JP7104120B2 - Potential measuring device - Google Patents

Description

The present invention relates to a potential measuring device. In particular, the present invention relates to a device that is fixed to various surfaces and is suitable for acquiring and measuring a surface potential.

The potentials that appear on the surface of the body, such as electrocardiograms, electromyograms, and electroencephalograms, are used as important indicators for medical treatment. The body surface potential measuring device for measuring the body surface potential is composed of a bioelectrode and an electronic circuit including an amplifier or the like that amplifies a signal captured from the bioelectrode. In recent years, from the viewpoints of home medical care, health care, long-term care, and QOL (Quality Of Life), a body surface potential measuring device capable of constantly measuring the body surface potential has been demanded. A service that determines the health condition of a person to be measured from a signal acquired by a body surface potential measuring device and presents advice for diagnosing a disease or improving health is being studied. In addition, the use as an interface between a human and a machine that operates a machine by converting a signal acquired by a body surface potential measuring device into a command is also being studied.
However, the conventional device cannot be worn for a long time due to the poor wearing feeling, and is not a service. In order to provide a practical service, a body surface potential measuring device having a good fit is required.

Patent Document 1 discloses a bioelectrode having an electrode head and an adhesive pad detachably attached to the electrode head. This bioelectrode can be fixed to the measurement target with an adhesive pad.

Patent Document 2 discloses an electric connector with a conductive adhesive layer which has an electric connector and a conductive adhesive layer formed on the electric connector and can be easily temporarily fixed to an electric junction. However, what is supposed to be fixed is an electrical junction having a flat surface such as an OA device, not the body surface of a living body.

Non-Patent Document 1 discloses a necklace-type electrocardiograph. The necklace type, which is easy to carry, alleviates the resistance to constant measurement. However, since the housing is large and hard, there is discomfort during mounting. It is also not suitable for sleep measurements as the device gets caught between the body and the ground when prone, causing pain. In addition, since a general bioelectrode formed of a hydrophilic conductive gel is used, the gel melts due to sweat, causing sticky discomfort and a rash, so that the gel cannot be used for a long time.

Patent Document 3 discloses a bioelectrode in which a garment and an electrode are integrated. Clothes worn on a daily basis have the function of bioelectrodes and can be worn for a long time. However, there is a problem that an accurate signal cannot be obtained because the clothes do not come into close contact with the skin, and there is a problem that a signal at a correct position cannot be obtained because the clothes shift when the measurement target operates.

Patent Document 4 discloses a body surface potential measuring device for controlling an artificial hand. However, the method for wearing it for a long time is not disclosed, and it cannot be used for a long time.

Patent Document 5 discloses a body surface potential measuring device provided with a myoelectric sensor, a signal processing unit, a wireless tag communication unit, and an antenna coil on a sheet having flexibility that can be freely deformed along the skin surface. ing. However, it is very difficult to mount an electronic component on a flexible sheet, and Patent Document 5 does not disclose a specific configuration and manufacturing method. Therefore, such a body surface potential measuring device is used. Cannot be manufactured.

Non-Patent Document 2 discloses an electromyogram made of a thin film transistor, and a body surface potential measuring device having a myoelectric sensor on a flexible sheet can be realized, but this device does not operate. Since a stable organic thin film transistor is used, it cannot be operated continuously for a long time. Further, since a very thin film is used as a base material in order to obtain flexibility, there is a problem that the durability is low and the film breaks in a short period of time.

Japanese Unexamined Patent Publication No. 2010-246751 Japanese Unexamined Patent Publication No. 2004-79278 JP-A-2015-83045 Japanese Unexamined Patent Publication No. 2001-231798 JP-A-2007-125104

2011. J. Penders, M.D. Altini, J. et al. van de Molengraft, F. et al. Yazioglu, C.I. Van Hof, A Low-power wareless ECG necklace for cardiac activity monitoring on-the-mov, Invited paper for EMBC 2011 T. Someya, 1 μm-Sickness 64-Channel Surface Electromyogram Measurement Sheet with 2V Organic Transistors for Professional Hand Controller, Electrical and Electronics Engineer

As mentioned above, although the body surface potential measuring device is already well known, none of them has a good wearing feeling, so that it is difficult to wear it for a long time, and it is also satisfactory in terms of measurement accuracy. There was nothing. Therefore, the problem to be solved by the present invention is to provide a potential measuring device that is comfortable to wear so that it can be worn for a long time and can measure more accurate data.

As a result of diligent studies to solve the above problems, the present inventor can mount the device along the uneven body surface by mounting the electronic circuit of the device on a flexible base material. The present invention has been completed by finding that it is possible to reduce a sense of discomfort during mounting, and that more accurate measurement can be performed by acquiring multipoint data by setting the number of measurement electrodes to two or more.

That is, the present invention is as follows.
[1] A potential measuring device having a flexible base material, an electronic circuit formed on the base material, and two or more measuring electrodes.
[2] The potential measuring device according to [1], wherein the measuring electrode is formed on a flexible base material.
[3] The potential measuring device according to [1] or [2], wherein the wiring contains an insulating material.
[4] The potential measuring device according to any one of claims 1 to 3, wherein the wiring includes at least one selected from the group consisting of silver, copper, and copper oxide.
[5] The potential measuring device according to any one of [1] to [4], wherein the connection between the wiring and the electronic component is formed of a composite material of a metal and an organic substance.
[6] The potential measuring device according to [5], wherein the organic substance is an epoxy resin.
[7] The potential measuring device according to any one of [1] to [6], wherein the electronic circuit includes a thin film transistor.
[8] The potential measuring device according to [7], wherein the buffer circuit includes a thin film transistor.
[9] The potential measuring device according to any one of [1] to [8], wherein a part of the surface is sealed with a rubber-like material.
[10] The potential measuring device according to [9], wherein the rubber-like material is a silicone resin.
[11] The potential measuring device according to any one of [1] to [10], wherein the measuring electrode is an adhesive electrode.
[12] An electromyographic actuator comprising the potential measuring device according to any one of [1] to [11].
[13] The method for manufacturing a potential measuring device according to any one of [1] to [11], which comprises a step of forming wiring by printing a conductive paste.
[14] The method for manufacturing a potential measuring device according to any one of [1] to [11], which comprises a step of mounting an electronic component on a wiring using a conductive adhesive and / or an anisotropic conductive adhesive.

According to the potential measuring device of the present invention, it is possible to provide a body surface potential measuring device that can be worn for a long period of time because it can realize a fit to the body surface that has never existed before and a good wearing feeling. can. Furthermore, it is possible to acquire multipoint data, which was difficult to acquire with a conventional device. Furthermore, these advantages can be applied not only to the measurement of body surface potential but also to the measurement of any surface potential.
Therefore, by using the potential measuring device of the present invention, it is possible to realize a disease diagnosis service using body surface potential information, an advice service for health promotion, and other control systems using various surface potential information.

It is the schematic which shows the specific example of the cross-sectional structure of the adhesive electrode which can be used in the device of this embodiment. It is a figure which shows the specific example of the arrangement when the non-conductive pressure-sensitive adhesive part is provided in the sticky electrode which can be used in the device of this embodiment. It is a figure which shows the specific example of the architecture of the electronic circuit included in the potential measurement device of this embodiment. It is a figure which shows an example of the layer structure of the thin film transistor which can be used for the electronic circuit included in the potential measurement device of this embodiment. It is a figure which shows the specific example of arrangement of a sensor, an analog front end and other electronic circuits in the potential measurement device of this embodiment. It is a figure which shows the specific example of the connection structure of a sensor and an analog front end in the potential measurement device of this embodiment. It is a figure which shows the specific example of the connection structure of a sensor and an analog front end in the potential measurement device of this embodiment. It is a figure which shows the specific example of the connection structure of a sensor and an analog front end in the potential measurement device of this embodiment. It is a figure which shows the specific example of the wiring for obtaining the electrical connection between an adhesive electrode and an electronic circuit in the potential measuring device of this embodiment. It is a figure which shows the specific example of the structure when the adhesive electrode, the base material, and the electronic circuit are integrated in the potential measuring device of this embodiment. It is a figure which shows the specific example of arrangement of an electronic circuit, a measuring electrode and a base material in the case which has a plurality of measuring electrodes in the potential measuring device of this embodiment. It is a figure which shows an example of the circuit structure of the potential measurement device of this embodiment. It is a figure which shows an example of the structure of the potential measurement device (electrocardiograph) of this embodiment. It is a figure which shows an example of the operation flow of the myoelectric actuator using the potential measuring device of this embodiment. It is a figure which shows an example of the structure of the myoelectric actuator using the potential measuring device of this embodiment. It is a figure which shows the waveform obtained by the electrocardiograph of Example 31.

Hereinafter, embodiments for carrying out the present invention (hereinafter, referred to as “the present embodiment”) will be described in detail below. The present invention is not limited to the following embodiments, and can be variously modified and implemented within the scope of the gist thereof.

[Potential measuring device]
The potential measuring device of the present embodiment has an electronic circuit formed on a flexible and flexible base material, and has at least two or more measuring electrodes. Hereinafter, the present embodiment will be described in detail.

In this embodiment, the potential measuring device is flexible due to its configuration.
The flexible potential measurement device can be worn for a long time without discomfort because it is comfortable to wear, and it can be worn along the shape of the surface such as the body surface (skin). The adhesion of the signal is improved, and a more accurate signal can be obtained.
Here, the term "flexible" means a state in which the device can be bent from a macroscopic point of view, and there may be a portion that cannot be bent locally. Here, the term “local” refers to a region of 900 mm ² or less. The bendable radius of curvature is preferably 1,000 m or less, more preferably 500 mm or less, and even more preferably 100 mm or less. If it is 1,000 mm or less, it can be attached to the human torso, if it is 500 mm or less, it can be attached to the human leg, and if it is 100 mm or less, it can be attached to the human upper limb. It becomes.

[Electronic circuit]
An electronic circuit is composed of wiring for electrically connecting electronic components to each other.
The function of the electronic circuit is not particularly limited, but it is preferable to have an analog front end and a power supply circuit. Further, it may have a control circuit, a communication circuit, a display circuit, a storage circuit, and the like.
The electronic circuit is formed on a flexible substrate.
The analog front end has a function of converting the analog signal output from the sensor and outputting the signal to the subsequent circuit. Signal conversion includes amplification, filtering, rectification, A / D conversion, and the like. The analog front end includes a buffer circuit, an amplifier circuit, a level shift circuit, a filter circuit (high-pass filter circuit, low-pass filter circuit, band-pass filter circuit, band-eliminate circuit, etc.), in-phase removal circuit, adder circuit, subtraction circuit, and integrator circuit. , Differentiator circuit, rectifier circuit, analog-digital conversion circuit, etc. are included. In order to acquire a high output impedance signal without attenuation, it is preferable that the analog front end has a buffer circuit for receiving an input signal from a sensor, and it is amplified to acquire a minute signal such as a skin potential. It is preferable to have a circuit, and it is preferable to have a filter circuit for noise reduction.

The power supply circuit supplies power to each part of the potential measuring device. The power supply circuit includes a step-up circuit, a step-down circuit, a voltage regulator, a rectifier circuit, an AC-DC converter, a DC-DC converter, a DC-AC converter, an AC-AC converter and the like. Further, a circuit for detecting the remaining battery level, power consumption, etc., a standby power supply circuit, and the like may be included.
As a method of supplying electric power to the power supply circuit, battery power supply, wire power supply, wireless power supply, energy harvesting, or the like can be used. Battery-powered, wireless-powered, and energy harvesting are preferred because they are portable. In particular, wireless power feeding and energy harvesting are preferable because the potential measuring device can be miniaturized.

The control circuit controls the operation of each part of the potential measuring device. The control circuit includes a CPU and is connected to an analog front end, a power supply circuit, a sensor, a communication circuit, a display circuit, a storage circuit, and the like. The CPU processes and executes instruction groups, data, and programs stored in the storage circuit. The program includes a signal processing program, a communication control program, and the like. If the potential measuring device performs advanced processing, it may be provided with a processor dedicated to data processing.
Further, when the potential measuring device performs advanced calculations, the control circuit may be provided with a pattern recognition unit. The pattern recognition unit may be included in the CPU, but may have a dedicated processor. The pattern recognition unit extracts a pattern from the data output from the analog front end and outputs an instruction assigned to each pattern.
Communication circuits transfer data to servers and relay devices. Data transfer may be wired or wireless, but wireless is preferable because it is easy to carry. The wireless communication circuit includes, for example, a modulation circuit, a demodulation circuit, a rectifier circuit, a storage circuit, an antenna, and the like. The modulation method is not limited, but amplitude modulation, frequency modulation, phase modulation can be used, and a modulation method that combines a plurality of modulation methods such as right-angle phase amplitude modulation can be used. In particular, the quadrature amplitude modulation method is preferable because the data transfer speed is high. Although the wireless communication frequency band is not limited, it is preferable to use the LF band, the HF band, the VHF band, and the UHF band, which are easily available for communication circuits.

The display circuit displays various information on the screen. As the display circuit, for example, a liquid crystal display, electronic paper, an organic EL display, a braille display, a tactile display, or the like can be used. In particular, electronic paper and organic EL displays are preferable because they can be flexibly formed, and electronic paper is more preferable because it consumes less power.

As the architecture of the electronic circuit, for example, the configuration shown in FIG. 3 can be adopted. The architecture of FIG. 3 includes a sensor, an analog front end, a control circuit, a power supply circuit, a display circuit, a storage circuit, and a communication circuit. The sensor output is tuned by the analog front end and passed to the control circuit. A power supply circuit, a display circuit, a storage circuit, and a communication circuit are connected to the control circuit, and the control circuit controls the operation of these circuits and the calculation of the sensor output.

Materials that form wiring include gold, silver, copper, nickel, aluminum, titanium, vanadium, chromium, manganese, iron, cobalt, zinc, niobium, molybdenum, palladium, cadmium, indium, tin, antimony, lantern, tantalum, Metals such as tungsten, platinum and lead, oxides of these metals, nitrides, salts and carbon materials such as carbon, graphite, fullerene, carbon nanotubes and graphene, and π such as polythiophene, polyaniline, polypyrrole, polyacetylene and polyphenylene vinylene. A material composed of a conjugated molecule, a π-conjugated molecule such as PEDOT / PSS, and a dopant can be used. In particular, metal is preferable because it has high conductivity, and aluminum, copper, silver, and gold are more preferable because they have high reliability for bending. Copper is particularly preferable because it is inexpensive. As the metal, a metal composed of one element can be used, or an alloy composed of a plurality of types of metals can be used.
Further, the wiring may contain an insulating material. The insulating material may form a laminated structure with the conductive material, or may form a regularly / irregularly mixed structure. By containing an insulating material, the flexibility of the wiring itself and the adhesion between the wiring and the base material are improved, and it is possible to obtain a wiring that does not break due to bending or expansion and contraction, which is preferable. Examples of the insulating material include polyimide, polyethylene terephthalate (PET), polyether sulfone (PES), polyethylene naphthalate (PEN), polyester, polycarbonate (PC), polyvinyl alcohol (PVA), and polyvinyl butyral (PVB). , Polyacetal, Polyarylate (PAR), Polyamide (PA), Polyamideimide (PAI), Polyetherimide (PEI), Polyphenylene ether (PPE), Polyphenylene sulfide (PPS), Polyether ketone (PEK), Polyphthalamide (PEK) PPA), polyether nitrile (PEN), polybenzimidazole (PBI), polycarbodiimide, polysiloxane, polymethacrylicamide, nitrile rubber, acrylic rubber, polyethylene tetrafluoride, epoxy resin, phenol resin, melamine resin, urea resin, Polymethylmethacrylate resin (PMMA), polybutene, polypentene, ethylene-propylene copolymer, ethylene-butene-diene copolymer, polybutadiene, polyisoprene, polychloroprene, ethylene-propylene-diene copolymer, nitrile rubber, chloro Sulfated polyethylene, acrylic rubber, epichlorohydrin rubber, urethane rubber, butyl rubber, fluororubber, polymethylpentene (PMP), polystyrene (PS), styrene-butadiene copolymer, polyethylene (PE), polyvinyl chloride (PVC), polyfluor Vinylidene (PVDF), polyether ether ketone (PEEK), phenol novolac, benzocyclobutene, polyvinylphenol, polychloropyrene, polyoxymethylene, polysulfone (PSF), silicone resin and the like can be used. As the sealing material, a material having a large elastic limit and a low elastic modulus is preferable. Specifically, it is preferable to use a rubber-like material, for example, ethylene-propylene copolymer, ethylene-butene-diene copolymer, polybutadiene, polyisoprene, polychloroprene, ethylene-propylene-diene copolymer, nitrile. Examples thereof include rubber, chlorosulfonated polyethylene, acrylic rubber, epichlorohydrin rubber, urethane rubber, butyl rubber, styrene-butadiene copolymer, fluororubber, silicone resin and the like. The content of the insulating material in the wiring is preferably 0.1% by mass or more, more preferably 1% by mass or more, and further preferably 5% by mass or more. Further, it is preferably 30% by mass or less, more preferably 20% by mass or less, and further preferably 10% by mass or less. The content of the insulating material in the wiring is preferably 1% by volume or more, more preferably 10% by mass or more, and further preferably 20% by mass. Further, it is preferably 70% by volume or less, more preferably 60% by volume or less, and further preferably 50% by volume or less. The content of the insulating material in the wiring can be confirmed by a method of observing the wiring cross section with an electron microscope, a method of estimating the composition ratio by thermal weight measurement, or the like.
The method for forming the wiring is not particularly limited, and examples thereof include a vapor deposition method, a sputtering method, and a printing method. As a method of performing patterning using a thin-film deposition method and a sputtering method, there are mask deposition and photolithography. Mask vapor deposition is a method in which a mask having holes having a desired shape is laminated on a base material and then vapor-deposited or sputtered to form a material only in the pores of the mask. The printing method is a method of forming wiring by printing a conductive paste on a base material. The printing method is preferable because the material utilization efficiency is high and the process is simple, so that wiring can be formed at low cost.

The conductive paste used for forming the wiring contains, for example, a conductive material, a binder, a solvent, a surfactant and the like. As the conductive material, the same material as the wiring material can be used. In particular, copper, silver, gold, and oxides thereof can be preferably used. In particular, copper or copper oxide is preferable because it is inexpensive.
As the conductive paste, a commercially available product can be used. For example, Fujikura Kasei's Dotite series (FA-333, FA-353N, XA-602N, XA-436, FA-301CA, FA-401CA, etc.), Harima Kasei's conductive paste (SCE-100, SP-100, etc.) , SP-500, CP-700, etc.) and nanopaste (NPS-JL, NPS-J, NPS, NPS-HTB, NPS-HB, NPG-J, etc.) and the like can be used.

There are various printing methods for forming the wiring by the printing method, and the wiring is not particularly limited. For example, screen printing, spray coating, spin coating, slit coating, die coating, bar coating, knife coating, offset printing, reverse printing, letterpress printing, flexo printing, inkjet printing, dispenser printing, gravure direct printing, gravure offset printing, stencil printing. Etc. can be used. In particular, screen printing is preferable because thick film printing is possible and low resistance wiring can be obtained.
The substrate may be washed prior to printing. As a method for cleaning the substrate, for example, a wet treatment using a chemical solution, a corona discharge, a dry treatment using plasma, UV, ozone, or the like can be used. Both wet treatment and dry treatment may be used.
The solvent is preferably removed from the wiring formed by printing. The solvent can be removed by allowing the printed film to stand at, for example, 20 to 150 ° C. for, for example, 1 minute to 2 hours. As the heating method in this case, for example, hot air drying, infrared drying, vacuum drying and the like can be used.
The film thickness of the printing film can be selected according to the printing method.
For example, when inkjet printing is applied, the film thickness of the printing film is preferably 0.1 to 10 μm, more preferably 0.5 to 5 μm as the value after removing the solvent.
When screen printing is applied, the print film thickness value after removing the solvent is preferably 1 to 100 μm, more preferably 10 to 50 μm.
When reverse printing is applied, the print film thickness value after removing the solvent is preferably 0.01 to 5 μm, more preferably 0.1 to 1 μm.

The printed film for wiring obtained as described above may then be subjected to a firing treatment.
The firing treatment may be performed using, for example, a heat treatment device such as a firing furnace, or may be performed using plasma, microwave plasma, ultraviolet rays, vacuum ultraviolet rays, electron beams, infrared lamp annealing, flash lamp annealing, laser, or the like. You may. In particular, the flash lamp annealing treatment and the plasma treatment have a feature that the conductive material is strongly heated but the insulating material is not heated so much. Therefore, when a resin base material is used as the base material, only the conductive paste is heated and the base material is not damaged by heat. Therefore, an inexpensive resin such as PET can be used as the base material, which is preferable. In particular, plasma treatment is more preferable because only the surface of the conductive paste tends to be heated and the damage to the base material due to heat transfer is small. The heat treatment using the heat treatment apparatus is preferable because general-purpose equipment can be used and the equipment cost can be reduced.
In order not to oxidize the wiring obtained after firing, it is preferable that the printing film is fired in a non-oxidizing atmosphere. When the conductive paste contains an oxide, the printing film should be fired in a reducing atmosphere in order to promote the reduction of the oxide and reduce the resistance of the obtained wiring as much as possible. Is more preferable.
The above-mentioned non-oxidizing atmosphere is an atmosphere that does not contain an oxidizing gas such as oxygen. The non-oxidizing atmosphere includes an inert atmosphere and a reducing atmosphere. The inert atmosphere is, for example, an atmosphere filled with an inert gas such as argon, helium, neon, and nitrogen.
The above-mentioned reducing atmosphere refers to an atmosphere in which a reducing gas such as hydrogen or carbon monoxide is present. As the reducing gas, a mixed gas obtained by mixing a small amount of the reducing gas with the inert gas can be preferably used from the viewpoint of safety. The mixed gas in this case is, for example,
A mixed gas consisting of 5.7% by volume or less of hydrogen and nitrogen;
A mixed gas or the like consisting of 2.9% by volume or less of hydrogen and a gas containing one or more inert gases selected from the group consisting of helium and argon can be used. Since these mixed gases are non-flammable, they can be used more safely.
These gases may be filled in a firing furnace and the printed film may be fired as a closed system. The printing film may be fired while the firing furnace is used as a distribution system and these gases are allowed to flow. When the printing film is fired in a non-oxidizing atmosphere, it is preferable to first draw a vacuum in the firing furnace to remove oxygen in the firing furnace and then replace it with a non-oxidizing gas.
The firing treatment may be performed under pressure or under reduced pressure.
As described above, the firing treatment in the present embodiment is preferably heat treatment, plasma treatment, or flash lamp annealing treatment. Hereinafter, these processes will be described.

The heat treatment as the above-mentioned firing treatment is specifically a treatment of heating a sample by contacting it with a high-temperature medium. Plasma treatment and flash lamp annealing treatment are not included in the heat treatment.
The high-temperature medium is not particularly specified, but for example, air, an inert gas, a reducing gas, a liquid, a metal, a ceramic, or the like can be used.
The heat source for heating the medium is not particularly specified, but for example, a far-infrared heater, a near-infrared heater, a resistance heating heater, a microwave heater, a combustion heating heater and the like can be used. As the far-infrared heater, for example, a halogen heater, a quartz tube heater, a carbon heater, a sheathed heater, a metal heater and the like can be used. As the near-infrared heater, for example, a halogen heater or the like can be used. As the resistance heating heater, for example, a metal heater, a ceramic heater, or the like can be used. As the heating element of the metal heater, for example, alloys such as iron-chromium-aluminum alloy and nickel-chromium alloy, and metals such as platinum, molybdenum, tantalum, and tungsten can be used. As the heating element of the ceramic heater, for example, silicon carbide, molybdenum-silicite, carbon or the like can be used. The microwave heater is a heater of a type that heats an object by an electromagnetic wave of about 100 kHz to 10 GHz. The combustion heater is a type of heater that heats an object by the heat of combustion when combustibles such as heavy oil and gas are burned.
The heat treatment temperature is preferably 300 ° C. or lower, more preferably 200 ° C. or lower, and even more preferably 150 ° C. or lower. If the heat treatment temperature is 300 ° C. or lower, a flexible printed circuit board can be formed using a heat-resistant flexible base material such as PI, and if the heat treatment temperature is 200 ° C. or lower, a transparent flexible base material such as PC or PEN is used. A printed circuit board can be formed, and if the temperature is 150 ° C. or lower, a flexible printed circuit board can be inexpensively formed by using a general-purpose resin substrate having low heat resistance such as PET but which is inexpensive. The heat treatment temperature is preferably 20 ° C. or higher, more preferably 30 ° C. or higher, and even more preferably 50 ° C. or higher. If the temperature is 20 ° C. or higher, the conductive material moves in the printing film due to thermal vibration, and the conductive materials come into contact with each other, so that the volume resistivity can be lowered. If the temperature is 30 ° C. or higher, the movement of particles in the printing film is accelerated due to the softening of organic substances in the printing film. Further, when the organic substance is softened, the conductive material is settled due to the difference in specific gravity between the conductive material and the organic substance, and is separated into a layer of the conductive material and a layer of the organic substance, so that the insulating organic substance is difficult to enter between the conductive materials. Therefore, the volume resistivity can be further lowered. If the temperature is 50 ° C. or higher, the sintering of the conductive materials proceeds, so that the volume resistance can be further reduced.
The heat treatment time is preferably 1 minute or longer, and more preferably 10 minutes or longer. If the heat treatment time is 1 minute or more, the resistance of the fired film can be reduced by bringing the conductive materials into contact with each other, and if the heat treatment time is 10 minutes or more, the sintering of the conductive materials proceeds further. The resistance of the fired film can be reduced. Further, the heating and firing time is preferably 4 hours or less from the viewpoint of reducing heat damage to the base material.

Specifically, the plasma treatment as the above-mentioned firing treatment is a treatment for exposing the sample to the plasma by generating plasma in the space where the sample is placed.
The method of generating plasma is not particularly specified, but for example, a method using a DC arc discharge, a high-frequency electromagnetic field, a microwave, or the like can be used. In particular, the method using microwaves is preferable because plasma can be generated at a low temperature and the heat damage to the substrate is small. Specifically, the microwave refers to an electromagnetic wave having a frequency of 300 MHz to 3 THz. The center frequency of the microwave is preferably 2 GHz to 4 GHz, more preferably 2.4 GHz to 2.5 GHz.
The device for generating microwave plasma is composed of, for example, a microwave oscillator, a transmission circuit, an antenna, and a discharge container. In addition to these, a magnetic field generator may be further used if necessary. In this device, plasma is generated in the discharge vessel. As the microwave oscillator, for example, a klystron, a magnetron, a gyrotron or the like can be used. As the transmission circuit, for example, a rectangular waveguide, a circular waveguide, a coaxial line, or the like can be used. A power monitor and a dummy load that absorbs reflected power may be installed in the middle of the transmission circuit. The structure of the apparatus includes, for example, a transmission line at the upper part, a discharge container at the lower part, the transmission line and the discharge container are connected via a quartz window, and a sample table is installed at the lower part of the discharge container. It is preferable that it is.
The microwave output is not particularly specified, but it is preferably 100 W or more and 3 kW or less. The microwave output may be constant during processing or may be changed during processing.
The temperature of the sample table is not particularly specified, but it is preferably 30 ° C. or higher and 150 ° C. or lower. When this temperature is 150 ° C. or lower, a general-purpose resin substrate having low heat resistance such as PET can be used as the base material. If the temperature is 30 ° C. or higher, low resistance wiring can be obtained.
The ambient atmosphere during plasma treatment is not particularly specified, but a reducing atmosphere is preferable. The ambient atmosphere can be controlled, for example, by flowing an appropriate gas into the discharge vessel. Although the flow rate of the gas is not particularly specified, it is preferably 10 SCCM or more and 1,000 SCCM or less, more preferably 50 SCCM or more and 500 SCCM or less, and further preferably 100 SCCM or more and 300 SCCM or less under reduced pressure. Under atmospheric pressure, it is preferably 500 SCCM or more and 10,000 SCCM or less, more preferably 1,000 SCCM or more and 6,000 SCCM or less, and further preferably 2,000 SCCM or more and 4,000 SCCM or less. In particular, it is preferable to form a reducing atmosphere by flowing a mixed gas formed by mixing a small amount of hydrogen with the inert gas. As the inert gas in this mixed gas, for example, nitrogen; a rare gas such as helium or argon can be used. The content of hydrogen in the mixed gas is preferably 0.1% by mass or more and 10% by mass or less, and more preferably 2% by mass or more and 6% by mass or less.
The pressure in the discharge container may be atmospheric pressure or may be reduced.
Although the plasma treatment time is not particularly specified, it is preferably 10 seconds or more and 30 minutes or less, more preferably 30 seconds or more and 10 minutes or less, and further preferably 1 minute or more and 5 minutes or less.

The flash lamp annealing treatment as the above-mentioned firing treatment is a treatment for heating a sample by irradiating the sample with light having a high energy density in a pulsed manner.
As the light source used for the flash lamp annealing treatment, for example, a xenon lamp, a krypton lamp, or the like can be used.
The wavelength of the light source is preferably in the visible light region because the printed film can be fired without causing heat damage to the transparent resin substrate. The wavelength of the light source can be easily controlled via a color filter.
The energy per pulse is not particularly specified, but is preferably 1 J or more and 3,000 J or less, more preferably 10 J or more and 2,000 J or less, and further preferably 100 J or more and 1,500 J or less. ..
Although the pulse time is not particularly specified, it is preferably 10 μs or more and 100 msec or less, more preferably 50 μs or more and 10 msec or less, and further preferably 100 μs or more and 5 msec or less. Here, the pulse time refers to the time from the time when the power is applied to the lamp for pulse light irradiation to the time when the power supply to the lamp is stopped due to the pulse light extinguishing.
The sample may be irradiated with pulsed light multiple times. The pulse interval is not particularly specified, but is preferably 10 μs or more and 1 second or less. Here, the pulse interval means the time from the time when the electric power is applied to the lamp for the irradiation of the pulsed light to the time when the electric power is applied to the lamp for the irradiation of the next pulsed light.
The temperature of the sample table is not particularly specified, but it is preferably 30 ° C. or higher and 150 ° C. or lower. When this temperature is 150 ° C. or lower, a general-purpose resin substrate having low heat resistance such as PET can be used as the base material. If the temperature is 30 ° C. or higher, a dense copper film can be obtained.
During the flash lamp annealing treatment, gas may flow into the container. In this case, since the sample is cooled by the gas flow, the thermal damage of the base material can be reduced.
The ambient atmosphere during the flash lamp annealing treatment is not particularly specified, but a reducing atmosphere is preferable. Specific examples of this reducing atmosphere and gas flow rate are the same as those described above for the reducing atmosphere during plasma treatment.
After the flash lamp annealing treatment, a pressure treatment may be further performed. By pressurizing the sample after the flash lamp annealing treatment, the formed copper film can be made more dense, which is preferable. As the pressurizing method, for example, a roller press, a flat plate press, or the like can be used. A roller press is particularly preferable because it is suitable for a large area press.

As the electronic component constituting the electronic circuit, an active component, a passive component, a structural component, a component having a plurality of functions mounted on one chip (for example, an ASIC (Application Specific Integrated Circuit)), and the like can be used. By mounting these electronic components on a base material, an electronic circuit can be formed. In particular, the ASIC is preferable because it can mount multiple functions in a small area and the potential measuring device can be miniaturized. These electronic components can be mounted on a conductive land formed on a base material by using a bonding material.
Generally, semiconductor parts such as active parts and ASICs are formed by using a silicon wafer, but parts formed by a thin film transistor can also be used. The component formed by the thin film transistor is preferable because the component itself has flexibility and the potential measuring device can be formed extremely flexibly. A thin film transistor is a transistor in which a semiconductor layer serving as a channel of the transistor is formed by a thin film process. The thin film process is a general term for processes for forming a thin film, and includes, for example, a vapor deposition method, a sputtering method, a CVD method, an ALD method, a printing method, and the like.

The thin film transistor is generally an element composed of a gate electrode, a drain electrode, a source electrode, a gate insulating film, and a semiconductor. FIG. 4 shows an example of the layer structure of the thin film transistor. The structure of FIG. 4 (a) is the bottom gate top contact structure, the structure of FIG. 4 (b) is the bottom gate bottom gate structure, the structure of FIG. 4 (c) is the top gate bottom contact structure, and the structure of FIG. 4 (d) is Top gate Top contact structure. In particular, a bottom gate top contact structure and a top gate bottom contact structure are preferable because elements having high characteristics can be obtained. Further, the bottom gate bottom contact structure is preferable because it is easy to manufacture.
As the semiconductor material, an organic semiconductor material, an inorganic semiconductor material, and an organic-inorganic composite semiconductor material can be used.
As the organic semiconductor material, a carbon material, a high molecular weight organic semiconductor material, and a low molecular weight organic semiconductor material can be used. The polymer organic semiconductor material can be formed by printing, and can be manufactured at low cost. Small molecule organic semiconductor materials generally have high purity, small changes in characteristics due to DC bias and temperature, and can realize devices with stable operation.
As the polymer organic semiconductor material, for example, π-conjugated polymer, π-conjugated graft polymer, π-conjugated block polymer and the like can be used. Here, the π-conjugated polymer refers to a material in which the π-conjugated polymer main chain continues uninterrupted. The π-conjugated block polymer refers to a copolymer having two or more types of repeating units and having repeating units having at least one type of π-conjugated structure. The π-conjugated graft polymer means a polymer having a π-conjugated structure in the side chain.
Examples of the P-type polymer organic semiconductor material include polythiophene derivatives, polyphenylene derivatives, polyaniline derivatives, polyphenylene vinylene derivatives, polyacetylene derivatives, polydiacetylene derivatives, polytriphenylamine derivatives, polyacene derivatives, polyfluorene derivatives, triphenylamine and phenylene vinylene. A copolymer derivative of thiophene and phenylene, a copolymer derivative of thiophene and thienothiophene, a copolymer derivative of thiophene and fluorene, and the like can be used. Specific examples of the P-type polymer organic semiconductor material include poly 3-hexylthiophene, poly [2,5-bis (3-tetradecylthiophene-2-yl) thieno [3,2-b] thiophene], and poly. [Bis (4-phenyl) (2,4,6-trimethylphenyl) amine] and the like can be used.
Examples of the N-type polymer organic semiconductor material include polybenzobisimidazole benzophenanthroline derivatives, polythiazole derivatives, polyfluorothiophene derivatives, polyfluorophenylene derivatives, polycyanoterephthalidene derivatives, polymers having a fluorenone skeleton, 9, 9-. Polymer with biscyanoethylfluorene skeleton, polymer with thiazole skeleton, polymer with benzothiaziazole skeleton, polymer with triazole skeleton, polymer with benzothiazole skeleton, polymer with naphthalenetetracarboxydiimide skeleton, polymer with perylenetetracarboxydiimide skeleton Polymers and the like can be used.
Examples of the P-type low molecular weight organic semiconductor material include acene derivatives, pyrene derivatives, perylene derivatives, coronene derivatives, picene derivatives, thienoacene derivatives, phenylene vinylene derivatives, fluorene derivatives, oligofuran derivatives, oligothiophene derivatives, tetrathiafluvalene derivatives, and phthalocyanine. Derivatives, porphyrin derivatives, azaacene derivatives, indolocarbazole derivatives, carbazole derivatives and the like can be used. Specific examples of P-type low molecular weight organic semiconductor materials include tetracene, pentacene, rubrene, 6,13-bis (triisopropylsilylethynyl) pentacene, C8-BTBT (Aldrich), DNTT, C10-DNTT, and DNT (Dinaft). Thiophen), alkyldinaphthophene, phthalocyanine copper (II), 4,4'-bis (N-carbazolyl) -1,1'-biphenyl, N, N'-di-[(1-naphthyl) -N, N '-Diphenyl]-(1,1'-biphenyl) -4,4'-diamine and the like can be used.
Examples of N-type low molecular weight organic semiconductor materials include fluoroacene derivatives, π-conjugated molecules having a perfluoroalkyl group, π-conjugated molecules having a perfluorophenyl group, π-conjugated molecules having a cyano group, naphthalenetetracarboxydiimide derivatives, and perylene. Tetracarboxydiimide derivatives, coronenimide derivatives, fullerene derivatives and the like can be used. Specifically, as an N-type low molecular weight organic semiconductor material, 1,2,3,4,8,9,10,11,15,16,17,18,22,23,24,25-hexadecafluorophthalocyanine Copper (II), N, N'-dioctyl-3,4,5,10-perylenetetracarboxydiimide, [6,6] -phenyl-C61-methyl butyrate and the like can be used.
As the carbon material, graphene, carbon nanotubes, fullerenes and the like can be used.
As the inorganic semiconductor material, elemental elemental semiconductors, oxide semiconductors, compound semiconductors, sulfide semiconductors and the like can be used. Examples of the elemental semiconductor include silicon and germanium. Examples of oxide semiconductors include IGZO (indium-gallium-zinc oxide), IZO (indium-zinc oxide), zinc oxide, indium oxide, titanium oxide, tin oxide, tungsten oxide, niobium oxide, and cuprous oxide. Etc. are exemplified. Examples of the compound semiconductor include gallium arsenide (GaAs), gallium arsenide phosphorus (GaAsP), gallium phosphide (GaP), cadmium selenium (CdSe), silicon carbide (SiC), indium antimonide (InSb), gallium nitride and the like. To. Examples of the sulfide semiconductor include molybdenum sulfide and cadmium sulfide.
The crystal structure of the inorganic semiconductor material is not particularly limited. Inorganic semiconductors having an amorphous structure can be suitably used because they can form a device that is flexible and comfortable to wear.
Examples of the organic-inorganic composite semiconductor material include semiconductor materials that combine the above-mentioned inorganic semiconductor materials and organic materials, semiconductor materials that combine inorganic materials and organic semiconductor materials, and semiconductor materials that combine inorganic semiconductor materials and organic semiconductor materials. Can be mentioned.

Examples of mounting methods of electronic components on wiring in each electronic circuit include through-hole mounting, surface mounting, wire bonding, flip chip mounting, and the like. In particular, surface mounting and flip chip mounting are preferable because the mounting area can be reduced and the bonding strength is high.
The connection portion between the electronic component and the wiring may be formed of metal or may be formed of a composite of metal and organic matter. It is preferable to have an organic substance in the connecting portion because it is possible to prevent the electronic components from falling off due to bending of the device. As the organic substance used for the connecting portion, a curable resin can be used. As the curable resin, for example, an epoxy resin, an acrylic resin, an ester resin, a silicone resin, or the like can be used. In particular, epoxy resins are preferable because they have high connection strength with metals.
Examples of the joining material include solder, conductive paste, conductive adhesive, and anisotropic conductive adhesive. In particular, conductive adhesives and anisotropic conductive adhesives are preferable because they can be bonded at a low temperature so that they can be mounted on a flexible substrate. Examples of the conductive adhesive include the conductive adhesive LS-109 manufactured by Asahi Chemical Laboratory Co., Ltd., Dotite FA-705BN manufactured by Fujikura Kasei Co., Ltd., XA-874, XA-910, SA-2024, XA-220MV, XA- 519B, FA-730, XA-819A, D-753, A-3 / C-3, Namics surface mount adhesives H9626, H9672, die attaches H9607, H9863, H9683, H980, H9870, Sk70N, H9940, Flip chip adhesive H9807, conductive resin TB3303G (NEO) manufactured by ThreeBond Co., Ltd., TB3331L, TB333C, TB3351C and the like can be used.
Further, the thin film transistor can be formed directly on the base material, and an extremely thin electronic circuit can be formed, which is preferable.

[Base material]
In the present embodiment, by making the base material on which the electronic circuit is formed flexible, it is possible to install the electronic circuit along the surface shape even when measuring the potential of the uneven or wavy surface. Therefore, the adhesion between the surface and the potential measuring device is improved, and a more accurate signal can be acquired. In addition, when the potential measuring device is used for measuring the potential on the surface of the body, the wearing feeling is improved and the device can be worn for a long time without discomfort.
Specific examples of the base material include PET, PEN, PC, COP, PI, silicone, Teflon (registered trademark), thin film glass, metal leaf, an organic material in which an inorganic filler is dispersed, and an organic material coated with an inorganic layer on the surface. It is preferable to use a material. In particular, PET and PEN are preferable because they can be obtained at low cost, and PI is preferable because they can be soldered.
The thickness of the base material is not particularly limited, but is preferably 1 μm or more, more preferably 10 μm or more, preferably 5 mm or less, more preferably 1 mm or less, and 200 μm or less. Is even more preferable. If it is 1 μm or more, it can be used as a self-supporting film, and if it is 10 μm or more, a high-strength film can be obtained and handling becomes easy. If it is thicker than 5 mm, the weight of the device becomes heavier and the wearing feeling becomes worse. Therefore, it is preferably 5 mm or less. If it is 1 mm or less, flexibility can be obtained, and if it is 200 μm or less, the thickness will be comfortable even if clothes are worn on the body surface potential measuring device.

The potential measuring device in this embodiment may be sealed with a sealant. As the sealing agent, an organic material, an inorganic material, or an organic-inorganic composite material can be used.
Examples of the organic material include polyimide, polyethylene terephthalate (PET), polyether sulfone (PES), polyethylene naphthalate (PEN), polyester, polycarbonate (PC), polyvinyl alcohol (PVA), polyvinyl butyral (PVB), and polyacetal. , Polyarylate (PAR), Polyamide (PA), Polyamideimide (PAI), Polyetherimide (PEI), Polyphenylene ether (PPE), Polyphenylene sulfide (PPS), Polyether ketone (PEK), Polyphthalamide (PPA) , Polyethernitrile (PEN), Polybenzimidazole (PBI), Polycarbodiimide, Polysiloxane, Polymethacrylicamide, Nitrile rubber, Acrylic rubber, Polyethylene tetrafluoride, Epoxy resin, Phenolic resin, Melamine resin, Urea resin, Polymethacryl Methyl acid acid resin (PMMA), polybutene, polypentene, ethylene-propylene copolymer, ethylene-butene-diene copolymer, polybutadiene, polyisoprene, polychloroprene, ethylene-propylene-diene copolymer, nitrile rubber, chlorosulfonated Polyethylene, acrylic rubber, epichlorohydrin rubber, urethane rubber, butyl rubber, fluororubber, polymethylpentene (PMP), polystyrene (PS), styrene-butadiene copolymer, polyethylene (PE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polyether ether ketone (PEEK), phenol novolac, benzocyclobutene, polyvinylphenol, polychloropyrene, polyoxymethylene, polysulfone (PSF), silicone resin and the like can be used. As the sealing material, a material having a large elastic limit and a low elastic modulus is preferable. Specifically, it is preferable to use a rubber-like material, for example, ethylene-propylene copolymer, ethylene-butene-diene copolymer, polybutadiene, polyisoprene, polychloroprene, ethylene-propylene-diene copolymer, nitrile. Examples thereof include rubber, chlorosulfonated polyethylene, acrylic rubber, epichlorohydrin rubber, urethane rubber, butyl rubber, styrene-butadiene copolymer, fluororubber, silicone resin and the like. Since the rubber-like material exhibits flexibility even with a thick film, the surface of the potential measuring device using a thick chip-type electronic component can be smoothly sealed while imparting flexibility. In particular, since silicone resin has high flexibility, cushioning property, and chemical resistance, it has a high ability to protect internal electronic circuits and can improve the durability of the potential measuring device, which is preferable. In addition, biocompatibility. It is highly resistant and can be worn for a long time.
As the inorganic material, for example, metal oxide, metal fluoride, metal carbide, metal carbon oxide, metal nitride and the like can be used. Specifically, silicon oxide, silver oxide, copper oxide, aluminum oxide, zirconia, titanium oxide, hafnium oxide, tantalum oxide, tin oxide, calcium oxide, cerium oxide, chromium oxide, cobalt oxide, formium oxide, lanthanum oxide, oxidation. Magnesium, manganese oxide, molybdenum oxide, nickel oxide, antimony oxide, samarium oxide, terbium oxide, tungsten oxide, yttrium oxide, zinc oxide, indium oxide, silver fluoride, silicon fluoride, aluminum fluoride, zirconium fluoride, fluoride Titanium, hafnium fluoride, tantalum fluoride, tin fluoride, calcium fluoride, cerium fluoride, cobalt fluoride, formium fluoride, lanthanum fluoride, magnesium fluoride, manganese fluoride, molybdenum fluoride, nickel fluoride, Antimon Fluoride, Samalium Fluoride, Terbium Fluoride, Tungsten Fluoride, Ittrium Fluoride, Zinc Fluoride, Lithium Fluoride, Lead Zirconate Titanium (PZT), Barium Titanium, Strontium Titanium, Copper Nitride, Silicon Nitride , Aluminum nitride, titanium nitride, hafnium nitride, tantalum nitride, tin nitride, calcium nitride, cerium nitride, cobalt nitride, formium nitride, lanthanum nitride, magnesium nitride, manganese nitride, molybdenum nitride, nickel nitride, antimony nitride, samarium nitride, nitride Telbium, tungsten nitride, yttrium nitride, zinc nitride, lithium nitride, gallium nitride, SiC, SiCN, diamond-like carbon (DLC) and the like can be used.
As the organic-inorganic composite material, an organic material or the like in which inorganic fine particles are dispersed can be used. The encapsulant may be used alone or in plurality. By laminating and sealing an organic material and an inorganic material, high barrier properties and flexibility can be realized at the same time. One side of the potential measuring device may be sealed, both sides may be sealed, or only a part thereof may be sealed. The thickness of the encapsulant is preferably equal to or greater than the thickness for flattening the unevenness of the surface of the potential measuring device. The feeling of wearing is improved by eliminating the unevenness on the surface of the potential measuring device.

As an example of the circuit configuration of the potential measuring device of the present embodiment, for example, the configuration illustrated in FIG. 12 can be used. The analog front end is composed of a buffer circuit, an amplifier circuit, a high-pass filter circuit, and a low-pass filter circuit, and has a battery and a power supply circuit for supplying power to the analog circuit.

The potential measuring device of this embodiment may have various sensors. The sensor acquires a signal and outputs the acquired signal as an analog signal to the analog front end. The signal may be a biological signal, and examples of the biological signal include pulse wave, pulse, pulse pressure, blood pressure, blood vessel diameter, electrocardiogram, myoelectricity, electroencephalogram, body temperature, and sweating amount. As the sensor, for example, a potential sensor, a current sensor, a speed sensor, an acceleration sensor, a distance sensor, a voice sensor, an optical sensor, a pressure sensor, a displacement sensor, a rotation angle sensor, a position sensor, an angular speed sensor, a chemical sensor, or the like can be used. can. As the potential sensor, for example, a measurement electrode can be used.
In the present embodiment, the sensor is connected to an electronic circuit and may be formed on a flexible base material on which the electronic circuit is formed, or mounted on the base material on which the electronic circuit is formed. It does not have to be.

[Measurement electrode]
The potential measuring device of this embodiment has two or more measuring electrodes as a potential sensor.
In the present embodiment, by having two or more measurement electrodes, the difference in the potential signal between the two electrodes can be acquired, and the common mode noise can be canceled. Further, by attaching a large number of measurement electrodes to the measurement target and selecting data having a strong signal strength from the data at multiple points, an accurate potential can be obtained. For example, when acquiring a biopotential signal from a measuring electrode, it is difficult to attach the measuring electrode to the correct position unless you are an expert, but if you use two or more measuring electrodes, you do not have specialized knowledge. In both cases, the probability of obtaining the potential at the correct position increases. Furthermore, by analyzing the data of multiple points, it is possible to obtain information that cannot be derived from the data of one point.

The sensor and part of the analog front end may be integrated. Specifically, the integrated state means a state in which they are laminated or a state in which they are formed in the vicinity on the same substrate. Sensors often have high output impedance and are susceptible to noise. By integrating the sensor and the analog front end, the physical distance between them can be reduced and noise can be reduced.
The sensor and part of the analog front end may be integrated and the remaining circuitry of the analog front end may be formed in a separate area. For example, a form formed on another base material as shown in FIG. 5 (a) and a form formed on the same base material at a distant place as shown in FIGS. 5 (b) and 5 (c) are exemplified. ..
The analog front end preferably has a buffer circuit as a component. Since the buffer circuit has a high input impedance, it is possible to acquire an accurate signal even if the body surface has a high impedance, and since it has a low output impedance, the distance from the subsequent circuit can be increased. , The degree of freedom in device design is improved. The buffer circuit is preferably integrated with the sensor. By integrating the buffer circuit and the sensor, it is possible to prevent noise from being added to the wiring from the sensor to the buffer circuit and acquire an accurate signal. The buffer circuit is preferably formed by a thin film transistor. When the buffer circuit is formed by the thin film transistor, the portion of the potential measuring device that is in close contact with the body can be formed more flexibly, and a better wearing feeling can be obtained.
Of the analog front ends, it is preferable to reduce the function of integrating with the sensor. Specifically, it is preferable to integrate only the buffer circuit or only the buffer circuit and the switching element with the sensor.
Further, it is preferable that the analog front end has an amplifier circuit and a filter circuit. By having an amplifier circuit, it is possible to obtain a body surface potential, which is often a minute signal, with high sensitivity. Noise can be reduced by using a filter circuit, and the amount of data can be reduced by removing signals having unnecessary frequencies.

In the present embodiment, the number of measurement electrodes is 2 or more, preferably 4 or more, preferably 16 or more, and further preferably 30 or more. If there are four or more, the probability that the measuring electrode will be attached at an appropriate position increases, and even an untrained person can easily measure the body surface potential. If there are 16 or more, the distribution of the body surface potential can be measured. If there are 30 or more, the electric potential in the body can be estimated.

The measurement electrode may be an array electrode. The array electrode is an electrode (aggregate) in which two or more electrodes are arranged, and in the array electrode, the measurement electrode can be arranged one-dimensionally or two-dimensionally.
The one-dimensional array electrode is an electrode in which a plurality of measurement electrodes are arranged on a straight line. The two-dimensional array electrode is an electrode in which a plurality of measurement electrodes are arranged on a plane. The arrangement of the measurement electrodes in the two-dimensional array electrode is not particularly limited, and may be, for example, a grid shape, a honeycomb shape, or the like. The use of array electrodes facilitates mounting the potential measurement device in an appropriate position.

When using array electrodes, all electrodes can be connected directly to the analog front end, or an active matrix configuration can be used. As the connection configuration of the array electrodes, for example, the configurations shown in FIGS. 6 to 8 are exemplified.
In FIG. 6, each output of the sensor array is directly input to the analog front end. In the case of this configuration, there is an advantage that the circuit can be simplified and sensor information can be acquired at the same time.
FIG. 7 shows an example of an active matrix type sensor array. Since the circuit configuration at each point of the active matrix type sensor array is the same, the circuit configuration of the active matrix type sensor array will be described by taking the circuit SC1 near the sensor 11 as an example. As shown in FIG. 7, the SC11 has a switching transistor T11 formed in the vicinity of the intersection position of the gate line GL1 and the signal line SL1. The drain terminal of the switching transistor is connected to the power supply line PL, the gate terminal is connected to the gate line GL1, and the source terminal is connected to the buffer circuit Buf11. Further, the SC 11 has a buffer circuit Buf 11 in which a power input terminal is connected to a source terminal of the switching transistor T11. The input terminal of the buffer circuit Buf 11 is connected to the sensor 11, and the output terminal is connected to the signal line SL1. Further, it has a sensor connected to the input terminal of the buffer circuit Buf11. The gate line is connected to the gate driver, the signal line is connected to the analog front end, and the power supply line is connected to the power supply circuit. Since the noise on the wiring can be reduced by using the buffer circuit, the gate line, the signal line, and the power supply line can be set to any length.
Next, the operation of the active matrix type sensor array will be described with reference to FIG. 7. By inputting switching signals from the gate driver to m gate lines in order, the switching transistors on the gate lines are turned on. When the switching transistor is turned on, the buffer circuit operates and transmits the signal output from the sensor to the signal line. The sensor signal transmitted to the signal line is input to the analog front end. The active matrix method is preferable because the number of wirings can be reduced, wiring defects can be reduced, and the device can be miniaturized, as compared with the type shown in FIG. For example, when a switching signal is input to the gate line GL1, the switching transistors T11 to T1n connected to the gate line GL1 are turned on. At this time, since no switching signal is input to GL2 to GLm, the switching transistors T21 to Tmn are in the OFF state. When the switching transistors T11 to T1n are turned on, the buffer circuits Buf11 to Buf1n operate, and the signals of the sensors 11 to 1n are transmitted to the signal lines SL1 to SLn, respectively. At this time, since Buf21 to Bufmn are not operating and the signals of the sensors 21 to sensormn are isolated from the signal lines, two or more sensor signals are not input to each signal line.
Next, the configuration of FIG. 8 will be described. This is a configuration in which the buffer circuit of FIG. 7 is replaced with a buffer transistor. The drain terminal of the buffer transistor is connected to the source terminal of the switching transistor, the gate terminal is connected to the sensor, and the source terminal is connected to the signal line. The configuration shown in FIG. 8 has a small number of elements and can be manufactured in the same process as the liquid crystal panel, so that the manufacturing is easy. Here, m and n are arbitrary positive numbers. The buffer circuit and the switching transistor are preferably formed by a thin film transistor. Further, the buffer circuit, the switching transistor and the sensor are preferably formed on the same flexible base material, and the sensor and the buffer circuit are preferably formed adjacent to each other or laminated. By forming the sensor on the same base material, the sensor portion that needs to be in close contact with the body surface can be made flexible, so that a good wearing feeling can be obtained.

As a method of mounting a plurality of measurement electrodes, for example, a plurality of measurement electrodes may be connected to the electronic circuit as shown in FIG. 11 (a), and FIGS. 11 (b) and 11 (c) show. As shown, an array electrode in which a plurality of electrode layers insulated from each other are provided on the same substrate may be used.
Generally, in order to acquire signals at multiple points, a large number of electrodes must be used, which is very troublesome to install. Further, even when a plurality of electrodes are formed on the same substrate, there is a problem that the electrodes may be electrically connected for some reason and measurement cannot be performed for a long time. By using electrodes having a plurality of electrode layers insulated from each other on the same substrate, signals at multiple points can be easily obtained for a long time.

In the present embodiment, the measurement electrode is connected to an electronic circuit and may be formed on a flexible base material on which the electronic circuit is formed, or on a base material on which the electronic circuit is formed. It does not have to be installed in.

[Adhesive electrode]
In the present embodiment, it is preferable that the measurement electrode is an adhesive electrode because it can be fixed to the measurement target.
The configuration of the adhesive electrode is not limited, but the configuration of the adhesive electrode is not limited. For example, it may be composed of an adhesive binder and an electrolyte, or may be composed of an adhesive binder and conductive fine particles. .. The adhesive binder is preferably hydrophobic. By using a hydrophobic adhesive binder, when it is attached to the body surface, it is possible to prevent elution of the binder component due to sweating, and a good wearing feeling can be obtained.
Specifically, it is preferable that the adhesive electrode has a conductive adhesive layer made of a hydrophobic adhesive binder and a conductive adhesive containing conductive fine particles.
The hydrophobic adhesive binder is not limited, and for example, a (meth) acrylic adhesive, a urethane adhesive, a synthetic rubber adhesive, a natural rubber adhesive, and a silicone adhesive can be used. In particular, a silicone-based adhesive can be suitably used from the viewpoint of a feeling of being attached to a living body. These can be used alone or in combination of two or more.
As for the degree of hydrophobicity, the solubility in water at 25 ° C. is preferably 10 g / 100 ml or less, more preferably 1 g / 100 ml or less, and further preferably 0.1 g / 100 ml or less.
Further, a diluent may be added to the hydrophobic adhesive binder. The diluent may be any one that is compatible with the hydrophobic adhesive binder, and water, alcohol, an organic solvent, or the like can be used.

Examples of the (meth) acrylic pressure-sensitive adhesive include those containing an acrylic polymer and / or an acrylic monomer, and may further contain additives such as a tackifier and a cross-linking agent.

As the acrylic polymer, for example, an acrylic polymer obtained by polymerizing a monomer component containing a (meth) acrylate monomer having an alkyl group having 1 to 24 carbon atoms can be used.
Examples of the (meth) acrylate having an alkyl group having 1 to 24 carbon atoms include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, and n-butyl (meth) acrylate. ) Acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, n-hexyl (meth) acrylate, cyclohexyl (meth) acrylate, n-octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) ) Acrylate, t-butylcyclohexyl (meth) acrylate, n-decyl (meth) acrylate, n-undecyl (meth) acrylate, n-dodecyl (meth) acrylate, n-tridecyl (meth) acrylate, n-tetradecyl (meth) Acrylate, n-pentadecyl (meth) acrylate, n-hexadecyl (meth) acrylate, n-heptadecyl (meth) acrylate, n-octadecyl (meth) acrylate, icosyl (meth) acrylate, henicosyl (meth) acrylate, docosyl (meth) Acrylate, tricosyl (meth) acrylate, tetracosyl (meth) acrylate and the like can be used. Only one type of these (meth) acrylates may be used, or a plurality of types may be used.
The alkyl group of the (meth) acrylate having an alkyl group having 1 to 24 carbon atoms preferably has 4 or more carbon atoms, more preferably 6 or more carbon atoms, further preferably 14 or more carbon atoms, and further. It is preferably 22 or less, more preferably 20 or less, and even more preferably 18 or less. If the number of carbon atoms is 4 or more, high hydrophobicity can be obtained, elution of the adhesive due to sweat can be prevented, if it is 6 or more, high adhesiveness can be obtained, and if it is 14 or more, it is a hydrocarbon type. Since it is easily dissolved in a solvent, it is easy to manufacture. Further, when the number of carbon atoms is 22 or less, sufficient solubility is obtained and production is easy, when it is 20 or less, the polymerization reaction is easy to control and production is easy, and when it is 18 or less, high adhesiveness is obtained. be able to.
The structure of the alkyl group of the (meth) acrylate having an alkyl group having 1 to 24 carbon atoms is not limited, and may have a linear structure or a branched structure. In particular, a (meth) acrylate having an alkyl group having a branched structure can be suitably used because it has high solubility and facilitates production.
The content of the (meth) acrylate having an alkyl group having 1 to 24 carbon atoms with respect to the total amount of the monomer components used in the production of the acrylic polymer is preferably in the range of 80% by mass to 99% by mass. More preferably, it is in the range of 90% by mass to 95% by mass.

As the monomer component that can be used in the production of the acrylic polymer, a highly polar vinyl monomer may be used in addition to those described above. By using a highly polar vinyl monomer, the production of an acrylic polymer can be facilitated, and the adhesiveness can be further improved.
As the highly polar vinyl monomer, a vinyl monomer having a carboxy group, a vinyl monomer having a hydroxyl group, and a vinyl monomer having an amino group can be used. Only one type of these vinyl monomers may be used, or a plurality of types may be used.
The content of the highly polar vinyl monomer with respect to the total amount of the monomer components used in the production of the acrylic polymer is preferably 0.01% by mass or more, preferably 10% by mass or less, and 5% by mass. It is more preferably% or less, and further preferably 1% by mass or less. If it is 10% by mass or less, elution of the adhesive due to sweat can be prevented, if it is 5% by mass or less, the adhesiveness can be adjusted in a suitable range, and if it is 1% by mass or less, a hydrophobic monomer can be prevented. Since sufficient compatibility with the above can be obtained, production becomes easy.

As the silicone-based pressure-sensitive adhesive, a pressure-sensitive adhesive containing a compound having a structure represented by the following composition formula (1) in at least a part of the molecule is preferable.
R _a SiO _(4-a) (1)
R represents the same or different substituents, and a is a positive number of 1 to 3. As a specific structure of the composition formula (1), for example, the structure represented by the following (Chemical formula 1) can be mentioned.

（化１）

(Chemical 1)

Here, R is, for example, an alkyl group such as hydrogen, halogen, nitro group, alkyl group (for example, methyl group, ethyl group, propyl group, isopropyl group, normal butyl group, tertiary butyl group, hexyl group, octyl group and the like. , Cycloalkyl group such as cyclohexyl group), cyano group, aryl group (eg phenyl group, naphthyl group, thienyl group, etc.), haloaryl group (eg pentafluorophenyl group, 3-fluorophenyl group, 3,4,5- Trifluorophenyl group, etc.), alkenyl group (eg, vinyl group, butenyl group, pentenyl group, hexenyl group, heptenyl group, octenyl group, (meth) acrylic group, etc.), alkynyl group, amide group, acyl group, alkylcarbonyl group, Carboxy group, alkoxy group (eg, methoxy group, etc.), aryloxy group (eg, phenoxy group, naphthyl group, etc.), haloalkyl group (eg, perfluoroalkyl group, etc.), thiocyano group, alkylsulfonyl group, sulfonamide group, amino group, An alkylamino group (for example, a methylamino group, etc.), a dialkylamino group (for example, a dimethylamino group, a diethylamino group, etc.), a hydroxyl group, or the like can be used.
Among these, a methyl group and a phenyl group can be preferably used as R. In particular, when R is a phenyl group, the heat resistance of the pressure-sensitive adhesive is improved, which is preferable.

As the silicone-based pressure-sensitive adhesive, for example, an addition-curable silicone-based pressure-sensitive adhesive, a condensation-curable silicone-based pressure-sensitive adhesive, and a radical-curable silicone-based pressure-sensitive adhesive can be used. In particular, addition-curing silicone-based pressure-sensitive adhesives and radical-curing silicone-based pressure-sensitive adhesives are preferable because the raw materials do not have leaving groups and no by-products are generated by the curing reaction. A platinum-based catalyst can be used as the curing catalyst, and in this case, a pressure-sensitive adhesive having higher biocompatibility can be formed.
The addition-curable silicone-based pressure-sensitive adhesive, the condensation-curable silicone-based pressure-sensitive adhesive, and the radical-curable silicone-based pressure-sensitive adhesive can be used alone or in combination.

The addition-curable silicone-based pressure-sensitive adhesive preferably contains a compound having an alkenyl group, a hydrosilane compound, and a platinum-based catalyst, and may further contain other additives.
As other additives, a cross-linking agent, an adhesiveness improver, an adhesiveness reducing agent, a curing accelerator, a curing retarder, a diluent and the like can be used.

As the compound having an alkenyl group, a compound having a structure of the composition formula (1) in part and a part of R being an alkenyl group or a compound containing an alkenyl group can be used.
The compound having an alkenyl group preferably has two or more alkenyl groups in one molecule. The position of the alkenyl group is not particularly limited, and it may be present at the end of the molecule or at the side chain.
Specific examples of the compound having an alkenyl group include, for example, a trimethylsiloxy group-blocked dimethylsiloxane / methylvinylsiloxane copolymer at both ends of the molecular chain, a trimethylsiloxy group-blocked methylvinylpolysiloxane at both ends of the molecular chain, and trimethylsiloxy at both ends of the molecular chain. Group-blocked methylvinylsiloxane / diphenylsiloxane copolymer, molecular chain double-ended trimethylsiloxy Group-blocked dimethylsiloxane / methylvinylsiloxane / diphenylsiloxane copolymer, molecular chain double-ended dimethylvinylsiloxy group-blocked dimethylpolysiloxane, molecular chain double-ended Dimethylvinyl siloxy group-blocked methylvinylpolysiloxane, molecular chain double-ended dimethylvinylsiloxy group-blocked methylphenylpolysiloxane, molecular chain double-ended dimethylvinylsiloxy group-blocked dimethylsiloxane / methylvinylsiloxane copolymer, molecular chain double-ended dimethylvinylsiloxy Base-blocked dimethylsiloxane / methylphenylsiloxane copolymer, molecular chain double-ended dimethylvinylsiloxy group-blocked dimethylsiloxane / diphenylsiloxane copolymer, molecular chain double-ended silanol group-blocked dimethylsiloxane / methylvinylsiloxane copolymer, molecular chain both Examples include terminal silanol group-blocking dimethylsiloxane / diphenylsiloxane copolymer, molecular chain both-terminal silanol group-blocking methylvinylpolysiloxane, and molecular chain double-terminal silanol group-blocking dimethylsiloxane / methylvinylsiloxane / methylphenylsiloxane copolymer. can.
As the compound having an alkenyl group, one type may be used alone, or a plurality of types having different molecular weights and molecular structures may be mixed and used.

The hydrosilane compound is a compound having at least one Si—H structure in the molecule, and in the present embodiment, it is particularly preferable to have two or more Si—H structures in one molecule.
The hydrosilane compound may further have a structure represented by the composition formula (1) in part.
One type of hydrosilane compound may be used alone, or a plurality of types having different molecular weights and molecular structures may be mixed and used.

As the platinum-based catalyst, for example, metallic platinum or a platinum compound can be used. Specific examples include platinum chloride acid, a complex of platinum chloride acid and an olefin, a complex of platinum chloride acid and vinyl siloxane, and the like.
The amount of the platinum-based catalyst added is preferably 1 to 5,000 ppm, more preferably 5 to 2,000 ppm, based on the total amount of the compound having an alkenyl group and the hydrosilane compound. If the addition amount is less than 1 ppm, the cross-linking density may be low and the cohesive force may be lowered, and if it exceeds 5,000 ppm, the tack and adhesive force may be lowered and the pot life may be shortened, which is economically disadvantageous. become.

The radical-curable silicone-based pressure-sensitive adhesive preferably contains a compound having an alkenyl group, a polysiloxane compound, and a radical generator, and may further contain other additives.
As other additives, a cross-linking agent, an adhesiveness improver, an adhesiveness reducing agent, a curing accelerator, a curing retarder, a diluent and the like can be used.

As the compound having an alkenyl group, the same compound as the compound having an alkenyl group contained in the addition-curable silicone-based pressure-sensitive adhesive can be used.
As the polysiloxane compound, for example, a compound having a structure represented by the composition formula (1) in at least a part of the molecule and having no substituent having an aliphatic unsaturated bond can be used. can. Here, examples of the substituent having an aliphatic unsaturated bond include an alkenyl group and an alkynyl group.

As the radical generator, for example, an organic peroxide, an azo compound, a photoradical generator and the like can be used.
The organic peroxide is a compound having an —O—O— bond, and specific examples thereof include benzoyl peroxide, cumyl peroxide, t-butyl cumyl peroxide, t-butyl peroxide, and 2,4-dichlorobenzoyl peroxide. , T-butylisobutyrate peroxide, t-butylbenzoate peroxide, t-butyl-2-ethylhexarate peroxide, t-butyloctane 2,2-bis peroxide, t-bis peroxide t- Butylcyclohexane, 2,5-dimethyl-2,5-diperoxide benzoylhexane and the like can be mentioned.
Specific examples of the azo compound include 2,2'-Azobis (isobutyrontile), 2,2'-Azobis (2,4-dimethylvalerontile), 2,2-Azobis (2-methylvaleronitril), 4,4'-. Azobis (4-cyanovaleric Acid), 2,2'-Azobis (2-methylpropionamide) Dihydrochloride, Dimethyl 2,2'-Azobis (2-methylpropionate) and the like can be used.
Specific examples of the photoradical generator include acetophenone, p-anisyl, benzyl, benzoin, benzophenone, 2-benzoylbenzoic acid, 4,4'-bis (diethylamino) benzophenone, and 4,4'-bis (dimethylamino). ) Benzophenone, benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin ethyl ether, 4-benzoyl benzoic acid, 2,2'-bis (2-chlorophenyl) -4,4', 5,5'-tetraphenyl- 1,2'-biimidazole, methyl 2-benzoyl benzoate, 2- (1,3-benzodioxol-5-yl) -4,6-bis (trichloromethyl) -1,3,5-triazine, 2 -Benzene-2- (dimethylamino) -4'-morpholinobtyrophenone, 4,4'-dichlorobenzophenone, 2,2'-diethoxyacetophenone, 2,2'-dimethoxy-2-phenylacetophenone, 2,4 -Diethylthioxanthene-9-one, diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, 1,4-dibenzoylbenzene, 2-ethylanthraquinone, 1-hydroxycyclohexylphenylketone, 2-hydroxy-2- Methylpropiophenone, 2-hydroxy-4'-(methylthio) -2-mophorinopropiophenone, 2-isonitrosopropiophenone, 2-phenyl-2- (p-toluenesulfonyloxy) acetphenone, phenylbis (2) , 4,6-trimethylbenzoyl) phosphine oxide and the like can be used.
Examples of other radical generators include ammonium persulfate, sodium persulfate, potassium persulfate, iron chloride, potassium permanganate, hydrogen peroxide, copper perchlorate, iron organic acid (III) and the like. Further, a combination of an oxidizing agent and a reducing agent such as hydrogen peroxide and iron (II) salt, persulfate and sodium bisulfite may be used.

As the silicone-based adhesive, a commercially available product can be used. For example, SD4580PSA, SD4584PSA, SD4587PSA, SD4587LPSA, SD4560PSA, SD4570PSA, SD4600FCPSA, SD4593PSA, DC7651ADHESIVE, DC7652ADHESIVE, SH4280PSA, Shin-Etsu Chemical KR-100, KR-100 3700, KR-3701, X-40-3237-1, X-40-3240, X-40-3291-1, KR-3704, X-40-3323, X-40-3270-1, X-40- 3306, PSA610-SM, YR3286, YR3340 and the like manufactured by MOMENTIVE can be used.
These commercially available products include two-component curable ones, but the catalyst to be added may be a mixture of materials specified by each company, or the platinum-based catalyst and radical generator may be used.

Examples of the conductive fine particles contained in the conductive pressure-sensitive adhesive include gold, silver, copper, nickel, aluminum, titanium, vanadium, chromium, manganese, iron, cobalt, zinc, niobium, molybdenum, palladium, cadmium, indium, and tin. , Antimony, lantern, tantalum, tungsten, platinum, lead and other metals and fine particles of oxides, nitrides and salts of these metals; fine particles of carbon materials such as carbon, graphite, fullerene, carbon nanotubes and graphene; A powder composed of a π-conjugated molecule such as polythiophene, polyaniline, polypyrrole, polyacetylene, polyphenylene vinylene, a π-conjugated molecule such as PEDOT / PSS, and a dopant can be used. In particular, metal fine particles are preferable because they have high conductivity, and copper, silver, and gold are particularly preferable because they exhibit high conductivity even when mixed with an organic substance.
As the metal fine particles, a metal composed of one element may be used, an alloy composed of a plurality of types of metals may be used, or fine particles having different core / shell structures in the metal composed of the core and the shell may be used. You can also. As the core / shell structure, specifically, inexpensive materials such as copper, aluminum, nickel, aluminum oxide, glass, and hollow glass can be preferably used for the core, and high conductivity such as silver and gold can be used for the shell. A structure using a material can be preferably used.
The conductive fine particles may be solid particles or hollow particles.

In the present embodiment, the average secondary particle diameter of the conductive fine particles is preferably 50 μm or more, more preferably 100 μm or more, further preferably 200 μm or more, and further preferably 1 mm or less. preferable. According to the research of the present inventor, when the average secondary particle diameter of the conductive fine particles is 50 μm or more, the adhesive electrode layer has high planar conductivity, and when it is 100 μm or more, the high vertical direction is obtained. It turned out to be conductive. In particular, if the thickness is 200 μm or more, the adhesive electrode layer has high conductivity even if the content of the conductive fine particles is not high. However, if it is 1 mm or more, discomfort occurs when the adhesive electrode layer is attached to the living body due to the unevenness due to the conductive particles, and from that point, it is preferably 1 mm or less.
The shape of the conductive fine particles is not particularly limited, and examples thereof include a sphere, a polyhedron, a fiber, a corner, flakes, and a needle.
Here, the average secondary particle diameter is the average particle diameter of agglomerates (secondary particles) formed by aggregating a plurality of primary particles. The average secondary particle size of the fine particles can be measured by, for example, a scanning electron microscope or an optical microscope. Here, the particle size means the diameter for a spherical material, the length of a fiber for a fibrous material, and the most that can be drawn in the cross section for other materials. It refers to the length of a long straight line.

In addition to the above-mentioned hydrophobic adhesive binder and conductive fine particles, the conductive pressure-sensitive adhesive may further contain additives for adjusting various properties. Examples of the additive include a dispersant, a surfactant, a pH adjuster, a solvent and the like.
The content of the conductive fine particles in the conductive pressure-sensitive adhesive is preferably 10 parts by mass or more, more preferably 100 parts by mass or more, based on 100 parts by mass of the solid content of the hydrophobic pressure-sensitive adhesive binder. It is more preferably 150 parts by mass or more, preferably 650 parts by mass or less, more preferably 350 parts by mass or less, and further preferably 280 parts by mass or less. If it is 10 parts by mass or more, the pressure-sensitive adhesive can exhibit sufficient conductivity for use as an electrode, and if it is 100 parts by mass or more, the resistance value of the pressure-sensitive adhesive is lower than the resistance value of the skin and there is less noise. The measurement becomes possible, and if it is 150 parts by mass or more, the resistance value of the adhesive electrode becomes negligibly small with respect to the resistance value of the skin. Further, if it is 650 parts by mass or less, it is possible to obtain an adhesiveness that enables measurement when the measurement target is in a stationary state, and if it is 350 parts by mass or less, the adhesiveness is maintained for a long time and 280 mass. If it is less than or equal to a part, it is possible to obtain adhesiveness that enables measurement even when the measurement target is exercising.

The conductive pressure-sensitive adhesive can be produced by mixing a hydrophobic pressure-sensitive adhesive, conductive fine particles, and an additive added as needed. Examples of the mixing method include an ultrasonic method, a mixer method, a rotation / revolution mixer method, a three-roll method, a two-roll method, and the like, and include an attritor, a Banbury mixer, a paint shaker, a kneader, a homogenizer, and a ball mill. , A bead mill, a sand mill, a jet mill, or the like.

The adhesive electrode layer can be formed, for example, by applying a conductive adhesive, performing steps such as coating, molding, drying, thermosetting, photocuring, and wet treatment.
The structure of the adhesive electrode is not limited, and for example, as illustrated in FIG. 1, it may consist of only the adhesive electrode layer ((a)), or the substrate and the adhesive formed on the substrate. It may be composed of an electrode layer ((b)), or may have a conductor portion between the adhesive electrode layer and the base material ((c)).
An adhesive electrode having a base material is preferable because it is easy to handle, and an adhesive electrode having a conductive base material and an adhesive electrode having a conductor portion between the base material and the adhesive electrode layer are noise-free. It is particularly preferable because it allows a small amount of measurement.
The base material is not particularly limited as long as it can support the adhesive electrode layer, and may or may not have conductivity, and an organic material, an inorganic material, or an organic-inorganic composite material may be used. can. It is preferable that the base material is flexible because the wearing feeling of the potential measuring device is enhanced.
Specific examples of organic materials include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), cycloolefin polymer (COP), polyimide (PI), silicone, paper phenol, paper epoxy, and Teflon (registered trademark). ), Etc. can be used. In particular, PET and PEN are available at low cost and are significant and preferable from a business point of view. As the inorganic material, alumina, ceramics, composite, glass, thin film glass, metal foil and the like can be used. As the organic-inorganic composite material, for example, glass epoxy, glass composite, an organic material in which an inorganic filler is dispersed, an organic material having an inorganic layer coated on the surface, or the like can be used. Examples of the method for coating the inorganic layer include a sol-gel method, a vapor deposition method, a sputtering method, a CVD (Chemical Vapor Deposition) method, and an ALD (Atomic Layer Deposition) method. The base material is preferably flexible (flexible) from the viewpoint of wearing comfort, and specifically, PET, PEN, PC, COP, PI, silicone, Teflon (registered trademark), thin film glass, and the like. It is preferable to use a metal foil, an organic material in which an inorganic filler is dispersed, or an organic material in which an inorganic layer is coated on the surface. In particular, PET and PEN are preferable because they can be obtained at low cost, and PI is preferable because they can be soldered.
The thickness of the base material is not particularly limited, but is preferably 1 μm or more, more preferably 10 μm or more, preferably 5 mm or less, more preferably 1 mm or less, and 200 μm or less. Is even more preferable. If it is 1 μm or more, it can be used as a self-supporting film, and if it is 10 μm or more, a high-strength film can be obtained and handling becomes easy. If it is thicker than 5 mm, the weight of the device becomes heavier and the wearing feeling becomes worse. Therefore, it is preferably 5 mm or less. If it is 1 mm or less, flexibility can be obtained, and if it is 200 μm or less, the thickness will be comfortable even if clothes are worn on the body surface potential measuring device.

The shape of the adhesive electrode layer is not limited, but for example, a shape having a circular shape, an elliptical shape, or a curved shape is preferable because it is difficult to peel off from the measurement surface.
The thickness of the adhesive electrode layer is preferably 100 μm or more, more preferably 120 μm or more, further preferably 200 μm or more, and further thicker than 300 μm from the viewpoint of fixation on the surface of the living body. It is also preferable to do so. The thickness of the adhesive electrode layer is preferably 1 mm or less, more preferably 800 μm or less, and further preferably 500 μm or less.
According to the research of the present inventor, it has been found that increasing the thickness of the adhesive electrode layer increases the fixing force to the measurement target. Specifically, if the thickness of the adhesive electrode layer is 100 μm or more, sufficient cushioning property can be obtained and a good wearing feeling can be obtained, and sufficient adhesion to the biological surface can be ensured. If there is, the adhesive electrode follows the unevenness of the biological surface (skin), so that better adhesion can be obtained between the adhesive electrode and the biological surface, and measurement with less noise becomes possible. If it is 200 μm or more, strong adhesiveness is obtained. Since it is obtained, measurement is possible even when the measurement target is in an operating state. In particular, when the adhesive electrode layer is used alone as an electrode (FIG. 1 (a)) or when the adhesive electrode layer is provided on the flexible substrate (FIGS. 1 (b) and 1 (c)). When a flexible base material is used, if the thickness of the adhesive electrode layer is within the above range, very strong fixation to the surface of the living body is possible. In this embodiment, the adhesive layer can be fixed. Since the resistance of the adhesive layer is so low that it becomes an electrode itself, the thickness of the adhesive layer can be made thicker than that of a conventional bioelectrode in which the adhesive layer is provided separately from the electrode.
If the thickness of the adhesive electrode layer is 1 mm or less, high conductivity sufficient for use as an electrode can be obtained, and if it is 800 μm or less, there is concern about adhesive residue of the conductive adhesive after peeling the electrode from the biological surface. If it is 500 μm or less, the thickness will be comfortable even if the adhesive electrode is attached and clothes are attached.

The content of the hydrophilic material in the conductive pressure-sensitive adhesive is preferably 5% by mass or less, more preferably 3% by mass or less, further preferably 1% by mass or less, and 0%. Is the most preferable. If it is 5% by mass or less, the discomfort caused by the elution of hydrophilic components due to sweating can be reduced. Here, hydrophilicity refers to a molecule having a solubility in water at 25 ° C. of greater than 10 g / 100 ml. Here, examples of the hydrophilic material include hydrophilic monomers, hydrophilic polymers, organic salts, and inorganic salts.

The shape of the adhesive electrode is not particularly limited, but is preferably flat, and for example, a surface shape such as a circular shape, an elliptical shape, a polygonal shape, a shape composed of a curved line, or a shape composed of a curved line and a straight line can be used. It can have a flat plate shape.
Further, the shapes of the base material, the conductor portion, and the adhesive electrode layer are not particularly limited, and these may be the same or different shapes.

The adhesive electrode may have a non-conductive adhesive portion in order to obtain higher adhesiveness. The non-conductive pressure-sensitive adhesive portion can be formed by, for example, a hydrophobic pressure-sensitive adhesive binder.
The arrangement of the non-conductive pressure-sensitive adhesive portion is not particularly limited, and for example, as shown in FIG. 2A, the structure may be such that the adhesive electrode layer is surrounded by the non-conductive pressure-sensitive adhesive portion. As shown in FIG. 2 (b), a checkered pattern structure including an adhesive electrode layer and a non-conductive adhesive portion may be used, or as shown in FIG. 2 (c), the adhesive electrode layer and the non-conductive adhesive portion may be used. A striped structure composed of a drug portion may be used.
In addition, although all the examples of FIG. 2 have a base material, the base material may not be provided.

[wiring]
The potential measuring device of the present embodiment may have wiring for obtaining an electrical connection between the measuring electrode and the electronic circuit. When an adhesive electrode is used as the measurement electrode, this wiring may be connected to the adhesive electrode layer itself, or when the adhesive electrode has a conductor portion, it may be connected to the conductor portion, and further. If the adhesive electrode has a conductive base material, it may be connected to the base material.
As shown in FIG. 10, in the present embodiment, the measuring electrode may be integrated with the electronic circuit of the potential measuring device. The measurement electrode and the electronic circuit may be formed side by side on the substrate, or may be formed by being laminated. In the case of stacking, it is preferable to provide a protective layer between the electronic circuit and the electrode from the viewpoint of protecting the electronic circuit. As the protective layer, a base material can be used as the protective layer, or an insulating material can be used to form the protective layer.

Next, various uses of the potential measuring device of this embodiment will be described individually.
[Electrocardiograph]
An electrocardiograph is a body surface potential measuring device for measuring an electrocardiogram.
The electrocardiograph mounts one of the two measurement electrodes near the heart and the other measurement electrode far from the heart, and measures the potential difference between these electrodes. Therefore, the electrocardiogram can be measured. The electrocardiograph may have three or more measurement electrodes, and can acquire the electrocardiographic potential corresponding to each combination of any two measurement electrodes. Generally, an electrocardiogram called a 12-lead electrocardiogram is measured using 10 measurement electrodes. If the distance between the measurement electrodes is too close, no potential difference will occur and the electrocardiogram cannot be measured. The distance between the measurement electrodes is preferably 10 mm or more, more preferably 15 mm or more, and further preferably 50 mm or more. If it is 10 mm or more, it becomes easy to measure R wave, if it is 20 mm or more, it becomes easy to measure P wave and T wave, and if it is 50 mm or more, it becomes easy to measure Q wave and S wave. The impedance of the measurement electrode is preferably 10 kΩ or less, preferably 100 Ω or less, and more preferably 10 Ω or less. Since the resistance of the skin is usually several kΩ, the electrocardiogram can be measured when the impedance of the measurement electrode is 10 kΩ or less, and can be measured without attenuation when the impedance is 100 Ω or less. Moreover, since the resistance of wet skin is several hundred Ω, the electrocardiogram can be measured without attenuation if the impedance of the measurement electrode is 10 Ω or less.
The electrocardiograph may have a ground electrode in addition to the measurement electrode. Here, the ground electrode refers to an electrode worn to keep the potential on the body surface constant. A constant voltage is always output to the ground electrode when viewed from the ground potential of the body surface potential measuring device, and by attaching the ground electrode to the skin, the potential of the body surface is derived from the ground potential of the body surface potential measuring device. Power is supplied from the body surface potential measuring device so that the voltage is maintained at a constant voltage.
The mounting position of the measurement electrode is not particularly limited, but it is preferably mounted on the chest at the same height as the central part of the heart. For example, the right edge of the 4th rib sternum (V1), the left edge of the 4th rib sternum (V2), the intersection of the midclavicle and the horizontal line across the 5th intercostal space (V4), the center of V2 and V4 (V3), V4. It is preferable to wear it at the intersection of the height horizon and the anterior axillary line (V5), the intersection of the V4 height horizon and the middle axillary line (V6), and a position away from V1 to V6 (for example, the abdomen).
In the present embodiment, the adhesive electrode can be used not only for the measurement electrode but also for the ground electrode. If the adhesive electrode is used, the necessary information can be obtained without shifting the measurement position even when the measurement target moves. The adhesive electrode may have an adhesive electrode layer arranged on one substrate so as to be attached to V1 to V6.
FIG. 13 shows a configuration example of the electrocardiograph. The illustrated electrocardiograph consists of electrodes and an analog front end. The analog signal output from the electrocardiograph can be measured by an external measuring device. The gain of the analog front end is preferably 10 to 1,000, and the frequency characteristic is preferably a characteristic of passing a signal having a frequency of 0.1 Hz or more and 10 kHz or less.
The analog front end preferably has a buffer circuit, an amplifier circuit, and a filter circuit. For the buffer circuit, for example, an amplifier circuit having a high input impedance (including a voltage follower) can be used. The input impedance of the buffer circuit is preferably 100 kΩ or more, more preferably 1 MΩ or more, and further preferably 100 MΩ or more. It is preferable to use a differential amplifier circuit as the amplifier circuit. By using a differential amplifier circuit, it is possible to remove in-phase noise on the two measurement electrodes. As the filter circuit, it is preferable to use a bandpass filter that passes a signal having a frequency of 0.1 Hz or more and 10 kHz or less. As the bandpass filter, a configuration in which a lowpass filter and a highpass filter are connected in series may be used.

[Electromyography]
An electromyogram is a body surface potential measuring device for measuring a surface myoelectric potential.
The electromyogram can measure the myoelectric potential by attaching at least two measuring electrodes along the muscle and measuring the potential difference between these electrodes. The electromyogram may have three or more measurement electrodes, and can acquire the myoelectric potential corresponding to each combination of any two measurement electrodes. If the distance between the measurement electrodes is too close, no potential difference will occur and the electrocardiogram cannot be measured. The distance between the measurement electrodes is preferably 5 mm or more in order to prevent crosstalk. An array electrode can be used for the electromyogram. By mounting the one-dimensional array electrode along the muscle fiber, the myoelectric potential can be easily acquired as a signal having a large amplitude. By using a two-dimensional array electrode, information on multiple muscles can be acquired at the same time, and by selecting an appropriate set of electrodes for the two-dimensional array electrode, the required myoelectric potential can be acquired. No specialized knowledge or training is required for mounting, and simple measurement is possible. The number of measurement electrodes of the two-dimensional array electrode is preferably 4 or more, preferably 16 or more, and further preferably 30 or more. If there are 4 or more, the myoelectric potential generated from one muscle can be acquired with high sensitivity, if 16 or more, the movement of the upper limbs can be classified in detail, and if 30 or more, the muscles of the inner muscle can be obtained. The potential can be estimated. Examples of the upper limb movement classifier include the Pattern Classification of Combined Movements Based on Muscle Synergy Theory, Journal of the Robotics Society of Japan, Vol. 28, No. 5, pp606, 2010 can be referred to.
The preferred range of impedance of the measuring electrode is the same as that of the electrocardiograph.
The electromyogram may have a ground electrode in addition to the measurement electrode. Here, the ground electrode is the same as the ground electrode of the electrocardiograph.
In the present embodiment, the adhesive electrode can be used not only for the measurement electrode but also for the ground electrode. If the adhesive electrode is used, the necessary information can be obtained without shifting the measurement position even when the measurement target moves.
As a configuration example of the electromyogram, the same configuration as the configuration example of the electrocardiograph shown in FIG. 13 can be exemplified. The illustrated electromyogram consists of electrodes and an analog front end. The analog signal output from the electromyogram can be measured by an external measuring device. The gain of the analog front end is preferably 100 to 100,000, and the frequency characteristic is preferably a characteristic of passing a signal having a frequency of 0.1 Hz or more and 10 kHz or less.
The analog front end preferably has a buffer circuit, an amplifier circuit, and a filter circuit. For the buffer circuit, for example, an amplifier circuit having a high input impedance (including a voltage follower) can be used. The input impedance of the buffer circuit is preferably 100 kΩ or more, more preferably 1 MΩ or more, and further preferably 100 MΩ or more. It is preferable to use a differential amplifier circuit as the amplifier circuit. By using a differential amplifier circuit, it is possible to remove in-phase noise on the two measurement electrodes. As the filter circuit, it is preferable to use a bandpass filter that passes a signal having a frequency of 0.1 Hz or more and 10 kHz or less. As the bandpass filter, a configuration in which a lowpass filter and a highpass filter are connected in series may be used.

The electromyogram can be used, for example, as a method for acquiring the myoelectric potential of the myoelectric actuator. An electromyographic actuator is a device that controls power by myoelectric potential.
FIG. 14 shows an example of the operation flow of the myoelectric actuator. The myoelectric actuator operates through the steps of myoelectric potential acquisition, signal preprocessing, feature extraction, classification, motion selection, and power control. Myoelectric potential acquisition is a step of measuring a user's myoelectric potential using an electromyogram. The signal preprocessing is a step of adding signal processing such as amplification, filtering, and analog / digital conversion to the acquired myoelectric potential to adjust the acquired myoelectric potential so that the feature amount can be easily extracted. The feature amount extraction is a step of extracting the feature amount to be input to the classifier from the preprocessed signal. Classification is the process of inputting features into a classifier and identifying the class. Motion selection is the process of selecting the actuator motion corresponding to the classified class. The power control is a step of generating a control signal of each drive unit and transmitting it to the power in order to cause the actuator to perform the selected operation.
The myoelectric actuator is composed of a body surface potential measuring device and an actuator. A relay device may be used if necessary. The operation flow shown in FIG. 14 is performed with these configurations, but the functions of each are not limited. As a configuration of the myoelectric actuator, for example, as shown in FIG. 15A, a body surface potential measuring device having functions such as myoelectric potential acquisition, signal preprocessing, feature amount extraction, classification, and motion selection, and a power control function. As shown in FIG. 15B, a body surface potential measuring device having a user's myoelectric potential acquisition, signal preprocessing, and wireless data transmission functions, and wireless data transmission / reception and feature amount extraction, An example is a configuration including a relay device having a classification and operation selection function and an actuator having a wireless data reception and power control function. Since the myoelectric actuator having the configuration shown in FIG. 15A does not require a relay device, high-speed data analysis is possible, and operation with high real-time performance is possible. In the myoelectric actuator having the configuration shown in FIG. 15B, the body surface potential measuring device and the actuator are wirelessly connected via a relay device, and the body surface potential measuring device and the actuator can be separated from each other. The degree of freedom in shape design is improved. Further, by providing the relay device with the function, it is possible to reduce the size and power consumption of the body surface potential measuring device and the actuator. Specific examples of the myoelectric actuator include a myoelectric prosthetic hand, a myoelectric prosthetic foot, and a myoelectric powered suit. A powered suit is a device intended to assist the dynamics of movement.
Among the above specific examples, the myoelectric prosthetic hand is a device that identifies the movement of the upper limb from the myoelectric potential of the upper limb and operates an actuator in the shape of the upper limb. The myoelectric prosthetic hand also operates in the flow as shown in FIG.
In the user's myoelectric potential acquisition step, it is preferable to acquire the myoelectric potential of the upper limb muscle. The myoelectric potential of the upper limb muscles includes, for example, the ulnar carpal extensor muscle, the ulnar carpal flexor muscle, the long radial carpal extensor muscle, the short radial carpal extensor muscle, the radial carpal flexor muscle, the long palm muscle, and the superficial finger flexor muscle. Long mother finger abductor muscle, maternal and child ball muscle group, short palm muscle, elbow muscle, finger extensor muscle, short mother finger extensor muscle, long mother finger extensor muscle, small finger extensor muscle, total finger extensor muscle, circular inward muscle, arm radius Examples thereof include muscles, triceps muscles, biceps muscles, humer muscles, and crow mouth muscles. In particular, by measuring the extensor carpi radialis, extensor carpi radialis, extensor carpi radialis, extensor carpi radialis, flexor carpi radialis, triceps brachii, and biceps brachii, fingers Bends, wrist bends, and wrist twists can be identified. The electromyogram preferably has a measuring electrode at a position where these myoelectric potentials can be acquired.

Hereinafter, the present invention will be specifically described with reference to Examples. However, the present invention is not limited to such examples.
The average secondary particle diameter of the conductive fine particles, the thickness of the adhesive electrode layer, the conductivity of the adhesive electrode, the adhesiveness, and the wearing feeling were measured / evaluated as follows. Hereinafter, unless otherwise specified, measurements / evaluations were carried out under the conditions of 25 ° C. and 45% humidity.
(1) Average Secondary Particle Diameter The average secondary particle diameter was measured using a scanning electron microscope. A specific operation will be described.
A sample (adhesive electrode layer) was cut into an appropriate size and subjected to BIB processing using an ion milling device E-3500 manufactured by Hitachi High-Technologies Corporation to prepare a cross section of the adhesive electrode layer. At this time, BIB processing was performed while cooling the sample as needed. The processed sample was subjected to conductive treatment, and the cross section of the adhesive electrode layer was observed with a scanning electron microscope S-4800 manufactured by Hitachi, Ltd. Any one field in which 10 or more particles (secondary particles) exist was selected, all the particle diameters in the image were measured, and the average value was taken as the average secondary particle diameter.
(2) Thickness of adhesive electrode layer Measured using a high-precision type thickness gauge manufactured by Mitutoyo.
(3) Evaluation of conductivity To evaluate the conductivity of the adhesive electrode, a 5 mm square copper foil is attached to the surface of the adhesive electrode layer facing the copper foil base material, and the copper foil base material is 5 mm square copper. The resistance value between the foil and the foil is measured, and if it is less than 10Ω, it is judged as ◎, if it is 10Ω or more and less than 100Ω, it is judged as ○, if it is 100Ω or more and less than 10kΩ, it is judged as △, and if it is 10kΩ or more and less than 1MΩ, it is judged as ×, 1MΩ. If it is above, it is set as XX.
(4) Evaluation of adhesiveness The adhesiveness of the adhesive electrode is evaluated by attaching the adhesive electrode to the upper arm wiped with alcohol and dropping it within 10 seconds with the arm down. If it fell within minutes, it was judged as Δ, and if it stuck for longer than 1 minute, it was judged as ○. Furthermore, if the adhesive electrode was attached to the upper arm wiped with alcohol and was attached even after running for 1 minute, it was judged as ◎.
(5) Evaluation of wearing feeling To evaluate the wearing feeling of the adhesive electrode, attach the adhesive electrode to the upper arm wiped with alcohol, discomfort at rest, discomfort during exercise (when sweating), glue after removal. The presence or absence of the remaining amount was visually judged, and the case corresponding to all was marked with ×, the case corresponding to any two was marked with Δ, the case corresponding to any one was marked with ○, and the case not applicable to any of them was marked with ⊚.

[Example 1]
20 g of silicone pressure-sensitive adhesive (Shin-Etsu Chemical Co., Ltd., KR-3701) and 0.1 g of platinum-based catalyst for silicone pressure-sensitive adhesive (Shin-Etsu Chemical Co., Ltd., CAT-PL-50T) are stirred and mixed by a rotation / revolution mixer, and hydrophobic. A sticky binder was obtained. To 0.5 g of this hydrophobic adhesive binder, 0.5 g of silver powder having an average particle diameter of 250 μm and 0.5 g of chloroform were added, and the mixture was stirred and mixed with a stirring rod to obtain a conductive adhesive.
The obtained conductive adhesive is stencil-printed on a 30 mm × 60 mm copper foil substrate using a stencil, dried at room temperature for 5 minutes, and further heated on a hot plate heated to 120 ° C. for 5 minutes. As a result, an adhesive electrode layer was formed. The obtained adhesive electrode had a 1.3 cm square adhesive electrode layer, and the thickness of the adhesive electrode layer was 100 μm.
The evaluation of the conductivity and the adhesiveness of the obtained adhesive electrode is shown in Table 1.

[Examples 2 to 21 , 29 to 30 and Reference Examples 1 to 7 ]
In the same manner as in Example 1, the composition of the conductive adhesive and the thickness of the adhesive electrode layer were changed as shown in Table 1, and the adhesive electrodes of Examples 2 to 21 , 29 to 30 and Reference Examples 1 to 7 were prepared. ..
The conductive fine particle CNTs used in Reference Examples 6 and 7 are cylindrical (diameter 60 nm, length 1 μm) carbon nanotubes.

The adhesive electrodes of Examples 1 to 21 , 29, 30 and Reference Examples 2 to 5 were not sticky when stationary or exercising, and did not leave adhesive residue when removed, and thus showed a good wearing feeling. Feeling ◎ Judgment was made. The adhesive electrodes of Reference Examples 6 and 7 did not cause any discomfort, but there was some adhesive residue, so the wearing feeling was judged to be ○. The adhesive electrode of Reference Example 1 had large silver particles and had a rugged discomfort during both stationary and exercising, but there was no adhesive residue, so the wearing feeling was judged to be Δ.

[Comparative Example 1]
As the adhesive electrode of Comparative Example 1, the disposable electrode SS-SUP00S manufactured by Sports Sensing Co., Ltd. was used as it was. This electrode has a structure in which an adhesive layer made of a conductive gel is laminated on an electrode made of silver and silver chloride. The thickness of this conductive gel was 500 μm. This conductive gel does not contain conductive particles and obtains low resistance by ionic conduction.
The adhesive electrode of Comparative Example 1 had a strong sticky feeling at the time of wearing, had discomfort such as the adhesive melting out during exercise, and had a large amount of adhesive residue at the time of attachment / detachment.

[Example 31]
An electrocardiograph having the adhesive electrodes of Example 12 as two measurement electrodes and one ground electrode was produced.
This electrocardiograph has a configuration having the above-mentioned two measurement electrodes, one ground electrode, and an electronic circuit on a flexible base material. A PET film A4300 manufactured by Toyobo Co., Ltd. was used as a base material. The wiring was formed by screen-printing Dotite FA-353N manufactured by Fujikura Kasei Co., Ltd. in a predetermined shape and heating and firing at 100 ° C. for 30 minutes. The insulating material contained in this wiring was about 50% by volume, and it was confirmed that it was in close contact with the base material after firing. A commercially available IC chip is used for the electronic component, and for mounting the electronic component, Dotite XA-910 manufactured by Fujikura Kasei Co., Ltd. is stencil-printed in a predetermined shape, and the IC chip is placed on the printed XA-910 at 100 ° C. The IC chip was fixed on the wiring by heating and firing for 1 hour.
The electrocardiograph of this embodiment has a differential instrumentation amplifier, a high-pass filter, a low-pass filter, and an active ground at the analog front end. The gain of the differential instrumentation amplifier was set to 1000. The cutoff frequencies of the high-pass filter and the low-pass filter were designed to be 0.3 Hz and 1 kHz, respectively. The active ground is an amplifier that outputs 0V.
The two measurement electrodes were connected to the differential input to the differential instrumentation amplifier, and the ground electrode was connected to the output terminal of the active ground.
One measurement electrode was attached to the left chest, the other measurement electrode was attached to the left abdomen, and the ground electrode was attached to the left abdomen. The output terminal from the electrocardiograph was connected to the LeCroy oscilloscope 9304A, and the waveform was observed. The obtained waveform is shown in FIG. This electrocardiograph was able to obtain the same waveform as in FIG. 16 even when it was bent with a radius of curvature of about 50 mm.

According to the potential measuring device according to the present invention, it is possible to eliminate discomfort when worn for a long time and acquire an accurate potential signal, so that it can be used for measuring various surface potentials, and in particular, an electromyogram. It can be suitably used for a body surface potential measuring device such as an electromyogram or an electromyogram.
Further, it can be suitably used for a pathology, a health condition diagnosis system, and a biological machine interface using the body surface potential measuring device.

Claims (13)

With a flexible substrate,
An electronic circuit formed on the substrate and
It has two or more measurement electrodes and
The measurement electrode is formed on a flexible substrate and
The measurement electrode is an adhesive electrode containing an adhesive binder and conductive fine particles having an average secondary particle diameter of 50 μm or more and 1 mm or less.
Potential measuring device. The adhesive binder is hydrophobic,
The potential measuring device according to claim 1. Wiring contains insulating material,
The potential measuring device according to claim 1 or 2. The connection between the wiring and the electronic components is made of a composite material of metal and organic matter,
The potential measuring device according to any one of claims 1 to 3 . The organic substance is an epoxy resin.
The potential measuring device according to claim 4 . Electronic circuits include thin film transistors,
The potential measuring device according to any one of claims 1 to 5 . The electronic circuit has a buffer circuit, and the buffer circuit includes a thin film transistor.
The potential measuring device according to claim 6 . Part of the surface is sealed with a rubbery material,
The potential measuring device according to any one of claims 1 to 7 . The rubber-like material is a silicone resin.
The potential measuring device according to claim 8 . The potential measuring device according to any one of claims 1 to 9 is included.
Myoelectric actuator. Including the step of forming wiring by printing a conductive paste,
The method for manufacturing a potential measuring device according to any one of claims 1 to 9 . Including the step of mounting an electronic component on a wiring using a conductive adhesive and / and an anisotropic conductive adhesive.
The method for manufacturing a potential measuring device according to any one of claims 1 to 9 . A method for measuring an electric potential using the electric potential measuring device according to any one of claims 1 to 9 .

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