JP2017092517A - Signal processing circuit, semiconductor integrated circuit device, oscillator, electronic apparatus, base station, and manufacturing method of signal processing circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-versatility signal processing circuit capable of outputting a plurality of information items relating to temperatures, and a manufacturing method thereof.SOLUTION: A semiconductor integrated circuit device comprises a signal processing circuit including: an amplifier circuit capable of outputting a signal based on a first reference signal and a first temperature signal; and a discrimination circuit capable of outputting a binary signal based on comparison of a second reference signal and a second temperature signal. Thus, information relating to a temperature based on the signal that the amplifier circuit can output and information relating to a temperature based on the binary signal that the discrimination circuit can output are outputted.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a signal processing circuit, a semiconductor integrated circuit device, an oscillator, an electronic device, a base station, and a signal processing circuit manufacturing method.

  A crystal oscillator used for a reference frequency signal source such as a communication device or a measuring instrument is required to have a stable output frequency with high accuracy against a temperature change. In general, an oven controlled crystal oscillator (OCXO) is known as a crystal oscillator that can achieve extremely high frequency stability. OCXO has a crystal unit housed in a constant temperature chamber (oven) controlled at a constant temperature. To achieve extremely high frequency stability, the temperature control deviation of the constant temperature chamber with respect to changes in ambient temperature is set. It is important to make it as small as possible.

  Patent Document 1 discloses a control circuit that can control a constant temperature bath of OCXO and output temperature information to the outside. By configuring the OCXO having means for controlling the oscillation frequency according to the temperature information output from the control circuit, it is possible to perform temperature compensation of the oscillation frequency based on the temperature signal inside the OCXO. It can be stabilized. Patent Documents 2 and 3 disclose OCXO that can notify the outside that the temperature has stabilized.

Japanese Patent No. 5114122 JP 2014-192578 A JP 2014-99808 A

  However, all of the inventions described in Patent Documents 1 to 3 correspond to both a case where temperature information is required in the external device and a case where information indicating that the temperature is stable is required in the external device. It is not possible.

  The present invention has been made in view of the above problems, and according to some aspects of the present invention, a highly versatile signal processing circuit capable of outputting a plurality of information on temperature and a method for manufacturing the same. Can be provided. Further, according to some aspects of the present invention, it is possible to provide a semiconductor integrated circuit device, an oscillator, an electronic device, and a base station using the signal processing circuit.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following aspects or application examples.

[Application Example 1]
The signal processing circuit according to this application example can output an amplification circuit capable of outputting a signal based on the first reference signal and the first temperature signal, and a binary signal based on a comparison between the second reference signal and the second temperature signal. A determination circuit.

  According to this application example, it is possible to realize a highly versatile signal processing circuit capable of outputting information on temperature based on a signal that can be output by the amplifier circuit and information on temperature based on a binary signal that can be output by the determination circuit. Can do.

[Application Example 2]
In the signal processing circuit according to the application example, the amplifier circuit operates based on a first enable signal, the determination circuit operates based on a second enable signal, and the output signal from the amplifier circuit and the determination The output signal from the circuit may be output from a common output terminal.

  According to this application example, based on the first enable signal and the second enable signal, information related to temperature based on the signal output from the amplifier circuit and information related to temperature based on the binary signal output from the determination circuit are output in common. A highly versatile signal processing circuit that can output from a terminal can be realized.

[Application Example 3]
The signal processing circuit according to the application example may further include an AND gate to which the output signal from the amplifier circuit, the output signal from the determination circuit, and the second enable signal are input.

  According to the signal processing circuit of the application example, when the amplifier circuit operates and the determination circuit stops, the second enable signal is output even if the intermediate potential signal output from the amplifier circuit is input to the AND gate. Therefore, it is possible to prevent a through current from flowing through the AND gate.

[Application Example 4]
The signal processing circuit according to the application example may further include an interface circuit that generates a signal indicating whether the temperature has reached a set temperature based on an output signal from the AND gate.

  According to the signal processing circuit according to this application example, a signal indicating whether or not the temperature has reached the set temperature can be output to the outside via the interface circuit.

[Application Example 5]
In the signal processing circuit according to the application example described above, a common reference signal may be input to the amplifier circuit and the determination circuit as the first reference signal and the second reference signal.

  According to this application example, a signal processing circuit having a simpler configuration can be realized.

[Application Example 6]
In the signal processing circuit according to the application example described above, a common temperature signal may be input to the amplifier circuit and the determination circuit as the first temperature signal and the second temperature signal.

  According to this application example, a signal processing circuit having a simpler configuration can be realized.

[Application Example 7]
In the signal processing circuit according to the application example, the first reference signal and the second reference signal are input from a common first input terminal, and the first temperature signal and the second temperature signal are shared by a second common signal. It may be input from an input terminal.

  According to this application example, a signal processing circuit having a simpler configuration can be realized.

[Application Example 8]
In the signal processing circuit according to the application example, the output signal from the amplifier circuit is output as a signal representing temperature, and the output signal from the determination circuit is used as a signal representing whether or not the temperature has reached a set temperature. It may be output.

  According to this application example, a highly versatile signal that can output temperature information based on the output signal from the amplifier circuit and information indicating whether the temperature has reached the set temperature based on the output signal from the determination circuit. A processing circuit can be realized.

[Application Example 9]
In the signal processing circuit according to the application example, the amplifier circuit may be a differential amplifier circuit, and the determination circuit may be a comparator.

  According to the signal processing circuit according to this application example, the differential amplifier circuit outputs the analog signal related to the temperature based on the first temperature signal, and the comparator outputs the binary signal related to the temperature based on the second temperature signal. It is possible to output with shortened rise time and fall time.

[Application Example 10]
A semiconductor integrated circuit device according to this application example includes any one of the signal processing circuits described above.

  According to this application example, it is possible to realize a highly versatile integrated circuit device capable of outputting information related to temperature based on a signal output from the amplifier circuit and information related to temperature based on a binary signal output from the determination circuit. .

[Application Example 11]
An oscillator according to this application example operates based on an oscillation element, an oscillation circuit that oscillates the oscillation element, a temperature detection element that detects an ambient temperature of the oscillation element, and a temperature detected by the temperature detection element A temperature control element; and any one of the signal processing circuits described above, wherein the first temperature signal and the second temperature signal are based on an output signal from the temperature detection element or an input signal to the temperature control element. Signal.

  According to this application example, since a highly versatile signal processing circuit that can output temperature information based on the signal output from the amplifier circuit and temperature information based on the binary signal output from the determination circuit is used, Various types of oscillators can be realized at a lower cost.

[Application Example 12]
An electronic apparatus according to this application example includes any one of the signal processing circuits described above or the oscillator described above.

[Application Example 13]
The base station according to this application example includes any of the signal processing circuits described above or the oscillator described above.

  According to these application examples, a highly versatile signal processing circuit capable of outputting information related to temperature based on the signal output from the amplifier circuit and information related to temperature based on the binary signal output from the determination circuit, or the signal processing circuit For example, an electronic device and a base station can be realized at a lower cost.

[Application Example 14]
The signal processing circuit manufacturing method according to the application example includes an amplifier circuit that outputs a signal based on the first reference signal and the first temperature signal, and a binary signal based on a comparison between the second reference signal and the second temperature signal. A method of manufacturing a signal processing circuit comprising a determination circuit for output and a storage unit, wherein either one of an output signal from the amplifier circuit and an output signal from the determination circuit is output from a common output terminal The step of setting the storage unit as described above.

  According to this application example, a highly versatile signal processing circuit that can output temperature information based on the output signal from the amplifier circuit and temperature information based on the output signal (binary signal) from the determination circuit is used. By changing the setting of the storage unit, a signal processing circuit corresponding to the application can be manufactured at low cost.

The figure which shows an example of the structure of the oscillator of this embodiment. The functional block diagram of the oscillator of this embodiment. The figure which shows the structural example of the temperature control circuit in this embodiment, and an output selection circuit. The figure which shows an example of the relationship between the internal temperature of the oven in this embodiment, the voltage of a 1st temperature signal, and the output voltage of an amplifier circuit. The figure which shows an example of the relationship between the internal temperature of the oven in this embodiment, the voltage of a 2nd temperature signal, and the output voltage of a determination circuit. The flowchart figure which shows an example of the procedure of the manufacturing method of the oscillator of this embodiment. The flowchart figure which shows an example of the detailed procedure of the temperature compensation adjustment process in this embodiment. The figure which shows the structural example of the temperature control circuit in the modification 1, and an output selection circuit. The figure which shows an example of the relationship between the internal temperature of the oven in the modification 1, the voltage of a 1st temperature signal, and the output voltage of an amplifier circuit. The figure which shows an example of the relationship between the internal temperature of the oven in the modification 1, the voltage of a 2nd temperature signal, and the output voltage of a determination circuit. The figure which shows the structural example of the temperature control circuit in the modification 2, and an output selection circuit. FIG. 10 is a diagram showing another configuration example of a temperature control circuit and an output selection circuit in Modification 2. FIG. 10 is a diagram illustrating a configuration example of an output selection circuit in a third modification. FIG. 10 is a diagram showing another configuration example of the output selection circuit in Modification 3. FIG. 3 is a functional block diagram illustrating an example of a configuration of an electronic apparatus according to the embodiment. The figure which shows an example of schematic structure of the base station of this embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. Also, not all of the configurations described below are essential constituent requirements of the present invention.

1. Oscillator 1-1. Structure of Oscillator FIG. 1 is a diagram showing an example of the structure of the oscillator of this embodiment, and is a cross-sectional view of the oscillator. As shown in FIG. 1, the oscillator 1 of the present embodiment includes an integrated circuit (IC) chip 2, an oscillation element 3, a package 4, an external terminal (external electrode) 6, a temperature control element 7, and a temperature detection element 8. It is comprised including.

  The package 4 is configured by bonding a case 4a and a base 4b.

A component mounting board 4c is provided in the internal space of the package 4 so as to face the base 4b, and an oven 9 is mounted on the upper surface of the component mounting board 4c. The IC chip 2 is mounted on the lower surface of the component mounting board 4c.

  The oscillation element 3 and the temperature detection element 8 are mounted on the upper surface of the component mounting board 9a, and the temperature control element 7 is mounted at a position facing the oscillation element 3 on the lower surface of the component mounting board 9a. It is housed in the internal space.

  Each terminal of the oscillation element 3, the temperature control element 7, and the temperature detection element 8 is electrically connected to each desired terminal of the IC chip 2 through a wiring pattern (not shown). Further, some terminals of the IC chip 2 are electrically connected to external terminals 6 provided on the surface of the package 4 through a wiring pattern (not shown).

  As the oscillation element 3, for example, a crystal vibration element, a SAW (Surface Acoustic Wave) resonance element, other piezoelectric vibration elements, a MEMS (Micro Electro Mechanical Systems) vibration element, or the like can be used. As a substrate material of the oscillation element 3, a piezoelectric single crystal such as crystal, lithium tantalate, and lithium niobate, a piezoelectric material such as piezoelectric ceramics such as lead zirconate titanate, or a silicon semiconductor material can be used. As an excitation means of the oscillation element 3, one using a piezoelectric effect may be used, or electrostatic driving using a Coulomb force may be used.

  The temperature detection element 8 detects the temperature around it and outputs a temperature detection signal having a voltage corresponding to the temperature. Since the temperature detection element 8 is accommodated in the internal space of the oven 9, the temperature of the internal space of the oven 9, in other words, the ambient temperature of the oscillation element 3 accommodated in the internal space of the oven 9 is detected. become. The temperature detection element 8 may be, for example, a thermistor (NTC thermistor (Negative Temperature Coefficient), PTC (Positive Temperature Coefficient) thermistor, etc.), platinum resistance, a temperature detection circuit using a semiconductor band gap, or the like. .

  The temperature control element 7 operates based on the temperature detected by the temperature detection element 8. The temperature control element 7 may be a heat generating element or a heat absorbing element. The temperature control element 7 may be, for example, a power transistor, a resistor, a Peltier element, or the like.

1-2. FIG. 2 is a functional block diagram of the oscillator 1 according to the present embodiment. As shown in FIG. 2, the oscillator 1 of this embodiment includes an oscillation element 3, a temperature control element 7 and a temperature detection element 8 housed in an oven 9, and an IC chip 2 for causing the oscillation element 3 to oscillate. The IC chip 2, the oscillation element 3, the temperature control element 7 and the temperature detection element 8 are accommodated in the package 4.

  In the present embodiment, the IC chip 2 is a semiconductor integrated circuit device and includes a signal processing circuit 5. The signal processing circuit 5 includes an oscillation circuit 10, an output circuit 20, a temperature control circuit 30, a regulator 40, a storage unit 50, an interface circuit 60, and an output selection circuit 70. The signal processing circuit 5 may have a configuration in which some of these elements are omitted or changed, or other elements are added.

  The storage unit 50 includes a nonvolatile memory 52 and a register 54, and is configured to be able to read / write the nonvolatile memory 52 and the register 54 from the external terminal 6 of the oscillator 1 via the interface circuit 60. ing.

The nonvolatile memory 52 is a storage unit for storing various control data, and is configured as a programmable ROM (PROM) capable of writing data. The non-volatile memory 52 may be, for example, various rewritable memories such as an EEPROM, or may be various rewritable memories such as a one-time PROM (which can be written only once). .

  The nonvolatile memory 52 stores oscillation control data for controlling the operation of the oscillation circuit 10, voltage control data for controlling the operation of the regulator 40, and temperature control data for controlling the operation of the temperature control circuit 30. May be. The oscillation control data is data for adjusting the oscillation stage current of the oscillation circuit 10, for example. The voltage control data is data for adjusting the internal power supply voltage, the reference voltage, and the reference current generated by the regulator 40, for example. The temperature control data is, for example, data for setting the internal temperature of the oven 9 (the temperature of the oscillation element 3), and the temperature detection output from the temperature detection element 8 to control the heat generation or heat absorption of the temperature control element 7. The threshold voltage data may be compared with a voltage based on the voltage of the signal. If the oscillation element 3 is an SC cut crystal resonator, the frequency temperature characteristic exhibits a quadratic curve, and the amount of frequency change per unit temperature is the smallest in the vicinity of the apex. May be data for setting the internal temperature of the oven 9 so that the temperature becomes the temperature near the apex. The non-volatile memory 52 may store control data for the output circuit 20.

  The nonvolatile memory 52 stores a first enable signal EN_AMP and a second enable signal EN_CMP for controlling the operation of the output selection circuit 70. In the present embodiment, the first enable signal EN_AMP and the second enable signal EN_CMP are each a 1-bit signal, but may be a multi-bit signal.

  Each data stored in the nonvolatile memory 52 is transferred from the nonvolatile memory 52 to the register 54 when the power of the IC chip 2 (signal processing circuit 5) is turned on (when the voltage of the power supply terminal rises from 0 V to a desired voltage). Transferred and held in register 54. Accordingly, the oscillation control data, temperature control data, and voltage control data held in the register 54 are input to the oscillation circuit 10, the temperature control circuit 30, and the regulator 40, respectively. The output selection circuit 70 receives the first enable signal EN_AMP and the second enable signal EN_CMP held in the register 54.

  The oscillation circuit 10 amplifies the output signal of the oscillation element 3 and feeds back to the oscillation element 3 to oscillate the oscillation element 3 and output a frequency signal (oscillation signal) based on the oscillation of the oscillation element 3. .

  As the oscillation circuit 10, circuits having various known configurations can be adopted. Examples of the circuit configured by the oscillation circuit 10 and the oscillation element 3 include a Pierce oscillation circuit, an inverter type oscillation circuit, a Colpitts oscillation circuit, and a Hartley oscillation circuit. Various oscillation circuits such as an oscillation circuit may be used.

  The output circuit 20 receives the oscillation signal output from the oscillation circuit 10, generates an oscillation signal for external output, and outputs it to the outside via the external terminal 6 of the oscillator 1. The output circuit 20 may be a differential output circuit such as an LVDS (Low Voltage Differential Signaling) circuit, a PECL (Positive Emitter Coupled Logic) circuit, or an LVPECL (Low Voltage PECL) circuit, or a single-ended output circuit. It may be. The output circuit 20 may divide the oscillation signal output from the oscillation circuit 10 and output the divided oscillation signal. For example, the frequency division ratio and output level of the frequency signal (oscillation signal) in the output circuit 20 may be controlled by the control data held in the register 54.

The temperature control circuit 30 receives a temperature detection signal output from the temperature detection element 8 and generates a temperature control signal for controlling heat generation or heat absorption of the temperature control element 7. For example, the temperature control circuit 30 controls the heat generation or heat absorption of the temperature control element 7 so that the voltage of the temperature detection signal is maintained at a desired voltage value corresponding to the temperature control data held in the register 54. Also good. As a result, the internal temperature of the oven 9 (temperature of the oscillation element 3) is controlled to be substantially constant regardless of the ambient temperature of the oscillator 1. Further, the temperature control circuit 30 outputs a first temperature signal Vt1 and a second temperature signal Vt2 based on the temperature detection signal.

  The temperature control element 7 controls the amount of heat generation or heat absorption based on the temperature control signal output from the temperature control circuit 30. For example, the temperature control element 7 may change the amount of heat generated or the amount of heat absorption according to the amount of current, and the amount of current flowing through the temperature control element 7 may be controlled based on the temperature control signal.

  The regulator 40 is based on the power supply voltage supplied from the power supply terminal of the oscillator 1 via the power supply terminal of the IC chip 2, and the oscillation circuit 10, the output circuit 20, the temperature control circuit 30, the storage unit 50, the interface circuit 60, and the output selection. Various internal power supply voltages and various reference voltages and reference currents for operating part or all of the circuit are generated.

  The output selection circuit 70 receives the first temperature signal Vt1 and the second temperature signal Vt2 output from the temperature control circuit 30, and the first enable signal EN_AMP and the second enable signal EN_CMP held in the register 54. In the present embodiment, in the nonvolatile memory 52 and the register 54, one of the first enable signal EN_AMP and the second enable signal EN_CMP is active (here, high level) and the other is inactive (here, low level). Is set as follows. When the first enable signal EN_AMP is active (high level), the output selection circuit 70 generates the output signal AMP_O based on the first temperature signal Vt1, and when the second enable signal EN_CMP is active (high level). Generates an output signal AMP_O based on the second temperature signal Vt2, and outputs it from the output terminal T1 of the signal processing circuit 5 to the outside via the external terminal 6 of the oscillator 1.

  Further, when the second enable signal EN_CMP is active (high level), the output selection circuit 70 generates a digital signal N_AMP_O based on the second temperature signal Vt2 and outputs it to the interface circuit 60.

  Details of a configuration example of the output selection circuit 70 will be described later.

The interface circuit 60 reads / writes data from / to the nonvolatile memory 52 and the register 54 based on clock signals and data signals (command data, address data, write data, etc.) input from the plurality of external terminals 6 of the oscillator 1. Interface circuit. The interface circuit 60 outputs the digital signal N_AMP_O when the digital signal N_AMP_O output from the output selection circuit 70 is input and a read request command for the digital signal N_AMP_O is input from the external terminal 6 of the oscillator 1. The interface circuit 60 may be an interface circuit compatible with various serial buses such as SPI (Serial Peripheral Interface) and I ² C (Inter-Integrated Circuit), or may be an interface circuit compatible with a parallel bus. Good. However, in order to reduce the number of external terminals of the oscillator 1 and reduce the size of the package 4, it is desirable to configure the interface circuit 60 as an interface circuit compatible with a serial bus.

  The oscillator 1 according to the present embodiment configured as described above is a thermostatic oven oscillator that outputs an oscillation signal having a very stable frequency regardless of the ambient temperature of the oscillator 1 in a desired temperature range in which the operation of the oscillator 1 is guaranteed. (If the oscillation element 3 is a crystal resonator, it functions as an OCXO (Oven Controlled Crystal Oscillator)). In particular, a temperature-controlled oscillator with extremely high frequency stability can be realized by setting the oscillation element 3 to be an SC cut crystal resonator and setting temperature control data so that the temperature of the oscillation element 3 becomes a temperature near the apex. Can do.

1-3. Configuration of Temperature Control Circuit and Output Selection Circuit FIG. 3 is a diagram illustrating a specific configuration example of the temperature control circuit 30 and the output selection circuit 70. In FIG. 3, an NPN power transistor that functions as a heating element is used as the temperature control element 7 that is electrically connected to the temperature control circuit 30. An NTC thermistor is used as the temperature detection element 8 that is electrically connected to the temperature control circuit 30. In FIG. 3, when the temperature decreases, the resistance value of the temperature detection element 8 (NTC thermistor) increases and the voltage of the output signal (temperature detection signal) decreases, so that the operational amplifier 31 included in the temperature control circuit 30 The input potential difference increases. Conversely, when the temperature rises, the resistance value of the temperature detection element 8 (NTC thermistor) decreases and the voltage of the output signal (temperature detection signal) rises, so the input potential difference of the operational amplifier 31 decreases. The output voltage of the operational amplifier 31 is proportional to the input potential difference. The temperature control element 7 (NPN type power transistor) is turned on when the output voltage of the operational amplifier 31 is higher than a predetermined voltage value, and the higher the voltage value, the more current flows and the amount of heat generation increases. Further, the temperature control element 7 (NPN type power transistor) is turned off when the output voltage of the operational amplifier 31 is lower than a predetermined voltage value, and current does not flow, and the heat generation amount gradually decreases. Accordingly, the temperature detection element 8 (NTC thermistor) has a desired resistance value, that is, the internal temperature of the oven 9 (the ambient temperature of the oscillation element 3) is maintained at a desired set temperature. The operation of the control element 7 is controlled.

  In this embodiment, the resistance value of the variable resistor 32 changes according to the temperature control data, and the voltage (temperature control element 7 (NPN type) of the non-inverting input terminal of the operational amplifier 31 depends on the resistance value of the variable resistor 32. The operating condition) of the power transistor) changes. Accordingly, the output voltage value (temperature value of the temperature detection signal) of the temperature detection element 8 (NTC thermistor) when the temperature control element 7 (NPN type power transistor) is switched on and off is variable according to the temperature control data. Therefore, the set temperature of the oven 9 can be controlled.

  As shown in FIG. 3, the output selection circuit 70 includes an amplification circuit 80 and a determination circuit 90.

  The amplifying circuit 80 receives the first reference signal Vr1 and the first temperature signal Vt1, which is a signal based on the output signal from the temperature detection element 8 (NTC thermistor), and inputs the first reference signal Vr1 and the first temperature signal Vt1. Based signal can be output. In the present embodiment, the amplifier circuit 80 is a differential amplifier circuit including an operational amplifier 83 that operates using the resistor 81, the resistor 82, and the reference voltage Vreg2 generated by the regulator 40 as a power supply voltage. The first reference signal Vr1 generated by resistance division between the reference voltage Vreg3 generated by the regulator 40 and the ground is input to the non-inverting input terminal of the operational amplifier 83, and the temperature detection element is used as the first temperature signal Vt1. A temperature detection signal (a signal from the NTC thermistor) output by 8 is input to the inverting input terminal of the operational amplifier 83 via the resistor 81.

  In the present embodiment, the amplifier circuit 80 operates based on the first enable signal EN_AMP. Specifically, the amplifier circuit 80 operates when the first enable signal EN_AMP is active (high level), and the operational amplifier 83 generates a potential difference between the first reference signal Vr1 and the first temperature signal Vt1. A signal having a voltage amplified by an amplification factor corresponding to the resistance value and the resistance value of the resistor 82 is output.

  The amplifier circuit 80 stops when the first enable signal EN_AMP is inactive (low level), the output terminal of the operational amplifier 83 is open (high impedance), and does not output a signal based on the first temperature signal Vt1.

In FIG. 4, when the first enable signal EN_AMP is active (high level), the internal temperature of the oven 9 (ambient temperature of the oscillation element 3), the voltage of the first temperature signal Vt1 (solid line), and the amplifier circuit 80 (operational amplifier) 83) shows an example of the relationship with the output voltage (broken line). As shown in FIG. 4, the output signal from the amplifier circuit 80 (the operational amplifier 83) is a signal whose voltage changes according to the voltage of the first temperature signal Vt1, that is, a signal representing temperature. More specifically, the output signal from the amplifier circuit 80 (the operational amplifier 83) is a signal representing the internal temperature of the oven 9 (the ambient temperature of the oscillation element 3).

  Returning to FIG. 3, the determination circuit 90 receives the second reference signal Vr2 and the second temperature signal Vt2 that is a signal based on the input signal to the temperature control element 7 (NPN type power transistor). A binary signal based on the comparison with the second temperature signal Vt2 can be output. In the present embodiment, the determination circuit 90 is a comparator 91 that operates using the reference voltage Vreg2 generated by the regulator 40 as a power supply voltage. Then, an input signal of the temperature control element 7 (input signal to the base terminal of the NPN type power transistor) is input to the non-inverting input terminal of the comparator 91 as the second temperature signal Vt2, and the reference voltage Vreg3 generated by the regulator 40 and A second reference signal Vr2 generated by resistance division between the ground and the ground is input to the inverting input terminal of the comparator 91. For example, the voltage of the second reference signal Vr2 is set to the set temperature when the temperature control element 7 (NPN type power transistor) is switched from on to off or from off to on (the internal temperature of the oven 9 (ambient temperature of the oscillation element 3)). The output voltage value of the operational amplifier 31 is set so as to match.

  In the present embodiment, the determination circuit 90 operates based on the second enable signal EN_CMP. Specifically, the determination circuit 90 (comparator 91) operates when the second enable signal EN_CMP is active (high level), and the voltage of the second temperature signal Vt2 is higher than the voltage of the second reference signal Vr2. Is a high level, and when the voltage of the second temperature signal Vt2 is lower than the voltage of the second reference signal Vr2, a signal that is at a low level is output.

  The determination circuit 90 (comparator 91) stops when the second enable signal EN_CMP is inactive (low level), and its output terminal becomes open (high impedance), and outputs a signal based on the second temperature signal Vt2. do not do.

  FIG. 5 shows the internal temperature of the oven 9 (the ambient temperature of the oscillation element 3) and the voltage (solid line) of the second temperature signal Vt2 and the determination circuit 90 (comparator) when the second enable signal EN_CMP is active (high level). 91) shows an example of the relationship with the output voltage (broken line). As shown in FIG. 5, the output signal from the determination circuit 90 (comparator 91) is a binary signal corresponding to the magnitude relationship between the voltage of the second temperature signal Vt2 and the voltage of the second reference signal Vr2, that is, the temperature. Is a signal indicating whether or not the set temperature has been reached. More specifically, when the output signal from the determination circuit 90 (comparator 91) is at a high level, the internal temperature of the oven 9 (the ambient temperature of the oscillation element 3) has not reached the set temperature, and is at a low level. The hour indicates that the internal temperature of the oven 9 (the ambient temperature of the oscillation element 3) has reached the set temperature.

Returning to FIG. 3, the output terminal of the amplifier circuit 80 (operational amplifier 83) and the output terminal of the determination circuit 90 (comparator 91) are connected by wiring, and a signal propagating through the wiring is transmitted from the output selection circuit 70. The output signal AMP_O is output from the output terminal T1 of the signal processing circuit 5. As described above, in the present embodiment, in the nonvolatile memory 52 and the register 54, one of the first enable signal EN_AMP and the second enable signal EN_CMP is active (high level) and the other is inactive (low level). Is set to be Therefore, when the first enable signal EN_AMP is set to active (high level), the output signal AMP_O of the output selection circuit 70 is an output signal from the amplifier circuit 80, and the second enable signal EN_CMP is active (high level). When set to, the output signal AMP_O of the output selection circuit 70 is an output signal from the determination circuit 90. That is, in this embodiment, the output signal from the amplifier circuit 80 and the output signal from the determination circuit 90 are output from the common output terminal T1.

  In this embodiment, the output selection circuit 70 further includes an AND gate 71 to which the output signal from the amplifier circuit 80, the output signal from the determination circuit 90, and the second enable signal EN_CMP are input. More specifically, the AND gate 71 receives the output signal AMP_O of the output selection circuit 70 and the second enable signal EN_CMP, and outputs a digital signal N_AMP_O that is the logical product of these two signals.

  Therefore, when the first enable signal EN_AMP is set to active (high level), the second enable signal EN_CMP is inactive (low level), so the digital signal N_AMP_O output from the AND gate 71 is a low level signal. It is. At this time, since the output signal AMP_O of the output selection circuit 70 is an output signal from the amplifier circuit 80, it can be an intermediate potential between the high level and the low level, but since the second enable signal EN_CMP is at the low level, the AND signal In the gate 71, the current path from the power source to the ground is interrupted, and no through current flows. Therefore, an increase in power consumption when the first enable signal EN_AMP is set to active (high level) can be suppressed.

  When the second enable signal EN_CMP is set to active (high level), the output signal AMP_O of the output selection circuit 70 is an output signal from the determination circuit 90, so that the digital signal N_AMP_O output from the AND gate 71 is also used. This is an output signal from the determination circuit 90. When the read request command (temperature) of the digital signal N_AMP_O is input from the external device via the external terminal 6 of the oscillator 1, the interface circuit 60 is based on the digital signal N_AMP_O that is an output signal from the AND gate 71. Thus, a signal indicating whether or not the temperature has reached the set temperature is generated and output to an external device via the external terminal 6 of the oscillator 1. More specifically, when the digital signal N_AMP_O is at a high level, the internal temperature of the oven 9 (ambient temperature of the oscillation element 3) does not reach the set temperature, and when the digital signal N_AMP_O is at a low level, the internal temperature of the oven 9 (oscillation). This represents that the ambient temperature of the element 3 has reached the set temperature.

1-4. Method for Manufacturing Oscillator (Signal Processing Circuit) FIG. 6 is a flowchart showing an example of the procedure of the method for manufacturing the oscillator 1 of the present embodiment. Part of steps S10 to S40 in FIG. 6 may be omitted or changed, or other steps may be added.

  In the example of FIG. 6, first, the characteristics of the IC chip 2 (signal processing circuit 5) are adjusted (S10). For example, in this step S10, the characteristic information of the IC chip 2 (signal processing circuit 5) is acquired, and the optimum voltage control data and oscillation control data for the storage unit 50 (nonvolatile memory 52) according to the acquired characteristic information. May be written.

  Next, the IC chip 2, the oven 9 in which the oscillation element 3, the temperature control element 7, and the temperature detection element 8 are housed are mounted on the component mounting board 4c, and heat treatment is performed to form the case 4a and the base 4b. The oscillator 1 is assembled by sealing (S20). By the step S20, the IC chip 2, the oscillation element 3, the temperature control element 7, and the temperature detection element 8 are connected by wiring provided inside the package 4 or on the surface of the recess, and when power is supplied to the IC chip 2, the IC chip 2, the oscillation element 3, the temperature control element 7, and the temperature detection element 8 are electrically connected.

  Next, the set temperature of the oscillator 1 is adjusted (S30). Details of this preset temperature adjustment step S30 will be described later.

Finally, in the signal processing circuit 5, the storage unit 50 is set so that one of the output signal from the amplifier circuit 80 and the output signal from the determination circuit 90 is output from the common output terminal T1 (S40). In this step S40, the nonvolatile memory 52 is set so that one of the first enable signal EN_AMP and the second enable signal EN_CMP is active (high level) and the other is inactive (low level).

  The flowchart of FIG. 6 is also a flowchart showing an example of the procedure of the method for manufacturing the signal processing circuit 5 (or IC chip 2), and the procedure of the method for manufacturing the signal processing circuit 5 (or IC chip 2) is as follows. Steps S20 and S30 may be omitted.

  FIG. 7 is a flowchart showing an example of a detailed procedure of the set temperature adjustment step (S30 in FIG. 6) in the present embodiment. Part of steps S31 to S39 in FIG. 7 may be omitted or changed, or other steps may be added. Moreover, you may change the order of each process suitably in the possible range.

  In the example of FIG. 7, first, an external device (here, a device for adjusting the characteristics of the oscillator 1) supplies a power supply voltage to the oscillator 1 accommodated in the thermostat and operates the oscillator 1 (S <b> 31). ).

  Next, the external device sets the temperature of the thermostatic chamber (ambient temperature of the oscillator 1) to a desired temperature (for example, −40 ° C.) (S32).

  Next, the external device sets predetermined temperature control data to the register 54 of the signal processing circuit 5 via the interface circuit 60 (S33).

  Next, the external device sets the register 54 of the signal processing circuit 5 so that the first enable signal EN_AMP is active (high level) and the second enable signal EN_CMP is inactive (low level), and the output terminal T1 is set. The voltage value V1 based on the first temperature signal Vt1 output via the voltage is measured (S34).

  Next, the external device sets the register 54 of the signal processing circuit 5 so that the first enable signal EN_AMP is inactive (low level) and the second enable signal EN_CMP is active (high level), and the output terminal T1 is set. The voltage value V2 based on the second temperature signal Vt2 output via the voltage is measured (S35).

  Next, the external device measures the frequency F of the oscillation signal output from the output circuit 20 (S36).

  Next, an external apparatus sets the temperature of a thermostat to different temperature (for example, -30 degreeC) (S321), and performs the process of process S33-process S36 again.

  Similarly, until the external device finishes measurement at all temperatures to be measured that are included in a desired temperature range (for example, −40 ° C. to + 85 ° C.) in which the operation of the oscillator 1 is guaranteed (N in S37). ), And repeats the process from step S32 to step S36.

  When the external device finishes measurement at all temperatures to be measured (Y in S37), next, from the temperature control data set in step S33, V1, V2 and F measured in steps S34 to S36, Temperature control data whose frequency temperature characteristic is closest to flat is calculated (S38). For example, the external device calculates the relationship between the set temperature control data and V2, the relationship between V2 and F, etc. for each V1, and calculates optimum temperature control data based on these relationships.

Next, the external device writes the temperature control data calculated in step S38 into the nonvolatile memory 52 of the signal processing circuit 5 (S39), and the set temperature adjustment step ends.

1-5. As described above, in the oscillator 1 of the present embodiment, the signal processing circuit 5 outputs a signal based on the first reference signal Vr1 and the first temperature signal Vt1 by the amplifier circuit 80, and the determination circuit 90 A binary signal based on the comparison between the second reference signal Vr2 and the second temperature signal Vt2 is output. Then, by setting the storage unit 50 so that only one of the first enable signal EN_AMP and the second enable signal EN_CMP is active, any of the output signal from the amplifier circuit 80 and the output signal from the determination circuit 90 is set. One of them can be output from a common output terminal T1. As described above, according to this embodiment, it is possible to realize the oscillator 1 according to the application at lower cost by changing the setting of the storage unit 50 using the highly versatile signal processing circuit 5. is there. In addition, according to the present embodiment, since either the output signal from the amplifier circuit 80 or the output signal from the determination circuit 90 can be output from the output terminal T1, it is advantageous for downsizing the oscillator 1.

  Further, according to the oscillator 1 of the present embodiment, as shown in FIG. 3, the output signal from the temperature detection element 8 is the first temperature signal Vt1, and the input signal to the temperature control element 7 is the second temperature signal Vt2. Thus, information on the internal temperature of the oven 9 (ambient temperature of the oscillation element 3) and whether or not the internal temperature of the oven 9 (ambient temperature of the oscillation element 3) has reached the set temperature (the temperature is stabilized). Information indicating whether or not) can be output. Therefore, as shown in FIG. 7, the external device can acquire necessary information while adjusting the settings of the first enable signal EN_AMP and the second enable signal EN_CMP and adjust the set temperature of the oven 9.

  Further, according to the oscillator 1 of the present embodiment, by setting the first enable signal EN_AMP to be active, information on the internal temperature of the oven 9 (ambient temperature of the oscillation element 3) and the internal temperature of the oven 9 (oscillation element) 3) can be output to the outside via the output terminal T1 and also to the outside via the interface circuit 60. Therefore, an external device that reads out via the interface circuit 60 a signal indicating whether or not the internal temperature of the oven 9 (ambient temperature of the oscillation element 3) has reached the set temperature is also received via the output circuit T1. It is possible to realize a highly versatile oscillator 1 that can be applied to the above.

  Further, according to the oscillator 1 of the present embodiment, as shown in FIG. 3, since the comparator 91 is used as the determination circuit 90 instead of the operational amplifier, the internal temperature of the oven 9 (the ambient temperature of the oscillation element 3) ) Can output a binary signal indicating whether or not the temperature has reached the set temperature with its rise time and fall time shortened.

1-6. Modification [Modification 1]
In the above-described embodiment, as shown in FIG. 3, a signal based on the output signal from the temperature detection element 8 is input to the amplifier circuit 80 as the first temperature signal Vt1. A signal based on the input signal may be input.

FIG. 8 is a diagram showing a specific configuration example of the temperature control circuit 30 and the output selection circuit 70 in the first modification. In FIG. 8, the input signal of the temperature control element 7 (input signal to the base terminal of the NPN type power transistor) is input to the amplifier circuit 80 as the first temperature signal Vt1 (specifically, the inversion of the operational amplifier 83). Input to the input terminal). Further, the temperature detection signal output from the temperature detection element 8 (NTC thermistor) is input to the determination circuit 90 as the second temperature signal Vt2 (specifically, input to the non-inverting input terminal of the comparator 91). ). That is, in FIG. 8, the first temperature signal Vt1 and the second temperature signal Vt2 are interchanged with respect to FIG. FIG. 9 shows the internal temperature of the oven 9 (the ambient temperature of the oscillation element 3) and the voltage (solid line) of the first temperature signal Vt1 when the first enable signal EN_AMP is active (high level). An example of the relationship with the voltage (broken line) of the amplifier circuit 80 (operational amplifier 83) is shown. FIG. 10 shows the internal temperature of the oven 9 (the ambient temperature of the oscillation element 3) and the voltage of the second temperature signal Vt2 (solid line) and the determination circuit 90 (when the second enable signal EN_CMP is active (high level)). An example of the relationship with the voltage (broken line) of the comparator 91) is shown.

[Modification 2]
In the embodiment described above, as shown in FIG. 3, the first reference signal Vr1 and the second reference signal Vr2 which are separate signals are input to the amplifier circuit 80 and the determination circuit 90, respectively. A common reference signal may be input to the amplifier circuit 80 and the determination circuit 90 as the reference signal Vr1 and the second reference signal Vr2. In the above-described embodiment, as illustrated in FIG. 3, the first temperature signal Vt1 and the second temperature signal Vt2 that are separate signals are input to the amplifier circuit 80 and the determination circuit 90, respectively. A common temperature signal may be input to the amplifier circuit 80 and the determination circuit 90 as the first temperature signal Vt1 and the second temperature signal Vt2.

  FIG. 11 is a diagram showing a specific configuration example of the temperature control circuit 30 and the output selection circuit 70 in the second modification. In FIG. 11, the reference signal generated by resistance division between the reference voltage Vreg3 generated by the regulator 40 and the ground is input to the amplifier circuit 80 as the first reference signal Vr1 (specifically, an operational amplifier) 83, and the second reference signal Vr2 is input to the determination circuit 90 (specifically, input to the inverting input terminal of the comparator 91). Further, an output signal (temperature detection signal) from the temperature detection element 8 (NTC thermistor) is input to the amplifier circuit 80 as the first temperature signal Vt1 (specifically, the operational amplifier 83 is connected via the resistor 81). And is input to the determination circuit 90 as the second temperature signal Vt2 (specifically, input to the non-inverting input terminal of the comparator 91). In the configuration of FIG. 11, when the first enable signal EN_AMP is active (high level), the internal temperature of the oven 9 (ambient temperature of the oscillation element 3), the voltage of the first temperature signal Vt1 (solid line), and the amplifier circuit The relationship between the voltage 80 (operational amplifier 83) and the voltage (broken line) is the same as in FIG. Similarly, in the configuration of FIG. 11, when the second enable signal EN_CMP is active (high level), the internal temperature of the oven 9 (ambient temperature of the oscillation element 3), the voltage of the second temperature signal Vt2 (solid line), and the determination Since the relationship with the voltage (broken line) of the circuit 90 (comparator 91) is the same as that in FIG. 10, the illustration thereof is omitted.

FIG. 12 is a diagram showing another specific configuration example of the temperature control circuit 30 and the output selection circuit 70 in the second modification. In FIG. 12, a reference signal generated by resistance division between the reference voltage Vreg3 generated by the regulator 40 and the ground is input to the amplifier circuit 80 as the first reference signal Vr1 (specifically, an operational amplifier) 83, and the second reference signal Vr2 is input to the determination circuit 90 (specifically, input to the inverting input terminal of the comparator 91). An input signal to the temperature control element 7 (NPN type power transistor) is input to the amplifier circuit 80 as the first temperature signal Vt1 (specifically, to the inverting input terminal of the operational amplifier 83 via the resistor 81). And is input to the determination circuit 90 as the second temperature signal Vt2 (specifically, input to the non-inverting input terminal of the comparator 91). In the configuration of FIG. 12, when the first enable signal EN_AMP is active (high level), the internal temperature of the oven 9 (ambient temperature of the oscillation element 3), the voltage of the first temperature signal Vt1 (solid line), and the amplifier circuit The relationship between the voltage 80 (operational amplifier 83) and the voltage (broken line) is the same as in FIG. Similarly, in the configuration of FIG. 12, when the second enable signal EN_CMP is active (high level), the internal temperature of the oven 9 (ambient temperature of the oscillation element 3), the voltage of the second temperature signal Vt2 (solid line), and the determination Since the relationship with the voltage (broken line) of the circuit 90 (comparator 91) is the same as that in FIG. 5, its illustration is omitted.

  According to the second modification, since the circuit for generating the first reference signal Vr1 and the second reference signal Vr2 can be shared, the signal processing circuit 5 having a simpler configuration and a smaller circuit area can be realized. it can.

[Modification 3]
In the output selection circuit 70 in the above embodiment, the first reference signal Vr1 and the second reference signal Vr2 are input from a common first input terminal, and the first temperature signal Vt1 and the second temperature signal Vt2 are shared. You may deform | transform so that it may input from a 2nd input terminal.

  FIG. 13 is a diagram illustrating a configuration example of the output selection circuit in the third modification when the output signal from the amplifier circuit 80 is output from the output terminal T1 (when the first enable signal EN_AMP is set to be active). . In FIG. 13, the first temperature signal Vt1 input to the inverting input terminal of the operational amplifier 83 and the second temperature signal Vt2 input to the non-inverting input terminal of the comparator 91 are transmitted from the first input terminal T11 of the IC chip 2. It is input in common. Further, the first reference signal Vr1 input to the non-inverting input terminal of the operational amplifier 83 and the second reference signal Vr2 input to the inverting input terminal of the comparator 91 are supplied from the common second input terminal T12 of the IC chip 2. It is input in common. The resistor 81 and the resistor 82 constituting the amplifier circuit 80 are provided outside the IC chip 2. For example, an output signal (temperature detection signal) from the temperature detection element 8 (NTC thermistor) or an input signal to the temperature control element 7 (NPN type power transistor) is supplied to one end of the resistor 81. The other end of the resistor 81 and one end of the resistor 82 are electrically connected to the first input terminal T11, and the other end of the resistor 82 is electrically connected to the output terminal T1. In this case, for example, in the procedure of the method for manufacturing the oscillator 1 shown in FIG. 6, a resistor having a desired resistance value is arranged in the arrangement region of the resistor 81 on the substrate and the desired region is arranged in the arrangement region of the resistor 82 in step S20. A resistor having a resistance value may be arranged.

  FIG. 14 is a diagram illustrating a configuration example of the output selection circuit in the third modification when the output signal from the determination circuit 90 is output from the output terminal T1 (when the second enable signal EN_CMP is set to be active). . In FIG. 14, the first temperature signal Vt1 input to the inverting input terminal of the operational amplifier 83 and the second temperature signal Vt2 input to the non-inverting input terminal of the comparator 91 are transmitted from the first input terminal T11 of the IC chip 2. It is input in common. Further, the first reference signal Vr1 input to the non-inverting input terminal of the operational amplifier 83 and the second reference signal Vr2 input to the inverting input terminal of the comparator 91 are supplied from the common second input terminal T12 of the IC chip 2. It is input in common. A resistor of 0Ω is provided outside the IC chip 2 as the resistor 81 constituting the amplifier circuit 80, and both ends of the resistor 81 are short-circuited. Unlike FIG. 13, the resistor 82 is not provided, and the first input terminal T11 and the output terminal T1 are open. In this case, for example, in the procedure of the manufacturing method of the oscillator 1 shown in FIG. 6, in step S20, a 0Ω resistor is arranged in the arrangement region of the resistor 81 on the substrate, and no resistor is arranged in the arrangement region of the resistor 82. What should I do?

  According to the third modification, it is possible to realize the oscillator 1 according to the application at low cost by making the IC chip 2 general-purpose and changing the external resistor 81 and the resistor 82 of the IC chip 2. .

[Modification 4]
In the above-described embodiment, as shown in FIG. 3, the AND gate 71 receives the output signal AMP_O of the output selection circuit 70 and the second enable signal EN_CMP, but instead of the second enable signal EN_CMP, A read signal generated when the interface circuit 60 receives a read request command from an external device may be input. This read signal may be, for example, a signal that becomes active (high level) during a period (clock cycle) in which the interface circuit 60 receives data to be read from the storage unit 50 or the output selection circuit 70. Alternatively, the AND gate 71 receives a signal corresponding to a logical product of this read signal and an address decode signal that becomes active (high level) only when reading from the output selection circuit 70, instead of the second enable signal EN_CMP. It may be input.

[Modification 5]
In the above-described embodiment, as shown in FIG. 3, the output signal from the amplifier circuit 80 and the output signal from the determination circuit 90 are output from the common output terminal T1 of the signal processing circuit 5, It may be output from a separate output terminal.

[Modification 6]
In the embodiment described above, when the first enable signal EN_AMP is set to active (high level) and the second enable signal EN_CMP is set to inactive (low level), the digital signal N_AMP_O output from the AND gate 71 is always low level. Therefore, the external device cannot read the output signal from the amplifier circuit 80 via the interface circuit 60. For example, an A / D conversion circuit that converts an output signal from the amplifier circuit 80 into a digital signal may be provided, and the digital signal output from the A / D conversion circuit may be input to the interface circuit 60.

2. Electronic Device FIG. 15 is a functional block diagram showing an example of the configuration of the electronic device of the present embodiment. The electronic apparatus 300 according to the present embodiment includes an oscillator 310, a CPU (Central Processing Unit) 320, a multiplier circuit 330, a ROM (Read Only Memory) 340, a RAM (Random Access Memory) 350, and a communication unit 360. . Note that the electronic device of the present embodiment may have a configuration in which some of the components (each unit) in FIG. 15 are omitted or changed, or other components are added.

  The oscillator 310 outputs an oscillation signal having a desired frequency based on the signal from the oscillation source by the signal processing circuit 312.

  The multiplier circuit 330 is a circuit that multiplies the oscillation signal output from the oscillator 310 (the signal processing circuit 312) to a desired frequency and outputs it. The oscillation signal output from the multiplier circuit 330 may be used as a clock signal for the CPU 320 or may be used for the CPU 320 to generate a carrier wave for communication.

  The CPU 320 (processing unit) performs various calculation processes and control processes based on, for example, an oscillation signal output from the oscillator 310 or an oscillation signal output from the multiplication circuit 330 in accordance with a program stored in the ROM 340 or the like.

  The ROM 340 stores programs, data, and the like for the CPU 320 to perform various calculation processes and control processes.

  The RAM 350 is used as a work area of the CPU 320, and temporarily stores programs and data read from the ROM 340, calculation results executed by the CPU 320 according to various programs, and the like.

The communication unit 360 performs various controls for establishing data communication between the CPU 320 and an external device.

  For example, the highly versatile signal processing circuit 5 in the above-described embodiment or each modification is applied as the signal processing circuit 312, or the oscillator 1 (the signal processing circuit 5 in the above-described embodiment or each modification) is applied as the oscillator 310. The cost reduction of the electronic device 300 can be realized.

  Various electronic devices can be considered as such an electronic device 300. For example, a GPS (Global Positioning System) module, a network device, a broadcasting device, a communication device used in an artificial satellite or a base station, a personal computer (for example, a mobile device) Personal computers, laptop personal computers, tablet personal computers), mobile terminals such as smartphones and mobile phones, digital cameras, ink jet dispensing devices (for example, ink jet printers), storage area network devices such as routers and switches, Local area network equipment, mobile terminal base station equipment, television, video camera, video recorder, car navigation device, real-time clock device, pager, electronic hand Books (including those with communication functions), electronic dictionaries, calculators, electronic game devices, game controllers, word processors, workstations, video phones, security TV monitors, electronic binoculars, POS (Point Of Sale) terminals, medical devices (for example, Electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring instruments, instruments (eg, vehicle, aircraft, ship instruments), flight simulator, Head mounted display, motion trace, motion tracking, motion controller, PDR (pedestrian position direction measurement), etc. are mentioned.

  As an example of the electronic apparatus 300 according to the present embodiment, a transmission apparatus that functions as a terminal base station apparatus that performs wired or wireless communication with a terminal by using an oscillator 310 including a signal processing circuit 312 as a reference signal source. Is mentioned. As the signal processing circuit 312, the highly versatile signal processing circuit 5 in the above-described embodiment or each modification is applied, or as the oscillator 310, the oscillator 1 in the above-described embodiment or each modification (including the signal processing circuit 5). By applying the above, it is possible to realize an electronic device 300 that can be used for, for example, a communication base station and that has higher frequency accuracy, higher performance, and higher reliability than conventional ones at a lower cost.

  As another example of the electronic apparatus 300 according to this embodiment, the communication unit 360 receives an external clock signal, and the CPU 320 (processing unit) outputs the external clock signal and the output signal of the oscillator 310 or the output signal of the multiplier circuit 330. And a frequency control unit that controls the frequency of the oscillator 310 based on (internal clock signal). This communication device may be, for example, a backbone network device such as stratum 3 or a communication device used for a femtocell.

3. Base Station FIG. 16 is a diagram illustrating an example of a schematic configuration of a base station according to the present embodiment. The base station 400 according to this embodiment includes a receiving device 410, a transmitting device 420, and a control device 430. Note that the electronic device of the present embodiment may have a configuration in which some of the components (each unit) in FIG. 16 are omitted or changed, or other components are added.

  The receiving device 410 includes a receiving antenna 412, a receiving unit 414, a processing unit 416, and an oscillator 418.

  The oscillator 418 outputs an oscillation signal having a desired frequency based on the signal from the oscillation source by the signal processing circuit 419.

  The receiving antenna 412 receives radio waves on which various types of information are superimposed from a mobile station (not shown) such as a mobile phone or a GPS satellite.

  The receiving unit 414 uses the oscillation signal output from the oscillator 418 (signal processing circuit 419) to demodulate the signal received by the receiving antenna 412 into a signal in a desired intermediate frequency (IF) band.

  The processing unit 416 uses the oscillation signal output from the oscillator 418 to convert the intermediate frequency band signal demodulated by the receiving unit 414 into a baseband signal, and demodulates information included in the baseband signal.

  The control device 430 receives the information demodulated by the receiving device 410 (processing unit 416) and performs various processes according to the information. Then, the control device 430 generates information to be transmitted to the mobile station and sends the information to the transmission device 420 (processing unit 426).

  The transmission apparatus 420 includes a transmission antenna 422, a transmission unit 424, a processing unit 426, and an oscillator 428.

  The oscillator 428 outputs an oscillation signal having a desired frequency based on the signal from the oscillation source by the signal processing circuit 429.

  The processing unit 426 generates a baseband signal using the information received from the control device 430 using the oscillation signal output from the oscillator 428 (signal processing circuit 429), and converts the baseband signal into an intermediate frequency band signal. Convert.

  The transmission unit 424 modulates the signal of the intermediate frequency band from the processing unit 426 using the oscillation signal output from the oscillator 428 and superimposes it on the carrier wave.

  The transmission antenna 422 transmits the carrier wave from the transmission unit 424 as a radio wave to a mobile station such as a mobile phone or a GPS satellite.

  As the signal processing circuit 419 included in the reception device 410 and the signal processing circuit 429 included in the transmission device 420, the signal processing circuit 5 having high versatility in the above-described embodiment or each modification is applied, or the oscillator 418 included in the reception device 410. By applying the oscillator 1 (including the signal processing circuit 5) in the above-described embodiment or each modification as the oscillator 428 included in the transmitter 420, a highly reliable base station with excellent communication performance can be obtained at lower cost. Can be realized.

  The present invention is not limited to the present embodiment, and various modifications can be made within the scope of the gist of the present invention.

  For example, the oscillator of the embodiment described above is a thermostatic oven type oscillator. However, the present invention is not limited to the thermostatic oven type oscillator, but a temperature compensated oscillator having a temperature compensation function (for example, TCXO (Temperature Compensated Crystal Oscillator)) or a frequency. Application to voltage controlled oscillators (eg, VCXO (Voltage Controlled Crystal Oscillator)) having a control function, oscillators having temperature compensation function and frequency control function (eg, VC-TCXO (Voltage Controlled Temperature Compensated Crystal Oscillator)), etc. Can do.

The above-described embodiments and modifications are merely examples, and the present invention is not limited to these. For example, it is possible to appropriately combine the above-described embodiment and each modification.

  The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same objects and effects). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

DESCRIPTION OF SYMBOLS 1 ... Oscillator, 2 ... IC chip, 3 ... Oscillation element, 4 ... Package, 4a ... Case, 4b ... Base, 4c ... Component mounting substrate, 5 ... Signal processing circuit, 6 ... External terminal (external electrode), 7 ... Temperature control element, 8 ... Temperature detection element, 9 ... Oven, 9a ... Component mounting board, 10 ... Oscillation circuit, 20 ... Output circuit, 30 ... Temperature control circuit, 31 ... Operational amplifier, 32 ... Variable resistance, 40 ... Regulator, DESCRIPTION OF SYMBOLS 50 ... Memory | storage part, 52 ... Nonvolatile memory, 54 ... Register, 60 ... Interface circuit, 70 ... Output selection circuit, 71 ... AND gate, 80 ... Amplifier circuit, 81 ... Resistance, 82 ... Resistance, 83 ... Operational amplifier, 90 DESCRIPTION OF SYMBOLS 91 ... Comparator 300 ... Electronic device 310 ... Oscillator 312 ... Signal processing circuit 320 ... CPU 330 ... Multiplier circuit 340 ... ROM 350 ... RAM 360 ... Communication unit, 400 ... Base station, 410 ... Reception device, 412 ... Reception antenna, 414 ... Reception unit, 416 ... Processing unit, 418 ... Oscillator, 419 ... Signal processing circuit, 420 ... Transmission device, 422 ... Transmission antenna, 424 ... Transmitter, 426 ... Processor, 428 ... Oscillator, 429 ... Signal processor, 430 ... Controller, EN_AMP ... First enable signal, EN_CMP ... Second enable signal, Vr1 ... First reference signal, Vr2 ... Second Reference signal, Vt1 ... first temperature signal, Vt2 ... second temperature signal, T1 ... output terminal

Claims (14)

An amplifier circuit capable of outputting a signal based on the first reference signal and the first temperature signal;
And a determination circuit capable of outputting a binary signal based on a comparison between the second reference signal and the second temperature signal. The amplifier circuit operates based on a first enable signal;
The determination circuit operates based on a second enable signal;
The signal processing circuit according to claim 1, wherein an output signal from the amplifier circuit and an output signal from the determination circuit are output from a common output terminal.   The signal processing circuit according to claim 2, further comprising an AND gate to which an output signal from the amplification circuit, an output signal from the determination circuit, and the second enable signal are input.   The signal processing circuit according to claim 3, further comprising an interface circuit that generates a signal indicating whether or not a temperature has reached a set temperature based on an output signal from the AND gate.   5. The signal processing circuit according to claim 1, wherein a common reference signal is input to the amplifier circuit and the determination circuit as the first reference signal and the second reference signal. 6.   The signal processing circuit according to claim 1, wherein a common temperature signal is input to the amplifier circuit and the determination circuit as the first temperature signal and the second temperature signal. The first reference signal and the second reference signal are input from a common first input terminal,
The signal processing circuit according to claim 1, wherein the first temperature signal and the second temperature signal are input from a common second input terminal. The output signal from the amplifier circuit is output as a signal representing temperature,
The signal processing circuit according to claim 1, wherein an output signal from the determination circuit is output as a signal indicating whether the temperature has reached a set temperature. The amplifier circuit is a differential amplifier circuit;
The signal processing circuit according to claim 1, wherein the determination circuit is a comparator.   A semiconductor integrated circuit device comprising the signal processing circuit according to claim 1. An oscillation element;
An oscillation circuit for oscillating the oscillation element;
A temperature detection element for detecting an ambient temperature of the oscillation element;
A temperature control element that operates based on the temperature detected by the temperature detection element;
A signal processing circuit according to any one of claims 1 to 9,
The oscillator, wherein the first temperature signal and the second temperature signal are signals based on an output signal from the temperature detection element or an input signal to the temperature control element.   An electronic apparatus comprising the signal processing circuit according to claim 1 or the oscillator according to claim 11.   The base station provided with the signal processing circuit as described in any one of Claims 1 thru | or 9, or the oscillator as described in Claim 11. An amplifier circuit that outputs a signal based on the first reference signal and the first temperature signal; a determination circuit that outputs a binary signal based on a comparison between the second reference signal and the second temperature signal; and a storage unit. A method for manufacturing a signal processing circuit comprising:
A method for manufacturing a signal processing circuit, comprising: setting the storage unit so that either one of an output signal from the amplifier circuit and an output signal from the determination circuit is output from a common output terminal.

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