JP6679164B2 - Label manufacturing equipment - Google Patents

Description

  The present invention relates to a label manufacturing apparatus that discriminates a good product and a bad product of a label sequentially formed on a continuous base material, eliminates the defective product, and replenishes the good product.

  In recent years, when a large number of products are to be labeled, labels are formed on a continuous mount and only non-defective labels are sequentially attached to the products. Then, when only non-defective products are used as the labels formed on the continuous mount, all the formed labels are inspected, and the judged defective products are easily and surely eliminated, and the non-defective products are replenished at the excluded positions. There is a need to.

  Conventionally, various techniques have been proposed to eliminate defective labels in label manufacturing. For example, in Patent Document 1, the quality is determined by the communication state with the RFID label continuously formed on the continuous label paper, the peeling roller is rotated, or the tension adjustment mechanism and the peeling mechanism determine the defect. There is proposed an RFID label inspection device that peels the RFID label from the mount and collects it on a tray.

  Further, as a technique of eliminating defective labels without using the tension adjusting mechanism of Patent Document 1, that is, without applying tension to continuous labels, for example, in Patent Document 2, in a reader / writer, peeling paper is used. Inspect good / defective IC labels that have been pasted, then collect defective IC labels by separating them from the release paper with the defective label collection roller, and collect with the defective label collection roller. There has been proposed a label sticking apparatus that peels the collected IC label from the defective label collecting roller with a defective label collecting paper and collects it.

JP, 2006-163838, A JP 2008-114904 A

  However, in Patent Document 1, when the defective RFID label is peeled from the mount and collected in the tray, the adhesive layer of the peeled RFID label may not be transferred to the tray and reliable delivery may not be performed. There is. Further, the label sticking device proposed in Patent Document 2 does not require the tension adjusting mechanism as in Patent Document 1, but the defective label collecting roller rotates with respect to the conveyed non-defective / defective label, Since it has to be non-rotating, there is a problem that the rotation control becomes complicated, and the defective label is adhered on the entire surface to the defective label collecting roller. There is a problem that it may not be possible to deliver.

  Then, this invention is made | formed in view of the said subject, and an object of this invention is to provide the label manufacturing apparatus which delivers and collects a defective label reliably.

In order to solve the above problems, the invention of claim 1, label stamped through a universal labeled adhesive layer peeling on at least a continuous form of the release member is formed at predetermined intervals, abut respective label A label manufacturing apparatus that removes a defective label, which has been inspected as a non-defective product and is determined to be a defective product, by a defective label removing unit, wherein the defective label removing unit includes a predetermined number of One adhesive portion and a predetermined number of first non-adhesive portions are formed adjacent to each other, and the opposite side of a part of the label adhesive layer in the width direction with respect to the conveyance direction of the defective label is adhesively held by the first adhesive portion. A defective label acquisition roller to be peeled from the peeling body, and a second adhesive portion is formed on at least a position corresponding to the first non-adhesive portion of the defective label acquisition roller on all or a part of the circumferential surface in the axial direction. Contact with defective label acquisition roller Label adhesive layer side of the held the defective label configured to have a, a defective label recovery roller for recovering adhering held in the second adhesive portion.

According to the present invention, the defective label removing means in the process of manufacturing the label is provided with the defective label acquisition roller and the defective label collecting roller, and the defective label acquisition roller has a predetermined number of first adhesives on the circumferential surface in the axial direction. Part and a predetermined number of first non-adhesive portions are formed adjacent to each other, and the opposite side of a part of the label adhesive layer layer in the width direction with respect to the conveyance direction of the defective label is adhered and held by the first adhesive portion and separated from the peeling body. The defective label collecting roller is peeled off, and a second adhesive portion is formed on all or a part of the circumferential surface in the axial direction at least at a position corresponding to the first non-adhesive portion, and is adhered and held by the defective label acquisition roller. By adopting a configuration in which the label adhesive layer side of the defective label is adhered and held by the second adhesive portion and collected, a defective label acquisition roll and a defective label collection roll can be provided without providing a tension adjusting mechanism. Without a miscellaneous rotation control, reliably defective labels defective label obtaining rolls adhered held, in which can be passed reliably received bad label recovery roll.

It is a schematic block diagram of the label manufacturing apparatus which concerns on this invention. It is explanatory drawing of the defective label removal means of FIG. It is explanatory drawing of the continuous label of FIG. It is operation | movement explanatory drawing (1) of defective label removal of FIG.1 and FIG.2. FIG. 3 is an explanatory diagram (2) of the operation of removing the defective label of FIGS. 1 and 2. It is explanatory drawing (1) of another structure of the defective label removal means of FIG. It is explanatory drawing (2) of another structure of the defective label removal means of FIG. It is explanatory drawing (3) of another structure of the defective label removal means of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present embodiment, the label will be described as an IC label having a communication function such as an RFID label, but the present invention can also be applied to a print label on which predetermined information is printed, for example. Further, in the present embodiment, the case where the IC labels (IC modules) are formed on the peeling body in a single row has been described, but in the case where the IC labels (IC modules) are formed in multiple rows, the components for the single row should be arranged in each row. It can be applied by. The term "IC label" is used not only after being die-cut, but also before being die-cut, that is, as a region including an IC module which is a main element of the IC label.

  FIG. 1 shows a schematic configuration diagram of the label manufacturing apparatus according to the present invention, FIG. 2 shows an explanatory view of the defective label removing means of FIG. 1, and FIG. 3 shows an explanatory view of the continuous label of FIG. In FIG. 1, the label manufacturing apparatus 11 does not show a control means for controlling the entire apparatus, but the continuous label supply unit 12 supplies the continuous label 31 described in FIG. 13, a die-cutting means and a conveying roller 16 (16A, 16B) are arranged. The label inspection unit 13 communicates with the IC module 35, which is the main element of the IC label 36 formed on the continuous label 31, to determine whether it is a non-defective product. The quality of the continuous label 31 supplied from the continuous label supply unit 12 is preliminarily inspected in a previous step in the label manufacturing process, and when the inspection result is used, the label inspection unit 13 is not necessary.

  The die-cutting means is composed of a receiving cylinder 15 provided with the die-cutting blade 14 and the continuous label 31 sandwiched therebetween. Die cutting is performed in the peeling body 32 in a half-cut state. An unnecessary body of the label surface body 34 called a scrap after all the good and defective IC labels are separated from the transport rollers 16A and 16B and is taken up by the unnecessary body winding unit 17. On the other hand, all the good and defective IC labels die-cut on the peeling body (32) are adhered and conveyed.

  A defective label removing unit, a label detecting unit 18, and a non-defective label replenishing unit 19, which will be described later, are arranged in the conveying direction of the peeling body 32. The label detection unit 18 detects the position of the blank area where the label was present after the defective label was removed. Aside from the detection accuracy, for example, an IC label (36) that has been conveyed as a good product. Of the IC label is detected, and whether the area is a blank area or not is determined by the time when the edge of the next IC label is detected. This can be achieved by controlling so that the good quality IC label is replenished after a predetermined time from the detection of the leading edge. The non-defective item label replenishing unit 19 is for replenishing and replenishing non-defective IC labels at the positions detected by the label detecting unit 18, and an inlet pasting mechanism or the like which has been conventionally known can be applied. The description is omitted here. Then, a peeling body winding section 20 for winding the peeling body 32 having the good quality IC label replenished by the good quality label replenishing section 19 is arranged.

  By the way, in the configuration of FIG. 1, the label detecting unit 18 and the non-defective label replenishing unit 19 may be omitted and the label roll may be in a state in which the defective IC label 36A is removed. In this case, the non-defective label replenishment is to produce a label roll of the non-defective IC label 36 in the steps of encoding, replenishment, and inspection in another device.

  A label peeling unit that changes the conveying direction to an acute angle via a roller that conveys obliquely downward is arranged with respect to the peeling body 32 that has been filled with a non-defective product IC label by the non-defective label replenishing unit 19 and is located above the conveying direction. The peeling body winding section 20 is arranged on the other hand, and on the other hand, a mount winding section for arranging the mount on which the peeling agent is formed from the mount supply section to be conveyed close to the label peeling section and to be wound up is added. Alternatively, a non-defective IC label peeled off from the label peeling unit may be transferred onto the mount.

  The defective label removing means is composed of a defective label acquisition roller 26 and a defective label collecting roller 27 which are rotated at the same speed as the conveying speed of the continuous label (31), and is appropriately provided with a feed roller 28. In FIG. 2, the defective label acquisition roller 26 is movable between the continuous label 31 side and the defective label collecting roller 27 side, and, for example, on a peripheral surface in the axial direction, for example, a portion including a central region in the axial direction. A single first adhesive portion 26C is formed at the position, and first non-adhesive portions 26A and 26B are formed adjacent to both ends thereof. The defective label acquisition roller 26 moves to the continuous label side and moves the defective IC label (36A) to the label surface body (34) side which is a part of the label body side in the width direction with respect to the transport direction of the first adhesive portion. It is adhered and held at 26C, peeled off from the peeling body (32), and moved to the defective label collecting roller 27 side (driving system is omitted). The defective label acquisition roller 26 and the defective label collection roller 27 may be rotated at any time during acquisition and delivery (collection) of the defective IC label.

  The defective label collecting roller 27 is a part of the circumferential surface in the axial direction, that is, a position of an area including both ends in the axial direction, and corresponds to the first non-adhesive portions 26A and 26B of the defective label acquisition roller 26. The second adhesive portions 27A and 27B are formed at the positions, and the portion including the central region is the second non-adhesive portion 27C. The defective label collecting roller 27 bonds and holds the defective IC label (36A) adhered and held by the defective label acquisition roller 26 moved by the second adhesive portions 27A and 27B on the label adhesive layer 33 side. to recover. These operation modes will be described with reference to FIGS. 4 and 5.

Here, as shown in FIGS. 3A and 3B, the continuous label 31 is label-adhered on a continuous peeling body 32 (peeling agent 32B) in which a peeling agent 32A is formed on a peeling base 32A. An IC module 35, which is composed of an IC chip and an antenna serving as a label body, which is later die-cut into an IC label 36 through a layer 33, is formed in a continuous manner at predetermined intervals. is there. The IC module 35 communicates with the label inspection unit 13 arranged at the set distance, and determines whether it is a non-defective product. The label surface body 34 composed of the label base 34A and the adhesive layer 34B is adhered onto the IC module 35. Incidentally, as a continuous label 31, the label substrate 34A of the label surface 34, may be a label base of the units forming the IC module 35, the adhesive layer 34 B in the case of forming the etched antenna to the label base Is required, and the adhesive layer 34 B becomes unnecessary when forming a printed antenna. Regardless of whether the IC module 35 is a good product or a defective product, a die-cutting blade 41 is formed around the die-cutting blade 14 to perform die-cutting.

  Therefore, FIGS. 4 and 5 are explanatory views of the operation of removing the defective label in FIGS. 1 and 2. First, the defective label acquisition roller 26, the defective label collection roller 27, and the feed roller 28 are rotated at the same speed as the conveying speed of the continuous label (continuous peeling body 32). The feed roller 28 is rotated in the clockwise direction, the defective label acquisition roller 26 is rotated in the counterclockwise direction which is the forward direction with respect to the conveyance direction, and the defective label collecting roller 27 is rotated in the clockwise direction. Note that when the transport direction is from right to left, the rotation direction is opposite.

  The conveyed IC label on the peeling body 32 is determined to be a non-defective product by the label inspection unit 13, and the defective label acquisition roller 26 has moved to the defective label collection roller 27 side when the IC label 36 of the non-defective product passes, and the defective product concerned is defective. The label collecting roller 27 is brought into contact with the label collecting roller 27 (FIG. 4A). When passing the defective IC label 36A (FIG. 4B), the defective label acquisition roller 26 is moved to the continuous label (continuous peeling body 32) side as shown in FIG. The position of the central area portion corresponding to a part in the width direction with respect to the conveying direction of the defective IC label 36A, which is the front end portion of the label surface body 34 side which is the label main body side of 36A, is set to the first adhesive of the defective label acquisition roller 26. Bonded by the portion 26C. In this case, the first non-adhesive portions 26A and 26B of the defective label acquisition roller 26 have no adhesive portion and are in a non-adhesive state with the defective IC label 36A (label surface body 34).

  Since the adhesive force between the first adhesive portion 26C and the label surface body 34 is stronger than the adhesive force between the label adhesive layer 33 of the defective IC label 36A and the peeling body 32, as shown in FIG. The defective IC label 36A is peeled off from the peeling body 32 by the rotation of the label collecting roller 27, and after the entire peeling, as shown in FIG. 4E, the defective IC label 36A is in the length direction (conveying direction). Then, the first adhesive portion 26C is rotated in an adhesive state.

  At the timing when the tip of the defective IC label 36A, which has been adhered by the rotation of the defective label acquisition roller 26, becomes the upper side (the defective label collecting roller 27 side), the defective label collecting roller 27 is changed to the one shown in FIG. As shown in the figure, the label is moved to the defective label collecting roller 27 side, and the leading end of the defective IC label 36A comes into contact with the defective label collecting roller 27, so that the label adhesive layer 33 of the defective label 36A and the defective label collecting roller 27 are moved. 2 Adhesive parts 27A and 27B adhere. In this case, the second non-adhesive portion 27C of the defective label collecting roller 27 has no adhesive portion, and is in a non-adhesive state with the defective IC label 36A (label adhesive layer 33).

  The adhesive force between the second adhesive portions 27A and 27B and the label adhesive layer 33 is stronger than the adhesive force between the first adhesive portion 26C and the label surface body 34, and the second adhesive portions 27A and 27B are defective IC labels 36A. 5B, the defective IC label 36A is rotated by the defective label acquisition roller 26 and the defective label collecting roller 27, so that the defective IC label 36A can be adhered to the defective label acquisition roller 26 as shown in FIG. 5B. The defective IC label 36A is further peeled off, and the defective IC label 36A is collected by the defective label collecting roller 27 as shown in FIG. 5C.

  Thus, without providing the tension adjusting mechanism as in Patent Document 1, and without performing complicated rotation control of the defective label acquisition roll 26 and the defective label collection roll 27 as in Patent Document 2, the defective label acquisition roll The defective IC label 36 </ b> A can be securely adhered and held at 26 and can be reliably delivered to the defective label collecting roll 27.

  Next, FIGS. 6 to 8 show explanatory views of other configurations of the defective label removing means of FIG. In FIG. 6, the position of the adhesive portion is reversed corresponding to FIG. 2, and in the defective label acquisition roller 26, a position corresponding to a part in the width direction of the defective IC label 36A on the peripheral surface is provided. That is, the first adhesive portions 26C-1 and 26C-2 for adhering the defective IC label 36A on the label surface body 34 side are formed at the position of the area including both ends in the axial direction, and the portion including the central area is divided into the first adhesive portion 26C-1 and 26C-2. 2 Non-adhesive portion 26A.

  In the defective label collecting roller 27, for example, only the portion including the central region in the axial direction is located at a position corresponding to a part of the peripheral surface of the defective IC label 36A in the width direction with respect to the transport direction. A second adhesive portion 27A for adhering the defective IC label 36A on the label adhesive layer 33 side is formed at a position corresponding to the first non-adhesive portion 26A of the acquisition roller 26, and both end sides of the second adhesive portion 27C- are attached to the second non-adhesive portion 27C-. 1,27C-2.

  Even with the above-described configuration, the adhesive force between the first adhesive portions 26C-1 and 26C-2 of the defective label acquisition roller 26 and the label surface body 34 on the label body side of the defective IC label 36A is the defective IC. Since the adhesive force between the label adhesive layer 33 of the label 36A and the peeling body 32 is stronger, the defective IC label 36A can be peeled from the peeling body 32, and the second adhesive portion 27A of the defective label collecting roller 27 can be removed. Since the adhesive force between the defective IC label 36A and the label adhesive layer 33 is stronger than the adhesive force between the first adhesive portions 26C-1 and 26C-2 of the defective label acquisition roller 26 and the label surface body 34, the defective IC label 36A is defective. The label 36A can be peeled off from the defective label acquisition roller 26 and collected by the defective label collecting roller 27.

  7A, in the defective label acquisition roller 26, at a position corresponding to a part of the defective IC label 36A in the width direction on the circumferential surface, that is, at a position of an area including one end side in the axial direction. A first adhesive portion 26D for adhering the defective IC label 36A on the label surface body 34 side is formed, and the other portion is used as a first non-adhesive portion 26E. Although the first adhesive portion 26D and the first non-adhesive portion 26E are configured to contact the defective IC label 36A over the entire surface without providing a step, a step may be provided as shown in FIG. This also applies to the case of FIG. 8 described later.

  In the defective label collecting roller 27, the second adhesive portion 27D that adheres the defective IC label 36A on the peripheral surface to the position corresponding to the entire width direction of the defective IC label 36A with respect to the transport direction on the label adhesive layer 33 side. Is formed and no non-adhesive portion is provided.

  That is, the adhesive force between the first adhesive portion 26D of the defective label acquisition roller 26 shown in FIG. 7B and the label surface body 34 on the label body side of the defective IC label 36A is the label adhesive layer 33 of the defective IC label 36A. Since the adhesive strength between the defective IC label 36A and the peeling body 32 is stronger than the peeling body 32, the defective IC label 36A can be peeled from the peeling body 32, and the second adhesive portion 27D of the defective label collecting roller 27 shown in FIG. Since the adhesive force of the defective IC label 36A with the label adhesive layer 33 is stronger than the adhesive force between the first adhesive portion 26D of the defective label acquisition roller 26 and the label surface body 34, the first adhesive portion 26D and the second adhesive portion Even if there is no great difference in the adhesive force of the portion 27D, the defective IC label 36A is peeled from the defective label acquisition roller 26 and collected by the defective label collecting roller 27. It is those that can Rukoto.

  8A, in the defective label acquisition roller 26, at a position corresponding to a part of the defective IC label 36A in the width direction on the circumferential surface, that is, at a position of a region including both end sides in the axial direction. First adhesive portions 26D-1 and 26D-2 for adhering the defective IC label 36A on the label surface body 34 side are formed, and a portion including the central region is used as a second non-adhesive portion 26E.

  In the defective label collecting roller 27, the second adhesive portion 27D that adheres the defective IC label 36A on the peripheral surface to the position corresponding to the entire width direction of the defective IC label 36A with respect to the transport direction on the label adhesive layer 33 side. Is formed and no non-adhesive portion is provided.

  That is, the adhesive force between the first adhesive portions 26D-1 and 26D-2 of the defective label acquisition roller 26 and the label surface body 34 on the label body side of the defective IC label 36A is the same as that of the label adhesive layer 33 of the defective IC label 36A. Since the adhesive strength with the peeling body 32 is stronger, the defective IC label 36A can be peeled from the peeling body 32, and the second adhesive portion 27D of the defective label collecting roller 27 and the label adhesive layer of the defective IC label 36A. Since the adhesive force with 33 is stronger than the adhesive force between the first adhesive portions 26D-1 and 26D-2 of the defective label acquisition roller 26 and the label surface body 34, the defective IC label 36A is changed to the defective label acquisition roller 26. The defective label can be further separated and collected by the defective label collecting roller 27.

  8B shows, in the defective label acquisition roller 26, a position corresponding to a part in the width direction of the defective IC label 36A on the peripheral surface, that is, a position of the region including both end sides in the axial direction and a central region. The first adhesive portions 26D-1, 26D-2, 26D-3 for adhering the defective IC label 36A on the label surface body 34 side are formed at positions including the second non-adhesive portion 26E-. As 1 and 26E-2, the first adhesive portions 26D-1, 26D-2, and 26D-3 are striped.

  In the defective label collecting roller 27, the second adhesive portion 27D that adheres the defective IC label 36A on the peripheral surface to the position corresponding to the entire width direction of the defective IC label 36A with respect to the transport direction on the label adhesive layer 33 side. Is formed and no non-adhesive portion is provided.

  That is, the adhesive force between the first adhesive portions 26D-1, 26D-2, 26D-3 of the defective label acquisition roller 26 and the label surface body 34 on the label body side of the defective IC label 36A is the label of the defective IC label 36A. Since the adhesive force between the adhesive layer 33 and the peeling body 32 is stronger, the defective IC label 36A can be peeled from the peeling body 32, and the second adhesive portion 27D and the defective IC label 36A in the defective label collecting roller 27 can be peeled off. Has a stronger adhesive force with the label adhesive layer 33 than the adhesive force between the first adhesive portions 26D-1, 26D-2, 26D-3 of the defective label acquisition roller 26 and the label surface body 34, the defective IC concerned. The label 36A can be peeled off from the defective label acquisition roller 26 and collected by the defective label collecting roller 27.

  By the way, in the above-described embodiment, the defective label acquisition roller 26 is movable. However, as another embodiment, the defective label acquisition roller 26 and the defective label collection roller 27 are brought into contact with each other and are conveyed on the feed roller 28. It is also possible to move the continuous label side to the defective label acquisition roller 26 side. That is, when the non-defective IC label 36 is passed, the continuous label is placed in a non-contact position with the defective label acquisition roller 26, and when the defective IC label 26A is passed, the continuous label is moved and brought into contact with the defective label acquisition roller 26. Then, the defective IC label 36A is acquired by the defective label acquisition roller 26. As a means for moving the continuous label, for example, guide rollers are arranged on the upstream side and the downstream side of the feed roller 28 and on the IC label 36 side, and the feed roller 28 and each guide roller are driven to move. Can be realized by

  INDUSTRIAL APPLICABILITY The label manufacturing apparatus of the present invention can be used in industries such as manufacture, sale, and use of apparatuses for continuously forming normal labels and IC labels.

11 Label Manufacturing Equipment 12 Continuous Label Supplying Section 13 Label Inspecting Section 14 Die-Cutting Means 15 Receiving Cylinder 16 Conveying Roller 17 Unwanted Body Winding Section 18 Label Detecting Section 19 Good Label Replenishing Section 20 Peeling Body Winding Section 26 Bad Label Acquiring Roller 26A , 26B First non-adhesive portion 26C, 26D First adhesive portion 26E First non-adhesive portion 27 Bad label collecting roller 27A, 27B Second adhesive portion 27C Second non-adhesive portion 27D Second adhesive portion 28 Feed roller 31 Continuous label 32 Peeling body 33 Label adhesive layer 34 Label surface body 35 IC module 35A Defective IC la module 36 IC label 36A Defective IC label 41 Die-cut line

Claims (1)

At least label stamped with freely through the label adhesive layer peeling on the continuous form of the release member is formed at a predetermined interval, those respective labels are determined to be good or whether the defective is inspected A label manufacturing apparatus for removing a defective label by a defective label removing unit,
The defective label removing means is
A predetermined number of first adhesive portions and a predetermined number of first non-adhesive portions are formed adjacent to each other on the circumferential surface on the axial direction, and the opposite side of a part of the label adhesive layer in the width direction with respect to the conveying direction of the defective label is formed. A defective label acquisition roller that is adhered and held by the first adhesive portion and is peeled off from the peeling body;
A second adhesive portion is formed at least in a position corresponding to the first non-adhesive portion of the defective label acquisition roller on all or part of the circumferential surface in the axial direction, and the defect is adhesively held by the defective label acquisition roller. A defective label collecting roller for collecting and holding the label adhesive layer side of the label with the second adhesive portion.
A label manufacturing apparatus comprising:

Images