JP2017113765A - Laser processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser processing device capable of appropriately improving processing quality by setting a processing region in accordance with a processing content in regard to the laser processing device which performs processing onto a work surface by applying a laser beam.SOLUTION: A laser processing device 100 includes a laser oscillation unit 12, a galvano-scanner 19, a laser controller 5, and a PC 7. The laser processing device 100 presets a processing region R in a scannable region (S5) by using an object region O calculated every processing object of processing data on object region calculation processing (S4) and, with respect to a position provided by dividing the processing region R with a division number of DAC66, a control signal of the galvano-scanner 19 is allocated (S7). The laser processing device 100 outputs the control signal of the galvano-scanner 19 via the DAC66, drives a galvano-scanner 19 via a galvano X-axis motor 31 and a galvano Y-axis motor 32 and performs two-dimensional scanning of a laser beam L (S19).SELECTED DRAWING: Figure 4

Description

  The present invention relates to a laser processing apparatus that processes a work surface by irradiating a laser beam.

  2. Description of the Related Art Conventionally, a laser processing apparatus includes a laser beam emitting unit, a scanning unit that scans laser light emitted from the laser beam emitting unit, and a control unit. Is subjected to desired processing with a laser beam.

  As an invention relating to such a laser processing apparatus, an invention described in Patent Document 1 is known. The laser marking device described in Patent Document 1 includes a laser light source, a galvano scanner as an optical scanning unit, and a control unit. The control unit controls the laser light source and the optical scanning unit, By scanning the laser beam from the laser light source, the workpiece is processed with the laser beam.

  In the laser marking device described in Patent Document 1, when marking a workpiece with a marking content that exceeds the unit area that can be scanned by a galvano scanner as an optical scanning unit, an extended marking area is provided for each of a plurality of unit areas. The marking process is performed for each unit area.

JP 2007-268582 A

  In the configuration as disclosed in Patent Document 1, laser light is scanned to a desired position in a unit area by a galvano scanner serving as an optical scanning unit. A drive signal for the galvano scanner is calculated by a CPU, and is converted to a DAC. It is sent as an analog signal through (digital to analog converter). Since the number of DAC divisions depends on the performance of the DAC, the larger the area where marking is performed, the lower the accuracy of driving by the galvano scanner, and the lower the resolution in the marking process.

  Considering this point, in the laser marking device described in Patent Document 1, the extended marking area is divided into a plurality of unit areas, and marking processing is performed for each unit area. , It was fixed to one corresponding to the size of the unit area. Therefore, regardless of the size of the region where the processing based on the processing data is performed, the processing quality based on the unit area (that is, the resolution in the marking processing) is obtained, and the processing quality can be further improved. could not.

  The present disclosure has been made in view of the above circumstances, and relates to a laser processing apparatus that performs processing on a workpiece surface by irradiating a laser beam. By setting a processing area according to the processing content, the processing quality is appropriately set. It is an object of the present invention to provide a laser processing apparatus that can be improved.

  In order to achieve the above object, a laser processing apparatus according to an aspect of the present invention scans a laser light emitting unit that emits laser light for processing a workpiece and laser light emitted from the laser light emitting unit. A scanning unit; a control unit that outputs a scanning unit driving signal that indicates a driving position of the scanning unit in a predetermined number of divisions; and that controls the emission of the laser beam from the laser beam emitting unit; and the scanning unit Based on the driving data, a driving unit that drives the scanning unit, a processing data acquisition unit that acquires processing data indicating processing content for the workpiece, and the processing data acquired by the processing data acquisition unit, A processing region that determines a processing region that is a range in which processing based on the processing data is performed within a scannable region where the laser beam can be scanned by the scanning unit. An allocation change unit that allocates the predetermined number of divisions of the scanning unit drive signal to the processing region determined by the processing region determination unit, and the control unit changes the allocation Based on the scanning unit drive signal assigned by the unit, the scanning unit is driven via the driving unit, and control regarding emission of the laser light from the laser light emitting unit is performed. .

  The laser processing apparatus includes a laser beam emitting unit, a scanning unit, a control unit, a drive unit, and a machining data acquisition unit. Laser beam emission is performed according to the machining data acquired by the machining data acquisition unit. The surface of the workpiece can be processed by scanning the laser beam emitted from the section with the scanning section. Here, the laser processing apparatus further includes a processing region determination unit and an allocation change unit, and based on the processing data acquired by the processing data acquisition unit, inside the scannable region, A machining area that is a range in which machining is performed based on the machining data is determined, and the predetermined division number of the scanning unit driving signals is assigned to the determined machining area. The laser processing apparatus drives the scanning unit via the driving unit based on the scanning unit driving signal allocated by the allocation changing unit under the control of the control unit, and emits the laser light. Control relating to emission of the laser light from the unit is performed. That is, according to the laser processing apparatus, the processing region determination unit determines the processing region corresponding to the processing content of the processing data within the scannable region, and a predetermined number of scanning units for the processing region. Since the drive signal is assigned, the drive accuracy of the scanning unit related to the machining inside the machining area can be improved as compared with the case where the entire scannable area is targeted, and the machining precision by the laser beam can be further improved. it can.

  A laser processing apparatus according to another aspect of the present invention is the laser processing apparatus according to claim 1, wherein the processing region determination unit includes a minimum size including all of one processing object constituting the processing content of the processing data. The region is determined as the processing region.

  According to the laser processing apparatus, the processing area determination unit determines the minimum size area including all of one processing object constituting the processing content of the processing data as the processing area. The size of the machining area in can be determined to an appropriate size corresponding to the content of the machining object, and the machining accuracy related to the machining object can be improved.

  A laser processing apparatus according to another aspect of the present invention is the laser processing apparatus according to claim 1 or 2, wherein the laser processing apparatus is based on a distortion correction coefficient for correcting distortion generated at a processing position by the laser beam. A correction unit that corrects the scanning unit drive signal; and a position determination unit that determines a position of the processing region determined by the processing region determination unit. The correction unit is determined by the position determination unit. Further, the distortion correction coefficient is changed according to the position of the processing region.

  The laser processing apparatus includes a correction unit and a position determination unit, and changes the distortion correction coefficient in accordance with the position of the processing region determined by the position determination unit. As a result, according to the laser processing apparatus, the correction unit corrects the scanning unit drive signal using the distortion correction coefficient corresponding to the processing region determined by the processing region determination unit, and thus occurs at the processing position by the laser beam. The distortion can be corrected with higher accuracy, and the processing quality for the processing region can be further improved.

  A laser processing apparatus according to another aspect of the present invention is the laser processing apparatus according to claim 3, wherein the correction unit calculates the distortion correction coefficient corresponding to the processing region determined by the position determination unit. The distortion correction coefficient used for correcting the distortion in the processing region is changed to the calculated distortion correction coefficient.

  According to the laser processing apparatus, since the correction unit calculates and changes the distortion correction coefficient corresponding to the processing region determined by the position determination unit, the scanning unit driving signal for the processing region is highly accurate. Thus, the distortion in the processing region can be more reliably reduced. That is, the laser processing apparatus can improve the processing accuracy for each processing region.

  A laser processing apparatus according to another aspect of the present invention is the laser processing apparatus according to any one of claims 1 to 4, wherein the processing data determines whether or not the processing data includes a plurality of processing objects. And a determination unit, and when the processing unit determines that the processing data includes a plurality of processing objects, the processing region determination unit is configured to process the processing objects included in the processing data with respect to the processing objects. The region is determined, and the control unit controls the emission of the laser light and the scanning of the laser light at different timings for each of the plurality of processing regions determined for the processing data.

  According to the laser processing apparatus, when the processing unit determines that the processing data includes a plurality of processing objects, the processing region determination unit determines the processing objects included in the processing data. The processing area is determined, and the control unit performs control related to emission of the laser light and scanning of the laser light at different timings for each of the plurality of processing areas determined for the processing data. For each of the plurality of processing regions determined for the object, it is possible to assign a scanning unit driving signal suitable for each of the processing regions, and thus it is possible to appropriately improve the processing quality for each processing region.

  A laser processing apparatus according to another aspect of the present invention is the laser processing apparatus according to claim 5, further comprising a distance determination unit that determines whether or not a distance between the plurality of processing objects is equal to or less than a predetermined value. When the determination unit determines that the processing data includes a plurality of processing objects, and the distance determination unit determines that the distance between the plurality of processing objects is equal to or less than a predetermined value, the processing The region determining unit determines a region having a minimum size including a plurality of processing objects located at a distance equal to or less than a predetermined value as the processing region.

  In the laser processing apparatus, the determination unit determines that the processing data includes a plurality of processing objects, and the distance determination unit determines that the distance between the plurality of processing objects is equal to or less than a predetermined value. In this case, the processing region determination unit determines one processing region for one processing object in order to determine a minimum size region including a plurality of processing objects located at a distance equal to or less than a predetermined value as the processing region. Compared to the case, it is possible to improve the processing quality related to a plurality of processing objects while appropriately omitting the processing by the allocation changing unit and the laser processing for each processing region. That is, according to the laser processing apparatus, when a plurality of processing objects are included in the processing data, it is possible to achieve both improvement in processing quality related to each processing object and improvement in processing efficiency related to each processing object. .

It is explanatory drawing which shows schematic structure of the laser processing apparatus which concerns on 1st Embodiment. It is a top view which shows the structure of the laser head part which concerns on 1st Embodiment. It is a block diagram which shows the control system of the laser processing apparatus which concerns on 1st Embodiment. It is a flowchart of a laser processing program. It is a flowchart of an object area | region calculation processing program. It is a flowchart of the processing area setting process program which concerns on 1st Embodiment. It is explanatory drawing which shows the processing content of the process area setting process in 1st Embodiment. It is explanatory drawing about calculation of the projective transformation coefficient with respect to a process area | region. It is a flowchart of the processing area setting process program which concerns on 2nd Embodiment. It is explanatory drawing which shows the processing content of the process area setting process in 2nd Embodiment.

(First embodiment)
Hereinafter, an embodiment (first embodiment) in which a laser processing apparatus according to the present invention is embodied in a laser processing apparatus 100 will be described in detail with reference to the drawings.

(Schematic configuration of laser processing equipment)
First, a schematic configuration of the laser processing apparatus 100 according to the first embodiment will be described in detail with reference to the drawings. The laser processing apparatus 100 includes a laser processing unit 1 and a PC 7, and controls the laser processing unit 1 in accordance with the processing data created by the PC 7, so that the surface of the workpiece W as a processing target object is controlled. The laser beam L is two-dimensionally scanned to perform marking processing.

(Schematic configuration of laser processing equipment)
Next, a schematic configuration of the laser processing unit 1 constituting the laser processing apparatus 100 will be described in detail with reference to the drawings. As shown in FIG. 1, the laser processing unit 1 according to the first embodiment includes a laser processing apparatus main body 2, a laser controller 5, and a power supply unit 6.

  The laser processing apparatus main body 2 can perform marking on the surface of the workpiece W by irradiating the workpiece W with the laser beam L and scanning the laser beam L two-dimensionally. The laser controller 5 is configured by a computer, is connected to the PC 7 so as to be capable of bidirectional communication, and is electrically connected to the laser processing apparatus main body 2 and the power supply unit 6. The PC 7 is composed of a personal computer or the like, and is used for creating machining data and inputting various instruction information related to machining in the laser machining apparatus 100. The laser controller 5 drives and controls the laser processing apparatus main body 2 and the power supply unit 6 based on the processing data, control parameters, various instruction information, and the like transmitted from the PC 7.

  FIG. 1 schematically shows the laser processing apparatus main body 2 because the schematic configuration of the laser processing apparatus 100 and the laser processing unit 1 is shown. Therefore, a specific configuration of the laser processing apparatus main body 2 will be described later.

(Schematic configuration of the laser processing device main unit)
Next, a schematic configuration of the laser processing apparatus main body 2 will be described with reference to FIGS. In the description of the laser processing apparatus main body 2, the left direction, the right direction, the upper direction, and the lower direction in FIG. 1 are the front direction, the rear direction, the upper direction, and the lower direction, respectively. Therefore, the emission direction of the laser light L in the laser oscillation unit 12 is the forward direction. The direction perpendicular to the main body base 11 and the laser beam L is the vertical direction. A direction perpendicular to the vertical direction and the front-rear direction of the laser processing apparatus main body 2 is the left-right direction of the laser processing apparatus main body 2.

  The laser processing apparatus body 2 includes a laser head 3 (see FIG. 1) that emits laser light L and guide light M coaxially from the fθ lens 20, and a substantially box-like shape in which the laser head 3 is fixed to the upper surface. And a processing container (not shown).

  As shown in FIGS. 1 and 2, the laser head unit 3 includes a main body base 11, a laser oscillation unit 12 that emits laser light L, an optical shutter unit 13, a reflection mirror 14, a half mirror 15, The sensor 16, the guide light unit 17, the pointer light emitting unit 18, the galvano scanner 19, the fθ lens 20, and the like are configured and covered with a substantially rectangular parallelepiped housing cover (not shown). .

  The laser oscillation unit 12 includes a laser oscillator 21 and a beam expander 22, and is attached to the main body base 11 via an attachment base and attachment screws. The laser oscillator 21 has a fiber connector, a condenser lens, a reflecting mirror, a laser medium, a passive Q switch, an output coupler, and a window in a casing. An optical fiber F is connected to the fiber connector, and pumping light emitted from the pumping semiconductor laser unit 40 constituting the power supply unit 6 enters through the optical fiber F.

  The condensing lens condenses the excitation light incident from the fiber connector. The reflecting mirror transmits the excitation light condensed by the condenser lens and reflects the laser light emitted from the laser medium with high efficiency. The laser medium is excited by the excitation light emitted from the excitation semiconductor laser unit 40 and oscillates the laser light L. As the laser medium, for example, a neodymium-added gadolinium vanadate (Nd: GdVO4) crystal to which neodymium (Nd) is added as a laser active ion can be used.

  The passive Q switch functions as a Q switch that uses laser light oscillated by a laser medium as a pulsed pulse laser. As the passive Q switch, for example, a chrome-added YAG (Cr: YAG) crystal can be used.

  The output coupler constitutes a reflecting mirror and a laser resonator. The output coupler is, for example, a partial reflecting mirror constituted by a concave mirror whose surface is coated with a dielectric layer film. For example, the reflectance at a wavelength of 1064 nm is 80% to 95%. The window is made of synthetic quartz or the like formed of a dielectric multilayer film or the like, and transmits the laser beam L emitted from the output coupler to the outside. Accordingly, the laser oscillator 21 oscillates a pulse laser through the passive Q switch, and outputs a pulse laser as the laser light L for processing the workpiece W.

  The beam expander 22 changes the beam diameter of the laser light L and is provided coaxially with the laser oscillator 21. The mounting base is fixed to the rear side on the upper surface of the main body base 11 and to the left. The laser oscillation unit 12 is attached to the mount so that the optical axis of the laser beam L can be adjusted by each mounting screw.

  As shown in FIGS. 1 and 2, the optical shutter unit 13 includes a shutter motor 26 configured by a stepping motor, a rotary solenoid, and the like, and a flat shutter 27. The shutter 27 is attached to the motor shaft of the shutter motor 26 and moves to a predetermined position as the shutter motor 26 rotates, thereby blocking the optical path of the laser light L. On the other hand, when the shutter 27 rotates so as not to be positioned on the optical path of the laser light L, the laser light L enters the reflection mirror 14 positioned in front of the laser oscillation unit 12 and the optical shutter unit 13.

  The reflection mirror 14 is disposed such that the reflection surface forms approximately 45 degrees with respect to the optical path of the laser beam L emitted from the laser oscillation unit 12. The reflection mirror 14 receives the laser beam L incident on the reflection surface. The light is reflected to the half mirror 15 disposed on the right side with respect to the reflection mirror 14.

  The half mirror 15 is disposed such that the reflection surface forms 45 degrees with respect to the optical path of the laser light L reflected by the reflection mirror 14, and most of the laser light L incident on the reflection surface is Reflected toward the galvano scanner 19. Further, the half mirror 15 transmits a part of the laser light L incident on the reflection surface to the optical sensor 16 located on the right side of the half mirror 15. Further, the guide light M from the guide light portion 17 disposed on the rear side is incident on one surface of the half mirror 15 (the back surface of the reflection surface). The half mirror 15 transmits the guide light M from the rear side of the laser head unit 3 onto the optical path of the laser light L reflected by the reflecting surface.

  The optical sensor 16 is composed of a photodiode or the like, and a part of the laser light L transmitted through the half mirror 15 is incident thereon. Therefore, the laser processing apparatus 100 can detect the intensity of the laser light L output from the laser oscillator 21 via the optical sensor 16.

  The guide light unit 17 includes, for example, a visible semiconductor laser 28 that emits red laser light as visible laser light, and a lens group (not shown) that converges the guide light M emitted from the visible semiconductor laser 28 into parallel light. And is arranged on the rear side of the half mirror 15. The guide light M has a wavelength different from that of the laser light L emitted from the laser oscillator 21. The guide light unit 17 is fixed to the main body base 11 so that the optical path of the guide light M transmitted through the half mirror 15 coincides with the optical path of the laser light L traveling from the half mirror 15 to the galvano scanner 19.

  A pointer light emitting portion 18 is disposed on the front left side of the main body base 11 so that the pointer light, which is visible light, can be emitted without going through the fθ lens 20 toward the inside of the processing container. It is configured. The pointer light emitting unit 18 is attached to the main body base 11 so that the incident angle of the pointer light with respect to a work placing unit (not shown) disposed inside the processing container has a predetermined inclination angle. The pointer light is emitted so as to form an intersection with the guide light M at the focal position (focus position) of the laser light L converged by the fθ lens 20. Therefore, according to the laser processing apparatus 100, the position of the focal plane related to the laser light L can be determined by the user based on the intersection of the guide light M from the guide light unit 17 and the pointer light from the pointer light emitting unit 18. Therefore, the position of the processed surface of the workpiece W with respect to the focal plane of the laser light L can be adjusted appropriately.

  The galvano scanner 19 is attached to the upper side of a through hole 29 formed on the front side of the main body base 11, and lowers the laser light L emitted from the laser oscillation unit 12 and the guide light M reflected by the half mirror 15. Two-dimensional scanning. The galvano scanner 19 includes a galvano X-axis motor 31 having a galvano X-axis mirror, a galvano Y-axis motor 32 having a galvano Y-axis mirror, and a main body 33. The galvano X-axis motor 31 and the galvano Y-axis motor 32 are attached to the main body 33 by being fitted and held in the respective mounting holes from the outside so that the respective motor shafts are orthogonal to each other.

  In the galvano X-axis motor 31, the galvano X-axis mirror is attached as a scanning mirror to the tip of the motor shaft, and when the laser beam L and the guide beam M are scanned on the workpiece W surface in the X-axis direction. Used. In the galvano Y-axis motor 32, the galvano Y-axis mirror is attached as a scanning mirror to the tip of the motor shaft, and the laser light L and the guide light M reflected by the galvano X-axis mirror are converted into the surface of the workpiece W. Used when scanning in the Y-axis direction.

  In the galvano scanner 19, the scanning mirrors attached to the tip ends of the galvano X-axis motor 31 and galvano Y-axis motor 32 face each other inside. Then, the rotation of the galvano X-axis motor 31 and the galvano Y-axis motor 32 is controlled to control the posture of each scanning mirror (that is, the galvano X-axis mirror and the galvano Y-axis mirror). The light M is scanned two-dimensionally downward. This two-dimensional scanning direction is a front-rear direction (X-axis direction) and a left-right direction (Y-axis direction) on the surface of the workpiece W.

  The fθ lens 20 is attached to the main body base 11 of the laser head unit 3, and the laser beam L and the guide beam M that are two-dimensionally scanned by the galvano scanner 19 on the surface of the workpiece W arranged below. Are condensed coaxially. Then, the fθ lens 20 makes the focal point where the laser beam L, the guide beam M, and the like are focused into a flat focal plane and corrects the scanning speed of the laser beam L and the guide beam M to be constant. . Therefore, according to the laser processing apparatus 100, by controlling the rotation of the galvano X-axis motor 31 and the galvano Y-axis motor 32, the laser light L and the guide light M are formed in a desired processing pattern on the surface of the workpiece W. Two-dimensional scanning can be performed in the front-rear direction (X direction) and the left-right direction (Y direction).

  As shown in FIG. 2, on the rear side of the main body base 11, a substrate on which a galvano driver 23 is mounted is erected on the right side of the laser oscillation unit 12. The galvano driver 23 drives and controls the galvano X-axis motor 31 and the galvano Y-axis motor 32 based on motor drive information input from a galvano controller 56 described later, and performs two-dimensional scanning with the laser light L and the guide light M. .

(Schematic configuration of the power supply unit)
Next, a schematic configuration of the power supply unit 6 in the laser processing unit 1 will be described with reference to FIG. As shown in FIG. 1, the power supply unit 6 includes a pumping semiconductor laser unit 40, a laser driver 51, a power supply unit 52, and a cooling unit 53 in a casing 55. The power supply unit 52 supplies a driving current for driving the pumping semiconductor laser unit 40 to the pumping semiconductor laser unit 40 via the laser driver 51. Based on the drive information input from the laser controller 5, the laser driver 51 drives the pumping semiconductor laser unit 40 on and off with a direct current.

  The pumping semiconductor laser unit 40 is optically connected to the laser oscillator 21 through an optical fiber F, and generates pumping light by drive control via a laser driver 51. Therefore, the pumping light from the pumping semiconductor laser unit 40 is incident on the laser oscillator 21 via the optical fiber F.

  The cooling unit 53 is a unit for adjusting the pumping semiconductor laser unit 40 and the power supply unit 52 within a predetermined temperature range. For example, the cooling unit 53 is cooled by an electronic cooling method, so that the temperature of the pumping semiconductor laser unit 40 is increased. Control is performed, and the oscillation wavelength of the pumping semiconductor laser unit 40 is finely adjusted.

(Control system for laser processing equipment)
Next, the control system configuration of the laser processing unit 1 constituting the laser processing apparatus 100 will be described with reference to the drawings. As shown in FIG. 3, the laser processing unit 1 includes a laser controller 5 that controls the entire laser processing unit 1, a laser driver 51, a galvano controller 56, a galvano driver 23, a guide light driver 58, and pointer light. The driver 59 and the optical sensor 16 are included. A DAC 66, a laser driver 51, a galvano controller 56, an optical sensor 16, a guide light driver 58, a pointer light driver 59, and the like are electrically connected to the laser controller 5.

  The laser controller 5 includes an arithmetic device that performs overall control of the laser processing unit 1, a CPU 61, a RAM 62, a ROM 63, and a timer 65 that measures time as control devices.

  The RAM 62 is for temporarily storing various calculation results calculated by the CPU 61, XY coordinate data of the machining scanning pattern, and the like. The ROM 63 stores various programs, and stores various programs such as calculating the XY coordinate data of the machining scanning pattern based on the machining data transmitted from the PC 7 and storing it in the RAM 62.

  That is, the ROM 63 stores a laser processing program (see FIG. 4), an object region calculation processing program (see FIG. 5), and a processing region setting processing program (see FIGS. 6 and 9) which will be described later. Further, the ROM 63 stores strain data composed of measured values of strain generated at the processing position by the laser beam L in the initial state of the laser processing apparatus 100 (for example, the state at the time of factory shipment). The contents of the distortion data will be described in detail later with reference to the drawings.

  The CPU 61 performs various calculations and controls based on various control programs stored in the ROM 63. For example, the CPU 61 outputs the drive information of the pumping semiconductor laser unit 40 such as the pumping light output of the pumping semiconductor laser unit 40 and the pumping light output period set based on the processing data input from the PC 7 to the laser driver 51. To do. Further, the CPU 61 sends the XY coordinate data of each machining point constituting the machining data input from the PC 7, a control signal for instructing ON / OFF of the galvano scanner 19, galvano scanning speed information, etc. via the DAC 66 to the galvano controller. To 56.

  The DAC 66 is an electronic circuit that converts a digital electric signal into an analog electric signal. For example, the DAC 66 converts a control signal output from the CPU 61 to instruct ON / OFF of the galvano scanner 19 into an analog electric signal, and outputs a galvano controller. To 56. The number of divisions of the DAC 66 is determined by its performance. For example, when the performance of the DAC 66 is 16 bits, the number of divisions of the DAC 66 is 65536. In the initial state, the drive control of the galvano scanner 19 is performed with respect to the coordinate position obtained by dividing the scannable area of the galvano scanner 19 defined on the orthogonal coordinate system by a predetermined number of divisions according to the X axis and the Y axis. The control signals are assigned and performed according to these. For example, the scannable area of the galvano scanner 19 is defined as a rectangular area having a length in the X-axis direction of 120 mm and a length in the Y-axis direction of 120 mm. When the scannable area defined in the rectangular shape is divided by the number of divisions of 65536 according to the X axis and the Y axis, the interval between the coordinate positions becomes 0.00183 mm.

  The laser driver 51 drives and controls the pumping semiconductor laser unit 40 based on the laser driving information and the like such as the pumping light output of the pumping semiconductor laser unit 40 and the pumping light output period input from the laser controller 5. Specifically, the laser driver 51 generates a pulsed drive current having a current value proportional to the excitation light output of the laser drive information input from the laser controller 5, and is based on the output period of the excitation light of the laser drive information. Output to the pumping semiconductor laser unit 40 during the period. Thereby, the pumping semiconductor laser unit 40 emits pumping light having an intensity corresponding to the pumping light output into the optical fiber F during the output period.

  The galvano controller 56 is based on the XY coordinate data of each processing point in the processing data input from the laser controller 5, galvano scanning speed information, and the like, the driving angle and the rotational speed of the galvano X-axis motor 31 and the galvano Y-axis motor 32, etc. And the motor drive information indicating the drive angle and the rotational speed is output to the galvano driver 23.

  The galvano driver 23 drives and controls the galvano X-axis motor 31 and the galvano Y-axis motor 32 based on the motor drive information indicating the drive angle and rotation speed input from the galvano controller 56, and performs two-dimensional scanning with the laser light L. To do.

  The guide light driver 58 controls the guide light unit 17 including the visible semiconductor laser 28 based on the control signal output from the laser controller 5, and is emitted from the visible semiconductor laser 28 based on the control signal, for example. The light emission timing and light amount of the guide light M are controlled. Then, the pointer light driver 59 controls the pointer light emitting unit 18 based on the control signal output from the laser controller 5, and performs pointer light emission control.

  As shown in FIGS. 1 and 3, a PC 7 is connected to the laser controller 5 so as to be capable of two-way communication. Processing data transmitted from the PC 7 indicates processing contents, control parameters of the laser processing apparatus main body 2, It is configured to be able to receive various instruction information from the user.

  Next, the control system configuration of the PC 7 constituting the laser processing apparatus 100 will be described with reference to the drawings. As illustrated in FIG. 3, the PC 7 includes a control unit 70 that controls the entire PC 7, an input operation unit 76 that includes a mouse, a keyboard, and the like, a liquid crystal display 77, and various data and programs for the CD-ROM 79. It comprises a CD-R / W78 etc. for writing and reading.

  The control unit 70 includes a CPU 71 as a calculation device and a control device that controls the entire PC 7, a RAM 72, a ROM 73, a timer 74 that measures time, an HDD 75, and the like. The RAM 72 is used for temporarily storing various calculation results calculated by the CPU 71. The ROM 73 stores various control programs and data tables.

  The HDD 75 is a storage device that stores various application software programs and various data files. The HDD 75 stores a data creation processing program for creating machining data indicating the machining content of laser machining on the workpiece W.

  Then, the CD-R / W 78 reads or writes each data group constituting the application program and various data tables from the CD-ROM 79.

  In the PC 7, application programs such as a data creation processing program, various data tables, and a database may be stored in the ROM 73 or may be configured to be read from a storage medium such as the CD-ROM 79. Moreover, you may comprise so that it may download via networks (not shown), such as the internet.

  The PC 7 is electrically connected via an input / output interface (not shown) to an input operation unit 76 composed of a mouse, a keyboard and the like, a liquid crystal display 77 and the like.

(Processing contents of the laser processing program in the first embodiment)
Next, the processing contents of the laser processing program executed by the CPU 61 of the laser controller 5 will be described in detail with reference to FIG. As described above, the laser processing program is stored in the ROM 63 of the laser controller 5 and is read and executed by the CPU 61.

  When the execution of the laser processing program is started, the CPU 61 first receives input of work information indicating the outer shape, constituent material, and the like of the work W to be processed (S1). The work information is generated using, for example, the input operation unit 76 of the PC 7 and input from the PC 7. After storing the accepted work information in the RAM 62, the CPU 61 shifts the processing to S2.

  In S <b> 2, the CPU 61 executes a processing condition setting process, and sets processing conditions related to marking processing for the workpiece W based on the workpiece information stored in the RAM 62. Examples of processing conditions set in this case include the output intensity of the laser beam L, the scanning speed of the laser beam L, and the like. In the processing condition setting process, for example, the CPU 61 sets the intensity of the laser light L when performing the marking processing according to the constituent material of the workpiece W. After finishing the processing condition setting process (S2), the CPU 61 shifts the process to S3.

  In S <b> 3, the CPU 61 acquires processing data from the PC 7. The machining data is generated by executing a data creation processing program by the CPU 71 of the PC 7, and includes one or a plurality of machining objects indicating the contents of machining by the laser light L. The processing object indicates the processing content drawn on the surface of the workpiece W by marking processing, and includes a plurality of processing points corresponding to processing positions by the laser light L, line elements configured by a set of processing points, and the like. Consists of including. Each processing point constituting the processing object is assigned to each coordinate position on the orthogonal coordinate system (intersection of two grids orthogonal to each other in the orthogonal coordinate system). After the machining data acquired from the PC 7 is stored in the RAM 62, the CPU 61 shifts the process to S4.

  After shifting to S4, the CPU 61 executes an object area setting process to set an object area O for each processed object in the processed data acquired in S3. Specifically, the CPU 61 reads and executes an object area setting processing program (see FIG. 5) stored in the ROM 63.

(Processing contents of object area setting processing program)
As shown in FIG. 5, when the execution of the object area setting processing program is started, the CPU 61 first identifies one machining object among the machining objects included in the machining data acquired in S3, and the machining object The circumscribed rectangle is calculated (S21). Specifically, the CPU 61 calculates a circumscribed rectangle of the processing object based on the X coordinate value and the maximum and minimum values of the Y coordinate values of all the processing points constituting the processing object. Thereafter, the CPU 61 proceeds to S22.

  In S <b> 22, the CPU 61 registers the coordinate information of the four points constituting the circumscribed rectangle of the processing object calculated in S <b> 21 in the object area list formed in the RAM 62. After registering the circumscribed rectangle related to the processed object in the object area list as the object area O, the CPU 61 shifts the processing to S23.

  After shifting to S23, the CPU 61 determines whether or not the object area O registration processing has been completed for all the processed objects included in the processed data acquired in S3. When the processing for all the processing objects is completed (S23: YES), the CPU 61 ends the object area calculation processing program and shifts the processing to S5 of the laser processing processing program. On the other hand, when the processes for all the processed objects have not been completed (S23: NO), the CPU 61 returns the process to S21, and registers the object area O (S21, S22) for other processed objects included in the processed data. ).

  As shown in FIG. 4, in S5, the CPU 61 executes a machining area setting process based on the processing result of the object area calculation process (S4), and performs a machining area R when performing a marking process based on the machining data. Set. Specifically, the CPU 61 reads and executes a machining area setting processing program (see FIG. 6) stored in the ROM 63.

(Processing contents of the machining area setting processing program according to the first embodiment)
When the execution of the processing area setting processing program is started, the CPU 61 determines whether or not the object area list includes a plurality of object areas. If the object area list includes a plurality of object areas, the CPU 61 determines from the object area list two objects. The area O is specified, and it is determined whether or not there is an overlapping area between the object areas O (S31). Specifically, the CPU 61 determines whether or not there is an overlap by comparing the magnitude relationship between the coordinate values of the four points that define each object region O. When there is an overlap between the object areas O (S31: YES), the CPU 61 shifts the process to S32. On the other hand, when there is no overlap between the object areas O (S31: NO), the CPU 61 shifts the process to S33. Similarly, even when there are not a plurality of object areas, since the object areas do not overlap (S31: NO), the CPU 61 shifts the process to S33.

  For example, a description will be given with reference to the example in the left diagram of FIG. In this example, it is determined whether or not the first object area Oa and the second object area Ob overlap. In this case, the CPU 61 compares the coordinate value corresponding to the lower right corner of the first object area Oa with the coordinate value corresponding to the upper left corner of the second object area Ob. In the relationship between the two points, the value of the second object area Ob is smaller than the value of the first object area Oa in the X coordinate value, and the value of the first object area Oa is smaller in the Y coordinate value. Since it is larger than the value of the second object area Ob, the CPU 61 determines that there is an overlap between the first object area Oa and the second object area Ob.

  In S <b> 32, the CPU 61 calculates a circumscribed rectangle that includes the overlapping object area O, and sets the calculated circumscribed rectangle as a processed area R that includes a plurality of processed objects. Specifically, the CPU 61 obtains the maximum value and the minimum value of the coordinate values of the four points constituting each object area O among the overlapping object areas O, and has a circumscribed rectangle specified by the maximum value and the minimum value. Then, the processing region R is set (see the right diagram in FIG. 7). After the information related to the set machining area R (for example, coordinate information of four points constituting the machining area R) is stored in the RAM 62, the CPU 61 proceeds to S34.

  In S33, since there is no overlap between the two object areas O, the CPU 61 sets each object area O as a processing area R. In this case, the CPU 61 stores the coordinate information of the four points related to each object region O in the RAM 62 as the coordinate information of the four points related to each processing region R. Thereafter, the CPU 61 proceeds to S34.

  When the process proceeds to S34, the CPU 61 determines whether or not the processes for all the object areas O (that is, the processes of S31 to S33) have been completed based on the object area list generated in the object area setting process (S4). to decide. When the processing for all the object areas O has been completed (S34: YES), the CPU 61 proceeds to S35. On the other hand, when the processing for all the object areas O has not been completed (S34: NO), the CPU 61 returns the processing to S31.

  In S <b> 35, the CPU 61 determines the processing order of the processing regions R when performing the marking processing for all the processing regions R stored in the RAM 62. As a method for determining the processing order of the processing regions R, for example, regarding the coordinate information of four points related to each processing region R, the processing order is determined in ascending order of Y coordinate values. This determination method is merely an example, and the order of increasing Y coordinate values may be used, or may be determined based on the size of the X coordinate values. Furthermore, the processing order of the processing regions R may be determined in accordance with a path that allows each processing region R to be processed efficiently. After storing the determined processing order of the processing region R in the RAM 62, the CPU 61 ends the processing region setting processing program and shifts the processing to S6 of the laser processing processing program.

  With reference to FIG. 4 again, the processing content after S6 will be described. In S <b> 6, the CPU 61 specifies one machining area R as a target machining area as a marking machining target in accordance with the machining order determined in S <b> 35 of the machining area setting processing program. After specifying the target machining area, the CPU 61 proceeds to S7.

  In S7, the CPU 61 first divides the target machining area specified in S6 by the number of divisions of the DAC 66. Subsequently, the CPU 61 assigns a control signal of the galvano scanner 19 to each coordinate position (hereinafter referred to as control reference coordinates) obtained by dividing the target machining area by the number of divisions of the DAC 66. When the target machining area is divided by the number of divisions of the DAC 66, the interval between the coordinate positions is smaller than when the entire scannable area of the galvano scanner 19 is divided by the number of divisions of the DAC 66. Therefore, the control signal of the galvano scanner 19 is assigned to coordinate positions with smaller intervals. As a result, the laser processing apparatus 100 can improve the scanning accuracy of the laser light L and the guide light M with respect to the inside of the target processing region as compared with the case where the entire scannable region of the galvano scanner 19 is the target. After assigning the control signal of the galvano scanner 19 to the control reference coordinates in the target machining area, the CPU 61 proceeds to S8.

  After shifting to S8, the CPU 61 calculates a projective transformation coefficient for correcting the distortion generated at the processing position by the laser light L in the target processing area based on the distortion data stored in the ROM 63.

  Here, the distortion data stored in the ROM 63 will be described. In the laser processing apparatus 100, when the galvano mirror is rotated according to the coordinate data of each processing point of the processing data without performing the correction process, the laser light L emitted from the laser oscillation unit 12 is galvano-scanner 19, fθ. In the process of reaching the workpiece W through the lens 20, the laser head unit 3 is affected by the arrangement of the laser oscillation unit 12 and the galvano scanner 19 and the aberration of the fθ lens 20.

  That is, due to these influences, the processing position by the laser beam L on the processing area of the surface of the workpiece W, the ideal point that is an ideal coordinate that is required to be processed by the laser beam L on the workpiece W, and the orthogonal coordinates in the processing data. Distortion as a deviation occurs between the set point which is the coordinates of the machining point set on the system. As shown in the left diagram of FIG. 8, the distortion data is composed of distortion values generated at respective coordinate positions obtained by dividing the scannable area of the galvano scanner 19 by the number of divisions of the DAC 66 according to the X and Y axes. ing.

  In S8, first, the CPU 61 specifies the position of the target machining area in the scannable area of the galvano scanner 19 based on the coordinate information of the four points related to the target machining area (FIG. 8). Subsequently, based on the distortion data configured as described above, the CPU 61 is close to the four points related to the target processing area among the coordinate positions associated with the distortion numerical values in the scannable area of the galvano scanner 19. A coordinate position is specified, and a numerical value of distortion at each coordinate position is acquired. Thereafter, the target machining area is obtained by dividing the target machining area by the number of divisions of the DAC 66 by a cubic spline interpolation method using the numerical value of the distortion at the coordinate position acquired from the distortion data and the coordinate information of the four points related to the target machining area. The numerical value of distortion at each control reference coordinate is obtained.

  Subsequently, the CPU 61 controls the control reference based on the coordinate value (X coordinate value, Y coordinate value) of each control reference coordinate in the target machining area and the distortion value at each control reference coordinate obtained by the cubic spline interpolation method. The coordinate value of the processing position when the laser beam L is irradiated is calculated without performing correction processing with the coordinates as a reference. Thereafter, the CPU 61 calculates a plurality of projective transformation coefficients (that is, “a” to “h”, “α”) related to the respective control reference coordinates in the target processing region based on the calculated coordinate values of the processing position. The projective transformation coefficient indicates a value necessary for canceling out the distortion (that is, the distortion obtained by the cubic spline interpolation method) generated at each control coordinate position on the orthogonal coordinate system by a projective transformation process described later.

The conversion formula used in the projective conversion process is as follows.
(X coordinate (x ′) of coordinate position) = (a * x + b * y + c) / (g * x + h * y + α)
(Y coordinate (y ′) of coordinate position) = (d * x + e * y + f) / (g * x + h * y + α)
And it is comprised by several projection transformation coefficient (namely, "a"-"h", "α") with respect to one control reference coordinate, "α" in the said projection transformation coefficient is "+1" or "- 1 ".

  After storing the projection transformation coefficient relating to each control reference coordinate in the target machining area calculated in this way in the RAM 62, the CPU 61 proceeds to S9.

  In S9, the CPU 61 performs a distortion correction execution process on the target machining area. Specifically, the CPU 61 projects the X coordinate value and Y coordinate value of each machining point constituting the machining object in the target machining area, and the projection associated with each control reference coordinate of the target machining area calculated in S8. By executing correction processing (projection conversion processing) using conversion coefficients (that is, “a” to “h”, “α”) and a conversion formula, the laser beam L is generated in the processing position of the target processing region. Correct distortion. Since the projective transformation coefficient in this case is associated with each control reference coordinate obtained by dividing the target machining area by the number of divisions of the DAC 66, according to the laser machining apparatus 100, distortion in the target machining area can be accurately detected. Can be corrected. Thereafter, the CPU 61 shifts the processing to S10.

  After shifting to S10, the CPU 61 executes the machining execution process for the target machining area, and controls the laser oscillation unit 12 and the galvano scanner 19 in which the processing result of the distortion correction execution process (S9) is reflected, thereby performing the target machining. The processing object related to the region is drawn on the surface of the workpiece W by the laser beam L. At this time, since the drive control of the galvano scanner 19 is performed according to the control reference coordinates obtained by dividing the target processing area by the number of divisions of the DAC 66, the laser processing apparatus 100 performs marking processing related to the processing object in the target processing area. The accuracy can be improved, and the resolution of the processed object can be increased. When the machining execution process for the target machining area ends, the CPU 61 proceeds to S11.

  In S <b> 11, the CPU 61 deletes the projective transformation coefficient related to the target machining area calculated in S <b> 8 from the RAM 62. Thereby, the laser processing apparatus 100 can store the projective transformation coefficient related to a new target processing region (for example, another processing region R) in the storage region of the RAM 62 that is released as a result of erasure. Can effectively utilize the storage capacity. Thereafter, the CPU 61 proceeds to S12.

  In S12, the CPU 61 determines whether or not the processing (S7 to S11) related to the marking processing for all the processing regions R set in S5 has been completed. When the processing for all the processing regions R has been completed (S12: YES), the CPU 61 ends the laser processing program. On the other hand, when the processing for all the processing regions R has not been completed (S12: NO), the CPU 61 returns the processing to S6, specifies the processing region R that is the next processing order as the target processing region, and the processing region About R, the process (S7-S11) which concerns on a marking process is performed.

  As described above, the laser processing apparatus 100 according to the first embodiment includes the laser oscillation unit 12, the galvano scanner 19, the fθ lens 20, the laser controller 5, and the PC 7. The surface of the workpiece W can be marked by scanning the laser beam L emitted from the laser beam L with the galvano scanner 19.

  The laser processing apparatus 100 sets the processing region R within the scannable region of the galvano scanner 19 by executing the processing region setting process (S5) on the processing object in the processing data acquired in S3, The control signal of the galvano scanner 19 is assigned to the position divided by the number of divisions of the DAC 66 with respect to the processing region R (S7). The laser processing apparatus 100 drives the galvano scanner 19 via the galvano X-axis motor 31 and the galvano Y-axis motor 32 based on the control signal of the galvano scanner 19 output from the CPU 61 via the DAC 66. Then, control regarding the emission of the laser light L from the laser oscillation unit 12 is performed.

  That is, according to the laser processing apparatus 100, the processing region R corresponding to the processing object in the processing data is set inside the scanning processing region of the galvano scanner 19, and the processing region R is set according to the number of divisions of the DAC 66. Since the control signal of the galvano scanner 19 is assigned, the driving accuracy of the galvano scanner 19 related to the marking process in the processing region R can be improved as compared with the case where the entire scanable region of the galvano scanner 19 is targeted. Further, the processing accuracy of the marking processing by the laser beam L can be further improved.

  Then, in the processing area setting process (S5), in order to set the processing area R on the basis of the object area O calculated as a circumscribed rectangle including one processing object in the object area calculation process (S4), the laser The processing apparatus 100 can determine the size of the processing region R inside the scannable region of the galvano scanner 19 to an appropriate size corresponding to the content of the processing object, thereby increasing the processing accuracy of the marking processing related to the processing object. Can be improved.

  The laser processing apparatus 100 determines the position of the processing region R in the scannable region of the galvano scanner 19 by executing the processes of S7 to S9, and projects according to the position of the processing region R inside the scannable region. The conversion coefficient is calculated based on the distortion data for the scannable area (S8), changed to the calculated projective conversion coefficient, and distortion correction relating to the processing object in the processing area R is performed (S9). Thereby, according to the said laser processing apparatus 100, since the correction process using the detailed projective transformation coefficient according to the process area | region R set by the process area setting process (S5) can be performed, it is based on the laser beam L. The distortion generated at the machining position can be corrected with higher accuracy, and the machining quality of the marking process on the machining region R can be further improved.

  The distortion data is composed of distortion numerical values at coordinate positions obtained by dividing the scannable area of the galvano scanner 19 by the DAC 66. Then, the projective transformation coefficient relating to the processing region R is obtained by calculating the processing region R by a cubic spline interpolation method using the position of the processing region R in the scannable region of the galvano scanner 19 and the distortion data. The numerical value of the distortion at the control reference coordinates divided by the DAC 66 is obtained, and calculated for each control reference coordinate based on the numerical value of the distortion. That is, according to the laser processing apparatus 100, a detailed distortion state in the processing region R can be obtained, and a projective transformation coefficient corresponding to the state can be calculated. It is possible to more reliably reduce the distortion generated therein, and to improve the processing quality related to the marking processing of the processing object.

  The laser processing apparatus 100 calculates one object region O for each processing object included in the processing data in the object region calculation processing (S4), and in the processing region setting processing (S5), the object processing is performed. The processing region R is set using the region O, and the processing order for the plurality of processing regions R is determined (S35). Therefore, according to the laser processing apparatus 100, as shown in FIG. 4, the processing (S7 to S11) related to the marking processing for each processing region R can be sequentially executed according to the determined processing order. The processing quality of the marking process for the region R can be improved appropriately.

  As shown in FIGS. 6 and 7, the laser processing apparatus 100 has a case where two object areas O overlap in the positional relationship between the two object areas O in the processing data (that is, between a plurality of processing objects). In order to set a circumscribed rectangle having a minimum size including a plurality of overlapping object areas O as one processing area R according to the processing area setting processing program (S35), Compared with the case where one machining area R is determined for one machining object, the allocation process in S7, the distortion correction process relating to S8 and S9, the marking process execution process (S10) for the machining area R, etc. are appropriate. It is possible to improve the processing quality of marking processing for a plurality of processing objects. That is, according to the laser processing apparatus 100, when the processing data includes a plurality of processing objects, it is possible to achieve both improvement in processing quality related to each processing object and improvement in processing efficiency related to each processing object. it can.

(Second Embodiment)
Next, an embodiment (second embodiment) different from the above-described first embodiment will be described in detail with reference to the drawings. The laser processing apparatus 100 according to the second embodiment has the same basic configuration as the laser processing apparatus 100 according to the first embodiment described above, and the processing content of the processing area setting process (S5) is different. Therefore, the description about the same structure and processing content as 1st Embodiment is abbreviate | omitted.

(Processing contents of machining area setting processing program according to second embodiment)
Also in the laser processing apparatus 100 according to the second embodiment, when the object region calculation process (S4) is completed as in the first embodiment, the CPU 61 executes a processing region setting process and performs marking processing based on the processing data. A processing region R for performing is set. Specifically, the CPU 61 reads the machining area setting processing program (see FIG. 9) according to the second embodiment from the ROM 63 and executes it.

  As shown in FIG. 9, when the execution of the machining area setting processing program according to the second embodiment is started, the CPU 61 first specifies two object areas O from the object area list, and between the object areas O. An interval in the X-axis direction (hereinafter, X-direction interval Dx) is calculated (S41). Specifically, the CPU 61 determines the difference between the maximum value of the X coordinate values relating to the four points constituting one object area O and the minimum value of the X coordinate values relating to the four points constituting the other object area O. , X-direction interval Dx is calculated. After storing the calculated X-direction interval Dx in the RAM 62, the CPU 61 proceeds to S42.

  In S42, the CPU 61 determines whether or not the X-direction interval Dx calculated in S41 is smaller than the maximum object width in the X-axis direction. The maximum value of the object width in the X-axis direction means a larger one of the two object areas O with respect to the width of the object area O in the X-axis direction, and the coordinates of four points constituting each object area O Among the information, it is specified by the maximum value and the minimum value of the X coordinate value. That is, in S42, it is determined whether or not the two object areas O are separated by a distance corresponding to one object area O in the X-axis direction. When the X-direction interval Dx is smaller than the maximum object width in the X-axis direction (S42: YES), the CPU 61 proceeds to S43. On the other hand, when the X-direction interval Dx is not smaller than the maximum object width in the X-axis direction (S42: NO), the CPU 61 proceeds to S46.

  In S43, the CPU 61 calculates an interval in the Y-axis direction between the two object areas O (hereinafter, Y-direction interval Dy). Specifically, the CPU 61 determines the difference between the maximum value of the Y coordinate values relating to the four points constituting one object area O and the minimum value of the Y coordinate values relating to the four points constituting the other object area O. , Y-direction interval Dy is calculated. After storing the calculated Y-direction interval Dy in the RAM 62, the CPU 61 proceeds to S44.

  After shifting to S44, the CPU 61 determines whether or not the Y-direction interval Dy calculated in S43 is smaller than the maximum object height in the Y-axis direction. The maximum value of the object height in the Y-axis direction means a larger one of the two object areas O with respect to the height of the object area O in the Y-axis direction. Of the coordinate information, it is specified by the maximum value and the minimum value of the Y coordinate value. That is, in S44, it is determined whether or not the two object areas O are separated by a distance corresponding to one object area O in the Y-axis direction. If the Y-direction interval Dy is smaller than the maximum object height in the Y-axis direction (S44: YES), the CPU 61 proceeds to S45. On the other hand, if the Y-direction interval Dy is not smaller than the maximum object height in the Y-axis direction (S44: NO), the CPU 61 proceeds to S46.

  In S45, the CPU 61 calculates a circumscribed rectangle that includes the two object areas O to be processed in S41 to S44, and sets the calculated circumscribed rectangle as a machining area R that includes a plurality of machining objects. Specifically, the CPU 61 obtains the maximum value and the minimum value of the coordinate values of the four points constituting each object area O in the two object areas O, and has a circumscribed rectangle specified by the maximum value and the minimum value. Then, the processing region R is set (see the right diagram in FIG. 10). After the information related to the set machining area R (for example, coordinate information of four points constituting the machining area R) is stored in the RAM 62, the CPU 61 proceeds to S47.

  Here, the processing contents of S41 to S45 will be described with reference to the example shown in FIG. In the example shown in FIG. 10, the positional relationship between the first object area Oa and the second object area Ob is determined. In this case, first, the CPU 61 calculates the X-direction interval Dx between the first object area Oa and the second object area Ob (S41). When comparing the object width related to the first object area Oa and the object width related to the second object area Ob, the object width of the second object area Ob is larger, so the CPU 61 determines that the X direction interval Dx and the second object area The size of the area Ob is compared with the object width (S42). In the example shown in FIG. 10, since the X-direction interval Dx is smaller than the object width of the second object area Ob (S42: YES), the CPU 61 proceeds to S43.

  In S43 for the example shown in FIG. 10, the CPU 61 calculates a Y-direction interval Dy between the first object area Oa and the second object area Ob (S44). When comparing the object height related to the first object area Oa and the object height related to the second object area Ob, the object height in the second object area Ob is larger, so the CPU 61 determines that the Y direction interval Dy and the second object area The size of the object Ob in the area Ob is compared (S44). Thereafter, in the example shown in FIG. 10, since the Y-direction interval Dy is smaller than the object height of the second object area Ob (S44: YES), the CPU 61 proceeds to S45.

  That is, as shown in this example, in the second embodiment, when there is an overlap between the first object area Oa and the second object area Ob as in the first embodiment (see the left figure in FIG. 7). In the case where the two object areas O are close to each other to some extent, a circumscribed rectangle including the two processed objects is set as one processed area R.

  In S <b> 46, the CPU 61 sets each object area O as a machining area R because the two object areas O are separated to some extent (equivalent to one object area O) in the X-axis direction and the Y-axis direction. To do. In this case, the CPU 61 stores the coordinate information of the four points related to each object region O in the RAM 62 as the coordinate information of the four points related to each processing region R. Thereafter, the CPU 61 proceeds to S47.

  When the process proceeds to S47, the CPU 61 determines whether or not the processes for all the object areas O (that is, the processes of S41 to S46) have been completed based on the object area list generated in the object area setting process (S4). to decide. When the processing for all the object areas O has been completed (S47: YES), the CPU 61 proceeds to S48. On the other hand, when the process for all the object areas O has not been completed (S47: NO), the CPU 61 returns the process to S41, and performs the processes of S41 to S46 for the other object areas O included in the processed data. .

  In S <b> 48, the CPU 61 determines the processing order of the processing regions R when performing the marking processing for all the processing regions R stored in the RAM 62. The method for determining the processing order of the processing regions R can be set as appropriate based on the positional relationship between the processing regions R, as in the first embodiment. After storing the determined processing order of the processing region R in the RAM 62, the CPU 61 ends the processing region setting processing program according to the second embodiment, and shifts the processing to S6 of the laser processing processing program.

  By configuring in this way, the laser processing apparatus 100 according to the second embodiment is arranged between the first object area Oa and the second object area Ob as in the first embodiment in the processing area setting process (S4). Not only when there is an overlap (see the left figure in FIG. 7), but also when the two object areas O are close to each other to some extent, a circumscribed rectangle including two processed objects is set as one processed area R. Can be set. That is, even in the laser processing apparatus 100 according to the second embodiment, when a plurality of processing objects are included in the processing data, the processing quality for each processing object is improved and the processing efficiency for each processing object is improved. Can be made compatible.

  In the above-described embodiment, the laser processing apparatus 100 is an example of a laser processing apparatus in the present invention, and the laser oscillation unit 12 is an example of a laser beam emitting section in the present invention. The galvano scanner 19 is an example of a scanning unit in the present invention, and the CPU 61 and the DAC 66 are examples of a control unit in the present invention. The galvano X-axis motor 31 and the galvano Y-axis motor 32 are examples of the drive unit in the present invention, and the CPU 61, RAM 62, and ROM 63 are the machining data acquisition unit, the machining area determination unit, the allocation change unit, and the correction in the present invention. It is an example of a part, a position judgment part, a judgment part, and a distance judgment part.

  Although the present invention has been described based on the embodiments, the present invention is not limited to the above-described embodiments, and various improvements and modifications can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, the laser processing apparatus 100 executes the processing condition setting process (S2) based on the workpiece information acquired in S1, thereby processing conditions for marking processing using the laser light L (for example, Although the output intensity and the like of the laser beam L are adjusted and set, the present invention is not limited to this mode. For example, in accordance with the configuration of the machining area R in the machining data, the machining conditions for machining the machining object related to the machining area R may be further adjusted and set.

  In the embodiment described above, since the control signal of the galvano scanner 19 is assigned to each control reference coordinate obtained by dividing the machining area R by the number of divisions of the DAC 66, the smaller the size of the machining area R, the more the marking by the laser light L is performed. The resolution of processing can be increased and high-definition drawing can be performed. In this case, when the locus of the laser light L by scanning with the galvano scanner 19 is changed with the change of the processing region R, the heat input amount of the laser light L per unit area changes. Considering this point, the output intensity of the laser beam L when processing the processing object related to the processing region R may be adjusted and set according to the size of the processing region R in the processing data. Good. For example, the length of the processed line segment is calculated from the coordinate value of the coordinates irradiated with the laser beam L, and the length of the processed line segment when assigning the control signal of the galvano scanner 19 to the entire scannable region and the processed region R are calculated. Even if it is configured to change the output intensity of the laser light L when processing the processing object related to the processing region R based on the ratio to the length of the processing line segment when assigning the control signal of the galvano scanner 19. Good.

  In the above-described embodiment, a configuration in which the distortion in the machining area R is always obtained by the cubic spline interpolation method for the machining area R included in the machining data, and a projective transformation coefficient based on the distortion is calculated (S8). However, it is not limited to this embodiment.

  In the case of the configuration of the laser processing apparatus 100, the distortion in the distortion data is large at the periphery of the scannable area defined in the orthogonal coordinate system and small near the origin of the scannable area as shown in the left diagram of FIG. Tend to be. Therefore, when the machining area R is near the origin in the scannable area, there is no significant difference between the detailed distortion inside the machining area R obtained by using the cubic spline interpolation method and the distortion in the distortion data. it is conceivable that.

  Considering these points, when the processing region R is in the vicinity of the origin in the scannable region, the projective transformation coefficient is obtained directly from the distortion of the distortion data without using the cubic spline interpolation method. Can do. With this configuration, it is possible to reduce the processing load for obtaining detailed distortion by the cubic spline interpolation method while maintaining a certain degree of correction accuracy by the projective transformation coefficient.

DESCRIPTION OF SYMBOLS 1 Laser processing unit 3 Laser head part 5 Laser controller 7 PC
12 Laser unit 19 Galvano scanner 20 fθ lens 31 Galvano X axis motor 32 Galvano Y axis motor 61 CPU
62 RAM
63 ROM
66 DAC
100 Laser processing equipment L Laser light O Object area R Processing area

Claims (6)

A laser beam emitting section for emitting a laser beam for processing the workpiece;
A scanning unit that scans the laser beam emitted from the laser beam emitting unit;
A control unit that outputs a scanning unit driving signal that indicates a driving position of the scanning unit in a predetermined number of divisions, and that controls the emission of the laser light from the laser light emitting unit;
A driving unit for driving the scanning unit based on the scanning unit driving signal;
A machining data acquisition unit for acquiring machining data indicating the machining content of the workpiece;
Based on the processing data acquired by the processing data acquisition unit, a processing region that is a range in which processing based on the processing data is performed is determined in a scannable region where the laser beam can be scanned by the scanning unit. A machining area determination unit to perform,
An allocation changing unit that allocates the predetermined number of divisions of the scanning unit drive signal to the processing region determined by the processing region determination unit;
The controller is
Based on the scanning unit driving signal allocated by the allocation changing unit, the scanning unit is driven via the driving unit, and control related to emission of the laser beam from the laser beam emitting unit is performed. A featured laser processing apparatus. The processing area determination unit
The laser processing apparatus according to claim 1, wherein a region having a minimum size including all of one processing object constituting the processing content of the processing data is determined as the processing region. A correction unit that corrects the scanning unit driving signal based on a distortion correction coefficient for correcting distortion generated at a processing position by the laser beam;
A position determination unit that determines the position of the processing region determined by the processing region determination unit,
The correction unit is
The laser processing apparatus according to claim 1, wherein the distortion correction coefficient is changed according to the position of the processing region determined by the position determination unit. The correction unit is
Calculating the distortion correction coefficient corresponding to the processing area determined by the position determination unit;
4. The laser processing apparatus according to claim 3, wherein a distortion correction coefficient used for correcting the distortion in the processing region is changed to the calculated distortion correction coefficient. A determination unit that determines whether or not the processing data includes a plurality of processing objects;
When it is determined by the determination unit that the processing data includes a plurality of processing objects,
The processing area determination unit
Determining the machining area for a plurality of machining objects included in the machining data;
The controller is
The control relating to the emission of the laser beam and the scanning of the laser beam is performed at different timings for each of the plurality of machining areas determined for the machining data. The laser processing apparatus as described. A distance determination unit that determines whether a distance between the plurality of processing objects is equal to or less than a predetermined value;
When the determination unit determines that the processing data includes a plurality of processing objects, and the distance determination unit determines that the distance between the plurality of processing objects is a predetermined value or less,
The processing area determination unit
6. The laser processing apparatus according to claim 5, wherein a region having a minimum size including a plurality of processing objects located at a distance equal to or less than a predetermined value is determined as the processing region.

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