JP2017107439A - Film sensor module and flexible substrate for film sensor module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact film sensor module in which the width of an area of a flexible substrate that extends to the outside of a sensor substrate is suppressed.SOLUTION: The film sensor module comprises: a sensor substrate 4 on which first electrodes 10a-10e arrayed in the row direction (direction X) are provided; the same number of first peripheral leader wirings 1a-1e as the number of rows of the array that are connected at one end to one end of the first electrodes 10a-10e; the same number of second peripheral leader wirings 2a-2e as the number of rows of the array that are connected at one end to the other end of the first electrodes 10a-10e; the same number of joining wirings 5a3-5e3 as the number of rows of the array that are provided so as to be located inward of the sensor substrate 4 and connect the other ends of the first peripheral leader wirings 1a-1e and the second peripheral leader wirings 2a-2e connected to the first electrodes 10a-10e of the same row; and a flexible substrate 35 having the same number of first outside leader wirings 5a7-5e7 as the number of rows of the array that are connected at one end to the joining wiring 5a3-5e3.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a film sensor module used for a capacitive touch panel and a flexible substrate used by being connected to the film sensor module.

   2. Description of the Related Art In recent years, touch panel type input devices (hereinafter simply referred to as “touch panels”) have been adopted for operation units of various electronic devices such as mobile terminals such as smartphones and tablets and car navigation systems. The touch panel is configured by bonding a position input device capable of detecting a contact position of a finger or the like on a display screen of a display device such as a liquid crystal panel or an organic EL (Electro-Luminescence). The touch panel system is roughly classified into a resistance film type, a capacitance type, an optical type, and an ultrasonic type, and each has a merit / demerit, and is used properly according to the application.

  In a capacitive touch panel, for example, a capacitance induced when a finger or the like is brought into contact with an electrode portion formed of a matrix-like translucent conductive film formed on a single substrate such as glass or film. By detecting this change as a weak current change, the contact position (touch position) on the touch panel is specified. The lower the electrical resistance of the film sensor, the lower the time constant and the higher the signal frequency. Therefore, when the electrical resistance of the sensor portion is lowered, it becomes possible to respond with high accuracy to a touch using an input auxiliary device such as a stylus whose conductivity is lower than that of a finger, and to respond to a large screen with high quality. The electrostatic capacitance type includes a surface type and a projection type.

  As a film sensor which is a sensor part of a projection type capacitive touch panel, two layers of transparent electrodes comprising a plurality of electrodes provided orthogonally to each other in the X and Y directions on the substrate and arranged in a grid shape, two layers If the metal wiring connected to the interlayer insulating layer between the transparent electrodes and the two transparent electrodes is configured, multi-touch capable of simultaneously detecting two touch positions at the intersections in the X direction and the Y direction is possible. A method of achieving both low resistance and transparency by using an electrode having a mesh structure in which fine conductive metal fine line patterns are stretched in a lattice pattern on the transparent electrode is disclosed (see Patent Document 1).

  Here, in an electronic device or the like on which a capacitive touch panel is mounted, the film sensor is disposed inside the casing in a state of a “film sensor module” connected to a flexible substrate. For electronic devices equipped with capacitive touch panels, it is very important to make them thinner and lighter, so there is an effective technology to reduce the width of the area where the flexible substrate protrudes outside the sensor substrate inside the housing. There is a strong demand.

JP 2012-53644 A

  The present invention has been made paying attention to the above-described problems, and provides a compact film sensor module in which the width of the region where the flexible substrate projects to the outside of the sensor substrate is suppressed, and a flexible substrate for the film sensor module The purpose is to do.

  In order to solve the above-described problems, an aspect of the film sensor module according to the present invention includes a sensor substrate in which a sensor region is configured by providing an array of a plurality of first electrodes arranged in a row direction on a main surface. One end of each first electrode array is electrically connected to one end of each first electrode array, and the same number of first peripheral lead wires as the number of rows in the array and each other end of each first electrode array are electrically connected to one end. Are connected to the arrangement of the first electrodes in the same row, and are connected to the arrangement of the first electrodes in the same row. The same number of connecting portions as the number of rows electrically connecting the other ends of the one peripheral lead wire and the second peripheral lead wire, one end being electrically connected to each of the connecting portions, and the other end being a driving IC The same number of first external lead wires as the number of rows connected to And summarized in that comprising a Rekishiburu substrate.

  According to another aspect of the flexible substrate for a film sensor module according to the present invention, a sensor substrate in which a plurality of first electrodes arranged in a row direction are provided on a main surface to form a sensor region; One end is electrically connected to each one end of the array of electrodes, and one end is electrically connected to the same number of first peripheral lead wires as the number of rows of the array and the other end of the first electrode array. The sensor board of the film sensor module provided with the same number of second peripheral lead wires as the number of rows is connected to the sensor board so that the main surface of the sensor board is located inside the sensor board when viewed from the front. The same number of coupled wirings as the number of rows, and electrically connecting the other ends of the first peripheral lead wires and the second peripheral lead wires connected to the array of the first electrodes in the same row, One end of each And summarized in that comprises the same number of external lead-out wiring and the number of rows and the other end is connected to the driving IC with the gas connecting, the.

  In another aspect of the flexible substrate for a film sensor module according to the present invention, a sensor substrate in which a plurality of first electrodes arranged in a row direction are provided on a main surface to form a sensor region; One end is electrically connected to each one end of the array of one electrode, and the same number of first peripheral lead wires as the number of rows of the array is connected to one end, and one end is electrically connected to each of the other ends of the first electrode array. The same number of second peripheral lead wires connected as the number of rows and the other ends of the first peripheral lead wires and the second peripheral lead wires connected to the arrangement of the first electrodes in the same row are connected in common. Are connected to the sensor substrate of the film sensor module, and one end is electrically connected to each of the common external connection terminals and the other end is connected to the driving IC. The same number of connected lines And summarized in that comprises section lead wires.

  Therefore, according to the film sensor module and the flexible substrate for the film sensor module according to the present invention, a compact film sensor module in which the width of the region where the flexible substrate protrudes outside the sensor substrate is suppressed, and the flexible for the film sensor module. A substrate can be provided.

It is an upper surface figure explaining the outline of the composition of the film sensor module concerning a 1st embodiment typically. It is the elements on larger scale which showed typically the 1st external connection terminal of the film sensor module concerning a 1st embodiment, the 2nd external connection terminal, and the 3rd external connection terminal in the state where a flexible substrate was removed. It is an upper surface figure explaining the outline of the composition of the flexible substrate of the film sensor module concerning a 1st embodiment typically. It is the elements on larger scale explaining typically the connection state of the 1st external connection terminal of the film sensor module concerning a 1st embodiment, the 2nd external connection terminal, and a flexible substrate. It is the sectional view on the AA line in FIG. It is an upper surface figure explaining the outline of the composition of the film sensor module concerning a comparative example typically. It is a top view explaining typically the outline of the composition of the film sensor module concerning a 2nd embodiment. It is the elements on larger scale which showed typically the common external connection terminal and 3rd external connection terminal of the film sensor module which concern on 2nd Embodiment in the state except the flexible substrate. It is a top view which illustrates typically the outline of the structure of the flexible substrate of the film sensor module which concerns on 2nd Embodiment. It is the elements on larger scale which illustrate typically the connection state of the common connection terminal of the film sensor module which concerns on 2nd Embodiment, and a flexible substrate.

  The first and second embodiments of the present invention will be described below. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, the drawings are schematic, and it should be noted that the relationship between the thickness and the planar dimensions, the ratio of the thickness of each device and each member, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  Further, the directions of “left and right” and “up and down” in the following description are merely definitions for convenience of description, and do not limit the technical idea of the present invention. Thus, for example, if the paper is rotated 90 degrees, “left and right” and “up and down” are read interchangeably, and if the paper is rotated 180 degrees, “left” becomes “right” and “right” becomes “left”. Of course.

<First Embodiment>
As shown in the top view of FIG. 1, the film sensor module according to the first embodiment is provided on the sensor substrate 4 on which the sensor area of the film sensor is configured on the main surface, An array of five first electrodes 10a to 10e arranged at substantially equal intervals in the row direction (X direction), which is exemplified by a series of rhombuses extending in the left-right direction indicated by a solid line in FIG.

  Further, the film sensor module has one end electrically connected to each of one end of the array of the five first electrodes 10a to 10e arrayed in the row direction. Peripheral lead wires 1a to 1e and five second peripheral lead wires having the same number as the number of rows of the first electrodes 10a to 10e, one end of which is electrically connected to each of the other ends of the array of the first electrodes 10a to 10e. And wirings 2a to 2e.

  The film sensor module electrically connects the other ends of the first peripheral lead wires 1a to 1e and the second peripheral lead wires 2a to 2e connected to the array of the first electrodes 10a to 10e in the same row. The same number of five coupled wirings 5a3 to 5e3 as the number of rows of the first electrodes 10a to 10e are provided.

The film sensor module has the same number of first external lead wires as the number of rows of the first electrodes 10a to 10e whose one end is electrically connected to each of the connecting wires 5a3 to 5e3 and the other end is connected to the driving IC. And a flexible substrate 35 having 5a7 to 5e7.
The coupled wirings 5a3 to 5e3 correspond to the “coupled portion” in the first embodiment. In the following description, the flexible substrate is also referred to as “FPC”.

The film sensor module is provided on the sensor substrate 4 and is exemplified by a series of rhombuses extending in the vertical direction indicated by broken lines in FIG. 1, and the column direction (Y direction) orthogonal to the row direction (X direction). The second electrodes 20a to 20i are arranged on the sensor substrate 4 with one end connected to one end of the second electrodes 20a to 20i. There are nine third peripheral lead wires 3a to 3i in the same number as the number of columns.
In the first embodiment, the X direction shown in FIG. 1 is described as the “row direction” and the Y direction is described as the “column direction” orthogonal to the row direction. Of course, can be configured.

  Further, the driving substrate 7 is connected to the film sensor module via the FPC 35. As shown in the top view of FIG. 3, the driving substrate 7 is provided between the first electrodes 10a to 10e and the second electrodes 20a to 20i. Thus, a driving IC 71 is mounted that performs computation processing by transmitting and receiving signals for detecting the touch position.

  Further, on the surface of the sensor substrate 4 where the second electrodes 20a to 20i are provided and located on the back side of the paper surface in FIG. 1, a front plate 9 made of glass or the like and serving as a cover for the touch panel sensor is provided. ing. That is, FIG. 1 shows a state that can be seen from the inside of the touch panel sensor when the outside of the touch panel operator is located.

The sensor substrate 4 is a sheet member having a substantially rectangular main surface, made of an insulating material, and can be made of, for example, a polyethylene terephthalate (PET) film that is advantageous in terms of cost. Moreover, a polyethylene naphthalate (PEN) film, a polyimide-type film, etc. can be used at the point which improves heat resistance. Furthermore, it is comprehensively selected from various viewpoints such as optical characteristics such as retardation, mechanical characteristics such as tensile strength, chemical resistance, surface treatment suitability, and film forming characteristics.
Other polyethylene resins, polypropylene resins, methacrylic resins, cyclic polyolefin resins, polystyrene resins, acrylonitrile- (poly) styrene copolymers (AS resins), acrylonitrile-butadiene-styrene copolymers (ABS resins), Films made from polyvinyl chloride resins, poly (meth) acrylic resins, polycarbonate resins, polyester resins, polyamide resins, polyamideimide resins, and the like can also be used.

  The thickness of the sensor substrate 4 is determined in consideration of the capacitance between the electrodes in the X direction and the electrodes in the Y direction. For example, if the capacitance is in the range of about 0.1 pF to about 10 pF, the thickness of the sensor substrate 4 can be set in the range of about 20 μm to about 130 μm.

  The first electrodes 10a to 10e are configured by a group of first sensor node lines 10a to 10e, which are structures in which nodes forming electrode elements for detecting the respective positions in the X direction are linearly assembled. Yes. In FIG. 1, five first sensor node lines 10 a to 10 e formed on the surface side of the sensor substrate 4 are illustrated by solid lines.

  The second electrodes 20a to 20i are configured by a group of second sensor node lines 20a to 20i, which are structures in which nodes forming electrode elements for detecting the respective positions in the Y direction are gathered in a linear shape. ing. In FIG. 1, nine second sensor node lines 20 a to 20 i formed on the back surface side of the sensor substrate 4 and drawn through the sensor substrate 4 are illustrated by broken lines.

  The first sensor node lines 10a to 10e can be made of, for example, a copper foil having a line width of about 3 to 4 μm, and high visibility and low resistance are achieved. Since the first sensor node lines 10a to 10e are light-shielding metal wirings, the line width can be set to about 20 μm or less in consideration of visibility.

The left ends of the first sensor node lines 10a to 10e in FIG. 1 are connected to one ends of the first peripheral lead wires 1a to 1e, and the other ends of the first peripheral lead wires 1a to 1e are 2, the first external connection terminals 1a5 to 1e5 are connected to each other.
Further, the respective right ends of the first sensor node lines 10a to 10e in FIG. 1 are connected to one ends of the second peripheral lead wires 2a to 2e, and the other ends of the second peripheral lead wires 2a to 2e are As shown in FIG. 2, it is connected to the second external connection terminals 2a5 to 2e5.

  Similarly to the first sensor node lines 10a to 10e, the second sensor node lines 20a to 20i have line widths, and high visibility and low resistance are achieved. One ends of the third peripheral lead wires 3a to 3i are connected to the respective lower ends of the second sensor node lines 20a to 20i in FIG. 1, and the other ends of the third peripheral lead wires 3a to 3i are As shown in FIG. 2, they are connected to the third external connection terminals 3a5 to 3i5, respectively.

As shown in FIG. 1, the first sensor node lines 10 a to 10 e and the second sensor node lines 20 a to 20 i are arranged so as to intersect with each other in a matrix when the sensor substrate 4 is viewed from the upper surface, and each rhombus is combined. A mesh structure is constructed.
Although not shown for convenience of explanation, copper wiring further intersects the inside of each rhombus of the first sensor node lines 10a to 10e and the second sensor node lines 20a to 20i in FIG. Thus, a plurality of grid structures appearing in a diamond shape having a smaller diameter are formed, and a mesh structure having a denser opening is formed.
As described above, a sensor region having a substantially rectangular shape as a whole is configured by a set of sensor nodes having a mesh structure formed on the sensor substrate 4. The length of one side of the mesh opening is appropriately determined in consideration of the aperture ratio.

Next, the first external connection terminals 1a5 to 1e5, the second external connection terminals 2a5 to 2e5, and the third external connection terminals 3a5 to 3i5 will be specifically described.
First, the third external connection terminals 3a5 to 3i5 form a group of nine corresponding to the nine second peripheral lead wires 2a to 2e, and the third peripheral lead wire 3a around the sensor area as shown in FIG. In the region in the vicinity of the end of the lower sensor substrate 4 in FIG. 1 from which 3 to 3i are pulled out, nine pieces are arranged at substantially central positions in the long side direction of the sensor substrate 4 at equal intervals along the long side. It is installed side by side.

  Although the nine external connection terminals 3a5 to 3i5 illustrated by dotted lines in FIG. 2 are substantially rectangular, the shape is not limited to a rectangle but may be appropriately changed. In the following description, for the sake of convenience, the rectangular long side of the lower sensor substrate 4 in FIG. 1 is defined and used as a “long side on the drawer side”.

  Next, the second external connection terminals 2a5 to 2e5 form a group of five corresponding to the five second peripheral lead wires 2a to 2e. In the vicinity of the left side of the third external connection terminals 3a5 to 3i5 in FIG. 2 with a small gap from the group of third external connection terminals 3a5 to 3i5, five pieces are equally spaced along the long side, respectively. It is installed side by side.

In addition, the first external connection terminals 1a5 to 1e5 form a group of five corresponding to the five first peripheral lead wires 1a to 1e, and the first external connection terminals 1a5 to 1e5 The two external connection terminals 2a5 to 2e5 are arranged adjacent to each other in the vicinity of the left side in FIG. 2 with a group of second external connection terminals 2a5 to 2e5 through a slight gap.
The five first external connection terminals 1a5 to 1e5 are arranged in parallel at equal intervals along the long side.

  Five first external connection terminals 1a5 to 1e5 are arranged in the order of 1a5, 1b5, 1c5,... From the left side to the right side in FIG. Are arranged in the order of 2a5, 2b5, 2c5,... From the right side to the left side in FIG.

  Specifically, in the arrangement region of the first external connection terminals 1a5 to 1e5 and the second external connection terminals 2a5 to 2e5, two peripheral leads are provided on the first sensor node line 10a in the uppermost stage in FIG. The two external connection terminals 1a5 and 2a5 connected via the wirings 1a and 2a are positioned on the outermost side among the ten external connection terminals 1a5 to 1e5 and 2a5 to 2e5. Then, the two external connection terminals 1b5 and 2b5 connected to the first sensor node line 10b in the second stage from the top in FIG. 1 are positioned inside the outermost external connection terminals 1a5 and 2a5. The two external connection terminals 1c5 and 2c5 connected to the third sensor node line 10c at the third stage are located inside the external connection terminals 1b5 and 2b5, and the ten external connection terminals 1a5 to 1e5. 2a5 to 2e5 are arranged from the outside toward the inside according to the arrangement order of the first sensor node lines 10a to 10e.

That is, the external connection terminals of the first external connection terminals 1a5 to 1e5 and the second external connection terminals 2a5 to 2e5 connected to the first sensor node lines 10a to 10e in the same row are the first external connection terminals. It arrange | positions right and left symmetrically centering | focusing on the clearance gap between the arrangement | positioning area | region of 1a5 to 1e5, and the arrangement | positioning area | region of 2nd external connection terminal 2a5 to 2e5.
The first external connection terminals 1a5 to 1e5, the second external connection terminals 2a5 to 2e5, and the third external connection terminals 3a5 to 3i5 are all provided on the same straight line extending in the left-right direction in FIG. It arrange | positions so that it may have an area | region.

  Next, the first peripheral lead wires 1a to 1e, the second peripheral lead wires 2a to 2e, and the third peripheral lead wires 3a to 3i will be specifically described. The first peripheral lead wires 1a to 1e, the second peripheral lead wires 2a to 2e, and the third peripheral lead wires 3a to 3i are all made of a copper foil or the like in the same manner as the sensor node lines 10a to 10e and 20a to 20i. It is a metal wiring and can be configured at low cost and with low resistance.

Further, the first peripheral lead wires 1a to 1e and the second peripheral lead wires 2a to 2e can be formed simultaneously and integrally with the first sensor node lines 10a to 10e in the manufacturing process. Similarly, the third peripheral lead wires 3a to 3i can be formed simultaneously and integrally with the second sensor node lines 20a to 20i.
The first peripheral lead wires 1a to 1e, the second peripheral lead wires 2a to 2e, and the third peripheral lead wires 3a to 3i are made as wide as possible to reduce the resistance in regions where there is no need to see through. For example, a line width in the range of 0.02 mm to 0.5 mm can be formed.

  First, as shown in FIG. 1, the third peripheral lead wires 3a to 3i extend from the sensor node line side toward the center of the long side on the lead side so as to be integrated at the center of the long side. As shown in FIG. 2, the third peripheral lead wires 3a to 3i are linearly arranged along the Y direction provided between the integrated positions and the corresponding third external connection terminals 3a5 to 3i5. It has the orthogonal part 3a3-3i3 extended in parallel.

  Next, as shown in FIG. 1, the first peripheral lead wires 1a to 1e are connected to the sensor from the left end portion of the first sensor node lines 10a to 10e in FIG. 1 in the peripheral region on the left side of the sensor region. Each extends in parallel so as to be drawn out of the region. Thereafter, the first peripheral lead wires 1a to 1e are bent by approximately 90 ° toward the long side on the lead side and extend toward the long side on the lead side along the Y direction.

  The first peripheral lead wires 1a to 1e are extended from the end of the long side on the lead side so as to go around the peripheral region of the sensor region from the left side to the bottom side at a position between the sensor region and the long side on the lead side. Each extends toward the center. That is, the first peripheral lead wires 1a to 1e are arranged in the X direction (or the Y direction) from the top to the bottom in FIG. 1 so as to go from the left end side of the sensor substrate 4 to the center of the long side on the lead side. ), The wiring path is shortened.

  As shown in FIG. 1, the first peripheral lead wires 1a to 1e correspond to the first end portions on the left side of the sensor substrate 4 and the direct portions 3a3 to 3i3 of the third peripheral lead wires 3a to 3i, respectively. 1 Bent toward the external connection terminals 1a5 to 1e5. The first external lead wires 5a7 to 5e7 are provided between the bent positions and the corresponding first external connection terminals 1a5 to 1e5, and the straight portions 1a3 to 1e3 extending linearly parallel to each other along the Y direction. have.

  Next, as shown in FIG. 1, the second peripheral lead wires 2 a to 2 e are connected to the sensor from the right end in FIG. 1 of the first sensor node lines 10 a to 10 e in the peripheral region on the right side of the sensor region. Each extends in parallel so as to be drawn out of the region. Thereafter, the second peripheral lead wires 2a to 2e are bent by approximately 90 ° toward the long side on the lead-out side and extend toward the long side on the lead-out side along the Y direction. Then, the second peripheral lead wires 2a to 2e extend from the end of the long side on the lead side so as to wrap around the sensor region from the right side to the bottom side at a position between the sensor region and the long side on the lead side. Each extends in a skew pattern toward the center.

  As shown in FIG. 2, the five second peripheral lead wires 2a to 2e are respectively connected between the right end portion of the sensor substrate 4 and the direct portions 3a3 to 3i3 of the third peripheral lead wires 3a to 3i. It bends toward the long side on the lead-out side, and then bends approximately 90 ° toward the first peripheral lead-out wirings 1a to 1e. The second peripheral lead wires 2a to 2e have straight portions 2a3 to 2e3 extending from the bent position toward the first peripheral lead wires 1a to 1e and extending linearly in parallel along the X direction.

  The direct portions 2a3 to 2e3 are a group of first peripheral lead wires 1a to 1b so as to cross the region where the direct portions 3a3 to 3i3 of the third peripheral lead wires 3a to 3i are formed on the back surface side of the sensor substrate 4. It extends to the vicinity of 1e. The second peripheral lead wires 2a to 2e are bent by approximately 90 ° toward the corresponding second external connection terminals 2a5 to 2e5 in the vicinity of the first peripheral lead wires 1a to 1e, and correspond to the bent positions, respectively. The second external connection terminals 2a5 to 2e5 are configured to extend in a straight line along the Y direction in parallel with each other.

  In this way, the direct portions 2a3 to 2e3 of the second peripheral lead wires 2a to 2e and the direct portions 3a3 to 3i3 of the third peripheral lead wires 3a to 3i are spatially separated between the thickness separations of the sensor substrate 4. They are provided so as to be orthogonal to each other.

  Next, the FPC 35 will be specifically described. As shown in FIG. 3, the FPC 35 has a substantially rectangular base end portion 50 positioned on the drive substrate 7 side when attached to the sensor substrate 4, and a connection portion side of the base end portion 50 to the sensor substrate 4. The base film (50, 51, 52) having the first substrate connecting portion 51 and the second substrate connecting portion 52 each having a substantially rectangular shape, which are separated from each other and are arranged in parallel. A base film (50, 51, 52) consists of resin materials, such as PET which has insulation.

Further, the FPC 35 is a group of coupled wirings of five substantially U-shaped lines indicated by dotted lines provided on one main surface of the first board connecting portion 51 located on the back side of the paper surface when viewed from the front in FIG. 5a3-5e3.
The FPC 35 has the same height as the coupling wirings 5a3 to 5e3 on one main surface of the first substrate connection part 51, and one end is connected to one end of the coupling wirings 5a3 to 5e3. There are five groups of first external lead wires 5a7 to 5e7 which are provided over the portion 50 and are shown by dotted lines in FIG.

Further, the FPC 35 is provided on one main surface of the second substrate connection portion 52 at the same layer height as the coupling wirings 5a3 to 5e3, and is a group of nine straight lines shown by dotted lines in FIG. Two external lead wires 6a to 6i are provided.
The FPC 35 includes a cover layer (not shown) provided on the coupling wires 5a3 to 5e3, the first external lead wires 5a7 to 5e7, and the second external lead wires 6a to 6i.

The first external lead wires 5a7 to 5e7 connect the first sensor node lines 10a to 10e and the driving IC 71 of the drive substrate 7, and the second external lead wires 6a to 6i are connected to the second sensor node lines 20a to 20e. 20i and the driving IC 71 are connected.
The coupling wires 5a3 to 5e3, the first external lead wires 5a7 to 5e7, and the second external lead wires 6a to 6i are the first peripheral lead wires 1a to 1e, the second peripheral lead wires 2a to 2e, and the third peripheral lead wires 3a to 3a. Similarly to 3i, it can be configured by metal wiring such as copper foil.

As shown in the top view of FIG. 4, the coupling wiring 5 a 3 having the largest U shape among the five coupling wirings 5 a 3 to 5 e 3 is provided on the outermost side in the first substrate connecting portion 51. Further, a coupling wire 5b3 having the second largest U-character among the five coupling wires 5a3 to 5e3 is provided inside the U-shape of the coupling wire 5a3, and further, the inside of the U-shape of the coupling wire 5b3. Is provided with a coupling wire 5c3 having the third largest U-shape among the five coupling wires 5a3 to 5e3, and five U-shaped coupling wires 5a3 to 5e3 are arranged in a nested manner. Has been.
In FIG. 4, for convenience of explanation, the outlines of the first external lead wires 5a7 to 5e7 located between the base film (50, 51, 52) and the sensor substrate 4 are highlighted with solid lines. .

The coupling wires 5a3 to 5e3 and the first external lead wires 5a7 to 5e7 are integrally formed inside the FPC 35. The coupling wires 5a3 to 5e3 and the first external lead wires 5a7 to 5e7 are parallel to each other and provided at substantially equal intervals in the facing portions.
The ends of the first external lead wires 5a7 to 5e7 on the opposite side to the coupled wires 5a3 to 5e3 are connected to a predetermined wire inside the drive substrate 7 and connected to the drive IC 71.

  The second external lead wires 6a to 6i are linearly extending in the Y direction toward the lower side in FIG. 3, and are provided in parallel with each other at substantially equal intervals. The ends of the second external lead wires 6 a to 6 i on the side opposite to the sensor substrate 4 are connected to predetermined wires inside the drive substrate 7.

  As shown in FIG. 4, on the surface side of the sensor substrate 4, one end of each of the coupling wires 5a3 to 5e3 is connected to the corresponding first external connection terminals 1a5 to 1e5 by, for example, a thermocompression bonding method or the like. 5a1 to 5e1 are formed. The other ends of the coupling wires 5a3 to 5e3 are respectively connected to the corresponding second external connection terminals 2a5 to 2e5, and five crimping portions 5a5 to 5e5 are formed in the same manner as the one end side.

  Further, on the back surface side of the sensor substrate 4, the second external lead wires 6 a to 6 i of the FPC 35 are provided with corresponding third peripheral lead wires by a thermocompression bonding method or the like, as shown by the dotted line 6 a 5 illustrated on the right side in FIG. .. Are connected to the third external connection terminals 3a5 to 3i5 of the wirings 3a to 3i, respectively, so that nine crimping parts 6a5,.

As shown in the sectional view of FIG. 5, the first sensor node lines 10 a to 10 e and the second sensor node lines 20 a to 20 i formed on both surfaces of the sensor substrate 4 are connected to the single-sided wiring of the FPC 35. At this time, as shown in FIG. 1 and FIG. 3, the wiring drawn from the first sensor node lines 10 a to 10 e is the five first peripheral lead wirings 1 a to 1 e in the inner region on the sensor substrate 4. And ten wires composed of a pair of five second peripheral lead wires 2a to 2e.
However, these ten wirings are connected to each other by using the five coupling wirings 5a3 to 5e3 located on the sensor substrate 4 inside the FPC 35, and the five coupling wirings 5a3 to 5e3 are further connected to the five wirings 5a3 to 5e3. The external lead wires 5a7 to 5e7 are connected, and the first sensor node lines 10a to 10e and the driving IC 71 outside the sensor substrate 4 are connected.

  That is, the number of surrounding lead wires 1a to 1e and 2a to 2e, which are twice the number (5) of the first sensor node lines 10a to 10e (5) formed on the sensor substrate 4, are connected to the driving IC 71. When electrically connecting, ten external lead wires are not required outside the sensor substrate 4, and the first external lead wires 5a7 to 5e7 corresponding to the number (five) of the first sensor node lines 10a to 10e are provided. If used, it is enough.

(Comparative example)
On the other hand, in the case of the film sensor module according to the comparative example shown in FIG. 6 that does not have the coupling wirings 5a3 to 5e3, the film shown in FIG. As in the case of the sensor module, nine third external connection terminals (not shown) to which nine third peripheral lead wires 3a to 3i are connected are arranged in parallel.

Further, on the left side of the nine third external connection terminals, five first external connection terminals (not shown) connected to the five first peripheral lead wires 81a to 81e are arranged in parallel, On the right side of the third external connection terminal, five second external connection terminals (not shown) to which five second peripheral lead wires 82a to 82e are connected are arranged in parallel.
That is, in the film sensor according to the comparative example, the group of first external connection terminals and the group of second external connection ends are not coupled to each other, and each occupies an arrangement region on the sensor substrate 4.

Therefore, the FPC 85 of the film sensor module according to the comparative example uses the number of surrounding lead wirings (10) that is twice the number (5) of the first sensor node lines 10a to 10e on the sensor substrate 4 side for driving. In order to be electrically connected to the IC, ten external lead wires drawn out of the sensor substrate 4 must be provided.
Then, it is necessary to connect the ten external lead wires between the corresponding external lead wires inside the FPC 85 located outside the sensor substrate 4 or inside the drive substrate 87. Therefore, the base film of the FPC 85 shown in FIG. 6 was measured along the long side direction of the region projecting outside the sensor substrate 4 from the base film (50, 51, 52) of the FPC 35 shown in FIG. The width becomes long (w1 <w2).

  According to the film sensor module according to the first embodiment, twice the number of the first sensor node lines 10a to 10e drawn on the sensor substrate 4 from both sides of the first sensor node lines 10a to 10e. Even if the peripheral lead wires 1a to 1e and 2a to 2e are formed, the external lead wire 5a7 connected to the double peripheral lead wires 1a to 1e and 2a to 2e is provided outside the sensor substrate 4. The number of .about.5e7 may be the same as the number of first sensor node lines 10a to 10e.

For this reason, a compact film sensor can be constructed in which the width of the area of the FPC 35 connected to the film sensor that protrudes outside the sensor substrate 4 can be reduced. Can be increased.
Here, in the space on the drive substrate 7 side of the film sensor inside the housing, a number of members such as a display device for a touch panel and wiring are provided. Therefore, by reducing the size of the FPC 35 and the film sensor module, it is possible to make the touch panel sensor and the electronic device mounted with the touch panel sensor thinner and lighter.

  Moreover, according to the film sensor module which concerns on a 1st form, it further has the arrangement | sequence of 2nd sensor node line 20a-20i each extended in the column direction orthogonal to the row direction of 1st sensor node line 10a-10e. Therefore, a film sensor for a touch panel capable of multi-touch can be configured.

  Moreover, according to the film sensor module which concerns on a 1st form, since the film sensor and FPC35 are further equipped with the drive substrate 7 in which the drive IC71 is mounted, the variation as a module increases and the response | compatibility to a customer's various request | requirements Will increase.

  Further, according to the film sensor module according to the first embodiment, if the coupling wirings 5a3 to 5e3 are provided in the FPC 35, the sensor sensor 4 is connected to the array of the first sensor node lines 10a to 10e in the same row. The same number of coupling portions as the number of rows of the first sensor node lines 10a to 10e that electrically connect the other ends of the first peripheral lead wires 1a to 1e and the second peripheral lead wires 2a to 2e can be configured.

  Further, according to the film sensor module according to the first embodiment, the coupling wires 5a3 to 5e3, the first external lead wires 5a7 to 5e7, and the second external lead wires 6a to 6i are formed in one side wiring region of the FPC 35. Therefore, the thickness of the FPC 35 can be made compact.

  Also, according to the film sensor module according to the first embodiment, the first external connection terminals 1a5 to 1e5 and the second external connection terminals 2a5 to 2e5 to which the coupling wires 5a3 to 5e3 are connected are arranged side by side. The lengths of the coupling wirings 5a3 to 5e can be suppressed.

  Moreover, according to the film sensor module which concerns on a 1st form, five sets of external connection terminals which consist of each external connection terminal connected with 1st sensor node line 10a-10e of the same row are arrange | positioned symmetrically. The Further, five U-shaped coupling wires 5a3 to 5e3 are arranged in a nested manner according to the symmetrical arrangement of the five sets of external connection terminals. Therefore, five sets of external connection terminals can be connected in a compact manner within the same plane at the same height.

  According to the film sensor module according to the first embodiment, the first external connection terminals 1a5 to 1e5, the second external connection terminals 2a5 to 2e5, and the third external connection terminals 3a5 to 3i5 are all overlapped on the same straight line. Therefore, it is possible to collectively perform the thermocompression work at the same position during the thermocompression process.

  According to the film sensor module according to the first embodiment, the first external connection terminals 1a5 to 1e5 are arranged at equal intervals, and the second external connection terminals 2a5 to 2e5 are also arranged at equal intervals. It is possible to easily pattern the coupling wirings 5a3 to 5e of the corresponding FPC 35.

  Further, according to the film sensor module of the first embodiment, the direct portions 2a3 to 2e3 of the second peripheral lead wires 2a to 2e and the direct portions 3a3 to 3i3 of the third peripheral lead wires 3a to 3i are provided on the sensor substrate 4. Are provided so as to be orthogonal to each other spatially, thereby suppressing interference of electrical signals flowing in each other and taking into account the length of each surrounding lead wire. It is possible to achieve both reduction in resistance by shortening the length.

<Second Embodiment>
In the film sensor module according to the first embodiment, a group of first external connection terminals 1a5 to 1e5 and a group of second external connection terminals 2a5 to 2e5 are arranged close to each other on the sensor substrate 4, and these The FPC 35 is overlaid on the external connection terminals 1a5 to 1e5, 2a5 to 2e5, and the first external connection terminals 1a5 to 1e5 and the connection lines 5a3 to 5e3 provided in the region located inside the sensor substrate 4 inside the FPC 35 and The second external connection terminals 2a5 to 2e5 were coupled.
However, in the film sensor module according to the second embodiment, on the sensor substrate 4, a group of first peripheral lead wires 1a to 1e and a group of second peripheral lead wires 2a to 2e have common external connections. It is characterized by pre-bonding using a terminal.

As shown in the top view of FIG. 7, the film sensor module according to the second embodiment is provided on the sensor substrate 4 for the film sensor and arranged on the sensor substrate 4 in the row direction (X direction). And an array of five first electrodes 10a to 10e.
The film sensor module has five first electrodes having the same number as the number of rows, one end of which is electrically connected to one end of the five first electrodes 10a to 10e arranged in the row direction. Five second peripherals having the same number as the number of rows of the first electrodes 10a to 10e, one end of which is electrically connected to each of the other ends of the arrangement of the peripheral lead wires 11a to 11e and the first electrodes 10a to 10e. Lead wires 12a to 12e.

  Moreover, as shown in the top view of FIG. 8, the film sensor module includes the first electrodes 10a to 10e in the same row among the plurality of first peripheral lead wires 11a to 11e and the plurality of second peripheral lead wires 12a to 12e. The same number of five as the number of rows of the first electrodes 10a to 10e, to which the other ends of the first peripheral lead wires 11a to 11e and the second peripheral lead wires 12a to 12e are connected in common. Common external connection terminals 11a5 to 11e5 are provided. The common external connection terminals 11a5 to 11e5 correspond to the “joining part” in the second embodiment.

  Further, as shown in FIG. 7, the film sensor module is provided on the sensor substrate 4 and has nine second electrodes 20a to 20i arranged in the column direction (Y direction) orthogonal to the row direction (X direction). And the nine third peripheral lead wires 13a having the same number as the number of columns of the second electrodes 20a to 20i, which are provided on the sensor substrate 4 and connected to one end of each of the second electrodes 20a to 20i. To 13i. The other ends of the third peripheral lead wires 13a to 13i are connected to the third external connection terminals 13a5 to 13i5 as shown in FIG.

In addition, as shown in FIG. 7, the film sensor module includes first electrodes 10 a to 10 e in which one end is electrically connected to each of the common external connection terminals 11 a 5 to 11 e 5 and the other end is connected to the driving IC 71. A flexible substrate 55 having five first external lead wires 15a7 to 15e7 in the same number as the number of rows is connected to the film sensor module through the FPC 55. The drive substrate 7 is connected to the drive substrate 7 in FIG. As shown in the top view, a driving IC 71 for performing arithmetic processing is mounted.

  Each of the third external connection terminals 13a5 to 13i5 has a substantially rectangular shape, and a group of nine third external connection terminals 13a5 to 13i5 corresponds to the nine three peripheral lead wires 13a to 13i. The nine third external connection terminals 13a5 to 13i5 are spaced apart from each other at equal distances from the long side on the drawer side, and are arranged at a substantially central position in the long side direction of the sensor substrate 4 at equal intervals along the long side. It is installed.

  The common external connection terminals 11a5 to 11e5 are all substantially rectangular and have a group of five, and the third external connection terminals 13a5 to 13i5 have a region overlapping with the third external connection terminals 13a5 to 13i5. It is provided close to the next door. The common external connection terminals 11a5 to 11e5 are arranged in parallel at equal intervals along the long side on the drawer side. In addition, although illustration is omitted, a ground (GND) line or an adjustment signal is provided in a region in the vicinity of the common external connection terminals 11a5 to 11e5 for the first peripheral lead wires 11a to 11e and the second peripheral lead wires 12a to 12e. External connection terminals to which other wirings such as lines are connected are also provided.

  Similarly to the third peripheral lead wires 3a to 3i shown in FIG. 1, the third peripheral lead wires 13a to 13i are integrated at the center of the long side from the sensor node line side to the center of the long side on the lead side. And each of the third external connection terminals 13a5 to 13i5 corresponding to the integration position and extending in parallel to each other in a straight line along the Y direction. .

  In the peripheral region on the left side of the sensor region, the first peripheral lead wires 11a to 11e are parallel to each other so as to be drawn to the outside of the sensor region from the left end of the first sensor node lines 10a to 10e in FIG. After extending, similar to the wiring route of the first peripheral lead wires 1a to 1e shown in FIG. 1, it bends repeatedly and approaches the third peripheral lead wires 13a to 13i on the back surface side of the sensor substrate 4 as viewed from above. Is configured to do.

  As shown in FIG. 7, the first peripheral lead wires 11a to 11e correspond to the left end portion of the sensor substrate 4 and the direct portions 13a3 to 13i3 of the third peripheral lead wires 13a to 13i, respectively. Bending toward the common external connection terminals 11a5 to 11e5. The first peripheral lead wires 11a to 11e extend linearly in parallel with each other along the Y direction between the bent positions and the corresponding common external connection terminals 11a5 to 11e5.

  In the peripheral region on the right side of the sensor region, the second peripheral lead wires 12a to 12e are parallel to each other so as to be drawn to the outside of the sensor region from the right end in FIG. 7 of the first sensor node lines 10a to 10e. After the extension, similar to the wiring route of the second peripheral lead wires 2a to 2e shown in FIG. 1, it bends repeatedly and approaches the third peripheral lead wires 13a to 13i on the back surface side of the sensor substrate 4 as viewed from above. Is configured to do.

  As shown in FIG. 8, the second peripheral lead wires 12 a to 12 e are respectively drawn out between the right end portion of the sensor substrate 4 and the direct portions 13 a 3 to 13 i 3 of the third peripheral lead wires 13 a to 13 i. Are bent toward the common external connection terminals 11a5 to 11e5. The second peripheral lead wires 12a to 12e have straight portions 12a3 to 12e3 extending from the bent position toward the first peripheral lead wires 11a to 11e and extending linearly in parallel along the X direction. The direct portions 12a3 to 12e3 are arranged in a region between the long side of the sensor substrate 4 on the drawer side and the group of third external connection terminals 13a5 to 13i5.

  Further, the orthogonal portions 12a3 to 12e3 of the second peripheral lead wires 12a to 12e extend to the vicinity of the common external connection terminals 11a5 to 11e5. The second peripheral lead wires 12a to 12e are bent by approximately 90 ° toward the corresponding common external connection terminals 11a5 to 11e5 in the vicinity of the common external connection terminals 11a5 to 11e5, and the common corresponding to the bent positions, respectively. The external connection terminals 11a5 to 11e5 are configured to extend linearly along the Y direction in parallel with each other.

  As described above, each of the first peripheral lead wires 11a to 11e and the second peripheral lead wires 12a to 12e drawn from both ends of the group of first sensor node lines 10a to 10e by the common external connection terminals 11a5 to 11e5. The other end is electrically connected. That is, the common external connection terminals 11a5 to 11e5 also serve as the first external connection terminals 1a5 to 1e5 and the second external connection terminals 2a5 to 2e5 of the film sensor module according to the first embodiment shown in FIG.

  As shown in FIG. 9, the FPC 55 has a substantially rectangular base end portion 150 positioned on the drive substrate 7 side when attached to the sensor substrate 4, and a connection portion side of the base end portion 150 to the sensor substrate 4. Base films (150, 151, 152) each having a substantially rectangular first substrate connecting portion 151 and a second substrate connecting portion 152 that are separated from each other and arranged in parallel. A base film (150, 151, 152) consists of resin materials, such as PET which has insulation.

  Further, the FPC 55 is provided across the first substrate connecting portion 151 and the base end portion 150 on one main surface of the first substrate connecting portion 151 located on the back side of the paper surface when viewing FIG. 9 from the front. A group of first external lead wires 15a7 to 15e7 is formed of five straight lines indicated by dotted lines.

Further, the FPC 55 is a group of second external parts that are provided on one main surface of the second substrate connection portion 152 at the same layer height as the first external lead wires 15a7 to 15e7, and are formed by nine straight lines indicated by dotted lines. The lead wires 16a to 16i are provided.
The FPC 55 includes a cover layer (not shown) provided on the first external lead wires 15a7 to 15e7 and the second external lead wires 16a to 16i.
The first external lead wires 15a7 to 15e7 connect the first sensor node lines 10a to 10e and the driving IC 71 of the drive substrate 7, and the second external lead wires 16a to 16i are connected to the second sensor node lines 20a to 20e. 20i and the driving IC 71 are connected.

  The first external lead wires 15a7 to 15e7 and the second external lead wires 16a to 16i are made of copper, like the first peripheral lead wires 11a to 11e, the second peripheral lead wires 12a to 12e, and the third peripheral lead wires 13a to 13i. It can be composed of metal wiring such as foil.

  As shown in the top view of FIG. 10, on the surface side of the sensor substrate 4, one ends of the first external lead wires 15a to 15e are connected to the corresponding common external connection terminals 11a5 to 11e5 by a thermocompression bonding method or the like, respectively. The crimping | compression-bonding part 15a5-15e5 is comprised. The ends of the first external lead wires 15a to 15e on the side opposite to the sensor substrate 4 are connected to the driving IC 71 via a predetermined wiring inside the driving substrate 7.

  Further, on the back surface side of the sensor substrate 4, the second external lead wires 16 a to 16 i of the FPC 55 are provided with corresponding third peripheral lead wires by a thermocompression bonding method or the like as shown by the dotted line 16 a 5 illustrated on the right side in FIG. .. Are connected to the third external connection terminals 13a5 to 13i5 of the wirings 13a to 13i, respectively, so that nine crimping portions 16a5,. The ends of the second external lead wires 16a to 16i on the side opposite to the sensor substrate 4 are connected to the driving IC 71 via a predetermined wire inside the drive substrate 7 like the first external lead wires 15a to 15e. ing.

  That is, the orthogonal portions 12a3 to 12e3 of the second peripheral lead wires 12a to 12e and the second external lead wires 16a to 16i of the FPC 55 are provided so as to be spatially orthogonal to each other during the thickness separation of the sensor substrate 4. ing.

  In the film sensor module according to the second embodiment, the third external connection terminals 13a5 to 13i5, the common external connection terminals 11a5 to 11e5, the first peripheral lead wires 11a to 11e, the second peripheral lead wires 12a to 12e, the third The components other than the peripheral lead wires 13a to 13i and the FPC 55 are equivalent to the corresponding members of the same name of the film sensor module shown in FIGS.

In the film sensor module shown in FIGS. 7 to 10, the wiring drawn out from the first sensor node lines 10 a to 10 e is the five first peripheral lead wirings 11 a to 11 e in the inner region on the sensor substrate 4. And ten wires composed of a pair of five second peripheral lead wires 12a to 12e.
However, these ten wires are coupled to each other by five common external connection terminals 11a5 to 11e5 inside the sensor substrate 4. The first external lead wires 15a to 15e of the FPC 55 are connected to the common external connection terminals 11a5 to 11e5, the first sensor node lines 10a to 10e, the driving IC 71 of the driving substrate 7 outside the sensor substrate 4, and Is connected.

  That is, also in the film sensor module shown in FIGS. 7 to 10, the number of the first sensor node lines 10a to 10e (5) formed on the sensor substrate 4 is twice the number (10). When the lead wires are electrically connected to the driving IC 71, ten external lead wires are not required on the outside of the sensor substrate 4, and the number of the first sensor node lines 10a to 10e (five) is drawn. Use of wiring is sufficient.

  According to the film sensor module according to the second embodiment, similarly to the film sensor module according to the first embodiment, the film is pulled out from both sides of the first sensor node lines 10a to 10e on the sensor substrate 4. Even if the number of the peripheral lead wires 11a to 11e and 12a to 12e is double the number of the first sensor node lines 10a to 10e, the double number of the peripheral lead wires is provided outside the sensor substrate 4. The number of external lead wires 15a to 15e to be connected to the wires 11a to 11e and 12a to 12e may be the same as the number of the first sensor node lines 10a to 10e.

  For this reason, a compact film sensor can be configured in which the width of the area of the FPC 55 connected to the film sensor that protrudes outside the sensor substrate 4 can be reduced. Can be increased.

Moreover, according to the film sensor module which concerns on a 2nd form, the orthogonal | vertical part 12a3-12e3 of 2nd periphery extraction wiring 12a-12e and 2nd external extraction wiring 16a-16i are between thickness separation of the sensor board | substrate 4. In the same manner as in the case of the second peripheral lead wires 2a to 2e and the third peripheral lead wires 3a to 3i of the film sensor module according to the first embodiment by being provided so as to be orthogonal to each other in space. Considering the parasitic capacitance, it is possible to achieve both suppression of interference of electric signals flowing in the wirings and reduction in resistance by shortening the lengths of the respective surrounding lead wirings.
Other effects of the film sensor module according to the second embodiment are the same as those of the film sensor module according to the first embodiment.

(Other embodiments)
Although the present invention has been described with reference to the above-described disclosed embodiments and examples, it should not be understood that the descriptions and drawings constituting a part of this disclosure limit the present invention. From this disclosure, it should be understood that various alternative embodiments, examples, and operational techniques will become apparent to those skilled in the art.
For example, the shape of the coupling wirings 5a3 to 5e3 shown in FIG. 4 is U-shaped, but the shape of the coupling wiring of the present invention is not limited to the U-shape. Other shapes may be employed as long as the coupling wiring is disposed inside the external connection terminal provided at the end of the sensor substrate. Even if the coupling wiring is not arranged inside the external connection terminal, it may have a shape that does not protrude from the substrate.

Further, for example, in the film sensor module according to the first and second embodiments, the first sensor node lines 10a to 10e are provided on the front surface of the sensor substrate 4, and the second sensor node lines 20a to 20i are provided on the back surface. However, the present invention is not limited to this, and the first sensor node lines 10a to 10e and the second sensor node lines 20a to 20i may be provided on one surface of the sensor substrate 4 via an insulating layer.
In addition, a substrate in which the first sensor node lines 10a to 10e are provided on one main surface and a substrate in which the second sensor node lines 20a to 20i are provided on one main surface separately from the substrate are provided with electrodes. You may comprise the film sensor which bonded the surfaces which are not provided back to back.

  Further, the mesh structure of the sensor region is not limited to that shown in FIG. 1. For example, the rhombus of the sensor node line on the front surface side and the rhombus of the sensor node line on the back surface side may be arranged with a half pitch shift. It can be configured by combining squares instead of rhombuses.

  In addition, the first external connection terminals 1a5 to 1e5, the second external connection terminals 2a5 to 2e5, and the third external connection terminals 3a5 to 3i5 shown in FIG. However, they may be arranged at indefinite intervals.

In addition, in FIGS. 1 to 10, sensor node lines using copper wiring have been described as examples of the electrodes in the X direction and the Y direction. However, the electrodes (electrode arrays) are contact points such as fingertips or styluses as touch panel sensors. In addition to the copper wiring that can capture the change in capacitance due to proximity or the like, the spread of transparent electrodes made of indium tin oxide (ITO), for example, is remarkable, but the present invention depends on the resistance value of the wiring. The merit in applying to a transparent electrode that requires a structure in which both sides of the sensor substrate are drawn out from both ends by the first and second peripheral lead wirings is more remarkable.
In the case of ITO, the resistance value is usually about several tens of ohms / cm ² even if it is low, so there is no problem in a small product such as a portable terminal. However, when the size is 15 inches or more, especially 20 inches or more, the ITO electrode Wiring resistance increases, and the detection sensitivity of the projected capacitive touch panel may decrease.

Further, when the sensor substrate is a film, the heat resistance of the film is up to about 250 ° C., so that the amorphous ITO formed by a film forming method such as sputtering is crystallized at a sufficiently high temperature of 250 ° C. or higher. It cannot be fired, has a high resistance value, and may be inferior in transparency. Therefore, when ITO is used in combination with the present invention, the effect is high.
Moreover, as shown in FIGS. 1-10, if the mesh-like electrode by metal wirings, such as copper, is used, it is advantageous at the point which can suppress the surface resistance and can obtain the thin, light, and high quality film sensor for touch panels. is there. Since the film type is lightweight and difficult to break, the manufacturing cost is low, and it has flexibility, it has the merit that it is easy to remove bubbles when it is bonded to a display device or a front plate and to be bonded easily. Further, it is effective not only for small-sized products such as portable terminals but also for medium-sized and large-sized products such as televisions and electronic blackboards that require productivity such as large area and easy bonding.

  As described above, the present invention includes various embodiments and the like not described above, and the technical scope of the present invention is defined only by the invention specifying matters according to the appropriate claims from the above description. Is.

1a to 1e first peripheral lead wires 1a3 to 1e3 direct portions 1a5 to 1e5 first external connection terminals 2a to 2e second peripheral lead wires 2a3 to 2e3 direct portions 2a5 to 2e5 second external connection terminals 3a to 3i third peripheral lead wires 3a3 to 3i3 Direct part 3a5 to 3i5 Third external connection terminal 4 Sensor substrate 5a1 to 5e1 Crimping part 5a3 to 5e3 Bonding wiring (coupling part)
5a5 to 5e5 Crimping portions 5a7 to 5e7 First external lead wires 6a to 6i Second external lead wires 6a5 to 6i5 Crimping portion 6a7 External lead portion 7 Driving substrate 9 Front plate 10a to 10e First electrode (first sensor node line)
11a to 11e First peripheral lead wires 11a5 to 11e5 Common external connection terminals (coupling portions)
12a to 12e Second peripheral lead wires 12a3 to 12e3 Direct portions 13a to 13i Third peripheral lead wires 13a3 to 13i3 Direct portions 13a5 to 13e5 Third external connection terminals 15a to 15e First external lead wires 16a to 16i Second external lead wires 16a5 pressure bonding parts 20a to 20i second electrode (second sensor node line)
35 Flexible PCB (FPC)
50 Base end portion 51 First substrate connecting portion 52 Second substrate connecting portion 55 Flexible substrate (FPC)
71 Driving IC
81a to 81e first peripheral lead wires 82a to 82e second peripheral lead wires 85 flexible substrate (FPC)
87 Driving substrate 150 Base end portion 151 First substrate connecting portion 152 Second substrate connecting portion w1 FPC width w2 FPC width

Claims (15)

A sensor substrate in which a sensor region is configured by providing an array of a plurality of first electrodes arranged in a row direction on a main surface;
The same number of first peripheral lead wires as the number of rows of the array, one end of which is electrically connected to one end of the array of the first electrodes;
The same number of second peripheral lead wires as the number of rows, one end of which is electrically connected to each of the other ends of the first electrode array;
Each of the first peripheral lead wires and the second peripheral lead wires provided so as to be located inside the sensor substrate when the main surface is viewed from the front and connected to the array of the first electrodes in the same row. The same number of coupling portions as the number of rows electrically connecting the other ends;
A flexible substrate having the same number of first external lead wires as the number of rows, one end of which is electrically connected to each of the coupling portions and the other end of which is connected to a driving IC;
A film sensor module comprising:   2. The film sensor module according to claim 1, further comprising an array of a plurality of second electrodes respectively extending in a column direction orthogonal to a row direction of the first electrodes.   The film sensor module according to claim 2, further comprising a driving substrate on which the driving IC is mounted.   The film sensor module according to claim 3, wherein the coupling portion is a coupling wiring provided on the flexible substrate.   5. The film sensor module according to claim 4, wherein both of the first external lead-out wiring and the coupling wiring are provided on one surface of the flexible substrate. A first external connection terminal provided on the sensor substrate and connected to the other end of the first peripheral lead wire;
A second external connection terminal that is arranged next to the first external connection terminal on the sensor substrate and to which the other end of the second peripheral lead wire is connected;
The coupling wiring is provided between the first external connection terminal and the second external connection terminal and electrically connected to the first external connection terminal and the second external connection terminal. The film sensor module according to claim 5. Each of the first external connection terminal and the second external connection terminal comprises a plurality of external connection terminals,
The plurality of first external connection terminals and the plurality of second external connection terminals are connected to the array of the first electrodes in the same row, and the first external connection terminals and the second external connection terminals are connected to the plurality of the plurality of first external connection terminals. The film sensor module according to claim 6, wherein the film sensor module is symmetrically arranged around a gap between the first external connection terminal and the plurality of second external connection terminals.   The film sensor module according to claim 7, wherein the coupling wiring is U-shaped when the main surface of the sensor substrate is viewed from the front.   9. The film sensor module according to claim 8, wherein the plurality of first external connection terminals and the plurality of second external connection terminals are arranged so as to have overlapping regions on the same straight line. The plurality of first external connection terminals, the first external connection terminals are arranged at equal intervals,
10. The film sensor module according to claim 9, wherein each of the plurality of second external connection terminals has the second external connection terminals arranged at equal intervals. Provided with the same number of third peripheral lead wires as the number of columns of the second electrodes, provided on the sensor substrate and electrically connected to one end of the plurality of second electrode arrays,
11. The film sensor module according to claim 10, wherein one of the first peripheral lead-out wiring and the second peripheral lead-out wiring is arranged so as to be orthogonal to the third peripheral lead-out wiring.   The coupling portion is provided on the sensor substrate, and the other ends of the first peripheral lead wiring and the second peripheral lead wiring connected to the array of the first electrodes in the same row are connected in common. The film sensor module according to claim 3, wherein the number of common external connection terminals is the same as the number of rows. Provided with the same number of third peripheral lead wires as the number of columns of the second electrodes, provided on the sensor substrate and electrically connected to one end of each of the plurality of second electrode arrays;
The flexible substrate has the same number of second external lead wires as the number of columns, one end of which is electrically connected to each of the third peripheral lead wires and the other end is connected to the drive substrate;
13. The film sensor module according to claim 12, wherein one of the first peripheral lead-out wiring and the second peripheral lead-out wiring is arranged so as to be orthogonal to the second external lead-out wiring. A sensor substrate having a plurality of first electrode arrays arranged in a row direction on the main surface to form a sensor region and one end of each of the first electrode arrays are electrically connected. The same number of first peripheral lead wires as the number of rows of the array, and the same number of second peripheral lead wires as the number of rows, one end of which is electrically connected to each of the other ends of the array of the first electrodes. In a state of being connected to the sensor substrate of the film sensor module provided with
The first peripheral lead wire and the second peripheral lead wire provided so as to be located inside the sensor substrate when the main surface of the sensor substrate is viewed from the front, and connected to the array of the first electrodes in the same row The same number of coupled wires as the number of rows electrically connecting the other end of each of
The same number of external lead wires as the number of rows, one end of which is electrically connected to each of the coupling wires and the other end of which is connected to the driving IC,
A flexible substrate for a film sensor module comprising: A sensor substrate having a plurality of first electrode arrays arranged in a row direction on the main surface to form a sensor region and one end of each of the first electrode arrays are electrically connected. The same number of first peripheral lead wires as the number of rows of the array, and the same number of second peripheral lead wires as the number of rows, one end of which is electrically connected to each of the other ends of the array of the first electrodes. And the same number of common external connection terminals as the number of rows to which the other ends of the first peripheral lead wires and the second peripheral lead wires connected to the array of the first electrodes in the same row are connected in common And is connected to the sensor substrate of the film sensor module,
A flexible substrate for a film sensor module comprising the same number of external lead wires as the number of rows, one end of which is electrically connected to each of the common external connection terminals and the other end of which is connected to a driving IC.

Images