JP2017168780A - Composite molding and method of manufacturing the same, and module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composite molding controlled in heat conduction to a predetermined region, a method of manufacturing such a composite molding, and a module including such a composite molding.SOLUTION: A composite molding includes a first molding having a mounting surface of a heat-generating electronic member and a second molding in contact with the first molding. In the composite molding, the first molding has a thermal conductivity at least two times higher than the thermal conductivity of the second molding.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a composite molded body, a method for producing the same, and a module including the composite molded body.

  There are cases where devices with high heat generation density, such as LED elements, laser diodes, and power semiconductors, are mounted in electronic and electrical equipment. In order to ensure high reliability in driving these devices, heat dissipation measures and heat Control of conduction is required.

  As a means used for heat dissipation measures, there is a heat dissipation sheet described in Patent Document 1. For example, in Patent Document 1, a metal fiber sheet obtained by subjecting a slurry containing metal fibers to a wet papermaking method and then sintering is impregnated with a heat conductive adhesive or a heat conductive adhesive is added. A sheet obtained by laminating is described.

JP 2000-101004 A Japanese Patent No. 4675276 Patent No. 5426399

  However, since the heat dissipation sheet of Patent Document 1 is a single layer sheet made of the same material, heat is conducted to the entire sheet. Therefore, when a heat generating electronic member and another electronic member are mounted on such a sheet, heat generated from the heat generating electronic member is transmitted to another electronic member, and the electronic component is affected by heat.

  According to the present invention for solving the above problems, there is provided a composite molded body in which heat conduction to a predetermined region is controlled, a method for producing such a composite molded body, and a module including such a composite molded body. .

  According to the present invention, there is provided a composite molded body including a first molded body having a mounting surface for a heat-generating electronic member and a second molded body in contact with the first molded body, wherein the heat of the first molded body. A composite molded body is provided having a conductivity that is at least twice as high as the thermal conductivity of the second molded body.

  Moreover, according to this invention, the process of providing the 1st shaping | molding which has the mounting surface of a heat generating electronic member, and the process of providing the 2nd shaping | molding body which contact | connected the said 1st shaping | molding body, and obtaining a composite shaping | molding body are provided. A method for producing a composite molded body is provided, wherein the thermal conductivity of the first molded body is at least twice as high as that of the second molded body.

Further, according to the present invention, the first molded body having a mounting surface for the heat generating electronic member and the second molded body provided in contact with the first molded body, the heat of the first molded body is provided. Conductivity is at least twice as high as the thermal conductivity of the second molded body, a composite molded body, a first heat generating electronic member provided on the placement surface of the first molded body, and the second A second electronic member provided on the molded body;
And a heat dissipating member provided in contact with the first molded body.

  According to this invention, the composite molded object which can reduce the heat conduction to a 2nd molded object is provided. According to the present invention, a method for producing such a composite molded body is provided. Moreover, according to this invention, a module provided with such a composite molded object is provided.

It is a perspective schematic diagram which shows the structure of the composite molded object which concerns on this embodiment. It is the top view (a) and sectional schematic diagram (b) which show the structure of the composite molded object which concerns on this embodiment. It is a cross-sectional schematic diagram which shows an example of the manufacturing method of the papermaking body which concerns on this embodiment. It is a schematic diagram which shows the structure of the module which concerns on this embodiment. 2 is a composite molded body in Example 1. 2 is a thermographic image of the composite molded body of Example 1 and Comparative Example 1. FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in all drawings, the same code | symbol is attached | subjected to the same component and description is abbreviate | omitted suitably.
In the following embodiments, the front, rear, left, right, and up and down directions are defined and illustrated as shown in the drawings, but this is for the purpose of simplifying the explanation of the relative relationship of each component, and therefore the present invention is implemented. It does not limit the direction of the product to be manufactured and used.

The composite molded body of the present invention includes a first molded body having a mounting surface for the heat generating electronic member and a second molded body in contact with the first molded body. The thermal conductivity of the first molded body is at least twice as high as that of the second molded body. Therefore, the heat generated from the heat generating electronic member disposed on the mounting surface of the first molded body is advantageously conducted to the first molded body, which is a region having a high thermal conductivity, and is a region having a low thermal conductivity. There is little or no conduction to the second compact. Therefore, in the composite molded body of the present invention, the degree and direction of heat conduction can be controlled.
If the difference in thermal conductivity between the first molded body and the second molded body is two times or more, the inventor advantageously conducts heat through the first molded body, and the first molded body and the second molded body. It has been found that heat exchange with the compact can be reduced.

  In one embodiment, as shown in FIG. 1, the composite molded body 10 includes a first molded body 20 having a mounting surface S for a heat generating electronic member, and a first molded body in an in-plane direction of the mounting surface S. 20 includes a second molded body 30 disposed in contact with 20. In the present embodiment, the thermal conductivity in the in-plane direction of the first molded body 20 is at least twice as high as the thermal conductivity in the in-plane direction of the second molded body 30. Such a composite molded body 10 has a highly controlled thermal conductivity in the in-plane direction. Moreover, the heat exchange between the 1st molded object 20 and the 2nd molded object 30 which contact | connected in the in-plane direction is reduced.

  In one embodiment, the first molded body 20 may be a papermaking body including a fiber filler and a resin. By using a papermaking body as the first molded body 20, the composite molded body 10 having excellent strength can be obtained. Moreover, the 1st molded object 20 which has high heat conductivity can be obtained by using the fiber filler which has heat conductivity as a fiber filler. Furthermore, by using such a 1st molded object 20, the direction and grade of the heat conduction of the composite molded object 10 obtained can be controlled.

Here, the papermaking body used as the 1st molded object 20 is demonstrated. The papermaking body is obtained by a papermaking method from a material slurry containing a fiber filler and a resin. The papermaking method refers to a wet papermaking method, that is, a papermaking technique which is one of papermaking techniques.
Note that the terms “papermaking method” and “papermaking body” refer to, for example, the state of an object obtained by using a technique of papermaking as described in Patent Document 2 and Patent Document 3, to which the present invention belongs. A technical term commonly used in the technical field.
In the specification of the present application, the papermaking body refers to a solid content in a wet state (this specification), which is obtained by passing a raw material slurry in which raw materials such as fibers and resins are dispersed in a dispersion medium, passing through a filter, and removing liquid. Refers to a molded body obtained by drying and heat treatment.

  FIG. 1 includes a first molded body 20 having a mounting surface S for a heat generating electronic member, and a second molded body 30 disposed in contact with the first molded body 20 in the in-plane direction of the mounting surface S. 1 is a schematic perspective view illustrating an example of a composite molded body 10. In the embodiment shown in FIG. 1, the composite molded body 10 has a flat plate shape, and the side surfaces of the first molded body 20 and the second molded body 30 constituting the composite molded body 10 are joined and integrated. ing. Here, the mounting surface S of the heat generating electronic member included in the first molded body 20 may be an arbitrary place on the upper surface of the first molded body 20.

  The papermaking body constituting the first molded body 20 includes the resin A and the fiber filler B. In FIG. 1, the enlarged schematic diagram of the area | region enclosed with the dotted line of the 1st molded object 20 which is a papermaking body is shown. In the first molded body 20, the orientation of the fiber filler B is highly controlled. Specifically, as shown in FIG. 1, the fiber fillers B are arranged in the in-plane direction. In other words, when the first molded body 20 is viewed from the plane direction, the orientation of the fiber filler B is random, and when viewed from the thickness direction, the fiber filler B is oriented in the in-plane direction of the first molded body 20. ing.

  In a preferred embodiment, the resin A is a thermosetting resin. By using the thermosetting resin, in the first molded body 20, the thermosetting resin A functions as a binder for binding the fiber fillers B, and the papermaking body is formed into a desired shape in the subsequent heat treatment. It functions as a molding material for molding and for integral molding with the second molded body 30.

  The fiber filler B used for the 1st molded object 20 which is a papermaking body has heat conductivity. Such fiber filler B mediates heat conduction. Therefore, the degree and direction of heat conduction of the obtained first molded body 20 can be controlled by adjusting the type, amount of use, orientation, and the like of the fiber filler B. In the embodiment shown in FIG. 1, the fiber filler B included in the first molded body 20 is oriented parallel to the in-plane direction of the first molded body 20. Due to the orientation of the fiber filler B, the thermal conductivity in the in-plane direction of the first molded body 20 is increased.

  Examples of the fiber filler B having thermal conductivity include metal fibers, carbon fibers, inorganic fibers, natural fibers, regenerated fibers, semi-synthetic fibers, and synthetic fibers. Among these, metal fibers, carbon fibers, or inorganic fibers are preferably used because they have high thermal conductivity.

As the metal fiber, a fiber containing at least one selected from the group consisting of aluminum, silver, copper, magnesium, iron, chromium, nickel, titanium, zinc, tin, molybdenum, and tungsten can be used. Specific examples of the metal fibers include, for example, stainless steel fibers manufactured by Nippon Seisen Co., Ltd. and Bekaert Japan Co., Ltd., copper fibers manufactured by Niji Co., Ltd., aluminum fibers, brass fibers, steel fibers, titanium fibers, phosphor bronze fibers, etc. These are available as commercial products.
Examples of the carbon fiber include PAN-based carbon fiber and pitch-based carbon fiber.
Examples of the inorganic fiber include glass fiber and ceramic fiber.
Examples of natural fibers include wood fibers, cotton, hemp, and wool.
Examples of the recycled fiber include rayon fiber.
Examples of semisynthetic fibers include polyamide fibers, aramid fibers, polyimide fibers, polyvinyl alcohol fibers, polyester fibers, acrylic fibers, polyparaphenylene benzoxazole fibers, polyethylene fibers, polypropylene fibers, polyacrylonitrile fibers, and ethylene vinyl alcohol fibers. It is done.
As a synthetic fiber, a cellulose fiber is mentioned, for example.

  The fiber length of the fiber filler B is preferably 1 mm or more and 15 mm or less, more preferably 1 mm or more and 6 mm or less, and further preferably 3 mm or more and 6 mm or less. The fiber filler B having a fiber length equal to or less than the above upper limit has good dispersibility in the material slurry in the manufacturing process of the papermaking described below, and as a result, the papermaking in which the fiber filler B is uniformly dispersed. The body is obtained. Moreover, the thermal conductivity of the in-plane direction of the 1st molded object which is a papermaking body can be increased by using the fiber filler B of the fiber length more than the said lower limit. Furthermore, the papermaking body which has high mechanical strength can be obtained by using the fiber filler B which has the fiber length in the said range.

  As the resin A, it is preferable to use a thermosetting resin. Examples of the thermosetting resin include epoxy resins, phenol resins, urea resins, melamine resins, unsaturated polyesters, silicone resins, urethane resins, or copolymers, blends, and polymer alloys thereof. These resins can be used alone or in combination of two or more.

  In one embodiment, the second molded body 30 is a cured product of a thermosetting resin or a papermaking body made of a material different from that of the first molded body 02. When a cured product of a thermosetting resin is used as the second molded body 30, the thermosetting resin that can be used is the same as the resin A exemplified in the first papermaking body constituting the first molded body 20.

  When the second molded body 30 is a papermaking body (herein referred to as a second papermaking body), the second papermaking body contains a different material from the first papermaking body constituting the first molded body 20 or has a different composition. Preferably there is. A 2nd papermaking body can be produced using resin and fiber filler B which were illustrated about the 1st papermaking body.

  The materials used to produce the first molded body 20 and the second molded body 30 are selected such that the thermal conductivity of the first molded body 20 is at least twice as high as that of the second molded body 30. The Furthermore, the material for producing the second molded body 30 is preferably selected so that the thermal conductivity of the second molded body 30 is 10 W / mk or less. The material can be selected by those skilled in the art based on the information on the thermal conductivity of the cured resin and the thermal conductivity of the fiber filler.

  For example, as the first molded body 20, a first paper body made of a fiber filler made of aluminum (thermal conductivity: 236 W · m / K) and a cured phenol resin (thermal conductivity: 0.5 W · m / K) is used. When used, the thermal conductivity in the in-plane direction of the first molded body 20 is at least about 1 W · m / K to about 10 W · m / K depending on the blending amount. When a phenol resin cured product (thermal conductivity: 0.5 W · m / K) is used as the second molded body 30, the thermal conductivity in the in-plane direction is about 0.5 W · m / K. In this case, the difference between the thermal conductivity in the in-plane direction of the first molded body 20 and the thermal conductivity in the in-plane direction of the second molded body 30 is at least 2 to 20 times.

  In one embodiment, the thermal conductivity of the first molded body 20 is preferably at least 5 times higher, more preferably at least 10 times higher, and more preferably at least 100 higher than the thermal conductivity of the second molded body 30. Twice as high, still more preferably at least 200 times higher. In addition, in the joining part of the 1st molded object 20 and the 2nd molded object 30, the thermal conductivity of the in-plane direction may be an aspect which changes in an inclination, or an aspect which changes in steps. Good. Since the difference in thermal conductivity between the first molded body 20 and the second molded body 30 is the above value, the heat generated from the heat generating electronic member placed on the first molded body 20 is transferred to the second molded body 30. Little or no conduction. Therefore, an electronic member whose heat conduction is not desirable and an electronic component whose operation is affected by heat can be disposed on the second molded body 30. Thus, according to the composite molded body 10 of the present invention, a heat generating electronic member and a member requiring temperature control can be arranged on one composite molded body 10.

  In FIG. 1, the 1st molded object 20 and the 2nd molded object 30 were flat form, and the aspect to which those side surfaces were joined was shown, but the 1st molded object 20 and the 2nd molded object 30 are three-dimensional, for example. You may have a shape. In FIG. 1, the composite molded body 10 has a flat plate shape, but the composite molded body 10 may have, for example, a three-dimensional shape. The shape of the composite molded body 10 can be changed as appropriate based on the shape of the electronic component placed on the composite molded body 10, its use, and the like.

  FIG. 1 shows a composite molded body 10 in which one flat first molded body 20 and one flat second molded body 30 are arranged in parallel in the in-plane direction. The body 10 is, for example, a form in which the other is fitted in an opening provided in a part of one of the first molded body 20 and the second molded body 30 (FIGS. 2a and 2b), The 2nd molded object 30 can take the form laminated | stacked in the thickness direction, or the form which combined these. The arrangement of the first molded body 20 and the second molded body 30 in the composite molded body 10 can be appropriately changed based on the size and shape of the electronic component placed on the molded body.

  The composite molded body 10 of the present invention provides a step of providing the first molded body 20 having the mounting surface S of the heat generating electronic member, and the second molded body 30 in contact with the first molded body 20. 10 is obtained. Here, the thermal conductivity of the first molded body 20 is adjusted to be at least twice as high as that of the second molded body 30.

  Below, about the manufacturing method of the composite molded object 10 according to one Embodiment, while the 1st molded object 20 and the 2nd molded object 30 are contacting in the inner surface direction, the aspect whose 1st molded object 20 is a papermaking body is demonstrated. The manufacturing method of such a composite molded body 10 includes a step of forming a papermaking layer from a slurry containing the thermosetting resin A and the fiber filler B by a papermaking method.

  First, manufacture of said papermaking layer is demonstrated with reference to FIG. FIG. 3 is a schematic cross-sectional view showing an example of a method for producing a papermaking layer. In one embodiment, the papermaking layer is manufactured using a wet papermaking method. In the present embodiment, the papermaking layer is prepared by dispersing the thermosetting resin A and the fiber filler B in a solvent to prepare a material slurry (FIG. 3a), and a container having the filter 60 on the bottom surface. And the solvent is discharged from the filter 60 (FIG. 3b). After the solvent is discharged from the filter 60, the aggregate of the material remains on the filter 60 in the form of a sheet. This aggregate of sheet-like materials is referred to as a papermaking layer 20a. After the step of preparing the material slurry, an aggregating agent can be added as necessary to promote the aggregation of the thermosetting resin A and the carbon fiber B.

  In the step of preparing the material slurry shown in FIG. 3A, the material excluding the flocculant is added to the solvent, stirred, and dispersed. In this embodiment, thermosetting resin A, fiber filler B, and other additives as needed are dispersed in a solvent. Thereby, the varnish-like material slurry for forming a papermaking layer can be obtained. As a method of dispersing each component in a solvent, for example, a method of stirring in a container equipped with a stirrer can be mentioned.

  As a solvent for preparing the material slurry, it is difficult to volatilize in the process of dispersing the above materials, it is easy to remove the solvent in order to reduce the residual in the papermaking, and the increase in energy due to the solvent removal can be suppressed. In view of the above, a solvent having a boiling point of 50 ° C. or higher and 200 ° C. or lower is preferable. Examples of such solvents include water; alcohols such as ethanol, 1-propanol, 1-butanol, and ethylene glycol; ketones such as acetone, methyl ethyl ketone, 2-heptanone, and cyclohexanone; ethyl acetate, butyl acetate, and methyl acetoacetate. And esters such as methyl acetoacetate; ethers such as tetrahydrofuran, isopropyl ether, dioxane and furfural. These solvents may be used alone or in combination of two or more. Among these, it is particularly preferable to use water because the supply amount is abundant, the cost is low, the environmental load is low, the safety is high, and the handling is easy.

  Next, as shown in FIG. 3B, the material slurry is put into a container having the filter 60 on the bottom surface, and the solvent is discharged from the filter 60. This allows the solvent to be separated from the material aggregates. At this time, the aggregate of sheet-like material remains on the filter 60, and the papermaking layer 20a is obtained. In the present embodiment, it is preferable to take out the papermaking layer 20a (FIG. 3c) and dry it in the heating furnace 70 to remove the remaining solvent (FIG. 3d).

  Then, the process of forming the 2nd molded object 30 is implemented. When producing the 2nd molded object 30 from a thermosetting resin, an opening part is provided in a part of the dried papermaking layer 20a obtained above, and the thermosetting resin which is the material of the 2nd molded object 30 is this. Place in the opening. Alternatively, the papermaking layer 20a and the thermosetting resin are arranged in the mold 71 so that they are juxtaposed. Thereafter, the papermaking layer 20a and the thermosetting resin are integrally molded by heating and pressing in the mold 71 using the heater 72 to obtain a single composite molded body 10 (FIG. 3e). When the method of providing an opening in the papermaking layer 20a is used, the composite molded body 10 having the form shown in FIG. 2 is obtained. When the papermaking layer 20a and the thermosetting resin are integrally molded in parallel, the structure shown in FIG. A composite molded body 10 having a shape is obtained.

  When using a papermaking body as the 2nd molded object 30, the papermaking layer 30a for the 2nd molded object 30 is produced similarly to the production method of the papermaking layer 20a for the 1st molded object 20. Next, the papermaking layer 20a for the first molded body 20 and the papermaking layer 30a for the second molded body 30 are arranged in the mold 71 so that they are arranged in parallel. Then, these papermaking layers are integrally molded by heating and pressing to obtain a single composite molded body 10. Alternatively, an opening may be provided in the papermaking layer 20a for the first molded body 20, and the papermaking layer 30a for the second molded body 30 may be disposed in the opening and integrally molded.

In the present embodiment, a papermaking layer having a desired shape can be obtained by selecting the shape of the filter 60 or using a mask in the step of carrying out the papermaking method.
As the shape of the filter 60, when a flat sheet-shaped filter 60 is used, a papermaking layer having a sheet-like shape is obtained. Further, for example, when a filter 60 having a three-dimensional shape such as a wave shape or unevenness is used, a papermaking layer having a three-dimensional shape is obtained. The shape of the papermaking layer can be appropriately selected according to the shape of the papermaking body (molded body) obtained by curing it, the shape of the mold, and the like. The thickness of the papermaking layer can be adjusted by adjusting the amount of each material in the material slurry, or by repeating the papermaking process shown in FIG.

  In one embodiment, a mold having a desired shape is used in the step of integrating the first papermaking layer 20a and the thermosetting resin or the step of integrating the first papermaking layer 20a and the second papermaking layer 30a. The shape of the resulting composite molded body 10 can be changed by compression molding.

  In one embodiment, as shown in FIG. 4, the module 100 is obtained by combining the composite molded body 10 with an electronic component and a heat dissipation member. In this embodiment, the module includes the composite molded body 10, the first heat generating electronic member 2 mounted on the first molded body 20, and the second electronic member 1 mounted on the second molded body 30. And the heat radiating member 3 provided in contact with the 1st molded object 20 is provided.

  As shown by the arrows in FIG. 4, the heat generated from the heat generating electronic member is transmitted to the heat radiating member 3 through the first molded body 20 and is radiated here. Since the first molded body 20 has higher thermal conductivity than the second molded body 30, heat is preferentially diffused into the first molded body 20 and is transmitted to the heat radiating member provided in the first molded body 20. Heat is dissipated. Therefore, heat is hardly transmitted to the second molded body 30, and the electronic member 1 on the second molded body 30 is not affected by the heat.

Example 1
By the method shown in the embodiment shown with reference to FIG. 3, a papermaking layer was produced using a slurry having the following composition.
First, 57 parts by weight of phenol resin (phenol resin, “PR51723”, manufactured by Sumitomo Bakelite Co., Ltd.) as a thermosetting resin pulverized to an average particle size of 100 μm (50% particle size based on mass) with an atomizer pulverizer, carbon fiber (Fiber length: 5 mm) 38 parts by weight, 5 parts by weight of aramid microfiber ("Tiara", manufactured by Daicel Finechem Co., Ltd.) as an additive were added to water, and stirred for 30 minutes with a disperser to obtain a mixture. . Here, it added to 10000 weight part of water with respect to a total of 100 weight part of the constituent material which consists of a thermosetting resin and carbon fiber.
Next, a flocculant (synthetic smectite: smecton (manufactured by Kunimine Kogyo Co., Ltd.)) dissolved in water in advance was added in an amount of 0.2 part by weight based on the total of the constituent materials described above, and the constituent materials were aggregated in a floc form. .
The slurry containing the agglomerate thus obtained was filtered through a 30-mesh metal net. Thereafter, the agglomerates remaining on the metal net were taken out, dehydrated and pressed, and further placed in a dryer at 50 ° C. for 5 hours to dry, thereby obtaining a sheet-like papermaking layer. The yield was 97%.

Next, an opening is formed in the obtained papermaking layer, and a granular phenolic resin molding material ("Sumicon PM", manufactured by Sumitomo Bakelite Co., Ltd.) is placed in this opening, and the papermaking body is put into a mold and heated and pressurized. A composite molded body composed of a portion and a cured resin was produced (FIG. 5).
The thermal conductivity in the in-plane direction (the direction of the arrow in FIG. 5) of the papermaking portion of the obtained composite molded body was 100 WmL, and the thermal conductivity in the thickness direction was 10 W / mK. The thermal conductivity of the second molded body was 0.5 W / mK in both the in-plane direction and the thickness direction.

Next, as shown in FIG. 6 (a), a heater was attached on the papermaking body portion, and the temperature change of the composite molded body was measured by thermography. FIG. 6B shows a thermographic image immediately after heating of the heater and a thermographic image 30 minutes after the heating. As shown in FIG.6 (b), it turned out that heat is transmitted to the papermaking part.
(Comparative Example 1)
As a comparative example, a molded body made only of a papermaking body was produced and its thermal conductivity was measured. The results are shown in FIG. As shown in FIG. 6 (c), the molded body of Comparative Example 1 conducts heat throughout.
As shown in the results of thermography, in the composite molded body of Example 1, heat is conducted along the region formed of the papermaking body, and the temperature of the region formed of the resin cured product is not increased. Thus, in the composite molded body of Example 1, the direction of heat conduction could be controlled.

DESCRIPTION OF SYMBOLS 1 Electronic member 2 Heat generating electronic member 3 Heat radiating member 10 Composite molded body 20 First molded body 20a Papermaking layer 30 Second molded body 30a Papermaking layer 60 Filter 70 Heating furnace 71 Mold 72 Heater 100 Module A Resin (thermosetting resin)
B Fiber filler S Placement surface

Claims (23)

A composite molded body including a first molded body having a mounting surface for a heat generating electronic member and a second molded body in contact with the first molded body,
The thermal conductivity of the first molded body is at least twice as high as the thermal conductivity of the second molded body,
Composite molded body. The second molded body is disposed in the in-plane direction of the placement surface of the first molded body,
The thermal conductivity in the in-plane direction of the first molded body is at least twice as high as the thermal conductivity in the in-plane direction of the second molded body,
The composite molded body according to claim 1.   The composite molded body according to claim 1 or 2, wherein the first molded body is a first papermaking body including a first fiber filler and a first resin.   The composite molded body according to claim 3, wherein the first resin includes a thermosetting resin.   The composite molded body according to claim 3 or 4, wherein the first fiber filler contained in the first molded body is oriented in parallel to an in-plane direction of the first molded body.   The composite molded body according to any one of claims 1 to 5, wherein the second molded body is a second papermaking body including a second fiber filler and a second resin, or a cured product of a thermosetting resin. The second molded body is the second papermaking body,
The composite molded body according to claim 6, wherein the second fiber filler contained in the second molded body is oriented in parallel to the in-plane direction of the second molded body.   The composite molded body according to claim 6 or 7, wherein the second resin contains a thermosetting resin.   The composite molded body according to any one of claims 1 to 8, wherein the thermal conductivity of the first molded body is at least five times higher than the thermal conductivity of the second molded body.   The composite molded body according to any one of claims 1 to 9, wherein the thermal conductivity in the in-plane direction of the first molded body is at least five times higher than the thermal conductivity in the in-plane direction of the second molded body.   The composite molded body according to any one of claims 1 to 10, wherein the second molded body has a thermal conductivity of 10 W / mk or less.   The composite molded body according to any one of claims 1 to 11, which has a flat plate shape or a three-dimensional shape.   The said 1st fiber filler contains at least 1 fiber selected from the group which consists of a metal fiber, carbon fiber, an inorganic fiber, a natural fiber, a regenerated fiber, a semisynthetic fiber, and a synthetic fiber, Any of Claims 3-12 A composite molded article according to any one of the above.   The composite molded body according to any one of claims 3 to 13, wherein the first fiber filler has a fiber length of 1 mm or more and 15 mm or less. Providing a first molded body having a mounting surface for a heat generating electronic member;
A method for producing a composite molded body comprising the step of providing a second molded body in contact with the first molded body to obtain a composite molded body,
The thermal conductivity of the first molded body is at least twice as high as the thermal conductivity of the second molded body,
A method for producing a composite molded body. The first molded body comprises a first papermaking body,
The second molded body is a cured product of a thermosetting resin,
The step of obtaining a composite molded body comprises
A step of forming a first papermaking layer by a papermaking method from a slurry containing the first fiber filler and the first resin;
Placing the thermosetting resin in contact with the first papermaking layer;
Heating and integrating the first papermaking layer and the thermosetting resin to obtain a composite molded body,
The manufacturing method of the composite molded object of Claim 15. The step of placing the thermosetting resin in contact with the first papermaking layer,
Arranging the thermosetting resin in the inner surface direction of the first papermaking layer in contact with the first papermaking layer;
The thermal conductivity in the in-plane direction of the first molded body is at least twice as high as the thermal conductivity in the in-plane direction of the second molded body,
The manufacturing method of the composite molded object of Claim 16. The process of obtaining a composite molded body by heating and integrating the first papermaking layer and the thermosetting resin,
Including a step of forming the composite molded body to have a flat plate shape or a three-dimensional shape,
The manufacturing method of the composite molded object of Claim 16 or 17. The first molded body comprises a first papermaking body,
The second molded body comprises a second papermaking body,
The step of obtaining a composite molded body comprises
A step of forming a first papermaking layer by a papermaking method from a slurry containing the first fiber filler and the first resin;
Forming a second papermaking layer in contact with the first papermaking layer by a papermaking method from a slurry containing the second fiber filler and the second resin;
Heating and integrating the first papermaking layer and the second papermaking layer to obtain a composite molded body,
The manufacturing method of the composite molded object of Claim 15. The step of forming the second papermaking layer in contact with the first papermaking layer includes:
Forming the second papermaking layer in contact with the first papermaking layer in an in-plane direction of the second papermaking layer;
The thermal conductivity in the in-plane direction of the first molded body is at least twice as high as the thermal conductivity in the in-plane direction of the second molded body,
The manufacturing method of the composite molded object of Claim 19. The above-mentioned step of heating and integrating the first papermaking layer and the second papermaking layer to obtain a composite molded body,
Including a step of forming the composite molded body to have a flat plate shape or a three-dimensional shape,
The manufacturing method of the composite molded object of Claim 19 or 20. It is comprised from the 1st molded object which has the mounting surface of a heat generating electronic member, and the 2nd molded object provided in contact with the said 1st molded object, The heat conductivity of the said 1st molded object is said 2nd molded object. A composite molded body at least twice as high as the thermal conductivity of the body;
A first heat generating electronic member provided on the placement surface of the first molded body;
A second electronic member provided on the second molded body;
A heat dissipating member provided in contact with the first molded body;
Comprising a module. The second molded body is disposed in the in-plane direction of the placement surface of the first molded body,
The module according to claim 22, wherein the thermal conductivity in the in-plane direction of the first molded body is at least twice as high as the thermal conductivity in the in-plane direction of the second molded body.