JP2017166988A5 - - Google Patents

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Publication number
JP2017166988A5
JP2017166988A5 JP2016052659A JP2016052659A JP2017166988A5 JP 2017166988 A5 JP2017166988 A5 JP 2017166988A5 JP 2016052659 A JP2016052659 A JP 2016052659A JP 2016052659 A JP2016052659 A JP 2016052659A JP 2017166988 A5 JP2017166988 A5 JP 2017166988A5
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JP
Japan
Prior art keywords
pair
lead frames
insulating film
connection
sensor
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Application number
JP2016052659A
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English (en)
Japanese (ja)
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JP6583073B2 (ja
JP2017166988A (ja
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Priority to JP2016052659A priority Critical patent/JP6583073B2/ja
Priority claimed from JP2016052659A external-priority patent/JP6583073B2/ja
Publication of JP2017166988A publication Critical patent/JP2017166988A/ja
Publication of JP2017166988A5 publication Critical patent/JP2017166988A5/ja
Application granted granted Critical
Publication of JP6583073B2 publication Critical patent/JP6583073B2/ja
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JP2016052659A 2016-03-16 2016-03-16 温度センサ Active JP6583073B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016052659A JP6583073B2 (ja) 2016-03-16 2016-03-16 温度センサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016052659A JP6583073B2 (ja) 2016-03-16 2016-03-16 温度センサ

Publications (3)

Publication Number Publication Date
JP2017166988A JP2017166988A (ja) 2017-09-21
JP2017166988A5 true JP2017166988A5 (cg-RX-API-DMAC7.html) 2018-01-18
JP6583073B2 JP6583073B2 (ja) 2019-10-02

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ID=59913279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016052659A Active JP6583073B2 (ja) 2016-03-16 2016-03-16 温度センサ

Country Status (1)

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JP (1) JP6583073B2 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12146800B2 (en) 2018-08-10 2024-11-19 Semitec Corporation Temperature sensor and device equipped with temperature sensor
CN116295901A (zh) * 2022-11-18 2023-06-23 广东万诺传感技术有限公司 一种接触式温度传感器

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