JP2017092148A - Method of manufacturing electronic device and apparatus of manufacturing electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device and an apparatus of manufacturing an electronic device which allow for long life of an opening formation member.SOLUTION: In a manufacturing method, an opening formation member 200 placed on a second movable mold 323 is pressed against a drain electrode without reaching a first movable mold 322, by moving the second movable mold 323 in the direction approaching one side of a circuit board, thus deforming the opening formation member 200 without reaching the first movable mold 322. Thereafter, a constituent material 30 is hardened, while deforming the opening formation member 200. In a manufacturing method, pressing of the opening formation member 200 against a pre-mold structure is stopped, by moving the second movable mold 323 in the direction receding from one side of the circuit board, and the opening formation member 200 is taken out from the mold resin 30.SELECTED DRAWING: Figure 9

Description

  The present invention relates to an electronic device manufacturing method and an electronic device manufacturing apparatus in which circuit elements are mounted on a circuit board and a mold resin is formed.

  Conventionally, as an example of an electronic device manufacturing method, there is a method disclosed in Patent Document 1. Patent Document 1 describes a method of exposing a part of an electronic device from a mold resin. In Patent Document 1, a mold resin is formed using an upper mold composed of a cavity forming member provided so as to be movable up and down and a chip pressing member provided in a through hole in the central portion of the cavity forming member so as to be raised and lowered. . The chip pressing member has a lower surface that completely covers the back surface of the chip, and a film (hereinafter referred to as an opening forming member) having a lower hardness than the chip is formed so as to cover at least the lower surface.

  And the manufacturing method of patent document 1 descend | falls, after the board | substrate with which the chip | tip was mounted | worn is mounted in the recessed part of a lower mold | type. In addition, the lower surface of the chip pressing member, that is, the surface on which the opening forming member is formed comes into contact with the back surface of the chip and presses the chip with a predetermined pressure. Next, the lower mold and the upper mold are clamped by lowering the cavity forming member. And molten resin is inject | poured into the cavity formed by mold clamping via a resin flow path.

Japanese Patent No. 4017480

  By the way, in Patent Document 1, when the cavity forming member descends, the opening forming member is disposed in the through hole and is sandwiched between the chip pressing member and the cavity forming member. Therefore, in patent document 1, since an opening formation member is worn out or torn by friction with a cavity formation member, there exists a problem that an opening formation member is not suitable for repeated use.

  The present invention has been made in view of the above problems, and an object thereof is to provide an electronic device manufacturing method and an electronic device manufacturing apparatus capable of extending the life of an opening forming member.

In order to achieve the above object, the present invention provides:
An electronic structure (110) having circuit elements (21, 22, 23) mounted on one surface of the circuit board (10, 10c) and a part of the electronic structure being exposed while covering the one surface and the circuit elements. A manufacturing method of an electronic device including a mold resin (30) in which openings (31, 31a to 31c) are formed,
It is a member made of an elastic body for making contact with an exposed portion of the electronic structure to be exposed to form an opening, and has a contact portion that contacts the exposed portion, from one end surface to the bottom that is the opposite end surface. An opening forming member (200, 200a, 200b) having a shape whose cross-sectional area increases as it goes;
A space is formed between the electronic structure and a space in close contact with the surface to be supplied with the molding resin constituent material. A hole is provided at a position facing the exposed portion and the periphery of the exposed portion. And a pressing portion (323) configured to be movable in a direction perpendicular to one surface within the hole and pressing the contact portion against the electronic structure while supporting the bottom portion. Use the type and
By moving the pressing portion in a direction approaching one surface, the contact portion of the opening forming member arranged on the pressing portion is pressed against the exposed portion without reaching the facing portion, and the opening forming member is moved without reaching the facing portion. A pressing step to deform,
A molding process for curing the constituent material in the space in a state where the opening forming member is deformed,
After the molding process, the pressing part is moved in a direction away from the one surface, thereby stopping the pressing of the opening forming member against the electronic structure and taking out the opening forming member from the mold resin, To do.

  As described above, the present invention uses the opening forming member and the mold to manufacture an electronic device including a mold resin in which an opening is formed so that a part of the electronic structure is exposed. And this invention hardens the constituent material of mold resin in the state which deform | transformed the opening formation member, and then stops the press of an opening formation member by moving a press part in the direction away from one surface. Since the opening forming member is an elastic body, when the pressing is stopped, the opening forming member returns to the shape before deformation. For this reason, when this invention stops the press of an opening formation member, an opening formation member can be taken out from mold resin and an opening part can be formed in mold resin.

  Moreover, this invention presses the contact part of the opening formation member arrange | positioned on a press part to an exposure part, without reaching an opposing part, and deform | transforms an opening formation member, without reaching an opposing part. For this reason, even if a press part moves within a hole, this invention can suppress that an opening formation member is pinched | interposed by an opposing part and a press part, and a friction arises. Therefore, the present invention can suppress the opening forming member from being worn or torn, and can extend the life of the opening forming member.

  Furthermore, the opening forming member has a shape in which the cross-sectional area becomes wider from one end face to the bottom. The opening formed by using the opening forming member can have a larger opening area on the opening end side than on the exposed part side. For this reason, this invention can improve the mold release property of the opening formation member with respect to mold resin.

Further features of the invention include
An electronic structure (110) having circuit elements (21, 22, 23) mounted on one surface of the circuit board (10, 10c) and a part of the electronic structure being exposed while covering the one surface and the circuit elements. An electronic device manufacturing apparatus including a mold resin (30) in which openings (31, 31a to 31c) are formed,
It is a member made of an elastic body for making contact with an exposed portion of the electronic structure to be exposed to form an opening, and has a contact portion that contacts the exposed portion, from one end surface to the bottom that is the opposite end surface. An opening forming member (200, 200a, 200b) having a shape whose cross-sectional area increases as it goes;
A space is formed between the electronic structure and a space in close contact with the surface to be supplied with the molding resin constituent material. A hole is provided at a position facing the exposed portion and the periphery of the exposed portion. And a pressing portion (323) configured to be movable in a direction perpendicular to one surface within the hole and pressing the contact portion against the electronic structure while supporting the bottom portion. A mold, and
The opening forming member is disposed on the pressing portion without reaching the facing portion,
The pressing portion moves in a direction approaching one surface, presses the contact portion of the opening forming member against the exposed portion, deforms the opening forming member without reaching the facing portion, and moves away from the one surface after the constituent material is cured. It moves to a direction and takes out an opening formation member from mold resin, It is characterized by the above-mentioned.

  As described above, the present invention includes the opening forming member and the mold in order to manufacture the electronic device including the mold resin in which the opening is formed so that a part of the electronic structure is exposed. And this invention moves a press part in the direction which approaches one surface, presses the contact part of an opening formation member to an exposure part, and deform | transforms an opening formation member without reaching an opposing part, and a constituent material hardens | cures Then, it moves to the direction away from one surface, and takes out an opening formation member from mold resin. Since the opening forming member is an elastic body, when the pressing is stopped, the opening forming member returns to the shape before deformation. Therefore, in the present invention, when the pressing part is moved away from one surface after the component material is cured, the opening forming member can be taken out from the mold resin, and the opening can be formed in the mold resin.

  Moreover, this invention presses the contact part of the opening formation member arrange | positioned on a press part to an exposure part, without reaching an opposing part, and deform | transforms an opening formation member, without reaching an opposing part. For this reason, even if a press part moves within a hole, this invention can suppress that an opening formation member is pinched | interposed by an opposing part and a press part, and a friction arises. Therefore, the present invention can suppress the opening forming member from being worn or torn, and can extend the life of the opening forming member.

  Furthermore, the opening forming member has a shape in which the cross-sectional area becomes wider from one end face to the bottom. The opening formed by using the opening forming member can have a larger opening area on the opening end side than on the exposed part side. For this reason, this invention can improve the mold release property of the opening formation member with respect to mold resin.

  The reference numerals in parentheses described in the claims and in this section indicate the correspondence with the specific means described in the embodiments described later as one aspect, and the technical scope of the invention is as follows. It is not limited.

It is a top view which shows schematic structure of the electronic device in embodiment. It is sectional drawing which follows the II-II line of FIG. It is a top view which shows schematic structure of the structure in embodiment. It is a top view which shows schematic structure of the opening formation member in embodiment. It is sectional drawing which follows the VV line of FIG. It is a top view which shows schematic structure of the lower mold | type in embodiment. It is sectional drawing of the structure before a resin application in embodiment, and a metal mold | die. It is sectional drawing of the structure and metal mold | die after resin application in embodiment. It is sectional drawing of the structure at the time of the molding pressure application in embodiment, and a metal mold | die. It is sectional drawing of the electronic apparatus after the molding pressure application in embodiment. It is an expanded sectional view containing the opening formation member at the time of the molding pressure application in embodiment. It is an expanded sectional view containing the opening part after the molding pressure application in embodiment. 10 is a cross-sectional view illustrating a schematic configuration of an electronic device according to Modification 1. FIG. 12 is a plan view showing a schematic configuration of an opening forming member in Modification 2. FIG. 10 is a plan view showing a schematic configuration of an opening forming member in Modification 3. FIG. It is sectional drawing of the structure and resin mold before resin application in the modification 4. It is sectional drawing of the structure after a resin application in the modification 4, and a metal mold | die. It is sectional drawing of the structure at the time of the molding pressure application in the modification 4, and a metal mold | die. FIG. 11 is a cross-sectional view of an electronic device after application of a molding pressure in Modification 4. It is sectional drawing of the structure before a resin application in modification 5, and a metal mold | die. It is sectional drawing of the structure after a resin application in the modification 5, and a metal mold | die. It is sectional drawing of the structure at the time of the molding pressure application in the modification 5, and a metal mold | die. FIG. 11 is a cross-sectional view of an electronic device after applying molding pressure in Modification 5. 14 is a cross-sectional view illustrating a schematic configuration of an electronic device according to Modification 6. FIG. 10 is a cross-sectional view illustrating a schematic configuration of an electronic device according to Modification 7. FIG.

  Hereinafter, a plurality of embodiments for carrying out the invention will be described with reference to the drawings. In each embodiment, portions corresponding to the matters described in the preceding embodiment may be denoted by the same reference numerals and redundant description may be omitted. In each embodiment, when only a part of the configuration is described, the other configurations described above can be applied to other portions of the configuration.

  As shown in FIGS. 1 and 2, the electronic device 100 includes a circuit board 10, circuit elements 21 and 22 mounted on one surface of the circuit board 10, and a mold resin 30. The electronic device 100 can also be said to be obtained by forming the mold resin 30 on the pre-mold structure 110 shown in FIG. The pre-mold structure 110 corresponds to an electronic structure, and circuit elements 21 and 22 are mounted on one surface of the circuit board 10.

  The circuit board 10 is obtained by forming a wiring with a conductive pattern such as copper on an insulating base material such as resin or ceramics. As the circuit board 10, for example, a multilayer board in which conductor patterns are laminated via an insulating base material, or a single layer board in which a single layer conductor pattern is formed on an insulating base material can be adopted. Further, the circuit board 10 has a surface pattern which is a part of the wiring formed on one surface of the insulating base material. Part of the surface layer pattern is a pad on which the circuit elements 21 and 22 are mounted. Further, since one surface of the circuit board 10 is a surface on which the circuit elements 21 and 22 are mounted, it can be said to be a mounting surface. The circuit board 10 may have a surface pattern formed on the opposite surface of the insulating base material.

  The electronic device 100 is provided with a heating element as the circuit element 21. Therefore, in the following, it is also referred to as a heating element 21. The heating element 21 is an element that generates heat when operated, and for example, a power semiconductor element such as a MOSFET or an IGBT can be employed. The circuit element 22 is, for example, a passive element such as a chip resistor or a chip capacitor, or a semiconductor element that does not generate as much heat as the heating element 21.

  The heating element 21 is a bare chip-shaped circuit element in which electrodes are formed on both surfaces of a base portion mainly composed of a semiconductor. That is, it can be said that the heat generating element 21 has a surface electrode formed on the front surface and a back electrode formed on the back surface. In the present embodiment, as an example, the heating element 21 in which the drain electrode 21a is formed as the front electrode and the gate electrode 21b and the source electrode 21c are formed as the back electrode is employed.

  The heating element 21 is mounted on the circuit board 10 with the gate electrode 21 b and the source electrode 21 c facing the circuit board 10. That is, in the heating element 21, each of the gate electrode 21 b and the source electrode 21 c is bonded to the surface pattern of the circuit board 10 via a conductive bonding member such as solder. Further, the heating element 21 is exposed from the mold resin 30 with the drain electrode 21a as an exposed portion.

  As described above, only the drain electrode 21 a of the heating element 21 is exposed from the mold resin 30. However, in addition to the drain electrode 21 a, the periphery of the drain electrode 21 a may be exposed from the mold resin 30 due to the collapse of the opening forming member 200 described later.

  Note that the heating element 21 may have the drain electrode 21a electrically connected to the circuit board 10 via a known clip. The clip is formed by bending a plate member composed mainly of a metal such as copper. In this case, a portion of the clip facing the drain electrode 21a may be exposed from the mold resin 30 as an exposed portion.

  The mold resin 30 is composed mainly of a resin having electrical insulation. The mold resin 30 is formed with an opening 31 so as to cover a surface of the circuit board 10 and the heating element 21 so that a part of the pre-mold structure 110 is exposed. In the present embodiment, a mold resin 30 in which an opening 31 is formed so as to expose the drain electrode 21a is employed. Therefore, as shown in FIG. 1, in the electronic device 100, the drain electrode 21 a can be seen at a position surrounded by the mold resin 30 in a plan view when viewed from one surface side of the circuit board 10. In other words, in the electronic device 100, the drain electrode 21 a is exposed in a recess that is recessed from the periphery of the mold resin 30.

  In addition, it can be said that the mold resin 30 covers the surface of the circuit board 10 in a state where the mold resin 30 is in contact with a surface of the heating element 21 except the drain electrode 21a. Further, the mold resin 30 covers the joint portion in a state where the mold resin 30 is in contact with the joint portion between the circuit board 10 and the circuit elements 21 and 22. The mold resin 30 covers the circuit element 22.

  Since the electronic apparatus 100 is formed with the mold resin 30, it can protect one surface of the circuit board 10, the circuit elements 21, 22 and the like, and can improve the bonding strength between the circuit board 10 and the circuit elements 21, 22. The molding resin 30 is formed by, for example, a compression molding method in a molding process described later.

  In the electronic device 100, since the drain electrode 21a is exposed from the mold resin 30, the heat dissipation of the heat generating element 21 can be improved as compared with the case where the drain electrode 21a is covered with the mold resin 30.

  In the electronic device 100, a heat dissipation member may be attached to the mold resin 30 side. The heat radiating member has a protrusion corresponding to the shape of the opening 31. That is, in the electronic device 100, the heat dissipation member is attached in a state where the protrusion is inserted into the opening 31. Thereby, the electronic device 100 can further improve the heat dissipation of the heat generating element 21. In the electronic device 100, when the protrusion and the drain electrode 21a are connected via an insulating sheet, the heat dissipation of the heating element 21 can be improved while electrically insulating the drain electrode 21a and the heat dissipation member. it can.

  Further, in the electronic device 100, the mold resin 30 side is attached to a refrigerant tube or the like, and the opening 31 can be a part of the refrigerant flow path. In this case, it is preferable to provide an insulating sheet on the surface of the drain electrode 21a. Also by this, the electronic device 100 can improve the heat dissipation of the heat generating element 21.

  Next, a manufacturing apparatus and a manufacturing method of the electronic device 100 will be described with reference to FIGS. In this manufacturing method, the electronic apparatus 100 is manufactured using a manufacturing apparatus including a mold and an opening forming member 200.

  First, the manufacturing apparatus will be described. The manufacturing apparatus includes a mold and an opening forming member 200. The opening forming member 200 shown in FIGS. 4 and 5 is a member for forming the opening 31 reaching the drain electrode 21a in the mold resin 30 in contact with the drain electrode 21a. The opening forming member 200 is also a member for suppressing the formation of the thin mold resin 30 on the surface of the drain electrode 21a. It can be said that the thin mold resin 30 is a flash.

  The opening forming member 200 is a member made of an elastic body such as silicone. As will be described in detail later, the opening forming member 200 is deformed by being pressed against the drain electrode 21a by the second movable mold 323, and returns to the shape before being pressed when released from the pressure by the second movable mold 323. is there. In other words, the opening forming member 200 is elastically deformed by being pressed against the drain electrode 21a, and returns to its original shape when separated from the drain electrode 21a.

  The opening forming member 200 is preferably made of a material having excellent durability and heat resistance. When forming the mold resin 30, the opening forming member 200 is heated together with the mold resin 30 and a molding pressure is applied. For this reason, the opening formation member 200 can endure the temperature at the time of forming the mold resin 30. That is, it is preferable that the opening forming member 200 is made of a material that is excellent in durability and heat resistance with respect to the pressure and temperature when the molding pressure is applied. Further, the opening forming member 200 is preferably made of a material that is excellent in releasability from the mold resin 30.

  In the present embodiment, an opening forming member 200 having a shape as shown in FIGS. 4 and 5 is employed as an example. That is, the opening forming member 200 includes a rectangular opposing surface 210 that is in close contact with the drain electrode 21a in the manufacturing process, a rectangular rear surface 220 that is the opposite surface of the opposing surface 210, and each side of the opposing surface 210 and the rear surface 220. It has four side surfaces 230 connected to each side.

  Further, the opening forming member 200 has an inclined portion 231 formed on a part of each side surface 230 on the facing surface 210 side. That is, it can be said that the opening forming member 200 has a shape in which a rectangular parallelepiped and a square frustum are integrally formed. As a result, the opening forming member 200 has a shape in which the cross-sectional area increases from the facing surface 210 to the back surface 220. Therefore, the area of the facing surface 210 is smaller than the area of the back surface 220. Here, the cross-sectional area is an area of a cross section parallel to the facing surface 210 and the back surface 220.

  Further, as shown in FIG. 5, it can be said that the opening forming member 200 has a trapezoidal cross section when cut at a virtual plane perpendicular to the opposing surface 210 and the back surface 220. The facing surface 210 corresponds to the contact portion and one end surface, and the back surface 220 corresponds to the bottom portion.

  As shown in FIG. 6, the opening forming member 200 is disposed on the upper surface of the second movable mold 323 with the back surface 220 facing the second movable mold 323. The opening forming member 200 is disposed on the upper surface of the second movable mold 323 in a removable state. In FIG. 6, the opening forming member 200 is disposed on the upper surface of the second movable mold 323, and the facing surface 210 and the inclined portion 231 of the opening forming member 200 and a part of the upper surface of the second movable mold 323. Is illustrated.

  The opening forming member 200 has a size that does not protrude from the facing region of the upper surface of the second movable mold 323 in a state before elastic deformation and in a state of elastic deformation. The area of the back surface 220 is always smaller than the area of the upper surface of the second movable mold 323. The opening forming member 200 has a thickness of 0.5 mm or more, for example.

  Next, the compression mold will be described with reference to FIGS. That is, in this embodiment, a compression mold is used as the mold. The compression mold is configured to include an upper mold 310 and a lower mold 320. The lower mold 320 corresponds to the mold in the claims. In the following description, the direction of gravity is set downward and the direction opposite to the direction of gravity is set upward.

  For example, the upper mold 310 and the lower mold 320 can move relatively closer or farther as the lower mold 320 moves up or down. As shown in FIG. 7, the upper mold 310 has a flat surface on which the pre-mold structure 110 is fixed (supported). The upper mold 310 is disposed in parallel with the ground, for example. The pre-mold structure 110 is fixed to a flat surface with the opposite surface of the circuit board 10 facing the flat surface of the upper mold 310. In addition, the upper mold 310 is provided with a fixing mechanism such as a vacuum clamp or a mechanical clamp in order to fix the pre-mold structure 110. However, the method for fixing the circuit board 10 to the upper mold 310 is not particularly limited.

  As illustrated in FIGS. 6 and 7, the lower mold 320 includes a clamp mold 321, a first movable mold 322, a second movable mold 323, and a spring 324. The lower mold 320 is disposed to face the upper mold 310 in a state where the pre-mold structure 110 is disposed between the lower mold 320 and the upper mold 310. The lower mold 320 forms a cavity 330, which is a space to which the constituent material of the mold resin 30 is supplied, in close contact with one surface of the circuit board 10 and between the pre-mold structure 110. In the following description, the reference numeral 30 is also given to the constituent material of the mold resin 30 for convenience. Moreover, as the constituent material 30, for example, a granular resin can be employed.

  The clamp mold 321 is provided with a hole surrounded by an annular side wall surface. When the mold resin 30 is molded, the clamp mold 321 comes into close contact with one surface of the circuit board 10. In other words, the clamp mold 321 is a portion that is annularly attached to one surface of the circuit board 10. In detail, it closely_contact | adheres over the perimeter of the edge part in the one surface of the circuit board 10. FIG.

  A first movable mold 322 and a second movable mold 323 are disposed in the hole of the clamp mold 321 so as to move upward and downward along the hole. More specifically, the first movable mold 322 corresponds to a facing portion, and is a portion provided with a hole portion at a position facing the drain electrode 21a and facing the drain electrode 21a. The first movable mold 322 is configured to be movable in a direction perpendicular to one surface of the circuit board 10 and applies a molding pressure to the constituent material 30 supplied to the cavity 330.

  On the other hand, the second movable mold 323 has the opening forming member 200 disposed on the upper surface as described above. The second movable mold 323 corresponds to a pressing portion, and is configured to be movable in a direction perpendicular to one surface of the circuit board 10 within the hole portion of the first movable mold 322, that is, in a vertical direction, and supporting the back surface 220. The opposing surface 210 is pressed against the drain electrode 21a. In the present embodiment, the second movable mold 323 having a rectangular upper surface is employed. However, the present invention is not limited to this. The upper surface of the second movable mold 323 may be circular.

  The first movable mold 322 and the second movable mold 323 are configured to be movable upward and downward by an actuator, for example. Further, the second movable mold 323 presses the opening forming member 200 against the drain electrode 21 a by the restoring force of the spring 324. However, the present invention is not limited to this. The second movable mold 323 can be employed even if it is driven upward by an actuator and presses the opening forming member 200 against the drain electrode 21a.

  As shown in FIG. 8, the lower mold 320 has an upper surface of the first movable mold 322 below the tip surface of the clamp mold 321 and the upper surface of the second movable mold 323 when the constituent material 30 is supplied. Is placed. Therefore, at this time, the region surrounded by the side wall surface of the clamp mold 321, the upper surface of the first movable mold 322, and the side wall surface of the second movable mold 323 can be said to be the cavity 330.

  Then, as shown in FIG. 9, the lower mold 320 has an upper surface of the first movable mold 322 and an upper surface of the second movable mold 323 along the same virtual plane when a molding pressure is applied to the constituent material 30. Be placed. Further, as shown in FIG. 9, the lower mold 320 has an upper surface of the first movable mold 322 and a second movable mold 323 below the front end surface of the clamp mold 321 when a molding pressure is applied to the constituent material 30. The upper surface of is arranged. Therefore, at this time, the region surrounded by the side wall surface of the clamp mold 321, the upper surface of the first movable mold 322, a part of the upper surface of the second movable mold 323, and the opening forming member 200 can be said to be the cavity 330.

  Here, this manufacturing method will be described with reference to FIGS. 3 and 7 to 12. First, in this manufacturing method, as shown in FIG. 3, the pre-mold structure 110 is prepared (preparation process). In the preparation step, the circuit elements 21 and 22 are mounted on the circuit board 10 by a known solder reflow or the like.

  Next, in this manufacturing method, the installation process shown in FIG. 7 is performed. In the installation process, the pre-mold structure 110 is fixed to the upper mold 310 so that one surface side of the circuit board 10 faces the lower mold 320. In addition, it can be said that the one surface side of the circuit board 10 is a forming surface side of the mold resin 30 in the pre-mold structure 110.

  Next, in this manufacturing method, as shown in FIG. 8, the constituent material 30 is supplied to the cavity 330 (resin-spreading step). In the resin rolling process, the granular constituent material 30 is spread over the region surrounded by the side wall surface of the clamp mold 321, the upper surface of the first movable mold 322, and the side wall surface of the second movable mold 323. At this time, the clamp mold 321, the first movable mold 322, and the second movable mold 323 are heated. Therefore, the constituent material 30 melts when supplied to the cavity 330.

  Next, in the present manufacturing method, as shown in FIG. 9, the component material 30 is molded by applying a molding pressure while heating the component material 30 in a state where the opening forming member 200 is pressed against the drain electrode 21a. (Pressing process, molding process).

  More specifically, in the present manufacturing method, the second movable mold 323 is moved in a direction approaching one surface of the circuit board 10, thereby pressing the facing surface 210 of the opening forming member 200 against the drain electrode 21 a, thereby opening the opening forming member 200. Is deformed (pressing step). At this time, in this manufacturing method, the opening forming member 200 arranged on the second movable mold 323 is pressed against the drain electrode 21a without reaching the first movable mold 322, and the opening is reached without reaching the first movable mold 322. The forming member 200 is deformed. That is, the opening forming member 200 does not reach the first movable mold 322 even if it is crushed between the second movable mold 323 and the drain electrode 21a. That is, the opening forming member 200 does not protrude from the opposing region on the upper surface of the second movable mold 323. Further, the opening forming member 200 is crushed to form a raised portion 240 around the drain electrode 21a as shown in FIG. The second movable mold 323 brings the opening forming member 200 into close contact with the drain electrode 21a so that the mold resin 30 does not enter the drain electrode 21a.

  In the manufacturing method, the constituent material 30 in the cavity 330 is cured in a state where the opening forming member 200 is deformed (molding process). In this manufacturing method, the clamp die 321 is in close contact with one surface of the circuit board 10 before the molding step. In the molding step, the first movable mold 322 is moved in a direction approaching one surface of the circuit board 10 to apply a molding pressure to the constituent material 30 in the cavity 330 to cure the constituent material 30. As a result, the mold resin 30 is formed around the opening forming member 200 in a deformed state, as shown in FIG. The mold resin 30 is in contact with the opening forming member 200 when a molding pressure is applied.

  Next, in this manufacturing method, as shown in FIG. 10, the lower mold 320 is released from the upper mold 310 (release process). In the release process, the entire lower mold 320 is moved away from one surface of the circuit board 10. Therefore, in the mold release process, the first movable mold 322 and the second movable mold 323 are also moved away from one surface of the circuit board 10. Thereby, in the mold release step, the pressing of the opening forming member 200 against the drain electrode 21a is stopped. Since the opening forming member 200 is an elastic body, when it is released from the pressing by the second movable mold 323, it returns to the shape before being pressed. For this reason, a clearance is formed between the mold resin 30 and the opening forming member 200. Then, in the mold release step, the opening forming member 200 is taken out from the mold resin 30 by moving the second movable mold 323 away from the one surface of the circuit board 10. Therefore, it can be said that the mold release step is a removal step.

  In the mold release process, the application of the molding pressure by the first movable mold 322 is also stopped. Thus, it can be said that, in the take-out process, after the molding process, application of the molding pressure is stopped and the opening forming member 200 is taken out from the mold resin 30. The electronic device 100 is manufactured by this manufacturing method. Note that, as described above, the opening forming member 200 is formed with the raised portion 240. For this reason, as shown in FIG. 12, the mold resin 30 has a recess 32 formed around the drain electrode 21a.

  As described so far, the manufacturing method includes the mold resin 30 in which the opening 31 is formed using the opening forming member 200 and the mold so that a part of the pre-mold structure 110 is exposed. The electronic device 100 is manufactured. And this manufacturing method hardens the constituent material of the mold resin 30 in a state where the opening forming member 200 is deformed, and then moves the second movable mold 323 in a direction away from one surface of the circuit board 10, thereby opening the opening. The pressing of the forming member 200 is stopped. Since the opening forming member 200 is an elastic body, when the pressing is stopped, the opening forming member 200 returns to the shape before the deformation. For this reason, in this manufacturing method, when the pressing of the opening forming member 200 is stopped, the opening forming member 200 can be taken out from the mold resin 30, and the opening 31 can be formed in the mold resin 30.

  Further, in this manufacturing method, the opposed surface 210 of the opening forming member 200 disposed on the second movable mold 323 is pressed against the drain electrode 21a without reaching the first movable mold 322, and reaches the first movable mold 322. The opening forming member 200 is deformed without any change. For this reason, in the present manufacturing method, even if the second movable mold 323 moves within the hole of the first movable mold 322, the opening forming member 200 is sandwiched between the first movable mold 322 and the second movable mold 323. The occurrence of friction can be suppressed. Therefore, this manufacturing method can suppress that the opening forming member 200 is worn or torn, and the life of the opening forming member 200 can be extended.

  Furthermore, the opening forming member 200 has a shape in which the cross-sectional area becomes wider from the facing surface 210 to the back surface 220. The opening 31 formed using the opening forming member 200 can have a larger opening area on the opening end side than on the drain electrode 21a side. For this reason, this manufacturing method can improve the releasability of the opening forming member 200 with respect to the mold resin 30.

  In addition, since this manufacturing method performs a molding process in the state which the opening formation member 200 contact | adhered to the drain electrode 21a, it can suppress that a flash is formed on the drain electrode 21a. Moreover, since this manufacturing method can expose the drain electrode 21a of the heat generating element 21 to the outside of the mold resin 30, the electronic device 100 excellent in heat dissipation can be manufactured. The manufacturing apparatus can achieve the above-described plurality of effects.

  By the way, in this embodiment, the example which forms the mold resin 30 by the compression molding method was employ | adopted. However, the present invention is not limited to this, and even a transfer mold method can be adopted. In this case, instead of the first movable mold 322, the lower mold 320 employs a fixed mold having a hole portion in which the second movable mold 323 can move in the vertical direction.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. Below, the modifications 1-6 of this invention are demonstrated. Although the said embodiment and the modifications 1-6 can each be implemented independently, it is also possible to implement combining suitably. The present invention is not limited to the combinations shown in the embodiments, and can be implemented by various combinations.

(Modification 1)
Depending on the shape of the opening forming member, an electronic device 100a as shown in FIG. 13 can be manufactured. FIG. 13 is a cross-sectional view corresponding to FIG. 2 in the above embodiment. The mold resin 30 of the electronic device 100a has an opening 31a having a curved surface. That is, it can be said that the manufacturing apparatus of Modification 1 includes an opening forming member that can manufacture the electronic device 100a. Moreover, it can be said that the manufacturing method of the modification 1 is performed using the opening formation member which can manufacture the electronic apparatus 100a. As the opening forming member of Modification 1, for example, an ellipsoidal member can be adopted.

(Modification 2)
The manufacturing apparatus according to the second modification includes an opening forming member 200a. The opening forming member 200a is different from the opening forming member 200 in shape as shown in FIG. Moreover, the manufacturing method of the modification 2 uses the opening formation member 200a. FIG. 14 is a cross-sectional view corresponding to FIG. 5 in the above embodiment.

  The opening forming member 200a includes a facing surface 210a, a back surface 220a, and a side surface 230a. The facing surface 210a has the same shape as the facing surface 210. In addition, the back surface 220a has the same shape as the back surface 220. The side surface 230a is inclined with respect to the facing surface 210a and the back surface 220a. That is, the opening forming member 200a has a quadrangular frustum shape. The manufacturing apparatus and manufacturing method of Modification 2 can achieve the same effects as in the above embodiment.

(Modification 3)
The manufacturing apparatus of Modification 3 includes an opening forming member 200b. As shown in FIG. 15, the opening forming member 200b is different in shape from the opening forming member 200a. Moreover, the manufacturing method of the modification 3 uses the opening formation member 200b. FIG. 15 is a cross-sectional view corresponding to FIG. 5 in the above embodiment.

  The opening forming member 200b includes a facing surface 210b, a back surface 220b, and a side surface 230b. The facing surface 210b has the same shape as the facing surface 210a. The back surface 220b has the same shape as the back surface 220a. The side surface 230b is inclined with respect to the opposing surface 210b and the back surface 220b and has a curved surface shape. That is, the opening forming member 200b has a quadrangular frustum shape with a curved side wall. The manufacturing apparatus and manufacturing method of Modification 3 can achieve the same effects as Modification 2.

(Modification 4)
The manufacturing method of Modification 4 is different from the above-described embodiment in the portion that is pressed by the opening forming member 200. In addition, the manufacturing apparatus of the modification 4 is the same as that of the said embodiment.

  The manufacturing method of the modification 4 is demonstrated using FIGS. The manufacturing method of the modification 4 is a method for manufacturing the electronic device 100b. In FIG. 16 to FIG. 18, circuit elements such as the heating element 21 are not shown.

  First, as shown in FIG. 16, an installation process is performed. This installation process is the same as the installation process of the said embodiment. In this installation step, the opening forming member 200 is disposed to face a part of the circuit board 10, that is, a part exposed from the mold resin 30. In the electronic device 100b, a part of the circuit board 10 becomes an exposed portion. Next, as shown in FIG. 17, a resin plating process is performed. The resin soaking process is the same as in the above embodiment.

  Next, as shown in FIG. 18, a pressing process and a molding process are performed. In the pressing step, the opening forming member 200 is deformed by pressing the facing surface 210 of the opening forming member 200 to a portion exposed from the mold resin 30 on one surface of the circuit board 10. And this manufacturing method performs a molding process in this state.

  Here, as shown in FIG. 18, an example is adopted in which the upper surface of the second movable mold 323 is arranged at a position higher than the upper surface of the first movable mold 322. As a result, as shown in FIG. 19, the mold resin 30 can have an opening end 32 b formed by the outer shape of the second movable mold 323.

  And as shown in FIG. 19, a mold release process is performed. This mold release process is the same as that of the said embodiment. Thereby, in this manufacturing method, the electronic device 100b shown in FIG. 19 can be manufactured.

  The electronic device 100 b manufactured by this manufacturing method is different from the electronic device 100 in that one surface of the circuit board 10 is exposed from the mold resin 30. That is, the mold resin 30 of the electronic device 100b has an opening 31b that reaches one surface of the circuit board 10.

  For this reason, the electronic device 100b can arrange | position a circuit element in the opening part 31b. That is, the electronic device 100b can mount a circuit element (out-mold element) that is not suitable for sealing with the mold resin 30 on a portion of the circuit board 10 exposed from the mold resin 30. The circuit elements that are not suitable for sealing with the mold resin 30 are elements that cannot withstand the temperature and molding pressure during the molding process, elements that are relatively large in size, and the like, and can be said to be elements outside the mold. The mold resin 30 of the electronic device 100b is different in shape from the mold resin 30 of the above embodiment, but the same reference numerals as those of the above embodiment are used for convenience.

  The manufacturing method of the modification 4 can have the same effect as the above embodiment. Furthermore, the manufacturing method of Modification 4 can manufacture the electronic device 100b.

(Modification 5)
The manufacturing method of the modified example 5 is different from the above embodiment in the portion pressed by the opening forming member 200. In addition, the manufacturing apparatus of the modification 5 is the same as that of the said embodiment.

  The manufacturing method of the modification 5 is demonstrated using FIGS. The manufacturing method of Modification 5 is a method for manufacturing the electronic device 100c. 20 to 23, circuit elements such as the heating element 21 are not shown.

  First, an installation process is performed as shown in FIG. In this installation step, the pre-mold structure 110 including the circuit board 10c in which the through hole 11c, which is a through hole penetrating in the thickness direction, is installed in the mold. In the circuit board 10c, a through hole is formed in an insulating base material, and a conductor which is a part of the wiring is exposed to the through hole, and a through hole 11c is formed. In this installation step, the opening forming member 200 is disposed to face the through hole 11c. In the electronic device 100c, the through hole 11c is an exposed portion. Next, as shown in FIG. 21, a resin plating process is performed. The resin soaking process is the same as in the above embodiment.

  Next, as shown in FIG. 22, a pressing process and a molding process are performed. In the pressing step, the side surface 230 of the opening forming member 200 is pressed against the through hole 11 c of the circuit board 10 to deform the opening forming member 200. And this manufacturing method performs a molding process in this state. Here, the facing surface 210 corresponds to one end surface, the side surface 230 corresponds to a contact portion, and the back surface 220 corresponds to a bottom portion.

  And a mold release process is performed as shown in FIG. This mold release process is the same as that of the said embodiment. Thereby, in this manufacturing method, the electronic device 100c shown in FIG. 23 can be manufactured.

  The electronic device 100 c manufactured by this manufacturing method is different from the electronic device 100 in that the through hole 11 c of the circuit board 10 is exposed from the mold resin 30. That is, the mold resin 30 of the electronic device 100c has an opening 31c communicating with the through hole 11c. For this reason, the through hole 11c can be used as a part for electrically connecting the electronic device 100c and the external device with a press-fit terminal.

(Modification 6)
In the electronic device 100d manufactured by the manufacturing method and manufacturing apparatus of Modification 6, a part of the electrolytic capacitor 23 is exposed from the mold resin 30 as shown in FIG. FIG. 24 is a cross-sectional view corresponding to FIG. 2 in the above embodiment.

  The electronic device 100d includes an electrolytic capacitor 23 having a first electrode 23a and a second electrode 23b formed on one surface as a circuit element. For example, an aluminum electrolytic capacitor can be used as the electrolytic capacitor 23. The electrolytic capacitor 23 is mounted with the first electrode 23a and the second electrode 23b facing the circuit board 10, and the opposite surface of the surface on which the first electrode 23a and the second electrode 23b are formed is an exposed portion of the mold resin 30. Is exposed from. That is, only the opposite surface of the electrolytic capacitor 23 is exposed from the mold resin 30, and other portions including the first electrode 23 a and the second electrode 23 b are covered with the mold resin 30. However, in the electrolytic capacitor 23, in addition to the opposite surface, a part of the opposite surface side of the side wall may be exposed from the mold resin 30 depending on how the opening forming member 200 is crushed.

  The electronic device 100 d can dissipate the electrolytic capacitor 23 while covering the electrolytic capacitor 23 with the mold resin 30. In the electronic device 100d, even if the electrolytic capacitor 23 leaks, the first electrode 23a and the second electrode 23b are short-circuited because the first electrode 23a and the second electrode 23b are sealed with the mold resin 30. Can be suppressed.

  The manufacturing apparatus of the modification 6 is the same as that of the said embodiment. Further, the manufacturing method of Modification 6 is different from the above-described embodiment only in that the opening forming member 200 is deformed by pressing the facing surface 210 of the opening forming member 200 against the opposite surface of the electrolytic capacitor 23. It is.

  The manufacturing apparatus and manufacturing method of Modification 6 can achieve the same effects as in the above embodiment. Furthermore, the manufacturing apparatus and the manufacturing method of Modification 6 can manufacture the electronic device 100d. The electronic device 100d may include the circuit elements 21 and 22 described above.

(Modification 7)
As shown in FIG. 25, the electronic device 100 e manufactured by the manufacturing method and manufacturing apparatus of Modification 6 includes the heat generating element 21 and the electrolytic capacitor 23 covered with the mold resin 30. FIG. 25 is a cross-sectional view corresponding to FIG. 2 in the above embodiment. As shown in FIG. 25, the electronic device 100e includes, as an example, a circuit configuration in which two heating elements 21 and one electrolytic capacitor 23 are electrically connected. However, the present invention is not limited to this. The electronic device 100e may include a circuit having a configuration different from the circuit configuration.

  The circuit board 10 includes a plurality of wirings 11 stacked via an insulating base, and an interlayer connection member 12 that electrically and mechanically connects the wirings 11 of different layers.

  The electronic device 100 e includes a clip 24 for electrically and mechanically connecting the drain electrode 21 a of the heating element 21 and the circuit board 10. The clip 24 is composed mainly of a metal such as copper or aluminum. The clip 24 faces the drain electrode 21a and is joined to the drain electrode 21a via a joining material, and the clip 24 faces the wiring 11 and is joined to the wiring 11 and the joining material via a joining material. It is comprised including the junction part and the intermediate part which continues to a 1st junction part and a 2nd junction part. For this reason, in the electronic device 100e, the first bonding portion bonded to the drain electrode 21a is exposed from the mold resin 30.

  In the electronic device 100 e, the drain electrode 21 a of one heating element 21 and the first electrode 23 a of the electrolytic capacitor 23 are electrically connected via the clip 24, the wiring 11, and the interlayer connection member 12. The second electrode 23 b of the electrolytic capacitor 23 is electrically connected to the source electrode 21 c of the other heating element 21 via the wiring 11 and the interlayer connection member 12. The drain electrode 21 a of the other heating element 21 is electrically connected to the source electrode 21 c of one heating element 21 via the clip 24, the wiring 11, and the interlayer connection member 12. The gate electrode 21b of each heating element 21 is electrically connected to an external connection terminal (not shown) or the like via the wiring 11 and the interlayer connection member 12.

  The manufacturing apparatus and manufacturing method of Modification 7 are the same as those in the above embodiment. Therefore, the manufacturing apparatus and the manufacturing method of Modification 7 can achieve the same effects as those of the above embodiment. Furthermore, the manufacturing apparatus and the manufacturing method of Modification 7 can manufacture the electronic device 100e. The electronic device 100e may include the circuit elements 21 and 22 described above.

  10, 10c circuit board, 21 heating element, 21a drain, 21b gate, 21c source, 22 mounting component, 30 mold resin, 31, 31a-c opening, 32 recess, 100, 100a-100d electronic device, 110 pre-mold structure Body, 200, 200a, 200b opening forming member, 210 facing surface, 220 back surface, 230 side surface, 231 inclined portion, 240 raised portion, 310 upper mold, 320 lower mold, 321 clamp type, 322 first movable type, 323 first 2 movable type, 324 spring, 330 cavity

Claims (8)

An electronic structure (110) in which circuit elements (21, 22, 23) are mounted on one surface of a circuit board (10, 10c), and a part of the electronic structure is exposed while covering the one surface and the circuit elements. A method of manufacturing an electronic device including a mold resin (30) in which openings (31, 31a to 31c) are formed,
A member made of an elastic body for contacting the exposed portion of the electronic structure to form the opening, the contact portion contacting the exposed portion, and an end surface on the opposite side from one end surface; An opening forming member (200, 200a, 200b) having a shape in which a cross-sectional area increases toward a certain bottom;
A space is formed between the electronic structure and a space in close contact with the one surface to be supplied with the molding resin constituent material, and a hole is provided at a position facing the exposed portion. A facing portion (322) disposed to face the periphery of the exposed portion, and configured to be movable in a direction perpendicular to the one surface within the hole portion, and pressing the contact portion against the electronic structure while supporting the bottom portion A pressing part (323) to be used, and
By moving the pressing part in a direction approaching the one surface, the contact part of the opening forming member disposed on the pressing part is pressed against the exposed part without reaching the opposing part, and the opposing part A pressing step for deforming the opening forming member without reaching
In a state where the opening forming member is deformed, a molding step for curing the constituent material in the space;
After the molding step, by moving the pressing portion in a direction away from the one surface, the pressing of the opening forming member against the electronic structure is stopped, and a step of taking out the opening forming member from the mold resin, A method for manufacturing an electronic device, comprising: The facing portion is configured to be movable in a direction perpendicular to the one surface, and is a portion that applies a molding pressure to the constituent material supplied to the space.
In the molding step, a molding pressure is applied to the constituent material in the space by the facing portion to cure the constituent material,
2. The method of manufacturing an electronic device according to claim 1, wherein, in the extracting step, after the molding step, application of the molding pressure is stopped and the opening forming member is extracted from the molding resin. The electronic device includes, as the circuit element (21), a front surface electrode (21a) formed on the front surface and a back surface electrode (21b, 21c) formed on the back surface, and a heating element that generates heat when operated,
The heating element is mounted with the back electrode facing the one surface,
In the pressing step, the surface electrode is exposed from the mold resin as the exposed portion by pressing the contact portion of the opening forming member against the surface electrode to deform the opening forming member. The manufacturing method of the electronic device of Claim 1 or 2.   In the pressing step, the contact portion of the opening forming member is pressed against a part of the one surface to deform the opening forming member, thereby exposing a part of the one surface as the exposed portion from the mold resin. The method for manufacturing an electronic device according to claim 1, wherein: The electronic device includes the circuit board (10c) in which a through hole (11c) penetrating in the thickness direction is formed,
In the pressing step, the surface of the through hole is exposed as the exposed portion from the mold resin by deforming the opening forming member by pressing the contact portion of the opening forming member against the surface of the through hole. The method for manufacturing an electronic device according to claim 1, wherein: The electronic device includes, as the circuit element (23), an electrolytic capacitor in which two electrodes (23a, 23b) are formed on one surface,
The electrolytic capacitor is mounted with the two electrodes facing the one surface,
In the pressing step, the contact portion of the opening forming member is pressed against the opposite surface of the surface of the electrolytic capacitor to deform the opening forming member, so that the opposite surface is exposed from the mold resin as the exposed portion. The method for manufacturing an electronic device according to claim 1, wherein: An electronic structure (110) in which circuit elements (21, 22, 23) are mounted on one surface of a circuit board (10, 10c), and a part of the electronic structure is exposed while covering the one surface and the circuit elements. An electronic device manufacturing apparatus including a mold resin (30) in which openings (31, 31a to 31c) are formed,
A member made of an elastic body for contacting the exposed portion of the electronic structure to form the opening, the contact portion contacting the exposed portion, and an end surface on the opposite side from one end surface; An opening forming member (200, 200a, 200b) having a shape in which a cross-sectional area increases toward a certain bottom;
A space is formed between the electronic structure and a space in close contact with the one surface to be supplied with the molding resin constituent material, and a hole is provided at a position facing the exposed portion. A facing portion (322) disposed to face the periphery of the exposed portion, and configured to be movable in a direction perpendicular to the one surface within the hole portion, and pressing the contact portion against the electronic structure while supporting the bottom portion A mold including a pressing portion (323) to perform,
The opening forming member is disposed on the pressing portion without reaching the facing portion,
The pressing portion moves in a direction approaching the one surface, presses the contact portion of the opening forming member against the exposed portion, deforms the opening forming member without reaching the facing portion, and the constituent material After the material has hardened, the device moves in a direction away from the one surface and takes out the opening forming member from the mold resin.   The facing portion is configured to be movable in a direction perpendicular to the one surface, and moves in a direction approaching the one surface to apply a molding pressure to the constituent material in the space in a state where the opening forming member is deformed. The apparatus for manufacturing an electronic device according to claim 7, wherein application of the molding pressure is stopped after the constituent material is cured.

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