JP2017181130A - Infrared ray sensor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an infrared ray sensor device capable of accurately measuring temperature by preventing influences due to accumulation of dust and dirt.SOLUTION: The infrared ray sensor device includes: an infrared sensor body 2 which has a first heat sensitive element for detection and a second heat sensitive element for compensation; and a light guide member 4 having an opening immediately above the first heat sensitive element which is formed enclosing the infrared sensor body. The light guide member includes: a first shielding part 5a covering immediately above the second heat sensitive element side; and a second shielding part 6a which is formed immediately above the first shielding part being separated from the first shielding part.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an infrared sensor device that detects infrared rays from a measurement object such as a toner fixing roller and measures the temperature and the like of the measurement object.

  Conventionally, an infrared sensor is used as a temperature sensor that detects the temperature of an object to be measured by detecting infrared rays radiated from the object to be measured in a non-contact manner. Such an infrared sensor is used in various fields such as temperature measurement of a fixing roller of toner (developer) incorporated in a copying machine, a printer, or the like, or indoor temperature control of an air conditioner.

For example, Patent Document 1 discloses a case having a light guide part that has an opening and guides infrared rays, a shielding part that has a shielding wall and shields infrared rays, a thermal sensor for detecting infrared rays, and a thermal sensor for temperature compensation. An infrared temperature sensor comprising a film on which is arranged is described. In this infrared temperature sensor, a temperature-compensating thermal element is installed in the shielding part.
Patent Document 2 describes an infrared temperature sensor including a resin film in which an infrared detection thermal element and a temperature compensation thermal element are arranged, and a holder having a light guide. In this infrared temperature sensor, the temperature compensating thermosensitive element is disposed inside the holding body and the lid member.

Japanese Patent Laying-Open No. 2015-172537 JP 2002-156284 A

The following problems remain in the conventional technology.
That is, in the conventional technology, infrared rays are covered with a shielding part or lid member so that infrared rays are not incident on the temperature-compensating thermosensitive element, but dust or dirt may adhere to the shielding part or lid member. There is a problem that adhering dust or dirt is heated by absorbing infrared rays, and the heat is transmitted to the shielding part or the lid member to affect the temperature-compensating thermal element.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an infrared sensor device capable of suppressing the influence of adhesion of dust, dirt, and the like and measuring temperature with high accuracy.

  The present invention employs the following configuration in order to solve the above problems. That is, an infrared sensor device according to a first aspect of the present invention is an infrared sensor body having a first thermal element for detection and a second thermal element for compensation, and is provided so as to surround the infrared sensor body. A light guide member having an opening directly above the heat sensitive element side, and the light guide member is provided directly above the first shield part and a first shielding part that covers just above the second heat sensitive element side And a second shielding part spaced from the first shielding part.

  That is, in this infrared sensor device, the light guide path member includes a first shielding part that covers directly above the second thermal element side, and a second shielding part that is provided immediately above the first shielding part and spaced apart from the first shielding part. Therefore, even if dust or dirt adheres to the second shielding part and heat is transmitted to the second shielding part, the first shielding part blocks infrared rays from the second shielding part, so that the temperature is reduced. It is possible to suppress the compensation of the second heat sensitive element for compensation.

An infrared sensor device according to a second invention is characterized in that, in the first invention, the second shielding part is an inclined part inclined with a lower end directed toward the first thermal element.
That is, in this infrared sensor device, since the second shielding portion is an inclined portion whose lower end is inclined toward the first thermal element side, the first detection for detection according to the inclination angle of the second shielding portion. A viewing angle can be ensured with respect to the light receiving surface on the thermal element side.

An infrared sensor device according to a third invention is the infrared sensor device according to the first or second invention, further comprising a substrate on which the infrared sensor body and the light guide member are installed, and the light guide member surrounds the infrared sensor body. And is disposed on the substrate so as to surround the inner member with a gap between the inner member having the first shielding portion and the inner member. It is comprised with the outer side member which has the said 2nd shielding part, It is characterized by the above-mentioned.
That is, in this infrared sensor device, the light guide member is disposed on the substrate so as to surround the infrared sensor body, and a gap is provided between the inner member having the first shielding portion and the inner member. Since it is composed of the outer member having the second shielding portion and being placed on the substrate so as to surround the inner member, heat is prevented from being directly transferred from the outer member having the second shielding portion to the inner member. can do.

An infrared sensor device according to a fourth invention is the infrared sensor device according to any one of the first to third inventions, wherein the light guide member has a plurality of lower protruding end portions penetrating through attachment holes formed in the substrate, The lower protruding end portion is a back surface shielding portion that covers a region immediately below the first and second heat sensitive elements in a state of being bent on the back surface side of the substrate. .
That is, in this infrared sensor device, the lower protruding end portion is a back surface shielding portion that covers a region immediately below the first and second heat sensitive elements while being bent on the back surface side of the substrate. The radiant heat from the back side can be shielded by the back side shielding part and isolated from the influence.

An infrared sensor device according to a fifth invention is the infrared sensor device according to any one of the first to fourth inventions, wherein the infrared sensor main body is spaced apart from an insulating film having a light receiving surface on an upper surface and a lower surface of the insulating film. The first and second thermosensitive elements provided on the insulating film, the conductive first wiring film formed on the lower surface of the insulating film and connected to the first thermosensitive element, and the second thermosensitive element And a conductive second wiring film connected to the thermosensitive element.
That is, in this infrared sensor device, since the heat sensitive element is provided in the insulating film, heat transfer from the light guide member to the heat sensitive element is further suppressed, and high-precision measurement is possible.

The present invention has the following effects.
That is, according to the infrared sensor device of the present invention, the light guide member is provided directly above the first shielding portion and the first shielding portion that covers the second heat sensitive element side, and is separated from the first shielding portion. Since it has a second shielding part, even if dust or dirt adheres to the second shielding part and heat is transmitted to the second shielding part, the first shielding part blocks infrared rays from the second shielding part. By doing so, it is possible to prevent the compensation second thermal element from being affected.
Therefore, the infrared sensor device of the present invention can maintain high-precision temperature measurement even if dust or dirt adheres, and is particularly suitable as a temperature sensor for measuring a toner fixing roller of a copying machine or a printer.

It is sectional drawing which shows 1st Embodiment of the infrared sensor apparatus which concerns on this invention. In 1st Embodiment, it is a top view which shows an infrared sensor apparatus. In 1st Embodiment, it is a perspective view which shows an infrared sensor apparatus. In 1st Embodiment, it is a perspective view which shows the inner member before attaching to a board | substrate. In 1st Embodiment, it is the back view (a) which shows a board | substrate, and the back view (b) which shows an infrared sensor device. In 1st Embodiment, it is a perspective view which shows an infrared sensor main body. In 1st Embodiment, it is sectional drawing which shows an infrared sensor main body. In 1st Embodiment, it is a back view which shows the insulating film in which the wiring film was formed. In 1st Embodiment, it is a perspective view which shows the infrared sensor apparatus which removed the outer side member. It is a perspective view which shows 2nd Embodiment of the infrared sensor apparatus which concerns on this invention.

  Hereinafter, a first embodiment of an infrared sensor device according to the present invention will be described with reference to FIGS. 1 to 9.

The infrared sensor device 1 according to the present embodiment measures, for example, the temperature of a toner fixing roller. As shown in FIGS. 1 to 3, the first thermal element 3A for detection and the second sensor 2 for compensation are used. The infrared sensor main body 2 having the thermal sensor element 3B, and the light guide member 4 which surrounds the infrared sensor main body 2 and has an opening directly above the first thermal sensor element 3A side.
In FIG. 1, the infrared sensor body 2 is schematically shown.
The light guide member 4 includes a first shielding portion 5a that covers a portion directly above the second thermal element 3B, and a second shielding portion 6a that is provided immediately above the first shielding portion 5a and is spaced apart from the first shielding portion 5a. Have. That is, the light guide member 4 has a double eaves structure of the first shielding part 5a and the second shielding part 6a.

The second shielding part 6a covers the part directly above the first shielding part 5a, and is a sloped part with a lower end inclined toward the first thermal element 3A.
In addition, the infrared sensor device 1 of the present embodiment includes a substrate 7 on which the infrared sensor main body 2 and the light guide member 4 are installed.
The first shielding part 5 a is installed in parallel with the substrate 7.
The light guide member 4 is disposed on the substrate 7 so as to surround the infrared sensor main body 2 and the inner member 5 having the first shielding portion 5a and the inner member 5 with a gap between them. The outer member 6 is provided on the substrate 7 so as to surround the member 5 and has the second shielding part 6a.

As shown in FIGS. 4 and 5, the inner member 5 of the light guide member 4 has a plurality of lower protruding end portions 5 b penetrating through attachment holes 7 a formed in the substrate 7.
These lower protruding end portions 5b are back surface shielding portions 5c that cover regions immediately below the first and second heat sensitive elements 3A and 3B in a state of being bent on the back surface side of the substrate 7.
That is, as shown in FIG. 4, the inner member 5 has a pair of lower protruding end portions 5b protruding downward in a rectangular flat plate shape at the lower portion, and these lower protruding end portions 5b are shown in FIG. After being inserted into the mounting hole 7a of the substrate 7 shown in FIG. As a result, the inner member 5 is fixed and secured, and a pair of back surface shielding portions 5c are formed.

A plurality of fixing protrusions 6b are provided at the lower part of the outer member 6, and the fixing protrusions 6b are inserted into the mounting holes 7b formed in the substrate 7 and a part of the fixing protrusions 6b is bent. The outer member 6 is fixed on the substrate 7 to prevent it from coming off.
The outer member 6 and the inner member 5 have a substantially rectangular tube shape as a whole, and are formed of a metal plate such as SUS (stainless steel), a resin molded body, or the like.

  As shown in FIGS. 6 to 9, the infrared sensor body 2 includes an insulating film 10 having a light receiving surface 2a on the upper surface, and a first thermal element 3A provided on the lower surface of the insulating film 10 so as to be separated from each other. And the second thermal element 3B and the conductive first wiring film 11A formed on the lower surface of the insulating film 10 and connected to the first thermal element 3A and the conductive element connected to the second thermal element 3B. Second wiring film 11B.

  The infrared sensor body 2 includes a resin-made terminal support 12 disposed on the lower surface side of the insulating film 10, and a plurality of lower portions provided on the terminal support 12 and disposed below the terminal support 12. And a mounting terminal 13.

In addition, a light receiving surface 2a is provided in a region on the first heat sensitive element 3A side of the upper surface of the insulating film 10, and a region on the second heat sensitive element 3B side is a region shielded from infrared rays. .
In the region on the second thermal element 3B side, an infrared reflection film 14 is patterned to shield infrared rays, and a region that shields infrared rays is provided.

That is, the infrared reflecting film 14 is provided on the upper surface of the insulating film 10 so as to face the second heat sensitive element 3B. The infrared reflection film 14 is formed in a rectangular shape in a region on the second heat sensitive element 3B side on the upper surface of the insulating film 10.
The infrared reflecting film 14 is formed of a material having an infrared reflectance higher than that of the insulating film 10 and is formed by applying a gold plating film on a copper foil. In addition to the gold plating film, for example, a mirror-deposited aluminum vapor deposition film or an aluminum foil may be used. The infrared reflection film 14 is formed to cover the second thermal element 3B with a size larger than that of the second thermal element 3B.

  The first thermal element 3A and the second thermal element 3B are chip thermistors in which terminal portions are formed at both ends. As this thermistor, there are thermistors such as NTC type, PTC type, CTR type, etc. In this embodiment, for example, NTC type thermistors are employed as the first thermal element 3A and the second thermal element 3B. This thermistor is formed of a thermistor material such as a Mn—Co—Cu-based material or a Mn—Co—Fe-based material.

Adhesive electrodes 15A and 15B formed on the insulating film 10 are connected to one end of each of the first wiring film 11A and the second wiring film 11B, and the insulating film 10 is connected to the other end. The terminal electrodes 16A and 16B formed in the are connected.
Note that the terminal portions of the corresponding first thermal element 3A and second thermal element 3B are bonded to the adhesive electrodes 15A and 15B with a conductive adhesive such as solder.
The board 7 is a circuit board such as a PCB board.

  The insulating film 10 is formed of a polyimide resin sheet in a rectangular shape, and the infrared reflecting film 14, the first wiring film 11A, and the second wiring film 11B are formed of copper foil. That is, these are formed by a double-sided flexible substrate in which the surface of a polyimide substrate used as the insulating film 10 is patterned with a copper foil used as the infrared reflecting film 14, the first wiring film 11A, and the second wiring film 11B. It was produced.

The mounting terminal 13 is made of, for example, a tin-plated copper alloy. The mounting terminal 13 extends to the upper portion of the terminal support 12 and is connected to the first terminal electrode 16A and the second terminal electrode 16B in the corresponding first wiring film 11A and second wiring film 11B. ing.
Further, the lower portion 13 a of the mounting terminal 13 is provided so as to protrude downward from the lower surface of the terminal support 12. That is, the mounting terminal 13 extends vertically, and the lower portion 13a protrudes downward from the lower surface of the terminal support 12, and the lower portion 13a bends and protrudes laterally. It is formed in a letter shape.
The mounting terminals 13 are respectively arranged in the vicinity of the four corners of the terminal support 12 and are incorporated into the terminal support 12 by insert molding or fitting.

  The terminal support 12 is made of a resin such as PPS (polyphenylene sulfide resin) and is formed in a frame shape along at least the outer edge of the insulating film 10. That is, the terminal support 12 is composed of an outer frame portion along the outer edge portion of the insulating film 10 and an intermediate frame portion crossing an intermediate portion between the first thermal element 3A and the second thermal element 3B. ing.

  As described above, in the infrared sensor device 1 according to the present embodiment, the light guide member 4 is provided on the first shielding portion 5a that covers the portion directly above the second thermal element 3B and the first shielding portion 5a. Since the second shielding part 6a is separated from the part 5a, as shown in FIG. 1, dust, dirt G, etc. adhere to the second shielding part 6a and heat is transmitted to the second shielding part 6a. Even if the 1st shielding part 5a interrupts | blocks the infrared rays from the 2nd shielding part 6a, it can suppress that the 2nd thermal element 3B for temperature compensation is influenced.

Moreover, since the 2nd shielding part 6a is made into the inclination part which inclined the lower end toward the 1st thermal element 3A side, according to the inclination angle of the 2nd shielding part 6a, the 1st thermal element for a detection A viewing angle can be secured with respect to the light receiving surface 2a on the 3A side.
In addition, the light guide member 4 is disposed on the substrate 7 so as to surround the infrared sensor body 2, and a gap is provided between the inner member 5 having the first shielding part 5 a and the inner member 5. The outer member 6 is disposed on the substrate 7 so as to surround the inner member 5 and has the second shielding portion 6a. Therefore, heat is transmitted from the outer member 6 having the second shielding portion 6a to the inner member. 5 can be prevented from being transmitted directly.

In addition, since the lower protruding end 5b is a back surface shielding portion 5c that covers a region immediately below the first heat sensitive element 3A and the second heat sensitive element 3B while being bent on the back surface side of the substrate 7, The radiant heat from the back surface side can be shielded by the back surface shielding part 5c and isolated from the influence.
Furthermore, since the heat sensitive elements 3A and 3B are provided on the insulating film 10, heat transfer from the light guide member 4 to the heat sensitive elements 3A and 3B is further suppressed, and high-precision measurement is possible.

  Next, a second embodiment of the infrared sensor device according to the present invention will be described below with reference to FIG. Note that, in the following description of the embodiment, the same components described in the above embodiment are denoted by the same reference numerals, and the description thereof is omitted.

The difference between the second embodiment and the first embodiment is that, in the first embodiment, the second shielding portion 6a is an inclined portion, whereas the infrared sensor device 21 of the second embodiment is shown in FIG. As shown in FIG. 4, the second shielding part 26 a is installed in parallel to the substrate 7.
That is, in the second embodiment, a horizontal plate-like second shielding part 26a is provided in parallel with the first shielding part 5a at the intermediate portion in the height direction of the outer member 26. In addition, the height of the 2nd shielding part 26a is set to the height which can ensure the viewing angle with respect to the light-receiving surface 2a.

  Therefore, when the second shielding portion is inclined as in the first embodiment, there is a possibility that attached dust, dirt, or the like may slide down to the light receiving surface 2a side, but in the infrared sensor device 21 of the second embodiment, 2 Since the shielding part 26a is installed in parallel to the substrate 7, dust, dirt, and the like are less likely to fall to the light receiving surface 2a side.

  The technical scope of the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

  For example, in the first embodiment, it is preferable to secure the viewing angle by inclining the second shielding portion with the lower end of the second shielding portion facing the first thermal element side, but it is possible to ensure the viewing angle. For example, the second inclined portion may be installed in a reverse direction.

In each of the above embodiments, the first and second thermosensitive elements of the chip thermistor are employed. However, the first and second thermosensitive elements formed of the thin film thermistor are employed. It doesn't matter.
As the thermal element, a thin film thermistor or a chip thermistor is used as described above, but a pyroelectric element or the like can be used in addition to the thermistor.

  DESCRIPTION OF SYMBOLS 1,21 ... Infrared sensor apparatus, 2 ... Infrared sensor main body, 2a ... Light-receiving surface, 3A ... 1st thermal element, 3B ... 2nd thermal element, 4 ... Light guide member, 5 ... Inner member, 5a ... 1st Shielding portion, 5b ... lower protruding end portion, 5c ... backside shielding portion, 6, 26 ... outer member, 6a, 26a ... second shielding portion, 7 ... substrate, 7a, 7b ... mounting hole, 10 ... insulating film, 11A ... 1st wiring film, 11B ... 2nd wiring film

Claims (5)

An infrared sensor body having a first thermal element for detection and a second thermal element for compensation;
A light guide member provided around the infrared sensor body and having an opening directly above the first thermal element side;
The light guide member includes a first shielding portion that covers the portion directly above the second thermal element side, and a second shielding portion that is provided immediately above the first shielding portion and is spaced apart from the first shielding portion. An infrared sensor device. The infrared sensor device according to claim 1,
2. The infrared sensor device according to claim 1, wherein the second shielding part is an inclined part having a lower end inclined toward the first thermal element side. In the infrared sensor device according to claim 1 or 2,
A substrate on which the infrared sensor body and the light guide member are installed;
The light guide member is disposed on the substrate so as to surround the infrared sensor body, and has an inner member having the first shielding portion,
An infrared ray characterized by comprising an outer member that is disposed on the substrate so as to surround the inner member with a gap between the inner member and the inner member, and that has the second shielding portion. Sensor device. In the infrared sensor device according to any one of claims 1 to 3,
The light guide member has a plurality of lower projecting ends penetrating attachment holes formed in the substrate;
The lower protruding end portion is a back surface shielding portion that covers a region immediately below the first and second heat sensitive elements in a state of being bent on the back surface side of the substrate. Infrared sensor device. In the infrared sensor device according to any one of claims 1 to 4,
The infrared sensor body has an insulating film having a light receiving surface on the upper surface;
The first thermal element and the second thermal element provided on the lower surface of the insulating film so as to be spaced apart from each other;
A conductive first wiring film formed on a lower surface of the insulating film and connected to the first thermal element; and a conductive second wiring film connected to the second thermal element. An infrared sensor device.

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