. 10, the light guide portion 21b has an R shape for totally reflecting light, is formed to protrude from the LED element 20a toward the wall surface (lateral direction), and radiates from the LED element 20a. It is formed to irradiate the emitted light toward the outer peripheral direction.

  The light guide portion 21b formed in a substantially circular shape when viewed from the bottom is formed in a shape bent in a concave shape (substantially C-shaped) in order to avoid the location where the sensor unit 22 is disposed. Yes.

  As shown in FIG. 3, the sensor unit 22 changes the power supplied to the LED element group 15 b according to the brightness of the environment (space) in which the LED lighting device 1 is installed, for example. Provides a function to obtain a certain illuminance. Further, the illuminance under the LED lighting device 1 is detected. The sensor unit 22 is attached to the upper part of the C-shaped part of the indirect light source substrate 20.

[Action]
Next, the operation of the LED lighting device 1 according to the embodiment of the present invention will be described with reference to FIGS. 4 and 10 mainly.

  The LED lighting device 1 shown in FIGS. 1 and 2 operates by being supplied with power from a power source and a power circuit (not shown). The power supply circuit has a function of adjusting the power of the power supply to a predetermined voltage or current. Further, the LED lighting device 1 has a function of receiving a signal (for example, infrared light) output from a remote controller by a light receiving unit (not shown) and transmitting the received signal to a control unit (not shown).

  The lighting circuit (not shown) has a function of driving the daylight color LED 15b1, the light bulb color LED 15b2, and the blue LED 15b3 based on the control signal received from the control unit. The lighting circuit (not shown) has a function of changing the drive current for driving the daylight color LED 15b1, the light bulb color LED 15b2, and the blue LED 15b3 for each k based on the control signal received from the control unit.

  The remote control (not shown) has a function to output a set signal by operating a button. For example, all lights mode, brightness up mode, blue LED addition mode, brightness up mode + blue LED addition The mode can be set.

  By the way, to make it easier to see the letters of books and newspapers, when you press a predetermined button on the remote control, the brightness of the daylight color LED 15b1 and the light bulb color LED 15b2 increases, the blue LED 15b3 lights up and blue-green light is added, making it brighter, Realize natural light closer to sunlight. Thereby, it becomes easy to see a character, a photograph, etc.

  When the LED element group 15 b of the main light source shown in FIG. 3 is turned on, the light irradiated from the LED element group 15 b irradiates the floor side through the LED cover 16 and the shade 19. The LED element group 15b also emits heat when irradiated with light.

  As shown in FIG. 4, the LED cover 16 is screwed to the heat sink 14 with an LED light source substrate 15 interposed between the heat sink 14 and the LED cover 16. Thereby, the adhesiveness of the LED light source board | substrate 15 with respect to the heat sink 14 becomes high, and can improve heat dissipation. Therefore, it is possible to realize the LED lighting device 1 in which the density of the light emitting surface of the main light source is uniform and the light emission efficiency of the LED element group 15b is excellent. Further, the heat dissipation plate 14 has an effect of correcting the LED arrangement of the LED element group 15 b at an appropriate position with respect to the LED cover 16 and reducing the warpage and deformation of the LED light source substrate 15.

  Further, as shown in FIG. 3, the heat radiating plate 14 has the LED light source substrate 15 (first light source substrate) disposed on the lower surface side of the heat radiating plate 14 so as to irradiate light downward. An indirect light source substrate 20 (second light source substrate) is disposed on the upper surface side so as to irradiate light upward. That is, the indirect light source substrate 20 is composed of a flat substrate that is connected in a C-shape and arranged horizontally.

  As shown in FIGS. 8 and 10, the many LED elements 20 a of the indirect light source substrate 20 are arranged on the outer peripheral portion on the upper surface side of the heat radiating plate 14 so that light is irradiated from the entire position of the outer peripheral portion. ing.

  In addition, a translucent light guide cover 21 that covers the indirect light source substrate 20 from above is provided on the upper surface side of the heat sink 14, and the light guide cover 21 includes a plurality of LED elements on the indirect light source substrate 20. It has a light guide part 21b for irradiating light emitted from 20a in the outer peripheral direction.

  For this reason, the light emitted from the LED element 20a is guided by the light guide portion 21b of the light guide cover 21 and emitted from the emission portion 21c in the outer peripheral direction. Therefore, the outer peripheral direction (wall surface direction) is irradiated, Since only the light emitted from the LED light source substrate 15 (first light source substrate) to the lower surface can illuminate the upper part of the room wall surface where the brightness cannot be compensated, the entire wall surface can be illuminated brightly.

  The LED element 20a of the indirect light source substrate 20 is disposed on the outer peripheral side of the outer peripheral portion of the LED light source substrate 15 (first light source substrate). For this reason, the LED element 20a that generates heat on the indirect light source substrate 20 and the LED element group 15b that is disposed on the LED light source substrate 15 and generates heat can be shifted from the radiator plate 14. It is possible to efficiently dissipate heat and cool. Moreover, since the LED element 20a can be disposed at a position closer to the outer peripheral end in the LED lighting device 1, the outer peripheral direction of the LED lighting device 1 can be illuminated brightly.

  As shown in FIGS. 4 and 10, a light guide cover 21 (upper cover) is attached to the cover attaching portion 14 e on the outer peripheral portion of the heat radiating plate 14. Further, the LED element 20a of the indirect light source substrate 20 (second light source substrate) is arranged on the upper part of the cover attaching portion 14e.

  For this reason, the LED element 20a can illuminate the light emitted from the LED element 20a in the outer circumferential direction and the upper direction without being blocked by other members. The amount can be increased compared to conventional devices, and the walls can be illuminated brightly.

  As described above, the LED lighting device 1 according to the embodiment of the present invention can direct the light of the indirect light source substrate 20 to the outer peripheral side by the light guide cover 21, so that the upper surface of the indoor wall can be illuminated and the brightness of the wall surface is increased. It can be increased.

  In addition, by using a light guide cover as the upper cover, the light extraction rate to the wall surface side is higher than the cover that spreads light by diffusing light with a diffusing material, so that the wall surface is brightly illuminated, LED The number of elements and power consumption can be reduced.

(Modification)
The present invention is not limited to the above-described embodiment, and various modifications and changes can be made within the scope of the technical idea, and the present invention extends to these modifications and changes. Of course. In addition, the same thing as what was demonstrated in the said embodiment attaches | subjects the same code | symbol, and abbreviate | omits the description.

(First modification of light guide cover)
The shape of the light guide 21b is not limited to R because the light is totally reflected, and may be an elliptical shape, a parabolic shape, a C-plane shape, or the like.

(Second modification of light guide cover)
The emission part 21c may have a shape (R shape, embossing, etc.) that diffuses the guided light.

  In this case, since the light emitted from the emission part 21c can be diffused, the luminance unevenness of the wall surface due to the high-intensity light beam can be reduced.

(Modification of indirect light source substrate)
FIG. 11 is a view showing a modification of the indirect light source substrate 20A, and is a perspective view showing the LED lighting device with the indirect light cover removed.

In the embodiment, as an example of the indirect light source substrate 20 (see FIG. 8), the case where the circuit substrate divided into three is connected in a C shape in plan view is not limited to this. .

As shown in FIG. 11, the indirect light source substrate 20 </ b> A may be a circuit board formed in one C shape.

  The indirect light source substrate 20A may be a single circuit board formed in a ring shape.

(Other variations)
Although the optical axis of the LED of the indirect light source substrate 20 faces the ceiling, it may have an optical axis inclined in the outer peripheral direction.

Further, in the present embodiment, in order to avoid wasting the substrate material at the time of substrate creation, that is, for the convenience of cutting the substrate, three arc-shaped substrates are created and connected to form a C-shaped indirect light. Although the light source substrate 20 is used, the indirect light source substrate 20 may be formed of a single substrate. In this case, there is an advantage that the board connection connector 20b and the like are not necessary.

DESCRIPTION OF SYMBOLS 1 LED illuminating device 11 Backbone 14 Heat sink 14e Cover attaching part 15 LED light source board (1st light source board)
15b LED element group (LED element)
16 LED cover 20 Indirect light source substrate (second light source substrate)
20a LED element 21 Light guide cover (upper cover)
21a Incident part 21b Light guide part 21c Output part

Claims (4)

  The present invention includes a first light source substrate that includes a plurality of LED elements as a main light source and irradiates light, a second light source substrate that includes a plurality of LED elements as a sub light source and irradiates light, and the first light source substrate. A LED lighting device comprising: a light source board and a heat radiating plate that radiates heat from the second light source board; and a light guide cover that guides light emitted from the second light source board to an outer peripheral side, The heat radiating plate has the first light source substrate disposed on the lower surface side of the heat radiating plate so as to emit light downward, and the upper surface side of the heat radiating plate is irradiated with light upward. A second light source substrate is disposed, and the light guide cover is disposed so as to cover the second light source substrate.   The plurality of LED elements of the second light source substrate are arranged on the outer peripheral portion on the upper surface side of the heat radiating plate so as to emit light from the entire position of the outer peripheral portion. The LED lighting device according to 1.   2. The LED lighting device according to claim 1, wherein the plurality of LED elements of the second light source substrate are arranged on an outer peripheral side with respect to an outer peripheral portion of the first light source substrate. The outer peripheral portion of the heat radiating plate has a cover attaching portion to which the upper cover is attached, and the plurality of LED elements of the second light source substrate are disposed on the cover attaching portion. The LED lighting device according to claim 1.

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