JP2017177633A - Label manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a label manufacturing device, which allows a position of a defective label to be surely recognized so that good labels can be replenished with high accuracy without deteriorating a work efficiency.SOLUTION: Die-cutting means comprises a first die-cutting blade 14 for die-cutting a label as a whole and a second die-cutting blade 16 for forming a rear-end die-cutting line 41A at a rear end side in a label conveying direction. On a continuous label 31 in which IC modules 35 are sequentially formed peelably on an at least peeling body 32 and conveyed, in a region where a good IC module 35 is die-cut just by the first die-cutting blade 14 into an IC label 36, a whole die-cutting line 41 is formed and an incision of the rear-end die-cutting line 41A is formed up to the peeling body 32 just by the second die-cutting blade 16, at a rear end side in the conveying direction with respect to a defective IC module 35A, so that the defective IC module 35A as a whole is rolled up together with an unwanted body without die-cutting the module.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a label manufacturing apparatus that discriminates non-defective and defective labels sequentially formed on a continuous base material, eliminates defective products, and replenishes non-defective products.

  In recent years, when affixing labels to a large number of products, a label is formed on a continuous mount, and only non-defective labels are sequentially affixed to the product. And when the label formed on the continuous mount is only good products, all the formed labels are inspected and the defective defective labels are efficiently removed, and the good labels are surely placed at the removed positions. Need to replenish.

  Conventionally, various techniques have been proposed for eliminating defective labels in label production. For example, Patent Document 1 inspects a non-defective product / defective product of a label arranged in one direction on a web-like label sheet that is detachably attached to a web-like release mount, and is considered to be a non-defective product. A defective label removing device has been proposed in which a slit is formed along the outer shape of only the label, and is peeled off and collected from the release mount, and the defective label is removed together with the release mount from which the non-defective label is recovered.

JP 2010-149333 A

  By the way, when producing a label roll only of a non-defective label, the defective label is used to replenish the non-defective label after the defective label is removed as in Patent Document 1 described above. For example, it is known to mark the position by an operator, but there is a problem that the work efficiency is lowered. There is a problem that it is necessary to provide a mechanism.

  On the other hand, it is also known to detect the position area that is regarded as a defective product label without using marking etc., but unlike mark detection etc., the detection position error is large, and replenishment of good product labels is accurate. There is a problem that you can not.

  Therefore, the present invention has been made in view of the above-described problems, and even if it is a mechanism that eliminates defective product labels together with unnecessary bodies, it is possible to reliably recognize the position of defective product labels without deteriorating work efficiency. It is an object of the present invention to provide a label manufacturing apparatus that can replenish with high accuracy.

  In order to solve the above problems, in the invention of claim 1, each label body on the continuous label which is formed and conveyed in a continuous manner so as to be peelable at least on a continuous peeled body is a non-defective product. A label manufacturing apparatus that winds a label body that has been inspected and determined as a defective product together with an unnecessary body that is no longer necessary for the continuous label. The entire label is die-cut, and a die-cutting means is provided for forming a notch to the peeling body on the rear end side in the transport direction of the label main body with respect to the label main body, which is regarded as a defective product.

  According to the present invention, a label as a whole is formed on a continuous label that is formed on and conveyed at least on a continuous peeled body, and which is regarded as a non-defective product in a mold release means. The label body that has been removed is formed with a notch up to the peeling body on the rear end side in the transport direction of the label body, and the label body that has been made defective is unnecessary. By adopting a configuration that winds up with the body, it is possible to wind up the entire unnecessary body by forming a cut on the rear end side in the transport direction with respect to the defective product label, and to detect the cut formed in the peeled body. It is possible to reliably recognize the position of the defective product label and to replenish the non-defective product label with high accuracy without lowering the work efficiency.

It is a schematic block diagram of the label manufacturing apparatus which concerns on this invention. It is explanatory drawing of the continuous label of FIG. It is operation | movement explanatory drawing of the die cutting means of FIG. It is explanatory drawing of label classification of FIG. It is another structure explanatory drawing of a die cutting means. It is operation | movement explanatory drawing of the die cutting means of FIG. It is explanatory drawing of the die cutting means of the other structure with respect to FIG. It is a schematic block diagram of other embodiment of the label manufacturing apparatus of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present embodiment, the label is described as an IC label having a communication function like an RFID label. However, for example, the label can be applied to a printed label on which predetermined information is printed. The term “IC label” is used as a product after die cutting, and is also used as a region before die cutting, that is, a region including an IC module (label body) which is a main element of an IC label. .

  FIG. 1 shows a schematic configuration diagram of a label manufacturing apparatus according to the present invention, and FIG. 2 shows an explanatory diagram of the continuous label of FIG. In FIG. 1, the label manufacturing apparatus 11 is not shown with a control means for controlling the entire apparatus, but is supplied with a continuous label 31 described in FIG. 13, the die cutting means and the transport roller 16 (16A, 16B) are arranged. The label inspection unit 13 communicates with the IC module 35 which is the main element of the IC label 36 formed on the continuous label 31 to determine whether the product is a non-defective product. In addition, the continuous label 31 supplied from the continuous label supply unit 12 may be pre-inspected for quality in a previous step in the label manufacturing process, and the die cutting means may be operated using the inspection result. In this case, the label inspection unit 13 is not necessary.

  The die cutting means includes a first die cutting blade 14 that is driven and a first receiving cylinder 15 that is positioned with the continuous label 31 interposed therebetween, and a second die cutting blade that can be driven. 16 and a second receiving cylinder 17 positioned with the continuous label 31 in between, a first die cutting blade 14 (first receiving cylinder 15), a second die cutting blade 16 ( A second receiving cylinder 17) is arranged side by side in the conveying direction of the continuous label 31. The first receiving cylinder 15 and the second receiving cylinder 17 may be a single receiving cylinder. Die cutting (cutting) is performed in a half-cut state (overshoot drive state of the first die cutting blade 14 and the second die cutting blade 16 to the peeling body 32) in the peeling body 32. From the transport rollers 18A and 18B, a label surface body 34, which is an unnecessary body called a waste after a non-defective IC label is punched, and is taken up by the unneeded body winding unit 17, and a non-defective IC label. The peeled body 32 to which only this is adhered as it is is conveyed separately.

  A cut line detection unit 20 and a non-defective label replenishment unit 21 are disposed on the conveying direction of the peeling body 32. The rear end die-cutting line detected by the cut line detection unit 18 will be described with reference to FIG. The non-defective label replenishment unit 19 replenishes a non-defective IC label by applying a non-defective IC label to the position detected by the cut line detection unit 18, and an conventionally known inlet pasting mechanism or the like can be applied. The description is omitted here.

  And the peeling body winding part 22 which winds up the said peeling body 32 in which the non-defective IC label was replenished by the said non-defective label replenishment part 21 is arrange | positioned.

  2A and 2B, the continuous label 31 has a label adhesive layer 33 on a continuous release body 32 (release agent 32B) in which a release agent 32A is formed on a release substrate 32A. An IC module 35 composed of an IC chip serving as a label main body and an antenna (which will later be die-cut in an area including the IC module 36 to form an IC label 36) is formed continuously at a predetermined interval. The IC module 35 communicates with the label inspection unit 13 arranged at a set distance, and determines whether or not it is a non-defective product. The label surface body 34 composed of the label base 34A and the adhesive layer 34B is bonded onto the IC module 35. In addition, as the continuous label 31, the label surface body 34 may be used as a label base material of a unit for forming the IC module 35. When the etching antenna is formed on the label base material, the adhesive layer 34 is required and printed. When the antenna is formed, the adhesive layer 34 is not necessary.

  Here, FIG. 3 shows an operation explanatory view of the die cutting means of FIG. The first mold punching blade 14 and the second mold punching blade 16 are individually driven and controlled in the vertical direction by control means (not shown), and the IC label (IC module) determined as good by the label inspection unit 13. 35), as shown in FIG. 3 (A), the first die cutting blade 14 is driven and descends, and the region including the IC module 35 determined to be non-defective (this is the IC label 36 after die cutting and The whole die cutting line 41 is formed and die cutting is performed. In this case, the second die cutting blade 16 is not driven.

  On the other hand, the first die cutting blade 14 is not driven for the IC label (IC module 35A) determined to be defective by the label inspection unit 13, and the second die cutting is performed as shown in FIG. The blade 16 is driven and lowered, and a rear end die-cut line 41A is formed at the rear end in the transport direction of an area that is supposed to be an IC label including the IC module 35A that is determined to be defective. As a result, a cut is formed at the position where the IC label on the peeled body 32 should be.

  That is, the label after the non-defective IC label is die-cut by forming a notch (rear end die-cut line 41A) on the rear end side in the transport direction which should be an IC label for the defective IC module 35A. The unnecessary body of the surface body 34 can be wound up. Further, the cut line formed in the peeled body 32 (rear end die-cut line 41A) is detected by the cut line detection unit 20 so that the position that should be an IC label corresponding to the IC module 35A determined as a defective product is determined. It can be surely recognized.

  Therefore, FIG. 4 shows an explanatory diagram of the label sorting in FIG. In FIG. 4A, when the IC module 35 formed on the continuous label 31 is determined to be a non-defective product by the label inspection unit 13, the entire IC label 36 is cut by the first die cutting blade 14 only. When the die cutting line 41 is formed and the label surface body 34 and the peeling body 32 are separated from the conveying rollers 18A and 18B, the non-defective IC label 36 is separated from the label surface body 34 by the whole die cutting line 41. It is conveyed while adhering to the peeling body 32. Further, the label surface body 34 from which the non-defective IC label 35 is separated becomes only the periphery of the extraction portion 42 and is wound around the unnecessary body winding portion 17 as an unnecessary body.

  On the other hand, in FIG. 4B, when the IC module 35A formed on the continuous label 31 is determined to be defective by the label inspection unit 13, it should be the IC label 35 only by the second die cutting blade 16. By cutting the rear end die wire 41 </ b> A on the rear end side, a half cut rear end die wire (cut) 41 </ b> A is formed on the peeled body 32. Then, when the label surface body 34 and the peeling body 32 are separated from the transport rollers 18A and 18B, the defective IC module 35A, which should become an IC label, together with the unnecessary body of the label base body 34, is not necessary. Rolled up. Further, the peeled body 32 from which the defective IC module 35A is separated on the label surface body 34 is conveyed in a state where the rear end die-cut line 41A is formed.

  Then, as shown in FIG. 1, the trailing edge punch line 41 </ b> A formed on the peeling body 32 is detected by the cut line detection unit 20, and the non-defective label replenishment unit 21 detects the non-defective IC at the detected position. A label 36 is affixed. As a result, the non-defective IC labels 36 are always wound on the peeling body 32 at equal intervals on the peeling body 32 to form a label roll.

  By the way, in the configuration of FIG. 1, a state where the defective IC label 36 </ b> A is removed and the rear end die-cut line 41 </ b> A is formed on the rear end side without providing the cut line detection unit 20 and the non-defective label replenishment unit 21. It is good also as a label roll. In this case, the replenishment of the good label is such that the label roll of the non-defective IC label 36 is produced by the encoding, replenishment, and inspection processes using a separate apparatus.

  Next, FIG. 5 shows another configuration explanatory view of the die cutting means, and FIG. 6 shows an operation explanatory view of the die cutting means of FIG. In the said embodiment, a die cutting means is comprised with the 1st die cutting blade 14 and the 2nd die cutting blade 16 which were juxtaposed in the conveyance direction of the continuous label 31, and the 1st receiving cylinder 15 and the 2nd receiving cylinder 17. FIG. As shown in FIG. 5 (A), the entire IC label is configured to be die-cut by the first die-cutting blade 14A and the second die-cutting blade 14B that are driven separately. is there. In this case, the first die cutting portion is constituted by the die cutting blade 14A and the single receiving cylinder 15, and the second die cutting portion is constituted by the second die cutting blade 14B and the receiving cylinder 15.

  Therefore, in FIG. 6, the first die cutting blade 14 </ b> A and the second die cutting blade 14 </ b> B are determined to be non-defective products by the label inspection unit 13, assuming that they are separately controlled in the vertical direction by control means (not shown). With respect to the IC label (IC module 35), as shown in FIG. 6 (A), the first die cutting blade 14A and the second die cutting blade 14B are driven and lowered, and the IC module 35 determined to be non-defective. The entire die cutting line 41 is formed and die-cut in a region including (this becomes the IC label 36 after die cutting). In addition, although conveyance of the continuous label 31 is performed in a stopped state, the first mold punching blade 14A and the second mold punching blade 14B may be driven simultaneously, and the first mold punching blade 14A and the second mold punching blade 14B May be continuously driven to release the die. In the case of continuous driving, immediately before the second die cutting blade 14B is driven, the continuous label 31 is transported minutely so that the die cutting lines at the boundary end portions of the first die cutting blade 14A and the second die cutting blade 14B are continuous. It can be made into a shape.

  On the other hand, as shown in FIG. 6B, the first die cutting blade 14A arranged on the upstream side in the conveying direction with respect to the IC label (IC module 35A) determined to be defective by the label inspection unit 13. Only the lower end is driven and lowered, and the rear end die-cut line 41A is formed at the rear end of the region that should be an IC label including the IC module 35A determined to be defective. A cut will be formed at the position where the IC label should be on the body 32.

  Next, FIG. 7 shows an explanatory view of a die cutting means having another configuration with respect to FIG. In the embodiment of FIG. 5 above, the die cutting means is constituted by the first die cutting blade 14A and the second die cutting blade 14B arranged in parallel in the conveying direction of the continuous label 31, and the single receiving cylinder 15. As shown in FIG. 7A, the first receiving cylinder 15A and the second receiving cylinder 15B are provided so as to be freely driven in the conveying direction of the continuous label 31 with respect to the single die cutting blade 14. It is good also as a structure. In this case, the die cutting blade 14 and the first receiving drum 15A constitute a first die cutting portion, and the die cutting portion 14 and the second receiving drum 15B constitute a second die cutting portion.

  That is, the first receiving cylinder 15A and the second receiving cylinder 15B are individually driven and controlled in the vertical direction by control means (not shown), and the IC labels (IC modules) determined as good by the label inspection unit 13 are used. 35), the die cutting blade 14 is lowered and the first die receiving cylinder 15A and the second receiving cylinder 15B are driven and raised together, as shown in FIG. In the region including the IC module 35 (this becomes the IC label 36 after die cutting), the entire die cutting line 41 is formed and die cutting is performed. The continuous label 31 is conveyed in a stopped state, but the first receiving cylinder 15A and the second receiving cylinder 15B may be driven simultaneously, and the first mold receiving cylinder 15A and the second receiving cylinder 15B are continuously connected. And may be die cut by driving.

  On the other hand, as shown in FIG. 7C, only the first receiving cylinder 15A arranged on the upstream side in the conveying direction is used for the IC label (IC module 35A) determined as defective by the label inspection unit 13. Is driven and raised, and the die cutting blade 14 is lowered, so that the die is cut only at the first receiving cylinder 15A, and an IC label including the IC module 35A determined as a defective product should be obtained. A rear end punch line 41A is formed as a cut at the rear end of the region. Also by this, a cut is formed at the position where the IC label on the peeled body 32 should be, as described above.

  Next, in FIG. 8, the schematic block diagram of other embodiment of the label manufacturing apparatus of FIG. 1 is shown. The label manufacturing apparatus 11 in FIG. 8 is the same as that in FIG. 1 up to the non-defective label replenishing unit 21, and is conveyed obliquely downward to the peeling body 32 replenished with the non-defective label refilling unit 21. A label peeling unit 24 that changes the conveyance direction at an acute angle via the roller 23 is arranged, and a peeling member winding unit 22 is arranged on the conveyance direction. In addition, a mount take-up unit 26 is disposed in which a mount 27 on which a release agent is formed from the mount supply unit 25 is conveyed in the vicinity of the label peeling unit 24 and wound. A good IC label peeled off from the label peeling part 24 is transferred onto the mount 27.

  In this embodiment, a non-defective IC label 36 is attached in place of a defective product, so that a non-defective product becomes a label roll when the peeled body 32 in a state where the non-defective IC labels 36 are arranged at equal intervals is wound as it is. In view of the fact that the cut (rear edge punching line 41A) is formed at the position where the IC label 36 is replenished, it is preferable to transfer it to a new mount 25. When the IC label 36 is peeled off from the peeling body 32 and is transferred onto the mount 27, the non-defective IC label 36 is wound on the mount 27 in a state where the IC labels 36 are arranged at equal intervals. It becomes a roll.

  In this way, it is possible to wind up the label surface body 34 which has become an unnecessary body by forming a cut on the rear end side in the transport direction with respect to the defective IC label 36A, and the cut formed in the peeling body 32. By detecting this, it is possible to reliably recognize the position of the defective IC label 36A, and it is possible to replenish the non-defective IC label with high accuracy without reducing the work efficiency.

  In the above-described embodiment, the case where the IC labels (IC modules 35) are formed in one row on the peeling body 32 has been described. However, the components for the one row are arranged for each row in the case where the labels are formed in multiple rows. Can be applied.

  The label manufacturing apparatus of the present invention can be used in industries such as manufacturing, sales, and use of apparatuses that continuously form normal labels and IC labels.

DESCRIPTION OF SYMBOLS 11 Label manufacturing apparatus 12 Continuous label supply part 13 Label inspection part 14 1st type | mold punching blade 15 1st receiving cylinder 16 2nd type | mold punching blade 17 2nd receiving cylinder 18 Conveyance roller 19 Unnecessary body winding part 20 Cutting line detection part 21 Non-defective label replenishment section 22 Stripping body winding section 31 Continuous label 32 Stripping body 33 Label adhesive layer 34 Label surface body 35 IC module 35A Defective product IC module 36 IC label 36A Defective IC label 41 Overall die-cut line 41A Rear end mold Cutout line 42

Claims (1)

A label body which is inspected to determine whether or not each label body is a non-defective product on a continuous label which is formed and conveyed in a continuous manner so that it can be peeled at least on a continuous peeling body Is a label manufacturing apparatus that winds together with unnecessary bodies that are no longer necessary for the continuous label,
Die cutting means for causing the label body, which is regarded as a non-defective product, to be die-cut as a whole label, and for the label body, which is regarded as a defective product, to be cut up to the peeling body on the rear end side in the transport direction of the label body. A label manufacturing apparatus comprising:

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