JP2017092307A - Substrate processing device, method of manufacturing semiconductor device, and method of teaching transportation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform a teaching work with accuracy.SOLUTION: A substrate processing device comprises: a storage shelf for storing a housing container that houses a substrate; a holding part for holding the housing container; a drive part for driving the holding part in a right/left direction, a forward/backward direction and a vertical direction; and a controller configured to acquire an encoder value of the drive part at the time when a pair of sensor parts installed in the holding part detect an identification part formed on the storage shelf and a target part installed in the storage shelf, to calculate a coordinate position of the holding part in the right/left direction, the forward/backward direction and the vertical direction that is used when the housing container is stored from the holding part to the storage shelf, on the basis of the encoder value, and to control the drive part and the sensor part so as to store the housing container in the storage shelf on the basis of the calculated result.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a substrate processing apparatus, a semiconductor device manufacturing method, and a transfer apparatus teaching method.

  Semiconductor manufacturing equipment is used to load and unload storage containers (FOUPs, pods) containing multiple substrates into and out of the equipment, storage shelves that temporarily store pods, and substrates into and out of storage containers. A pod opener, and a transport mechanism for transporting the pod between the load port, the storage shelf and the pod opener. At the time of start-up and maintenance of the semiconductor manufacturing apparatus, an operator performs a teaching operation (teaching operation) of the transfer position of the transfer mechanism and sets the coordinate position of the transfer mechanism (see, for example, Patent Document 1). However, the setting of the coordinate position of the transport mechanism may vary depending on the skill level of the worker and the work environment.

JP-A-9-199571

  An object of the present invention is to provide a technique capable of performing teaching work with high accuracy.

According to one aspect of the invention,
A storage shelf for storing a storage container storing a substrate;
A holding portion for holding the storage container;
A drive unit for driving the holding unit in the left-right direction, the front-rear direction, and the vertical direction;
The pair of sensor units installed in the holding unit acquires an encoder value of the drive unit when the identification unit formed in the storage shelf and the target unit installed in the storage shelf are detected, and the encoder Based on the value, the coordinate position in the left-right direction, the front-rear direction, and the vertical direction of the holding unit when storing the storage container from the holding unit to the storage shelf is calculated, and the storage container is determined based on the calculated result. A control unit configured to control the drive unit and the sensor unit to store in a storage shelf;
A technique is provided.

  According to the present invention, teaching work can be performed with high accuracy.

It is a perspective view of the substrate processing apparatus used suitably by embodiment of this invention. It is a longitudinal cross-sectional view of the substrate processing apparatus used suitably by embodiment of this invention. It is a longitudinal cross-sectional view of the processing furnace of the substrate processing apparatus used suitably by embodiment of this invention. It is a schematic block diagram of the operation unit of the substrate processing apparatus used suitably by embodiment of this invention, and is a figure which shows the control system of an operation unit with a block diagram. It is a perspective view of a storage shelf and a transfer device suitably used in an embodiment of the present invention. (A) is a perspective view of the shelf board used suitably by embodiment of this invention, (b) is an enlarged view of a notch part. It is a conceptual diagram which shows the output zone of the sensor used suitably by embodiment of this invention. It is a perspective view of a sensor jig suitably used in an embodiment of the present invention. (A) is a perspective view of the target jig suitably used in the embodiment of the present invention, (b) is a top view of the target part, (c) is a front view of the target part, (d) FIG. 4 is a right side view of the target unit. It is a flowchart figure which shows the flow of the teaching processing procedure of the storage shelf of this invention. It is a flowchart figure which shows the flow of the teaching processing procedure of the pod opener of this invention.

<One Embodiment>
Hereinafter, an embodiment of the present invention will be described with reference to FIGS. The front-rear direction (CX direction), the left-right direction (CS direction), the up-down (vertical) direction (CZ direction), and the rotation direction (CR direction) in this embodiment are as shown in FIG.

(1) Configuration of Substrate Processing Apparatus As shown in FIGS. 1 and 2, the substrate processing apparatus 1 includes a casing 2, and an opening provided in a lower portion of the front wall 3 of the casing 2 so as to allow maintenance. A front maintenance port 4 is opened. The front maintenance port 4 is opened and closed by a front maintenance door 5.

  A pod loading / unloading port 6 is opened on the front wall 3 of the housing 2 so as to communicate with the inside and outside of the housing 2. The pod loading / unloading port 6 is opened and closed by a front shutter (loading port opening / closing mechanism) 7, and a load port (pod transfer table) 8 is installed in front of the pod loading / unloading port 6. The load port 8 is configured to align the mounted pod 9.

  The pod 9 is a hermetically sealed substrate transfer container, and is loaded into the load port 8 by an in-process transfer device (not shown) and unloaded from the load port 8.

  A rotary pod shelf (storage shelf) 11 is installed at an upper portion of the housing 2 at a substantially central portion in the front-rear direction. The storage shelf 11 is configured to store a plurality of pods 9.

  The storage shelf 11 is erected vertically, and has a support column 12, a plurality of shelf plates 13 that are radially supported by the support column 12 at upper, middle, and lower positions, and a support column that drives the support column 12 to rotate intermittently. And a rotation mechanism 12A. As shown in FIG. 5, the support column rotating mechanism 12 </ b> A includes a CR shaft motor 12 </ b> B as a CR drive unit that drives the support column 12 to rotate. The CR axis motor 12B is connected to a CR axis encoder (encoder) 12C as a sensor for detecting the rotation direction, rotation position, and rotation speed of the CR axis motor. The shelf board 13 is formed in a bowl shape in which four bowl shapes are combined in a plan view. Placed portions 13 </ b> A are respectively formed on the front end side of the bowl shape of the shelf plate 13, and four placed portions 13 </ b> A are formed on one shelf plate 13. Each saddle shape is relatively positioned between the respective stages as an A row, a B row, a C row, and a D row.

  On the upper surface of the four mounting portions 13A on the shelf board 13, pin portions 13B as protruding portions are provided to project at three locations. By engaging the concave portion of the pod 9 with the pin portion 13B of the placement portion 13A, the pod 9 is positioned at a predetermined position. When the pod 9 is transferred from the holding portion 15A onto the shelf board 13, the holding portion 15A is moved slightly upward from the shelf board 13 so that the holding portion 15A is moved downward and the pod 9 is placed on the placement portion 13A. To do.

  As shown in FIG. 6 (a), the foremost end of the shelf board 13 is a hole formed by cutting out a part of the end, and a notch 13C as an identification part is formed respectively. Yes. As shown in FIG. 6B, the notch 13C is formed in a rectangular shape. A part of the short side of the cutout portion 13C is recessed so as to be bent outward. The long side of the notch 13C is configured such that at least a portion that intersects with an extension line of the short side (upward arrow in the figure) is horizontal. By setting it as such a shape, the detection of the notch part 13C by the sensor 60 mentioned later can be performed accurately.

  As shown in FIG. 2, a pair of pod openers (pod opening / closing mechanisms) 14 are provided below the storage shelf 11 in two vertical stages. The pod opener 14 has a configuration in which the pod 9 is placed and the lid of the pod 9 can be opened and closed.

  Between the load port 8, the storage shelf 11, and the pod opener 14, a pod transfer device 15 (transfer device 15) is installed as a transfer mechanism for transferring the pod 9. The transport device 15 includes a CS axis motor 15E as a CS drive unit for driving the holding unit 15A in the left-right direction, a CX axis motor 15F as a CX drive unit for driving in the front-rear direction, and a CZ drive as a CZ drive unit for driving in the vertical direction. A shaft motor 15D is provided. A CS encoder (encoder) 15H, a CX encoder (encoder) 15I, and a CZ encoder (encoder) 15G as sensors for detecting the rotational direction, rotational position, and rotational speed of each motor are connected to the motors 15D to 15F, respectively. Has been. With such a configuration, the pod 9 can be moved up and down in the vertical direction and can be moved back and forth in the horizontal direction (left and right direction and front and rear direction) while being held by the holding portion 15A. The pod 9 can be transported to and from the opener 14. On the upper surface of the holding portion 15A, a pin portion is formed as a protruding portion that engages with the concave portion of the pod 9, and the pod 9 is held by engaging the concave portion of the pod 9 with the pin portion of the holding portion 15A. It is positioned at a predetermined position on the part 9.

  As shown in FIG. 2, a sub-housing 16 is provided over the rear end of the lower portion of the housing 2 at a substantially central portion in the front-rear direction. A pair of wafer loading / unloading ports 19 for loading / unloading wafers (substrates) 18 into / from the sub-casing 16 are arranged on the front wall 17 of the sub-casing 16 in two vertical rows. Yes. The pod openers 14 are provided for the upper and lower wafer loading / unloading ports 19, 19, respectively.

  The pod opener 14 includes a mounting table 21 on which the pod 9 is mounted and an opening / closing mechanism 22 that opens and closes the lid of the pod 9. The pod opener 14 is configured to open and close the wafer entrance of the pod 9 by opening and closing the lid of the pod 9 mounted on the mounting table 21 by the opening and closing mechanism 22.

  The sub housing 16 constitutes a transfer chamber 23 that is airtightly isolated from a space (conveying space) in which the pod conveying device 15 and the storage shelf 11 are disposed. A transfer mechanism (transfer machine) 24 for transferring a wafer is installed in the front region of the transfer chamber 23. The transfer machine 24 includes a required number of wafer placement plates 25 (five in the drawing) on which the wafers 18 are placed. The wafer mounting plate 25 can be moved directly in the horizontal direction, can be rotated in the horizontal direction, and can be moved up and down. The wafer transfer mechanism 24 is configured to load and unload the wafer 18 with respect to a substrate holder (boat) 26 described later.

  The transfer chamber 23 is configured to receive and wait for a boat 26, and a processing furnace 28 is provided above the transfer chamber 23. As shown in FIG. 3, the processing furnace 28 includes a heater 37 as a heating mechanism (temperature adjustment unit). A reaction tube 38 is disposed inside the heater 37 concentrically with the heater 37. The reaction tube 38 forms a processing chamber 29 therein, and the lower end of the processing chamber 29 has a furnace port. The furnace port is opened and closed by a furnace port shutter (furnace port opening / closing mechanism).

  As shown in FIG. 2, a boat elevator 32 as an elevating mechanism (elevating device) for elevating the boat 26 is provided between the right end portion of the housing 2 and the right end portion of the transfer chamber 23 of the sub housing 16. is set up. A seal cap 34 as a lid is horizontally attached to the arm 33 connected to the elevator platform of the boat elevator 32, and the seal cap 34 supports the boat 26 vertically and loads the boat 26 into the processing chamber 29. In this state, the furnace port can be hermetically closed.

  As shown in FIG. 3, a rotation mechanism 39 that rotates the boat 26 described later is installed on the opposite side of the seal cap 34 from the processing chamber 29. A rotation shaft 39A of the rotation mechanism 39 is connected to the boat 26 through the seal cap 34. The rotation mechanism 39 is configured to rotate the wafer 18 by rotating the boat 26.

  The boat 26 is configured to hold a plurality of (for example, about 25 to 125) wafers 18 in a horizontal posture with the wafer 18 aligned in the center.

  In the reaction tube 38, nozzles 41 and 42 for supplying a processing gas into the processing chamber 29 are provided so as to rise upward from the lower portion of the reaction tube 38 in the stacking direction of the wafer 200. A gas supply pipe 43a is connected to the nozzle. A gas supply pipe 43 b is connected to the nozzle 42.

  The gas supply pipes 43a and 43b are respectively provided with mass flow controllers (MFC) 45a and 45b as flow rate controllers (flow rate control units) and valves 47a and 47b as opening / closing valves in order from the upstream direction. A processing gas is supplied from the gas supply pipe 43 a into the processing chamber 29 through the MFC 45 a, the valve 47 a, and the nozzle 41. The reaction gas is supplied from the gas supply pipe 43b into the processing chamber 29 through the MFC 45b, the valve 47b, and the nozzle.

  The reaction tube 38 is provided with an exhaust pipe 49 for exhausting the atmosphere in the processing chamber 29. The exhaust pipe 49 is connected to a pressure sensor 51 as a pressure detector (pressure detection unit) for detecting the pressure in the processing chamber 29 and an APC (Auto Pressure Controller) valve 53 as a pressure regulator (pressure adjustment unit). A vacuum pump 55 as an evacuation device is connected. The APC valve 53 can open and close the valve in a state where the vacuum pump 55 is operated, thereby evacuating and stopping the evacuation in the processing chamber 29. Further, in a state where the vacuum pump 55 is operated, The valve is configured such that the pressure in the processing chamber 29 can be adjusted by adjusting the valve opening based on the pressure information detected by the pressure sensor 51.

  Inside the reaction tube 38, a temperature sensor 57 as a temperature detector is installed. By adjusting the power supply to the heater 207 based on the temperature information detected by the temperature sensor 57, the temperature in the processing chamber 29 becomes a desired temperature distribution. The temperature sensor 57 is configured in an L shape like the nozzles 41 a and 41 b and is provided along the inner wall of the reaction tube 38.

  As shown in FIG. 3, the operation unit 121, which is a control unit (control means), is configured as a computer including a CPU (Central Processing Unit) 121a, a RAM (Random Access Memory) 121b, a storage device 121c, and a hub 121d. Yes. The RAM 121b, the storage device 121c, and the hub 121d are configured to exchange data with the CPU 121a via the internal bus 121e. For example, an input / output device 122 configured as a touch panel or the like is connected to the operation unit 121.

  The hub 121d is connected to a transfer controller 131 that is a transfer control unit (transfer control unit) that controls driving of the transfer system, and a process controller 141 that is a process control unit (process control unit) that controls the film forming process. ing. The transport controller 131 is configured as a computer including a CPU 131a, a RAM 131b, and a storage device 131c. The conveyance controller 131 is connected to the column rotation mechanism 12A, the conveyance device 15, the rotation mechanism 39, the boat elevator 32, and the like. During teaching work, it is connected to a sensor 60 described later.

  The process controller 141 is configured as a computer including a CPU 141a, a RAM 141b, a storage device 141c, and an I / O port 141d. The I / O port 141d is connected to the above-described MFCs 45a and 45b, valves 47a and 47b, pressure sensor 51, APC valve 53, vacuum pump 55, temperature sensor 57, heater 37, and the like.

  The storage devices 121c, 131c, and 141c are configured by, for example, flash memory, HDD (Hard Disk Drive), and the like. In the storage devices 121c, 131c, and 141c, a control program that controls teaching work and operation of the substrate processing apparatus, a process recipe that describes a film forming process procedure and conditions that will be described later, and the like are stored in a readable manner. ing. The process recipe is a combination of processes so that a predetermined result can be obtained by causing the process controller 141 to execute each procedure in a film forming process to be described later, and functions as a program. Hereinafter, process recipes, control programs, and the like are collectively referred to simply as programs. The process recipe is also simply called a recipe. When the term “program” is used in this specification, it may include only a recipe, only a control program, or both. The RAMs 121b, 131b, and 141b are configured as memory areas (work areas) that temporarily store programs and data read by the CPUs 121a, 131a, and 141a.

  The CPU 121a is configured to read a control program from the storage device 121c and cause the device controller 131 and the process controller 141 to execute the program, and to read a recipe from the storage device 121c in response to an operation command input from the input / output device 122 or the like. Yes. The CPU 121a instructs the apparatus controller 131 and the process controller 141 to operate in accordance with the contents of the read control program and recipe, adjusts the flow of various gases by the MFCs 45a and 45b, opens and closes the valves 47a and 47b, and the APC valve. 53, pressure adjustment operation by the APC valve 53 based on the pressure sensor 51, starting and stopping of the vacuum pump 55, temperature adjustment operation of the heater 37 based on the temperature sensor 57, rotation of the boat 26 and rotation speed adjustment by the rotation mechanism 39 It is configured to control operation, raising / lowering operation of the boat 26 by the boat elevator 32, teaching work, and the like.

  The operation unit 121 is stored in an external storage device 123 (for example, a magnetic tape, a magnetic disk such as a flexible disk or a hard disk, an optical disk such as a CD or DVD, a magneto-optical disk such as an MO, or a semiconductor memory such as a USB memory or a memory card). The above-described program can be configured by installing it in a computer. The storage device 121c and the external storage device 123 are configured as computer-readable recording media. Hereinafter, these are collectively referred to simply as a recording medium. When the term “recording medium” is used in this specification, it may include only the storage device 121c alone, may include only the external storage device 123 alone, or may include both. The program may be provided to the computer using a communication means such as the Internet or a dedicated line without using the external storage device 123.

(2) Film Forming Process An example in which a film is formed on a substrate as one step of a semiconductor device (device) manufacturing process using the substrate processing apparatus described above will be described. In the following description, the operation of each unit constituting the substrate processing apparatus is controlled by the operation unit 121.

  First, in the wafer charging step, the wafer 18 is loaded (charged) into the boat 26. In the charging state in the boat 26, the wafers 18 are stacked and aligned in multiple stages in parallel and horizontally with the centers thereof aligned.

  Next, in the boat loading step, the boat 26 in which the plurality of wafers 18 are stacked and held is loaded into the processing chamber 29 in an atmospheric pressure state (boat loading). Specifically, the boat 26 loaded with the wafers 18 is raised in the vertical direction by the boat elevator 32 and is carried into the processing chamber 29 in the reaction tube 38.

  Next, in the film forming step, the processing gas and the reaction gas are introduced into the processing chamber 29 while the boat 26 is rotated. That is, when the valve 47 a is opened, a predetermined processing gas is supplied to the nozzle 41 and is introduced into the processing chamber 29 from the nozzle 41. Further, when the valve 47 b is opened, a predetermined reactive gas is supplied to the nozzle 42 and introduced into the processing chamber 29 from the nozzle 42.

For example, in the case of forming a silicon oxide film (SiO ₂ film, hereinafter simply referred to as SiO film) on the wafer 18, dichlorosilane gas (DCS gas) as a processing gas is applied to the wafer 18 in the processing chamber 29. Alternating supply with oxygen gas (O ₂ gas) as a reaction gas is performed. That is, the step of supplying DCS gas as a processing gas to the wafer 18 in the processing chamber 29 and the step of supplying O ₂ gas as a reaction gas to the wafer 18 in the processing chamber 29 are in between the processing chambers. The process is alternately performed a predetermined number of times with the process of exhausting the gas in the gas 29 being interposed. More specifically, the process gas (DCS gas) supply process → the purge process → the reaction gas (O ₂ gas) supply process → the purge process is set as one cycle and this cycle is performed a predetermined number of times.

The processing conditions at this time are exemplified as follows.
Wafer 18 temperature: 250-700 ° C.
Processing chamber pressure: 1 to 4000 Pa
DCS gas supply flow rate: 1 to 2000 sccm
O ₂ gas supply flow rate: 100 to 10,000 sccm
N ₂ gas supply flow rate: 100 to 10000 sccm

  By processing the wafer 18 with the above-described processing procedure and processing conditions, a SiO film having a predetermined thickness is formed on the wafer 18.

(3) Configuration of Teaching Jig Next, a jig used in teaching work in the present embodiment will be described with reference to FIGS. In the present embodiment, the sensor jig 59 installed in the holding unit 15A, the target jig 69 installed on the bottom shelf 13 of the storage shelf 11, the shelf 13 and the notch 13C as the identification unit are used. Teaching. In the following description, the same reference numerals are given to the same parts as those described above, and the description thereof is omitted.

  As shown in FIG. 8, the sensor jig 59 includes sensors 60 </ b> A and 60 </ b> B that are optical sensors as detection means, and an attachment portion 64 that fixes the sensors 60 </ b> A and 60 </ b> B and is attached on the holding portion 15 </ b> A of the transport device 15. Composed. The sensors 60 </ b> A and 60 </ b> B are installed as a pair on the mounting portion 64 and separated from each other by a predetermined distance, and are mounted on the holding portion 15 </ b> A via the mounting portion 64. In this specification, the case of simply referring to the sensor 60 includes the case of referring to the right side sensor 60A and the left side sensor 60B, and the case of referring to both of them.

  The sensor 60 has a light projecting / receiving unit 62 for projecting and receiving a laser beam on the front surface (shelf 13 side), and applies the laser beam to an object (a target unit 70, a shelf 13 and a notch 13C described later). ), The reflected light reflected from the object is received, and the presence / absence of the object and the distance to the object are detected from the output value corresponding to the received light. In this specification, the term “object” includes the case where each of the target unit 70, the shelf board 13 and the cutout portion 13C is referred to, or the case where all of them are referred to.

  The sensor 60 is mounted on the holding unit 15A so that the light projecting / receiving unit 62 faces the edge of the tip of the holding unit 15A. In plan view, the sensor 60 has the same distance from the right end of the light projecting / receiving unit 62 and the holding unit 15A of the sensor 60A and the distance from the left end of the projecting / receiving unit 62 of the sensor 60B and the holding unit 15A. Installed in the holding portion 15A. The left and right sensors 60B are used to detect the horizontal and vertical coordinate positions of the CS and CX directions, and the right sensor 60A is used to detect the vertical and CZ directions. In addition, the left and right sensors 60A and 60B are used simultaneously to detect the coordinate position in the CR direction, which is the rotational direction.

  The coordinate position is detected by using the CS axis, CX axis, and CZ axis of the transport device 15 and the CR axis of the support column 12 in accordance with changes in the output value of the sensor 60 when the sensor 60 detects the object. This is performed by acquiring pulse values (number of pulses, hereinafter also referred to as encoder values) of encoders 15G to I and 12C respectively provided in the motors 15D to F and 12B to be driven. As shown in FIG. 7, the output value of the sensor 60 varies depending on the distance between the sensor 60 and the object. For example, if the reference position of the distance between the sensor 60 and the object is 0, the sensor output value changes from PASS to LOW when approaching 2 mm (−2) from the reference position. In this way, the teaching work is performed using the change in the sensor output value corresponding to the distance between the sensor 60 and the object.

  Since the sensor 60 has a measurement direction that is easy to detect, it is preferable to install the sensor 60 so that the moving direction of the holding unit 13 during the teaching operation matches the measurement direction of the sensor 60. For example, it is assumed that the measurement direction that the sensor 60 can easily detect is the vertical direction when the sensor 60 is erected. In this case, it is preferable that the sensor 60A for detecting the vertical direction (CZ direction) is erected and the sensor 60B for detecting the horizontal direction (CX direction, CS direction) is laid sideways. At that time, it is preferable to increase the height of the sensor 60B so that the height positions of the laser beams of the sensor 60A and the sensor 60B are the same.

  The attachment portion 64 is attached to the holding portion 15A with screws or the like and is easily attached and detached, and the sensor 60 can be easily and accurately positioned and attached to the existing transport device 15 as well.

  The target jig 69 includes target portions 70A and 70B, and an attachment portion 72 for fixing the target portions 70A and 70B and attaching the target portions 70A and 70B onto the placement portion 13A of the shelf board 13. A pair of target units 70A and 70B are fixed on the mounting portion 72 so as to face the sensors 60A and 60B, respectively, and fixed to the left and right by a predetermined distance, and are installed on the mounting portion 13A via the mounting portion 72. In this specification, the case where the target portion 70 is simply referred to includes the case where the right target portion 70A and the left target portion 70B are referred to, and the case where both are referred to. The target portion 70 is formed in a rectangular shape in which the corner portion of the base portion 70C is angular. By setting it as such a shape, the target part 70 can be erected vertically and the detection accuracy by the sensor 60 can be improved. In particular, the detection accuracy of the coordinate position in the CZ direction can be improved.

  As shown in FIG. 9, the target portion 70 is formed with a base portion 70C and a convex portion 70D protruding from the base portion 70C. As shown in FIG. 9B, the convex portion 70D has a smaller surface area than the base portion 70C. Further, the left side surface and the lower surface of the base portion 70C and the convex portion 70C are formed in a flat and continuous shape. With such a configuration, as shown in FIGS. 9B and 9D, steps having a height corresponding to the thickness of the convex portion 70D are formed on the upper and right sides of the convex portion 70D. By detecting this step with the sensor 60, teaching work is performed.

  As shown in FIGS. 9B to 9D, inclined surfaces S are formed at the upper and right corners of the convex portion 70C. That is, some corners of the convex portion 70C are tapered. By adopting such a shape, light projection from the sensor 60 can be stably reflected to the light projection light receiving unit 62, so that the detection accuracy of the sensor 60 can be improved and the accuracy of teaching work is improved. Can be made.

  It is preferable that the target unit 70 be installed in the same direction. In other words, it is preferably installed so that the steps are directed in the same direction. By installing in this way, the drive range of the holding | maintenance part 13 at the time of teaching work can be narrowed, the time of teaching work can be shortened, and work efficiency can be improved.

(4) Teaching Process The teaching process procedure in this embodiment will be described with reference to the flowchart shown in FIG.

  The teaching work is performed under the control of the operation unit 121 and the apparatus controller 13, and processing is performed at each stage, such as the lowest level of the storage shelf → second level →.

(Step S110)
The holding portion 15A is moved in front of the placement portion 13A of the shelf board 13 on which the first stage A-row target jig 69 is installed.

(Step S120)
Parallel coordinate position detection (parallelism adjustment) in the CR axis direction is performed. The target 70 is irradiated with the laser beam of the sensor 60, and the CR shaft motor 12B is driven to rotate the support column 12 of the storage shelf 11 so that the output values of the left and right sensors 60A and 60B become the same value. For example, when the output value of the right sensor 60B is LOW → PASS, it is rotated clockwise. Further, when the output value of the left sensor 60A is LOW → PASS, it is rotated counterclockwise. When the output values of the left and right sensors 60A and 60B become the same value, the encoder value of the CR axis motor is acquired as the coordinate position of the CR axis.

(Step S130)
Next, the coordinate position of the CX axis is detected. The CX axis motor 15F of the transport device 15 is driven, and the holding unit 15A is driven backward (CX direction). When the left sensor 60A approaches the left target unit 70A and the output value changes from PASS to HIGH, the encoder value of the CX axis motor is acquired as the coordinate position of the CX axis.

(Step S140)
Next, the coordinate position of the CS axis is detected. The CS axis motor 15E is driven, and the holding portion 15A is driven leftward (CS direction). When the left sensor 60A detects a step on the right side of the left target unit 70A and the output value changes from HIGH or PASS to LOW, the encoder value of the CS axis motor is acquired. Then, as the coordinate position of the CS axis, a value is calculated by subtracting a predetermined value A ₁ from the obtained encoder values. Here, the predetermined value A _1, a value obtained by converting the width dimension to the encoder value of the convex portion 70D of the target portion 70.

(Step S150)
Next, CZ-axis coordinate position detection is performed. The CZ-axis motor 15D is driven to drive the holding unit 15A upward (CZ direction). The right sensor 60B detects the step at the upper part of the right target unit 70B, and acquires the encoder value of the CZ-axis motor when the output value becomes HIGH or PASS → LOW. Then, as the coordinate position of the CZ axis, and calculates the acquired value obtained by subtracting the encoder value from the predetermined value A _2. Here, the predetermined value A _2, is a value obtained by converting the vertical width dimension of the convex portion 70D to the encoder value of the target portion 70.

(Step S160)
Next, the motors 15D to 15F of the respective axes are driven to move the holding portion 15A to the end face of the shelf 13 in the first row A row.

(Step S170)
Detection of CS axis deviation of the conveying device 15 (running correction) is performed. The laser beam of the left sensor 60A is irradiated to the end surface of the shelf board 13, the CS axis motor 15E is driven, and the holding portion 15A is driven in the left-right direction (CS direction). When the laser beam of the left sensor 60A detects the notch 13C and the output value changes, the encoder value of the CS axis motor is acquired.

(Step S180)
Based on the coordinate position of each axis and the deviation value of the CS axis, the coordinate position of each placement portion in the first-stage B to D rows is calculated.

(Step S190)
Based on the coordinate positions of the first stage placement units, the theoretical coordinate positions of the second to fourth stage placement units (rows A to D) are calculated.

(Step S200)
The holding portion 15A is moved to the theoretical coordinate position of the nth stage (n = 2 or more) A row.

(Step S210)
Parallel coordinate position detection (parallelism adjustment) in the CR axis direction is performed on the end face of the shelf 13 in the n-th row A row. The end face of the shelf 13 is irradiated with the laser beam of the sensor 60, and the CR shaft motor 12B is driven to rotate the support column 12 of the storage shelf 11 so that the output values of the left and right sensors 60A and 60B are the same. When the output values of the left and right sensors 60A and 60B become the same value, the encoder value of the CR axis motor is acquired as the coordinate position of the CR axis. Then, based on the coordinate position of the CR axis of the nth stage A column, the coordinate position of the CR axis of the nth stage B to D columns is calculated.

(Step S220)
The coordinate position of the CX axis in the nth row A row is detected. The CX axis motor 15F of the transport device 15 is driven, and the holding unit 15A is driven backward (CX direction). When the left sensor 60A approaches the plate end surface and the output value changes from PASS to HIGH, the encoder value of the CX axis motor is acquired as the coordinate position of the CX axis. Next, the coordinate position detection of the CS axis of the nth stage A row is performed. The CS axis motor 15E of the transport device 15 is driven to drive the holding portion 15A in the left direction (CS direction). When the left sensor 60A detects the notch 13C and the output value changes, the encoder value of the CS axis motor is acquired as the CS axis coordinate position.

(Step S230)
Similarly to (Step S220), the coordinate position of each CX axis in the nth stage BD row is detected.

(Step S240)
It is determined whether (Step S200) to (Step S230) have been completed for all levels and columns of the storage shelf 11. The processes of (Step S200) to (Step S230) are repeatedly executed for each column in each column until the processing for all columns and columns is completed.

(Step S250)
When the processing is completed for all the levels and columns of the storage shelf 11, the detection operation is terminated. That is, the motors 15D to 15I and 12B of the respective axes are driven and driven to the HOME position.

(Step S260)
The coordinate positions detected and calculated in (Step S120) to (Step S230) are stored in the memory 121c.

  Through the teaching process described above, the coordinate position of the holding portion 15A when the transport device 15 performs the pod 9 transfer operation on the storage shelf 11 is obtained. During actual operation, the pod 9 can be transferred by the same operation as teaching by driving the motor of each axis based on the coordinate position stored in the memory 121c.

  Although the teaching process of the storage shelf 11 has been described above, the target jig 69 is also installed on the upper and lower stages of the pod opener 14, and the teaching process of the storage shelf 11 and the teaching process of the pod opener 14 are performed automatically and continuously. Also good.

  For example, the teaching process of the pod opener 14 shown in FIG. 11 is performed before the above-described (Step S110).

(Step S10)
The holding portion 15A is moved to the upper stage of the pod opener 14.

(Step S20)
The coordinate positions of the CX axis, the CS axis, and the CZ axis are calculated in the same procedure as (Step S130) to (Step S150).

(Step S30)
The holding portion 15A is moved to the lower stage in front of the pod opener 14.

(Step S40)
The coordinate positions of the CX axis and CS axis are calculated in the same procedure as (Step S20). Based on the coordinate position of the CZ axis in the upper stage of the pod opener 14 calculated in (Step S30), the coordinate position of the CZ axis is calculated.

(Step S50)
The detection operation is terminated. That is, the motor of each axis is driven and driven to the HOME position.

(Step S60)
The coordinate positions detected and calculated in (Step S20) and (Step S40) are stored in the memory 121c.

  When (Step S60) is completed, (Step S110) is continuously executed. As described above, the teaching process between the pod opener 14 and the storage shelf 11 is automatically performed continuously, whereby the teaching work time can be shortened and the working efficiency can be improved.

(5) Effects according to this embodiment According to this embodiment, one or a plurality of effects described below can be obtained.

  (A) By performing teaching work automatically, it is possible to suppress variations in man-hours and quality such as work time and teaching accuracy by the operator. As a result, the teaching work can be performed with a constant time and accuracy regardless of the operator. Also, by automating the teaching work, the operator can perform maintenance work at other locations in parallel with the teaching work, so that work efficiency can be improved and downtime of the substrate processing apparatus can be reduced. it can.

  (B) By forming the notch on the end surface of the storage shelf, the teaching work can be performed accurately without installing the target jig in each stage or each row of the storage shelf. One target jig need only be installed in any row at the bottom of the storage shelf, so that it is possible to omit dangerous high-place work during teaching work, thus ensuring worker safety. Can do.

  (C) By installing two sensors apart from each other, the distance to the object can be detected at two locations, and therefore the parallelism (degree of parallelism) between the holding unit and the object can be detected. . Thereby, it is not necessary to prepare a new jig in order to detect the parallelism, and the teaching work can be performed efficiently. In addition, by changing the installation direction of the sensor according to the detection direction of the sensor, the detection in the horizontal direction and the front-rear direction can be distributed to the left and right sensors, and the driving distance of the holding unit during teaching work can be set appropriately. Since the distance can be set, the accuracy of teaching work can be improved.

  (D) By forming the notch portion on the end surface of the shelf board, the driving distance of the holding portion when detecting the notch portion is shortened as compared with the case where the notch portion is formed on a portion other than the end surface of the shelf board. And teaching work can be performed efficiently.

(6) Modification This embodiment is not limited to the above-described embodiment, and can be modified as in the following modification. Also in the modification shown below, there exists an effect similar to the above-mentioned aspect.

(Modification 1)
It is good also as a structure provided with the non-reflective part which does not reflect a laser beam around the target part 70, without forming convex part 70D in the target part 70. FIG. Further, a groove may be formed around the target unit 70. Further, the target unit 70 may be formed as a single plate instead of being installed as a pair on the left and right. With such a configuration, the target jig 59 can be manufactured at low cost.

(Modification 2)
Instead of a rotating shelf, a fixed shelf may be used as the storage shelf 11. In this case, since the storage shelf does not rotate, the coordinate position detection step of the CR axis such as (Step S120) and (Step S210) in FIG. 10 is omitted. In the case of a fixed shelf, the target jig 69 is installed in an arbitrary row at the bottom of the fixed shelf. Moreover, it is preferable to form a notch part in the end surface of the shelf board of each mounting part of a fixed shelf similarly to a rotation shelf.

(Modification 3)
The teaching work program may be stored in an external tool, and the work may be performed by connecting the external tool to each axis motor and sensor during the teaching work. Since the teaching work can be performed independently in a state where the transfer system is separated from the control system of the substrate processing apparatus 1, the maintenance efficiency can be improved. The coordinate position detected by the external tool is preferably stored in an external storage device and read by the operation unit 121, for example.

  The above-described embodiments and modifications can be used in appropriate combinations. The processing procedure and processing conditions at this time can be the same as the processing procedure and processing conditions of the above-described embodiment, for example. In addition, the sensor is an optical sensor of a different form from the above-described optical sensor, a sensor that detects a position by detecting a shelf as an image, and a time from when an ultrasonic wave is emitted to an object and the reflected wave returns. It is also possible to use an ultrasonic sensor or the like that detects the presence / absence and distance of the object. Further, the number of storage shelves is not limited to four, and the above teaching process can be applied to any number of shelves.

<Preferred embodiment of the present invention>
Hereinafter, preferred embodiments of the present invention will be additionally described.

(Appendix 1)
According to one aspect of the invention,
A storage shelf for storing a storage container storing a substrate;
A holding portion for holding the storage container;
A drive unit for driving the holding unit in the left-right direction, the front-rear direction, and the vertical direction;
The pair of sensor units installed in the holding unit acquires an encoder value of the drive unit when the identification unit formed in the storage shelf and the target unit installed in the storage shelf are detected, and the encoder Based on the value, the coordinate position in the left-right direction, the front-rear direction, and the vertical direction of the holding unit when storing the storage container from the holding unit to the storage shelf is calculated, and the storage container is determined based on the calculated result. A control unit configured to control the drive unit and the sensor unit to store in a storage shelf;
A substrate processing apparatus is provided.

(Appendix 2)
The apparatus according to appendix 1, preferably,
The sensor unit is
A first sensor used for setting coordinate positions in the left-right direction and the front-rear direction of the holding unit;
And a second sensor used for setting the vertical coordinate position of the holding unit.

(Appendix 3)
The apparatus according to appendix 2, preferably,
The first sensor and the second sensor set the parallelism of the holding part with respect to the placement part.

(Appendix 4)
The apparatus according to any one of appendices 1 to 3, preferably,
The identification unit is formed at an end of the storage shelf facing the holding unit.

(Appendix 5)
The apparatus according to appendix 4, preferably,
The storage shelf is provided in a plurality of stages, and the target unit is installed in the lowest stage of the storage shelf.

(Appendix 6)
The apparatus according to any one of appendices 1 to 5, preferably,
The target portion is
The base,
It is comprised with the convex part protruded from the said base.

(Appendix 7)
The apparatus according to appendix 6, preferably,
The convex portion has a surface area smaller than that of the base portion, and the target portion is formed in a shape in which side surfaces and a lower surface of the base portion and the convex portion are continuously flat.

(Appendix 8)
The apparatus according to appendix 6 or 7, preferably,
Some corners of the convex part are formed in a tapered shape.

(Appendix 9)
The apparatus according to any one of appendices 1 to 8, preferably,
A rotation drive unit for rotating the storage shelf;
The control unit obtains an encoder value of the driving unit and an encoder value of the rotation driving unit when a pair of sensor units installed in the holding unit detect a target unit installed in the storage shelf. Based on the encoder value, the coordinate position of the holding unit when the storage container is stored from the holding unit to the storage shelf is calculated in the left-right direction, the front-rear direction, the vertical direction, and the rotation direction. The drive unit, the sensor unit, and the rotation drive unit are controlled to store the storage container in the storage shelf.

(Appendix 10)
According to another aspect of the invention,
A step of transporting the storage container to a storage shelf by a transport device including a holding unit that holds a storage container that stores a substrate and a drive unit that moves the holding unit in the left-right direction, the front-rear direction, and the vertical direction;
Transporting the substrate in the storage container to a processing chamber;
Processing the substrate in the processing chamber,
In the step of transporting the storage container, the pair of sensor units installed in the holding unit detect the identification unit formed in the storage shelf and the target unit installed in the storage shelf. The storage container is stored based on coordinate positions in the left-right direction, the front-rear direction, and the vertical direction of the holding unit when the storage container is stored from the holding unit to the storage shelf. A method for manufacturing a semiconductor device to be stored on a shelf and a substrate processing method are provided.

(Appendix 11)
According to yet another aspect of the invention,
A procedure for transporting the storage container to a storage shelf by a transport device including a holding unit that holds a storage container for storing a substrate and a drive unit that moves the holding unit in the left-right direction, the front-rear direction, and the vertical direction;
A procedure for unloading the storage container from the storage shelf and transferring the substrate in the storage container to a substrate holder;
A procedure for processing the substrate in a processing chamber;
In the step of transporting the storage container, the pair of sensor units installed in the holding unit detect the identification unit formed in the storage shelf and the target unit installed in the storage shelf. The storage container is stored based on coordinate positions in the left-right direction, the front-rear direction, and the vertical direction of the holding unit when the storage container is stored from the holding unit to the storage shelf. A program to be executed by a computer to be stored on a shelf or a computer-readable recording medium on which the program is recorded is provided.

(Appendix 12)
According to yet another aspect of the invention,
A substrate having a holding unit that holds a storage container that stores a substrate, a transfer device including a drive unit that moves the holding unit in the left-right direction, the front-rear direction, and the vertical direction, and a storage shelf on which the storage container is placed. A teaching method for a transfer device used in a processing device,
A step of moving the holding unit in which a pair of sensor units are installed in front of the storage shelf in which a target unit is installed;
The holding unit is driven in the left-right direction and the front-rear direction, and the target unit is detected by one of the sensor units, and the encoder value of the drive unit when the target unit is detected is obtained to obtain the left-right direction and the front-rear direction. Calculating a coordinate position;
A step of driving the holding unit in the vertical direction, detecting the target unit by the other sensor unit, obtaining an encoder value of the driving unit when the target unit is detected, and calculating a coordinate position in the vertical direction When,
Is provided.

9 Pod 11 Storage shelf 15 Transport device 60 Sensor 70 Target unit 121 Operation unit 131 Device controller

Claims (3)

A storage shelf for storing a storage container storing a substrate;
A holding portion for holding the storage container;
A drive unit for driving the holding unit in the left-right direction, the front-rear direction, and the vertical direction;
The pair of sensor units installed in the holding unit acquires an encoder value of the drive unit when the identification unit formed in the storage shelf and the target unit installed in the storage shelf are detected, and the encoder Based on the value, the coordinate position in the left-right direction, the front-rear direction, and the vertical direction of the holding unit when storing the storage container from the holding unit to the storage shelf is calculated, and the storage container is determined based on the calculated result. A control unit configured to control the drive unit and the sensor unit to store in a storage shelf;
A substrate processing apparatus.
A step of transporting the storage container to a storage shelf by a transport device including a holding unit that holds a storage container that stores a substrate and a drive unit that moves the holding unit in the left-right direction, the front-rear direction, and the vertical direction;
Transporting the substrate in the storage container to a processing chamber;
Processing the substrate in the processing chamber,
In the step of transporting the storage container, the pair of sensor units installed in the holding unit detect the identification unit formed in the storage shelf and the target unit installed in the storage shelf. The storage container is stored based on coordinate positions in the left-right direction, the front-rear direction, and the vertical direction of the holding unit when the storage container is stored from the holding unit to the storage shelf. A method for manufacturing a semiconductor device to be stored on a shelf.
A substrate having a holding unit that holds a storage container that stores a substrate, a transfer device including a drive unit that moves the holding unit in the left-right direction, the front-rear direction, and the vertical direction, and a storage shelf on which the storage container is placed. A teaching method for a transfer device used in a processing device,
A step of moving the holding unit in which a pair of sensor units are installed in front of the storage shelf in which a target unit is installed;
The holding unit is driven in the left-right direction and the front-rear direction, and the target unit is detected by one of the sensor units. Calculating a coordinate position;
A step of driving the holding unit in the vertical direction, detecting the target unit by the other sensor unit, obtaining an encoder value of the driving unit when the target unit is detected, and calculating a coordinate position in the vertical direction When,
Teaching method for a conveying apparatus having