JP2017108073A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of achieving high speed and downsizing of a system at low cost without deteriorating reliability.SOLUTION: A semiconductor device comprises an interposer board 1 mounted on a mother board 2 and a plurality of mounting components 40 mounted on the interposer board 1 and the mother board 2. The interposer board 1 comprises: an immovable mounting part 30 which mounts some of the plurality of mounting components 40 and which is mounted on the mother board 2; a movable mounting part 35 which mounts some of the plurality of mounting components 40; and a flexible board 12 which electrically connecting the immovable mounting part 30 and the movable mounting part 35 by being connected with the immovable mounting part 30 and the movable mounting part 35, and changes relative positions of the immovable mounting part 30 and the movable mounting part 35 by being deformed.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a semiconductor device including a circuit board. In particular, the present invention relates to a mounting method for mounting components to be mounted on a circuit board.

  In recent years, electronic devices in which semiconductor devices are mounted have been significantly improved in performance, function, and size, and semiconductor devices are increasingly required to be faster and smaller. Correspondingly, instead of mounting individual semiconductor components on the main board (hereinafter referred to as the motherboard), a plurality of semiconductor elements are connected on the mounting board (hereinafter referred to as the interposer board) to function as a single module. In addition, the development of a semiconductor device called a multi-chip module (hereinafter referred to as MCM), which has achieved higher-density system mounting by mounting an interposer board on a motherboard, thereby realizing higher-density system mounting. It is being promoted by each company.

  In the MCM, in order to prevent cracking or solder cracking of the semiconductor element due to a difference in thermal expansion with the interposer substrate, a device such as changing the thickness or area of the semiconductor element according to the thickness of the interposer substrate has been made (for example, Patent Document 1).

JP 2002-305285 A

  Here, if the number of components mounted on the MCM is increased in order to increase the speed of the system, the interposer substrate becomes large and it is difficult to reduce the size of the system. For example, since mounting parts such as arithmetic devices and storage devices are relatively large, it is difficult to reduce the size of the system when many of these parts are mounted on the MCM.

  Furthermore, when the components mounted on the interposer substrate or the MCM are increased, the difference in thermal expansion between the substrate and the components is increased, and cracks and solder cracks are likely to occur, resulting in a decrease in reliability. Further, when the parts to be mounted on the interposer substrate or the MCM are increased, it is necessary to deal with cracks and solder cracks, resulting in high costs.

  In addition, it is difficult to obtain expensive components such as arithmetic devices suitable for MCM, and it is also difficult to newly develop dedicated components with different areas and thicknesses. As described above, when increasing the speed of the system, there are problems that it is difficult to reduce the size, the reliability is lowered, and the manufacturing cost is increased.

  The present invention has been made in view of the above, and an object of the present invention is to provide a semiconductor device capable of increasing the speed and size of a system at low cost without reducing reliability.

  In order to solve the above-described problems and achieve the object, a semiconductor device according to the present invention includes an interposer substrate mounted on a motherboard, and a plurality of mounting components mounted on the interposer substrate and the motherboard. The interposer substrate mounts a part of the plurality of mounting parts and is mounted on the motherboard, a movable mounting part for mounting a part of the plurality of mounting parts, and the fixed The fixed mounting portion and the movable mounting portion are electrically connected to each other by being connected to the mounting portion and the movable mounting portion, and the fixed mounting portion and the movable mounting portion are relatively deformed by being deformed. And a flexible connection part capable of changing the position.

  The semiconductor device according to the present invention has an effect that the system can be speeded up and downsized at a low cost without reducing reliability.

Sectional drawing which shows the structure of the semiconductor device concerning Embodiment 1 Schematic diagram showing the configuration of the interposer substrate shown in FIG. Block diagram showing the operation of the semiconductor device according to the first embodiment. Sectional drawing which shows the structure of the semiconductor device which concerns on Embodiment 2. FIG. Block diagram showing the operation of the semiconductor device according to the second embodiment. Sectional drawing which shows the structure of the semiconductor device which concerns on Embodiment 3. FIG. Block diagram showing the operation of the semiconductor device according to the third embodiment. A plan view showing a configuration of a semiconductor device according to a fourth embodiment. FIG. 7 is a plan view showing a configuration of a semiconductor device according to the fifth embodiment. Block diagram showing the operation of the apparatus according to the fifth embodiment Sectional drawing which shows the structure of the semiconductor device concerning Embodiment 6 Sectional drawing which shows the structure of the semiconductor device concerning Embodiment 7 Sectional drawing which shows the comparative example of the semiconductor device using the interposer board comprised with the rigid board | substrate Sectional drawing which shows the comparative example of the semiconductor device using the interposer board comprised with the rigid board | substrate

  Hereinafter, a semiconductor device according to an embodiment of the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited by this embodiment.

Embodiment 1 FIG.
FIG. 1 is a cross-sectional view showing the configuration of the semiconductor device according to the first embodiment. In FIG. 1, hatching of the cross section is partly omitted for easy viewing. The same applies to other sectional views. A semiconductor device 50 according to the first embodiment includes an interposer substrate 1 mounted on a motherboard 2 and a plurality of mounting components 40 mounted on the interposer substrate 1 and the motherboard 2. The interposer substrate 1 is mounted on a mother board 2 and is configured by mounting a plurality of mounting components 40 on the interposer substrate 1 and the mother board 2. The arithmetic device 3 which is the mounting component 40 is mounted on the interposer substrate 1 constituting the semiconductor device 50, and the interposer substrate 1 is mounted on the mother board 2, whereby the arithmetic device 3 is attached to the mother board 2 via the interposer substrate 1. Implemented. Thereby, the arithmetic device 3 is electrically connected to the mother board 2 via the interposer substrate 1.

  The arithmetic device 3 uses a CPU (Central Processing Unit). A first cooling plate 8 that cools the arithmetic device 3 is attached to the arithmetic device 3 on the surface side of the arithmetic device 3 opposite to the side mounted on the interposer substrate 1. Note that the arithmetic device 3 may be other than the CPU, and may be a field programmable gate array (FPGA) or a general purpose graphics processing unit (GPGPU).

  A high-speed I / O interface component 5 that is a mounting component 40 and other electronic components 6 are mounted on the surface of the motherboard 2 on which the interposer substrate 1 is mounted. The high-speed I / O interface component 5 is a USB (Universal Serial Bus) component. The high-speed I / O interface component 5 may be a high-speed I / O interface component other than a USB component, such as a SATA (Serial Advanced Technology Attachment) component, PCIe (Peripheral Component Interconnect express). (Registered Trademark) parts, HDMI (High-Definition Multimedia Interface) (Registered Trademark) parts, parts compliant with other standards, or parts having a structure different from these standards may be used. . The high-speed I / O interface component 5 may be of any standard or structure as long as it can perform data communication. The mounting component 40 mounted on the mother board 2 may be an I / O interface component other than the high-speed I / O interface component 5.

  The mounting of the arithmetic device 3 on the interposer substrate 1, the mounting of the interposer substrate 1 on the motherboard 2, the mounting of the high-speed I / O interface component 5 on the motherboard 2, and the mounting of the electronic component 6 on the motherboard 2 are performed by soldering. Performed by the ball 7.

  FIG. 2 is a schematic diagram showing a configuration of the interposer substrate shown in FIG. The interposer substrate 1 includes a first component mounting portion 10 that is a fixed mounting portion 30 for mounting a part of the plurality of mounting components 40 and a movable mounting portion 35 for mounting a part of the plurality of mounting components 40. It has a second component mounting part 11 and a flexible substrate 12 which is a flexible connection part. The first component mounting portion 10 is formed in a plate shape, and is a member for mounting the arithmetic device 3 on one surface by the solder balls 7 and mounting the other surface on the mother board 2 by the solder balls 7. Yes. That is, the mounting component 40 mounted on the first component mounting unit 10 is the arithmetic device 3, and the first component mounting unit 10 is mounted on the motherboard 2.

  Two second component mounting portions 11 are provided, both of which are formed in a plate shape. The two second component mounting portions 11 are both connected to the first component mounting portion 10 by the flexible substrate 12. The flexible substrate 12 is connected to the first component mounting unit 10 and the second component mounting unit 11 to electrically connect the first component mounting unit 10 and the second component mounting unit 11, and the flexible substrate 12. By deforming itself, the relative positions of the first component mounting unit 10 and the second component mounting unit 11 can be changed.

  Specifically, the flexible substrate 12 employs a flexible and flexible base material such as a polyimide resin and can be easily deformed with a weak force. The second component mounting unit 11 is connected to the first component mounting unit 10 by the flexible substrate 12, so that the second component mounting unit 11 can move relative to the first component mounting unit 10 within a range in which the flexible substrate 12 can be moved by deformation. The first component mounting unit 10 is connected to the first component mounting unit 10 so as to be able to change the general position, and is electrically connected to the first component mounting unit 10. That is, the two second component mounting portions 11 are connected to the first component mounting portion 10 by the flexible substrate 12 so that the relative positions with respect to the first component mounting portion 10 can be changed independently of each other.

  In the interposer substrate 1, the first component mounting unit 10 is mounted on the motherboard 2, and the second component mounting unit 11 is not mounted on the motherboard 2. On the other hand, since the second component mounting unit 11 is electrically connected to the first component mounting unit 10 by the flexible substrate 12, the second component mounting unit 11 is also electrically connected to the mother board 2 via the first component mounting unit 10. It is connected. Accordingly, the second component mounting portion 11 is electrically connected to the motherboard 2 while being arranged so as to be movable with respect to the motherboard 2 within a range in which the flexible substrate 12 can be deformed. .

  The mounting component 40 mounted on the second component mounting unit 11 is the storage device 4, and the storage device 4 that is the mounting component 40 is mounted on the second component mounting unit 11 as shown in FIG. A plurality of storage devices 4 are mounted on both surfaces of the second component mounting unit 11. The storage device 4 uses a high-speed memory element. The storage device 4 stores a program executed in the arithmetic device 3 and can store various data. The storage device 4 may be a DDR4 SDRAM (Double Data Rate 4-Synchronous Dynamic Random Access Memory). The storage device 4 conforms to other standards, or the storage device 4 has a structure different from these standards. It may be. The storage device 4 may be of any standard or structure as long as it can store various data.

  As shown in FIG. 1, the storage device 4 cools the storage device 4 on the surface side of the storage device 4 opposite to the side mounted on the second component mounting portion 11 of the interposer substrate 1. A second cooling plate 9 is attached. One second cooling plate 9 is attached to the second cooling plate 9 across the plurality of storage devices 4 mounted on one second component mounting unit 11. That is, the plurality of storage devices 4 mounted on one second component mounting unit 11 are connected to the common second cooling plate 9. The second cooling plate 9 attached to the plurality of storage devices 4 mounted on one second component mounting unit 11 is provided with a different second cooling plate 9 for each surface of the second component mounting unit 11. Alternatively, a different second cooling plate 9 may be attached to each storage device 4. Further, the second cooling plate 9 may not be attached to the storage device 4, and the storage device 4 mounted on one second component mounting unit 11 is a storage to which the second cooling plate 9 is attached. The device 4 and the storage device 4 to which the second cooling plate 9 is not attached may be mixed.

  The arithmetic device 3 and the storage device 4 are connected within the interposer substrate 1 and are not connected to the mother board 2. Specifically, the arithmetic device 3 is mounted on the first component mounting portion 10 of the interposer substrate 1, and the storage device 4 is electrically connected to the first component mounting portion 10 via the flexible substrate 12. It is mounted on the component mounting unit 11. Thereby, the arithmetic device 3 and the storage device 4 can communicate with each other via the first component mounting unit 10, the flexible substrate 12, and the second component mounting unit 11. That is, the arithmetic device 3 and the storage device 4 are not connected to the mother board 2 but are connected in the interposer substrate 1 and can communicate via the interposer substrate 1.

  Further, since the arithmetic device 3 is electrically connected to the motherboard 2 via the interposer substrate 1, the high-speed I / O interface component 5 and the electronic component 6 mounted on the motherboard 2, and the arithmetic device 3 Can communicate via the interposer substrate 1 and the mother board 2.

  Next, the operation will be described. FIG. 3 is a block diagram showing the operation of the semiconductor device according to the first embodiment. The arithmetic device 3 reads the program stored in the storage device 4 and performs calculation and control, thereby executing processing according to the instruction content of the read program. The storage device 4 is also used for temporary storage of a program executed in the arithmetic device 3 and data used when the arithmetic device 3 executes processing according to the program. The arithmetic device 3 and the storage device 4 and the high-speed I / O interface component 5 are connected via a CPU bus 19 provided on the mother board 2 to exchange data. As a result, the arithmetic device 3 can exchange data with an external device (not shown) that is disposed outside the semiconductor device 50 and connected to the high-speed I / O interface component 5.

  The interposer substrate 1 is electrically and physically connected to the mother board 2 by the solder balls 7 only at the first component mounting portion 10, and the second component mounting portion 11 is a flexible substrate that can be easily deformed with a weak force. 12 is connected to the first component mounting unit 10. Thereby, the storage device 4 is fixed at a position away from the mother board 2 by the second component mounting portion 11 by utilizing the property of the flexible substrate 12 that can be deformed with a weak force without being directly mounted on the mother board 2. Can be arranged. In addition, since the second component mounting unit 11 is not mounted on the mother board 2, the storage device 4 can be mounted on both surfaces of the second component mounting unit 11, and the mounting density can be increased.

  Since the semiconductor device 50 is configured as described above, the number of components mounted on the interposer substrate 1 is increased in order to increase the speed of the system, and even if the interposer substrate 1 itself becomes larger, the components are three-dimensionally mounted on the motherboard 2. Can be implemented. This makes it possible to reduce the size of the system.

  FIG. 13 is a cross-sectional view showing a comparative example of a semiconductor device using an interposer substrate formed of a rigid substrate. As a comparative example for the semiconductor device 50 according to the first embodiment, a semiconductor device 50a in which the interposer substrate 1a is formed of a rigid substrate will be described. In the semiconductor device 50 a of the comparative example shown in FIG. 13, unlike the interposer substrate 1 in the first embodiment shown in FIG. 1, the interposer substrate 1 a is composed of a rigid substrate that is entirely mounted on the motherboard 2. That is, the interposer substrate 1a of the comparative example connects the first component mounting portion 10 and the second component mounting portion 11 by the flexible substrate 12 like the interposer substrate 1 in the first embodiment, and the first component mounting portion 10 Instead of mounting only on the mother board 2, it is a rigid board on which the interposer board 1a formed in a single plate shape is mounted on the mother board 2. In the semiconductor device 50a of the comparative example, the interposer substrate 1a is mounted on the mother board 2 by connecting a part of the interposer substrate 1a formed of the rigid substrate to the mother board 2 by the solder balls 7.

  Similarly to the interposer substrate 1 in the first embodiment, the interposer substrate 1a of the comparative example is formed to have a size capable of mounting a plurality of mounting components 40. The size of the interposer substrate 1a is the same as that of the embodiment. 1 is larger than the first component mounting portion 10 of the interposer substrate 1. For this reason, it is possible to mount many mounting components 40 such as the storage device 4, the high-speed I / O interface component 5, and the electronic component 6 as the mounting components 40 on the interposer substrate 1 a. However, the interposer substrate 1a of the comparative example shown in FIG. 13 is large in size so that a plurality of mounting components 40 can be mounted, and between the interposer substrate 1a and the mother board 2, there is no solder ball 7 between them. Since there is only one gap, the mounting component 40 cannot be mounted between the interposer substrate 1 a and the mother board 2.

  FIG. 14 is a cross-sectional view showing a comparative example of a semiconductor device using an interposer substrate formed of a rigid substrate. A semiconductor device 50a according to another comparative example in which the interposer substrate 1a is formed of a rigid substrate will be described. The semiconductor device 50a according to the comparative example shown in FIG. 14 has a structure in which the expansion card 20 on which the storage device 4 and the high-speed I / O interface component 5 are mounted is mounted. In general, the expansion card 20 is connected to the mother board 2 with a connector 21 or the like. However, when the interposer board 1a is large, when the expansion card 20 is mounted on the mother board 2, there are more restrictions on the mounting position and the like. May occur and the expansion card 20 may not be mounted on the motherboard 2. Even in such a case, as shown in the comparative example shown in FIG. 14, the expansion cards 20 are stacked on the interposer substrate 1a and connected to the motherboard 2 in a three-dimensional manner via the expansion cards 20. It is possible to mount the mounting component 40 such as the / O interface component 5. However, when the expansion card 20 is arranged on the interposer substrate 1a using the large interposer substrate 1a, the number of the mounting components 40 that can be directly mounted on the mother board 2 is limited. That is, since there is only a gap corresponding to one solder ball 7 between the interposer substrate 1a and the mother board 2, the storage device 4, high-speed I / O interface component 5, electronic component 6 and the like are mounted between them. The component 40 cannot be mounted.

  On the other hand, in the semiconductor device 50 according to the first embodiment, the interposer substrate 1 is configured by connecting the first component mounting portion 10 and the second component mounting portion 11 with the flexible substrate 12, and the second component mounting portion. 11 can remove the spatial restrictions on the motherboard 2 by mounting the first component mounting portion 10 on the motherboard 2 without mounting on the motherboard 2. As a result, even when the first component mounting unit 10 and the second component mounting unit 11 are combined and the entire interposer substrate 1 is enlarged, the high-speed I / O interface is not provided in the area of the mother board 2 immediately below the second component mounting unit 11. Since the mounting components 40 such as the component 5 and the electronic component 6 can be mounted, the area where the motherboard 2 can be mounted can be increased.

  Further, since the mother board 2 and the second component mounting part 11 are separated, the influence of thermal expansion or the like when the interposer substrate 1 is mounted on the mother board 2 can be reduced, and the countermeasure is not required. Thereby, since the thermal stress applied to the solder ball 7 is relaxed, it is possible to suppress the breakage of the joint portion between the interposer substrate 1 and the mother board 2 and to realize high reliability and low cost.

  Furthermore, as the mounting component 40 to be mounted on the second component mounting portion 11, a general component similar to that mounted on the motherboard 2 can be adopted, and no special special component is used. The general mounting technology can be applied with almost no change. Thereby, the structure which increases the area which can mount components of the motherboard 2 or makes it highly reliable is realizable at low cost.

  Further, by mounting and consolidating components having a large number of signals for transmitting high-speed signals such as the arithmetic device 3 and the storage device 4 on the interposer substrate 1, wiring for transmitting high-speed signals can be eliminated on the mother board 2. Therefore, in the mother board 2 larger than the interposer substrate 1, it is not necessary to consider the high frequency characteristics for the base material to be used, so that a cheaper one can be applied. Moreover, since the number of wirings of the mother board 2 is reduced, the number of substrate layers can be reduced. Thereby, the design of the mother board 2 can be facilitated and the cost can be reduced. As a result, the speed and size of the system can be increased at a low cost without reducing the reliability.

  In addition, by providing the second cooling plate 9 in the second component mounting portion 11, heat can be radiated by the second cooling plate 9 even if the mounting component 40 mounted on the second component mounting portion 11 is a high heat generating component. Become. If cooling is not necessary, the second cooling plate 9 may be used as a simple structure for fixing the second component mounting portion 11. Further, the second cooling plate 9 may be a structure integrated with the first cooling plate 8, and the second component mounting portion 11 may be fixed by being stacked on the first cooling plate 8.

  The semiconductor device 50 according to the first embodiment is configured as a BGA (Ball Grid Array) package, but can be applied to various other integrated circuit packages such as a CGA (Column Grid Array) package. It is. The interposer substrate of the first embodiment is also applied to a structure in which components and devices mounted on the interposer substrate 1 and the mother board 2 are exchanged, and a structure of the semiconductor device 50 that is composed of a single type of component or device. A structure with 1 is established.

Embodiment 2. FIG.
FIG. 4 is a cross-sectional view showing the configuration of the semiconductor device according to the second embodiment. The semiconductor device 50 according to the second embodiment has the same configuration as that of the semiconductor device 50 according to the first embodiment, but the second component mounting unit 11 of the interposer substrate 1 has a high-speed I / O in addition to the storage device 4. The interface component 5 is mounted. That is, the mounting components 40 mounted on the second component mounting unit 11 are the storage device 4 and the high-speed I / O interface component 5. As a result, the arithmetic device 3, the storage device 4, and the high-speed I / O interface component 5 are not connected to the motherboard 2 but are connected within the interposer substrate 1, and can communicate via the interposer substrate 1. It has become. The mounting component 40 mounted on the second component mounting unit 11 may be an I / O interface component other than the high-speed I / O interface component 5.

  Next, the operation will be described. FIG. 5 is a block diagram showing the operation of the semiconductor device according to the second embodiment. The arithmetic device 3 reads the program stored in the storage device 4 and performs calculation and control, thereby executing processing according to the instruction content of the read program. The storage device 4 is also used for temporary storage of a program executed in the arithmetic device 3 and data used when the arithmetic device 3 executes processing according to the program. The arithmetic device 3, the storage device 4, and the high-speed I / O interface component 5 are connected via the CPU bus 19 in the interposer substrate 1 to exchange data. The high-speed I / O interface component 5 outputs data processed by the arithmetic device 3 and the storage device 4 to an external device (not shown), or receives data from the external device and receives the data from the external device. 4 for input.

  The interposer substrate 1 is electrically and physically connected to the mother board 2 by the solder balls 7 only at the first component mounting portion 10, and the second component mounting portion 11 is connected to the first component mounting portion by the flexible substrate 12. 10 is connected. Accordingly, the storage device 4 and the high-speed I / O interface component 5 are not directly mounted on the mother board 2, but use the property of the flexible substrate 12 that can be deformed with a weak force, so that the second component mounting unit 11 can be used. Thus, it can be fixed and arranged at a position away from the motherboard 2. In addition, since the second component mounting unit 11 is not mounted on the motherboard 2, the storage device 4 and the high-speed I / O interface component 5 can be mounted on both surfaces of the second component mounting unit 11, and the mounting density Can be increased.

  The semiconductor device 50 according to the second embodiment configured as described above can obtain the same effects as the semiconductor device 50 according to the first embodiment.

  In addition, since the high-speed I / O interface component 5 is mounted on the second component mounting portion 11, it can be directly pulled out of the housing in which the motherboard 2 is installed. That is, when the high-speed I / O interface component 5 is mounted on the interposer substrate 1a of the comparative example shown in FIG. 13, the relay substrate connected to the high-speed I / O interface component 5 using a connector and a cable. Is screwed to a housing in which the mother board 2 is installed, so that a connection portion with an external device needs to be pulled out of the housing. On the other hand, in the semiconductor device 50 according to the second embodiment, the flexible substrate 12 is deformed to change the relative position of the second component mounting unit 11 with respect to the first component mounting unit 10, thereby installing the mother board 2 internally. It is possible to place the second component mounting portion 11 in the vicinity of the housing to be pulled out and to pull out the high-speed I / O interface component 5 directly to the outside of the housing. Thereby, the number of parts can be reduced, and the cost and mass can be greatly reduced. Further, by utilizing the characteristics of the flexible substrate 12, even a case with a special structure can be adapted.

  Furthermore, since the high-speed I / O interface component 5 can be pulled out directly to the outside of the housing, the signal crossing between the boards can be reduced, and a cable or the like is not required. Can be reduced. As a result, it is possible to increase the speed of data exchange between the semiconductor device 50 and the external device, and thus increase the speed of information processing.

Embodiment 3 FIG.
FIG. 6 is a cross-sectional view showing the configuration of the semiconductor device according to the third embodiment. The semiconductor device 50 according to the third embodiment has the same configuration as that of the semiconductor device 50 according to the second embodiment. 5 is implemented. In addition to this, the semiconductor device 50 according to the third embodiment mounts the free space optical communication component 13 as the mounting component 40 on the second component mounting portion 11 and mounts these mounting components 40 on the interposer substrate 1 Are mounted on the motherboard 2. That is, the mounting components 40 mounted by the second component mounting unit 11 are the storage device 4, the high-speed I / O interface component 5, and the free space optical communication component 13. As a result, the arithmetic device 3, the storage device 4, the high-speed I / O interface component 5, and the free space optical communication component 13 are connected in the interposer substrate 1 without being connected to the motherboard 2, and the interposer substrate 1 is connected to the interposer substrate 1. It is possible to communicate through the network.

  The free space optical communication component 13 includes a semiconductor laser that emits light with a narrow directivity such as a VCSEL (Vertical Cavity Surface Emitting LASER), and a photodiode having a light receiving element, and uses infrared rays as a carrier wave. Thus, data can be transmitted and received. The carrier wave used in the free space optical communication component 13 may be other than infrared rays, and may be light having a wavelength that can be transmitted and received using a semiconductor laser and a photodiode. Further, as an example of a component that emits light used in the free space optical communication component 13, a VCSEL that is a semiconductor laser suitable for free space optical communication by emitting light on a surface is described. The component to be used may be a semiconductor laser other than the VCSEL, or a component other than the semiconductor laser may be used. The component that emits light used in the free-space optical communication component 13 is not particularly limited as long as it has narrow directivity and emits light traveling straight far.

  Next, the operation will be described. FIG. 7 is a block diagram showing the operation of the semiconductor device according to the third embodiment. The arithmetic device 3 reads the program stored in the storage device 4 and performs calculation and control, thereby executing processing according to the instruction content of the read program. The storage device 4 is also used for temporary storage of a program executed in the arithmetic device 3 and data used when the arithmetic device 3 executes processing according to the program. The arithmetic device 3, the storage device 4, the high-speed I / O interface component 5, and the free space optical communication component 13 are connected via the CPU bus 19 in the interposer substrate 1 to exchange data. The high-speed I / O interface component 5 outputs data processed by the arithmetic device 3 and the storage device 4 to an external device (not shown), or receives data from the external device and receives the data from the external device. 4 for input.

  The free space optical communication component 13 converts the data, which is an electrical signal processed by the arithmetic device 3 and the storage device 4, into light by a light emitting diode and transmits the light, and the light propagating through the free space is transmitted again by the photodiode. Is converted into an electrical signal and received. Thereby, very high-speed communication is performed between the arithmetic devices 3 in the housing in which the mother board 2 is installed.

  The interposer substrate 1 is electrically and physically connected to the mother board 2 by the solder balls 7 only at the first component mounting portion 10, and the second component mounting portion 11 is connected to the first component mounting portion by the flexible substrate 12. 10 is connected. Thereby, the storage device 4, the high-speed I / O interface component 5, and the free space optical communication component 13 use the property of the flexible substrate 12 that can be deformed with a weak force without being directly mounted on the mother board 2. Thus, the second component mounting portion 11 can be fixed and arranged at a position away from the motherboard 2. Since the second component mounting unit 11 is not mounted on the motherboard 2, the storage device 4, the high-speed I / O interface component 5, and the free space optical communication component 13 are mounted on both surfaces of the second component mounting unit 11. It is possible to increase the mounting density.

  The semiconductor device 50 according to the third embodiment configured as described above can obtain the same effects as the semiconductor device 50 according to the second embodiment.

  In addition, communication can be made between the arithmetic devices 3 in the housing in which the motherboard 2 is installed without going through the motherboard 2, via the free space optical communication component 13, so that the wiring length can be shortened. Further, the signal transfer between the substrates can be reduced. In addition, since a cable or the like is not required for communication between the arithmetic devices 3 in the housing, it is possible to reduce the cause of signal quality degradation. As a result, it is possible to increase the speed of data exchange between the arithmetic devices 3, and thus to increase the speed of information processing in the semiconductor device 50.

  In the third embodiment, communication between the arithmetic devices 3 is performed by optical communication using the free space optical communication component 13, but communication between the arithmetic devices 3 may be performed by wireless communication. It may be performed by wired communication having a cable or the like. Regardless of the communication means between the arithmetic devices 3, it is possible to increase the speed of information processing by mounting a plurality of interposer boards 1 on which the arithmetic devices 3 are mounted on the mother board 2 and performing communication between the arithmetic devices 3.

Embodiment 4 FIG.
FIG. 8 is a plan view showing the configuration of the semiconductor device according to the fourth embodiment. In the semiconductor device 50 according to the fourth embodiment, the interposer substrate 1 has a configuration in which the component mounting portions are connected to the four surfaces by the flexible substrate 12. Specifically, the interposer substrate 1 has the first component mounting portion 10 for the fixed mounting portion 30 as in the first to third embodiments, but the movable mounting portion 35 for the first to third embodiments. Unlike the above, the movable mounting portion 35 includes four components, that is, the third component mounting portion 14, the fourth component mounting portion 15, the fifth component mounting portion 16, and the sixth component mounting portion 17.

  The four movable mounting portions 35, that is, the third component mounting portion 14, the fourth component mounting portion 15, the fifth component mounting portion 16, and the sixth component mounting portion 17 are arranged on four sides of the first component mounting portion 10. Yes. That is, the third component mounting portion 14, the fourth component mounting portion 15, the fifth component mounting portion 16, and the sixth component mounting portion 17 are each side of the first component mounting portion 10 formed in a rectangular plate shape. It is arranged corresponding to. The third component mounting portion 14, the fourth component mounting portion 15, the fifth component mounting portion 16, and the sixth component mounting portion 17 are all flexible boards whose relative positions with respect to the first component mounting portion 10 can be changed. 12 is connected to the first component mounting unit 10.

  The first component mounting unit 10 is mounted on the motherboard 2, and the third component mounting unit 14, the fourth component mounting unit 15, the fifth component mounting unit 16, and the sixth component mounting unit 17 are directly mounted on the motherboard 2. By being connected to the first component mounting portion 10 by the flexible substrate 12 without being mounted, the flexible substrate 12 and the first component mounting portion 10 are electrically connected to the mother board 2.

  Arithmetic device 3, storage device 4, high-speed I / O interface component 5, free space optical communication component 13 and the like can be mounted in any combination on each component mounting portion on interposer substrate 1, and flexible substrate 12 It is a structure that enables communication in the housing in any combination and direction due to the characteristics of In the fourth embodiment, the arithmetic device 3 is mounted on the first component mounting unit 10 as in the first to third embodiments. The third component mounting unit 14, the fourth component mounting unit 15, the fifth component mounting unit 16, and the sixth component mounting unit 17 include the arithmetic device 3, the storage device 4, and the high-speed I / O interface that are the mounting components 40. Component 5 and free space optical communication component 13 are mounted. Specifically, the arithmetic device 3 is mounted on the third component mounting unit 14, the storage device 4 is mounted on the fourth component mounting unit 15, and the high-speed I / O interface component is mounted on the fifth component mounting unit 16. 5 is mounted, and the free space optical communication component 13 is mounted on the sixth component mounting portion 17. The mounting component 40 mounted on the fifth component mounting unit 16 may be an I / O interface component other than the high-speed I / O interface component 5.

  In the fourth embodiment, the configuration in which four movable mounting portions 35 are provided is shown. However, the shape, structure, arrangement, quantity, and the like of the fixed mounting portion 30 and the movable mounting portion 35 may be variously changed. it can. That is, the interposer substrate 1 has a plurality of movable mounting portions 35, and the plurality of movable mounting portions 35 are disposed around the fixed mounting portion 30, and each has a relative position with respect to the fixed mounting portion 30. What is necessary is just to be connected to the fixed mounting part 30 by the flexible substrate 12 so that change is possible. Further, the mounting component 40 to be mounted on the movable mounting portion 35 may be other than the combination described above with respect to the movable mounting portion 35, and other than the mounting component 40 described above may be mounted.

Embodiment 5. FIG.
FIG. 9 is a plan view showing the configuration of the semiconductor device according to the fifth embodiment. The semiconductor device 50 according to the fifth embodiment uses a plurality of interposer substrates 1 in the fourth embodiment, and arranges the free space optical communication components 13 mounted on each interposer substrate 1 so as to face each other. Optical communication can be performed between the interposer substrates 1 using the optical communication component 13.

  Next, the operation will be described. FIG. 10 is a block diagram illustrating the operation of the apparatus according to the fifth embodiment. The difference from the third embodiment is that three interposer substrates 1 on which a free-space optical communication component 13 is mounted on the motherboard 2 in addition to the storage device 4 and the high-speed I / O interface component 5 in the second embodiment. This is the point of implementation. In the fifth embodiment, the interposer substrate 1 is disposed so that the free space optical communication components 13 face each other between the adjacent interposer substrates 1, or is free space between the adjacent interposer substrates 1. The free space optical communication component 13 is mounted at a position where the optical communication components 13 face each other.

  By configuring the interposer substrate 1 as described above, communication can be performed in any combination and direction between two or more arithmetic devices 3 in the housing without going through the motherboard 2. Thereby, even when three or more arithmetic devices 3 are mounted on the mother board 2, extremely high-speed communication can be performed between the arithmetic devices 3.

  Further, since the free space optical communication component 13 is mounted on the movable mounting portion 35 that can change the relative positional relationship with respect to the first component mounting portion 10, the flexible substrate 12 is deformed to be movable mounted. By moving the part 35, the free space optical communication component 13 can be pulled out of the housing in which the mother board 2 is installed. Thereby, optical communication can be performed between cases using the free space optical communication component 13, and high-speed communication can also be performed between cases. In addition, since the flexible substrate 12 has flexibility and flexibility, when performing communication between the cases, this property of the flexible substrate 12 is used to obtain a case with a special structure. Can also be adapted.

Embodiment 6 FIG.
FIG. 11 is a cross-sectional view showing the configuration of the semiconductor device according to the sixth embodiment. The semiconductor device 50 according to the sixth embodiment has the same configuration as the semiconductor device 50 according to the first embodiment, but the arithmetic device 3 is mounted on the first component mounting unit 10 by the IC socket 18. That is, the arithmetic device 3 is mounted on the first component mounting portion 10 via the IC socket 18, and the arithmetic device 3 is electrically connected to the first component mounting portion 10 via the IC socket 18. .

  The semiconductor device 50 according to the sixth embodiment has a structure that can be applied to the arithmetic device 3 of an LGA (Land Grid Array) package by mounting the IC socket 18 on the interposer substrate 1. As a result, the same effects as in the first embodiment can be obtained also in the arithmetic device 3 of the LGA package.

Embodiment 7 FIG.
FIG. 12 is a cross-sectional view showing the configuration of the semiconductor device according to the seventh embodiment. The semiconductor device 50 according to the seventh embodiment has the same configuration as that of the semiconductor device 50 according to the first embodiment, but the interposer substrate 1 is mounted on the mother board 2 with the IC socket 18. That is, the first component mounting unit 10 is mounted on the motherboard 2 via the IC socket 18, and the first component mounting unit 10 is electrically connected to the motherboard 2 via the IC socket 18.

  The semiconductor device 50 according to the seventh embodiment has a structure that is compatible with the LGA package interposer substrate 1 by mounting the IC socket 18 on the mother board 2. As a result, the same effects as those of the first embodiment can be obtained in the interposer substrate 1 of the LGA package.

  The configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

  1, 1a Interposer board, 2 Motherboard, 3 Processing unit, 4 Storage device, 5 High speed I / O interface parts (I / O interface parts), 6 Electronic parts, 7 Solder balls, 8 First cooling plate, 9 2 cooling plate, 10 first component mounting portion, 11 second component mounting portion, 12 flexible substrate (flexible connection portion), 13 free space optical communication component, 14 third component mounting portion, 15 fourth component mounting portion , 16 5th component mounting portion, 17 6th component mounting portion, 18 IC socket, 19 CPU bus, 20 expansion card, 21 connector, 30 fixed mounting portion, 35 movable mounting portion, 40 mounting component, 50, 50a semiconductor device.

Claims (8)

An interposer board mounted on the motherboard;
A plurality of mounting components mounted on the interposer substrate and the motherboard;
With
The interposer substrate is
A fixed mounting portion that is mounted on the motherboard while mounting a part of the plurality of mounting components,
A movable mounting part for mounting a part of the plurality of mounting parts;
The fixed mounting part and the movable mounting part are electrically connected to each other by being connected to the fixed mounting part and the movable mounting part, and the fixed mounting part and the movable mounting part are Flexible connections that can change the general position;
A semiconductor device comprising:   The semiconductor device according to claim 1, wherein the mounting component mounted on the movable mounting portion is a storage device.   The semiconductor device according to claim 1, wherein the mounting component mounted on the movable mounting portion is an I / O interface component.   The semiconductor device according to claim 1, wherein the mounting component mounted on the movable mounting portion is a free space optical communication component. The interposer substrate has a plurality of the movable mounting parts,
5. The plurality of movable mounting parts are connected to the fixed mounting part by the flexible connection part so that a relative position with respect to the fixed mounting part can be changed independently of each other. The semiconductor device according to any one of the above.   6. The semiconductor device according to claim 5, wherein the mounting components mounted on the movable mounting portion are a storage device, an I / O interface component, and a free space optical communication component.   The semiconductor device according to claim 1, wherein an arithmetic device is mounted on the fixed mounting portion via an IC socket.   The semiconductor device according to claim 1, wherein the fixed mounting portion is mounted on the motherboard via an IC socket.

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