JP2017113930A - Cleansing composition for mold - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleansing composition capable of easily performing process without causing damage etc. on molding parts such as a mold, and capable of effectively cleansing and removing gum components derived from a variety of molding raw material resins.SOLUTION: A cleansing composition for a mold according to the present invention comprises at least an amide-based solvent, a ketone-based solvent, and an ester-based solvent. The cleansing composition for a mold is for cleansing and removing a gum component derived from a molding raw material resin. Examples of the molding raw material resin include polystyrene resin, acrylonitrile-butadiene-styrene resin, polypropylene resin, polyacetal resin, polyamide resin and the like.SELECTED DRAWING: None

Description

  The present invention relates to a cleaning composition for a mold, and more specifically, cleans resin resin and gas resin originating from a resin component generated on the surface of a mold, a cylinder, etc. during molding of a resin such as injection molding. The present invention relates to a mold cleaning composition for removal.

  In plastic molding processes such as injection molding, when various resins, which are molding raw materials, are heated, the resin melts and fuses to the surface of a cylinder, mold, etc., and the fused resin is absorbed by air. It is oxidized and carbonized by high-temperature heat to become a so-called resin resin (also referred to as “resin residue”). Further, a volatile gas component generated from the molten resin adheres to a mold or the like and is solidified when the temperature of the mold is lowered, so that a so-called gas resin (also referred to as “mold deposit”) is generated.

  If these resin or gas resin (hereinafter collectively referred to as “resin component”) adheres to the surface of a mold or the like and accumulates dirt, it greatly affects the finished dimensions, appearance, releasability, etc. of the molded product. . In order to prevent such adverse effects due to dirt, it is necessary to periodically perform a cleaning process or the like on a mold used for plastic molding such as injection molding to remove accumulated dirt.

  As a method for removing the spider component adhering to the surface of the mold or the like, for example, adhesion removal using a cleaning rubber sheet, cleaning removal using an alkaline solution, polishing removal by manual or blast shot, and the like are known.

  Specifically, the adhesion removal method using a cleaning rubber sheet is a method of sticking a rubber sheet on the surface of accumulated dirt molds, etc., attaching the dirt to the rubber sheet, and removing the dirt together with the sheet after a predetermined time. It is to peel off. However, in this method, the mold must be removed and disassembled completely, and the work of attaching the rubber sheet to the mold is extremely troublesome, and a part of the rubber sheet remains attached to the mold. There is a fear. Moreover, there is a possibility of damaging the surface of the mold.

  In addition, as a cleaning removal method using an alkaline solution, for example, Patent Document 1 discloses a mold cleaning agent in which a polyhydric alcohol is a main component and a strong alkali and a surfactant are blended therein. However, although the cleaning method using an alkaline liquid has a high detergency, there are problems that the load on humans and the environment is large, such as the influence of the alkaline liquid on workers and the treatment of waste liquid after cleaning.

  Further, polishing removal by manual or blast shot can remove dirt on the details of the mold, but there are problems that the time required for the polishing operation becomes long and the mold is easily damaged. In other words, blast shots have different cleaning effects depending on the media used, and when glass having a relatively high hardness is used as the media, the mold may be significantly damaged and the molding accuracy may be reduced. In addition, when dry ice having a hardness lower than that of glass is used as a medium, damage to the mold is reduced, but the effect of removing dirt is reduced.

  On the other hand, there is a cleaning removal method using a solvent in addition to the above-described removal method of the spider component. This solvent cleaning and removal method uses a combination of various organic solvents and chlorinated solvents, and is easy to perform and has the advantage of less impact on the mold. Various cleaning compositions have been proposed (see, for example, Patent Documents 2 and 3).

  Now, in plastic molding, various types of raw material resins are used depending on the type and use of the molded product. Naturally, the melting point of the molding material resin differs depending on the type, and the optimum cylinder temperature, mold temperature, solidification temperature, and the like in the molding process such as injection molding differ. Also, there is a difference in the resin component generated when such various molding raw material resins are molded. Table 1 shows examples of approximate temperature ranges of various resin melting points, molding cylinder temperature, solidification temperature, and mold temperature.

  In the above-described cleaning and removal method using a solvent, the solubility of the resin used as a starting ingredient, that is, a resin used as a molding raw material for injection molding or the like, in the solvent affects the cleaning effect. As described above, in recent years, various types of molding resin compositions have been developed and their types are diverse. Even when any type of resin is used as a molding raw material, the resin component derived from the raw resin can be effectively used. There is a need for solvent compositions that can be washed away.

Japanese Patent Laid-Open No. 11-090938 JP 2001-232647 A JP 2005-035121 A

  The present invention has been proposed in view of such circumstances, and can be easily processed without damaging a molded member such as a mold, and the spear component derived from various molding raw material resins. It is an object of the present invention to provide a cleaning composition that can effectively wash and remove water.

  In order to solve the above-mentioned problems, the present inventors have studied various combinations of solvents, and as a result, have found that at least a cleaning composition containing an amide solvent, a ketone solvent, and an ester solvent. As a result, it has been found that the resin component derived from various resins can be effectively washed and removed, and the present invention has been completed.

  (1) The first invention of the present invention is a mold cleaning composition containing at least an amide solvent, a ketone solvent, and an ester solvent.

  (2) The second invention of the present invention is a mold cleaning composition for cleaning and removing a spear component derived from a molding raw material resin in the first invention.

  (3) According to a third aspect of the present invention, in the first or second aspect, the amide solvent is N-ethyl-2-pyrrolidone or N-methyl-2-pyrrolidone, and the content thereof is a composition. It is a metal mold | die cleaning composition which is 1 mass%-50 mass% with respect to the whole thing.

  (4) According to a fourth aspect of the present invention, in any one of the first to third aspects, the ketone solvent is cyclohexanone or diacetone alcohol, and the content thereof is 5 mass relative to the entire composition. It is a detergent composition for metal mold | die which is% -30 mass%.

  (5) According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the ester solvent is an amyl acetate or a dicarboxylic acid methyl ester compound, the content of which is relative to the entire composition. It is a cleaning composition for metal mold | dies which are 5 mass%-30 mass%.

  (6) A sixth invention of the present invention is a mold cleaning composition according to any one of the first to fifth inventions, further comprising an alcohol solvent.

  (7) According to a seventh aspect of the present invention, in the sixth aspect, the alcohol solvent is octanol or benzyl alcohol, and the content thereof is 5% by mass to 30% by mass with respect to the entire composition. A cleaning composition for molds.

  (8) An eighth invention of the present invention is the mold cleaning composition according to any one of the first to seventh inventions, further containing a hydrocarbon solvent.

  (9) In a ninth aspect of the present invention based on the eighth aspect, the hydrocarbon solvent is a naphthene solvent or an isoparaffin solvent, and the content thereof is 5% by mass to 30% with respect to the entire composition. It is a cleaning agent composition for metal molds which is mass%.

  (10) A tenth aspect of the present invention is a mold cleaning composition according to any one of the first to ninth aspects, further comprising a glycol solvent.

  According to the present invention, it is possible to easily perform processing without damaging a molded member such as a mold, and it is possible to effectively wash and remove the spear components derived from various molding raw material resins.

  Hereinafter, a specific embodiment of the present invention (hereinafter referred to as “the present embodiment”) will be described in detail. In addition, this invention is not limited to the following embodiment, A various change is possible in the range which does not change the summary of this invention.

  The mold cleaning composition according to the present embodiment is for cleaning and removing the spear component that has adhered to and accumulated on the surface of a molded metal member such as a mold or a cylinder. Specifically, the mold cleaning composition according to the present embodiment contains at least an amide solvent, a ketone solvent, and an ester solvent. In particular, it is preferably composed of a high boiling point solvent having a boiling point of 150 ° C. or higher, preferably 180 ° C. or higher, more preferably 200 ° C.

  In the present specification, molded metal members such as molds and cylinders that can adhere and accumulate, and the objects to be cleaned by the cleaning composition are collectively referred to as “molds”.

  According to such a mold cleaning composition, it is possible to easily remove the spear component that has adhered to and accumulated on the mold surface without damaging the mold. Moreover, this mold cleaning composition can be suitably used for cleaning spear components derived from various molding raw material resins. Specifically, as the molding raw material resin, for example, the resin component derived from all resins such as polystyrene resin, acrylonitrile / butadiene / styrene resin, polypropylene resin, polyacetal resin, and polyamide resin is effectively washed and removed. Can do. In addition, resins other than the listed resins are not excluded.

  Hereinafter, each solvent component will be described in detail.

[Amide solvent]
Examples of the amide solvent include N-ethyl-2-pyrrolidone (NEP), N-methyl-2-pyrrolidone (NMP), N, N-dimethylacetamide, N, N-dimethylformamide, hexamethylphosphoric triamide. 1,3-dimethyl-2-imidazolidinone and the like.

  Among them, in the mold cleaning composition according to the present embodiment, it is preferable to use N-ethyl-2-pyrrolidone or N-methyl-2-pyrrolidone, which is a high boiling point solvent, and more cleanability, environment From the viewpoint of high safety, it is particularly preferable to use N-ethyl-2-pyrrolidone. According to the mold cleaning agent composition containing N-ethyl-2-pyrrolidone as an amide solvent and containing a ketone solvent and an ester solvent, which will be described later, the resin component derived from various resins is more It can be cleaned and removed effectively, and the burden on the environment is small.

  In addition, these amide solvents can be used alone or in combination of two or more.

  The content of the amide-based solvent is preferably in the range of 1% by mass to 50% by mass, more preferably in the range of 3% by mass to 45% by mass in the mold cleaning composition. It is particularly preferable that the amount be in the range of% to 40% by mass. If the content of the amide solvent is less than 1% by mass, there is a possibility that the cleaning and removing action of the spider component may not be sufficiently obtained. Absent.

[Ketone solvent]
Examples of ketone solvents include acetone, isophorone, methyl ethyl ketone, methyl propyl ketone, methyl butyl ketone, diethyl ketone, methyl isobutyl ketone, methyl amyl ketone, ethyl butyl ketone, methyl hexyl ketone, diisobutyl ketone, trimethylnonanone, and cyclopentane. Nonone, cyclohexanone, cycloheptanone, cyclooctanone, methylcyclohexanone, 2,4-pentanedione, acetonylacetone, acetophenone, dimethylmethylcyclohexanone carbonate, diacetone alcohol and the like can be mentioned.

  Among them, it is preferable to use cyclohexanone, diacetone alcohol or the like from the viewpoint of being a high boiling point solvent and having high environmental safety. These ketone solvents can be used singly or in combination of two or more.

  The content of the ketone solvent is preferably in the range of 5% by mass to 30% by mass, more preferably in the range of 10% by mass to 25% by mass in the cleaning composition for molds, and 15% by mass. It is particularly preferable that the amount be in the range of% to 20% by mass.

[Ester solvent]
Examples of the ester solvent include methyl acetate, butyl acetate, ethyl acetate, isopropyl acetate, amyl acetate, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl-3. -Dicarboxylic acids such as ethoxypropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, methyl formate, ethyl formate, butyl formate, propyl formate, ethyl lactate, butyl lactate, propyl lactate dicarboxylate methyl ester Examples include alkyl esters.

  Among them, it is preferable to use amyl acetate, dicarboxylic acid methyl ester, etc., which are high boiling solvents. These ester solvents may be used alone or in combination of two or more.

  The content of the ester solvent is preferably in the range of 5% by mass to 30% by mass, more preferably in the range of 10% by mass to 25% by mass, in the mold cleaning composition. It is particularly preferable that the amount be in the range of% to 20% by mass.

[Others]
(Alcohol solvent)
The mold cleaning composition may contain an alcohol solvent. Examples of alcohol solvents include methanol, ethanol, propanol, butanol, pentanol, 2-methylbutanol, 3-methoxybutanol, hexanol, 2-methylpentanol, 2-ethylbutanol, heptanol, octanol, and 2-ethylhexanol. , Nonyl alcohol, decanol, undecyl alcohol, trimethylnonyl alcohol, tetradecyl alcohol, heptadecyl alcohol, phenol, cyclohexanol, methylcyclohexanol, benzyl alcohol, ethylene glycol, 1,2-propylene glycol, 1,3-butylene glycol , Diethylene glycol, dipropylene glycol, triethylene glycol, tripropylene glycol and the like.

  Among them, it is preferable to use octanol, benzyl alcohol, etc., which are high boiling solvents. In addition, these alcohol solvents can be used individually by 1 type or in combination of 2 or more types.

  The content of the alcohol solvent is preferably in the range of 5 to 30% by mass, more preferably in the range of 10 to 25% by mass in the mold cleaning composition. It is particularly preferable that the amount be in the range of% to 20% by mass.

(Hydrocarbon solvent)
Moreover, you may make the cleaning composition for metal molds contain a hydrocarbon solvent. Examples of the hydrocarbon solvent include aliphatic hydrocarbon solvents such as n-hexane, n-heptane, n-octane, naphthene solvents, and isoparaffin solvents, and aromatic hydrocarbon solvents such as benzene, toluene, and xylene. Can be mentioned.

  Among them, it is preferable to use a naphthene solvent, an isoparaffin solvent, or the like, which is a high boiling point solvent. In addition, these alcohol solvents can be used individually by 1 type or in combination of 2 or more types.

  The hydrocarbon solvent content in the mold cleaning composition is preferably in the range of 5% by mass to 30% by mass, more preferably in the range of 10% by mass to 25% by mass. It is particularly preferable that the mass range be from 20% by mass.

(Glycol solvent)
In addition, the mold cleaning composition may contain a glycol solvent. Examples of glycol solvents include ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, 1,2-butylene glycol, 1,3-butylene glycol and other glycols, ethylene glycol monobutyl ether, diethylene glycol monoethyl ether, Diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, dipropylene glycol monomethyl ether, and other glycol monoalkyl ethers, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, diethylene glycol diethyl ether, and diethylene glycol isopropyl methyl ether. Dialkyl ethers Lumpur, etc. can be mentioned. These glycol solvents can be used singly or in combination of two or more.

  The content of the glycol solvent is preferably in the range of 1% by mass to 20% by mass, more preferably in the range of 5% by mass to 10% by mass in the mold cleaning composition.

  As described above, the mold cleaning composition according to the present embodiment contains at least an amide solvent, a ketone solvent, and an ester solvent, and more preferably N-ethyl. It contains 2-pyrrolidone or N-methyl-2-pyrrolidone as an amide solvent. More preferably, it further contains an alcohol solvent and a hydrocarbon solvent. According to such a cleaning composition for a mold, it can be applied to the mold or immersed in the mold without damaging the mold and easily attached to the mold surface. Thus, the accumulated spider component can be removed. Moreover, this mold cleaning composition can be suitably used for cleaning spear components derived from various molding raw material resins.

  EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following examples.

<Examples and comparative examples>
Various molding raw materials (pellets) were placed in a 0.2 g metal container (φ30 mm, depth 10 mm), the upper surface portion was covered with a SUS plate (100 mm × 50 mm × t2 mm), and the molding raw material was fired in a firing furnace. As firing conditions, the firing temperature was set to be equal to or higher than the melting point of each forming raw material, and the firing time was 1 hour. Due to the firing, a SUS plate covering the metal container was burnt in the shape of a lid. The firing that occurred on the SUS plate was assumed to be a component of resin (resin resin, gas resin). Note that the color of the burn varies depending on each forming raw material.

  As the molding material resin, five types of polystyrene resin, acrylonitrile / butadiene / styrene (ABS) resin, polypropylene resin, polyacetal resin, and polyamide resin were used, respectively. The firing conditions of the pellets of each molding material are as shown in Table 1 below. I made it.

  In the following Examples and Comparative Examples, a cleaning composition for cleaning gas scum produced on the SUS plate was prepared.

[Example 1]
40% by mass of N-ethyl-2-pyrrolidone (NMP), which is an amide solvent, 20% by mass of cyclohexanone, which is a ketone solvent, and 15% by mass of amyl acetate, which is an ester solvent, were blended. Further, 20% by mass of octanol (2-ethylhexanol), which is an alcohol solvent, and 5% by mass of an aliphatic hydrocarbon solvent (Exsol D110, manufactured by TonenGeneral Sekiyu KK) are further blended to form a detergent composition. A product was prepared.

[Example 2]
Except that 4% by weight of amide solvent, 20% by weight of ketone solvent, 20% by weight of ester solvent, 20% by weight of alcohol solvent, and 36% by weight of hydrocarbon solvent were blended. A cleaning composition was prepared using the same raw materials as in Example 1.

[Example 3]
The amide solvent was blended at a ratio of 40% by mass, the ketone solvent at 10% by mass, and the ester solvent at a ratio of 35% by mass. Moreover, 3-methoxy-3-methyl-1-butanol, which is a glycol solvent, was further blended at a ratio of 15% by mass to prepare a cleaning composition. The same amide solvent, ketone solvent and ester solvent as in Example 1 were used.

[Comparative Example 1]
In Comparative Example 1, a cleaning agent composition was prepared by blending a ketone solvent at 10% by mass, an ester solvent at 35%, an alcohol solvent at 30% by mass, and a hydrocarbon solvent at 50% by mass. . The same ketone solvent, ester solvent, alcohol solvent, and hydrocarbon solvent as in Example 1 were used.

[Comparative Example 2]
In Comparative Example 2, a cleaning composition was prepared by blending N-methyl-pyrrolidone (NMP), which is an amide solvent, at a ratio of 45 mass% and γ-butyrolactone, which is a ketone solvent, at a ratio of 55 mass%. The same amide solvent as in Example 1 was used.

[Comparative Example 3]
In Comparative Example 3, the ketone solvent is 17% by mass, the ester solvent is 17% by mass of amyl acetate, the dibasic acid dimethyl ester is 9% by mass, the alcoholic solvent is 41% by mass, octanol (2-ethylhexanol). ) In a proportion of 15% by mass. The same ketone solvent as in Example 1 was used.

  Table 2 below collectively shows the compositions of the cleaning compositions prepared in Examples and Comparative Examples.

<Cleaning test and evaluation>
The SUS plate on which the gas dust adhered was heated at 80 ° C. with a hot plate, and left for 10 minutes when the surface temperature of the SUS plate reached 80 ° C. Then, the produced cleaning composition was applied, waited for 1 minute, and the gas scum was wiped off with a paper waste.

  The cleaning effect of the cleaning composition is determined based on the density of the gas sani on the surface of the SUS plate. “◎” indicates that the hue of the gas yan becomes thin after the cleaning process, and “○” indicates that the gas yan is slightly thin after the cleaning process. The case where there was almost no change was evaluated as “Δ”, and the case where there was no change was evaluated as “×”. Table 3 below summarizes the results of the cleaning treatment test for gas sprout produced by the firing treatment of each molding raw material.

Claims (10)

A mold cleaning composition comprising at least an amide solvent, a ketone solvent, and an ester solvent. The mold cleaning composition according to claim 1, which is for cleaning and removing a spear component derived from a molding raw resin. The amide solvent is N-ethyl-2-pyrrolidone or N-methyl-2-pyrrolidone, and the content thereof is 1% by mass to 50% by mass with respect to the entire composition. Mold cleaning composition. The mold cleaning according to any one of claims 1 to 3, wherein the ketone solvent is cyclohexanone or diacetone alcohol, and the content thereof is 5% by mass to 30% by mass with respect to the entire composition. Agent composition. The gold according to any one of claims 1 to 4, wherein the ester solvent is amyl acetate or a dicarboxylic acid methyl ester compound, and the content thereof is 5% by mass to 30% by mass with respect to the entire composition. Mold cleaning composition. The mold cleaning composition according to any one of claims 1 to 5, further comprising an alcohol solvent. The mold cleaning composition according to claim 6, wherein the alcohol solvent is octanol or benzyl alcohol, and the content thereof is 5 mass% to 30 mass% with respect to the entire composition. The mold cleaning composition according to any one of claims 1 to 7, further comprising a hydrocarbon solvent. The mold cleaning composition according to claim 8, wherein the hydrocarbon solvent is a naphthenic solvent or an isoparaffin solvent, and the content thereof is 5% by mass to 30% by mass with respect to the entire composition. The mold cleaning composition according to any one of claims 1 to 9, further comprising a glycol solvent.