JP2017169790A - Adhesive electrode and body surface potential measuring device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive electrode and body surface potential measuring device which can acquire accurate biosignal, keep excellent adhesiveness even against the irregular and complicated shape like the body surface for a long time or during exercise too and has no risk such as discomfort or rash while it is attached.SOLUTION: The biological body surface potential acquisition adhesive electrode has an adhesive electrode layer consisting of conductive adhesive including a hydrophobic adhesive binder and conductive particulates.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an adhesive electrode that is attached to the surface of a living body and acquires and measures the body surface potential, and a device for measuring the body surface potential of the living body.

Potentials appearing on the body surface such as an electrocardiogram, electromyogram and electroencephalogram are used as an important index for medical treatment. These body surface potential measuring devices for measuring the body surface potential include a biological electrode and an electronic circuit including an amplifier that amplifies a signal taken in from the biological electrode. In recent years, from the viewpoints of home medical care, health care, nursing care, and QOL (Quality Of Life), a body surface potential measuring device capable of constantly measuring body surface potential has been demanded. A service for determining the health condition of a person to be measured from a signal acquired by a body surface potential measuring device and presenting advice for diagnosing a disease or promoting health has been studied. In addition, use as an interface between a human and a machine that operates a machine by converting a signal acquired by a body surface potential measuring device into a command is also being studied.
Such a body surface potential measuring device needs to be able to acquire an accurate signal even when the measurement target is operating and to be able to be worn for a long time.

Patent Document 1 discloses a bioelectrode having an electrode head and an adhesive pad that is detachably attached to the electrode head. This bioelectrode can be fixed to a measurement object with an adhesive pad.
In Patent Document 1, the adhesive pad is composed of hydrogel or silicone gel. However, hydrogel cannot be worn for a long time because electrolytes or the like may elute due to sweat or may cause sticky discomfort or rash. . In the case of silicone gel, there is no problem of elution of components due to sweat because it is hydrophobic. However, in general, if it is insulative, it is disclosed how to make it conductive. Is undisclosed and therefore it is not clear how conductive it is.

Patent Document 2 discloses an electrical connector with a conductive adhesive layer that has an electrical connector and a conductive adhesive layer formed thereon and is easy to temporarily fix to an electrical joint. However, what is supposed to be fixed is an electrical joint having a flat surface, such as an OA device, and not a body surface of a living body.
In addition, Patent Document 2 does not mention the conductivity of the conductive adhesive layer, but has a conductivity that can be used as an electrode in view of a configuration having an electrical connector separately. I can't think of it.

  Non-Patent Document 1 discloses a necklace type electrocardiograph. The necklace type that is easy to carry reduces the sense of resistance to measurement at all times. However, since the casing is large and hard, there is an uncomfortable feeling during wearing. In addition, the device is sandwiched between the body and the ground when lying down, causing pain and is not suitable for measurement during sleep. In addition, since a general bioelectrode formed of a hydrophilic conductive gel is used, the gel is melted by perspiration, resulting in sticky discomfort and rash, and cannot be used for a long time.

  Patent Document 3 discloses a biological electrode in which clothes and electrodes are integrated. The clothes worn on a daily basis have a function of a bioelectrode and can be worn for a long time. However, there is a problem that an accurate signal cannot be acquired because the clothes are not in close contact with the skin, and that a signal at a correct position cannot be acquired because the clothes are displaced when the measurement target is operated.

  Patent Document 4 discloses a body surface potential measuring device for controlling a prosthetic hand. However, a method for wearing for a long time is not disclosed and cannot be used for a long time.

  Patent Document 5 discloses a body surface potential measuring device in which a myoelectric sensor, a signal processing unit, a wireless tag communication unit, and an antenna coil are provided on a flexible sheet that can be freely deformed along the skin surface. ing. However, it is very difficult to mount an electronic component on a flexible sheet, and since Patent Document 5 does not disclose a specific configuration and manufacturing method, such a body surface potential measuring device is not provided. It cannot be manufactured.

  Patent Document 6 discloses a bioelectrode having an electrode sheet and a conductive pressure-sensitive adhesive layer containing conductive particles in a pressure-sensitive adhesive laminated on one surface thereof. Patent Document 6 does not mention the conductivity of the conductive adhesive layer, but it is usually difficult to obtain high conductivity simply by mixing conductive particles into an insulating adhesive, and a separate electrode is required. Considering the configuration of having a sheet, it cannot be considered that the sheet itself has sufficient conductivity to be used as an electrode.

  Non-Patent Document 2 discloses an electromyograph made of a thin film transistor, which can realize a body surface potential measuring device having a myoelectric sensor on a flexible sheet. Since a stable organic thin film transistor is used, it cannot be operated continuously for a long time. Further, since a very thin film is used as a base material in order to obtain flexibility, there is a problem that durability is low and the film is broken in a short period of time.

JP 2010-246751 A JP 2004-79278 A Japanese Patent Laying-Open No. 2015-83045 JP 2001-231798 A JP 2007-125104 A Japanese Unexamined Patent Publication No. 2016-30021

2011. J. et al. Penders, M.M. Altini, J .; van de Molengraft, F.M. Yazicioglu, C.I. Van Hoof, A Low-power wireless ECG necklace for cardiac activity monitoring on-the-move, Invited paper for EMBC 2011 T.A. Somea, 1 μm-Thickness 64--Channel Surface Electrogram Measurement Measurement Sheet 2 V Organic Transformer For Censitor Intense Control Control IE IE

  The problem to be solved by the present invention is that an accurate biological signal can be obtained, and it is worn while maintaining good adhesiveness even for a long time or during exercise, even for a complex shape with irregularities such as a body surface. It is to provide an adhesive electrode and a body surface potential measuring device without the risk of unpleasantness and rash at times.

  As a result of intensive studies to solve the above problems, the present inventor has found that the adhesive layer formed by the conductive adhesive containing the conductive fine particles and the hydrophobic adhesive binder has a risk of discomfort and rash during wearing. Less, and surprisingly, by adjusting the particle size and amount of the conductive fine particles, the resistance can be reduced to such an extent that it can be used as an electrode. It was found to have high conductivity. And when such an adhesion layer was used as an electrode, it discovered that strong adhesive force and the high adhering force to the biological body surface were obtained, and completed this invention.

That is, the present invention is as follows.
[1] A living body surface potential acquiring adhesive electrode having an adhesive electrode layer made of a conductive adhesive containing a hydrophobic adhesive binder and conductive fine particles.
[2] The adhesive electrode according to [1], wherein the adhesive electrode layer has a thickness of 100 μm or more and 1 mm or less.
[3] The adhesive electrode according to [1] or [2], wherein an average secondary particle diameter of the conductive fine particles is 50 μm or more and 1 mm or less.
[4] The adhesive electrode according to any one of [1] to [3], wherein the hydrophobic adhesive binder is a silicone-based adhesive.
[5] The adhesive electrode according to any one of [1] to [4], wherein the content of the hydrophilic material in the conductive adhesive is 5% by mass or less.
[6] The conductive fine particles according to any one of [1] to [5], wherein the conductive fine particles are contained in an amount of 10 parts by mass or more and 650 parts by mass or less with respect to 100 parts by mass of the solid content of the hydrophobic adhesive binder. Adhesive electrode.
[7] An array electrode having two or more adhesive electrodes according to any one of [1] to [6] on one substrate.
[8] A body surface potential measuring device comprising the adhesive electrode according to any one of [1] to [6] or the array electrode according to [7].
[9] A myoelectric actuator including the body surface potential measuring device according to [8].

  According to the adhesive electrode of the present invention, it is possible to acquire a biological signal with almost no discomfort or rash at the time of wearing. Moreover, since the adhesive electrode of this invention has strong adhesive force, it can be fixed to the body surface for a long time. Furthermore, since the adhesive electrode of the present invention can follow a complex shape with irregularities such as the surface of the body and can obtain good adhesion to the skin, it can acquire an accurate biological signal over a long period of time. Can do. Therefore, if the body surface potential measuring device having the adhesive electrode of the present invention is used, the body surface potential can always be measured.

It is the schematic which shows the specific example of the cross-section of the adhesive electrode of this embodiment. It is a figure which shows the specific example of the arrangement | positioning, when providing a nonelectroconductive adhesive part in the adhesive electrode of this embodiment. It is a figure which shows the specific example of the architecture of the electronic circuit contained in the body surface potential measuring device of this embodiment. It is a figure which shows an example of the layer structure of the thin-film transistor which can be used for the electronic circuit contained in the body surface potential measuring device of this embodiment. It is a figure which shows the specific example of arrangement | positioning of a sensor, an analog front end, and another electronic circuit in the body surface potential measuring device of this embodiment. It is a figure which shows the specific example of the connection structure of a sensor and an analog front end in the body surface potential measuring device of this embodiment. It is a figure which shows the specific example of the connection structure of a sensor and an analog front end in the body surface potential measuring device of this embodiment. It is a figure which shows the specific example of the connection structure of a sensor and an analog front end in the body surface potential measuring device of this embodiment. It is a figure which shows the specific example of the wiring for obtaining electrical connection between an adhesive electrode and an electronic circuit in the body surface potential measuring device of this embodiment. In the body surface potential measuring device of this embodiment, it is a figure which shows the specific example of the structure at the time of integrating an adhesive electrode, a base material, and an electronic circuit. In the body surface potential measuring device of this embodiment, it is a figure which shows the specific example of arrangement | positioning of an electronic circuit, the electrode for a measurement, and a base material when it has two or more electrodes for a measurement. It is a figure which shows an example of the circuit structure of the body surface potential measurement device of this embodiment. It is a figure which shows an example of a structure of the body surface potential measuring device (electrocardiograph) of this embodiment. It is a figure which shows an example of the operation | movement flow of the myoelectric actuator using the body surface potential measuring device of this embodiment. It is a figure which shows an example of a structure of the myoelectric actuator using the body surface potential measuring device of this embodiment. It is a figure which shows the waveform obtained by the electrocardiograph of Example 31.

  Hereinafter, modes for carrying out the present invention (hereinafter referred to as “the present embodiment”) will be described in detail below. In addition, this invention is not limited to the following embodiment, It can implement by changing variously within the range of the summary.

  The biological body surface potential acquisition electrode of this embodiment has an adhesive electrode layer formed of a conductive adhesive, and the conductive adhesive contains a hydrophobic adhesive binder and conductive fine particles.

[Hydrophobic adhesive binder]
In this embodiment, the conductive adhesive contains a hydrophobic adhesive binder.
There is no limitation in the hydrophobic adhesive binder, and for example, a (meth) acrylic adhesive, a urethane adhesive, a synthetic rubber adhesive, a natural rubber adhesive, or a silicone adhesive can be used. In particular, the silicone-based pressure-sensitive adhesive can be suitably used from the viewpoint of a feeling of mounting on a living body. These can be used alone or in combination.
As the degree of hydrophobicity, the solubility in water at 25 ° C. is preferably 10 g / 100 ml or less, more preferably 1 g / 100 ml or less, and further preferably 0.1 g / 100 ml or less.
A diluent may be added to the hydrophobic adhesive binder. The diluent is not particularly limited as long as it is compatible with the hydrophobic adhesive binder, and water, alcohol, organic solvent and the like can be used.

  Examples of the (meth) acrylic pressure-sensitive adhesive include those containing an acrylic polymer and / or an acrylic monomer, and may further contain additives such as a tackifier and a crosslinking agent.

As the acrylic polymer, for example, an acrylic polymer obtained by polymerizing a monomer component containing a (meth) acrylate monomer having an alkyl group having 1 to 24 carbon atoms can be used.
Examples of the (meth) acrylate having an alkyl group having 1 to 24 carbon atoms include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, and n-butyl (meth) ) Acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, n-hexyl (meth) acrylate, cyclohexyl (meth) acrylate, n-octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) ) Acrylate, t-butylcyclohexyl (meth) acrylate, n-decyl (meth) acrylate, n-undecyl (meth) acrylate, n-dodecyl (meth) acrylate, n-tridecyl (meth) acrylate, n-tetradecyl ( Acrylate), n-pentadecyl (meth) acrylate, n-hexadecyl (meth) acrylate, n-heptadecyl (meth) acrylate, n-octadecyl (meth) acrylate, icosyl (meth) acrylate, heicosyl (meth) acrylate, docosyl ( A (meth) acrylate, a tricosyl (meth) acrylate, a tetracosyl (meth) acrylate, etc. can be used. These (meth) acrylates may be used alone or in combination.
The carbon number of the alkyl group of the (meth) acrylate having an alkyl group having 1 to 24 carbon atoms is preferably 4 or more, more preferably 6 or more, further preferably 14 or more, It is preferably 22 or less, more preferably 20 or less, and even more preferably 18 or less. If the number of carbon atoms is 4 or more, high hydrophobicity can be obtained, and elution of the adhesive due to sweat can be prevented. If it is 6 or more, high adhesiveness can be obtained, and if it is 14 or more, hydrocarbon-based. Manufacture is easy because it is easily dissolved in a solvent. Further, if the number of carbon atoms is 22 or less, sufficient solubility is obtained and the production becomes easy. If the number of carbon atoms is 20 or less, the polymerization reaction is easily controlled and the production becomes easy. be able to.
There is no limitation on the structure of the alkyl group of the (meth) acrylate having an alkyl group having 1 to 24 carbon atoms, and a linear structure and a branched structure can be taken. In particular, a (meth) acrylate having an alkyl group having a branched structure can be preferably used because it has high solubility and can be easily produced.
The content of the (meth) acrylate having an alkyl group having 1 to 24 carbon atoms relative to the total amount of monomer components used in the production of the acrylic polymer is preferably in the range of 80% by mass to 99% by mass, A range of 90% by mass to 95% by mass is more preferable.

As a monomer component that can be used in the production of the acrylic polymer, a highly polar vinyl monomer may be used in addition to those described above. By using a highly polar vinyl monomer, it becomes easy to produce an acrylic polymer, and the tackiness can be further improved.
As the highly polar vinyl monomer, a vinyl monomer having a carboxy group, a vinyl monomer having a hydroxyl group, and a vinyl monomer having an amino group can be used. Only one kind of these vinyl monomers may be used, or a plurality of kinds may be used.
The content of the highly polar vinyl monomer with respect to the total amount of monomer components used for the production of the acrylic polymer is preferably 0.01% by mass or more, and preferably 10% by mass or less. % Or less is more preferable, and 1 mass% or less is further preferable. If it is 10% by mass or less, elution of the adhesive due to sweat can be prevented, and if it is 5% by mass or less, the tackiness can be adjusted to a suitable range. If it is 1% by mass or less, the hydrophobic monomer And sufficient compatibility is obtained, so that the production becomes easy.

As the silicone-based pressure-sensitive adhesive, a pressure-sensitive adhesive containing a compound having a structure represented by the following composition formula (1) in at least a part of the molecule is preferable.
R _a SiO _(4-a) (1)
R represents the same or different substituents, and a is a positive number of 1 to 3. As a specific structure of the composition formula (1), for example, a structure represented by the following (Chemical Formula 1) can be given.

(Chemical formula 1)

Here, as R, for example, hydrogen, halogen, nitro group, alkyl group (for example, alkyl group such as methyl group, ethyl group, propyl group, isopropyl group, normal butyl group, tertiary butyl group, hexyl group, octyl group, etc.) Cycloalkyl group such as cyclohexyl group), cyano group, aryl group (for example, phenyl group, naphthyl group, thienyl group, etc.), haloaryl group (for example, pentafluorophenyl group, 3-fluorophenyl group, 3,4,5- Trifluorophenyl group, etc.), alkenyl group (for example, vinyl group, butenyl group, pentenyl group, hexenyl group, heptenyl group, octenyl group, (meth) acryl group, etc.), alkynyl group, amide group, acyl group, alkylcarbonyl group, A carboxy group, an alkoxy group (such as a methoxy group), an aryloxy group ( For example, phenoxy group, naphthyl group, etc.), haloalkyl group (eg, perfluoroalkyl group, etc.), thiocyano group, alkylsulfonyl group, sulfonamido group, amino group, alkylamino group (eg, methylamino group), dialkylamino group (eg, A dimethylamino group, a diethylamino group, etc.), a hydroxyl group, etc. can be used.
Among these, as R, a methyl group or a phenyl group can be preferably used. In particular, when R is a phenyl group, the heat resistance of the pressure-sensitive adhesive is improved, which is preferable.

As the silicone-based adhesive, for example, an addition-curable silicone-based adhesive, a condensation-curable silicone-based adhesive, and a radical-curable silicone-based adhesive can be used. In particular, the addition curable silicone pressure-sensitive adhesive and the radical curable silicone pressure-sensitive adhesive are preferable because the raw material does not have a leaving group and a by-product is not generated by a curing reaction. A platinum-based catalyst can be used as the curing catalyst, and in this case, an adhesive having higher biocompatibility can be formed.
The addition curable silicone pressure-sensitive adhesive, the condensation curable silicone pressure-sensitive adhesive, and the radical curable silicone pressure-sensitive adhesive can be used alone or in combination.

The addition-curable silicone pressure-sensitive adhesive preferably contains a compound having an alkenyl group, a hydrosilane compound, and a platinum catalyst, and may further contain other additives.
As other additives, a crosslinking agent, an adhesion improver, an adhesion reducing agent, a curing accelerator, a curing retarder, a diluent and the like can be used.

As the compound having an alkenyl group, a compound partially having the structure of the composition formula (1) and a part of R being an alkenyl group or containing an alkenyl group can be used.
The compound having an alkenyl group preferably has two or more alkenyl groups in one molecule. The position of the alkenyl group is not particularly limited, and may be at the molecular end or in the side chain.
Specific examples of the compound having an alkenyl group include, for example, a trimethylsiloxy group-capped dimethylsiloxane / methylvinylsiloxane copolymer, a molecular chain both-end trimethylsiloxy group-capped methylvinylpolysiloxane, a molecular chain both-end trimethylsiloxy. Blocked methylvinylsiloxane / diphenylsiloxane copolymer, both ends of molecular chain trimethylsiloxy group-blocked dimethylsiloxane / methylvinylsiloxane / diphenylsiloxane copolymer, both ends of molecular chain dimethylvinylsiloxy-blocked dimethylpolysiloxane, both ends of molecular chain Dimethylvinylsiloxy group-capped methylvinylpolysiloxane, molecular chain both ends dimethylvinylsiloxy group-capped methylphenylpolysiloxane, molecular chain both ends dimethylvinylsiloxy group-capped dimethylsiloxane Tyrvinylsiloxane copolymer, dimethylvinylsiloxy group-blocked dimethylvinylsiloxy group copolymer at both ends of the molecular chain, dimethylvinylsiloxy group-blocked dimethylsiloxane-diphenylsiloxane copolymer at both ends of the molecular chain, silanol group at both ends of the molecular chain Blocked dimethylsiloxane / methylvinylsiloxane copolymer, molecular chain both ends silanol-blocked dimethylsiloxane / diphenylsiloxane copolymer, molecular chain both ends silanol-blocked methylvinylpolysiloxane, molecular chain both ends silanol-blocked dimethylsiloxane / methyl Examples thereof include vinyl siloxane / methyl phenyl siloxane copolymer.
As the compound having an alkenyl group, one kind may be used alone, or a plurality of kinds having different molecular weights and molecular structures may be mixed and used.

The hydrosilane compound is a compound having at least one Si—H structure in the molecule, and in the present embodiment, it is particularly preferable to have two or more Si—H structures in one molecule.
The hydrosilane compound may further have a structure partially represented by the composition formula (1).
A hydrosilane compound may be used individually by 1 type, and may mix and use multiple types from which molecular weight and molecular structure differ.

As a platinum-type catalyst, metal platinum and a platinum compound can be used, for example. Specific examples include chloroplatinic acid, a complex of chloroplatinic acid and an olefin, a complex of chloroplatinic acid and vinylsiloxane, and the like.
The addition amount of the platinum-based catalyst is preferably 1 to 5,000 ppm, more preferably 5 to 2,000 ppm, based on the total amount of the alkenyl group-containing compound and the hydrosilane compound. If the amount added is less than 1 ppm, the crosslink density may be low and the cohesive strength may be reduced. become.

As the radical curable silicone pressure-sensitive adhesive, a compound containing an alkenyl group-containing compound, a polysiloxane compound, and a radical generator is preferable, and may further contain other additives.
As other additives, a crosslinking agent, an adhesion improver, an adhesion reducing agent, a curing accelerator, a curing retarder, a diluent and the like can be used.

As the compound having an alkenyl group, the same compound as the compound having an alkenyl group contained in the addition-curable silicone pressure-sensitive adhesive can be used.
As the polysiloxane compound, for example, a compound having a structure represented by the composition formula (1) in at least a part of the molecule and having no aliphatic unsaturated bond substituent may be used. it can. Here, examples of the substituent having an aliphatic unsaturated bond include an alkenyl group and an alkynyl group.

As the radical generator, for example, an organic peroxide, an azo compound, a photo radical generator, or the like can be used.
The organic peroxide is a compound having a —O—O— bond, and specific examples thereof include benzoyl peroxide, cumyl peroxide, t-butylcumyl peroxide, t-butyl peroxide, 2,4-dichlorobenzoyl peroxide. , Peroxide t-butyl isobutyrate, peroxide t-butyl benzoate, peroxide t-butyl-2-ethyl hexalate, 2,2-bis peroxide t-butyl octane, 1,1-bis peroxide t- Examples thereof include butylcyclohexane and 2,5-dimethyl-2,5-diperoxybenzoylhexane.
Specific examples of the azo compound include 2,2′-Azobis (isobutyronitrile), 2,2′-Azobis (2,4-dimethylvaleronitrile), 2,2-Azobis (2-methylbutyronitrile), 4,4′- Azobis (4-cyanovalic acid), 2,2′-Azobis (2-methylpropionamide) Dihydrochloride, Dimethyl 2,2′-Azobis (2-methylpropionate) and the like can be used.
Specific examples of the photo radical generator include acetophenone, p-anisyl, benzyl, benzoin, benzophenone, 2-benzoylbenzoic acid, 4,4′-bis (diethylamino) benzophenone, 4,4′-bis (dimethylamino). ) Benzophenone, benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin ethyl ether, 4-benzoylbenzoic acid, 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenyl- 1,2′-biimidazole, methyl 2-benzoylbenzoate, 2- (1,3-benzodioxol-5-yl) -4,6-bis (trichloromethyl) -1,3,5-triazine, 2 -Benzyl-2- (dimethylamino) -4'-morpholinobutyrophenone, 4, 4′-dichlorobenzophenone, 2,2′-diethoxyacetophenone, 2,2′-dimethoxy-2-phenylacetophenone, 2,4-diethylthioxanthen-9-one, diphenyl (2,4,6-trimethyl) Benzoyl) phosphine oxide, 1,4-dibenzoylbenzene, 2-ethylanthraquinone, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methylpropiophenone, 2-hydroxy-4 ′-(methylthio) -2- Morpholinopropiophenone, 2-isonitrosopropiophenone, 2-phenyl-2- (p-toluenesulfonyloxy) acetophenone, phenylbis (2,4,6-trimethylbenzoyl) phosphine oxide, and the like can be used.
Other radical generators include ammonium persulfate, sodium persulfate, potassium persulfate, iron chloride, potassium permanganate, hydrogen peroxide, copper perchlorate, and organic acid iron (III). Further, a combination of an oxidizing agent and a reducing agent such as hydrogen peroxide and iron (II) salt, persulfate and sodium bisulfite may be used.

A commercially available product can be used as the silicone-based pressure-sensitive adhesive. For example, SD4580PSA, SD4584PSA, SD4587PSA, SD4587LPSA, SD4560PSA, SD4570PSA, SD4600FCPSA, SD4593PSA, DC7651ADHESIVE, DC7652ADHESIVE, SH4280PSA, R130-K, Shin-Etsu Chemical Co., Ltd. 3700, KR-3701, X-40-3237-1, X-40-3240, X-40-3291-1, KR-3704, X-40-3323, X-40-3270-1, X-40- 3306, PSA610-SM, YR3286, YR3340, etc. manufactured by MOMENTIVE can be used.
These commercially available products include those of two-component curing type, but the catalyst added may be mixed with materials specified by each company, or the above platinum-based catalyst and radical generator may be used.

[Conductive fine particles]
In the present embodiment, the conductive fine particles contained in the conductive pressure-sensitive adhesive are not limited, for example, gold, silver, copper, nickel, aluminum, titanium, vanadium, chromium, manganese, iron, cobalt, zinc, niobium, molybdenum, Fine particles composed of metals such as palladium, cadmium, indium, tin, antimony, lanthanum, tantalum, tungsten, platinum, lead, and oxides, nitrides, and salts of these metals; carbon such as carbon, graphite, fullerene, carbon nanotubes, and graphene Fine particles composed of materials; and π-conjugated molecules such as polythiophene, polyaniline, polypyrrole, polyacetylene, and polyphenylene vinylene; and powders composed of π-conjugated molecules such as PEDOT / PSS and a dopant can be used. In particular, fine metal particles are preferable because of their high conductivity, and copper, silver, and gold are particularly preferable because of their high conductivity and high conductivity even when mixed with organic substances.
As the metal fine particles, a metal composed of one element can be used, an alloy composed of a plurality of kinds of metals can be used, or fine particles having a core / shell structure in which the metal composed of the core and the shell is different. You can also. Specifically, as the core / shell structure, inexpensive materials such as copper, aluminum, nickel, aluminum oxide, glass, and hollow glass can be suitably used for the core, and high conductivity such as silver and gold can be used for the shell. A structure using a material can be preferably used.
The conductive fine particles may be solid particles or hollow particles.

In the present embodiment, the average secondary particle diameter of the conductive fine particles is preferably 50 μm or more, more preferably 100 μm or more, further preferably 200 μm or more, and 1 mm or less. preferable. According to the study of the present inventor, when the average secondary particle diameter of the conductive fine particles is 50 μm or more, the adhesive electrode layer has high planar conductivity, and when it is 100 μm or more, the vertical direction is high. It has been found that it has conductivity. In particular, when it is 200 μm or more, even if the content of the conductive fine particles in the adhesive electrode layer is not high, it has high conductivity. However, when the thickness is 1 mm or more, discomfort occurs when the adhesive electrode layer is attached to the living body due to the unevenness of the conductive particles. From that point, it is preferable to set the thickness to 1 mm or less.
Although there is no restriction | limiting in particular as a shape of electroconductive fine particles, For example, a spherical shape, a polyhedron, a fiber, an angle | corner, flakes, a needle etc. are mentioned.
Here, the average secondary particle diameter is an average particle diameter of an aggregate (secondary particle) formed by collecting a plurality of primary particles. The average secondary particle diameter of the fine particles can be measured by, for example, a scanning electron microscope or an optical microscope. Here, the particle diameter means the diameter for a spherical material, the fiber length for a fiber-like material, and the other materials that can be drawn in the cross section. The length of a long straight line.

[Conductive adhesive]
In the present embodiment, the conductive pressure-sensitive adhesive contains the hydrophobic pressure-sensitive adhesive binder and the conductive fine particles, and may further contain additives in order to adjust various properties. Examples of the additive include a dispersant, a surfactant, a pH adjuster, and a solvent.
In the present embodiment, the content of the conductive fine particles in the conductive pressure-sensitive adhesive is preferably 10 parts by mass or more and 100 parts by mass or more with respect to 100 parts by mass of the solid content of the hydrophobic adhesive binder. Is more preferably 150 parts by mass or more, preferably 650 parts by mass or less, more preferably 350 parts by mass or less, and further preferably 280 parts by mass or less. If it is 10 parts by mass or more, the adhesive can exhibit sufficient conductivity for use as an electrode, and if it is 100 parts by mass or more, the resistance value of the adhesive is lower than the resistance value of the skin, and there is less noise. Measurement is possible, and if it is 150 parts by mass or more, the resistance value of the adhesive electrode becomes so small that the resistance value of the adhesive electrode can be ignored. Moreover, if it is 650 mass parts or less, the adhesiveness of the grade which can be measured when a measuring object is a stationary state can be obtained, and if it is 350 mass parts or less, adhesiveness is maintained for a long time, and 280 masses. If it is less than or equal to the part, it is possible to obtain adhesiveness that enables measurement even when the measurement object is in motion.

  In the present embodiment, the conductive pressure-sensitive adhesive can be produced by mixing a hydrophobic pressure-sensitive adhesive binder, conductive fine particles, and additives that are added as necessary. Examples of the mixing method include an ultrasonic method, a mixer method, a rotation / revolution mixer method, a three-roll method, a two-roll method, and the like. Attritor, Banbury mixer, paint shaker, kneader, homogenizer, ball mill , Bead mill, sand mill, jet mill and the like.

[Adhesive electrode]
In this embodiment, the adhesive electrode has an adhesive electrode layer formed of a conductive adhesive.
The adhesive electrode layer can be formed, for example, by applying a conductive adhesive and performing processes such as application, molding, drying, heat curing, photocuring, and wet processing.
The structure of the adhesive electrode is not limited. For example, as illustrated in FIG. 1, the adhesive electrode layer may consist of only the adhesive electrode layer ((a)), or the adhesive formed on the substrate and the substrate. It may consist of an electrode layer ((b)), and may further have a conductor part between the adhesive electrode layer and the substrate ((c)).
An adhesive electrode having a base material is preferable because it is easy to handle, and an adhesive electrode having a conductive base material or an adhesive electrode having a conductor portion between the base material and the adhesive electrode layer is a noise source. This is particularly preferable because a small amount of measurement is possible.
The substrate is not particularly limited as long as it can support the adhesive electrode layer, and may or may not have conductivity, and an organic material, an inorganic material, or an organic-inorganic composite material may be used. it can. Specific examples of organic materials include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), cycloolefin polymer (COP), polyimide (PI), silicone, paper phenol, paper epoxy, and Teflon (registered trademark). ), Etc. can be used. In particular, PET and PEN are available at low cost, and are significant and preferable from the viewpoint of business. As the inorganic material, alumina, ceramics, composite, glass, thin film glass, metal foil, or the like can be used. As the organic-inorganic composite material, for example, glass epoxy, glass composite, an organic material in which an inorganic filler is dispersed, an organic material whose surface is coated with an inorganic layer, and the like can be used. Examples of the inorganic layer coating method include a sol-gel method, a vapor deposition method, a sputtering method, a CVD (Chemical Vapor Deposition) method, and an ALD (Atomic Layer Deposition) method. As a base material, it is preferable that it is flexible (it has flexibility) from a viewpoint of mounting | wearing feeling, Specifically, PET, PEN, PC, COP, PI, silicone, Teflon (trademark), thin film glass, It is preferable to use a metal foil, an organic material in which an inorganic filler is dispersed, and an organic material whose surface is coated with an inorganic layer. In particular, PET and PEN are preferable because they are available at low cost, and PI is preferable because soldering is possible.
Although there is no restriction | limiting in particular in the thickness of a base material, It is preferable that it is 1 micrometer or more, It is more preferable that it is 10 micrometers or more, It is preferable that it is 5 mm or less, It is more preferable that it is 1 mm or less, It is 200 micrometers or less. Is more preferable. If it is 1 μm or more, it can be used as a free-standing film. If it is thicker than 5 mm, the device weight increases and the feeling of wearing becomes worse. If it is 1 mm or less, it is preferable because flexibility is obtained, and if it is 200 μm or less, it is a thickness that does not give a sense of incongruity even if clothes are worn on the body surface potential measuring device.

Although there is no limitation on the shape of the adhesive electrode layer, for example, a shape composed of a circle, an ellipse, or a curve is preferable because it is difficult to peel off from the body surface.
Further, the thickness of the adhesive electrode layer is preferably 100 μm or more, more preferably 120 μm or more, further preferably 200 μm or more, and further thicker than 300 μm, from the viewpoint of fixation to the surface of the living body. It is also preferable to do. The thickness of the adhesive electrode layer is preferably 1 mm or less, more preferably 800 μm or less, and even more preferably 500 μm or less.
According to the inventor's research, it was found that when the thickness of the adhesive electrode layer is increased, the fixing force to the surface of the living body is increased. Specifically, if the thickness of the adhesive electrode layer is 100 μm or more, sufficient cushioning properties can be obtained and a good wearing feeling can be obtained, and sufficient adhesion to the living body surface can be ensured, and at 120 μm or more If there is, the adhesive electrode follows the unevenness of the surface of the living body (skin), so that better adhesion can be obtained between the adhesive electrode and the surface of the living body, and measurement with low noise is possible. Therefore, measurement is possible even when the object to be measured is in an operating state. In particular, when only the adhesive electrode layer is used alone as an electrode (FIG. 1 (a)), or when the adhesive electrode layer is provided on a flexible substrate (FIGS. 1 (b) and (c)). When a flexible substrate is used, if the thickness of the adhesive electrode layer is in the above range, the substrate can be very firmly fixed to the surface of the living body. Since the resistance itself is so low that it becomes an electrode itself, it is possible to make the thickness of the adhesive layer thicker than a conventional bioelectrode in which the adhesive layer is provided separately from the electrode.
If the thickness of the adhesive electrode layer is 1 mm or less, sufficiently high conductivity can be obtained for use as an electrode, and if it is 800 μm or less, there is a concern about adhesive residue remaining after peeling the electrode from the surface of the living body. If the thickness is 500 μm or less, the thickness is such that there is no sense of incongruity even if the clothes are worn on the adhesive electrode.

  The hydrophilic material content in the conductive adhesive is preferably 5% by mass or less, more preferably 3% by mass or less, further preferably 1% by mass or less, and 0%. Is most preferred. If it is 5 mass% or less, the discomfort produced by the elution of the hydrophilic component by perspiration can be reduced. Here, the hydrophilic property means a molecule having a solubility in water at 25 ° C. of more than 10 g / 100 ml. Here, examples of the hydrophilic material include hydrophilic monomers, hydrophilic polymers, organic salts, and inorganic salts.

There is no particular limitation on the shape of the adhesive electrode, but it is preferably a flat plate shape. It can be set as the flat shape which has.
Moreover, there is no restriction | limiting in particular in the shape of a base material, a conductor part, and an adhesive electrode layer, These may be the same and a different shape may be sufficient as them.

The adhesive electrode may have a non-conductive adhesive part in order to obtain higher adhesiveness. A nonelectroconductive adhesive part can be formed with a hydrophobic adhesive binder, for example.
Although there is no particular limitation on the arrangement of the non-conductive pressure-sensitive adhesive part, for example, as shown in FIG. 2 (a), the periphery of the pressure-sensitive electrode layer may be surrounded by the non-conductive pressure-sensitive adhesive part, As shown in FIG. 2 (b), a checkered pattern structure composed of an adhesive electrode layer and a non-conductive adhesive part may be used, or as shown in FIG. 2 (c), the adhesive electrode layer and the non-conductive adhesive A stripe structure composed of an agent part may be used.
In addition, although the example of FIG. 2 has a base material, it does not need to have a base material.

[Body surface potential measurement device]
A body surface potential measuring device can be formed using the electrode of the present embodiment. The body surface potential measuring device is formed of, for example, a sensor including the electrode of the present embodiment, a base material, and an electronic circuit.

The electronic circuit is composed of wiring for electrically connecting electronic components to each other.
The function of the electronic circuit is not particularly limited, but preferably includes a sensor, an analog front end, and a power supply circuit. Further, a control circuit, a communication circuit, a display circuit, a memory circuit, or the like may be included.
The analog front end has a function of converting the analog signal output from the sensor and outputting the signal to a subsequent circuit. Analog front end includes buffer circuit, amplifier circuit, level shift circuit, filter circuit (high-pass filter circuit, low-pass filter circuit, band-pass filter circuit, band-eliminate circuit, etc.), in-phase removal circuit, addition circuit, subtraction circuit, integration circuit A differentiation circuit, a rectification circuit, an analog-digital conversion circuit, and the like. In order to acquire a high output impedance signal without attenuation, the analog front end preferably has a buffer circuit for receiving the input signal from the sensor, and is amplified to acquire a minute signal such as skin potential. It is preferable to have a circuit, and it is preferable to have a filter circuit for noise reduction.

The power supply circuit supplies power to each part of the body surface potential measurement device. The power supply circuit includes a step-up circuit, a step-down circuit, a voltage regulator, a rectifier circuit, an AC-DC converter, a DC-DC converter, a DC-AC converter, an AC-AC converter, and the like. Further, it may include a circuit for detecting the remaining battery level, power consumption, etc., a standby power supply circuit, and the like.
As a method for supplying power to the power supply circuit, battery power feeding, wired power feeding, wireless power feeding, energy harvesting, or the like can be used. Battery power feeding, wireless power feeding, and energy harvesting are preferable because they are portable. In particular, wireless power feeding and energy harvesting are preferable because the body surface potential measuring device can be miniaturized.

The control circuit controls the operation of each part of the body surface potential measurement device. The control circuit includes a CPU and is connected to an analog front end, a power supply circuit, a sensor, a communication circuit, a display circuit, a storage circuit, and the like. The CPU processes and executes instruction groups, data, and programs stored in the storage circuit. The program includes a signal processing program and a communication control program. When the body surface potential measurement device performs advanced processing, a processor dedicated to data processing may be provided.
When the body surface potential measuring device performs advanced calculations, the control circuit may include a pattern recognition unit. The pattern recognition unit may be included in the CPU, but may have a dedicated processor. The pattern recognition unit extracts a pattern from data output from the analog front end, and outputs a command assigned to each pattern.

The sensor acquires a signal and outputs the acquired signal as an analog signal to the analog front end. The signal may be a biological signal, and examples of the biological signal include a pulse wave, a pulse, a pulse pressure, a blood pressure, a blood vessel diameter, an electrocardiogram, an electromyogram, an electroencephalogram, a body temperature, and a sweating amount. The adhesive electrode can be used as a sensor for acquiring a pulse wave, a pulse, an electrocardiogram, an electromyogram, an electroencephalogram, and a sweating amount.
The communication circuit transfers data to the server or relay device. Data transfer may be wired or wireless, but wireless is preferable because it is easy to carry. The wireless communication circuit includes, for example, a modulation circuit, a demodulation circuit, a rectifier circuit, a memory circuit, an antenna, and the like. The modulation method is not limited, but amplitude modulation, frequency modulation, and phase modulation can be used, and a modulation method that combines a plurality of modulation methods such as quadrature amplitude modulation can be used. In particular, the quadrature amplitude modulation method is preferable because the data transfer rate is high. Although there is no restriction on the radio communication frequency band, it is preferable to use the LF band, HF band, VHF band, and UHF band, from which communication circuits can be easily obtained.

  The display circuit displays various information on the screen. As the display circuit, for example, a liquid crystal display, electronic paper, an organic EL display, a braille display, a tactile display, or the like can be used. In particular, an electronic paper and an organic EL display are preferable because they can be formed flexibly, and an electronic paper is more preferable because of low power consumption.

  As an electronic circuit architecture, for example, a configuration as shown in FIG. 3 can be adopted. The architecture of FIG. 3 includes a sensor, an analog front end, a control circuit, a power supply circuit, a display circuit, a storage circuit, and a communication circuit. The sensor output is adjusted at the analog front end and passed to the control circuit. A power supply circuit, a display circuit, a memory circuit, and a communication circuit are connected to the control circuit, and the control circuit controls these operations and sensor output calculations.

The materials forming the wiring include gold, silver, copper, nickel, aluminum, titanium, vanadium, chromium, manganese, iron, cobalt, zinc, niobium, molybdenum, palladium, cadmium, indium, tin, antimony, lanthanum, tantalum, Metals such as tungsten, platinum, lead, and oxides, nitrides, salts of these metals, carbon materials such as carbon, graphite, fullerene, carbon nanotubes, graphene, and π such as polythiophene, polyaniline, polypyrrole, polyacetylene, polyphenylene vinylene, etc. A material composed of a conjugated molecule and a π-conjugated molecule such as PEDOT / PSS and a dopant can be used. In particular, metals are preferable because of high conductivity, and aluminum, copper, silver, and gold are more preferable because of high reliability with respect to bending. Copper is particularly preferable because it is inexpensive. As the metal, a metal composed of one element can be used, and an alloy composed of a plurality of kinds of metals can also be used.
Further, the wiring may contain an insulating material. The insulating material may form a laminated structure with a conductive material, or may form a structure in which regular / irregularly mixed materials are mixed. By containing an insulating material, the flexibility of the wiring itself and the adhesion between the wiring and the substrate are improved, and a wiring that is not disconnected by bending or expansion / contraction can be obtained, which is preferable. Examples of the insulating material include polyimide, polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalate (PEN), polyester, polycarbonate (PC), polyvinyl alcohol (PVA), and polyvinyl butyral (PVB). , Polyacetal, polyarylate (PAR), polyamide (PA), polyamideimide (PAI), polyetherimide (PEI), polyphenylene ether (PPE), polyphenylene sulfide (PPS), polyether ketone (PEK), polyphthalamide ( PPA), polyether nitrile (PEN), polybenzimidazole (PBI), polycarbodiimide, polysiloxane, polymethacrylamide, nitrile rubber, acrylic rubber, polyethylene Tetrafluoride, epoxy resin, phenol resin, melamine resin, urea resin, polymethyl methacrylate resin (PMMA), polybutene, polypentene, ethylene-propylene copolymer, ethylene-butene-diene copolymer, polybutadiene, polyisoprene, Polychloroprene, ethylene-propylene-diene copolymer, nitrile rubber, chlorosulfonated polyethylene, acrylic rubber, epichlorohydrin rubber, urethane rubber, butyl rubber, fluororubber, polymethylpentene (PMP), polystyrene (PS), styrene-butadiene copolymer Polymer, polyethylene (PE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polyether ether ketone (PEEK), phenol novolac, benzocyclobutene, poly Alkenyl phenols, polychloroprene, polyoxymethylene, can be used polysulfone (PSF), and silicone resin. As the sealing material, a material having a large elastic limit and a low elastic modulus is preferable. Specifically, it is preferable to use a rubber-like material, for example, ethylene-propylene copolymer, ethylene-butene-diene copolymer, polybutadiene, polyisoprene, polychloroprene, ethylene-propylene-diene copolymer, nitrile. Examples thereof include rubber, chlorosulfonated polyethylene, acrylic rubber, epichlorohydrin rubber, urethane rubber, butyl rubber, styrene-butadiene copolymer, fluororubber, and silicone resin. The content of the insulating material in the wiring is preferably 0.1% by mass or more, more preferably 1% by mass or more, and further preferably 5% by mass or more. Moreover, it is preferable that it is 30 mass% or less, It is more preferable that it is 20 mass% or less, It is further more preferable that it is 10 mass% or less. As content of the insulating material in wiring, it is preferable that it is 1 volume% or more, it is more preferable that it is 10 mass% or more, and it is further more preferable that it is 20 mass%. Moreover, it is preferable that it is 70 volume% or less, It is more preferable that it is 60 volume% or less, It is further more preferable that it is 50 volume% or less. The content of the insulating material in the wiring can be confirmed by a method of observing a cross section of the wiring with an electron microscope, a method of estimating a composition ratio by thermogravimetry, or the like.
The method for forming the wiring is not particularly limited, but examples thereof include a vapor deposition method, a sputtering method, and a printing method. As a method of performing patterning using a vapor deposition method and a sputtering method, there are mask vapor deposition and photolithography. Mask vapor deposition is a method in which a material having a hole having a desired shape is deposited or sputtered in a state where the mask is superimposed on a base material, and a material is formed only in the hole portion of the mask. The printing method is a method of forming a wiring by printing a conductive paste on a substrate. The printing method is preferable because the material utilization efficiency is high and the process is simple, so that wiring can be formed at low cost.

The conductive paste used for forming the wiring contains, for example, a conductive material, a binder, a solvent, a surfactant, and the like. As the conductive material, a material similar to the wiring material can be used. In particular, copper, silver, gold, and oxides thereof can be preferably used. In particular, copper or copper oxide is preferable because it is inexpensive.
A commercially available product can be used as the conductive paste. For example, Dotite series (FA-333, FA-353N, XA-602N, XA-436, FA-301CA, FA-401CA, etc.) manufactured by Fujikura Kasei Co., Ltd., conductive paste (SCE-100, SP-100) manufactured by Harima Chemical Co., Ltd. , SP-500, CP-700, etc.) and nano pastes (NPS-JL, NPS-J, NPS, NPS-HTB, NPS-HB, NPG-J, etc.) and the like can be used.

There are various types of printing methods for forming the wiring by a printing method, and there is no particular limitation. For example, screen printing, spray coating, spin coating, slit coating, die coating, bar coating, knife coating, offset printing, reverse printing, letterpress printing, flexographic printing, inkjet printing, dispenser printing, gravure direct printing, gravure offset printing, stencil printing Etc. can be used. In particular, screen printing is preferable because thick film printing is possible and low-resistance wiring can be obtained.
Prior to printing, the substrate may be washed. As a substrate cleaning method, for example, a wet process using a chemical solution, a dry process using corona discharge, plasma, UV, ozone, or the like can be used. Both wet processing and dry processing may be used.
The solvent is preferably removed from the wiring formed by printing. The solvent can be removed by a method of leaving the printed film, for example, at 20 to 150 ° C., for example, for 1 minute to 2 hours. As a heating method in this case, for example, techniques such as hot air drying, infrared drying, and vacuum drying can be used.
The film thickness of the printing film can be selected according to the printing method.
For example, the thickness of the printed film when ink jet printing is applied is preferably 0.1 to 10 μm, more preferably 0.5 to 5 μm, as a value after removal of the solvent.
When screen printing is applied, the printed film thickness value after removing the solvent is preferably 1 to 100 μm, and more preferably 10 to 50 μm.
When reverse printing is applied, the printed film thickness value after removal of the solvent is preferably 0.01 to 5 μm, and more preferably 0.1 to 1 μm.

The printed film for wiring obtained as described above may then be subjected to a firing treatment.
The baking treatment may be performed using, for example, a heat treatment apparatus such as a baking furnace, or using plasma, microwave plasma, ultraviolet light, vacuum ultraviolet light, electron beam, infrared lamp annealing, flash lamp annealing, laser, or the like. May be. In particular, the flash lamp annealing process and the plasma process are characterized in that the conductive material is heated strongly but the insulating material is not heated so much. Therefore, when a resin base material is used as the base material, only the conductive paste is heated and the base material is not damaged by heat. Therefore, an inexpensive resin such as PET can be used for the substrate, which is preferable. In particular, plasma treatment is more preferable because only the surface of the conductive paste tends to be heated and damage to the substrate due to heat transfer is small. Heat treatment using a heat treatment apparatus is preferable because general-purpose equipment can be used and equipment costs can be reduced.
In order not to oxidize the wiring obtained after firing, the printed film is preferably fired in a non-oxidizing atmosphere. If the conductive paste contains an oxide, the printed film should be baked in a reducing atmosphere in order to accelerate the reduction of the oxide and reduce the resistance of the resulting wiring as much as possible. Is more preferable.
The non-oxidizing atmosphere is an atmosphere that does not contain an oxidizing gas such as oxygen. As this non-oxidizing atmosphere, there are an inert atmosphere and a reducing atmosphere. The inert atmosphere is an atmosphere filled with an inert gas such as argon, helium, neon, or nitrogen.
The reducing atmosphere refers to an atmosphere in which a reducing gas such as hydrogen or carbon monoxide exists. As the reducing gas, a mixed gas obtained by mixing a small amount of a reducing gas with an inert gas can be suitably used from the viewpoint of safety. As a mixed gas in this case, for example,
A mixed gas composed of 5.7% by volume or less of hydrogen and nitrogen;
A mixed gas composed of 2.9% by volume or less of hydrogen and a gas containing one or more inert gases selected from the group consisting of helium and argon can be used. Since these mixed gases are nonflammable, they can be used more safely.
These gases may be filled in a firing furnace and the printed film may be fired as a closed system. The printed film may be fired while flowing these gases using a firing furnace as a flow system. When the printed film is baked in a non-oxidizing atmosphere, it is preferable that the baking furnace is once evacuated to remove oxygen in the baking furnace and then replaced with a non-oxidizing gas.
The firing treatment may be performed under pressure or under reduced pressure.
As described above, the firing treatment in this embodiment is preferably a heat treatment, a plasma treatment, or a flash lamp annealing treatment. Hereinafter, these processes will be described.

The heat treatment as the above-described baking treatment is specifically a treatment for heating the sample by bringing it into contact with a high-temperature medium. Plasma treatment and flash lamp annealing treatment are not included in the heat treatment.
Although there is no particular designation for the high-temperature medium, for example, air, inert gas, reducing gas, liquid, metal, ceramic, or the like can be used.
The heat source for heating the medium is not particularly specified, and for example, a far infrared heater, a near infrared heater, a resistance heater, a microwave heater, a combustion heater, or the like can be used. As the far infrared heater, for example, a halogen heater, a quartz tube heater, a carbon heater, a sheathed heater, a metal heater or the like can be used. As the near-infrared heater, for example, a halogen heater can be used. As the resistance heater, for example, a metal heater, a ceramic heater, or the like can be used. As the heating element of the metal heater, for example, an alloy such as an iron-chromium-aluminum alloy or a nickel-chromium alloy, or a metal such as platinum, molybdenum, tantalum, or tungsten can be used. As the heating element of the ceramic heater, for example, silicon carbide, molybdenum-silicite, carbon or the like can be used. The microwave heater is a heater that heats an object with an electromagnetic wave of about 100 kHz to 10 GHz. The combustion heater is a heater that heats an object with combustion heat when combustible substances such as heavy oil and gas are burned.
The heat treatment temperature is preferably 300 ° C. or lower, more preferably 200 ° C. or lower, and further preferably 150 ° C. or lower. If the heat treatment temperature is 300 ° C. or lower, a flexible printed circuit board can be formed using a heat-resistant flexible base material such as PI, and if it is 200 ° C. or lower, a transparent flexible base material such as PC or PEN is used. A printed circuit board can be formed, and if it is 150 degrees C or less, a flexible printed circuit board can be formed at low cost using a general-purpose resin substrate having low heat resistance such as PET but inexpensive. The heat treatment temperature is preferably 20 ° C. or higher, more preferably 30 ° C. or higher, and further preferably 50 ° C. or higher. If it is 20 degreeC or more, an electroconductive material will move in a printed film with a thermal vibration, and volume resistivity can be lowered | hung by electroconductive materials contacting. If it is 30 degreeC or more, the movement in the printing film of particle | grains will speed up by softening of the organic substance in a printing film. Furthermore, when the organic material is softened, the conductive material settles due to the difference in specific gravity between the conductive material and the organic material, and is separated into a conductive material layer and an organic material layer, making it difficult for the insulating organic material to enter between the conductive materials. Therefore, the volume resistivity can be further reduced. If it is 50 degreeC or more, since sintering of electroconductive materials advances, volume resistance can be lowered | hung further.
The heat treatment time is preferably 1 minute or longer, and more preferably 10 minutes or longer. If the heat treatment time is 1 minute or more, the resistance of the fired film can be lowered by bringing the conductive materials into contact with each other, and if the heat treatment time is 10 minutes or more, the sintering of the conductive materials proceeds. The resistance of the fired film can be lowered. Moreover, it is preferable from a viewpoint of heat damage reduction to a base material that the heat-firing time is 4 hours or less.

Specifically, the above-described plasma treatment as the firing treatment is a treatment in which the sample is exposed to plasma by generating plasma in a space where the sample is placed.
A method for generating plasma is not particularly specified. For example, a method using a DC arc discharge, a high-frequency electromagnetic field, a microwave, or the like can be used. In particular, a method using a microwave is preferable because plasma can be generated at a low temperature, and thermal damage to the substrate is small. Specifically, the microwave refers to an electromagnetic wave having a frequency of 300 MHz to 3 THz. The center frequency of the microwave is preferably 2 GHz to 4 GHz, more preferably 2.4 GHz to 2.5 GHz.
An apparatus for generating microwave plasma includes, for example, a microwave oscillator, a transmission circuit, an antenna, and a discharge vessel. In addition to these, a magnetic field generator may be further used as necessary. In this apparatus, plasma is generated in the discharge vessel. As the microwave oscillator, for example, a klystron, a magnetron, a gyrotron, or the like can be used. As the transmission circuit, for example, a rectangular waveguide, a circular waveguide, a coaxial line, or the like can be used. A power monitor and a dummy load that absorbs reflected power may be attached in the middle of the transmission circuit. As the structure of the apparatus, for example, it has a transmission line in the upper part, a discharge container in the lower part, the transmission line and the discharge container are connected via a quartz window, and a sample stage is installed in the lower part of the discharge container. It is preferable that
Although there is no specific designation for the output of the microwave, it is preferable that the output is 100 W or more and 3 kW or less. The output of the microwave may be constant during the process or may be changed during the process.
The temperature of the sample stage is not particularly specified, but is preferably 30 ° C. or higher and 150 ° C. or lower. If this temperature is 150 ° C. or lower, a general-purpose resin substrate having low heat resistance such as PET can be used as the base material. If it is 30 degreeC or more, a low resistance wiring will be obtained.
The ambient atmosphere during the plasma treatment is not particularly specified, but a reducing atmosphere is preferable. The ambient atmosphere can be controlled, for example, by flowing an appropriate gas through the discharge vessel. The gas flow rate is not particularly specified, but it is preferably 10 SCCM or more and 1,000 SCCM or less, more preferably 50 SCCM or more and 500 SCCM or less, and further preferably 100 SCCM or more and 300 SCCM or less, under reduced pressure. Under atmospheric pressure, it is preferably 500 SCCM or more and 10,000 SCCM or less, more preferably 1,000 SCCM or more and 6,000 SCCM or less, and further preferably 2,000 SCCM or more and 4,000 SCCM or less. In particular, it is preferable to form a reducing atmosphere by flowing a mixed gas obtained by mixing a small amount of hydrogen with an inert gas. As the inert gas in the mixed gas, for example, nitrogen; a rare gas such as helium or argon can be used. The hydrogen content in the mixed gas is preferably 0.1% by mass or more and 10% by mass or less, and more preferably 2% by mass or more and 6% by mass or less.
The pressure in the discharge vessel may be atmospheric pressure or reduced pressure.
The plasma treatment time is not particularly specified, but is preferably 10 seconds or longer and 30 minutes or shorter, more preferably 30 seconds or longer and 10 minutes or shorter, and further preferably 1 minute or longer and 5 minutes or shorter.

The flash lamp annealing process as the above-described firing process is a process of heating the sample by irradiating the sample with light having a high energy density.
As a light source used for the flash lamp annealing treatment, for example, a xenon lamp, a krypton lamp, or the like can be used.
The wavelength of the light source is preferably in the visible light region because the printed film can be baked without causing thermal damage to the transparent resin substrate. The wavelength of the light source can be easily controlled through a color filter.
The energy per pulse is not particularly specified, but is preferably 1 J or more and 3,000 J or less, more preferably 10 J or more and 2,000 J or less, and further preferably 100 J or more and 1,500 J or less. .
The pulse time is not particularly specified, but is preferably 10 μsec or more and 100 msec or less, more preferably 50 μsec or more and 10 msec or less, and further preferably 100 μsec or more and 5 msec or less. Here, the pulse time refers to the time from the time when power is supplied to the lamp for pulsed light irradiation to the time when power supply to the lamp is stopped for turning off the pulsed light.
The sample may be irradiated with pulsed light multiple times. The pulse interval is not particularly specified, but is preferably 10 μs or more and 1 second or less. Here, the pulse interval refers to the time from the time when power is applied to the lamp for pulsed light irradiation to the time when power is applied to the lamp for the next pulsed light irradiation.
The temperature of the sample stage is not particularly specified, but is preferably 30 ° C. or higher and 150 ° C. or lower. If this temperature is 150 ° C. or lower, a general-purpose resin substrate having low heat resistance such as PET can be used as the base material. If it is 30 ° C. or higher, a dense copper film can be obtained.
During the flash lamp annealing process, a gas may be flowed into the container. In this case, since the sample is cooled by the gas flow, thermal damage to the substrate can be reduced.
The ambient atmosphere during the flash lamp annealing treatment is not particularly specified, but a reducing atmosphere is preferable. The specific example of the reducing atmosphere and the gas flow rate are the same as those described above for the reducing atmosphere during plasma processing.
After the flash lamp annealing treatment, a pressure treatment may be further performed. By pressurizing the sample after the flash lamp annealing treatment, the formed copper film can be made denser, which is preferable. As a pressing method, for example, a roller press, a flat plate press, or the like can be used. In particular, a roller press is preferable because it is suitable for a large area press.

As an electronic component constituting the electronic circuit, an active component, a passive component, a structural component, a component in which a plurality of functions are mounted on a single chip (for example, ASIC (Application Specific Integrated Circuit)), or the like can be used. An electronic circuit can be formed by mounting these electronic components on a substrate. In particular, the ASIC is preferable because it can be equipped with multiple functions in a small area and the body surface potential measuring device can be miniaturized. These electronic components can be mounted on a conductive land formed on a substrate using a bonding material.
Generally, semiconductor components such as active components and ASICs are formed using a silicon wafer, but components formed by thin film transistors can also be used. A component formed of a thin film transistor is preferable because the component itself has flexibility, so that the body surface potential measuring device can be formed extremely flexibly. A thin film transistor refers to a transistor in which a semiconductor layer serving as a channel of a transistor is formed by a thin film process. The thin film process is a general term for processes for forming a thin film, and includes, for example, vapor deposition, sputtering, CVD, ALD, and printing.

A thin film transistor is an element generally composed of a gate electrode, a drain electrode, a source electrode, a gate insulating film, and a semiconductor. FIG. 4 shows an example of a layer structure of a thin film transistor. 4A is a bottom gate top contact structure, FIG. 4B is a bottom gate bottom gate structure, FIG. 4C is a top gate bottom contact structure, and FIG. 4D is a structure. It is called a top gate top contact structure. In particular, the bottom gate top contact structure and the top gate bottom contact structure are preferable because a high-performance element can be obtained. A bottom gate bottom contact structure is preferable because it is easy to manufacture.
As the semiconductor material, an organic semiconductor material, an inorganic semiconductor material, or an organic-inorganic composite semiconductor material can be used.
As the organic semiconductor material, a carbon material, a high molecular organic semiconductor material, and a low molecular organic semiconductor material can be used. The polymer organic semiconductor material can be formed by printing and can be manufactured at low cost. A low-molecular organic semiconductor material generally has high purity, a characteristic change due to a direct current bias or temperature is small, and a stable operation device can be realized.
As a high molecular organic semiconductor material, for example, a π-conjugated polymer, a π-conjugated graft polymer, a π-conjugated block polymer, or the like can be used. Here, the π-conjugated polymer refers to a material in which the π-conjugation of the polymer main chain continues without interruption. A π-conjugated block polymer refers to a copolymer having two or more types of repeating units and a repeating unit having at least one type of π-conjugated structure. The π-conjugated graft polymer refers to a polymer having a π-conjugated structure in the side chain.
Examples of P-type polymer organic semiconductor materials include polythiophene derivatives, polyphenylene derivatives, polyaniline derivatives, polyphenylene vinylene derivatives, polyacetylene derivatives, polydiacetylene derivatives, polytriphenylamine derivatives, polyacene derivatives, polyfluorene derivatives, triphenylamine and phenylene vinylene. Copolymer derivatives of thiophene and phenylene, copolymer derivatives of thiophene and thienothiophene, copolymer derivatives of thiophene and fluorene, and the like. Specific examples of the P-type polymer organic semiconductor material include poly-3-hexylthiophene, poly [2,5-bis (3-tetradecylthiophen-2-yl) thieno [3,2-b] thiophene], poly [Bis (4-phenyl) (2,4,6-trimethylphenyl) amine] and the like can be used.
Examples of N-type organic polymer semiconductor materials include polybenzobisimidazobenzophenanthroline derivatives, polythiazole derivatives, polyfluorothiophene derivatives, polyfluorophenylene derivatives, polycyanoterephthalidene derivatives, polymers having a fluorenone skeleton, 9,9- Polymer having biscyanoethylfluorene skeleton, polymer having thiazole skeleton, polymer having benzothiadiazole skeleton, polymer having triazole skeleton, polymer having benzothiazole skeleton, polymer having naphthalenetetracarboxydiimide skeleton, having perylenetetracarboxydiimide skeleton Polymers and the like can be used.
Examples of P-type low molecular organic semiconductor materials include acene derivatives, pyrene derivatives, perylene derivatives, coronene derivatives, picene derivatives, thienoacene derivatives, phenylene vinylene derivatives, fluorene derivatives, oligofuran derivatives, oligothiophene derivatives, tetrathiafulvalene derivatives, phthalocyanines. Derivatives, porphyrin derivatives, azaacene derivatives, indolocarbazole derivatives, carbazole derivatives, and the like can be used. Specific examples of P-type low-molecular organic semiconductor materials include tetracene, pentacene, rubrene, 6,13-bis (triisopropylsilylethynyl) pentacene, C8-BTBT (Aldrich), DNTT, C10-DNTT, DNT (Dinaft). Thiophene), alkyldinaphthothiophene, phthalocyanine copper (II), 4,4′-bis (N-carbazolyl) -1,1′-biphenyl, N, N′-di-[(1-naphthyl) -N, N '-Diphenyl]-(1,1'-biphenyl) -4,4'-diamine or the like can be used.
Examples of N-type low molecular organic semiconductor materials include fluoroacene derivatives, π-conjugated molecules having a perfluoroalkyl group, π-conjugated molecules having a perfluorophenyl group, π-conjugated molecules having a cyano group, naphthalene tetracarboxydiimide derivatives, and perylene. Tetracarboxydiimide derivatives, coronenimide derivatives, fullerene derivatives and the like can be used. Specific examples of the N-type low molecular organic semiconductor material include 1,2,3,4,8,9,10,11,15,16,17,18,22,23,24,25-hexadecafluorophthalocyanine. Copper (II), N, N′-dioctyl-3,4,5,10-perylenetetracarboxydiimide, [6,6] -phenyl-C61-methyl butyrate and the like can be used.
As the carbon material, graphene, carbon nanotube, fullerene, or the like can be used.
As the inorganic semiconductor material, a single element semiconductor, an oxide semiconductor, a compound semiconductor, a sulfide semiconductor, or the like can be used. Examples of the single element semiconductor include silicon and germanium. Examples of the oxide semiconductor include IGZO (indium-gallium-zinc oxide), IZO (indium-zinc oxide), zinc oxide, indium oxide, titanium oxide, tin oxide, tungsten oxide, niobium oxide, and cuprous oxide. Etc. are exemplified. Examples of the compound semiconductor include gallium arsenide (GaAs), gallium arsenide phosphorus (GaAsP), gallium phosphide (GaP), cadmium selenium (CdSe), silicon carbide (SiC), indium antimony (InSb), and gallium nitride. The Examples of sulfide semiconductors include molybdenum sulfide and cadmium sulfide.
The crystal structure of the inorganic semiconductor material is not particularly limited. An inorganic semiconductor having an amorphous structure can be suitably used because it is flexible and can form a device with a good wearing feeling.
Examples of the organic-inorganic composite semiconductor material include a semiconductor material that combines the above-described inorganic semiconductor material and an organic material, a semiconductor material that combines an inorganic material and an organic semiconductor material, and a semiconductor material that combines an inorganic semiconductor material and an organic semiconductor material. Can be mentioned.

Examples of the mounting method of the electronic component on the wiring in each electronic circuit include through-hole mounting, surface mounting, wire bonding, and flip chip mounting. In particular, surface mounting and flip chip mounting are preferable because the mounting area can be reduced and the bonding strength is also high.
A connection portion between the electronic component and the wiring may be formed of a metal or a composite of a metal and an organic material. It is preferable to have an organic substance in the connection portion because the electronic component can be prevented from falling off by bending the device. A curable resin can be used as the organic substance used for the connection portion. As the curable resin, for example, an epoxy resin, an acrylic resin, an ester resin, a silicone resin, or the like can be used. In particular, an epoxy resin is preferable because of its high connection strength with metal.
Examples of the bonding material include solder, conductive paste, conductive adhesive, anisotropic conductive adhesive, and the like. In particular, a conductive adhesive and an anisotropic conductive adhesive are preferable because they can be bonded at a low temperature such that they can be mounted on a flexible substrate. As the conductive adhesive, for example, conductive adhesive LS-109 manufactured by Asahi Chemical Research Co., Ltd., Dotite FA-705BN, XA-874, XA-910, SA-2024, XA-220MV, XA- manufactured by Fujikura Kasei Co., Ltd. 519B, FA-730, XA-819A, D-753, A-3 / C-3, surface mount adhesives H9626, H9672 manufactured by NAMICS, die attach agents H9607, H9863, H9683, H9800, H9870, Sk70N, H9940, Flip chip connecting agent H9807, ThreeBond conductive resin TB3303G (NEO), TB3331L, TB333C, TB3351C, and the like can be used.
A thin film transistor is preferable because it can be directly formed on a substrate and an extremely thin electronic circuit can be formed.

In the present embodiment, the body surface potential measurement device is preferably flexible.
The flexible body surface potential measurement device can be worn for a long time without discomfort because it is comfortable to wear, and it can be worn according to the shape of the body surface (skin), so the body surface and body surface potential measurement Adhesion with the device is improved, and a more accurate signal can be acquired. Here, “flexible” means a state in which the device can be bent when viewed macroscopically, and there may be a locally rigid portion. Here, the term “local” refers to a region of 2500 mm ² or less and 4 mm ² or more. The bendable radius of curvature is preferably 1,000 m or less, more preferably 500 mm or less, and even more preferably 100 mm or less. If it is 1,000 mm or less, it can be worn on a human torso, if it is 500 mm or less, it can be worn on a human leg, and if it is 100 mm or less, it can be worn on a human upper limb. It becomes.

As the base material for the body surface potential measuring device, the same base material that can be used for the adhesive electrode can be used. The substrate is preferably flexible from the viewpoint of wearing feeling. By making the base material flexible, it can be worn for a long time without discomfort, and it can be worn along the skin shape, so the adhesion between the body surface and the body surface potential measurement device And more accurate signals can be obtained. Specific examples of the base material include PET, PEN, PC, COP, PI, silicone, Teflon (registered trademark), thin film glass, metal foil, an organic material in which an inorganic filler is dispersed, and an organic material in which an inorganic layer is coated on the surface. It is preferable to use a material. In particular, PET and PEN are preferable because they are available at low cost, and PI is preferable because soldering is possible.
Although there is no restriction | limiting in particular in the thickness of a base material, It is preferable that it is 1 micrometer or more, It is more preferable that it is 10 micrometers or more, It is preferable that it is 5 mm or less, It is more preferable that it is 1 mm or less, It is 200 micrometers or less. Is more preferable. If it is 1 μm or more, it can be used as a self-supporting film, and if it is 10 μm or more, a high-strength film is obtained and handling becomes easy. If it is thicker than 5 mm, the device weight increases and the feeling of wearing becomes worse. If it is 1 mm or less, it is preferable because flexibility is obtained, and if it is 200 μm or less, it is a thickness that does not give a sense of incongruity even if clothes are worn on the body surface potential measuring device.

The body surface potential measuring device in the present embodiment may be sealed with a sealant. As the sealant, an organic material, an inorganic material, or an organic-inorganic composite material can be used.
Examples of organic materials include polyimide, polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalate (PEN), polyester, polycarbonate (PC), polyvinyl alcohol (PVA), polyvinyl butyral (PVB), and polyacetal. , Polyarylate (PAR), polyamide (PA), polyamideimide (PAI), polyetherimide (PEI), polyphenylene ether (PPE), polyphenylene sulfide (PPS), polyether ketone (PEK), polyphthalamide (PPA) , Polyether nitrile (PEN), polybenzimidazole (PBI), polycarbodiimide, polysiloxane, polymethacrylamide, nitrile rubber, acrylic rubber, polyethylene Rafluoride, epoxy resin, phenol resin, melamine resin, urea resin, polymethyl methacrylate resin (PMMA), polybutene, polypentene, ethylene-propylene copolymer, ethylene-butene-diene copolymer, polybutadiene, polyisoprene, polychloroprene , Ethylene-propylene-diene copolymer, nitrile rubber, chlorosulfonated polyethylene, acrylic rubber, epichlorohydrin rubber, urethane rubber, butyl rubber, fluororubber, polymethylpentene (PMP), polystyrene (PS), styrene-butadiene copolymer , Polyethylene (PE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polyether ether ketone (PEEK), phenol novolac, benzocyclobutene, polyvinylidene Phenol, polychloroprene, polyoxymethylene, can be used polysulfone (PSF), and silicone resin. As the sealing material, a material having a large elastic limit and a low elastic modulus is preferable. Specifically, it is preferable to use a rubber-like material, for example, ethylene-propylene copolymer, ethylene-butene-diene copolymer, polybutadiene, polyisoprene, polychloroprene, ethylene-propylene-diene copolymer, nitrile. Examples thereof include rubber, chlorosulfonated polyethylene, acrylic rubber, epichlorohydrin rubber, urethane rubber, butyl rubber, styrene-butadiene copolymer, fluororubber, and silicone resin. Since the rubber-like material exhibits flexibility even with a thick film, the surface of the body surface potential measuring device using a thick chip-type electronic component can be smoothly sealed while providing flexibility. In particular, since the silicone resin has high flexibility, cushioning properties, and chemical resistance, it is preferable because it has a high ability to protect the internal electronic circuit and can improve the durability of the body surface potential measuring device. Can be worn for a long time due to its high biocompatibility.
As the inorganic material, for example, a metal oxide, a metal fluoride, a metal carbide, a metal carbonate, a metal nitride, or the like can be used. Specifically, silicon oxide, silver oxide, copper oxide, aluminum oxide, zirconia, titanium oxide, hafnium oxide, tantalum oxide, tin oxide, calcium oxide, cerium oxide, chromium oxide, cobalt oxide, holmium oxide, lanthanum oxide, oxidation Magnesium, manganese oxide, molybdenum oxide, nickel oxide, antimony oxide, samarium oxide, terbium oxide, tungsten oxide, yttrium oxide, zinc oxide, indium oxide, silver fluoride, silicon fluoride, aluminum fluoride, zirconium fluoride, fluoride Titanium, hafnium fluoride, tantalum fluoride, tin fluoride, calcium fluoride, cerium fluoride, cobalt fluoride, holmium fluoride, lanthanum fluoride, magnesium fluoride, manganese fluoride, molybdenum fluoride, nickel fluoride, Fluoride Timon, samarium fluoride, terbium fluoride, tungsten fluoride, yttrium fluoride, zinc fluoride, lithium fluoride, lead zirconate titanate (PZT), barium titanate, strontium titanate, copper nitride, silicon nitride, nitride Aluminum, titanium nitride, hafnium nitride, tantalum nitride, tin nitride, calcium nitride, cerium nitride, cobalt nitride, holmium nitride, lanthanum nitride, magnesium nitride, manganese nitride, molybdenum nitride, nickel nitride, antimony nitride, samarium nitride, terbium nitride, Tungsten nitride, yttrium nitride, zinc nitride, lithium nitride, gallium nitride, SiC, SiCN, diamond-like carbon (DLC), or the like can be used.
As the organic-inorganic composite material, an organic material in which inorganic fine particles are dispersed can be used. The sealant may be used alone or in combination. High barrier properties and flexibility can be realized at the same time by laminating and sealing an organic material and an inorganic material. One side of the body surface potential measuring device may be sealed, both sides may be sealed, or only a part may be sealed. The thickness of the sealant is preferably equal to or greater than the thickness that flattens the unevenness of the surface of the body surface potential measuring device. A feeling of wearing is improved by eliminating irregularities on the surface of the body surface potential measuring device.

The body surface potential measuring device essentially has a sensor that acquires the body surface potential including the electrode of the present embodiment, and also has an analog front end, a control unit (control circuit), a communication unit (communication) as shown in FIG. Circuit), a storage unit (storage circuit), and a power supply unit (power supply circuit).
The sensor senses a body surface potential and acquires a signal. The analog front end converts the signal acquired by the sensor. Signal conversion includes amplification, filtering, rectification, A / D conversion, and the like. The control unit controls each part of the body surface potential measurement device. The acquired signal can be analyzed by the control unit. The storage unit stores and recalls information. The communication unit performs communication between the body surface potential measurement device and another device. The power supply unit supplies power to each part of the body surface potential measurement device.
The sensor and analog front end are preferably flexible. If the sensor and the analog front end are flexible, the feeling when worn on the body surface is improved and can be worn for a long time without discomfort, and can be worn along the shape of the body surface (skin) Therefore, the adhesion between the body surface and the body surface potential measuring device is improved, and a more accurate signal can be acquired.
The sensor includes the electrode of the present embodiment as a measurement electrode.

The sensor and a part of the analog front end may be integrated. Specifically, the term “integrated” refers to a stacked state or a state formed in the vicinity of the same substrate. Sensors often have high output impedance and are susceptible to noise. By integrating the sensor and the analog front end, the physical distance between them can be reduced, and noise can be reduced.
A part of the sensor and the analog front end may be integrated, and the remaining circuits of the analog front end may be formed in another region. For example, the form formed on another base as shown in FIG. 5A, or the form formed at a distant place on the same base as shown in FIGS. 5B and 5C is exemplified. .
The analog front end preferably includes a buffer circuit as a component. Since the buffer circuit has a high input impedance, an accurate signal can be obtained even if the body surface has a high impedance, and since it has a low output impedance, the distance from the subsequent circuit can be increased. , Device design freedom is improved. The buffer circuit is preferably integrated with the sensor. By integrating the buffer circuit and the sensor, it is possible to prevent noise from being placed on the wiring from the sensor to the buffer circuit and to acquire an accurate signal. The buffer circuit is preferably formed by a thin film transistor. When the buffer circuit is formed of a thin film transistor, a portion to be in close contact with the body of the body surface potential measuring device can be formed more flexibly, and a better wearing feeling can be obtained.
Of the analog front end, the number of functions integrated with the sensor is preferably small. Specifically, it is preferable to integrate only the buffer circuit or only the buffer circuit and the switching element with the sensor.
The analog front end preferably includes an amplifier circuit and a filter circuit. By having the amplifier circuit, the body surface potential, which is often a minute signal, can be acquired with high sensitivity. Noise can be reduced by using a filter circuit, and the amount of data can be reduced by removing signals having unnecessary frequencies.

  The number of measurement electrodes is preferably 4 or more, more preferably 16 or more, and still more preferably 30 or more. If the number is four or more, the probability that the measurement electrode is attached to an appropriate position increases, and even a person who is not trained can easily measure the body surface potential. If there are 16 or more, the distribution of the body surface potential can be measured. If there are 30 or more, the potential in the body can also be estimated.

An array electrode can be used as the measurement electrode of the sensor. An array electrode is an electrode (aggregate) in which two or more electrodes are arranged. In the array electrode, measurement electrodes can be arranged one-dimensionally or two-dimensionally.
The one-dimensional array electrode is an electrode in which a plurality of measurement electrodes are arranged on a straight line. The two-dimensional array electrode is an electrode in which a plurality of measurement electrodes are arranged on a plane. The arrangement of the measurement electrodes in the two-dimensional array electrode is not particularly limited, but may be, for example, a lattice shape or a honeycomb shape. By using the array electrode, it becomes easy to attach the body surface potential measuring device to an appropriate position, and it becomes possible to acquire multipoint potential information.

When array electrodes are used, all the electrodes can be directly connected to the analog front end, or an active matrix configuration can be used. As the connection configuration of the array electrodes, for example, configurations as shown in FIGS.
In FIG. 6, each output of the sensor array is input directly to the analog front end. In the case of this configuration, there are advantages that the circuit can be simplified and sensor information can be acquired simultaneously.
FIG. 7 shows an example of an active matrix type sensor array. Since the circuit configuration of each point of the active matrix sensor array is the same, the circuit configuration of the active matrix sensor array will be described by taking the circuit SC1 in the vicinity of the sensor 11 as an example. As shown in FIG. 7, the SC11 has a switching transistor T11 formed in the vicinity of the intersection position of the gate line GL1 and the signal line SL1. The drain terminal of the switching transistor is connected to the power supply line PL, the gate terminal is connected to the gate line GL1, and the source terminal is connected to the buffer circuit Buf11. In addition, the SC11 has a buffer circuit Buf11 in which a power supply input terminal is connected to the source terminal of the switching transistor T11. The input terminal of the buffer circuit Buf11 is connected to the sensor 11, and the output terminal is connected to the signal line SL1. Further, it has a sensor connected to the input terminal of the buffer circuit Buf11. The gate line is connected to the gate driver, the signal line is connected to the analog front end, and the power supply line is connected to the power supply circuit. Since the noise on the wiring can be reduced by using the buffer circuit, the gate line, the signal line, and the power supply line can be set to arbitrary lengths.
Next, the operation of the active matrix type sensor array will be described with reference to FIG. By sequentially inputting switching signals from the gate driver to the m gate lines, the switching transistors on the gate lines are turned on. When the switching transistor is turned on, the buffer circuit operates and transmits a signal output from the sensor to the signal line. The sensor signal transmitted to the signal line is input to the analog front end. The active matrix method is preferable because the number of wirings can be reduced, wiring defects can be reduced, and the device can be miniaturized as compared with the format shown in FIG. For example, when a switching signal is input to the gate line GL1, the switching transistors T11 to T1n connected to the gate line GL1 are turned on. At this time, since no switching signal is input to GL2 to GLm, the switching transistors T21 to Tmn are in the OFF state. When the switching transistors T11 to T1n are turned on, the buffer circuits Buf11 to Buf1n operate, and the signals of the sensors 11 to 1n are transmitted to the signal lines SL1 to SLn, respectively. At this time, the Buf21 to Bufmn are not operating, and the signals of the sensors 21 to mn are insulated from the signal lines, so that two or more sensor signals are not input to each signal line.
Next, the configuration of FIG. 8 will be described. This is a configuration in which the buffer circuit of FIG. 7 is replaced with a buffer transistor. The drain terminal of the buffer transistor is connected to the source terminal of the switching transistor, the gate terminal is connected to the sensor, and the source terminal is connected to the signal line. The configuration of FIG. 8 has a small number of elements and can be manufactured by the same process as that of a liquid crystal panel, and thus is easy to manufacture. Here, m and n are arbitrary positive numbers. The buffer circuit and the switching transistor are preferably formed using thin film transistors. The buffer circuit, the switching transistor, and the sensor are preferably formed on the same flexible base material, and the sensor and the buffer circuit are preferably formed adjacent to each other or stacked. By forming on the same base material, since the sensor part which needs to be stuck to the body surface can be made flexible, a good wearing feeling can be obtained.

The body surface potential measurement device of this embodiment may have a wiring for obtaining an electrical connection between the electrode and the electronic circuit. This wiring may be connected to the adhesive electrode layer itself, or when the adhesive electrode has a conductor part, may be connected to the conductor part, and further, the adhesive electrode may be a conductive base material. When it has, you may connect with a base material.
As shown in FIG. 10, the adhesive electrode of this embodiment may be integrated with the electronic circuit of the body surface potential measurement device. The adhesive electrode and the electronic circuit may be formed side by side on the substrate, or may be formed by laminating. In the case of stacking, it is preferable from the viewpoint of electronic circuit protection to provide a protective layer between the electronic circuit and the electrode. As the protective layer, a substrate can be used as the protective layer, or the protective layer can be formed using an insulating material.

The body surface potential measuring device of this embodiment may have a plurality of measuring electrodes. Since the body surface potential measuring device is preferably a differential input in order to cancel in-phase noise on the body surface, it is preferable to have two or more measuring electrodes. As a method for mounting a plurality of measurement electrodes, for example, a plurality of adhesive electrodes may be connected to an electronic circuit as shown in FIG. 11 (a), or in FIGS. 11 (b) and 11 (c). As shown, an array electrode provided with a plurality of adhesive electrode layers insulated from each other on the same substrate may be used.
In general, in order to acquire a multipoint signal, a large number of electrodes must be used, and the mounting is very troublesome. In addition, even when a plurality of electrodes are formed on the same base material, there is a problem that the electrodes may be electrically connected for some reason and measurement for a long time cannot be performed. If an adhesive electrode having a plurality of adhesive electrode layers insulated from each other on the same substrate is used, multipoint signals can be acquired easily and for a long time.

  As an example of the circuit configuration of the body surface potential measurement device of the present embodiment, for example, the configuration illustrated in FIG. 12 can be used. The analog front end includes a buffer circuit, an amplifier circuit, a high-pass filter circuit, and a low-pass filter circuit, and has a battery and a power supply circuit for supplying power to the analog circuit.

Next, various uses of the body surface potential measuring device will be individually described.
[Electrocardiograph]
An electrocardiograph is a body surface potential measuring device for measuring a cardiac potential.
The electrocardiograph is preferably formed on a flexible substrate. Because a flexible electrocardiograph can be formed by using a flexible base material, the wearing feeling is improved, it can be worn for a long time without discomfort, and it can be worn along the skin shape. The adhesion between the body surface and the body surface potential measuring device is improved, and a more accurate signal can be acquired.
The electrocardiograph has at least two measurement electrodes, one measurement electrode is mounted near the heart, the other measurement electrode is mounted at a position far from the heart, and the potential difference between these electrodes is measured. Thus, the cardiac potential can be measured. The electrocardiograph may have three or more measurement electrodes, and can acquire an electrocardiogram corresponding to each combination of two arbitrary measurement electrodes. In general, an electrocardiogram called a 12-lead electrocardiogram is measured using 10 measuring electrodes. If the distance between the electrodes for measurement is too close, a potential difference does not occur, and the electrocardiogram cannot be measured. The distance between electrodes for measurement is preferably 10 mm or more, more preferably 15 mm or more, and further preferably 50 mm or more. If it is 10 mm or more, it becomes easy to measure R wave, if it is 20 mm or more, it becomes easy to measure P wave and T wave, and if it is 50 mm or more, it becomes easy to measure Q wave and S wave. The impedance of the measurement electrode is preferably 10 kΩ or less, preferably 100 Ω or less, and more preferably 10 Ω or less. Usually, since the resistance of the skin is several kΩ, an electrocardiogram can be measured if the impedance of the measuring electrode is 10 kΩ or less, and can be measured without attenuation if the impedance is 100Ω or less. Further, since the resistance of wet skin is several hundreds Ω, an electrocardiogram can be measured without attenuation if the impedance of the measurement electrode is 10 Ω or less.
The electrocardiograph may have a ground electrode in addition to the measurement electrode. Here, the ground electrode refers to an electrode to be worn in order to keep the body surface potential constant. A constant voltage is always output to the ground electrode as seen from the ground potential of the body surface potential measuring device. By attaching the ground electrode to the skin, the potential of the body surface is changed from the ground potential of the body surface potential measuring device. Electric power is supplied from the body surface potential measuring device so as to keep a constant voltage.
The mounting position of the measurement electrode is not particularly limited, but it is preferable to mount the electrode for measurement on the chest having the same height as the center of the heart. For example, the fourth rib sternum right edge (V1), the fourth rib sternum left edge (V2), the intersection of the clavicle midline and the horizontal line across the fifth rib (V4), the center of V2 and V4 (V3), V4 It is preferable to attach to the intersection (V5) of the horizontal line of the height and the anterior axillary line, the intersection of the horizontal line of the height of V4 and the middle axillary line (V6), and a position away from V1 to V6 (for example, the abdomen).
In this embodiment, the adhesive electrode of this embodiment can be used as the measurement electrode and the ground electrode. If the adhesive electrode is used, the necessary information can be acquired without shifting the measurement position even when the measurement object is operated. The adhesive electrode may have an adhesive electrode layer arranged to be attached to V1 to V6 on one substrate.
FIG. 13 shows a configuration example of the electrocardiograph. The exemplified electrocardiograph is composed of an electrode and an analog front end. The analog signal output from the electrocardiograph can be measured with an external measuring machine. The gain of the analog front end is preferably 10 to 1,000, and the frequency characteristic preferably has a characteristic of passing a signal having a frequency of 0.1 Hz to 10 kHz.
The analog front end preferably includes a buffer circuit, an amplifier circuit, and a filter circuit. As the buffer circuit, for example, an amplifier circuit (including a voltage follower) having a high input impedance can be used. The input impedance of the buffer circuit is preferably 100 kΩ or more, more preferably 1 MΩ or more, and even more preferably 100 MΩ or more. A differential amplifier circuit is preferably used as the amplifier circuit. By using the differential amplifier circuit, it is possible to remove in-phase noise on the two measurement electrodes. The filter circuit preferably uses a band-pass filter that passes a signal having a frequency of 0.1 Hz to 10 kHz. As the bandpass filter, a configuration in which a lowpass filter and a highpass filter are connected in series may be used.

[Electromyograph]
An electromyograph is a body surface potential measuring device for measuring surface myoelectric potential. The electromyograph is preferably formed on a flexible substrate. By using a flexible base material, a flexible electromyograph can be formed, so the wearing feeling is improved, and it is possible to wear it according to the skin shape, so the skin and the body surface potential measuring device are in close contact with each other. Thus, a more accurate signal can be acquired.
The electromyograph has at least two measuring electrodes. By attaching two measuring electrodes along the muscle and measuring the potential difference between these electrodes, the myogenic potential can be measured. The electromyograph may have three or more measurement electrodes, and can acquire a myoelectric potential corresponding to each combination of two arbitrary measurement electrodes. If the distance between the electrodes for measurement is too close, a potential difference does not occur, and the electrocardiogram cannot be measured. The distance between measurement electrodes is preferably 5 mm or more in order to prevent crosstalk. An array electrode can be used for the electromyograph. By mounting the one-dimensional array electrode along the muscle fiber, the myoelectric potential can be easily acquired as a signal having a large amplitude. By using a two-dimensional array electrode, information of a plurality of muscles can be acquired simultaneously, and a necessary myoelectric potential can be acquired by selecting an appropriate electrode set of the two-dimensional array electrode. Specialized knowledge and training are not required for installation, and simple measurement is possible. The number of measurement electrodes of the two-dimensional array electrode is preferably 4 or more, preferably 16 or more, and more preferably 30 or more. If there are 4 or more, the myoelectric potential generated from one muscle can be acquired with high sensitivity, if it is 16 or more, the movement of the upper limb can be classified in detail, and if it is 30 or more, the muscle of the inner muscle The potential can be estimated. As a classifier of upper limb movement, for example, Pattern Classification of Combined Motions Based on Muscular Synergy Theory, Journal of the Robotics Society of Japan, Vol. 28, No 5, pp 606, 2010 can be referred to.
The preferable range of the impedance of the measuring electrode is the same as that of the electrocardiograph.
The electromyograph may have a ground electrode in addition to the measurement electrode. Here, the ground electrode is the same as the ground electrode of the electrocardiograph.
In this embodiment, the electrode of this embodiment can be used as the measurement electrode and the ground electrode. If the adhesive electrode is used, the necessary information can be acquired without shifting the measurement position even when the measurement object is operated.
As a configuration example of the electromyograph, a configuration similar to the configuration example of the electrocardiograph illustrated in FIG. 13 can be exemplified. The illustrated electromyograph is composed of an electrode and an analog front end. The analog signal output from the electromyograph can be measured with an external measuring machine. The gain of the analog front end is preferably 100 to 100,000, and the frequency characteristic preferably has a characteristic of passing a signal having a frequency of 0.1 Hz to 10 kHz.
The analog front end preferably includes a buffer circuit, an amplifier circuit, and a filter circuit. As the buffer circuit, for example, an amplifier circuit (including a voltage follower) having a high input impedance can be used. The input impedance of the buffer circuit is preferably 100 kΩ or more, more preferably 1 MΩ or more, and even more preferably 100 MΩ or more. A differential amplifier circuit is preferably used as the amplifier circuit. By using the differential amplifier circuit, it is possible to remove in-phase noise on the two measurement electrodes. The filter circuit preferably uses a band-pass filter that passes a signal having a frequency of 0.1 Hz to 10 kHz. As the bandpass filter, a configuration in which a lowpass filter and a highpass filter are connected in series may be used.

The electromyograph can be used, for example, as a method for acquiring a myoelectric potential of a myoelectric actuator. A myoelectric actuator is a device that performs power control by means of myoelectric potential.
FIG. 14 shows an example of the operation flow of the myoelectric actuator. The myoelectric actuator operates through processes of myoelectric potential acquisition, signal preprocessing, feature amount extraction, classification, operation selection, and power control. Myoelectric potential acquisition is a step of measuring a user's myoelectric potential using an electromyograph. The signal pre-processing is a step of adding signal processing such as amplification, filtering, analog / digital conversion, etc. to the acquired myoelectric potential so as to easily extract the feature amount. The feature amount extraction is a step of extracting feature amounts to be input to the classifier from the preprocessed signal. Classification is a process of specifying a class by inputting a feature quantity into a classifier. The operation selection is a step of selecting an operation of the actuator corresponding to the classified class. The power control is a process of generating a control signal for each drive unit and transmitting it to the power in order to cause the actuator to perform the selected operation.
The myoelectric actuator includes a body surface potential measuring device and an actuator. A relay device may be used as necessary. Although the operation flow shown in FIG. 14 is performed with these configurations, the functions of each are not limited. As the configuration of the myoelectric actuator, for example, as shown in FIG. 15A, a body surface potential measuring device and a power control function having functions up to myoelectric potential acquisition, signal preprocessing, feature amount extraction, classification, and operation selection A body surface potential measuring device having a function of acquiring a myoelectric potential of a user, signal preprocessing, and a wireless data transmission function, wireless data transmission and reception, feature amount extraction, as shown in FIG. A configuration including a relay device having a classification / operation selection function and an actuator having a wireless data reception and power control function is exemplified. Since the myoelectric actuator having the configuration shown in FIG. 15A does not require a relay device, high-speed data analysis is possible, and high-real-time operation is possible. The myoelectric actuator having the configuration of FIG. 15B is a device in which the body surface potential measuring device and the actuator are wirelessly connected via a relay device, and the body surface potential measuring device and the actuator can be separated. The degree of freedom in shape design is improved. Further, by providing the relay device with a function, the body surface potential measuring device and the actuator can be reduced in size and power can be saved. Specific examples of myoelectric actuators include myoelectric prosthetic hands, myoelectric prostheses, myoelectric powered suits, and the like. A powered suit is a device intended for dynamic assistance of movement.
Among the above specific examples, the myoelectric prosthetic hand is a device that identifies the motion of the upper limb from the myoelectric potential of the upper limb and operates the actuator having the shape of the upper limb. The myoelectric prosthesis also operates according to the flow shown in FIG.
In the myoelectric potential acquisition process of the user, it is preferable to acquire the myoelectric potential of the upper limb muscles. As the myoelectric potential of the upper limb muscles, for example, ulnar carpal extensor, ulnar carpal flexor, long lateral carpal extensor, short lateral carpal extensor, radial lateral flexor, long palmar muscle, superficial digit flexor, Long thumb abductor, maternal and child bulb muscles, short palm, elbow, finger extensor, short thumb extensor, long thumb extensor, little finger extensor, total finger extensor, circular rotator muscle, brachial rib Examples include muscle, triceps, biceps, humerus, incisor arm and the like. In particular, measure the ulnar carpal extensor, the ulnar carpal flexor, the long lateral carpal extensor, the short lateral carpal extensor, the radial lateral flexor, the triceps, the biceps Bends, wrist bends, and wrist twists. The electromyograph preferably has a measurement electrode at a position where these myoelectric potentials can be acquired.

Hereinafter, the present invention will be specifically described by way of examples. However, the present invention is not limited to such examples.
Measurement / evaluation of the average secondary particle diameter of the conductive particles, the thickness of the adhesive electrode layer, the conductivity of the adhesive electrode, the adhesiveness, and the wearing feeling was performed as follows. Hereinafter, unless otherwise specified, measurement / evaluation was performed under the conditions of 25 ° C. and humidity of 45%.
(1) Average secondary particle diameter The average secondary particle diameter was measured using a scanning electron microscope. A specific operation will be described.
A sample (adhesive electrode layer) was cut into an appropriate size and subjected to BIB processing using an ion milling device E-3500 manufactured by Hitachi High-Technologies Corporation to prepare a cross section of the adhesive electrode layer. At this time, BIB processing was performed while cooling the sample as needed. The processed sample was subjected to a conductive treatment, and the cross section of the adhesive electrode layer was observed with a scanning electron microscope S-4800 manufactured by Hitachi, Ltd. An arbitrary field of view having 10 or more particles (secondary particles) was selected, all particle sizes in the image were measured, and the average value was taken as the average secondary particle size.
(2) Thickness of adhesive electrode layer The thickness was measured using a high precision type thickness gauge manufactured by Mitutoyo Corporation.
(3) Evaluation of conductivity The conductivity of the adhesive electrode is evaluated by attaching a 5 mm square copper foil to the surface of the adhesive electrode layer facing the copper foil substrate, and the copper foil substrate is a 5 mm square copper. The resistance value between the foil and the foil is measured. If it is less than 10Ω, it is judged as ◎. If it is 10Ω or more and less than 100Ω, it is judged as ○. If it is 100Ω or more and less than 10kΩ, Δ. If it is above, it was set as xx.
(4) Adhesive evaluation Adhesive evaluation of an adhesive electrode was evaluated by sticking the adhesive electrode to an upper arm wiped with alcohol and dropping within 10 seconds with the arm down, judged x △ judgment when falling within minutes, and ◯ judgment when sticking longer than 1 minute. Furthermore, the adhesive electrode was attached to the upper arm wiped with alcohol, and the case where the adhesive electrode was still attached after running for 1 minute was judged as ◎.
(5) Evaluation of feeling of wearing The feeling of wearing of the adhesive electrode is evaluated by sticking the adhesive electrode on the upper arm wiped with alcohol, discomfort at rest, discomfort at exercise (when sweating), glue after removal The presence / absence of the remaining portion was judged visually, and “X” was assigned to all cases, “△” was assigned to any two, “◯” was assigned to any one, and “◎” was not applied to any of them.

[Example 1]
20 g of silicone adhesive (Shin-Etsu Chemical Co., Ltd., KR-3701) and 0.1 g of platinum-based catalyst for silicone adhesive (Shin-Etsu Chemical Co., Ltd., CAT-PL-50T) are mixed by stirring with a rotating and rotating mixer, and hydrophobic An adhesive binder was obtained. 0.5 g of silver powder having an average particle diameter of 250 μm and 0.5 g of chloroform were added to 0.5 g of this hydrophobic adhesive binder, and the mixture was stirred and mixed with a stir bar to obtain a conductive adhesive.
The obtained conductive adhesive was stencil-printed on a 30 mm × 60 mm copper foil base material using a stencil plate, dried at room temperature for 5 minutes, and further heated on a hot plate heated to 120 ° C. for 5 minutes. Thus, an adhesive electrode layer was formed. The obtained adhesive electrode had a 1.3 cm square adhesive electrode layer, and the thickness of the adhesive electrode layer was 100 μm.
Table 1 shows the evaluation of conductivity and adhesiveness of the obtained adhesive electrode.

[Examples 2 to 30]
In the same manner as in Example 1, the conductive adhesive composition and the thickness of the adhesive electrode layer were changed as shown in Table 1, and adhesive electrodes of Examples 2 to 30 were produced.
The conductive fine particles CNT used in Examples 26 and 27 are carbon nanotubes having a cylindrical shape (diameter 60 nm, length 1 μm).

  The adhesive electrodes of Examples 1 to 25, 29, and 30 did not become sticky at rest and during exercise, and when they were removed, no adhesive residue was generated and a good wearing feeling was shown. Although the adhesive electrodes of Examples 26 and 27 had no unpleasant feeling, there was some adhesive residue, and thus the wearing feeling was judged as “good”. The adhesive electrode of Example 26 had a large silver particle and had a feeling of discomfort when worn at rest and during exercise, but there was no adhesive residue, so a feeling of wearing Δ was determined.

[Comparative Example 1]
As an adhesive electrode of Comparative Example 1, a disposable electrode SS-SUP00S manufactured by Sports Sensing Co. was used as it was. This electrode has a configuration in which an adhesive layer made of conductive gel is laminated on an electrode made of silver and silver chloride. The thickness of this conductive gel was 500 μm. In addition, this electroconductive gel does not contain electroconductive particle and has acquired low resistance by ion conduction.
The adhesive electrode of Comparative Example 1 had a strong feeling of stickiness at the time of wearing, an unpleasant feeling such as melting of the adhesive at the time of exercise, and a large amount of adhesive residue at the time of desorption.

[Example 31]
An electrocardiograph having the adhesive electrode of Example 12 as two measurement electrodes and one ground electrode was produced.
This electrocardiograph has a configuration having the above-described two measurement electrodes, one ground electrode, and an electronic circuit on a flexible base material. A PET film A4300 manufactured by Toyobo Co., Ltd. was used as the substrate. The wiring was formed by screen-printing Dotite FA-353N manufactured by Fujikura Kasei Co., Ltd. in a predetermined shape and heating and firing at 100 ° C. for 30 minutes. The insulating material contained in the wiring was about 50% by volume, and it was confirmed that it was in close contact with the substrate after firing. A commercially available IC chip is used for the electronic component, and for mounting the electronic component, Dotite XA-910 manufactured by Fujikura Kasei Co., Ltd. is stencil-printed into a predetermined shape, and the IC chip is placed on the printed XA-910, 100 ° C. The IC chip was fixed on the wiring by baking for 1 hour.
The electrocardiograph of this embodiment has a differential instrumentation amplifier, a high-pass filter, a low-pass filter, and an active ground at the analog front end. The gain of the differential instrumentation amplifier was set to 1000. The cutoff frequencies of the high pass filter and the low pass filter were designed to be 0.3 Hz and 1 kHz, respectively. The active ground is an amplifier that outputs 0V.
Two measurement electrodes were connected to the differential input to the differential instrumentation amplifier, and the ground electrode was connected to the output terminal of the active ground.
One measurement electrode was attached to the left chest, the other measurement electrode left abdomen, and the ground electrode was attached to the left abdomen. The output terminal from the electrocardiograph was connected to an oscilloscope 9304A manufactured by LeCroy, and the waveform was observed. The obtained waveform is shown in FIG. This electrocardiograph was able to obtain the same waveform as in FIG. 16 even when bent with a radius of curvature of about 50 mm.

According to the adhesive electrode of the present invention, it is possible to eliminate the risk of discomfort and rash when worn for a long time, and to acquire an accurate biological signal. For example, it can be suitably used for a body surface potential measuring device such as an electrocardiograph or an electromyograph.
Further, it can be suitably used for pathology, health condition diagnosis system, and biological machine interface using the body surface potential measuring device.

Claims (9)

Having an adhesive electrode layer made of a conductive adhesive containing a hydrophobic adhesive binder and conductive fine particles,
Adhesive electrode for obtaining body surface potential. The thickness of the adhesive electrode layer is 100 μm or more and 1 mm or less,
The adhesive electrode according to claim 1. The average secondary particle diameter of the conductive fine particles is 50 μm or more and 1 mm or less,
The adhesive electrode according to claim 1 or 2. The hydrophobic adhesive binder is a silicone-based adhesive;
The adhesive electrode according to any one of claims 1 to 3. The content of the hydrophilic material in the conductive adhesive is 5% by mass or less.
The adhesive electrode according to any one of claims 1 to 4. The conductive fine particles are contained in an amount of 10 parts by mass or more and 650 parts by mass or less with respect to 100 parts by mass of the solid content of the hydrophobic adhesive binder.
The adhesive electrode according to any one of claims 1 to 5. Having two or more adhesive electrodes according to any one of claims 1 to 6 on one substrate;
Array electrode. The adhesive electrode according to any one of claims 1 to 6, or the array electrode according to claim 7,
Body surface potential measurement device. A myoelectric actuator comprising the body surface potential measuring device according to claim 8.