JP2017141355A - Method for producing polyimide foam - Google Patents
Method for producing polyimide foam Download PDFInfo
- Publication number
- JP2017141355A JP2017141355A JP2016023456A JP2016023456A JP2017141355A JP 2017141355 A JP2017141355 A JP 2017141355A JP 2016023456 A JP2016023456 A JP 2016023456A JP 2016023456 A JP2016023456 A JP 2016023456A JP 2017141355 A JP2017141355 A JP 2017141355A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- polyimide precursor
- precursor powder
- acid diester
- foam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004642 Polyimide Substances 0.000 title claims abstract description 94
- 229920001721 polyimide Polymers 0.000 title claims abstract description 94
- 239000006260 foam Substances 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000002243 precursor Substances 0.000 claims abstract description 49
- -1 aromatic tetracarboxylic acid diester Chemical class 0.000 claims abstract description 43
- 239000000843 powder Substances 0.000 claims abstract description 42
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 150000004984 aromatic diamines Chemical class 0.000 claims abstract description 19
- 238000005187 foaming Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000011049 filling Methods 0.000 claims abstract description 4
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 6
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 6
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 5
- 238000007790 scraping Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 abstract 2
- 238000005336 cracking Methods 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 abstract 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 239000002904 solvent Substances 0.000 description 12
- 210000004027 cell Anatomy 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
- 239000004094 surface-active agent Substances 0.000 description 6
- 150000004982 aromatic amines Chemical class 0.000 description 5
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 3
- NBAUUNCGSMAPFM-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=CC(C(O)=O)=C1C(O)=O NBAUUNCGSMAPFM-UHFFFAOYSA-N 0.000 description 3
- FYYYKXFEKMGYLZ-UHFFFAOYSA-N 4-(1,3-dioxo-2-benzofuran-5-yl)-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1C1=CC=CC2=C1C(=O)OC2=O FYYYKXFEKMGYLZ-UHFFFAOYSA-N 0.000 description 3
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000032050 esterification Effects 0.000 description 3
- 238000005886 esterification reaction Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 2
- GWHLJVMSZRKEAQ-UHFFFAOYSA-N 3-(2,3-dicarboxyphenyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O GWHLJVMSZRKEAQ-UHFFFAOYSA-N 0.000 description 2
- RQEOBXYYEPMCPJ-UHFFFAOYSA-N 4,6-diethyl-2-methylbenzene-1,3-diamine Chemical compound CCC1=CC(CC)=C(N)C(C)=C1N RQEOBXYYEPMCPJ-UHFFFAOYSA-N 0.000 description 2
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 150000005690 diesters Chemical class 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- 239000013500 performance material Substances 0.000 description 2
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 2
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- JRHNUZCXXOTJCA-UHFFFAOYSA-N 1-fluoropropane Chemical compound CCCF JRHNUZCXXOTJCA-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- KELUYBRGBRRUCW-UHFFFAOYSA-N 2,4-diethylbenzene-1,3-diamine Chemical compound CCC1=CC=C(N)C(CC)=C1N KELUYBRGBRRUCW-UHFFFAOYSA-N 0.000 description 1
- 229940075142 2,5-diaminotoluene Drugs 0.000 description 1
- RLYCRLGLCUXUPO-UHFFFAOYSA-N 2,6-diaminotoluene Chemical compound CC1=C(N)C=CC=C1N RLYCRLGLCUXUPO-UHFFFAOYSA-N 0.000 description 1
- OBCSAIDCZQSFQH-UHFFFAOYSA-N 2-methyl-1,4-phenylenediamine Chemical compound CC1=CC(N)=CC=C1N OBCSAIDCZQSFQH-UHFFFAOYSA-N 0.000 description 1
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical compound C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 1
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- CKOFBUUFHALZGK-UHFFFAOYSA-N 3-[(3-aminophenyl)methyl]aniline Chemical compound NC1=CC=CC(CC=2C=C(N)C=CC=2)=C1 CKOFBUUFHALZGK-UHFFFAOYSA-N 0.000 description 1
- WXRREUIRWZLUBD-UHFFFAOYSA-N 3-[2-(3-aminophenoxy)propan-2-yloxy]aniline Chemical compound C=1C=CC(N)=CC=1OC(C)(C)OC1=CC=CC(N)=C1 WXRREUIRWZLUBD-UHFFFAOYSA-N 0.000 description 1
- DVXYMCJCMDTSQA-UHFFFAOYSA-N 3-[2-(3-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=CC(N)=CC=1C(C)(C)C1=CC=CC(N)=C1 DVXYMCJCMDTSQA-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- LBPVOEHZEWAJKQ-UHFFFAOYSA-N 3-[4-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 LBPVOEHZEWAJKQ-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- AIVVXPSKEVWKMY-UHFFFAOYSA-N 4-(3,4-dicarboxyphenoxy)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 AIVVXPSKEVWKMY-UHFFFAOYSA-N 0.000 description 1
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical compound CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- OBBOXORQYKYQJP-UHFFFAOYSA-N 4-[(4-amino-2,6-diethylphenyl)methyl]-3,5-diethylaniline Chemical compound CCC1=CC(N)=CC(CC)=C1CC1=C(CC)C=C(N)C=C1CC OBBOXORQYKYQJP-UHFFFAOYSA-N 0.000 description 1
- ZFNBMPKLGYWYFF-UHFFFAOYSA-N 4-[(4-amino-2-ethyl-6-methylphenyl)methyl]-3-ethyl-5-methylaniline Chemical compound CCC1=CC(N)=CC(C)=C1CC1=C(C)C=C(N)C=C1CC ZFNBMPKLGYWYFF-UHFFFAOYSA-N 0.000 description 1
- NWIVYGKSHSJHEF-UHFFFAOYSA-N 4-[(4-amino-3,5-diethylphenyl)methyl]-2,6-diethylaniline Chemical compound CCC1=C(N)C(CC)=CC(CC=2C=C(CC)C(N)=C(CC)C=2)=C1 NWIVYGKSHSJHEF-UHFFFAOYSA-N 0.000 description 1
- QJENIOQDYXRGLF-UHFFFAOYSA-N 4-[(4-amino-3-ethyl-5-methylphenyl)methyl]-2-ethyl-6-methylaniline Chemical compound CC1=C(N)C(CC)=CC(CC=2C=C(CC)C(N)=C(C)C=2)=C1 QJENIOQDYXRGLF-UHFFFAOYSA-N 0.000 description 1
- IYMMZGRJAMFSKQ-UHFFFAOYSA-N 4-[2-(4-aminophenoxy)propan-2-yloxy]aniline Chemical compound C=1C=C(N)C=CC=1OC(C)(C)OC1=CC=C(N)C=C1 IYMMZGRJAMFSKQ-UHFFFAOYSA-N 0.000 description 1
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- KIFDSGGWDIVQGN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)fluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 KIFDSGGWDIVQGN-UHFFFAOYSA-N 0.000 description 1
- QGMGHALXLXKCBD-UHFFFAOYSA-N 4-amino-n-(2-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=CC=CC=C1N QGMGHALXLXKCBD-UHFFFAOYSA-N 0.000 description 1
- CWJJAFQCTXFSTA-UHFFFAOYSA-N 4-methylphthalic acid Chemical compound CC1=CC=C(C(O)=O)C(C(O)=O)=C1 CWJJAFQCTXFSTA-UHFFFAOYSA-N 0.000 description 1
- CQMIJLIXKMKFQW-UHFFFAOYSA-N 4-phenylbenzene-1,2,3,5-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C1C1=CC=CC=C1 CQMIJLIXKMKFQW-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000005011 alkyl ether group Chemical group 0.000 description 1
- 125000005233 alkylalcohol group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229940111121 antirheumatic drug quinolines Drugs 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- PRAKJMSDJKAYCZ-UHFFFAOYSA-N dodecahydrosqualene Natural products CC(C)CCCC(C)CCCC(C)CCCCC(C)CCCC(C)CCCC(C)C PRAKJMSDJKAYCZ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 210000000497 foam cell Anatomy 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- DYFXGORUJGZJCA-UHFFFAOYSA-N phenylmethanediamine Chemical compound NC(N)C1=CC=CC=C1 DYFXGORUJGZJCA-UHFFFAOYSA-N 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000003248 quinolines Chemical class 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Molding Of Porous Articles (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
本発明は、芳香族ポリイミドからなるポリイミド発泡体の製造方法に関するものである。特に、製造工程における亀裂の発生を防ぐポリイミド発泡体の製造方法に関する。 The present invention relates to a method for producing a polyimide foam made of an aromatic polyimide. In particular, the present invention relates to a method for producing a polyimide foam that prevents the occurrence of cracks in the production process.
ポリイミド発泡体は、他の高分子発泡体に比べて耐熱性や機械的特性などに優れており、高温環境下での断熱材、遮音材、吸音材等に用いることが期待できることから、従来から種々の検討がなされている。 Polyimide foam is superior to other polymer foams in heat resistance, mechanical properties, etc., and can be expected to be used as a heat insulating material, sound insulating material, sound absorbing material, etc. in a high temperature environment. Various studies have been made.
例えば、特許文献1には、テトラカルボン酸成分として2,3,3’,4’−ビフェニルテトラカルボン酸ジエステルを用い、ジアミン成分としてパラフェニレンジアミンなどの芳香族ジアミンとジアミノシロキサンを併用したポリイミド発泡体の製造方法が記載されており、このポリイミド発泡体は、ガラス転移温度(Tg)が高く、しかも十分な発泡倍率を有することが記載されている。 For example, Patent Document 1 discloses a polyimide foam using a 2,3,3 ′, 4′-biphenyltetracarboxylic acid diester as a tetracarboxylic acid component, and an aromatic diamine such as paraphenylenediamine and diaminosiloxane as a diamine component. A manufacturing method of a body is described, and it is described that this polyimide foam has a high glass transition temperature (Tg) and a sufficient expansion ratio.
また、特許文献2には、テトラカルボン酸成分として3,3’,4,4’−ビフェニルテトラカルボン酸ジエステルを用いたポリイミド発泡体の製造方法が記載されており、得られるポリイミド発泡体は、変形しても容易に亀裂が発生しない可撓性や優れたクッション性などの機械的特性や、耐熱性に優れることが記載されている。 Patent Document 2 describes a method for producing a polyimide foam using 3,3 ′, 4,4′-biphenyltetracarboxylic acid diester as a tetracarboxylic acid component, and the resulting polyimide foam is: It describes that it is excellent in mechanical properties such as flexibility, excellent cushioning properties, and heat resistance, which do not easily crack even when deformed.
しかし、ポリイミド発泡体の製造においては、大型、例えば、一辺0.5m以上の立方体などの形状でセルが均一な製品を、亀裂等の欠陥を発生させることなく製造するのは容易ではなかった。そこで、本発明は、大型のポリイミド発泡体を、セルが均一な状態で亀裂を発生させることなく製造できる、改良されたポリイミド発泡体の製造方法を提供することを目的とする。 However, in the production of polyimide foam, it has not been easy to produce a large-sized product, for example, a cube having a side of 0.5 m or more and a uniform cell without causing defects such as cracks. Then, an object of this invention is to provide the manufacturing method of the improved polyimide foam which can manufacture a large sized polyimide foam in a state with a uniform cell, without generating a crack.
本発明は以下の項に関する。
1. 芳香族テトラカルボン酸ジエステル成分と芳香族ジアミン成分とからなるポリイミド前駆体粉末を加熱して発泡させる工程を含むポリイミド発泡体の製造方法であって、
ポリイミド前駆体粉末を型枠内に充填し、上面を擦り切る工程を含み、型枠内に充填されたポリイミド前駆体粉末に振動を与えて嵩密度を大きくする工程を含まないことを特徴とする、ポリイミド発泡体の製造方法。
2. 芳香族テトラカルボン酸ジエステル成分が、50〜70モル%の3,3’,4,4’−ビフェニルテトラカルボン酸ジエステルと、5〜15モル%の2,3,3’,4’−ビフェニルテトラカルボン酸ジエステルと、20〜40モル%の3,3’,4,4’−ベンゾフェノンテトラカルボン酸ジエステルとからなり、芳香族ジアミン成分が、70〜97モル%のm−フェニレンジアミンと、30〜3モル%の4,4’−メチレンジアニリンとからなる、前記項1に記載のポリイミド発泡体の製造方法。
The present invention relates to the following items.
1. A method for producing a polyimide foam comprising a step of heating and foaming a polyimide precursor powder comprising an aromatic tetracarboxylic acid diester component and an aromatic diamine component,
The method includes the step of filling the polyimide precursor powder into the mold and scraping the upper surface, and does not include the step of increasing the bulk density by applying vibration to the polyimide precursor powder filled in the mold. The manufacturing method of a polyimide foam.
2. The aromatic tetracarboxylic acid diester component is 50 to 70 mol% 3,3 ', 4,4'-biphenyltetracarboxylic acid diester and 5 to 15 mol% 2,3,3', 4'-biphenyltetra. It consists of carboxylic acid diester and 20 to 40 mol% of 3,3 ′, 4,4′-benzophenone tetracarboxylic acid diester, and the aromatic diamine component is 70 to 97 mol% of m-phenylenediamine and 30 to Item 2. The method for producing a polyimide foam according to Item 1, comprising 3 mol% of 4,4'-methylenedianiline.
本発明により、大型のポリイミド発泡体を、セルが均一な状態で亀裂を発生させることなく製造することが可能となり、製品を歩留りよく製造することができる。 According to the present invention, a large-sized polyimide foam can be produced without causing cracks in a uniform cell state, and a product can be produced with good yield.
ポリイミド発泡体は、芳香族テトラカルボン酸ジエステル成分と芳香族ジアミン成分とからなるポリイミド前駆体を含むポリイミド前駆体粉末を加熱して発泡、イミド化することによって製造することができる。本発明においては、原料となるポリイミド前駆体粉末
を型枠内に充填した後、棒や板などで上面を擦り切って平らにし、この状態から発泡させることを特徴とする。また、ポリイミド前駆体粉末に振動を与えて嵩密度を大きくする操作を行わないことを特徴とする。
The polyimide foam can be produced by heating and foaming and imidizing a polyimide precursor powder containing a polyimide precursor composed of an aromatic tetracarboxylic acid diester component and an aromatic diamine component. The present invention is characterized in that after the polyimide precursor powder as a raw material is filled in a mold, the upper surface is scraped and flattened with a bar or plate, and foamed from this state. In addition, the polyimide precursor powder is not subjected to an operation of increasing the bulk density by applying vibration.
本発明で用いるポリイミド前駆体を構成する芳香族テトラカルボン酸ジエステル成分は、好ましくは、芳香族テトラカルボン酸と低級アルコールからなる芳香族テトラカルボン酸ジエステルである。芳香族テトラカルボン酸ジエステルは、芳香族テトラカルボン酸二無水物を低級アルコールと200℃以下、好ましくは120℃以下の温度で0.1〜48時間好ましくは1〜24時間程度反応させてエステル化することで容易に得られる。この反応では、必要に応じてエステル化触媒を添加してもよい。 The aromatic tetracarboxylic acid diester component constituting the polyimide precursor used in the present invention is preferably an aromatic tetracarboxylic acid diester composed of an aromatic tetracarboxylic acid and a lower alcohol. Aromatic tetracarboxylic acid diester is esterified by reacting aromatic tetracarboxylic dianhydride with lower alcohol at a temperature of 200 ° C. or lower, preferably 120 ° C. or lower for 0.1 to 48 hours, preferably 1 to 24 hours. Can be easily obtained. In this reaction, an esterification catalyst may be added as necessary.
前記芳香族テトラカルボン酸ジエステル成分は、特に限定はなく、ポリイミド発泡体を形成できる芳香族テトラカルボン酸ジエステルであればよい。芳香族テトラカルボン酸ジエステルとしては、例えば、2,3,3’,4’−ビフェニルテトラカルボン酸、2,2’,3,3’−ビフェニルテトラカルボン酸、3,3’,4,4’−ビフェニルテトラカルボン酸などのビフェニルテトラカルボン酸、3,3’,4,4’−ベンゾフェノンテトラカルボン酸、4,4’−オキシジフタル酸、ピロメリット酸、3,3’,4,4’−ジフェニルスルホンテトラカルボン酸、2,2−ビス(3,4−ジカルボキシフェニル)メタンなどのジエステルを好適に挙げることができる。 The aromatic tetracarboxylic acid diester component is not particularly limited as long as it is an aromatic tetracarboxylic acid diester capable of forming a polyimide foam. Examples of the aromatic tetracarboxylic acid diester include 2,3,3 ′, 4′-biphenyltetracarboxylic acid, 2,2 ′, 3,3′-biphenyltetracarboxylic acid, and 3,3 ′, 4,4 ′. -Biphenyltetracarboxylic acid such as biphenyltetracarboxylic acid, 3,3 ', 4,4'-benzophenone tetracarboxylic acid, 4,4'-oxydiphthalic acid, pyromellitic acid, 3,3', 4,4'-diphenyl Preferable examples include diesters such as sulfonetetracarboxylic acid and 2,2-bis (3,4-dicarboxyphenyl) methane.
エステル化に用いる低級アルコールとしては、メタノール、エタノール、プロパノール、ブタノール、ペンタノールなどの炭素数が1〜6のアルキルアルコールが好適である。 As the lower alcohol used for esterification, alkyl alcohols having 1 to 6 carbon atoms such as methanol, ethanol, propanol, butanol, pentanol and the like are preferable.
本発明で用いるポリイミド前駆体を構成する芳香族ジアミン成分は、特に限定はなく、ポリイミド発泡体を形成できる芳香族ジアミンであればよい。芳香族ジアミンとしては、例えば1,4−ジアミノベンゼン、1,3−ジアミノベンゼン、1,2−ジアミノベンゼンなどのジアミノベンゼン、2,4−ジアミノトルエン、2,6−ジアミノトルエンなどのジアミノトルエン、2,6−ジエチル−1,3−ジアミノベンゼン、4,6−ジエチル−2−メチル−1,3−ジアミノベンゼン、3,5−ジエチルトルエン−2,6−ジアミン、4,4’−ジアミノジフェニルエーテル、3,4’−ジアミノジフェニルエーテル、3,3’−ジアミノジフェニルエーテル、3,3’−ジアミノベンゾフェノン、4,4’−ジアミノベンゾフェノン、3,3’−ジアミノジフェニルメタン、4,4’−ジアミノジフェニルメタン、4,4’−ジアミノジフェニルスルホン、ビス(2,6−ジエチル−4−アミノフェニル)メタン、4,4’−メチレン−ビス(2,6−ジエチルアニリン)、ビス(2−エチル−6−メチル−4−アミノフェニル)メタン、4,4’−メチレン−ビス(2−エチル−6−メチルアニリン)、2,2−ビス(3−アミノフェニル)プロパン、2,2−ビス(4−アミノフェニル)プロパン、1,3−ビス(4−アミノフェノキシ)ベンゼン、1,3−ビス(3−アミノフェノキシ)ベンゼン、1,4−ビス(4−アミノフェノキシ)ベンゼン、1,4−ビス(3−アミノフェノキシ)ベンゼン、ベンジジン、3,3’−ジメチルベンジジン、2,2−ビス(4−アミノフェノキシ)プロパン、2,2−ビス(3−アミノフェノキシ)プロパン、2,2−ビス[4’−(4’’−アミノフェノキシ)フェニル]ヘキサフルオロプロパン、9,9−ビス(4−アミノフェニル)フルオレン、ビス[4−(4−アミノフェノキシ)フェニル]スルホン、4,4’−ビス(4−アミノフェノキシ)ビフェニルなどを好適に挙げることができる。 The aromatic diamine component which comprises the polyimide precursor used by this invention does not have limitation in particular, What is necessary is just an aromatic diamine which can form a polyimide foam. Examples of the aromatic diamine include diaminobenzene such as 1,4-diaminobenzene, 1,3-diaminobenzene, and 1,2-diaminobenzene, diaminotoluene such as 2,4-diaminotoluene and 2,6-diaminotoluene, 2,6-diethyl-1,3-diaminobenzene, 4,6-diethyl-2-methyl-1,3-diaminobenzene, 3,5-diethyltoluene-2,6-diamine, 4,4′-diaminodiphenyl ether 3,4′-diaminodiphenyl ether, 3,3′-diaminodiphenyl ether, 3,3′-diaminobenzophenone, 4,4′-diaminobenzophenone, 3,3′-diaminodiphenylmethane, 4,4′-diaminodiphenylmethane, 4, , 4′-diaminodiphenylsulfone, bis (2,6-diethyl-4 Aminophenyl) methane, 4,4′-methylene-bis (2,6-diethylaniline), bis (2-ethyl-6-methyl-4-aminophenyl) methane, 4,4′-methylene-bis (2- Ethyl-6-methylaniline), 2,2-bis (3-aminophenyl) propane, 2,2-bis (4-aminophenyl) propane, 1,3-bis (4-aminophenoxy) benzene, 1,3 -Bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, benzidine, 3,3'-dimethylbenzidine, 2,2- Bis (4-aminophenoxy) propane, 2,2-bis (3-aminophenoxy) propane, 2,2-bis [4 ′-(4 ″ -aminophenoxy) phenyl] hex Preferred examples include fluoropropane, 9,9-bis (4-aminophenyl) fluorene, bis [4- (4-aminophenoxy) phenyl] sulfone, 4,4′-bis (4-aminophenoxy) biphenyl, and the like. it can.
本発明においては、特に芳香族テトラカルボン酸ジエステル成分が、2,3,3’,4’−ビフェニルテトラカルボン酸、2,2’,3,3’−ビフェニルテトラカルボン酸、3,3’,4,4’−ビフェニルテトラカルボン酸などのビフェニルテトラカルボン酸のジエステル、3,3’,4,4’−ベンゾフェノンテトラカルボン酸ジエステル、4,4’−オキシジフタル酸ジエステル、ピロメリット酸ジエステルから選ばれる化合物であることが好ましい。また、芳香族ジアミン成分が、p−フェニレンジアミン、m−フェニレンジアミン、2,4−ジアミノトルエン、2,5−ジアミノトルエン、m−トリジン、4,4’−ジアミノジフェニルメタン、4,4’−メチレンジアニリンから選ばれる化合物であることが好ましい。 In the present invention, in particular, the aromatic tetracarboxylic acid diester component is 2,3,3 ′, 4′-biphenyltetracarboxylic acid, 2,2 ′, 3,3′-biphenyltetracarboxylic acid, 3,3 ′, It is selected from diesters of biphenyltetracarboxylic acid such as 4,4′-biphenyltetracarboxylic acid, 3,3 ′, 4,4′-benzophenone tetracarboxylic acid diester, 4,4′-oxydiphthalic acid diester, and pyromellitic acid diester A compound is preferred. In addition, the aromatic diamine component is p-phenylenediamine, m-phenylenediamine, 2,4-diaminotoluene, 2,5-diaminotoluene, m-tolidine, 4,4′-diaminodiphenylmethane, 4,4′-methylene. A compound selected from dianiline is preferred.
特に、芳香族テトラカルボン酸ジエステル成分が、50〜70モル%の3,3’,4,4’−ビフェニルテトラカルボン酸ジエステルと、5〜15モル%の2,3,3’,4’−ビフェニルテトラカルボン酸ジエステルと、20〜40モル%の3,3’,4,4’−ベンゾフェノンテトラカルボン酸ジエステルとからなり、芳香族ジアミン成分が、70〜97モル%のm−フェニレンジアミンと、30〜3モル%の4,4’−メチレンジアニリンとからなることが、得られるポリイミド発泡体の機械的特性や耐熱性の点から好適である。 In particular, the aromatic tetracarboxylic acid diester component is 50 to 70 mol% 3,3 ′, 4,4′-biphenyltetracarboxylic acid diester and 5 to 15 mol% 2,3,3 ′, 4′-. Biphenyltetracarboxylic acid diester and 20 to 40 mol% 3,3 ', 4,4'-benzophenone tetracarboxylic acid diester, wherein the aromatic diamine component is 70 to 97 mol% m-phenylenediamine; It is preferable from 30 to 3 mol% of 4,4′-methylenedianiline from the viewpoint of mechanical properties and heat resistance of the resulting polyimide foam.
本発明で用いるポリイミド前駆体粉末には、芳香族テトラカルボン酸エステル成分と芳香族アミン成分以外に、必要に応じて界面活性剤(整泡剤)、触媒、難燃剤などの添加剤を好適に加えることができる。界面活性剤(整泡剤)としては、ポリウレタンフォームの整泡剤として好適に使用される界面活性剤を好適に使用することができる。中でも、ポリジメチルシロキサンのメチル基の一部がポリエチレンオキサイド基、ポリ(エチレン−プロピレン)オキサイド基またはプロピレンオキサイド基等のポリアルキレンオキサイド基で置換されたグラフト共重合体(置換したポリアルキレンオキサイド基の末端は水酸基又はメチルエーテル等のアルキルエーテル基やアセチル基等のアルキルエステル基である)などのポリエーテル変性シリコーンオイルが特に好適である。 In addition to the aromatic tetracarboxylic acid ester component and the aromatic amine component, additives such as a surfactant (foam stabilizer), a catalyst, and a flame retardant are suitably used for the polyimide precursor powder used in the present invention. Can be added. As the surfactant (foam stabilizer), a surfactant suitably used as a foam stabilizer for polyurethane foam can be preferably used. Among them, a graft copolymer in which a part of the methyl group of polydimethylsiloxane is substituted with a polyalkylene oxide group such as a polyethylene oxide group, a poly (ethylene-propylene) oxide group or a propylene oxide group (of a substituted polyalkylene oxide group). A polyether-modified silicone oil such as a hydroxyl group or an alkyl ether group such as methyl ether or an alkyl ester group such as acetyl group is particularly suitable.
ポリエーテル変性シリコーンオイルの具体例としては、SH−193、SH−192、SH−194、SH−190、SF−2937、SF−2908、SF−2904、SF−2964、SRX−298、SRX−2908、SRX−274C、SRX−295、SRX−294A、SRX−280A(以上、東レ・ダウコーニングシリコーン社製)、L−5340、SZ−1666、SZ−1668(以上、日本ユニカー社製)、TFA4205(GE東芝シリコーン社製)、X−20−5148、X−20−8046、X−20−8047、X−20−8048、X−20−8049、F−518、F−348、F−395、F−506、F−317M、KF−351A、KF−353A、KF−354L、KP−101(以上、信越化学社製)、L6100J、L6100、L6884、L6887、L6900、L6970、L5420(以上、モメンティブ・パフォーマンス・マテリアルズ社製)などの市販品が挙げられる。 Specific examples of the polyether-modified silicone oil include SH-193, SH-192, SH-194, SH-190, SF-2937, SF-2908, SF-2904, SF-2964, SRX-298, SRX-2908. , SRX-274C, SRX-295, SRX-294A, SRX-280A (above, manufactured by Toray Dow Corning Silicone), L-5340, SZ-1666, SZ-1668 (above, manufactured by Nihon Unicar), TFA4205 ( GE Toshiba Silicone)), X-20-5148, X-20-8046, X-20-8047, X-20-8048, X-20-8049, F-518, F-348, F-395, F -506, F-317M, KF-351A, KF-353A, KF-354L, KP-101 (Shin-Etsu Made Gakusha), L6100J, L6100, L6884, L6887, L6900, L6970, L5420 (manufactured by Momentive Performance Materials, Inc.), and is commercially available, such as.
また、触媒は、イミド化を促進するためのものであって、1,2−ジメチルイミダゾール、2−エチル−4−メチルイミダゾール、ベンズイミダゾールなどのイミダゾール類、イソキノリンなどのキノリン類、ピリジンなどのピリジン類、1,8−ジアザ−ビシクロ(5,4,0)ウンデセン−7のようなアミン類などが好適である。 Further, the catalyst is for accelerating imidization, and includes imidazoles such as 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole and benzimidazole, quinolines such as isoquinoline, and pyridine such as pyridine. And amines such as 1,8-diaza-bicyclo (5,4,0) undecene-7 are preferred.
本発明で用いるポリイミド前駆体粉末は、ポリイミド前駆体を主として含む原料を均一に、いわゆる分子分散させたポリイミド前駆体溶液から溶媒を蒸発させて乾固させ、得られた乾固物(固形物)を粉砕するか、或いはスプレードライヤーなどを用いて溶媒の蒸発と粉末化を同時に行う方法によって製造できる。溶媒の蒸発に際しては発泡が生じない低い温度範囲内で加熱処理するのが好ましく、好ましくは100℃以下、より好ましくは70℃以下である。ここでは、原料が粉末化できればよく、溶媒が0.1〜15質量%程度残存することが好ましい。通常は、例えば低沸点溶媒であるメタノールを用いた場合でも、0.1〜10質量%より好ましくは0.5〜5質量%の(遊離の)メタノールが残存している。前記温度よりも高温で蒸発を行って得られたポリイミド前駆体粉末は発泡性が著しく低下する。なお、溶媒の蒸発や粉末の乾燥は常圧下でも、加圧下でも、或いは減圧下でも構わない。 The polyimide precursor powder used in the present invention is a solid product obtained by evaporating a solvent from a polyimide precursor solution in which a raw material mainly containing a polyimide precursor is uniformly dispersed in a so-called molecule and evaporating the solvent. Or by evaporating the solvent and pulverizing at the same time using a spray dryer or the like. When evaporating the solvent, it is preferable to perform heat treatment within a low temperature range in which foaming does not occur, preferably 100 ° C. or less, more preferably 70 ° C. or less. Here, it is sufficient that the raw material can be powdered, and it is preferable that the solvent remains about 0.1 to 15% by mass. Usually, even when methanol which is a low-boiling solvent is used, for example, 0.1 to 10% by mass, more preferably 0.5 to 5% by mass (free) methanol remains. The polyimide precursor powder obtained by performing the evaporation at a temperature higher than the above temperature has a marked decrease in foamability. Note that evaporation of the solvent and drying of the powder may be performed under normal pressure, under pressure, or under reduced pressure.
前記ポリイミド前駆体溶液は、溶媒中に、少なくとも芳香族テトラカルボン酸ジエステル成分と芳香族アミン成分、必要に応じて界面活性剤(整泡剤)、触媒、難燃剤などの添加剤からなるポリイミド前駆体の各成分を加えて、好ましくは60℃以下(通常室温、例えば24℃)で、好ましくは0.1〜6時間(通常1〜2時間)程度混合・撹拌して、均一に溶解することによって製造できる。
特に、まず低級アルコール中に芳香族テトラカルボン酸二無水物と必要に応じてエステル化触媒とを加えて反応することによって芳香族テトラカルボン酸エステル成分の低級アルコール溶液を調製し、その反応溶液に芳香族アミン成分などの他の成分を加えて、均一に溶解して混合する方法が好適である。
ここで、芳香族テトラカルボン酸エステル成分と芳香族アミン成分とが略等当量数、具体的には当量数の比(芳香族テトラカルボン酸成分/芳香族ジアミン成分)が0.95〜1.05の範囲、芳香族テトラカルボン酸エステル成分と芳香族ジアミン成分の場合には、略等モル、具体的にはモル比(芳香族テトラカルボン酸成分/芳香族ジアミン成分)が0.95〜1.05の範囲で用いることが好適である。
The polyimide precursor solution is a polyimide precursor comprising, in a solvent, at least an aromatic tetracarboxylic acid diester component and an aromatic amine component, and optionally additives such as a surfactant (foam stabilizer), a catalyst, and a flame retardant. Add each component of the body, preferably at 60 ° C. or lower (usually room temperature, for example, 24 ° C.), preferably 0.1 to 6 hours (usually 1 to 2 hours) for mixing and stirring to dissolve uniformly. Can be manufactured.
In particular, first, a lower alcohol solution of an aromatic tetracarboxylic acid ester component is prepared by adding an aromatic tetracarboxylic dianhydride and, if necessary, an esterification catalyst to the lower alcohol and reacting, and the reaction solution is used as the reaction solution. A method in which other components such as an aromatic amine component are added and uniformly dissolved and mixed is suitable.
Here, the aromatic tetracarboxylic acid ester component and the aromatic amine component have approximately the same number of equivalents, specifically, the ratio of the number of equivalents (aromatic tetracarboxylic acid component / aromatic diamine component) is 0.95 to 1. In the range of 05, in the case of an aromatic tetracarboxylic acid ester component and an aromatic diamine component, substantially equimolar, specifically, a molar ratio (aromatic tetracarboxylic acid component / aromatic diamine component) is 0.95-1. It is preferable to use within the range of .05.
ポリイミド前駆体溶液の調製に用いる溶媒は、芳香族テトラカルボン酸ジエステル成分、芳香族アミン成分、およびその他の成分を溶解できるものであれば特に限定されない。アルコール、エーテル、ケトン、或いは他の有機溶媒を好適に用いることができるが、粉末化してポリイミド前駆体を得る場合には、低沸点溶媒が好適に採用される。
なお、ポリイミド前駆体に必要に応じて加えられる界面活性剤、触媒、難燃剤などの添加剤は、芳香族テトラカルボン酸エステル成分の溶液に、芳香族ジアミンを加えて均一な溶液にする際には、芳香族ジアミンに先立って加えることが好適であるが、芳香族ジアミンの後で加えても構わない。
The solvent used for preparing the polyimide precursor solution is not particularly limited as long as it can dissolve the aromatic tetracarboxylic acid diester component, the aromatic amine component, and other components. Alcohols, ethers, ketones, or other organic solvents can be suitably used. However, when powdered to obtain a polyimide precursor, a low boiling point solvent is preferably employed.
Additives such as surfactants, catalysts, and flame retardants that are added to the polyimide precursor as needed are added to the solution of the aromatic tetracarboxylic acid ester component when the aromatic diamine is added to make a uniform solution. Is preferably added prior to the aromatic diamine, but may be added after the aromatic diamine.
発泡工程では上述のようにして得られるポリイミド前駆体粉末を加熱して発泡させる。本発明の製造方法においては、ポリイミド前駆体粉末を加熱する前に、ポリイミド前駆体粉末を型枠内に充填し、上面を擦り切る工程を含む。すなわち、型枠内に過剰な量のポリイミド前駆体粉末を入れ、型枠の縁より上部にあるポリイミド前駆体粉末を棒や板などで擦り切って平らにし、この状態から発泡させる。なお、型枠の形状や大きさは特に制限されない。 In the foaming step, the polyimide precursor powder obtained as described above is heated and foamed. The production method of the present invention includes a step of filling the polyimide precursor powder in a mold and scuffing the upper surface before heating the polyimide precursor powder. That is, an excessive amount of the polyimide precursor powder is put into the mold, and the polyimide precursor powder located above the edge of the mold is flattened by scraping with a stick or a plate, and foamed from this state. The shape and size of the mold are not particularly limited.
また、本発明の製造方法においては、型枠内に充填されたポリイミド前駆体粉末に振動を与えて嵩密度を大きくする工程は含まない。上述の摺り切り工程においてもポリイミド前駆体粉末を圧縮せずに擦り切ることが好ましい。 Moreover, in the manufacturing method of this invention, the process which gives a vibration to the polyimide precursor powder with which the mold was filled and enlarges a bulk density is not included. Also in the above-mentioned scraping process, it is preferable to scrape the polyimide precursor powder without compressing it.
発泡工程における加熱処理は、発泡させるための加熱を行うことができれば限定されるものではないが、例えばオーブン或いはマイクロ波装置などの加熱装置を用いて好適に行うことができる。この時の加熱処理条件(加熱温度や時間など)は、ポリイミド前駆体の種類や処理量に対応して適宜選択することができる。 The heat treatment in the foaming step is not limited as long as heating for foaming can be performed, but for example, it can be suitably performed using a heating device such as an oven or a microwave device. The heat treatment conditions (heating temperature, time, etc.) at this time can be appropriately selected in accordance with the type of polyimide precursor and the amount of treatment.
オーブンで加熱する場合は、発泡のために、好ましくは80〜200℃、より好ましくは100〜180℃、特に好ましくは130〜150℃の温度範囲で加熱処理することが必要であり、また加熱処理時間は、好ましくは5〜60分間、より好ましくは10〜30分間程度である。前記の加熱温度よりも温度が低くなると発泡させるために長時間が必要となるので好ましくない。また前記の加熱温度よりも温度が高くなると得られるポリイミド発泡体の発泡体セルを均一にするのが難しくなるので好適ではない。 When heating in an oven, it is necessary to heat-treat in the temperature range of preferably 80 to 200 ° C, more preferably 100 to 180 ° C, and particularly preferably 130 to 150 ° C for foaming. The time is preferably about 5 to 60 minutes, more preferably about 10 to 30 minutes. If the temperature is lower than the heating temperature, a long time is required for foaming, which is not preferable. Moreover, since it becomes difficult to make the foam cell of the polyimide foam obtained uniform when temperature becomes higher than the said heating temperature, it is not suitable.
マイクロ波で加熱する場合は、通常は電波法に基づいて2.45GHzの周波数で行う。ポリイミド前駆体粉末の処理量を増すとより大きな出力が必要になる。例えば、ポリイミド前駆体の粉末数十グラム〜数千グラムに対して1〜25kwの出力が好適に採用される。マイクロ波を照射すると、通常は1〜2分間程度で発泡が開始し、照射時間が5〜20分間で発泡は収束する。 When heating with microwaves, it is usually performed at a frequency of 2.45 GHz based on the Radio Law. Increasing the throughput of the polyimide precursor powder requires a greater output. For example, an output of 1 to 25 kw is suitably employed for several tens to thousands of grams of polyimide precursor powder. When the microwave is irradiated, foaming usually starts in about 1 to 2 minutes, and the foaming converges in 5 to 20 minutes.
オーブン加熱或いはマイクロ波照射のいずれの場合も、発泡が終了した段階では、得られたポリイミド発泡体は十分な機械的強度を有していない。従って、得られたポリイミド発泡体を例えばオーブンなどの加熱装置によって、さらに後加熱することが好適である。 In either case of oven heating or microwave irradiation, the obtained polyimide foam does not have sufficient mechanical strength when foaming is completed. Therefore, it is preferable that the obtained polyimide foam is further post-heated by a heating device such as an oven.
後加熱は、得られたポリイミド発泡体の大きさに依存するが、200℃以上でポリイミド発泡体のガラス転移温度+10℃以下の温度範囲、通常は200〜500℃、好ましくは200〜400℃の温度範囲で、5分〜24時間好ましくは1〜15時間加熱することによって好適に行うことができる。後加熱は、例えば200℃程度の比較的低温から10℃/分の昇温速度で徐々に昇温し、350℃程度の高温で最終的に加熱するような所定の温度プロファイルにしたがって加熱温度を変える方法であっても構わない。 The post-heating depends on the size of the obtained polyimide foam, but is a temperature range of 200 ° C. or higher and a glass transition temperature of the polyimide foam + 10 ° C. or lower, usually 200 to 500 ° C., preferably 200 to 400 ° C. It can be suitably carried out by heating in the temperature range for 5 minutes to 24 hours, preferably 1 to 15 hours. The post-heating is carried out according to a predetermined temperature profile in which, for example, the temperature is gradually raised from a relatively low temperature of about 200 ° C. at a rate of 10 ° C./min, and finally heated at a high temperature of about 350 ° C. You may change the method.
なお、発泡倍率や見掛け密度(密度)は、発泡時の揮発成分(重合イミド化の際に発生するアルコールや水、更に溶媒やその他の揮発性の添加物など)の量や、加熱処理の方法や、加熱時の温度プロファイルなどの諸条件によって適宜制御することができる。 The expansion ratio and the apparent density (density) are the amount of volatile components at the time of foaming (alcohol and water generated during polymerization imidization, further solvent and other volatile additives, etc.), and the heat treatment method. In addition, it can be appropriately controlled according to various conditions such as a temperature profile during heating.
本発明に係るポリイミド発泡体の製造方法によれば、簡単な操作や簡便な工程によって、大型のポリイミド発泡体を、細かで均一なセルの状態で、亀裂を発生させることなく容易に且つ再現性よく(歩留まりよく)製造することが可能となる。 According to the method for producing a polyimide foam according to the present invention, a large-sized polyimide foam can be easily and reproducibly produced in a thin and uniform cell state without cracks by simple operations and simple steps. It is possible to manufacture well (with good yield).
次に、実施例によって本発明を更に詳しく説明する。なお、本発明は以下の実施例に限定されるものではない。
以下の例において各略号は次の化合物を意味する。
s−BPDA:3,3’,4,4’−ビフェニルテトラカルボン酸二無水物
BTDA:3,3’,4,4’−ベンゾフェノンテトラカルボン酸二無水物
a−BPDA:2,3,3’,4’−ビフェニルテトラカルボン酸二無水物
MPD:m−フェニレンジアミン
MDA:4,4’−メチレンジアニリン
1,2−DMz:1,2−ジメチルイミダゾール
Next, the present invention will be described in more detail with reference to examples. In addition, this invention is not limited to a following example.
In the following examples, each abbreviation means the following compound.
s-BPDA: 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride BTDA: 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride a-BPDA: 2,3,3 ′ , 4′-biphenyltetracarboxylic dianhydride MPD: m-phenylenediamine MDA: 4,4′-methylenedianiline 1,2-DMz: 1,2-dimethylimidazole
各特性の評価方法は次のとおりである。
<厚み分布>
1.2m×1.2mの型枠内に充填したポリイミド前駆体粉末について、縦横等間隔の7×7点(49点)を指定し、金尺により粉の厚みを計測し、49点の測定値の平均値を平均厚みとした。また、これらの測定値について標準偏差(δ)を求めた。
<嵩密度と嵩密度分布>
厚み計測した49箇所に、一定面積の筒を挿してポリイミド前駆体粉末を採取し、重量を測定した。
次の計算式により、嵩密度を算出した。
嵩密度(g/cc)=重量(g)/回収面積(cm2)×厚み(cm)
また、これらの測定値について標準偏差(δ)を求めた。
<ボイド数>
4000万画素以上を有したデジタルカメラで、1.05m×1.15mのポリイミド発泡体の切断面と寸法が分かるスケールが写るように撮影した。
画像処理ソフトImageJを使用し、0.79mm2〜314mm2の面積を有するセルをボイドとして認識し、単位面積(m2)当たりのボイド個数で示した。
The evaluation method of each characteristic is as follows.
<Thickness distribution>
For polyimide precursor powder filled in a 1.2 m x 1.2 m mold, specify 7 x 7 points (49 points) at equal intervals in the vertical and horizontal directions, measure the thickness of the powder with a metal ruler, and measure 49 points. The average value was defined as the average thickness. Further, a standard deviation (δ) was obtained for these measured values.
<Bulk density and bulk density distribution>
A cylinder with a certain area was inserted into 49 places where the thickness was measured, and polyimide precursor powder was collected and weighed.
The bulk density was calculated by the following formula.
Bulk density (g / cc) = weight (g) / recovered area (cm 2 ) × thickness (cm)
Further, a standard deviation (δ) was obtained for these measured values.
<Number of voids>
The image was taken with a digital camera having 40 million pixels or more so that a scale showing a cut surface and dimensions of a 1.05 m × 1.15 m polyimide foam was captured.
Using an image processing software ImageJ, recognizes a cell having an area of 0.79mm 2 ~314mm 2 as a void, indicated in the void number per unit area (m 2).
(参考例)
3m3のSUS反応器にメタノールを954kg、s−BPDAを282kg(960mol)、a−BPDAを47kg(160mol)、BTDAを155kg(480mol)、1,2−DMzを7kgそれぞれ仕込んだ後、昇温し、還流させながら、2時間加熱攪拌を行い、s−BPDA、a−BPDA、BTDAをそれぞれエステル化し、均一な溶液とした。
(Reference example)
A 3 m 3 SUS reactor was charged with 954 kg of methanol, 282 kg (960 mol) of s-BPDA, 47 kg (160 mol) of a-BPDA, 155 kg (480 mol) of BTDA, and 7 kg of 1,2-DMz, and then heated. The mixture was heated and stirred for 2 hours while refluxing to esterify s-BPDA, a-BPDA, and BTDA, respectively, to obtain uniform solutions.
得られた溶液を室温まで冷却した後、芳香族ジアミン成分のMPDを156kg(1,440mol)、MDAを32kg(160mol)、シリコーン系界面活性剤のL6100J(モメンティブ・パフォーマンス・マテリアルズ社製)を16kg加えて攪拌し、沈殿物を生じることなく均一な溶液を得た。 After cooling the resulting solution to room temperature, MPD of aromatic diamine component was 156 kg (1,440 mol), MDA was 32 kg (160 mol), and silicone surfactant L6100J (made by Momentive Performance Materials) was used. 16 kg was added and stirred to obtain a uniform solution without causing precipitation.
この溶液をスプレードライヤー内に噴霧し、乾燥エアー温度65℃で溶媒のメタノールを除去しながら乾燥し、ポリイミド前駆体粉末を得た。得られた粉末の平均粒径は47μm、嵩密度は0.35g/ccであった。以下の実施例ではこのポリイミド前駆体粉末を用いた。 This solution was sprayed into a spray dryer and dried while removing methanol as a solvent at a dry air temperature of 65 ° C. to obtain a polyimide precursor powder. The average particle size of the obtained powder was 47 μm, and the bulk density was 0.35 g / cc. In the following examples, this polyimide precursor powder was used.
(実施例1)
ポリイミド前駆体粉末17.0kgを底面の大きさが1.2×1.2mで高さ0.025mの型枠内に投入した後、角棒を型枠の上面に沿って移動させることにより、ポリイミド前駆体粉末の上面を擦り切って平らにした。型枠内に残ったポリイミド前駆体粉末は15.6kgで、平均厚み27.2mm、標準偏差(σ)1.3であった。また、平均嵩密度は0.412g/ccであった。これをマイクロ波オーブン(富士電波工機製)のターンテーブル上に置き、3rpmの回転速度でターンテーブルを回転させながら、15kW×17分間と32kW×15分間、マイクロ波を照射して発泡させた。これを200℃に昇温した熱風オ−ブン(ノリタケ社製)に投入し、最高温度330℃まで段階的に加温して後加熱処理を行った。得られたポリイミド発泡体は、最大高さが1.15mであり、セルは均一で亀裂も認められなかった。ポリイミド発泡体の密度は7.5kg/m3であった。
Example 1
After placing 17.0 kg of polyimide precursor powder into a mold having a bottom size of 1.2 × 1.2 m and a height of 0.025 m, the square bar is moved along the upper surface of the mold, The upper surface of the polyimide precursor powder was scraped and flattened. The polyimide precursor powder remaining in the mold was 15.6 kg, the average thickness was 27.2 mm, and the standard deviation (σ) was 1.3. The average bulk density was 0.412 g / cc. This was placed on a turntable of a microwave oven (manufactured by Fuji Electric Koki Co., Ltd.) and foamed by microwave irradiation for 15 kW × 17 minutes and 32 kW × 15 minutes while rotating the turntable at a rotation speed of 3 rpm. This was put into a hot air oven (manufactured by Noritake Co., Ltd.) that had been heated to 200 ° C., and was heated stepwise to a maximum temperature of 330 ° C., followed by post-heating treatment. The obtained polyimide foam had a maximum height of 1.15 m, the cells were uniform and no cracks were observed. The density of the polyimide foam was 7.5 kg / m 3 .
(比較例1)
ポリイミド前駆体粉末20.0kgを底面の大きさが1.2m×1.2mで高さ0.030mの型枠内に投入した後、均一になるように平板で均し、平坦な板を上にのせて、振動テーブル(エクセン社製)の上で5分間振動させた。その後、角棒を型枠の上面に沿って移動させることにより、ポリイミド前駆体粉末の上面を擦り切って平らにした。型枠内に残ったポリイミド前駆体粉末は17.1kgで、平均厚み27.8mm、標準偏差(σ)1.2で、平均嵩密度は0.474g/ccあった。これを実施例1と同様の条件にて発泡させ、ポリイミド発泡体を得た。得られたポリイミド発泡体は、最大高さが1.2mであり、セルは不均一で大きな亀裂が認められた。ポリイミド発泡体の密度は7.5kg/m3であった。
(Comparative Example 1)
After 20.0 kg of the polyimide precursor powder was put into a mold having a bottom size of 1.2 m × 1.2 m and a height of 0.030 m, it was leveled with a flat plate so as to be uniform. Then, it was vibrated for 5 minutes on a vibration table (Exsen). Then, the upper surface of the polyimide precursor powder was scraped and flattened by moving the square bar along the upper surface of the mold. The polyimide precursor powder remaining in the mold was 17.1 kg, the average thickness was 27.8 mm, the standard deviation (σ) was 1.2, and the average bulk density was 0.474 g / cc. This was foamed under the same conditions as in Example 1 to obtain a polyimide foam. The obtained polyimide foam had a maximum height of 1.2 m, and the cells were uneven and large cracks were observed. The density of the polyimide foam was 7.5 kg / m 3 .
(比較例2)
ポリイミド前駆体粉末15.0kgを底面の大きさが1.2m×1.2mで高さ0.030mの型枠内に投入し、平板で粉表面を均した。ポリイミド前駆体粉末の平均厚みは25.8mm、標準偏差(σ)4.6で、平均嵩密度は0.405g/ccあった。これを実施例1と同様の条件にて発泡させ、ポリイミド発泡体を得た。得られたポリイミド発泡体は、最大高さが1.1mであり、セルは不均一で大きな亀裂が認められた。ポリイミド発泡体の密度は6.8kg/m3であった。
(Comparative Example 2)
15.0 kg of polyimide precursor powder was put into a mold having a bottom size of 1.2 m × 1.2 m and a height of 0.030 m, and the powder surface was leveled with a flat plate. The average thickness of the polyimide precursor powder was 25.8 mm, the standard deviation (σ) was 4.6, and the average bulk density was 0.405 g / cc. This was foamed under the same conditions as in Example 1 to obtain a polyimide foam. The obtained polyimide foam had a maximum height of 1.1 m, and the cells were uneven and large cracks were observed. The density of the polyimide foam was 6.8 kg / m 3 .
(比較例3)
ポリイミド前駆体粉末15.0kgを底面の大きさが1.2m×1.2mで高さ0.025mの型枠内に投入し、均一になるように平板で均し、平坦な板を上にのせて、振動テーブル(エクセン社製)の上で5分間振動させた。ポリイミド前駆体粉末の平均厚みは22.2mm、標準偏差(σ)3.0で、平均嵩密度は0.496g/ccあった。これを、実施例1と同様の条件にて発泡させ、ポリイミド発泡体を得た。得られたポリイミド発泡体は、最大高さが1.1mであり、セルは不均一で大きな亀裂が認められた。ポリイミド発泡体の密度は7.2kg/m3であった。
(Comparative Example 3)
15.0 kg of the polyimide precursor powder is put into a mold having a bottom size of 1.2 m × 1.2 m and a height of 0.025 m, leveled with a flat plate so as to be uniform, and a flat plate is placed on top. Then, it was vibrated for 5 minutes on a vibration table (Exsen). The average thickness of the polyimide precursor powder was 22.2 mm, the standard deviation (σ) was 3.0, and the average bulk density was 0.496 g / cc. This was foamed under the same conditions as in Example 1 to obtain a polyimide foam. The obtained polyimide foam had a maximum height of 1.1 m, and the cells were uneven and large cracks were observed. The density of the polyimide foam was 7.2 kg / m 3 .
Claims (2)
ポリイミド前駆体粉末を型枠内に充填し、上面を擦り切る工程を含み、型枠内に充填されたポリイミド前駆体粉末に振動を与えて嵩密度を大きくする工程を含まないことを特徴とする、ポリイミド発泡体の製造方法。 A method for producing a polyimide foam comprising a step of heating and foaming a polyimide precursor powder comprising an aromatic tetracarboxylic acid diester component and an aromatic diamine component,
The method includes the step of filling the polyimide precursor powder into the mold and scraping the upper surface, and does not include the step of increasing the bulk density by applying vibration to the polyimide precursor powder filled in the mold. The manufacturing method of a polyimide foam.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016023456A JP6645232B2 (en) | 2016-02-10 | 2016-02-10 | Method for producing polyimide foam |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016023456A JP6645232B2 (en) | 2016-02-10 | 2016-02-10 | Method for producing polyimide foam |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017141355A true JP2017141355A (en) | 2017-08-17 |
JP6645232B2 JP6645232B2 (en) | 2020-02-14 |
Family
ID=59627197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016023456A Expired - Fee Related JP6645232B2 (en) | 2016-02-10 | 2016-02-10 | Method for producing polyimide foam |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6645232B2 (en) |
-
2016
- 2016-02-10 JP JP2016023456A patent/JP6645232B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP6645232B2 (en) | 2020-02-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107540839B (en) | Light sound-absorbing heat-insulating polyimide foam material and preparation method thereof | |
EP1167427B1 (en) | Aromatic polyimide foam | |
Lv et al. | Flexible polydimethylsiloxane-based porous polyimide films with an ultralow dielectric constant and remarkable water resistance | |
CN102838745B (en) | Preparation method of polyimide foam | |
WO2015180063A1 (en) | Method for continuously preparing solvent-free open-cell and closed-cell polyimide foam | |
CN109593199B (en) | Soft polyimide foam, preparation method and application thereof | |
KR101739842B1 (en) | Micro-pored polyimide sponge and method for preparation of the same | |
CN101735457B (en) | Production method of soft polyimide foam | |
JP5446756B2 (en) | Polyimide foam and method for producing the same | |
CN114729137B (en) | Polyimide film with high elasticity and high heat resistance and manufacturing method thereof | |
JP5056353B2 (en) | Novel polyimide foam and method for producing the same | |
JP6645232B2 (en) | Method for producing polyimide foam | |
JP2007063380A (en) | Method for producing polyimide precursor powder for expansion molding use | |
JP2016180077A (en) | Method for producing polyimide foam | |
EP2166033A1 (en) | Method for production of polyimide foam, and polyimide foam | |
JP2010006628A (en) | Carbon porous body and method for producing the same | |
JP4096798B2 (en) | Foamed polyimide molding and its production method | |
JP5373307B2 (en) | Method for producing lightweight polyimide molded body | |
JP5470685B2 (en) | Polyimide foam comprising 3,3 ', 4,4'-biphenyltetracarboxylic acid component and method for producing the same | |
CN114395158A (en) | Preparation method of low-density, high-temperature-resistant and high-uniformity closed-cell rigid polyimide foam material | |
JP5652471B2 (en) | Melt molded product of polyimide precursor and method for producing polyimide foam using the same | |
CN104017215B (en) | A kind of polyimide resin and preparation method thereof and a kind of polyimide foam | |
CN113166454B (en) | Polyimide film with improved thermal conductivity and method for preparing same | |
JP2004515897A (en) | High density polyimide foam insulator | |
TW202140624A (en) | Aromatic polyimide powder for molded body, molded body using same, method for improving mechanical strength of molded body |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181220 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190821 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190827 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191210 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20191223 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6645232 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |