JP2017116317A - Sensor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce partial losses and faults in a sensor structure unit and a signal processing integrated circuit without being directly subjected to an external force from a side face as seen from a contact sensing side.SOLUTION: A sensor device of the present invention comprises: a sensor structure unit having, on one face exposed to the outside, a contact sensing face that is directly in contact with a detection object, and outputting a sensor signal in response to a change of the contact sensing face; a substrate having one face of which is formed a first concave-shaped part and having the other face of which, opposite the one face, is formed a second concave-shaped part; and a signal processing integrated circuit for processing a sensor signal outputted by the sensor structure unit. The sensor structure unit is disposed inside the first concave-shaped part of the substrate. The signal processing integrated circuit is disposed in the second concave-shaped part of the substrate.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a sensor device that detects force.

  A sensor device comprising a sensor structure that outputs an analog sensor signal in response to a displacement of a contact sensing surface and a substrate having an integrated circuit for signal processing that processes an analog sensor signal output from the sensor structure is known. (See Patent Document 1).

Japanese Patent No. 5328924

  In the sensor device, the sensor structure and the signal processing integrated circuit may receive an external force directly from the side as viewed from the contact sensing surface. In the sensor device that detects force, a force equivalent to the force received by the contact sensing surface may be applied to the signal processing circuit. For this reason, there is a possibility that the sensor structure and the signal processing integrated circuit may be lost or broken.

  The present invention has been made to solve such a problem, and the defect and failure of the sensor structure part and the signal processing integrated circuit without receiving external force directly from the side face part when viewed from the contact sensing surface. This can prevent the signal processing circuit from being applied with the same force as the contact sensing surface and prevent the signal processing integrated circuit from being lost. While achieving these, the footprint is small and the influence of noise, etc. is small. The main object is to provide a force sensor device.

In order to achieve the above object, one embodiment of the present invention provides:
A sensor structure part that has a contact sensing surface that directly contacts a detection object on one surface exposed to the outside and outputs a sensor signal in response to a change in the contact sensing surface;
A substrate in which a first concave portion is formed on one surface and a second concave portion is formed on a surface opposite to the one surface;
A signal processing integrated circuit for processing a sensor signal output from the sensor structure;
With
The sensor structure is disposed in a first concave portion of the substrate;
The signal processing integrated circuit is disposed in a second concave portion of the substrate.
This is a sensor device.
According to this aspect, the sensor structure is disposed in the first concave portion of the substrate, and the signal processing integrated circuit is disposed in the second concave portion of the substrate. Therefore, the side of the sensor structure is protected by the first concave portion of the substrate, and does not receive external force directly from the side as viewed from the contact sensing surface. Further, the side of the signal processing integrated circuit is protected by the second concave portion of the substrate, and does not receive external force directly from the side as viewed from the contact sensing surface. Thereby, the defect | deletion and failure of a sensor structure part and an integrated circuit for signal processing can be reduced.
In this aspect, the sensor structure portion is configured as a MEMS (Micro Electro Mechanical Systems) sensor, and may be displaced in accordance with application of force to the contact sensing surface. Thereby, since it can be manufactured by a semiconductor process as in the case of the signal processing integrated circuit, it is possible to manufacture a large number of sensor structures at the same time as in the case of the signal processing integrated circuit.
In this aspect, the surface of the signal processing integrated circuit may be located below the surface of the outer edge portion outside the second concave portion of the substrate. As a result, it is possible to prevent the signal processing integrated circuit from being applied with the same force as that of the contact sensing surface, and to prevent the signal processing integrated circuit from being damaged.
In this aspect, the sensor structure portion and the signal processing integrated circuit may be disposed so as to overlap each other via the first and second concave portions of the substrate. Thereby, a footprint can be made small and an electrical noise can be reduced.

  According to the present invention, the loss and failure of the sensor structure and the signal processing integrated circuit can be reduced without receiving external force directly from the side surface as viewed from the contact sensing surface, and the signal processing circuit is equivalent to the contact sensing surface. It is possible to provide a force sensor device that can prevent the force from being applied and prevent the signal processing integrated circuit from being lost.

It is sectional drawing which shows schematic structure of the sensor apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing which shows schematic structure of the sensor apparatus which concerns on Embodiment 2 of this invention. It is sectional drawing which shows schematic structure of the sensor apparatus which concerns on Embodiment 3 of this invention. It is sectional drawing which shows schematic structure of the sensor apparatus which concerns on Embodiment 4 of this invention. It is sectional drawing which shows schematic structure of the sensor apparatus which concerns on Embodiment 5 of this invention. (A) It is a figure which shows the state which applied the load to the force transmission part of a sensor structure part. (B) It is a figure which shows the state which applied the load to the force transmission part of a sensor structure part. It is a figure which shows the relationship between the load of the force transmission part of a sensor structure part, and the sensor value of a sensor apparatus. It is sectional drawing which shows schematic structure of the sensor apparatus which concerns on Embodiment 6 of this invention. (A) It is a figure which shows the state which applied the load to the force transmission part of a sensor structure part. (B) It is a figure which shows the state which applied the load to the force transmission part of a sensor structure part. It is a figure which shows the relationship between the load of the force transmission part of a sensor structure part, and the sensor value of a sensor apparatus. It is a figure which shows the structure which joined the structure main-body part to the side surface of the 1st recessed part via the side surface junction part. It is sectional drawing which shows schematic structure of the sensor apparatus which concerns on Embodiment 7 of this invention. It is the top view which looked at the board | substrate from upper direction. It is sectional drawing which shows a half-groove structure. It is a top view which shows a half-groove structure. It is a bottom view which shows schematic structure of the sensor apparatus which concerns on Embodiment 8 of this invention. It is a figure which shows an example of the bus wiring on a circuit board.

Embodiment 1
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a cross-sectional view showing a schematic configuration of a sensor device according to Embodiment 1 of the present invention. The sensor device 1 according to the first embodiment of the present invention is a sensor that detects force. For example, a plurality of sensors are arranged on a robot hand or the entire body surface of the robot and are connected to each other via a bus. This is for configuring a tactile sensor system.

  Robots that need to collaborate with people use this tactile sensor system to grasp, grasp, and touch the shape of the object, supplement the audiovisual sense, grasp the object and surrounding conditions, and touch the person Is possible. For this reason, it is necessary to improve the degree of freedom of touching and mounting of the robot without a sense of incongruity. As will be described later, the sensor device 1 according to the first embodiment has a sensor structure in which the sensor structure 2, the substrate 3, and the signal processing integrated circuit 4 are stacked and integrated in a small size. For this reason, a footprint is small, a small sensor can be comprised, and also curved surface mounting is possible.

  The sensor device 1 according to the first embodiment includes a sensor structure 2 having a contact sensing surface that directly contacts a detection object on one surface exposed to the outside, and a first concave portion 31 formed on one surface, A substrate 3 having a second concave portion 32 formed on the surface opposite to the one surface, and a signal processing integrated circuit 4 for processing an analog sensor signal output from the sensor structure portion 2 are provided.

  The sensor structure unit 2 is configured as, for example, a MEMS (Micro Electro Mechanical Systems) sensor made of conductive silicon. Thereby, since it can be manufactured by a semiconductor process in the same manner as the signal processing integrated circuit 4, the sensor structure unit 2 can be manufactured in a small size and in large quantities at a time. The sensor structure 2 is displaced in response to application of force to the contact sensing surface that is in direct contact with the detection target. The sensor structure portion 2 is provided with a convex force transmission portion 22 in contact with the detection target at the center of the structure main body portion 21 when viewed from the front side, and the periphery of the force transmission portion 22 is a concave thin portion 23. It has become. A peripheral edge 24 around the thin portion 23 supports the thin portion 23.

  Since the thin wall portion 23 has elasticity, the structure main body portion 21 functions as an operation film. That is, when a force is applied to the force transmitting portion 22, the thin-walled portion 23 is elastically deformed, and the structural main body portion 21 is bent.

  Here, a contact sensing surface is constituted by the force transmission unit 22. As described above, the structure main body portion 21 has a diaphragm structure including the force transmission portion 22 and the thin portion 23. Thereby, the force applied to the force transmission part 22 is correctly reflected in the deformation | transformation of the structure main-body part 21, and a detection target object can be detected with high precision.

  The sensor structure 2 outputs an analog sensor signal in response to the displacement of the contact sensing surface, and the back surface of the structure main body 21 where the first sensor electrode 25 that performs force-electric conversion is opposite to the contact sensing surface. Are provided in plurality.

  The substrate 3 is configured as a multilayer substrate made of, for example, ceramic, PCB or the like. A first concave portion 31 is formed on the surface of the substrate 3. A joint portion (adhesive layer) 5 for joining the structure main body portion 21 of the sensor structure portion 2 to the first concave portion 31 is provided on the bottom surface of the first concave portion 31. The structure main body 21 is disposed on the bottom surface of the first concave portion 31 via the joint 5. Note that the side surface joint portion 6 may be provided on the side surface of the first concave portion 31, and the side surface of the structure main body portion 21 may be joined to the side surface of the first concave portion 31 via the side surface joint portion 6. These junctions 5 and 6 are metal materials having conductivity in order to apply a potential to the sensor structure 2.

  For example, the surface of the outer edge portion 36 outside the first concave portion 31 of the substrate 3 and the contact sensing surface of the structure main body portion 21 of the sensor structure portion 2 (the force receiving surface of the force transmission portion 22) are on the same plane. As described above, the structure main body 21 of the sensor structure 2 is disposed in the first concave portion 31 of the substrate 3. Thereby, the side of the structure main body 21 of the sensor structure 2 is protected by the first concave portion 31 of the substrate 3 and does not receive external force directly from the side as viewed from the contact sensing surface.

  A plurality of second sensor electrodes 33 are provided on the bottom surface of the first concave portion 31 of the substrate 3. Each second sensor electrode 33 of the first concave portion 31 of the substrate 3 faces the first sensor electrode 25 of the structure main body portion 21 of the sensor structure portion 2 to form a capacitor. On the lower surface side of the substrate 3, for example, an external terminal for connecting to a bus of the tactile sensor system is provided and mounted on the bus wiring. The substrate 3 is provided with a three-dimensional wiring, and the wiring can be easily routed through the three-dimensional wiring.

  The signal processing integrated circuit 4 is electrically connected to the first sensor electrode 25 of the sensor structure 2 via the via in the substrate 3 and the joint 5 or the side joint 6. The signal processing integrated circuit 4 is electrically connected to the second sensor electrode 33 through a via in the substrate 3. A capacitance conversion circuit (not shown) in the signal processing integrated circuit 4 processes a capacitor change between the sensor electrodes 25 and 33. This capacitance conversion circuit (not shown) includes a switched capacitor as a CV change circuit and a CR oscillation circuit as a C-F conversion circuit. Further, the signal processing integrated circuit 4 performs detection processing for detecting a detection target, communication processing for performing data communication with other sensor devices 1, and the like based on the analog sensor signal.

  The signal processing integrated circuit 4 is disposed in a second concave portion 32 formed on the back surface of the substrate 3. Thereby, the side of the signal processing integrated circuit 4 is protected by the second concave portion 32 of the substrate 3 and does not receive external force directly from the side as viewed from the contact sensing surface. For example, the surface of the signal processing integrated circuit 4 is positioned below the surface of the outer edge portion 34 outside the second concave portion 32 of the substrate 3. Thereby, even if a force is applied to the contact sensing surface of the sensor structure portion 2, the force is received by the outer edge portion 34. For this reason, it is possible to prevent the signal processing integrated circuit 4 from being applied with the same force as the contact sensing surface, and to prevent the signal processing integrated circuit 4 from being lost.

In addition, the sensor structure unit 2 that performs force-electrical conversion and the signal processing integrated circuit 4 that performs signal processing thereof are arranged so as to overlap each other via the first and second concave portions 31 and 32 of the substrate 3. Has been. Thereby, electrical noise can be reduced while the footprint is reduced.
The signal processing integrated circuit 4 is mounted on the second concave portion 32 of the substrate 3 by using, for example, solder reflow (resin molding), wire bonding (bare chip), flip chip bonding (bare chip), or the like. In addition to the signal processing integrated circuit 4, for example, a plurality of circuits, passive circuits such as RLC (power supply stabilization circuit, filter circuit, etc.), sensors not related to the force sensor are installed and multifunctionalized, and the second circuit board 3 These can be mounted on the concave portion 32 to protect them.

  As described above, in the sensor device 1 according to the first embodiment, the first and second concave portions 31 and 32 are respectively formed on the front and back surfaces of the substrate 3, and the sensor structure portion 2 is in the first concave portion 31 of the substrate 3. The signal processing integrated circuit 4 is disposed in the second concave portion 32 of the substrate 3. Thereby, the loss and failure of the sensor structure 2 and the signal processing integrated circuit 4 can be reduced without receiving external force directly from the side as viewed from the contact sensing surface.

Embodiment 2
FIG. 2 is a cross-sectional view showing a schematic configuration of a sensor device according to Embodiment 2 of the present invention.
In the sensor device 20 according to the second embodiment of the present invention, in addition to the configuration of the first embodiment, the sensor structure portion 26 includes a concave portion 28 formed on the back surface of the structure main body portion 27, and the concave portion 28 has a first sensor. An electrode 25 may be provided. The structure main body 27 is integrally provided with a plate member 29 that closes the concave portion 28. The plate-like member 29 has a three-dimensional wiring (not shown) inside. The plate-like member 29 is provided with a second sensor electrode 33 that is separated from the first sensor electrode 25 of the concave portion 28 by a predetermined distance.

The plate-shaped member 29 is bonded to the bottom surface of the first concave portion 31 of the substrate 3 through the bonding portion 5. The sensor structure 26 alone having the structure main body 27 provided with the first sensor electrode 25 and the plate-like member 29 provided with the second sensor electrode 33 has a function as a force sensor.
The first sensor electrode 25 is electrically connected to the signal processing integrated circuit 4 via the structure main body 27, the joint 5, the three-dimensional wiring in the plate-like member 29, and the via in the substrate 3. The second sensor electrode 33 is electrically connected to the signal processing integrated circuit 4 through the three-dimensional wiring in the plate-like member 29, the joint portion 5, and the via in the substrate 3. In the second embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  According to the second embodiment, in addition to the effects of the first embodiment, a dedicated signal processing integrated circuit 4 corresponding to the sensor structure 26 is not required. There is an effect that the combination with the integrated circuit 4 becomes possible.

Embodiment 3
FIG. 3 is a cross-sectional view showing a schematic configuration of a sensor device according to Embodiment 3 of the present invention.
In the sensor device 30 according to the third embodiment of the present invention, in addition to the configuration of the first embodiment, the sensor structure unit 2 includes the force transmission unit 22, the thin-walled portion 23, and the peripheral portion 24 of the structure main body 21 with a resin 35. It may be covered and sealed. Thereby, since the resin 35 and the peripheral part 24 absorb the load which the force transmission part 22 and the thin part 23 of the structure main-body part 21 receive, a load range improves.

  According to the third embodiment, in addition to the effect according to the first embodiment, the effect of reducing the overload applied to the force transmitting portion 22 and the thin portion 23 of the structure main body portion 21 is further achieved. Note that in the third embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

Embodiment 4
FIG. 4 is a cross-sectional view showing a schematic configuration of a sensor device according to Embodiment 4 of the present invention.
In the sensor device 40 according to the fourth embodiment of the present invention, the sensor structure 2 side of the first sensor device 1 according to the first embodiment is fixed to a fixed surface, and the signal processing integration of the first sensor device 1 is performed. The signal processing integrated circuit 4 side of the second sensor device 1 according to the first embodiment may be fixed to the circuit 4 side.

  The first sensor device 1 located on the lower side is turned upside down, and the outer edge portion 36 outside the first concave portion 31 of the substrate 3 and the peripheral edge portion 24 of the sensor structure portion 2 are interposed via an elastic member 41 such as resin. And fixed to the fixed surface. The rigidity of the elastic member 41 is desirably sufficiently smaller than the rigidity of the thin portion 23. On the other hand, the force transmission part 22 of the sensor structure part 2 is fixed to a fixed surface by a rigid member 42. The second sensor device 1 is placed on the first sensor device 1 fixed upside down and joined together.

The outer edge portion 34 outside the second concave portion 32 of the substrate 3 of the first sensor device 1 and the outer edge portion 34 outside the second concave portion 32 of the substrate 3 of the second sensor device 1 are joined. The force transmission unit 22 of the sensor structure unit 2 of the first sensor device 1 and the force transmission unit 22 of the sensor structure unit 2 of the second sensor device 1 are arranged on the same axis (force detection axis) line. .
With the above configuration, when a load is applied to the sensor structure 2 of the second sensor device 1, the structure main body 21 of the sensor structure 2 of the first sensor device 1 and the sensor structure of the second sensor device 1. The structure main body 21 of the part 2 is bent by substantially the same amount. For this reason, if it is normal, the 1st and 2nd sensor apparatus 1 will output substantially the same sensor value. Therefore, by comparing the sensor value of the first sensor device 1 with the sensor value of the second sensor device 1, a failure (such as an open failure or a short failure) of these sensor devices 1 can be detected.

  As described above, according to the fourth embodiment, in addition to the effects according to the first embodiment, a failure of the sensor device 1 can be detected. In the fourth embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

Embodiment 5
FIG. 5 is a cross-sectional view showing a schematic configuration of a sensor device according to Embodiment 5 of the present invention.
In the sensor device 50 according to the fifth embodiment of the present invention, in addition to the configuration of the first embodiment, the displacement amount of the force transmission unit 22 is set on the end surface (power receiving surface) of the force transmission unit 22 of the sensor structure unit 2. A protrusion 51 having a corresponding height may be provided.

  For example, as shown in FIG. 6A, when a load is applied to the projection 51 of the force transmission unit 22 of the sensor structure 2 by the detection target X, the structure main body 21 is gradually bent. In this case, as shown in FIG. 7A, the sensor value output from the sensor device 50 gradually increases. This inclination is determined by the spring constant of the thin portion 23. When the structural body 21 is bent by a certain amount, the detection object X hits the peripheral edge 24 of the structural body 21 as shown in FIG. For this reason, the structure main-body part 21 will not bend any more. In this case, as shown in FIG. 7B, the sensor value output by the sensor device 50 is constant. As described above, the peripheral portion 24 can absorb the overload applied to the force transmitting portion 22 and the thin portion 23 of the structure main body portion 21.

  As described above, according to the fifth embodiment, in addition to the effects according to the first embodiment, it is possible to reduce overload applied to the force transmitting portion 22 and the thin portion 23 of the structure main body portion 21. In the fifth embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

Embodiment 6
FIG. 8 is a cross-sectional view showing a schematic configuration of a sensor device according to Embodiment 6 of the present invention.
In the sensor device 60 according to the sixth embodiment of the present invention, in addition to the configuration of the second embodiment, the joint portion 61 that joins the first concave portion 31 of the substrate 3 and the plate-like member 29 of the sensor structure portion 26 is electrically conductive. May be formed of a flexible elastic member. For example, the contact sensing surface (force transmission unit 22) of the structure main body 27 of the sensor structure 26 protrudes from the surface of the outer edge 36 outside the first concave portion 31 of the substrate 3 by a distance d.

  In the sixth embodiment, it is assumed that the detection target is larger than the structure main body 27 of the sensor structure 26. Further, the side surface joining portion is not provided on the side surface of the first concave portion 31.

  For example, as shown in FIG. 9A, when a load is applied to the force transmission portion 22 of the sensor structure portion 26 by the detection object X, the joint portion 61 is compressed and gradually contracted, and the structure main body portion 27 is also gradually bent. Mu In this case, as shown in FIG. 10A, the sensor value output by the sensor device 60 gradually increases. Note that the slope of A in FIG. 10 is determined by the spring constant α of the thin portion 23.

  When the joining portion 61 is contracted, the detection target X hits the surface of the outer edge portion 36 of the substrate 3 as shown in FIG. 9B. For this reason, the structure main body 27 does not bend any more. In this case, as shown in FIG. 10B, the sensor value output by the sensor device 60 is constant. Note that the load when the sensor value of the sensor device 60 becomes constant is determined by the spring constant β and the distance d of the elastic member of the joint portion 61. Thus, the overload applied to the force transmitting portion 22 and the thin portion 23 of the structure main body portion 67 can be absorbed by the outer edge portion 36 of the substrate 3.

  As described above, according to the sixth embodiment, in addition to the effect according to the second embodiment, it is possible to reduce the overload applied to the force transmitting portion 22 and the thin portion 23 of the structure main body portion 27. In the sixth embodiment, the same parts as those in the second embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the sixth embodiment, the side surface joint portion 62 is provided on the side surface of the first concave portion 31, and the side surface of the structure main body portion 27 is joined to the side surface of the first concave portion 31 via the side surface joint portion 62. (FIG. 11). The side surface joining portion 62 is formed of a conductive elastic member.

Embodiment 7
FIG. 12 is a cross-sectional view showing a schematic configuration of a sensor device according to Embodiment 7 of the present invention. In the sensor device 70 according to the seventh embodiment of the present invention, in addition to the configuration of the first embodiment, the substrate 71 is fixed to the electrode via the electrode fixing portion 72 on which the second sensor electrode 33 is disposed and the separation groove 73. And a substrate peripheral portion 74 formed outside the portion 72.

  FIG. 13 is a top view of the substrate as viewed from above. The electrode fixing portion 72 is provided with two second sensor electrodes 33 around each corner. The separation groove 73 penetrates, and the electrode fixing portion 72 and the substrate peripheral portion 74 are divided by the separation groove 73.

The periphery of each angle of the electrode fixing portion 72 is connected to the substrate peripheral portion 74 via two beam portions 75, respectively. The beam portion 75 mechanically and electrically connects the electrode fixing portion 72 and the substrate peripheral portion 74. The signal processing integrated circuit 4 is connected to a substrate peripheral portion 74 outside the separation groove 73 by a bump or the like.
The signal processing integrated circuit 4 is made of, for example, a multilayer material containing metal, and has a thermal expansion coefficient different from that of the ceramic substrate 71 and the sensor structure 2.

  Therefore, conventionally, the substrate of the signal processing integrated circuit is bent due to the temperature change, so that the gap between the first sensor electrode of the sensor structure and the second sensor electrode of the substrate is changed, and the temperature characteristic is lowered. For example, stress is generated when the signal processing integrated circuit is connected to the substrate by a bump or the like, and the gap between the first sensor electrode of the sensor structure and the second sensor electrode of the substrate changes, so that the stress at the time of mounting can be reduced. Impact was a problem.

  On the other hand, in the seventh embodiment, as described above, the substrate 71 is separated into the electrode fixing portion 72 where the second sensor electrode 33 is disposed and the substrate peripheral portion 74 via the separation groove 73. . The signal processing integrated circuit 4 is connected to the substrate peripheral portion 74. For this reason, even when the substrate of the signal processing integrated circuit 4 is bent due to a temperature change, the influence only affects the peripheral portion 74 of the substrate and does not affect the electrode fixing portion 72. Accordingly, since the gap between the first sensor electrode 25 of the sensor structure 2 and the second sensor electrode 33 of the substrate 71 does not change due to the temperature change, the temperature characteristics of the sensor structure 2 are improved. Further, the stress on the substrate 71 generated when the signal processing integrated circuit 4 is connected to the substrate 71 by bumps or the like can be absorbed by the separation groove 73. Therefore, the mounting stress can be relieved and the influence on the sensor structure 2 can be reduced.

  As mentioned above, according to this Embodiment 7, in addition to the effect which concerns on the said Embodiment 1, there exists the said advantageous effect. Note that in the seventh embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the above-described embodiment, a half-groove structure in which a thin bottom is formed in an intermediate portion in the depth direction may be used instead of a groove that completely penetrates the separation groove 76. 14 and 15 are a sectional view and a top view showing the half-groove structure. An electric wiring layer 77 is formed at the bottom of the separation groove 76, and the electrode fixing portion 72 and the substrate peripheral portion 74 outside thereof are electrically connected via the electric wiring layer 77.

  By making the separation groove 76 have a half-groove structure, the temperature characteristics of the sensor structure 2 can be improved and the mounting stress can be reduced, and further, the first sensor electrode 25 of the sensor structure 2 and the second sensor of the substrate 71 can be reduced. The electrode 33 can be sealed between the sensor structure 2 and the substrate 71, and its moisture resistance can be improved.

Embodiment 8
FIG. 16 is a bottom view showing a schematic configuration of a sensor device according to Embodiment 8 of the present invention. In the sensor device 80 according to the eighth embodiment of the present invention, mounting pads (external terminals) 81 are evenly arranged along the outer edge of the outer edge 34 outside the second concave portion 32 on the back surface of the substrate 3. . The mounting pads 81 are arranged on the back surface of the substrate 3 in, for example, 5 rows. At least one mounting pad 81 in each row is connected to wiring inside the substrate 3. The other pads 81 in the same row have the same potential and function as the mounted pads 81 in a floating state or connected.

  According to the eighth embodiment, by disposing the mounting pads 81 evenly along the outer edge of the back surface of the substrate 3, the load applied to the substrate 3 can be evenly distributed. Further, by setting the mounting pads 81 in the same row to the same potential as the pads 81 in the floating row or connected in the same row as described above, for example, the location on the bus wiring of the circuit board as shown in FIG. Regardless, the sensor device 80 can be freely mounted.

  Note that the present invention is not limited to the above-described embodiment, and can be changed as appropriate without departing from the spirit of the present invention. For example, the configurations of the first to eighth embodiments can be arbitrarily combined.

  DESCRIPTION OF SYMBOLS 1 Sensor apparatus, 2 Sensor structure part, 3 Substrate, 4 Signal processing integrated circuit, 5 Joint part, 6 Side joint part, 21 Structure main body part, 22 Force transmission part, 23 Thin part, 24 Peripheral part, 25 1st sensor Electrode, 31 First concave portion, 32 Second concave portion, 33 Second sensor electrode, 34 Outer edge portion, 35 Resin, 36 Outer edge portion, 41 Elastic member, 42 Rigid member, 51 Protruding portion, 61 Joint portion, 62 Side joint Part, 72 electrode fixing part, 73 separation groove, 74 substrate peripheral part, 75 beam part, 76 separation groove, 77 electric wiring layer, 81 mounting pad

Claims (4)

A sensor structure part that has a contact sensing surface that directly contacts a detection object on one surface exposed to the outside and outputs a sensor signal in response to a change in the contact sensing surface;
A substrate in which a first concave portion is formed on one surface and a second concave portion is formed on a surface opposite to the one surface;
A signal processing integrated circuit for processing a sensor signal output from the sensor structure;
With
The sensor structure is disposed in a first concave portion of the substrate;
The signal processing integrated circuit is disposed in a second concave portion of the substrate.
A sensor device. The sensor device according to claim 1,
The sensor structure is configured as a MEMS (Micro Electro Mechanical Systems) sensor, and is displaced according to application of force to the contact sensing surface. The sensor device according to claim 2,
The sensor device according to claim 1, wherein the surface of the signal processing integrated circuit is positioned below the outer peripheral surface of the second concave portion of the substrate. The sensor device according to any one of claims 2 and 3,
The sensor device, wherein the sensor structure and the signal processing integrated circuit are arranged so as to be closely stacked via the first and second concave portions of the substrate.

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