JP2017191941A - Surface-mount inductor and manufacturing method thereof - Google Patents
Surface-mount inductor and manufacturing method thereof Download PDFInfo
- Publication number
- JP2017191941A JP2017191941A JP2017086340A JP2017086340A JP2017191941A JP 2017191941 A JP2017191941 A JP 2017191941A JP 2017086340 A JP2017086340 A JP 2017086340A JP 2017086340 A JP2017086340 A JP 2017086340A JP 2017191941 A JP2017191941 A JP 2017191941A
- Authority
- JP
- Japan
- Prior art keywords
- molded body
- coil
- resin
- magnetic powder
- metal magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
本発明は、導線を巻回して形成したコイルと、主に金属磁性体粉末と樹脂を含有する封止材でコイルを封止した成形体とを備えた表面実装インダクタ及びその製造方法に関する。 The present invention relates to a surface-mount inductor including a coil formed by winding a conductive wire, and a molded body in which the coil is sealed with a sealing material mainly containing metal magnetic powder and resin, and a method for manufacturing the same.
従来の表面実装インダクタに、図５に示す様に、導線を巻回してコイル２１を形成し、このコイル２１を磁性粉末と樹脂を含む封止材で形成された成形体２２内に埋設し、コイル２１を成形体２２の表面に形成された外部端子２４に接続したものがある（例えば、特許文献１を参照。）。この表面実装インダクタは、導線を巻回して形成したコイル２１をタブレットに載置し、コイル２１の引き出し端部２１ｂをタブレットの柱状凸部の外側側面に沿わせて成型金型の内壁面との間に挟まれるようにコイルとタブレットを成型金型内に配置し、この金型を用い、樹脂成形法もしくは圧粉成形法によりコイル２１を内蔵する成形体２２が形成され、この成形体に導電性ペーストをディップにより塗布して外部端子２４が形成される。 As shown in FIG. 5, a coil 21 is formed by winding a conducting wire on a conventional surface mount inductor, and the coil 21 is embedded in a molded body 22 formed of a sealing material containing magnetic powder and resin. There exists what connected the coil 21 to the external terminal 24 formed in the surface of the molded object 22 (for example, refer patent document 1). In this surface mount inductor, a coil 21 formed by winding a conductive wire is placed on a tablet, and a lead-out end portion 21b of the coil 21 is placed along an outer side surface of a columnar convex portion of the tablet with an inner wall surface of a molding die. A coil and a tablet are placed in a molding die so as to be sandwiched between them, and a molding 22 containing the coil 21 is formed by a resin molding method or a powder molding method using this die, and the molding is electrically conductive. The external terminals 24 are formed by applying a functional paste by dipping.
近年、電子機器の更なる小型化に伴い、このような構造の面実装インダクタでは上面に形成された外部電極がシールド板と接触してショートする可能性が生じる。そのため電極の構造をＬ字状にした面実装インダクタへの要求が高まってきた。
この様な状況の中、従来の表面実装インダクタにおいて、外部端子の構造をＬ字状にしようとした場合、成形体に導電性ペーストをディップにより塗布しているために外部端子をＬ字状に形成することが難しかった。また、従来の表面実装インダクタは、導電ペースト槽にためられた導電性ペーストに成形体を浸す形になるため、成形体の外部端子を形成する部分が浸る程度の導電性ペーストが必要となる上、品質管理上廃棄しなければならない量を含めると無駄になる導電性ペーストが多く、製造コストが上昇する原因ともなっていた。
この様な問題点を解決するために、特開２００９−１７０４８８号公報に示す様に、外部端子を板状の金属フレームで形成することが行われたが、金属フレームの厚み分、全体の形状が大きくなったり、コイルや成形体の大きさが小さくなって十分な特性が得られなくなったりする上、外部端子を形成するための工数が増加するという問題があった。
また、別の解決手法として、外部端子をスパッタにより形成することが考えられるが、高価な装置が必要となるという問題があった。
In recent years, with the further miniaturization of electronic devices, there is a possibility that the external electrode formed on the upper surface of the surface mount inductor having such a structure may come into contact with the shield plate and short-circuit. For this reason, there has been an increasing demand for a surface mount inductor having an L-shaped electrode structure.
Under such circumstances, in the conventional surface mount inductor, when trying to make the structure of the external terminal L-shaped, the conductive paste is applied to the molded body by dipping, so that the external terminal is L-shaped. It was difficult to form. In addition, since the conventional surface-mount inductor has a shape in which the molded body is immersed in the conductive paste stored in the conductive paste tank, the conductive paste is required to immerse the portion forming the external terminal of the molded body. In addition, if the amount that must be discarded for quality control is included, a large amount of conductive paste is wasted, which increases the manufacturing cost.
In order to solve such a problem, as shown in Japanese Patent Application Laid-Open No. 2009-170488, the external terminals are formed with a plate-shaped metal frame. In addition, the size of the coil and the molded body is reduced and sufficient characteristics cannot be obtained, and the number of steps for forming the external terminal increases.
Another possible solution is to form the external terminals by sputtering, but there is a problem that an expensive device is required.
本発明は、高価な装置を用いることなく、外部端子を容易に形成することができ、低背化、特性の向上が可能な表面実装インダクタ及びその製造方法を提供することを目的とする。 SUMMARY OF THE INVENTION An object of the present invention is to provide a surface mount inductor that can easily form an external terminal without using an expensive device, can be reduced in profile, and can be improved in characteristics, and a method for manufacturing the same.
本発明は、導線を巻回して形成したコイルと、主に金属磁性体粉末と樹脂を含有する封止材でコイルを封止した成形体を備えた表面実装インダクタにおいて、コイルは引き出し端部の表面が成形体の表面に露出する様に埋設され、成形体の表面の外部端子が形成される部分の樹脂が除去され、金属磁性体粉と外部端子を構成するメッキ層が接合され、外部端子とコイルの引き出し端が接続される。
また、本発明は、導線を巻回して形成したコイルと、主に金属磁性体粉末と樹脂を含有する封止材でコイルを封止した成形体を備えた表面実装インダクタにおいて、コイルは成形体内に埋設されて引き出し端部が成形体から引き出され、成形体の表面の外部端子が形成される部分の樹脂が除去され、金属磁性体粉と外部端子を構成するメッキ層が接合され、外部端子とコイルの引き出し端が接続される。
さらに、本発明は、導線を巻回して形成したコイルと、主に金属磁性体粉末と樹脂を含有する封止材でコイルを封止した成形体を備えた表面実装インダクタの製造方法において、導線を巻回して形成したコイルを成形体内に埋設する工程と、成形体の表面の外部端子が形成される部分の樹脂を除去し、成形体にメッキ処理を施して樹脂が除去された部分において金属磁性体粉と接合するメッキ層を形成してコイルの引き出し端と接続される外部端子が形成される工程を備える。
The present invention relates to a surface-mount inductor including a coil formed by winding a conductive wire and a molded body in which the coil is sealed with a sealing material mainly containing metal magnetic powder and resin. The surface is buried so as to be exposed on the surface of the molded body, the resin on the surface of the molded body where the external terminals are formed is removed, the metal magnetic powder and the plating layer constituting the external terminals are joined, and the external terminals And the lead-out end of the coil are connected.
The present invention also relates to a surface mount inductor including a coil formed by winding a conductive wire and a molded body in which the coil is sealed with a sealing material mainly containing metal magnetic powder and resin. The lead end is drawn out from the molded body, the resin on the surface of the molded body where the external terminals are formed is removed, the metal magnetic powder and the plating layer constituting the external terminal are joined, and the external terminal And the lead-out end of the coil are connected.
Furthermore, the present invention relates to a method of manufacturing a surface mount inductor comprising a coil formed by winding a conductive wire and a molded body in which the coil is sealed with a sealing material mainly containing metal magnetic powder and resin. A step of embedding the coil formed by winding the metal in the molded body, removing the resin on the surface of the molded body where the external terminals are formed, and plating the molded body to remove the resin from the metal A step of forming a plating layer to be bonded to the magnetic powder and forming an external terminal connected to the lead-out end of the coil is provided.
本発明の表面実装インダクタは、導線を巻回して形成したコイルと、主に金属磁性体粉末と樹脂を含有する封止材でコイルを封止した成形体を備え、コイルは引き出し端部の表面が成形体の表面に露出する様に埋設され、成形体の表面の外部端子が形成される部分の樹脂が除去され、金属磁性体粉と外部端子を構成するメッキ層が接合され、外部端子とコイルの引き出し端が接続されるので、高価な装置を用いることなく、外部端子を容易に形成することができ、低背化、特性の向上が可能となる。
また、本発明の表面実装インダクタは、導線を巻回して形成したコイルと、主に金属磁性体粉末と樹脂を含有する封止材でコイルを封止した成形体を備え、コイルは成形体内に埋設されて引き出し端部が成形体から引き出され、外部端子とコイルの引き出し端が接続されるので、高価な装置を用いることなく、外部端子を容易に形成することができ、低背化、特性の向上が可能となる。
さらに、本発明の表面実装インダクタの製造方法は、導線を巻回して形成したコイルと、主に金属磁性体粉末と樹脂を含有する封止材でコイルを封止した成形体を備え、導線を巻回して形成したコイルを成形体内に埋設する工程と、成形体の表面の外部端子が形成される部分の樹脂を除去し、成形体にメッキ処理を施して樹脂が除去された部分において金属磁性体粉と接合するメッキ層を形成してコイルの引き出し端と接続される外部端子が形成される工程を備えるので、高価な装置を用いることなく、外部端子を容易に形成することができ、低背化、特性の向上が可能となる。
The surface-mount inductor of the present invention includes a coil formed by winding a conductive wire, and a molded body in which the coil is sealed with a sealing material mainly containing metal magnetic powder and resin. Embedded in the surface of the molded body to be exposed, the resin on the surface of the molded body where the external terminals are formed is removed, the metal magnetic powder and the plating layer constituting the external terminals are joined, and the external terminals and Since the lead-out end of the coil is connected, the external terminal can be easily formed without using an expensive device, and the height and characteristics can be improved.
The surface-mount inductor of the present invention includes a coil formed by winding a conductive wire and a molded body in which the coil is sealed with a sealing material mainly containing metal magnetic powder and resin, and the coil is in the molded body. Since the lead-out end is buried and pulled out from the molded body, and the external terminal and the lead-out end of the coil are connected, the external terminal can be easily formed without using an expensive device, and has a low profile and characteristics. Can be improved.
Furthermore, the manufacturing method of the surface mount inductor of the present invention includes a coil formed by winding a conductive wire, and a molded body in which the coil is sealed with a sealing material mainly containing a metal magnetic powder and a resin. The process of embedding the coil formed by winding and removing the resin in the part where the external terminals are formed on the surface of the molded body, and applying the plating treatment to the molded body to remove the metal magnetism Since it has a step of forming a plating layer to be bonded to body powder and forming an external terminal connected to the lead-out end of the coil, the external terminal can be easily formed without using an expensive device. It is possible to improve the height and characteristics.
本発明の表面実装インダクタによれば、成形体の表面の外部端子が形成される部分の樹脂が除去されるので、成形体を構成する金属磁性粉末が露出し、その周囲に比較してこの部分にメッキが成長しやすくなる。この時、成形体の表面の樹脂が除去される部分の形状を調整することにより、外部端子の形状を容易に変更することが可能となる。また、外部端子の厚みを２０μｍ以下に薄くすることができ、その分成形体の大きさを大きくしたり、全体の形状を小さくしたりすることができる。外部端子を薄くできた分成形体の大きさを大きくした場合、導線の太さを太くしたり、コイルの大きさを大きくしたりできる。
また、本発明の表面実装インダクタの製造方法によれば、成形体の表面の外部端子が形成される部分の樹脂が除去されるので、成形体を構成する金属磁性粉末が露出し、その周囲に比較してこの部分にメッキが成長しやすくなる。この時、成形体の表面の樹脂が除去される部分の形状を調整することにより、外部端子の形状を容易に変更することが可能となる。また、外部端子の厚みを２０μｍ以下に薄くすることができ、その分成形体の大きさを大きくしたり、全体の形状を小さくしたりすることができる。外部端子を薄くできた分成形体の大きさを大きくした場合、導線の太さを太くしたり、コイルの大きさを大きくしたりできる。
According to the surface mount inductor of the present invention, since the resin of the portion where the external terminal is formed on the surface of the molded body is removed, the metal magnetic powder constituting the molded body is exposed, and this portion is compared with the surrounding area. It is easy to grow plating. At this time, it is possible to easily change the shape of the external terminal by adjusting the shape of the portion from which the resin on the surface of the molded body is removed. In addition, the thickness of the external terminal can be reduced to 20 μm or less, and accordingly, the size of the molded body can be increased or the overall shape can be decreased. When the size of the molded body is increased by reducing the thickness of the external terminal, the thickness of the conductive wire can be increased or the size of the coil can be increased.
Further, according to the method for manufacturing a surface mount inductor of the present invention, since the resin of the portion where the external terminals are formed on the surface of the molded body is removed, the metal magnetic powder constituting the molded body is exposed and around it. Compared to this, the plating easily grows in this portion. At this time, it is possible to easily change the shape of the external terminal by adjusting the shape of the portion from which the resin on the surface of the molded body is removed. In addition, the thickness of the external terminal can be reduced to 20 μm or less, and accordingly, the size of the molded body can be increased or the overall shape can be decreased. When the size of the molded body is increased by reducing the thickness of the external terminal, the thickness of the conductive wire can be increased or the size of the coil can be increased.
以下、本発明の表面実装インダクタ及びその製造方法の実施例を図１乃至図４を参照して説明する。
図１は本発明の面実装インダクタの成形体の斜視図である。
図１において、１１はコイル、１２は成形体である。
コイル１１は、導線をその両端部が外周に位置するように渦巻き状に２段の外外巻きに巻回した巻回部１１ａと、巻回部１１ａから引き出された引き出し端部１１ｂを備えた空芯コイルが形成される。導線は断面が平角状の平角線が用いられる。引き出し端部１１ｂは、導線の両端部が巻回部１１ａから巻回部を挟んで対向する様に引き出される。
成形体１２は、樹脂と磁性材料を含む封止材を用いてコイル１１を内包する様に形成される。封止材としては、磁性材料として例えば鉄系の金属磁性粉末を、樹脂として例えばエポキシ樹脂をそれぞれ用い、これらを混合したものが用いられる。この成形体１２の長さ方向の対向する側面には、コイル１１の引き出し端部１１ｂの表面が露出する。
そして、この成形体１２の長さ方向の対向する側面と底面に外部端子１４が形成され、コイル１１の引き出し端部１１ｂと外部端子１４が接続される。外部端子１４は、ＮｉやＳｎ等の金属材料を用いたメッキ層によりＬ字状に形成される。
Hereinafter, embodiments of the surface mount inductor and the manufacturing method thereof according to the present invention will be described with reference to FIGS.
FIG. 1 is a perspective view of a molded body of a surface mount inductor according to the present invention.
In FIG. 1, 11 is a coil and 12 is a molded body.
The coil 11 includes a winding part 11a in which a conducting wire is wound in a spiral shape so that both ends thereof are positioned on the outer periphery, and a drawing end part 11b drawn from the winding part 11a. An air core coil is formed. The conducting wire is a rectangular wire having a rectangular cross section. The lead-out end portion 11b is pulled out so that both end portions of the conducting wire face each other with the winding portion interposed therebetween from the winding portion 11a.
The molded body 12 is formed so as to enclose the coil 11 using a sealing material including a resin and a magnetic material. As the sealing material, for example, an iron-based metal magnetic powder is used as a magnetic material, and an epoxy resin is used as a resin, and a mixture thereof is used. The surface of the lead-out end portion 11b of the coil 11 is exposed on the opposite side surfaces of the molded body 12 in the length direction.
And the external terminal 14 is formed in the side surface and bottom face which oppose the length direction of this molded object 12, and the drawer | drawing-out edge part 11b of the coil 11 and the external terminal 14 are connected. The external terminal 14 is formed in an L shape by a plating layer using a metal material such as Ni or Sn.
この様な表面実装インダクタは以下の様にして製造される。まず、断面が平角状の絶縁被覆が施された導線をその両端が外周に位置する様に渦巻き状に２段の外外巻きに巻回して巻回部１１ａを形成した後、導線の両端を巻回部の外周から引き出して引き出し端部１１ｂを形成して空芯コイル１１が形成される。本実施例で用いる導線は絶縁被膜としてイミド変成ポリウレタン層を有するものを用いた。絶縁被膜は、ポリアミド系やポリエステル系などでもよく、耐熱温度が高いものの方が好ましい。また、本実施例では断面が平角形状のものを用いるが、丸線や断面が多角形状のものを用いてもよい。
次に、磁性材料として例えば鉄系の金属磁性粉末を、樹脂として例えばエポキシ樹脂をそれぞれ用い、これらを混合して粉末状に造粒した封止材を用いて、圧縮成形法にて、図１に示すような空芯コイル１１が埋設された成形体１２を成形する。このとき、空芯コイル１１の引き出し端部１１ｂは、成形体１２の長さ方向の対向する側面の外部端子が形成される位置にその表面が露出するようにする。本実施例では圧縮成形法で成形体を作成したが、圧粉成形法などの成形方法で成形体を作成してもよい。
続いて、空芯コイル１１の引き出し端部１１ｂの表面の被膜を機械剥離によって除去した後、図２に示す様に、成形体１２の長さ方向の対向する側面と底面の外部端子が形成される部分１３をレーザー照射、ブラスト処理、研磨等を用いてその表面に存在する樹脂成分等を除去する。これにより、成形体１２を構成する金属磁性粉末の表面や切断面が露出する。
さらに、この成形体１２に導電材料でメッキ処理を施して、図３に示す様に成形体１２の長さ方向の対向する側面と底面に金属磁性粉末と接合するメッキ層を形成して外部端子１４が形成される。導電材料としては、例えばＮｉやＳｎを含有するもの、又は、その両方を含有するものが用いられる。外部端子１４は成形体１２の表面に露出していた空芯コイル１１の引き出し端部１１ｂと接続される。
Such a surface mount inductor is manufactured as follows. First, after forming a winding part 11a by winding a conducting wire coated with a rectangular insulating coating in a spiral shape so that both ends thereof are located on the outer periphery, the winding part 11a is formed at both ends of the conducting wire. An air core coil 11 is formed by forming a leading end portion 11b by pulling out from the outer periphery of the winding portion. The conducting wire used in this example used an insulating coating having an imide-modified polyurethane layer. The insulating coating may be polyamide or polyester, and preferably has a high heat resistance temperature. In this embodiment, a rectangular cross section is used, but a round line or a polygonal cross section may be used.
Next, for example, an iron-based metal magnetic powder is used as a magnetic material, and an epoxy resin is used as a resin, and a sealing material obtained by mixing and granulating these powders is used in a compression molding method. The molded body 12 in which the air-core coil 11 as shown in FIG. At this time, the lead end portion 11b of the air-core coil 11 is exposed at the position where the external terminals on the side surfaces facing the length direction of the molded body 12 are formed. In this embodiment, the molded body is created by the compression molding method, but the molded body may be created by a molding method such as a compacting method.
Subsequently, after the coating on the surface of the lead-out end portion 11b of the air-core coil 11 is removed by mechanical peeling, as shown in FIG. 2, the external terminals on the side surface and the bottom surface facing the length direction of the molded body 12 are formed. The resin component existing on the surface of the portion 13 to be removed is removed by laser irradiation, blasting, polishing or the like. Thereby, the surface and cut surface of the metal magnetic powder constituting the compact 12 are exposed.
Further, the molded body 12 is plated with a conductive material, and as shown in FIG. 3, plating layers are formed on the opposite side and bottom surfaces of the molded body 12 to join the metal magnetic powder. 14 is formed. As the conductive material, for example, a material containing Ni or Sn, or a material containing both of them is used. The external terminal 14 is connected to the leading end portion 11 b of the air-core coil 11 exposed on the surface of the molded body 12.
この様に形成された本発明の表面実装インダクタは、成形体が樹脂と金属磁性粉末を含む封止材を用いて形成されるので、図４（Ａ）に示す様に、その表面は樹脂１２ａに覆われ、内部に金属磁性粉末１２ｂが混在した状態となっている。ここで、成形体の外部端子が形成される部分をレーザー照射、ブラスト処理、研磨等を用いてその表面に存在する樹脂成分等を除去することにより、図４（Ｂ）に示す様に、成形体の外部電極を形成する部分に、成形体の表面に金属磁性粉末１２ｂが露出する。この状態で成形体に導電材料でメッキ処理を施すことにより、図４（Ｃ）に示す様に、成形体の外部端子が形成される部分にメッキ層１４が形成される。これは金属磁性粉末１２ｂが金属性を有するために、成形体にメッキ処理を施すことにより、成形体の表面の金属磁性粉末が露出した部分に集中的に通電されてメッキが成長し、成形体の表面の金属磁性粉末を露出させた部分にメッキ層１４が形成されることになる。
従って、本発明の表面実装インダクタは、成形体の表面の樹脂が除去された部分に、金属磁性粉末と接合するメッキ層が形成されて、成形体に空芯コイルの引き出し端部と接続される外部端子が形成される。
In the surface mount inductor of the present invention formed in this way, the molded body is formed using a sealing material containing a resin and a metal magnetic powder, so that the surface thereof is a resin 12a as shown in FIG. The metal magnetic powder 12b is mixed inside. Here, as shown in FIG. 4 (B), by removing the resin component etc. existing on the surface of the molded body where the external terminals are formed using laser irradiation, blasting, polishing, etc. The metal magnetic powder 12b is exposed on the surface of the molded body at the portion of the body where the external electrode is formed. By plating the molded body with a conductive material in this state, a plated layer 14 is formed at a portion where the external terminal of the molded body is formed, as shown in FIG. This is because the metal magnetic powder 12b is metallic, so that the molded body is subjected to a plating treatment, whereby a portion of the surface of the molded body where the metal magnetic powder is exposed is intensively energized and plating grows. The plated layer 14 is formed on the exposed surface of the metal magnetic powder.
Therefore, in the surface mount inductor of the present invention, a plating layer to be bonded to the metal magnetic powder is formed on the part from which the resin on the surface of the molded body is removed, and the molded body is connected to the leading end of the air core coil. External terminals are formed.
以上、本発明の表面実装インダクタ及びその製造方法の実施例を述べたが、本発明はこの実施例に限られるものではない。例えば、実施例では封止材として磁性材料に鉄系金属磁性粉末、樹脂にエポキシ樹脂を用いたが、磁性材料として他の組成の金属磁性粉末、その表面がガラス等の絶縁体で被覆された金属磁性粉末、表面を改質した金属磁性粉末を用いても良い。また、樹脂として、ポリイミド樹脂やフェノール樹脂などの熱硬化性樹脂や、ポリエチレン樹脂やポリアミド樹脂などの熱可塑性樹脂を用いても良い。さらに、外部端子は、成形体にＮｉやＳｎ以外の導電材料でメッキ処理を施して、金属磁性粉末と接合するメッキ層を形成することにより形成しても良い。またさらに、成形体の外部端子が形成される部分の空芯コイルの引き出し端部が露出した位置に、Ａｇ、Ｃｕ等の導体を含有する導電性ペースト等で構成される接合材を空芯コイルの引き出し端部を覆うように塗布した後、成形体にメッキ処理を施しても良い。この場合、この接合材によってコイルの引き出し端と外部端子の固着強度を向上させることができる。
また、実施例ではコイルの引き出し端部の表面が成形体の表面に露出する様にコイルを成形体内に埋設する例を示したが、コイルの引き出し端部が成形体から引き出される様にコイルを成形体内に埋設し、コイルの引き出し端部の表面の被膜を除去すると共に、成形体の外部端子が形成される部分の樹脂成分等を除去し、引き出し端部を外部端子が形成される部分に位置する様に加工し、この状態で成形体にメッキ処理を施して外部端子を形成しても良い。さらに、この場合において、外部端子が形成される部分に位置させたコイルの引き出し端部を覆う様に、Ａｇ、Ｃｕ等の導体を含有する導電性ペースト等で構成される接合材を塗布して、コイルの引き出し端部を成形体に固定した状態で、成形体にメッキ処理を施して外部端子を形成しても良い。
As mentioned above, although the Example of the surface mount inductor of this invention and its manufacturing method was described, this invention is not limited to this Example. For example, in the examples, iron-based metal magnetic powder was used as the sealing material as the sealing material, and epoxy resin was used as the resin, but the metal magnetic powder of another composition was used as the magnetic material, and its surface was coated with an insulator such as glass. Metal magnetic powder or metal magnetic powder with a modified surface may be used. Further, as the resin, a thermosetting resin such as a polyimide resin or a phenol resin, or a thermoplastic resin such as a polyethylene resin or a polyamide resin may be used. Further, the external terminal may be formed by plating the molded body with a conductive material other than Ni or Sn to form a plating layer to be bonded to the metal magnetic powder. Furthermore, a bonding material composed of a conductive paste containing a conductor such as Ag, Cu or the like is provided at the position where the lead-out end portion of the air core coil in the portion where the external terminal of the molded body is formed is exposed to the air core coil. After the coating is applied so as to cover the drawn end portion, the molded body may be plated. In this case, the bonding strength of the coil drawing end and the external terminal can be improved by this bonding material.
Further, in the embodiment, an example is shown in which the coil is embedded in the molded body so that the surface of the coil drawing end is exposed on the surface of the molded body, but the coil is mounted so that the coil drawing end is pulled out of the molded body. Embedded in the molded body, removes the coating on the surface of the coil lead-out end, removes the resin component of the part where the external terminal of the molded body is formed, and turns the lead-out end into the part where the external terminal is formed The external terminals may be formed by processing so as to be positioned and plating the molded body in this state. Further, in this case, a bonding material composed of a conductive paste containing a conductor such as Ag or Cu is applied so as to cover the lead end of the coil positioned at the portion where the external terminal is formed. The external terminal may be formed by plating the molded body in a state in which the drawn end of the coil is fixed to the molded body.
１１ コイル
１２ 成形体
11 Coil 12 Molded body
Claims (8)
該コイルは引き出し端部の表面が該成形体の表面に露出する様に埋設され、
該成形体の表面の樹脂が除去され、該樹脂が除去された部分のコイルの引き出し端部が露出した位置に、該引き出し端部を覆う導電性の接合材を形成し、該金属磁性体粉と該接合材に接合するメッキ層が形成されて該コイルの引き出し端部が接続される外部端子が形成されることを特徴とする表面実装インダクタ。 In a surface mount inductor comprising a coil formed by winding a conductive wire, and a molded body in which the coil is sealed with a sealing material mainly containing metal magnetic powder and resin,
The coil is embedded so that the surface of the drawn end is exposed on the surface of the molded body,
A conductive bonding material covering the lead-out end is formed at a position where the resin on the surface of the molded body is removed and the lead-out end of the coil where the resin is removed is exposed, and the metal magnetic powder And a plating layer bonded to the bonding material to form an external terminal to which the lead end of the coil is connected.
該コイルは該成形体内に埋設されて引き出し端部を該成形体から引き出し、外部端子が形成される位置に配置され、
該成形体の表面の外部端子が形成される部分の樹脂が除去され、該金属磁性体粉と該外部端子を構成するメッキ層が接合され、該外部端子と該コイルの引き出し端部が接続されていることを特徴とする表面実装インダクタ。 In a surface mount inductor comprising a coil formed by winding a conductive wire, and a molded body in which the coil is sealed with a sealing material mainly containing metal magnetic powder and resin,
The coil is embedded in the molded body, the drawer end is pulled out from the molded body, and is arranged at a position where an external terminal is formed,
The resin on the surface of the molded body where the external terminals are formed is removed, the metal magnetic powder and the plating layer constituting the external terminals are joined, and the external terminals and the leading end of the coil are connected. A surface-mount inductor characterized by that.
導線を巻回して形成したコイルを引き出し端部の表面が該成形体の表面に露出する様に成形体内に埋設する工程と、
該成形体の表面の樹脂を除去して該成形体の表面に金属磁性体粉末を露出させる工程と、
該樹脂が除去された部分のコイルの引き出し端部が露出した位置に、該引き出し端部を覆う様に導電性の接合材を塗布し、
該成形体にメッキ処理を施すことにより、該成形体表面に露出させた金属磁性体粉末の表面上にメッキを成長させて該金属磁性体粉と該接合材に接合するメッキ層を形成して該コイルの引き出し端部と接続される外部端子が形成される工程を備えることを特徴とする表面実装インダクタの製造方法。 In a method of manufacturing a surface mount inductor comprising a coil formed by winding a conductive wire, and a molded body in which the coil is sealed with a sealing material mainly containing metal magnetic powder and resin,
A step of embedding a coil formed by winding a conducting wire in the molded body such that the surface of the drawn end is exposed on the surface of the molded body;
Removing the resin on the surface of the molded body to expose the metal magnetic powder on the surface of the molded body; and
Applying a conductive bonding material so as to cover the lead end at a position where the lead end of the coil where the resin is removed is exposed,
By plating the molded body, plating is grown on the surface of the metal magnetic powder exposed on the surface of the molded body to form a plating layer that joins the metal magnetic powder and the bonding material. A method for manufacturing a surface-mount inductor, comprising a step of forming an external terminal connected to a leading end portion of the coil.
導線を巻回して形成したコイルを成形体内に埋設し、該コイルの引き出し端部を該成形体から引き出し、外部端子が形成される位置に配置する工程と、
該成形体の表面の樹脂を除去して該成形体の表面に金属磁性体粉末を露出させる工程と、
該樹脂が除去された部分の該コイルの引き出し端部が配置された位置に、該引き出し端部を覆う様に導電性の接合材を塗布して引き出し端を成形体表面に固定する工程と、
該成形体にメッキ処理を施すことにより、該成形体表面に露出させた金属磁性体粉末の表面上にメッキを成長させて該金属磁性体粉と該接合材に接合するメッキ層を形成して該コイルの引き出し端部と接続される外部端子が形成される工程を備えることを特徴とする表面実装インダクタの製造方法。 In a method of manufacturing a surface mount inductor comprising a coil formed by winding a conductive wire, and a molded body in which the coil is sealed with a sealing material mainly containing metal magnetic powder and resin,
A step of burying a coil formed by winding a conducting wire in a molded body, pulling out a leading end of the coil from the molded body, and placing the external terminal at a position;
Removing the resin on the surface of the molded body to expose the metal magnetic powder on the surface of the molded body; and
Applying a conductive bonding material so as to cover the lead-out end at a position where the lead-out end of the coil in the portion where the resin is removed, and fixing the lead-out end to the surface of the molded body;
By plating the molded body, plating is grown on the surface of the metal magnetic powder exposed on the surface of the molded body to form a plating layer that joins the metal magnetic powder and the bonding material. A method for manufacturing a surface-mount inductor, comprising a step of forming an external terminal connected to a leading end portion of the coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017086340A JP6414612B2 (en) | 2017-04-25 | 2017-04-25 | Surface mount inductor and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017086340A JP6414612B2 (en) | 2017-04-25 | 2017-04-25 | Surface mount inductor and manufacturing method thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014180928A Division JP6179491B2 (en) | 2014-09-05 | 2014-09-05 | Surface mount inductor and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017191941A true JP2017191941A (en) | 2017-10-19 |
| JP6414612B2 JP6414612B2 (en) | 2018-10-31 |
Family
ID=60086000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017086340A Active JP6414612B2 (en) | 2017-04-25 | 2017-04-25 | Surface mount inductor and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6414612B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021170576A (en) * | 2020-04-14 | 2021-10-28 | 株式会社村田製作所 | Inductor and method for manufacturing the same |
| JP7463837B2 (en) | 2020-05-14 | 2024-04-09 | Tdk株式会社 | Electronic Components |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10284343A (en) * | 1997-04-11 | 1998-10-23 | Mitsubishi Materials Corp | Chip type electronic component |
| JP2001052937A (en) * | 1999-08-13 | 2001-02-23 | Murata Mfg Co Ltd | Inductor and manufacture thereof |
| JP2001155950A (en) * | 1999-09-16 | 2001-06-08 | Murata Mfg Co Ltd | Inductor and method of manufacturing therefor |
| JP2011003761A (en) * | 2009-06-19 | 2011-01-06 | Yoshizumi Fukui | Winding integrated type molded coil, and method of manufacturing winding integrated type molded coil |
| JP2012160507A (en) * | 2011-01-31 | 2012-08-23 | Toko Inc | Surface mount inductor and method for manufacturing surface mount inductor |
| JP2013045927A (en) * | 2011-08-25 | 2013-03-04 | Taiyo Yuden Co Ltd | Electronic component and manufacturing method therefor |
| JP2013110184A (en) * | 2011-11-18 | 2013-06-06 | Toko Inc | Surface-mounted inductor manufacturing method and surface-mounted inductor |
| JP2013149814A (en) * | 2012-01-20 | 2013-08-01 | Toko Inc | Surface mounting inductor and manufacturing method therefor |
| JP2013211333A (en) * | 2012-03-30 | 2013-10-10 | Toko Inc | Method of manufacturing surface mount inductor |
| JP2016032050A (en) * | 2014-07-29 | 2016-03-07 | 太陽誘電株式会社 | Coil component, manufacturing method thereof, and electronic apparatus |
-
2017
- 2017-04-25 JP JP2017086340A patent/JP6414612B2/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10284343A (en) * | 1997-04-11 | 1998-10-23 | Mitsubishi Materials Corp | Chip type electronic component |
| JP2001052937A (en) * | 1999-08-13 | 2001-02-23 | Murata Mfg Co Ltd | Inductor and manufacture thereof |
| JP2001155950A (en) * | 1999-09-16 | 2001-06-08 | Murata Mfg Co Ltd | Inductor and method of manufacturing therefor |
| JP2011003761A (en) * | 2009-06-19 | 2011-01-06 | Yoshizumi Fukui | Winding integrated type molded coil, and method of manufacturing winding integrated type molded coil |
| JP2012160507A (en) * | 2011-01-31 | 2012-08-23 | Toko Inc | Surface mount inductor and method for manufacturing surface mount inductor |
| JP2013045927A (en) * | 2011-08-25 | 2013-03-04 | Taiyo Yuden Co Ltd | Electronic component and manufacturing method therefor |
| JP2013110184A (en) * | 2011-11-18 | 2013-06-06 | Toko Inc | Surface-mounted inductor manufacturing method and surface-mounted inductor |
| JP2013149814A (en) * | 2012-01-20 | 2013-08-01 | Toko Inc | Surface mounting inductor and manufacturing method therefor |
| JP2013211333A (en) * | 2012-03-30 | 2013-10-10 | Toko Inc | Method of manufacturing surface mount inductor |
| JP2016032050A (en) * | 2014-07-29 | 2016-03-07 | 太陽誘電株式会社 | Coil component, manufacturing method thereof, and electronic apparatus |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021170576A (en) * | 2020-04-14 | 2021-10-28 | 株式会社村田製作所 | Inductor and method for manufacturing the same |
| JP7247942B2 (en) | 2020-04-14 | 2023-03-29 | 株式会社村田製作所 | Inductor and manufacturing method thereof |
| JP7463837B2 (en) | 2020-05-14 | 2024-04-09 | Tdk株式会社 | Electronic Components |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6414612B2 (en) | 2018-10-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6179491B2 (en) | Surface mount inductor and manufacturing method thereof | |
| JP2017201718A (en) | Surface mounting inductor and manufacturing method thereof | |
| US9659705B2 (en) | Method of producing surface-mount inductor | |
| KR101866150B1 (en) | Surface-mounted inductor and manufacturing method therefor | |
| US11769621B2 (en) | Inductor with an electrode structure | |
| JP5450675B2 (en) | Surface mount inductor and manufacturing method thereof | |
| JP5832355B2 (en) | Manufacturing method of surface mount inductor | |
| US20160276088A1 (en) | Wire wound inductor and method of manufacturing the same | |
| JP5450565B2 (en) | Surface mount inductor | |
| JP2018107199A (en) | Surface-mount inductor | |
| KR20180073450A (en) | Surface-mount inductor | |
| JP2017069460A (en) | Coil component and manufacturing method therefor | |
| US11657955B2 (en) | Surface mount inductor | |
| JP6414612B2 (en) | Surface mount inductor and manufacturing method thereof | |
| JP5450566B2 (en) | Manufacturing method of surface mount inductor | |
| JP2019197781A (en) | Surface-mounted inductor | |
| KR101792279B1 (en) | Inductor and inductor manufacturing method | |
| JP7003901B2 (en) | Surface mount inductor | |
| US10026549B2 (en) | Method of manufacturing an electronic component | |
| JP6332159B2 (en) | Surface mount inductor and manufacturing method thereof | |
| JP6172214B2 (en) | Manufacturing method of surface mount inductor | |
| US20170133150A1 (en) | Customized smd power inductor and method of manufacturing the same | |
| US20240071676A1 (en) | Inductor and method for manufacturing inductor | |
| JP2023150279A (en) | inductor | |
| JP2021111647A (en) | Inductor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180420 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180529 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180711 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180807 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180823 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180905 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180918 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6414612 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |