JP2017091574A - 空間および時間内のイベントのキャプチャ - Google Patents
空間および時間内のイベントのキャプチャ Download PDFInfo
- Publication number
- JP2017091574A JP2017091574A JP2017012055A JP2017012055A JP2017091574A JP 2017091574 A JP2017091574 A JP 2017091574A JP 2017012055 A JP2017012055 A JP 2017012055A JP 2017012055 A JP2017012055 A JP 2017012055A JP 2017091574 A JP2017091574 A JP 2017091574A
- Authority
- JP
- Japan
- Prior art keywords
- image
- light
- electrode
- embodiments include
- infrared
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 43
- 238000003384 imaging method Methods 0.000 claims abstract description 21
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 description 48
- 230000003595 spectral effect Effects 0.000 description 42
- 238000000034 method Methods 0.000 description 26
- 238000005286 illumination Methods 0.000 description 25
- 230000004044 response Effects 0.000 description 18
- 230000002093 peripheral effect Effects 0.000 description 17
- 239000011358 absorbing material Substances 0.000 description 9
- 125000006850 spacer group Chemical group 0.000 description 9
- 230000000903 blocking effect Effects 0.000 description 8
- 230000009977 dual effect Effects 0.000 description 8
- 238000004891 communication Methods 0.000 description 7
- 230000000007 visual effect Effects 0.000 description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 230000000875 corresponding effect Effects 0.000 description 6
- 210000003811 finger Anatomy 0.000 description 6
- 230000010354 integration Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 239000000969 carrier Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 210000003813 thumb Anatomy 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003331 infrared imaging Methods 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 229920000144 PEDOT:PSS Polymers 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000002596 correlated effect Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000011664 signaling Effects 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000000411 transmission spectrum Methods 0.000 description 2
- YBNMDCCMCLUHBL-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) 4-pyren-1-ylbutanoate Chemical compound C=1C=C(C2=C34)C=CC3=CC=CC4=CC=C2C=1CCCC(=O)ON1C(=O)CCC1=O YBNMDCCMCLUHBL-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910002665 PbTe Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910005642 SnTe Inorganic materials 0.000 description 1
- 208000004350 Strabismus Diseases 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910007709 ZnTe Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(IV) oxide Inorganic materials O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N nickel(II) oxide Inorganic materials [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- -1 polyphenylene vinylene Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 1
- 230000001225 therapeutic effect Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
- G06F3/0421—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means by interrupting or reflecting a light beam, e.g. optical touch-screen
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
- G01J1/0418—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using attenuators
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/017—Gesture based interaction, e.g. based on a set of recognized hand gestures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/0304—Detection arrangements using opto-electronic means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/20—Movements or behaviour, e.g. gesture recognition
- G06V40/28—Recognition of hand or arm movements, e.g. recognition of deaf sign language
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- General Health & Medical Sciences (AREA)
- Psychiatry (AREA)
- Social Psychology (AREA)
- Multimedia (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Studio Devices (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- User Interface Of Digital Computer (AREA)
- Light Receiving Elements (AREA)
- Image Input (AREA)
Abstract
Description
次に図3を参照すると、図1または図2の演算デバイスで使用することができるカメラ・モジュール300の一実施形態が、示される。カメラ・モジュール300は、図1のカメラ・モジュール113、または図2のカメラ・モジュール213A、213Bに対応することができる。図3に示すように、カメラ・モジュール300は、基板301、画像センサ303、およびボンド・ワイヤ305を備える。ホルダ307が、基板の上に位置決めされている。光学フィルタ309は図では、ホルダ307の一部に取り付けられている。バレル311は、レンズ313、またはレンズのシステムを保持する。
実施形態では、第1のパターンを有する構造化光は、第1の期間中に源から表現することができ、第2のパターンを有する構造化光は、第2の期間中に源から表現することができる。
実施形態は、図7に示す差分システムを含む。図7は、光感知動作との外部干渉を少なくするための3電極差分レイアウト・システム700の一実施形態を示す。3電極差分レイアウト・システム700は図では、3つの電極701、703、705全てを覆う光感知材料を含む。遮光材料707(ブラック)は、第1の電極701および第2の電極703を使用して電気的にアクセスされる領域内で光が光感知材料に作用するのを防ぐ。実質的に透明な材料709(クリア)は、第2の電極703と第3の電極705を使用して電気的にアクセスされる実質的に個別の領域内で光が光感知材料に作用するのを可能にする。クリアで覆われた電極対およびブラックで覆われた電極対に流れる電流の差は、光電流に等しい、すなわち、このような差はいかなる暗電流も含んでいないが、その代わり、あらゆる暗オフセットが実質的に取り除かれた状態で、光強度に比例する。
実施形態は、異なる形状、サイズ、およびスペクトル応答(例えば、異なる色に対する感度)を有するいくつかのセンサを利用することを含む。実施形態は、マルチ・レベル出力信号を発生させることを含む。実施形態は、入射光のスペクトルおよび特性に関する情報のうちの少なくとも一方を再構築するために、適切な回路およびアルゴリズムを使用して信号を処理することを含む。
画像化などを介したシーンに関する視覚的情報のキャプチャは、ある範囲の応用例の領域で望ましい。場合により、画像化システムと興味のあるシーンの間にある媒体の光学性状は、光吸収、光散乱、または両方を示すことがある。場合により、光吸収および光拡散のうちの少なくとも一方は、第2のスペクトル範囲と比較して、第1のスペクトル範囲でより強く起こることがある。場合により、強い吸収または拡散する第1のスペクトル範囲は、約470nmから約630nmまでの可視スペクトル範囲の一部または全てを含み、より弱く吸収または拡散する第2のスペクトル範囲は、約650nmから約24μmまでの波長範囲に広がる赤外線の部分を含むことがある。
実施形態では、画像化システムは、2つのモード、可視波長画像化用の第1のモード、および赤外線画像化用の第2のモードで動作することができる。実施形態では、第1のモードは、画像センサ上へのある赤外線波長の光の入射を実質的に遮断するフィルタを利用することができる。
実施形態は、画像が取得されることを示すユーザと、画像の取得に関連する集積期間の間の間隔が約1秒未満であるカメラ・システムを含む。実施形態は、画像センサとプロセッサの間のメモリ要素を含むカメラ・システムを含む。
実施形態は、第1の画像が取得され、メモリ内に記憶され、第2の画像が取得され、プロセッサを使用して、第1の画像および第2の画像からの情報を利用する画像を生成するカメラ・システムを含む。実施形態は、第1の画像および第2の画像からの情報を組み合わせることによって、高い動的範囲で画像を生成することを含む。実施形態は、第1の焦点を有する第1の画像と、第2の焦点を有する第2の画像と、第1の画像および第2の画像からより高い等価深度の焦点を有する画像を生成することを含む。
実施形態では、画像センサは、第1のスペクトル・バンドで感知を行う第1の層、および第2のスペクトル・バンドで感知を行う第2の層を含むことができる。
実施形態では、デバイスは、第1の電極、第1の選択的スペーサ、光吸収材料、第2の選択的スペーサ、および第2の電極からなっていてもよい。
実施形態は、光キャリアが第1の遮断層に向かって輸送されるように、集積期間として知られる第1の間隔中にデバイスに電気バイアスをかけることを含み、光キャリアは、集積期間の間に遮断層とのインターフェイスの近くに記憶される。
Claims (5)
- 画像化システムであって、
焦点面アレイと、
第1の実質的透過バンドおよび第2の実質的透過バンドを有する光学フィルタと、
アクティブ照明器と
を備え、
第1の時間間隔中に、該焦点面アレイは第1の画像を取得し、第2の時間間隔中に、該アクティブ照明器は電源が入れられ、該焦点面アレイは第2の画像を取得し、第3の画像は該第2の画像から該第1の画像を減算することによって生成されるように構成され、表示システムは該第1の画像および該第3の画像を組み合わせた画像を表示する、画像化システム。 - 前記第3の画像は、アクティブ照明されていない背景画像が除去されている、アクティブ照明されたシーンの画像を表す、請求項1に記載の画像化システム。
- 照明器は、構造化光を使用する、請求項1に記載の画像化システム。
- 前記構造化光は、波長が赤外である、請求項1に記載の画像化システム。
- 前記第3の画像は、前記シーンにおける深度情報を含む、請求項1に記載の画像化システム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161545203P | 2011-10-10 | 2011-10-10 | |
US61/545,203 | 2011-10-10 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014535813A Division JP2014531080A (ja) | 2011-10-10 | 2012-10-10 | 空間および時間内のイベントのキャプチャ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017091574A true JP2017091574A (ja) | 2017-05-25 |
JP6261151B2 JP6261151B2 (ja) | 2018-01-17 |
Family
ID=48042101
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014535813A Pending JP2014531080A (ja) | 2011-10-10 | 2012-10-10 | 空間および時間内のイベントのキャプチャ |
JP2017012055A Active JP6261151B2 (ja) | 2011-10-10 | 2017-01-26 | 空間および時間内のイベントのキャプチャ |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014535813A Pending JP2014531080A (ja) | 2011-10-10 | 2012-10-10 | 空間および時間内のイベントのキャプチャ |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130089237A1 (ja) |
EP (1) | EP2766792A4 (ja) |
JP (2) | JP2014531080A (ja) |
KR (1) | KR101991237B1 (ja) |
CN (1) | CN104137027B (ja) |
WO (1) | WO2013055777A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9162144B2 (en) * | 2011-12-05 | 2015-10-20 | Microsoft Technology Licensing, Llc | Portable device pairing with a tracking system |
US9208753B2 (en) | 2012-09-17 | 2015-12-08 | Elwha Llc | Unauthorized viewer detection system and method |
WO2014093334A2 (en) | 2012-12-10 | 2014-06-19 | Invisage Technologies, Inc. | Capture of scenes and events in space and time |
US9746926B2 (en) * | 2012-12-26 | 2017-08-29 | Intel Corporation | Techniques for gesture-based initiation of inter-device wireless connections |
WO2015188146A2 (en) * | 2014-06-05 | 2015-12-10 | Edward Hartley Sargent | Sensors and systems for the capture of scenes and events in space and time |
US9692968B2 (en) | 2014-07-31 | 2017-06-27 | Invisage Technologies, Inc. | Multi-mode power-efficient light and gesture sensing in image sensors |
US9531979B2 (en) * | 2014-12-30 | 2016-12-27 | Stmicroelectronics (Grenoble 2) Sas | IC image sensor device with twisted pixel lines and related methods |
US9881966B2 (en) | 2015-07-17 | 2018-01-30 | International Business Machines Corporation | Three-dimensional integrated multispectral imaging sensor |
US9842868B2 (en) * | 2015-10-26 | 2017-12-12 | Sensors Unlimited, Inc. | Quantum efficiency (QE) restricted infrared focal plane arrays |
CN105511631B (zh) * | 2016-01-19 | 2018-08-07 | 北京小米移动软件有限公司 | 手势识别方法及装置 |
CN107664534B (zh) * | 2016-07-27 | 2019-12-13 | 上海新微技术研发中心有限公司 | 温度传感器封装结构 |
CN106599812A (zh) * | 2016-12-05 | 2017-04-26 | 苏州维盟韵联网络科技有限公司 | 一种用于智能家居系统的3d动态手势识别方法 |
CN108389875A (zh) | 2017-02-03 | 2018-08-10 | 松下知识产权经营株式会社 | 摄像装置 |
JP6975896B2 (ja) | 2017-02-03 | 2021-12-01 | パナソニックIpマネジメント株式会社 | 撮像装置の制御方法及び撮像装置 |
CN108389870A (zh) * | 2017-02-03 | 2018-08-10 | 松下知识产权经营株式会社 | 摄像装置 |
WO2020105361A1 (ja) | 2018-11-19 | 2020-05-28 | パナソニックIpマネジメント株式会社 | 撮像装置及び撮像システム |
CN113345919B (zh) * | 2021-05-25 | 2023-07-04 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其制作方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010504522A (ja) * | 2006-09-21 | 2010-02-12 | トムソン ライセンシング | 3次元モデル取得のための方法及びシステム |
JP2010039912A (ja) * | 2008-08-07 | 2010-02-18 | Sony Corp | 静脈パターン取得装置、静脈パターン取得方法および静脈テンプレート |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7519223B2 (en) * | 2004-06-28 | 2009-04-14 | Microsoft Corporation | Recognizing gestures and using gestures for interacting with software applications |
US7809214B2 (en) * | 2005-08-22 | 2010-10-05 | Samsung Electronics Co., Ltd. | Device and a method for identifying movement patterns |
JP2009042796A (ja) * | 2005-11-25 | 2009-02-26 | Panasonic Corp | ジェスチャー入力装置および方法 |
EP2432015A1 (en) * | 2007-04-18 | 2012-03-21 | Invisage Technologies, Inc. | Materials, systems and methods for optoelectronic devices |
US8723795B2 (en) * | 2008-04-24 | 2014-05-13 | Oblong Industries, Inc. | Detecting, representing, and interpreting three-space input: gestural continuum subsuming freespace, proximal, and surface-contact modes |
US8971565B2 (en) * | 2008-05-29 | 2015-03-03 | Hie-D Technologies, Llc | Human interface electronic device |
US8345920B2 (en) * | 2008-06-20 | 2013-01-01 | Northrop Grumman Systems Corporation | Gesture recognition interface system with a light-diffusive screen |
US20100123665A1 (en) * | 2008-11-14 | 2010-05-20 | Jorgen Birkler | Displays for Mobile Devices that Detect User Inputs Using Touch and Tracking of User Input Objects |
JP5177075B2 (ja) * | 2009-02-12 | 2013-04-03 | ソニー株式会社 | 動作認識装置、動作認識方法、プログラム |
EP2427857B1 (en) * | 2009-05-04 | 2016-09-14 | Oblong Industries, Inc. | Gesture-based control systems including the representation, manipulation, and exchange of data |
JP2010277197A (ja) * | 2009-05-26 | 2010-12-09 | Sony Corp | 情報処理装置、情報処理方法およびプログラム |
KR101688655B1 (ko) * | 2009-12-03 | 2016-12-21 | 엘지전자 주식회사 | 사용자의 프레전스 검출에 의한 제스쳐 인식 장치의 전력 제어 방법 |
-
2012
- 2012-10-10 KR KR1020147012707A patent/KR101991237B1/ko active IP Right Grant
- 2012-10-10 EP EP12839963.1A patent/EP2766792A4/en not_active Withdrawn
- 2012-10-10 WO PCT/US2012/059527 patent/WO2013055777A1/en active Application Filing
- 2012-10-10 US US13/648,721 patent/US20130089237A1/en not_active Abandoned
- 2012-10-10 CN CN201280060815.8A patent/CN104137027B/zh active Active
- 2012-10-10 JP JP2014535813A patent/JP2014531080A/ja active Pending
-
2017
- 2017-01-26 JP JP2017012055A patent/JP6261151B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010504522A (ja) * | 2006-09-21 | 2010-02-12 | トムソン ライセンシング | 3次元モデル取得のための方法及びシステム |
JP2010039912A (ja) * | 2008-08-07 | 2010-02-18 | Sony Corp | 静脈パターン取得装置、静脈パターン取得方法および静脈テンプレート |
Also Published As
Publication number | Publication date |
---|---|
CN104137027B (zh) | 2018-04-17 |
KR20140081867A (ko) | 2014-07-01 |
WO2013055777A1 (en) | 2013-04-18 |
EP2766792A1 (en) | 2014-08-20 |
JP2014531080A (ja) | 2014-11-20 |
EP2766792A4 (en) | 2016-03-30 |
JP6261151B2 (ja) | 2018-01-17 |
US20130089237A1 (en) | 2013-04-11 |
KR101991237B1 (ko) | 2019-06-20 |
CN104137027A (zh) | 2014-11-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6261151B2 (ja) | 空間および時間内のイベントのキャプチャ | |
US10924703B2 (en) | Sensors and systems for the capture of scenes and events in space and time | |
US9979886B2 (en) | Multi-mode power-efficient light and gesture sensing in image sensors | |
US10681296B2 (en) | Scaling down pixel sizes in image sensors | |
US10341571B2 (en) | Image sensors with electronic shutter | |
US9898117B2 (en) | Sensors and systems for the capture of scenes and events in space and time | |
US10685999B2 (en) | Multi-terminal optoelectronic devices for light detection | |
US20170264836A1 (en) | Image sensors with electronic shutter | |
US10529769B2 (en) | Method of manufacturing a color image sensor having an optically sensitive material with multiple thicknesses | |
US20160037093A1 (en) | Image sensors with electronic shutter |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170822 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20171023 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20171023 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171115 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20171206 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20171211 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6261151 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |