JP2017183507A - Circuit arrangement - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit arrangement which is satisfactorily filled with a resin, prevents the resin from being leaked to a connector part and is capable of reducing component cost.SOLUTION: The present invention relates to a circuit arrangement including multiple terminals and a resist insulating the terminals in end portions; and a resin part which is integrally formed to expose the terminals and the resist on the substrate. The resist is provided in an outer peripheral part enclosing the entire terminals. Further, a height from a top face of the substrate to a top face of the resist is set smaller than a height from the top face of the substrate to top faces of the terminals.EFFECT: A resin can be prevented from being sneaked and leaked from a cavity to a terminal side (connector part), air within a cavity can be released and the circuit arrangement can be satisfactorily filled with the resin. Further, since an application portion of the resist is widened just to the outer peripheral part of the terminals, the need of additional components like the prior arts is eliminated, thereby reducing component cost.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a circuit device in which a substrate and an electronic component mounted on the substrate are sealed with a resin.

  A vehicle represented by a passenger car or a motorcycle is equipped with a circuit device including a substrate. In the circuit device, in order to prevent water and the like from entering the substrate, a technique for sealing the periphery of the substrate so as to be solid with resin has been put into practical use. In such a circuit device, a transfer molding technique is known in which a resin melted from a heating pod is filled in a cavity in which a substrate is disposed (see, for example, Patent Document 1 (FIG. 6)).

The basic principle of the technique disclosed in Patent Document 1 will be described with reference to FIG.
As shown in FIG. 4A, a circuit board 105 supported by a support member 104 is disposed in a cavity 103 of a transfer mold 100 composed of a lower mold 101 and an upper mold 102, and the connector extends from the circuit board 105. A part (contact part) 106 is sandwiched between the lower mold 101 and the upper mold 102.

  Molten resin 108 is injected from the gate 107 into the cavity 103, and the molten resin 108 is solidified, whereby a part of the connector portion 106 and the circuit board 105 are sealed. However, when the molten resin is filled, the molten resin 108 may leak from the cavity 103 to the connector portion 106. As one of countermeasures, the technique of Patent Document 2 is known.

The basic principle of the technique disclosed in Patent Document 2 will be described with reference to FIG.
As shown in FIG. 4B, a circuit board 115 on which an electronic component 114 is mounted is disposed in a cavity 113 of a transfer mold 110 made up of a lower mold 111 and an upper mold 112, and a connector extending from the circuit board 115. A part (contact part) 116 is sandwiched between the lower mold 101 and the upper mold 102. An O-ring 119 that prevents the molten resin 118 from leaking into the connector portion 116 is disposed at the base end portion 117 of the connector portion 116.

  However, when the O-ring 119 is disposed, the parts cost and the assembling cost increase due to the increase in the number of parts and the assembling man-hours. Moreover, it becomes difficult for the gas in the cavity to escape during the filling of the molten resin, and it becomes difficult to fill the resin well. Therefore, there is a demand for a technique that can be satisfactorily filled with resin, prevent resin leakage to the connector portion, and reduce component costs.

JP 2010-56355 A Japanese Patent No. 4478007

  An object of the present invention is to provide a circuit device that can be satisfactorily filled with resin, prevent resin leakage to the connector portion, and reduce component costs.

  The invention according to claim 1 includes a substrate having a plurality of terminals and a resist that insulates these terminals at the end, and a resin portion that is integrally formed on the substrate so as to expose the terminals and the resist. In the circuit device, the resist is provided on an outer peripheral portion surrounding the entire terminal, and a height from the upper surface of the substrate to the upper surface of the resist is smaller than a height from the upper surface of the substrate to the upper surface of the terminal. It is characterized by being set.

  The invention according to claim 2 includes a substrate having a plurality of terminals and a resist that insulates these terminals at an end portion, and a resin portion integrally formed on the substrate so as to expose the terminals and the resist. In the circuit device, the resist is provided between the adjacent terminals, and a height from an upper surface of the substrate to an upper surface of the resist is set smaller than a height from an upper surface of the substrate to an upper surface of the terminal. It is characterized by.

  The invention according to claim 3 includes a substrate having a plurality of terminals and a resist that insulates these terminals at an end portion, and a resin portion integrally formed so as to expose the terminals and the resist on the substrate. In the circuit device, the resist provided between the adjacent terminals is connected to a resist provided on an outer peripheral portion surrounding the entire terminal, and a height from the upper surface of the substrate to the upper surface of the resist is It is set smaller than the height from the upper surface of the substrate to the upper surface of the terminal.

  In the invention according to claim 1, since the resist is provided on the outer peripheral portion surrounding the entire terminal, the resin can be prevented from leaking from the cavity to the terminal side (connector portion). Furthermore, since the height from the top surface of the substrate to the top surface of the resist is set to be smaller than the height from the top surface of the substrate to the top surface of the terminal, it is possible to prevent the intrusion of molten resin and escape air in the cavity. The resin can be satisfactorily filled. Furthermore, since the resist coating portion is simply spread over the outer periphery of the terminal, a separate part as in the prior art becomes unnecessary, and the part cost can be reduced.

  In the invention according to claim 2, since the resist is provided between the adjacent terminals, the resin can be prevented from leaking from the cavity to the space between the terminals (connector portion). Furthermore, since the height from the top surface of the substrate to the top surface of the resist is set to be smaller than the height from the top surface of the substrate to the top surface of the terminal, it is possible to prevent the intrusion of molten resin and escape air in the cavity. The resin can be satisfactorily filled. Furthermore, since the resist coating portion is simply widened between the terminals, a separate part as in the prior art becomes unnecessary, and the part cost can be reduced.

  In the invention according to claim 3, since the resist provided between the adjacent terminals is connected to the resist provided on the outer peripheral portion surrounding the entire terminal, the terminal side (connector including the space between the terminals from the cavity) (connector) ) Can be prevented from leaking around. Furthermore, since the height from the top surface of the substrate to the top surface of the resist is set to be smaller than the height from the top surface of the substrate to the top surface of the terminal, it is possible to prevent the intrusion of molten resin and escape air in the cavity. The resin can be satisfactorily filled. Furthermore, since the resist coating portion is simply widened between the outer peripheral portion of the terminal and between the terminals, a separate part as in the prior art becomes unnecessary, and the part cost can be reduced.

1 is a perspective view of a circuit device according to Embodiment 1. FIG. It is sectional drawing which has arrange | positioned the board | substrate which concerns on Example 1 to the metal mold | die. 7 is a perspective view of a circuit device according to Embodiment 2 and Embodiment 3. FIG. It is a figure explaining the basic principle of a prior art.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

First, Embodiment 1 of the present invention will be described with reference to the drawings.
As shown in FIG. 1, the circuit device 40 includes a substrate 41, a plurality of terminals 42 provided in parallel at the end of the substrate 41, a resist 43 provided on the substrate 41 and insulating the terminals 42, and the substrate 41. The resin part 51 formed integrally so that the terminal 42 and the resist 43 may be exposed.

  The resist 43 includes an outer peripheral resist 44 provided on the outer peripheral portion surrounding the entire terminal 42 and an inter-terminal resist 45 provided between the terminals 42, and the inter-terminal resist 45 is connected to the outer peripheral resist 44. The terminal 42 and the resist 43 are provided on the upper surface of the substrate 41, but are similarly provided on the lower surface of the substrate 41.

  A substrate protection part 52 that protects the substrate 41 is formed at the tip and side of the substrate 41. The substrate protection part 52 is a resin formed integrally with the resin part 51. The substrate 41 exposed from the resin portion 51, the terminal 42, the resist 43, and the substrate protection portion 52 constitute an edge connector 61 that is connected to an external connector.

Next, the substrate 41 arranged in the transfer mold 10 will be described.
FIG. 2A is a cross-sectional view at a position between the terminals 42, and the transfer mold 10 includes a lower mold 11 as a fixed mold and an upper mold 12 as a movable mold. Has been.

  The two lower molds 11 and the upper mold 12 are arranged in a cavity 13 for molding a molten resin, a gate 21 for supplying the molten resin to the cavity 13, and the cavity 13 while being clamped to each other. A substrate clamping portion 31 that clamps the end portion of the substrate 41 is provided. At the front end side of the substrate clamping unit 31, a front end cavity 14 for forming the substrate protection unit 52 by flowing molten resin is formed.

  The edge part of the board | substrate 41 clamped by the board | substrate clamping part 31 comprises the edge connector 61. FIG. In the edge connector 61, a resist 43 is applied to the upper and lower surfaces of the substrate 41. In the cavity 13, a plurality of electronic components 46 are provided on the substrate 41.

  2B is a cross-sectional view taken along the line bb of FIG. 2A, and a distal end cavity 14 is formed on the lateral width direction side of the substrate 41 so that the molten resin flows into the substrate protection portion 52. Has been. The front end cavity 14 on the lateral width side of the substrate 41 communicates with the cavity 13 and further communicates with the front end cavity 14 on the front end side of the substrate 41. The tip cavity 14 is formed on the side of the substrate 41 in the width direction and the tip side.

  Further, on the upper surface of the substrate 41, an outer peripheral resist 44 is formed on the outer peripheral portion of the entire terminal 42, and an inter-terminal resist 45 is formed between the terminals 42. A very small gap is formed in the upper and lower surfaces of the outer peripheral resist 44 and the substrate sandwiching portion 31 so that the molten resin cannot flow (details will be described later). Therefore, it is possible to prevent the molten resin from flowing between the upper and lower surfaces of the outer peripheral resist 44 and the substrate holding portion 31 from the tip portion cavity 14 during molding.

  FIG. 2C is an enlarged view of a portion c of FIG. 2B, and the terminal 42 provided on the substrate 41 is in contact with the substrate clamping portion 31. A height H 1 from the upper surface of the substrate 41 to the upper surface of the resist 43 is set to be smaller than a height H 2 from the upper surface of the substrate 41 to the upper surface of the terminal 42. On the upper surface side of the substrate 41, a gap 47 having a length L <b> 1 is formed between the upper surface of the inter-terminal resist 45 and the substrate clamping portion 31. A gap 48 having a width W1 is formed between the side surface of the inter-terminal resist 45 and the terminal 42.

  The molten resin used in the transfer mold in the example does not flow into a gap having a width of 20 μm or less. The length L1 of the gap 47 and the width W1 of the gap 48 are 20 μm or less. For this reason, it is possible to prevent the molten resin from entering between the terminals 42. Further, even if the length L1 of the gap 47 and the width W1 of the gap 48 are 20 μm or less, air can be passed. For this reason, the air of the cavity 13 and the front-end | tip part cavity 14 can be let through, and it can degas favorably.

  Also, the outer peripheral resist 44 is the same as the inter-terminal resist 45, and a gap having a length L <b> 1 is formed between the upper surface of the outer peripheral resist 44 and the substrate clamping portion 31. The gap of the length L1 is set to a height at which the molten resin does not pass but the air can escape, so that the molten resin can be prevented from entering and the air in the cavity 13 and the tip cavity 14 can escape. Can be filled with resin.

  Furthermore, since the application portion of the resist 43 is merely spread on the outer peripheral portion of the terminal 42, a separate part as in the prior art becomes unnecessary, and the part cost can be reduced. Further, the terminal 42 is in contact with the substrate holding portion 31, and the molten resin is prevented from entering between the terminal 42 and the substrate holding portion 31.

Next, a second embodiment of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected about the same structure as the structure shown in FIG. 1, and detailed description is abbreviate | omitted.
As shown in FIG. 3A, an inter-terminal resist 45 is formed between adjacent terminals 42 on the upper surface of the substrate 41. For this reason, it is possible to prevent the molten resin from leaking from the cavity 13 and the tip portion cavity 14 to the space between the terminals 42 (connector portion).

  Further, a height H1 (see FIG. 2) from the upper surface of the substrate 41 to the upper surface of the resist 43 is set to be smaller than a height H2 (see FIG. 2) from the upper surface of the substrate 41 to the upper surface of the terminal 42. For this reason, intrusion of molten resin can be prevented and air in the cavity 13 and the tip portion cavity 14 can be released, and the resin can be satisfactorily filled. Furthermore, since only the application part of the resist 43 is spread between the terminals 42, a separate part as in the prior art becomes unnecessary, and the part cost can be reduced.

Next, Embodiment 3 of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected about the same structure as the structure shown in FIG. 1, and detailed description is abbreviate | omitted.
As shown in FIG. 3B, on the upper surface of the substrate 41, the outer peripheral resist 44 is provided on the outer peripheral portion surrounding the entire terminal 42. For this reason, it is possible to prevent the molten resin from leaking from the cavity 13 and the tip cavity 14 to the terminal side (connector portion).

  Further, a height H1 (see FIG. 2) from the upper surface of the substrate 41 to the upper surface of the resist 43 is set to be smaller than a height H2 (see FIG. 2) from the upper surface of the substrate 41 to the upper surface of the terminal 42. For this reason, intrusion of molten resin can be prevented and air in the cavity 13 and the tip portion cavity 14 can be released, and the resin can be satisfactorily filled. Furthermore, since the application portion of the resist 43 is merely spread on the outer peripheral portion of the terminal 42, a separate part as in the prior art becomes unnecessary, and the part cost can be reduced.

  In addition, this invention is not limited to the said embodiment, A various design change is possible in the range which does not deviate from the summary. In the embodiment, the terminal 42 and the resist 43 are provided on both surfaces of the substrate 41. However, the present invention is not limited to this, and it may be provided only on one surface of the substrate 41.

  In the example, the molten resin used in the transfer mold does not flow into the gap having a width greater than 0 and not greater than 20 μm, and the length L1 of the gap 47 and the width W1 of the gap 48 are not greater than 20 μm. However, the present invention is not limited to this, and the length L1 of the gap 47 and the width W1 of the gap 48 may be appropriately changed as long as the molten resin to be used does not flow into the gap.

  Further, the number of terminals 42 is not limited to the embodiment, and a plurality of terminals 42 may be arranged in the same direction, such as four, eight, and ten.

  The present invention is suitable for a circuit device in which a substrate and an electronic component mounted on the substrate are sealed with a resin.

  40 ... circuit device, 41 ... substrate, 42 ... terminal, 43 ... resist, 44 ... periphery resist, 45 ... resist between terminals, 51 ... resin part, 52. .Protecting part for substrate, H1... Height from the top surface of the substrate to the top surface of the resist, H2.

Claims (3)

A circuit device comprising a substrate having a plurality of terminals at the end and a resist that insulates these terminals, and a resin portion integrally formed to expose the terminals and the resist on the substrate,
The resist is provided on the outer periphery surrounding the entire terminal,
A circuit device, wherein a height from an upper surface of the substrate to an upper surface of the resist is set smaller than a height from an upper surface of the substrate to an upper surface of the terminal. A circuit device comprising a substrate having a plurality of terminals at the end and a resist that insulates these terminals, and a resin portion integrally formed to expose the terminals and the resist on the substrate,
The resist is provided between the adjacent terminals,
A circuit device, wherein a height from an upper surface of the substrate to an upper surface of the resist is set smaller than a height from an upper surface of the substrate to an upper surface of the terminal. A circuit device comprising a substrate having a plurality of terminals at the end and a resist that insulates these terminals, and a resin portion integrally formed to expose the terminals and the resist on the substrate,
The resist provided between the adjacent terminals is connected to a resist provided on an outer peripheral portion surrounding the entire terminal,
A circuit device, wherein a height from an upper surface of the substrate to an upper surface of the resist is set smaller than a height from an upper surface of the substrate to an upper surface of the terminal.

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