JP2017168629A - Soldering device and soldering method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent burning of a soldered part, even when the thread solder supply timing lags behind the laser irradiation timing, without causing any design change of a board or increase in the production process.SOLUTION: A soldering device includes a laser light source 1 for radiating laser 11, a solder supply section 2 for supplying thread solder 21, a heat sink 3 with heat capacity, a moving section 4 for moving the heat sink 3, a contact section 52 for bringing the heat sink 3 into contact with a soldered part 101 or a conduction part 102 on a board 10, by means of the moving section 4, and a soldering section 53 for performing soldering in a state where the heat sink 3 is in contact with the soldered part 101 or conduction part 102, by irradiating the soldered part 101 with laser 11 from the laser light source 1, and supplying the thread solder 21 by the solder supply section 2.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a soldering apparatus and a soldering method for performing laser soldering using thread solder.

  In recent years, electronic circuit boards (hereinafter referred to as “boards”) have been miniaturized, and components are mounted at high density. At the same time, metal pads and metal patterns, which are soldered portions on the substrate, are also downsized to a width of about 1 mm, and it is required to perform precise soldering on a minute region. Therefore, laser soldering capable of heating a minute region is used as means for performing precise soldering.

On the other hand, when laser soldering is used in combination with thread solder, there is a problem of burnout of the soldered portion. Hereinafter, an operation example of laser soldering using thread solder by a conventional soldering apparatus will be described.
In the soldering apparatus, first, the laser irradiation spot from the laser light source and the supply point of the thread solder from the solder supply unit are matched with the part to be soldered on the substrate. Next, the soldering part is soldered by irradiating a laser with a laser light source and simultaneously supplying thread solder with a solder supply part. Thereafter, laser irradiation by the laser light source is terminated, and at the same time, the supply of yarn solder by the solder supply unit is terminated.
Here, the heat capacity of the part to be soldered has decreased with the downsizing. For this reason, if the supply timing of the thread solder is delayed with respect to the laser irradiation timing due to, for example, a shift in the supply position of the thread solder, the laser irradiation portion of the soldered portion will overheat and burn out.

  Therefore, conventionally, burning is prevented by using a flame-retardant substrate or applying a solder resist or a laser resist to the substrate (for example, see Patent Documents 1 and 2). In addition, it is also known to prevent burning by using a low-power laser or preheating a substrate using a defocused laser (see, for example, Patent Documents 3 and 4).

JP 2013-258254 A JP 60-182191 A Japanese Patent Publication No.8-18125 JP-A-60-180666

  However, the method of using a flame-retardant substrate or applying a solder resist or laser resist to the substrate causes a change in the design of the substrate or an increase in the manufacturing process, so that it is difficult to apply to existing products. . In addition, even when using a low-power laser or preheating the substrate using a defocused laser, the supply timing of the thread solder is delayed relative to the laser irradiation timing due to misalignment of the supply position of the thread solder, etc. If this happens, burnout will occur and the problem will not be solved.

  The present invention has been made to solve the above-described problems. In this case, the supply timing of the thread solder is delayed with respect to the laser irradiation timing without causing the design change of the substrate and the increase of the manufacturing process. Even if it exists, it aims at providing the soldering apparatus and the soldering method which can prevent the burning of a to-be-soldered part.

  A soldering apparatus according to the present invention includes a laser light source for irradiating a laser, a solder supply unit for supplying thread solder, a heat sink having a heat capacity, a moving unit for moving the heat sink, and a part to be soldered on a substrate, or When there is a conducting part conducted in the substrate in the soldered part, a contact part where the heat sink is brought into contact with the conducting part by the moving part, and the heat sink is in contact with the soldered part or conducting part The soldering part is provided with a soldering part for performing soldering by irradiating the soldered part with a laser from a laser light source and supplying a thread solder with a solder supply part.

  According to this invention, since it is configured as described above, even if the supply timing of the thread solder is delayed with respect to the laser irradiation timing without causing a change in the design of the substrate and an increase in the manufacturing process, Burnout of the soldered part can be prevented.

It is a schematic diagram which shows the structural example of the soldering apparatus which concerns on Embodiment 1 of this invention. It is a flowchart which shows the operation example of the soldering apparatus which concerns on Embodiment 1 of this invention. 3A and 3B are top views showing an operation example of the soldering apparatus according to Embodiment 1 of the present invention. It is a perspective view which shows the operation example at the time of the soldering by the soldering apparatus which concerns on Embodiment 1 of this invention. 5A and 5B are top views showing another operation example of the soldering apparatus according to Embodiment 1 of the present invention. 6A and 6B are top views showing another operation example of the soldering apparatus according to Embodiment 1 of the present invention. It is a schematic diagram which shows the structural example of the soldering apparatus which concerns on Embodiment 2 of this invention. It is a flowchart which shows the operation example of the soldering apparatus which concerns on Embodiment 2 of this invention. 9A to 9D are top views showing an operation example of the soldering apparatus according to Embodiment 2 of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
Embodiment 1 FIG.
FIG. 1 is a schematic diagram showing a configuration example of a soldering apparatus according to Embodiment 1 of the present invention.
As shown in FIG. 1, the soldering apparatus includes a laser light source 1, a solder supply unit 2, a heat sink 3, a moving unit 4, and a control unit 5.

The laser light source 1 irradiates a laser 11.
The solder supply unit 2 supplies the thread solder 21.

The heat sink 3 has a heat capacity and is made of a metal member or the like.
The moving unit 4 moves the heat sink 3.

  The controller 5 controls the operation of each part of the soldering apparatus. The control unit 5 includes a positioning unit 51, a contact unit 52, and a soldering unit 53. The control unit 5 is realized by a processing circuit such as a system LSI or a CPU that executes a program stored in a memory or the like.

  The positioning unit 51 aligns the irradiation spot of the laser 11 by the laser light source 1 and the supply point of the thread solder 21 by the solder supply unit 2 with the soldered part 101 on the substrate 10. At this time, for example, the positioning unit 51 moves the laser light source 1 and the solder supply unit 2 to match the irradiation spot and the supply point with the soldered unit 101.

  The contact portion 52 is connected to the soldered portion 101 or the soldered portion 101 when the conductive portion 102 conducted in the substrate 10 exists (see FIG. 5B). The heat sink 3 is brought into contact.

  In a state where the heat sink 3 is in contact with the soldered part 101 or the conduction part 102, the soldering part 53 irradiates the laser to be soldered part 101 with the laser 11 from the laser light source 1, and the solder supply part 2 performs the yarn. Soldering is performed by supplying the solder 21. The soldering unit 53 also controls the irradiation intensity of the laser 11 and the supply speed of the thread solder 21.

Next, an operation example by the soldering apparatus according to the first embodiment will be described with reference to FIGS. Hereinafter, a case where the heat sink 3 is brought into contact with the soldered portion 101 will be described.
In the operation example by the soldering apparatus according to the first embodiment, as shown in FIG. 2, first, the positioning unit 51 applies the irradiation spot of the laser 11 by the laser light source 1 and the soldered part 101 on the substrate 10. The supply points of the thread solder 21 by the solder supply unit 2 are matched (step ST201).

  Moreover, the contact part 52 makes the heat sink 3 contact with the to-be-soldered part 101 by the moving part 4 (step ST202). As a result, as shown in FIG. 3A, the heat sink 3 having a heat capacity is brought into direct contact with the soldered part 101, and the heat capacity of the soldered part 101 can be increased.

  Next, in a state where the heat sink 3 is in contact with the soldered part 101, the soldering part 53 irradiates the soldered part 101 with the laser 11 from the laser light source 1, and the solder supply part 2 performs the thread solder 21. Is supplied to perform soldering (step ST203). At this time, the thread solder 21 is supplied simultaneously with the irradiation of the laser 11. FIG. 3B and FIG. 4 show how soldering is performed by the soldering portion 53.

  Here, as described above, the heat capacity of the soldered portion 101 is increased by the heat sink 3. Therefore, even if the supply timing of the thread solder 21 is delayed with respect to the irradiation timing of the laser 11 due to a supply position shift of the thread solder 21 or the like, the heat from the laser 11 can be released to the heat sink 3 side. Therefore, it is possible to avoid the occurrence of excessive temperature rise in the laser irradiated portion of the soldered portion 101 and to prevent burning.

  3 and 4 show the case where the heat sink 3 is arranged near the supply point of the thread solder 21 on the soldered portion 101. However, the present invention is not limited to this. For example, when a part of the soldered portion 101 is extended as shown in FIG. 5A or when the soldered portion 101 is placed in the substrate 10 as shown in FIG. 5B. When there is a conducting part (metal pad or metal pattern) 102 that is conducted, the heat sink 3 can be arranged far from the supply point of the thread solder 21. In FIG. 5A, the heat sink 3 is brought into contact with the extended portion of the soldered portion 101, and in FIG. 5B, the heat sink 3 is brought into contact with the conducting portion 102. In the case of FIG. 5B, since the conductive portion 102 is not soldered, the heat sink 3 can be removed from the conductive portion 102 after soldering to the soldered portion 101.

  In the above description, it is assumed that a part (not shown) is surface-mounted on the soldered portion 101. However, the present invention is not limited to this. For example, as shown in FIG. 6, the configuration of the first embodiment can be similarly applied when a penetrating component (not shown) is soldered to the soldered portion 101. It is.

  As described above, according to the first embodiment, when the soldered part 101 or the conductive part 102 on the substrate 10 exists, the heat sink 3 is brought into contact with the conductive part 102 by the moving part 4. In the state where the heat sink 3 is in contact with the soldered part 101 or the conduction part 102, the laser light source 1 irradiates the laser 11 to the soldered part 101, and the solder supply part 2 supplies the thread solder 21. Thus, since the soldering is performed, the supply timing of the thread solder 21 is delayed with respect to the irradiation timing of the laser 11 without causing the design change of the substrate 10 and the increase of the manufacturing process. Burnout of the soldered part 101 can be prevented. Further, in the configuration of the first embodiment, unlike the prior art, it is not necessary to change the design of the substrate 10 and increase the manufacturing process, so that it can be easily applied to existing products.

  Moreover, in the structure of Embodiment 1, since the heat capacity of the to-be-soldered part 101 can be increased, it becomes possible to ease the conditions of the supply time of the thread solder 21.

Embodiment 2. FIG.
In the first embodiment, when the heat sink 3 is brought into contact with the soldered portion 101, it is assumed that the heat sink 3 is left on the substrate 10 as it is after soldering. However, depending on the substrate 10, the heat sink 3 may not be left on the substrate 10. Therefore, in the second embodiment, a configuration in which the heat sink 3 can be removed after soldering to the soldered portion 101 even when the heat sink 3 is brought into contact with the soldered portion 101 will be described.

  FIG. 7 is a schematic diagram showing a configuration example of a soldering apparatus according to Embodiment 2 of the present invention. The soldering apparatus according to the second embodiment shown in FIG. 7 is different from the soldering apparatus according to the first embodiment shown in FIG. 1 in that the material of the heat sink 3 is limited. The part 55 is added. Other configurations are the same, and the same reference numerals are given and description thereof is omitted.

  The heat sink 3 in the second embodiment is made of a metal member that has a heat capacity and does not get wet with the thread solder 21. Examples of the member used for the heat sink 3 include platinum, SUS, Ni-based alloy, and the like.

The removal portion 54 is for removing the heat sink 3 from the soldered portion 101 by the moving portion 4 after the processing by the soldering portion 53.
The reheating unit 55 is for irradiating the laser 11 again with the laser light source 1 to the part 101 to be soldered after the processing by the removing unit 54. The reheating unit 55 also controls the irradiation intensity of the laser 11.

  Next, an operation example by the soldering apparatus according to the second embodiment will be described with reference to FIGS. The operation example by the soldering apparatus according to the second embodiment shown in FIG. 8 is obtained by adding steps ST801 and 802 to the operation example by the soldering apparatus according to the first embodiment shown in FIG. Other operations are the same and the description thereof is omitted. 9A and 9B are the same views as FIGS. 3A and 3B.

  In the soldering apparatus according to the second embodiment, after the processing by the soldering unit 53 in step ST202, the removing unit 54 removes the heat sink 3 from the soldered unit 101 by the moving unit 4 (step ST801). That is, in the second embodiment, the heat sink 3 is made of a metal member that is difficult to get wet with the thread solder 21. Therefore, the heat sink 3 can be removed from the soldered part 101 after soldering to the soldered part 101, as shown in FIG. 9C.

  Next, the reheating unit 55 causes the laser light source 1 to irradiate the laser 11 again to the part to be soldered 101 (step ST802). That is, by removing the heat sink 3, a portion (unsoldered portion 101b shown in FIG. 9C) of the soldered portion 101 where the heat sink 3 was installed is exposed. Therefore, as shown in FIG. 9D, the soldered portion 101 is irradiated again with the laser 11 to adjust the soldering shape on the soldered portion 101 and apply the solder to the entire soldered portion 101. be able to.

  In the above description, the case where the reheating unit 55 adjusts the soldering shape on the soldered portion 101 is shown. However, the reheating unit 55 is not an essential configuration, and the reheating unit 55 may be removed from the control unit 5 when the soldering shape on the soldered unit 101 is not required.

As described above, according to the second embodiment, the heat sink 3 is composed of a metal member that is difficult to get wet with the thread solder 21, and after the soldering to the soldered portion 101, the heat sink 3 is removed. In addition to the effects of the first embodiment, it is possible to cope with the case where the heat sink 3 needs to be removed.
Moreover, the soldering shape on the to-be-soldered part 101 can be adjusted by reheating the to-be-soldered part 101 after removing the heat sink 3.

  In the present invention, within the scope of the invention, any combination of the embodiments, or any modification of any component in each embodiment, or omission of any component in each embodiment is possible. .

DESCRIPTION OF SYMBOLS 1 Laser light source 2 Solder supply part 3 Heat sink 4 Moving part 5 Control part 10 Board | substrate 11 Laser 21 Thread solder 51 Positioning part 52 Contacting part 53 Soldering part 54 Removal part 55 Reheating part 101 Soldering part 101b Unsoldering part 102 Conduction Part

Claims (5)

A laser light source for irradiating a laser;
A solder supply section for supplying thread solder;
A heat sink having a heat capacity;
A moving part for moving the heat sink;
A soldered part on the substrate, or a contact part where the heat sink is brought into contact with the conductive part when the conductive part conducted in the board exists in the soldered part;
In a state where the heat sink is in contact with the soldered part or the conduction part, the soldering part is irradiated with laser by the laser light source, and thread solder is supplied by the solder supply part. A soldering device having a soldering part for performing soldering. The soldering apparatus according to claim 1, wherein the heat sink is made of a metal that does not wet the yarn solder. The contact portion makes the heat sink contact the soldered portion,
The soldering apparatus according to claim 2, further comprising: a removing unit that removes the heat sink from the soldered portion by the moving unit after the processing by the soldering unit. The soldering apparatus according to claim 3, further comprising a reheating unit that irradiates the soldered portion with a laser again by the laser light source after the processing by the removing portion. A soldering method by a soldering apparatus comprising a laser light source for irradiating a laser, a solder supply unit for supplying thread solder, a heat sink having a heat capacity, and a moving unit for moving the heat sink,
When the contact part is a soldered part on the substrate, or when the conductive part conducted in the board exists in the soldered part, the heat sink is brought into contact with the conductive part by the moving part,
In the state where the heat sink is in contact with the soldered part or the conducting part, the soldering part irradiates the soldered part with laser by the laser light source, and supplies the thread solder by the solder supply part. Soldering method characterized by performing soldering.

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