JP2017191286A - Lithography device and controlling method of lithography device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lithography device capable of effectively using a cleaning member and surely removing a foreign substance, by managing history of loading positions and loading frequencies of the cleaning member.SOLUTION: The lithography apparatus is a lithography apparatus 10 transcribing a circuit pattern formed on an original plate onto a substrate, which comprises a holding member 61 holding the substrate; a cleaning member 1 which is brought into contact with a holding surface 62 at a side at which the holding member 61 holds the substrate and removes a foreign substance on the holding surface 62; storage means 90 storing loading positions and loading frequencies of the cleaning member 1 onto the holding surface 62; and control means 70 controlling cleaning operation of the cleaning member 1 on the basis of the loading positions and loading frequencies stored in the storage means 90. The control means 70 controls cleaning operation so that the cleaning member 1 is loaded on a position different from the past loading position.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a lithographic apparatus and a method for controlling the lithographic apparatus, and more particularly to a lithographic apparatus that removes foreign matter on a substrate holding surface using a cleaning member.

  In a lithographic apparatus, if a foreign substance adheres to a substrate holding surface that holds a wafer (substrate) to be a semiconductor integrated circuit by suction, a wafer suction failure occurs. In addition, a partial swell is formed on the wafer surface, and the pattern is not drawn correctly. On the other hand, even if foreign matter adheres to the reticle or mask holding surface, which is the original plate on which the pattern is formed, a reticle or mask adsorption failure occurs. Also, if the reticle or mask is held tilted, the pattern is not drawn correctly. In order to avoid these problems, wiping cleaning or disassembly cleaning of the substrate holding surface for holding the wafer and the reticle or mask holding surface serving as the pattern original plate is required. However, in order to perform wiping cleaning or disassembly cleaning, it is necessary to stop the lithography apparatus, resulting in a reduction in production efficiency.

  Patent Document 1 discloses a foreign matter removing method on a substrate holding surface using a cleaning member. Each time the cleaning member is transported onto the substrate holding surface, the foreign material adhering to the substrate holding surface is removed by moving the cleaning member in the rotation direction by a predetermined angle with respect to the same rotation center, and removing the foreign matter to the back surface of the wafer. It is disclosed that foreign matter adhesion is reduced.

JP 2004-71999 A

  However, Patent Document 1 does not describe how to manage the usage history of the cleaning member. Therefore, there is a possibility that foreign matter is removed using the same place. For example, when the rotation center at the time of rotating the cleaning member is the same as in Patent Document 1, the foreign matter removal effect at the rotation center may be reduced. Furthermore, if the cleaning member is used beyond the usage limit, the effect of removing foreign matter is reduced, cannot be removed, or the foreign matter removed last time increases due to reattachment.

  In view of such problems, an object of the present invention is to provide a lithography apparatus that can effectively use a cleaning member and reliably remove foreign matter by managing a use history of the cleaning member.

  In order to solve the above problems, a lithographic apparatus according to the present invention is a lithographic apparatus that transfers a circuit pattern formed on an original onto a substrate, the holding member holding the substrate, and the holding member being A cleaning member that is in contact with the holding surface on the side that holds the substrate and removes foreign matter on the holding surface; a storage unit that stores a mounting position and the number of times of mounting of the cleaning member on the holding surface; Control means for controlling the cleaning operation of the cleaning member based on the mounting position and the number of mounting times stored in the means, the control means being mounted at a position where the cleaning member is different from the past mounting position. The cleaning operation is controlled as described above.

  According to the present invention, it is possible to provide a lithographic apparatus that can effectively use a cleaning member and reliably remove foreign matter by managing the use history of the cleaning member.

1 is a diagram showing a configuration of a lithographic apparatus. It is a figure which shows the structure of a board | substrate holding surface. It is a figure which shows the structure of a cleaning member. It is a figure which shows an example which moves and holds a cleaning member with respect to a board | substrate holding part. It is a figure which shows the contact trace of the cleaning member with the support pin 62a of a board | substrate holding | maintenance part. It is a figure which shows the imprint apparatus as a lithography apparatus. It is a flowchart which shows the cleaning sequence using a cleaning member. It is a figure which shows the structure of the lithography apparatus which concerns on 2nd Embodiment. . It is a figure which shows the structure of the lithography apparatus which concerns on 3rd Embodiment. It is a figure which shows the structure of the lithography apparatus which concerns on 4th Embodiment.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a plan view of a lithographic apparatus according to this embodiment. The lithography apparatus 10 according to this embodiment includes a load port 20, a transfer robot 30, a pre-alignment mechanism 40, an in-device storage carrier 50, a substrate stage 60, and a control device 70. A substrate storage case 21 that stores the cleaning member 1 is mounted on the load port 20. The substrate stage 60 is provided with a substrate holding part (holding member) 61 for holding a substrate. The substrate holding part 61 has delivery pins 63a, 63b, 63c (a plurality of pins) for delivering the substrate to and from the transfer robot 30. ) Is provided.

  Note that the lithography apparatus according to this embodiment includes an exposure apparatus and a drawing apparatus. The exposure apparatus transfers (exposes) an image of a pattern formed on an original (reticle) onto a substrate by irradiation with charged particle beams such as EUV light, KrF laser light, and ion beams. The drawing apparatus draws a pattern on a substrate using, for example, an electron beam or laser light.

  Next, FIG. 2 shows a top view of the substrate holding portion 61 and a cross-sectional view taken along a broken line in the top view. The substrate holding portion 61 has a substrate holding surface 62, and the surface of the substrate holding surface 62 is composed of a large number of support pins 62a, an outer peripheral ring-shaped flat portion 62b, and a ring-shaped flat portion 62c. That is, the substrate holding surface 62 is an aggregate of the surfaces of the respective support pins 62a, and the substrate holding surface 62 is configured by an aggregate of the upper surfaces of the support pins 62a. The upper part (side on which the substrate is placed) of the support pin 62a has a flat surface. In the present embodiment, it is assumed that the foreign matter 64 exists on the substrate holding surface 62.

  FIG. 3 is a plan view and a side view of the cleaning member 1 used in the present embodiment, and has a cleaning layer 1b on one side of the silicon substrate 1a. The cleaning layer 1b has an adhesive resin layer. By bringing the cleaning layer 1b and the substrate holding surface 62 into contact, the foreign matter adhering to the substrate holding surface 62 is attached to the cleaning layer 1b. . Further, without being limited to the resin layer, the back surface of the Si substrate itself may be used as the cleaning layer. In this case, the same effect can be obtained even if the Si substrate is not a layer.

  FIG. 4 is a diagram illustrating a mounting position when the cleaning member 1 is mounted on the substrate holding surface 62 of the substrate holding unit 61, and shows an example where each cleaning is mounted at a position different from the past position. FIG. 5 shows the movement of the contact mark (contact portion with the pin of the substrate holding unit 61) of the cleaning member corresponding to FIG. 4 with the support pin 62a of the substrate holding unit 61. In the present embodiment, the diameter of the support pins 62a is R, the pitch (interval) thereof is L, and the shift distance during cleaning of the cleaning member 1 is D. In the present embodiment, the contact mark formed on the cleaning member 1 once by bringing the cleaning member 1 and the support pin 62a into contact with each other, and the contact mark formed by bringing the cleaning member 1 and the support pin 62a into contact with each other thereafter. Clean so that they do not overlap. That is, cleaning is performed while shifting the cleaning member 1 so that the contact trace at the past cleaning and the contact trace formed at the next cleaning do not overlap. Therefore, the shift distance D is a distance larger than the pin diameter R. Further, the distance is smaller than the pitch L of the support pins 62a. In the present embodiment, an example in which cleaning is performed four times while shifting the cleaning member is shown. As shown in FIG. 4, in the first cleaning operation, since the cleaning member is attached and detached at the standard position of the substrate holding portion, the position of the cleaning member is 170a and the X shift amount is zero. The contact mark of the support pin 62a at this time is 160a in FIG.

  Next, in the second cleaning operation, the position of the cleaning member is 170b and the X shift amount is D because the contact mark of the support pin 62a is shifted by a distance D in the x direction so as not to overlap. The contact mark at this time is 160b and does not overlap with the contact mark 160a at the first cleaning. That is, the cleaning operation is performed so as to be mounted at a position shifted by a distance that is larger than the diameter of the support pin 62a and smaller than the interval between adjacent pins. The contact mark at the next cleaning (second time) does not overlap.

  Similarly, in the fourth cleaning operation, since the contact trace of the support pin 62a is not overlapped, the cleaning member is positioned at 170d and the X shift amount is set to be shifted by a distance D in the X direction. 3D. The contact mark at this time is 160d. In the present embodiment, the shift is made in the X direction so that the contact marks of the support pins 62a do not overlap, but the movement direction may be shifted in the Y direction. Alternatively, the moving direction may be a combination of the X direction and the Y direction. In any case, if the total shift distance (total movement distance in the shifting direction) Ds in any one direction of the X direction and the Y direction is smaller than L in a plurality of cleaning operations, The contact marks of the support pins 62a do not overlap.

  FIG. 6 shows an imprint apparatus that forms a circuit pattern by pressing (transferring) an original plate (mask) on which a concavo-convex pattern is formed, onto a substrate (on a silicon substrate) applied to a resin applied as a lithography apparatus. It is a front view. The mask 150 is held by the mask chuck 151, and an imprint operation can be performed by the imprint head 153. These are fixed by the structure 152. The imprint head 153 is controlled by the imprint control unit 100. The substrate stage 60 is controlled by the stage controller 130. The transfer robot 30 and the load port 20 are controlled by the transfer system control unit 120. The pre-alignment mechanism 40 is controlled by the pre-alignment control unit 110. The series of control units 100 to 130 are controlled by the control unit 70. When the substrate chuck 151 is cleaned using the cleaning member 1, the control unit 70 is connected with a storage unit 90 for storing a position to be mounted on the substrate chuck 151.

  Next, a cleaning member management method will be described. First, the cleaning member 1 placed in the substrate storage case 21 is placed (mounted) on the pre-alignment chuck 41 of the pre-alignment mechanism 40 by the handling arm 31 of the transport robot 30. The cleaning member 1 placed on the pre-alignment chuck 41 is pre-aligned by a pre-alignment detection system and a pre-alignment chuck driving mechanism (not shown). After the pre-alignment, the cleaning member 1 is transferred to the in-device storage carrier 50 by the handling arm 31 of the transfer robot 30 and stands by.

  When the substrate holding surface 62 needs to be cleaned, the cleaning member 1 stored in the in-device storage carrier 50 is transferred to the pre-alignment mechanism 40 by the transfer robot 30. The cleaning member 1 placed (mounted) on the pre-alignment chuck 41 is pre-aligned by a pre-alignment detection system and a pre-alignment chuck driving mechanism (not shown).

  After the pre-alignment, the cleaning member 1 is placed on the delivery pins 63a, 63b, and 63c of the substrate holding unit and the substrate support unit 61 in the substrate stage 60 by the transfer robot 30. The control device 70 determines the substrate on the substrate stage 60 based on the past mounting position of the cleaning member 1 stored in the storage unit 90 (contact position information between the convex portion of the substrate holding unit and the substrate) and mounting number information. The holding part 61 is driven. That is, the substrate holding part 61 on the substrate stage 60 is driven so that the cleaning member 1 is mounted at a position different from the past use position (relative position between the cleaning member 1 and the substrate holding part).

  The cleaning member 1 is held on the substrate holding surface 62 when the delivery pins 63a, 63b, and 63c are lowered. By holding the cleaning member 1 on the substrate holding surface 62, the foreign matter 64 attached to the substrate holding surface 62 moves to the cleaning layer 1 b of the cleaning member 1. The cleaning member 1 that has taken in the foreign matter is picked up from the substrate holder 61 by the transfer robot 30 and returned to the in-device storage carrier 50. When the series of foreign matter removing operations is completed, the control device 70 stores the mounting position and the number of mountings of the cleaning member 1 on the substrate holding unit 61. When the controller 70 is instructed to remove the next foreign matter, the controller 70 mounts the cleaning member 1 at a position different from the past mounting position based on the mounting position and the number of mountings of the cleaning member 1 stored in the storage unit 90. At this time, in this embodiment, the cleaning member 1 is mounted so as to operate as shown in FIG. As described above, since the usage status of the cleaning member 1 can be managed, the cleanliness of the substrate holding surface can be maintained without deteriorating the foreign matter removing effect. Further, since the cleaning member is used efficiently, there is a merit in terms of cost.

  FIG. 7 is a flowchart showing a cleaning sequence in the lithography apparatus (imprint apparatus in the present embodiment) using the cleaning member according to the present embodiment. First, when an imprint operation is started (step S200), a resist is applied to the substrate, and after the mask and the substrate are aligned, the mask impresses and releases the substrate (that is, the imprint operation is performed). (Step S201). Next, it is determined whether or not a predetermined number of imprint operations have been completed (step S202). If the predetermined number of imprint operations are not completed (no), the process returns to step S201, and the process is repeated until the predetermined number of imprint operations are completed.

  On the other hand, when a predetermined number of imprint operations have been completed (yes), the possibility of foreign matter adhering to the chuck surface increases, and it is determined whether or not to perform chuck cleaning (step S203). If the chuck cleaning is not performed (no), the imprint operation is terminated (step S204). On the other hand, if the chuck cleaning is to be performed (yes), the process proceeds to step S205. Then, the mounting position of the cleaning member 1 on the substrate chuck 151 is read from the mounting position storage unit 90, and the mounting position k = 1 is set (step S205).

  Next, the cleaning member 1 is carried into the apparatus (step S206), is chucked (held) on a PA (pre-alignment) stage (not shown), and is aligned (step S207). Next, it is transported to the substrate stage 60 and chucked (step S208). Here, the cleaning member 1 causes particles (foreign matter 64) present on the substrate chuck 151 to adhere to the surface. The cleaning member 1 is transported (unloaded) from the substrate stage 60 (step S209), and is temporarily placed on the in-device storage carrier 50 (storage station) in the device (step S210). Next, it is determined whether or not a predetermined number of cleaning operations have been completed (step S211). When the predetermined number of cleaning operations are completed (yes), the process returns to step S201, and the imprint operation is performed again. That is, for example, if particles (foreign matter 64) are removed by the first cleaning operation, the cleaning operation is completed, so the process returns to step S201 and the imprint operation is performed again. On the other hand, if the predetermined number of cleaning operations have not been completed (no), the mounting position of the cleaning member 1 is reset (k + 1) (step S212), and the process returns to step S206 to perform the cleaning operation again. That is, for example, when the number of times of mounting k = 2 is necessary, a new mounting position is read from the mounting position storage unit 90, and the mounting position on the substrate chuck 151 is changed and reset. A series of cleaning operations are repeated again at this position (steps S207 to S211).

  As described above, according to the present embodiment, it is possible to provide a lithography apparatus that can effectively use the cleaning member and reliably remove foreign matter by managing the history of the mounting position and the number of times of mounting. Therefore, the cleaning operation can be performed at a position where the number of times the cleaning member is used is appropriate and different from the past mounting position.

(Second Embodiment)
In the first embodiment, the method for controlling the mounting position so as not to overlap based on the mounting position of the cleaning member 1 stored in the mounting position storage unit 90 has been described. In the present embodiment, a method for managing the cleaning member with the electronic tag of the substrate storage case will be described. FIG. 8 is a plan view of the lithographic apparatus according to the present embodiment. Hereinafter, a different part from 1st Embodiment is demonstrated.

  As shown in FIG. 8, the substrate storage case 21 includes an electronic tag 80 that records the past mounting position and mounting frequency information of the cleaning member 1 stored therein. A reader / writer (reader) 81 for reading and writing the internal data of the electronic tag 80 is mounted on the apparatus side in the vicinity of the substrate storage case 21. Here, the electronic tag is referred to as an IC tag, an RF tag, a wireless tag, or the like, and uses RFID (Radio Frequency Identification) technology that reads and writes data in an IC chip without contact using wireless communication. , Used to identify "things". In addition, the electronic tag includes an IC chip for storing data and a small antenna, and various information is written in the IC chip according to an identification number and an application. Normally, an electronic tag does not have a power source, and communication is possible by receiving a radio wave generated by the reader / writer 81 with an antenna, and data on the IC chip is read and written.

  Next, a procedure for removing foreign matter from the substrate holding surface 62 using the cleaning member 1 according to this embodiment will be described. First, when it is necessary to remove foreign matter from the substrate holding surface 62, the operator sets the substrate storage case 21 containing the cleaning member 1 in the load port 20. When the substrate storage case 21 is set in the load port 20, the control device 70 uses the reader / writer 81 to electronically record the past mounting position and mounting frequency information of the cleaning member 1 stored in the substrate storage case 21. Read from tag 80.

  Next, the control device 70 uses the data read from the electronic tag 80 to drive the substrate holding unit 61 on the substrate stage 60 so that the cleaning member 1 is mounted at a position different from the past mounting position. The foreign matter 64 on the holding surface 62 is removed. When a series of foreign matter removal operations are completed, the control device 70 uses the reader / writer 81 to transfer the mounting position and mounting frequency data of the cleaning member 1 to the substrate holding unit 61 to the electronic tag 80 mounted on the substrate storage case 21. Write.

  As described above, in this embodiment, the history of the mounting position and the number of mounting times is managed by the electronic tag, so that the usage status of the cleaning member can be known, and the cleanliness of the substrate holding surface can be improved without deteriorating the foreign matter removal effect. Can be maintained.

(Third embodiment)
Next, in the present embodiment, a method of managing the cleaning member usage history with the unique number of the substrate storage case using a barcode or the like and the data in the host computer (external device) 71 associated with the unique number will be described. FIG. 9 is a plan view of the lithographic apparatus according to the present embodiment. Hereinafter, a different part from 1st Embodiment is demonstrated. A barcode 82 for managing the unique number of the substrate storage case 21 is mounted on the substrate storage case 21. In the vicinity of the barcode 82, a barcode reader 83 for reading the data of the barcode 82 is mounted.

  A procedure for removing the foreign matter 64 from the substrate holding surface 62 using the cleaning member 1 according to this embodiment will be described. First, when it is necessary to remove foreign matter from the substrate holding surface 62, the operator sets the substrate storage case 21 containing the cleaning member 1 in the load port 20. When the substrate storage case 21 is set in the load port 20, the control device 70 reads the data of the barcode 82 mounted on the substrate storage case 21 using the barcode reader 83. The control device 70 sends the unique number data of the substrate storage case 21 read by the barcode reader 83 to the host computer 71. The host computer 71 sends back the past mounting position and mounting frequency information of the cleaning member 1 associated with the unique number of the substrate storage case 21 to the control device 70. The controller 70 uses the data sent from the host computer 71 to drive the substrate holding portion 61 on the substrate stage 60 so that the cleaning member 1 is mounted at a position different from the past mounting position. The foreign matter 64 is removed. When the series of foreign matter removing operations is completed, the control device 70 transmits data of the mounting position and the number of mounting times of the cleaning member 1 to the substrate holding unit 61 to the host computer 71. The host computer rewrites the data associated with the unique number of the substrate storage case 21 to the latest mounting position and mounting frequency information, and prepares for the next foreign substance removal.

  Thus, in this embodiment, the usage status of the cleaning member can be managed by managing the history of the mounting position and the number of mounting times using the barcode reader.

(Fourth embodiment)
Next, a method for managing the usage history of the cleaning member by directly writing the usage history to the cleaning member using the liquid ejection mechanism according to the present embodiment will be described. FIG. 10 is a plan view of the lithographic apparatus according to the present embodiment. Hereinafter, a different part from 1st Embodiment is demonstrated. The substrate transport path of the lithography apparatus 10 has a discharge device (dispenser) 84 for discharging a resist (imprint material) having a property of being cured by UV light, and a reading for reading an arrangement pattern of the resist discharged by the discharge device 84. A device (reader) 85 is mounted. Here, the discharge device 84 of the present embodiment discharges the resist by a piezo method using a piezoelectric element, a thermal method (bubble jet (registered trademark) method) in which bubbles are generated in the nozzle by heat, or the like. The arrangement pattern of the discharged resist is, for example, a numeral, an alphabet, a barcode, or the like. The reading device 85 is a device that reads characters or barcodes from an image captured by a CCD camera, for example. Before reading with the reading device 85, the resist may be irradiated with UV light and cured.

  Hereinafter, a procedure for cleaning the substrate holding surface 62 using the cleaning member 1 according to the present embodiment will be described. First, the cleaning member 1 placed in the substrate storage case 21 is mounted on the pre-alignment chuck 41 of the pre-alignment mechanism 40 by the transport robot 30. The cleaning member 1 placed on the pre-alignment chuck 41 is pre-aligned by a pre-alignment detection system and a pre-alignment chuck driving mechanism (not shown). During pre-alignment, the reading device 85 reads the arrangement pattern of the resist on the cleaning member supplied by the ejection device (writing means) 84 in a predetermined arrangement. That is, the past mounting position printed on the surface of the cleaning member 1 and the number of times of mounting information are read and sent to the control device 70. The control device 70 drives the substrate holding portion 61 on the substrate stage 60 so that the cleaning member 1 is mounted at a position different from the previous mounting position using the data read by the reading device 85, and the foreign matter on the substrate holding surface 62. 64 is removed. When the series of foreign matter removal operations is completed, the control device 70 causes the ejection device 84 to print data on the mounting position and the number of times of mounting of the cleaning member 1 on the substrate holding portion 61 on the surface of the cleaning member 1. After printing, the resist is cured by applying UV light using a UV illumination system (not shown) to fix the pattern. The cleaning member 1 can be managed by calling the fixed pattern.

  Thus, in this embodiment, the usage status of the cleaning member can be managed by managing the history of the mounting position and the number of mounting times using the liquid discharge mechanism.

  The cleaning of the substrate holding surface that holds the substrate that becomes the semiconductor integrated circuit has been described above as an example. However, the method and apparatus for cleaning a substrate holding surface using the cleaning member of the present invention can also be applied to a method for removing foreign matter adhering to a reticle or mask holding surface as a pattern original plate. Therefore, the cleaning member may have the same shape as the substrate or the original plate depending on the application.

  Moreover, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

DESCRIPTION OF SYMBOLS 1 Cleaning member 10 Semiconductor device 61 Substrate holding part 62 Substrate holding surface 70 Control part 90 Storage part

Claims (9)

A lithographic apparatus for transferring a circuit pattern formed on an original plate onto a substrate,
A holding member for holding the substrate;
A cleaning member for removing foreign matter on the holding surface, wherein the holding member is in contact with the holding surface on the side holding the substrate;
Storage means for storing the mounting position and the number of mounting times of the cleaning member with respect to the holding surface;
Control means for controlling the cleaning operation of the cleaning member based on the mounting position and the number of mounting times stored in the storage means;
With
The lithographic apparatus, wherein the control unit controls the cleaning operation so that the cleaning member is mounted at a position different from a past mounting position. The holding surface is provided with a plurality of pins for holding the substrate,
The control means controls the cleaning operation so that the cleaning member is mounted at a position shifted by a distance larger than a diameter of the pins and smaller than an interval between the plurality of pins. A lithographic apparatus according to claim 1. 3. The control unit according to claim 2, wherein the control unit controls the cleaning operation such that a total moving distance of the cleaning member in a shifting direction is smaller than an interval between the plurality of pins adjacent to each other. The lithographic apparatus described. The said storage means is an electronic tag, The said control means reads the said mounting position and mounting frequency memorize | stored in the said electronic tag with a reader, and controls the said cleaning operation | movement. The lithographic apparatus according to claim 1. The storage means is an external device that is connected to the lithography apparatus and manages a past mounting position and the number of mounting times associated with a unique number of the cleaning member,
The control means controls the cleaning operation so that the cleaning member associated with the unique number managed by the external device is mounted at a position different from the past mounting position and the mounting frequency. The lithographic apparatus according to claim 1, wherein the lithographic apparatus is a lithographic apparatus. The storage means is writing means for writing to the cleaning member, and the control means reads the past mounting position and the number of mounting times of the cleaning member written by the writing means, and reads the past mounting position read The lithographic apparatus according to claim 1, wherein the cleaning operation is controlled so as to be mounted at a position different from the lithographic apparatus. The lithography apparatus according to claim 6, wherein the writing unit supplies the resist on the cleaning member in a predetermined arrangement indicating a past mounting position and the number of mountings of the cleaning member. The lithographic apparatus according to claim 1, wherein the cleaning member has the same shape as the substrate or the original. A method for controlling a lithography apparatus for transferring a circuit pattern formed on an original plate onto a substrate,
A storage step for storing the mounting position and the number of mountings of the cleaning member for removing the foreign matter on the holding surface with the holding member holding the substrate being brought into contact with the holding surface on the side holding the substrate;
A control step of controlling a cleaning operation of the cleaning member based on the mounting position and the number of mounting times stored in the storage step;
In the control step, the cleaning operation is controlled so that the cleaning member is mounted at a position different from the past mounting position.

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