JP2017084922A - Working system for board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount an electronic component to a mounting position of a substrate.SOLUTION: In a component mounting machine of the present invention, a lead wire rectification tool 86 is arranged at a lower side of a holding jig holding a lead component 88, and a penetration hole 97 penetrating to a vertical direction is formed in an arm 93 of the lead wire rectification tool 86. A bottom surface of the arm 93 is imaged by an imaging device, and an opening position to the side of bottom surface of the arm 93 of the penetration hole 97 is calculated on the basis of image data. The holding jig is moved to that the opening position of the penetration hole 97 to be calculated and the penetration hole 208 of a circuit base material 12 are overlapped. Thus, the penetration hole 97 of the lead wire rectification tool 86 and the penetration hole 208 of the circuit base material 12 are communicated in a matching state. Therefore, when the holding jig holding the lead component 88 is declined, a lead wire 89 of the lead component 88 is conducted to the penetration hole 97 of the lead wire rectification tool 86, and is inserted into the penetration hole 208 of circuit base material 12, and is properly mounted to a mounting position of the substrate.SELECTED DRAWING: Figure 17

Description

  The present invention relates to a substrate working system for mounting electronic components on a substrate.

  When the electronic component is mounted on the substrate, the posture of at least a part of the electronic component is corrected. Then, by correcting at least a part of the electronic component, the electronic component is appropriately mounted on the substrate. For example, the following patent document describes a technique for properly inserting the lead of the lead component into the through hole of the substrate in order to appropriately attach the lead component to the substrate.

Japanese Patent Laid-Open No. 7-15188 JP-A-6-53697

  According to the technique described in the above-mentioned patent document, it is possible to appropriately mount the electronic component on the substrate to some extent. However, in the above patent document, there is a description that the imaging means and the imaging data are used when mounting the electronic component, but there is no detailed description about the reliability of those methods, and the electronic component is more appropriately used. It is desired to be mounted on a substrate. This invention is made | formed in view of such a situation, and the subject of this invention is mounting | wearing a board | substrate with an electronic component appropriately.

  In order to solve the above-described problems, the work system for a substrate according to the present invention includes (A) a holding tool for holding an electronic component, and (B) a correction tool through-hole penetrating in the vertical direction. A working head having a component posture correcting tool disposed under the head, (C) a lowering device for lowering the electronic component held by the holding tool toward the correction tool through-hole, and the working head arbitrarily A moving device that moves to the position, a control device that controls the operation of the moving device, and an imaging device that images the lower end surface of the component correction tool in which the correction tool through-hole opens, and the control device includes: Based on the imaging data obtained by imaging of the imaging device, the opening position of the correction tool through hole is acquired, and the opening position of the correction tool through hole and the mounting position of the electronic component on the substrate overlap each other. The operation of the mobile device Characterized in that the Gosuru.

  In the on-board working system according to the present invention, a component posture correcting tool is disposed below a holder for holding an electronic component, and the component posture correcting tool has a correction tool through-hole penetrating in the vertical direction. Is formed. Further, the lower surface of the component posture correcting tool is imaged by the imaging device, and the opening position of the correction tool through hole is calculated based on the imaging data. And the action | operation of a moving apparatus is controlled so that the opening position of the correction tool through-hole and the mounting position to the board | substrate of an electronic component overlap. Accordingly, it is possible to appropriately mount the electronic component at the mounting position of the substrate by lowering at least a part of the electronic component held by the holder through the correction tool through hole.

It is a perspective view which shows a component mounting machine. It is a perspective view which shows a component mounting apparatus. It is a side view which shows a component holder. It is a front view which shows a component holder. It is an enlarged view which shows the front-end | tip part of a component holder. It is an enlarged view which shows a pair of arm in the viewpoint from upper direction. It is a side view which shows the component holder of the state holding the lead component. It is an enlarged view which shows a pair of arm in the viewpoint from upper direction. It is sectional drawing in the AA line of FIG. It is a perspective view which shows a cut and clinching apparatus. It is a perspective view which shows a cut and clinching unit. It is sectional drawing which shows a slide body. It is an enlarged view which shows a slide body. It is a block diagram which shows a control apparatus. It is the schematic when the lead wire of a lead component is inserted in the through-hole of a board | substrate. It is the schematic which shows the state with which the arm was piled up on the circuit base material. It is the schematic when the lead wire of a lead component is inserted in the through-hole of a board | substrate. It is the schematic when the lead wire of a lead component is inserted in the through-hole of a board | substrate. It is sectional drawing which shows the cut and clinch unit just before the lead wire of a lead component is cut | disconnected. It is sectional drawing which shows the cut and clinch unit after the lead | read | reed of lead components is cut | disconnected. It is a side view which shows the working head of 2nd Example. It is an enlarged view which shows the correction | amendment main-body part in the viewpoint from upper direction. It is sectional drawing in the BB line of FIG. It is the schematic when the electronic component hold | maintained at the suction nozzle is mounted | worn with a circuit base material. It is the schematic when the electronic component hold | maintained at the suction nozzle is mounted | worn with a circuit base material.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

[First embodiment]
<Configuration of component mounter>
FIG. 1 shows a component mounter 10. The component mounter 10 is a device for performing a component mounting operation on the circuit substrate 12. The component mounting machine 10 includes an apparatus main body 20, a substrate conveyance holding device 21, a component supply device 22, a bulk component supply device 23, a component mounting device 24, a mark camera 26, a parts camera 28, and a cut and clinching device (see FIG. 10). 34 and a control device (see FIG. 14) 36 are provided. The circuit substrate 12 includes a circuit board, a three-dimensional structure substrate, and the like, and the circuit board includes a printed wiring board and a printed circuit board.

  The apparatus main body 20 includes a frame portion 40 and a beam portion 42 that is overlaid on the frame portion 40. The substrate conveyance holding device 21 is disposed at the center in the front-rear direction of the frame portion 40 and includes a conveyance device 50 and a clamp device 52. The conveyance device 50 is a device that conveys the circuit substrate 12, and the clamp device 52 is a device that holds the circuit substrate 12. Thereby, the substrate conveyance holding device 21 conveys the circuit substrate 12 and holds the circuit substrate 12 in a fixed position at a predetermined position. In the following description, the conveyance direction of the circuit substrate 12 is referred to as an X direction, a horizontal direction perpendicular to the direction is referred to as a Y direction, and a vertical direction is referred to as a Z direction. That is, the width direction of the component mounting machine 10 is the X direction, and the front-rear direction is the Y direction.

  The component supply device 22 is disposed at one end of the frame portion 40 in the front-rear direction. The component supply device 22 includes a tray-type component supply device 56 and a feeder-type component supply device (see FIG. 14) 58. The tray-type component supply device 56 is a device that supplies components placed on the tray. The feeder-type component supply device 58 is a device that supplies components by a tape feeder or a stick feeder (not shown).

  The bulk component supply device 23 is disposed at the other end of the frame portion 40 in the front-rear direction. The separated component supply device 23 is a device that aligns a plurality of components scattered in a separated state and supplies the components in an aligned state. That is, it is an apparatus that aligns a plurality of components in an arbitrary posture into a predetermined posture and supplies the components in a predetermined posture.

  Note that examples of the components supplied by the component supply device 22 and the bulk component supply device 23 include electronic circuit components, solar cell components, power module components, and the like. Electronic circuit components include components having leads and components not having leads.

  The component mounting device 24 is disposed in the beam portion 42 and includes two work heads 60 and 62 and a work head moving device 64. The work head moving device 64 includes an X direction moving device 68, a Y direction moving device 70, and a Z direction moving device 72. Then, the two working heads 60 and 62 are integrally moved to arbitrary positions on the frame portion 40 by the X-direction moving device 68 and the Y-direction moving device 70. The work heads 60 and 62 are detachably attached to the sliders 74 and 76, and the Z-direction moving device 72 individually moves the sliders 74 and 76 in the vertical direction. That is, the work heads 60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.

  Further, as shown in FIG. 2, a component holder 78 is attached to the lower end surface of each work head 60, 62. The component holder 78 holds the lead wire of the lead component. As shown in FIGS. 3 to 6, the main body portion 80, a pair of claw portions 81, an auxiliary plate 82, and a first opening / closing device (FIG. 14). Reference) 83, a pusher 84, an elevating device (see FIG. 14) 85, a lead wire correcting tool 86, and a second opening / closing device (see FIG. 14) 87. Incidentally, FIG. 3 is a side view of the component holder 78. FIG. 4 is a front view of the component holder 78. FIG. 5 is an enlarged view showing the pair of claw portions 81 and the auxiliary plate 82 as viewed from above. FIG. 6 is an enlarged view showing the lead wire correcting tool 86 from a viewpoint from above.

  The pair of claw portions 81 are held by the main body portion 80 so as to be swingable. By the operation of the first opening / closing device 83, the pair of claw portions 81 are swung, and the tip portions thereof approach and separate from each other. A recess 90 having a size corresponding to the wire diameter of the lead wire 89 of the lead component 88 to be held is formed inside the pair of claws 81. The auxiliary plate 82 is located between the pair of claw portions 81 and swings together with the pair of claw portions 81. At this time, the auxiliary plate 82 enters between the pair of lead wires 89 of the lead component 88. When the pair of claw portions 81 approach the auxiliary plate 82, each of the pair of lead wires 89 of the lead component 88 is sandwiched from both side surfaces by the concave portion 90 of the claw portion 81 and the auxiliary plate 82. The As a result, as shown in FIG. 7, the lead component 88 is held by the pair of claw portions 81 at the proximal end portion of the lead wire 89, that is, the end portion of the lead component 88 on the side close to the component main body 91. . At this time, the lead wire 89 is sandwiched between the concave portion 90 of the claw portion 81 and the auxiliary plate 82, so that a certain degree of bending, bending or the like is corrected. The pusher 84 is held by the main body portion 80 so as to be movable in the vertical direction, and moves up and down by the operation of the lifting device 85. When the pusher 84 is lowered, the pusher 84 comes into contact with the component main body 91 of the lead component 88 held by the pair of claws 81 and presses the lead component 88 downward. At this time, the holding force of the lead wire 89 by the pair of claw portions 81 is reduced to such an extent that the lead wire 89 slips while being held by the pair of claw portions 81 when the lead component 88 is pressed by the pusher 84. Is done. Specifically, for example, when the first opening / closing device 83 is operated by air pressure, the air pressure is adjusted when the pusher is operated, and when the first opening / closing device 83 is operated by an electromagnetic motor, it is supplied when the pusher is operated. The power is adjusted.

  The lead wire straightening tool 86 includes a bracket 92 and a pair of arms 93. The bracket 92 has a generally rectangular flat plate shape, and is fixed to the side surface of the main body 80 at the upper end so as to extend in the vertical direction. The lower end portion of the bracket 92 extends downward from the lower end portions of the claw portion 81 and the auxiliary plate 82. The pair of arms 93 has a plate shape with a plate thickness, and is attached to the lower end portion of the bracket 92 in a state where the side surfaces thereof are in close contact with each other. The pair of arms 93 is slidably held at the lower end portion of the bracket 92 in a posture that is generally perpendicular to the bracket 92 so as to extend below the claw portion 81 and the auxiliary plate 82. The pair of arms 93 swings in synchronization with the operation of the second opening / closing device 87. That is, the pair of arms 93 swings in the direction of approaching or separating from each other by the operation of the second opening / closing device 87. Accordingly, the pair of arms 93 are in a close contact state in which the side surfaces are in close contact as shown in FIG. 6 and in a separated state in which the side surfaces are apart from each other as shown in FIG. Torture between.

  Each of the pair of arms 93 is formed with a pair of through grooves 94 penetrating in the vertical direction, as shown in FIG. Each through groove 94 is generally a semicircular groove, and includes a first groove portion 95 that continues from the opening on the upper end surface of the arm 93, and a second groove portion that continues from the first groove portion 95 to the opening on the lower end surface of the arm 93. It is divided into 96. The first groove 95 has a tapered shape with an inner diameter that increases toward the top, and the second groove 96 has a shape in which the inner diameter does not change.

  Then, as shown in FIG. 6, the pair of arms 93 are swung and brought into close contact with each other, so that one pair of arms 94 and the other through groove 94 form a pair of arms as shown in FIG. 6. A through-hole 97 that penetrates in the vertical direction is defined. That is, when the pair of arms 93 are brought into close contact with each other, a pair of through holes 97 penetrating the pair of arms in the vertical direction is formed. Each through hole 97 includes a first through hole 98 defined by one first groove 95 and the other first groove 95 of the pair of arms 93 and one second of the pair of arms 93. The second through hole 99 is partitioned by the groove 96 and the other second groove 96, the first through hole 98 is tapered, and the inner diameter of the second through hole 99 does not change. It is a straight hole shape.

  The inner diameter of the second through hole 99 of each through hole 97 is slightly larger than the outer shape of the lead wire 89 of the lead component 88 held by the claw 81 and the auxiliary plate 82. The pitch of the pair of through holes 97 is the same as the pitch of the pair of lead wires 89 of the lead component 88 held by the claw portion 81 and the auxiliary plate 82. Specifically, the distance between one center and the other center of the pair of through holes 97 is the same as the distance between one center and the other center of the pair of lead wires 89. Yes.

  Further, since the through hole 97 has a shape corresponding to the lead diameter, lead pitch, etc. of the lead component 88 held by the component holder 78, if the type of the lead component to be held is changed, the lead The wire straightening tool 86 is also changed. That is, the lead wire corrector 86 is detachable from the component holder 78, and a plurality of types of lead wire correctors 86 are prepared according to the type of the lead component 88. Then, a lead wire correction tool 86 having a shape corresponding to the type of the lead component to be held is attached to the component holder 78.

  In addition, the pair of through holes 97 formed when the pair of arms 93 are in close contact with each other and the recesses 90 of the pair of claws 81 holding the lead component 88 coincide with each other in the vertical direction. That is, the pair of through holes 97 and the recesses 90 of the pair of claw portions 81 have the same coordinates in the XY direction, and the pair of through holes 97 has the pair of claw portions 81 and the auxiliary plate 82. The lead component 88 is held below the pair of lead wires 89. For this reason, the lead component 88 held by the claw portion 81 and the auxiliary plate 82 is pressed downward by the pusher 84, so that the pair of lead wires 89 descend toward the pair of through holes 97. .

  Further, as shown in FIG. 2, the mark camera 26 is attached to the slider 74 so as to face downward, and is moved together with the work head 60 in the X direction, the Y direction, and the Z direction. As a result, the mark camera 26 images an arbitrary position on the frame unit 40. As shown in FIG. 1, the parts camera 28 is disposed between the base material conveyance holding device 21 and the component supply device 22 on the frame portion 40 so as to face upward. Thereby, the parts camera 28 images the components held by the component holder 78 of the work heads 60 and 62.

  The cut and clinching device 34 is disposed below the conveying device 50, and includes a cut and clinching unit 100 and a unit moving device 102 as shown in FIG. As shown in FIG. 11, the cut and clinching unit 100 includes a unit main body 110, a pair of slide bodies 112, and a pitch changing mechanism 114. A slide rail 116 is disposed at the upper end of the unit main body 110 so as to extend in the X direction. The pair of slide bodies 112 are slidably supported by the slide rail 116. As a result, the pair of slide bodies 112 approach and separate in the X direction. The pitch changing mechanism 114 has an electromagnetic motor 118, and the distance between the pair of slide bodies 112 is controlled to be controllable by the operation of the electromagnetic motor 118.

  Further, as shown in FIG. 12, each of the pair of slide bodies 112 includes a fixed portion 120, a movable portion 122, and a slide device 124. The fixed portion 120 is slidably held on the slide rail 116. . Two slide rails 126 are fixed to the back side of the fixed portion 120 so as to extend in the X direction, and the movable portion 122 is slidably held by the two slide rails 126. Thereby, the movable part 122 slides in the X direction with respect to the fixed part 120. The slide device 124 includes an electromagnetic motor (see FIG. 14) 128, and the movable portion 122 slides in a controllable manner by the operation of the electromagnetic motor 128.

  Moreover, the upper end part of the fixing | fixed part 120 is made into the tapered shape, and the 1st insertion hole 130 is formed so that the upper end part may be penetrated to an up-down direction. The first insertion hole 130 opens at the upper end to the upper end surface of the fixed portion 120, and the opening edge to the upper end surface is a fixed blade (see FIG. 15) 131. Further, the first insertion hole 130 is open at the lower end to the side surface of the fixing portion 120, and a disposal box 132 is disposed below the opening to the side surface.

  As shown in FIG. 13, the upper end portion of the movable portion 122 is also tapered, and a bent portion 133 bent in an L shape is formed at the upper end portion. The bent portion 133 extends above the upper end surface of the fixed portion 120, and the bent portion 133 and the upper end of the fixed portion 120 face each other with a slight clearance. In addition, the first insertion hole 130 that opens to the upper end surface of the fixing portion 120 is covered by the bent portion 133, but the second insertion hole 136 is disposed in the bent portion 133 so as to face the first insertion hole 130. Is formed.

  The second insertion hole 136 is a through-hole penetrating the bent portion 133 in the vertical direction, and the inner peripheral surface of the second insertion hole 136 is a tapered surface whose inner diameter decreases toward the lower side. On the other hand, the inner peripheral surface in the vicinity of the opening of the first insertion hole 130 to the upper end surface of the fixing portion 120 is not a tapered surface, and the inner diameter in the vicinity of the opening of the first insertion hole 130 is generally uniform. In addition, the opening edge to the lower end surface of the bending part 133 of the 2nd insertion hole 136 is made into the movable blade (refer FIG. 15). A guide groove 140 is formed on the upper end surface of the bent portion 133 so as to extend in the X direction, that is, in the sliding direction of the movable portion 122. The guide groove 140 is formed so as to straddle the opening of the second insertion hole 136, and the guide groove 140 and the second insertion hole 136 are connected. The guide groove 140 is open on both side surfaces of the bent portion 133.

  As shown in FIG. 10, the unit moving device 102 includes an X direction moving device 150, a Y direction moving device 152, a Z direction moving device 154, and a rotation device 156. The X direction moving device 150 includes a slide rail 160 and an X slider 162. The slide rail 160 is disposed so as to extend in the X direction, and the X slider 162 is slidably held by the slide rail 160. The X slider 162 moves in the X direction by driving an electromagnetic motor (see FIG. 14) 164. The Y-direction moving device 152 includes a slide rail 166 and a Y slider 168. The slide rail 166 is disposed on the X slider 162 so as to extend in the Y direction, and the Y slider 168 is slidably held on the slide rail 166. The Y slider 168 moves in the Y direction by driving an electromagnetic motor (see FIG. 14) 170. The Z direction moving device 154 includes a slide rail 172 and a Z slider 174. The slide rail 172 is disposed on the Y slider 168 so as to extend in the Z direction, and the Z slider 174 is slidably held on the slide rail 172. The Z slider 174 moves in the Z direction by driving an electromagnetic motor (see FIG. 14) 176.

  The rotation device 156 has a generally disk-shaped rotary table 178. The rotary table 178 is supported by the Z slider 174 so as to be rotatable about its axis, and is rotated by driving of an electromagnetic motor (see FIG. 14) 180. A cut and clinching unit 100 is disposed on the rotary table 178. With such a structure, the cut and clinch unit 100 is moved to an arbitrary position by the X-direction moving device 150, the Y-direction moving device 152, and the Z-direction moving device 154, and is rotated at an arbitrary angle by the rotation device 156. To do. Thereby, the cut and clinching unit 100 can be positioned at an arbitrary position below the circuit substrate 12 held by the clamp device 52.

  As shown in FIG. 14, the control device 36 includes a controller 190, a plurality of drive circuits 192, and an image processing device 196. The plurality of drive circuits 192 include the transport device 50, the clamp device 52, the tray-type component supply device 56, the feeder-type component supply device 58, the work head moving device 64, the first opening / closing device 83, the lifting device 85, and the second opening / closing device. 87, connected to the bulk component supply device 23 and electromagnetic motors 118, 128, 164, 170, 176, 180. The controller 190 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 192. Thereby, the operations of the substrate conveyance holding device 21 and the component mounting device 24 are controlled by the controller 190. The controller 190 is also connected to the image processing device 196. The image processing device 196 processes image data obtained by the mark camera 26 and the part camera 28, and the controller 190 acquires various types of information from the image data.

<Operation of component mounter>
In the component mounter 10, the component mounting operation is performed on the circuit substrate 12 held by the clamp device 52 with the above-described configuration. In the component mounting machine 10, various components can be mounted on the circuit substrate 12. The case where the lead component 88 is mounted on the circuit substrate 12 will be described below.

  Specifically, the circuit substrate 12 is transported to the work position, and is fixedly held by the clamp device 52 at that position. Then, the cut and clinching unit 100 is moved below the circuit substrate 12. In the cut-and-clinch unit 100, the coordinate in the XY direction of the second insertion hole 136 of the movable portion 122 and the coordinate in the XY direction of the through hole 208 (see FIG. 15) of the circuit base 12 match. The upper surface of the movable part 122 and the lower surface of the circuit substrate 12 do not come into contact with each other, and the upper surface of the movable part 122 is moved slightly below the lower surface of the circuit substrate 12.

  Specifically, in the cut and clinching unit 100, the distance between the second insertion holes 136 of the movable portion 122 of the pair of slide bodies 112 is between the two through holes 208 formed in the circuit substrate 12. The distance between the pair of slide bodies 112 is adjusted by the pitch changing mechanism 114 so as to be the same as the distance. Then, by the operation of the unit moving device 102, the cut and clinch unit 100 is moved and rotated in the XYZ directions. Thereby, the coordinate in the XY direction of the second insertion hole 136 of the movable portion 122 and the coordinate in the XY direction of the through hole 208 of the circuit base material 12 coincide with each other, and the upper surface of the movable portion 122 and the circuit base material 12 are matched. The upper surface of the movable part 122 is positioned slightly below the lower surface of the circuit substrate 12.

  When the circuit substrate 12 is fixedly held by the clamping device 52, the mark camera 26 moves above the circuit substrate 12 and images the circuit substrate 12. And the controller 190 calculates the information regarding the holding position etc. of the circuit base material 12 based on the imaging data. Further, the component supply device 22 or the bulk component supply device 23 supplies the lead component 88 at a predetermined supply position. Then, one of the work heads 60 and 62 moves above the component supply position and holds the lead component 88 by the component holder 78.

  Subsequently, the work heads 60 and 62 holding the lead component 88 are moved above the parts camera 28, and imaging by the parts camera 28 is performed. At this time, in the conventional apparatus, the lead component 88 held by the component holder 78 is imaged, information on the holding posture of the lead component 88 by the component holder 78 is calculated based on the imaging data, and the holding posture is calculated. Using the information regarding, the mounting operation of the lead component 88 to the circuit substrate 12 is performed. Specifically, the tip position of the pair of lead wires 89 of the lead component 88 is calculated based on the imaging data of the lead component 88. The “calculation” in this specification is a concept including processing by a computer such as the controller 190, and is an action for obtaining a predetermined value by performing processing on various data. Next, the operations of the X-direction moving device 68 and the Y-direction moving device 70 are controlled so that the calculated tip positions of the pair of lead wires 89 and the positions of the two through holes 208 of the circuit substrate 12 overlap. Is done. Then, by the operation of the Z direction moving device 72, the component holder 78 holding the lead component 88 is lowered. As a result, the lead wire 89 of the lead component 88 is inserted into the through hole 208 of the circuit substrate 12.

  However, in the component holder 78, even if the lead wire 89 is clamped by the concave portion 90 of the claw portion 81 and the auxiliary plate 82, the lead wire 89 is bent, bent, or the like, the tip of the lead wire 89 is corrected. There may be bending or bending in the part. In such a case, as shown in FIG. 15, the leading end of the lead wire 89 may come into contact with the upper surface of the circuit substrate 12 and the lead wire 89 may not be inserted into the through hole 208. In view of the above, in the component mounting machine 10, the lead wire correcting tool 86 is provided in the component holder 78, and the lead wire 89 is inserted into the through hole 208 using the lead wire correcting tool 86. Is done.

  Specifically, the work heads 60 and 62 are moved above the parts camera 28, and the lower surfaces of the pair of arms 93 of the lead wire correction tool 86 are imaged by the parts camera 28. At this time, the pair of arms 93 are in close contact with each other. For this reason, a pair of through holes 97 are formed in the pair of arms 93 in close contact, and the opening of the pair of through holes 97 to the lower surface side of the arm 93 is imaged by the parts camera 28. The Then, the opening on the lower end side of the pair of through holes 97, that is, the opening position on the lower end side of the second through hole 99 is calculated by the controller 190 based on the imaging data. The lower end surface of the arm 93 is a polished surface. For this reason, light at the time of imaging by the parts camera 28 is reflected on the lower end surface of the arm 93, and the boundary between the opening of the through hole 97 and the lower end surface of the arm 93 becomes clear. As a result, the opening position of the through hole 97 to the lower end surface of the arm 93 can be appropriately calculated.

  Subsequently, when the opening position on the lower end side of the through hole 97 is calculated, the opening position of the through hole 97 and the position of the through hole 208 of the circuit substrate 12 are overlapped in the vertical direction. The operation of the moving device 68 and the Y-direction moving device 70 is controlled. The component holder 78 is lowered by the operation of the Z-direction moving device 72. Thereby, as shown in FIG. 16, the through hole 97 of the lead wire correcting tool 86 and the through hole 208 of the circuit base material 12 communicate with each other in a state in which they match in the vertical direction.

  As described above, in the through hole 97 of the lead wire correction tool 86, the second through hole portion 99 located below the through hole 97 is a straight hole having an inner diameter slightly larger than the lead diameter of the lead wire 89. However, the 1st through-hole part 98 located above the through-hole 97 is made into the taper shape from which an internal diameter becomes large, so that it goes upwards. The opening on the upper end portion side of the first through hole portion 98, that is, the opening on the upper end portion side of the through hole 97 is made larger than the opening on the upper end portion side of the through hole 208 of the circuit substrate 12.

  Next, when the through hole 97 of the lead wire correcting tool 86 and the through hole 208 of the circuit base material 12 communicate with each other in the vertical direction, the leads held by the pair of claws 81 and the auxiliary plate 82 are connected. The component 88 is pressed downward by the pusher 84. As a result, the pair of lead wires 89 descends toward the pair of through holes 97 of the lead wire correction tool 86. In the through hole 97, since the opening on the upper end side is made larger than the opening of the through hole 208 of the circuit substrate 12, even when the tip of the lead wire 89 is bent, as shown in FIG. The lead wire 89 is appropriately inserted into the through hole 97 of the lead wire correcting tool 86. Note that the holding of the lead component 88 by the claw portion 81 and the auxiliary plate 82 is released at the timing when the leading end portion of the lead wire 89 is inserted into the through hole 97.

  Subsequently, when the lead component 88 is pressed further downward by the pusher 84 in a state where the tip end portion of the lead wire 89 is inserted into the through hole 97 of the lead wire correction tool 86, the tip end of the lead wire 89 is moved to the through hole. 97 is in contact with the inner peripheral surface of the first through-hole portion 98, that is, the tapered surface. The leading end of the lead wire 89 is guided to the second through hole portion 99 of the through hole 97 by the taper surface, and is inserted into the second through hole portion 99. At this time, the inner diameter of the second through-hole portion 99 is slightly larger than the lead diameter of the lead wire 89 and is approximately the same size. Therefore, the lead wire 89 inserted into the second through-hole portion 99 is The shape of the second through hole 99 is corrected to a straight line.

  Then, the lead component 88 is further pressed downward by the pusher 84, so that the tip end portion of the lead wire 89 is inserted into the through hole 208 of the circuit base 12 that communicates with the through hole 97 of the lead wire correction tool 86. Is done. Subsequently, the lead component 88 is further pressed downward by the pusher 84, so that the tip of the lead wire 89 is positioned below the through hole 208 of the circuit base 12 as shown in FIG. It is inserted into the second insertion hole 136 of the body 112. Note that the contact state of the pair of arms 93 is released at the timing when the leading end of the lead wire 89 is inserted into the second insertion hole 136. That is, the pair of arms 93 are swung in the direction of separating, and are separated. As a result, the lead wire 89 is straightly corrected by the first through hole portion 98 of the through hole 97 until the lead wire 89 is inserted into the second insertion hole 136, so that the lead wire 89 is reliably inserted into the second insertion hole 136. It becomes possible to do.

  Next, when the lead wire 89 is inserted into the second insertion hole 136, the correction of the lead wire 89 is released by releasing the contact state of the arm 93, but the second insertion hole 136 is also tapered. The lead wire 89 is inserted into the first insertion hole 130 through the second insertion hole 136. That is, when the lead component 88 is further pressed downward by the pusher 84, the tip of the lead wire 89 inserted into the second insertion hole 136 comes into contact with the tapered surface of the second insertion hole 136, and the tapered surface is brought into contact with the tapered surface. It is guided and inserted into the first insertion hole 130. As shown in FIG. 19, when the leading end portion of the lead wire 89 is inserted into the first insertion hole 130 by a predetermined amount, the pushing of the lead component 88 by the pusher 84 is stopped. Next, when the lead wire 89 is inserted into the first insertion hole 130 by a predetermined amount, the pair of movable parts 122 slide in the approaching direction by the operation of the slide device 124. As a result, the lead wire 89 is cut by the fixed blade 131 of the first insertion hole 130 and the movable blade 138 of the second insertion hole 136, as shown in FIG. The tip portion separated by cutting the lead wire 89 falls inside the first insertion hole 130 and is discarded in the disposal box 132.

  In addition, the pair of movable parts 122 are slid in a direction closer to each other even after the lead wire 89 is cut. For this reason, the new leading end portion of the lead wire 89 by cutting is bent along the tapered surface of the inner periphery of the second insertion hole 136 as the movable portion 122 slides, and the movable portion 122 slides. Thus, the leading end portion of the lead wire 89 is bent along the guide groove 140. As a result, the lead wire 89 is bent on the back surface side of the circuit substrate 12, and the lead component 88 is mounted on the circuit substrate 12 in a state in which the lead wire 89 is prevented from being pulled out from the through hole 208.

  As described above, in the component mounting machine 10, it is possible to increase the insertion rate of the lead wire 89 into the through hole 208 by using the lead wire straightening tool 86. Further, the lead wire 89 is straightened in the first through hole portion 98 of the through hole 97 of the lead wire correcting tool 86, so that the lead wire 89 can be preferably inserted into the second insertion hole 136. It becomes possible. Furthermore, in the conventional apparatus, since the holding position of the lead component 88 changes every time the lead component 88 is held by the component holder 78, the lead component 88 is held by the component holder 78 for each mounting operation of one component. The lead component 88 is imaged, and the tip position of the lead wire 89 of the lead component 88 is calculated based on the imaging data. On the other hand, in the component mounter 10, once the lower surfaces of the pair of arms 93 in close contact with each other are imaged and the opening position of the pair of through holes 97 is calculated, the opening of the through hole 97 in the component holder 78 is calculated. Since the position does not change, the opening position of the through hole 97 can be continuously used during the mounting operation. That is, in the component mounter 10, once the pair of arms 93 in close contact with each other is imaged, it is not necessary to perform imaging with the parts camera 28 for each component mounting operation. As a result, it is possible to shorten the time required for imaging, calculation, and the like. However, as described above, a plurality of types of lead wire correcting tools 86 are prepared in accordance with the types of the lead components 88. When the lead component 88 to be held is changed, the lead wire correcting tools 86 are also changed. Exchanged. For this reason, after the lead wire correcting tool 86 is replaced, it is necessary to perform imaging by the parts camera 28 and to calculate the position of the through hole 97 of the replaced lead wire correcting tool 86.

  As shown in FIG. 14, the controller 190 of the control device 36 includes an imaging unit 210, a calculation unit 212, an operation control unit 216, and an insertion unit 218. The imaging unit 210 is a functional unit for imaging the lower end surfaces of the pair of arms 93 in close contact with the parts camera 28. The calculation unit 212 is a functional unit for calculating the opening position of the through hole 97 to the lower end surface of the arm 93 based on the imaging data. The operation control unit 216 is a functional unit for controlling the operation of the work head moving device 64 so that the calculated opening position of the through hole 97 and the opening position of the through hole 208 of the circuit base material 12 overlap. . The insertion portion 218 inserts the lead wire 89 of the lead component 88 into the lead wire correction tool 86 in a state where the opening position of the through hole 97 of the lead wire correction tool 86 and the opening position of the through hole 208 of the circuit substrate 12 overlap. This is a functional part for insertion into the through hole 97.

[Second Embodiment]
The component mounter of the second embodiment is substantially the same as the component mounter 10 of the first embodiment except for the work head. For this reason, the working head 250 will be described with reference to FIG. 21. The same reference numerals are used for the same components as those of the component mounter 10 of the first embodiment, and the description thereof is omitted.

  The work head 250 includes a plurality of rod-shaped mounting units 252, and suction nozzles 254 are mounted at the tips of the plurality of mounting units 252. The suction nozzle 254 communicates with a positive / negative pressure supply device (not shown) via negative pressure air and positive pressure air passages. The suction nozzle 254 sucks and holds the electronic component with a negative pressure, and detaches the held electronic component with a positive pressure. Further, the plurality of rod-shaped mounting units 252 are held on the outer periphery of the unit holder 256 at an equiangular pitch and in a state where the axial direction is vertical, and the suction nozzle 254 extends from the lower surface of the unit holder 256. It extends downward.

  The unit holder 256 is held by the main body 258 of the work head 250 so as to be able to rotate about the axis of the unit holder 256. And the unit holding body 256 rotates intermittently for every arrangement | positioning angle of the mounting | wearing unit 252 by the action | operation of a rotation apparatus (illustration omitted). As a result, the mounting units 252 are sequentially stopped at the first station (the rightmost station in the drawing) which is one of the stop positions of the plurality of mounting units 252. The mounting unit 252 located at the first station moves up and down by the operation of a first lifting device (not shown). As a result, the electronic component is sucked and held from the supply position of the component supply device 23 or the loose component mounting device 24 by the suction nozzle 254 of the mounting unit 252 located in the first station.

  Further, as the unit holder 256 rotates, the second station (the leftmost station in the figure) located on the opposite side of the first station among the stopped positions of the plurality of mounting units 252 also has its first. The mounting unit 252 located at the second station moves up and down by the operation of a second lifting device (not shown). As a result, the electronic component held by the suction nozzle 254 of the mounting unit 252 located at the second station is mounted on the substrate.

  In addition, the work head 250 includes a component posture correction tool 260. The component posture correction tool 260 includes a bracket 262 and a correction main body 264. The bracket 262 has a generally rectangular flat plate shape, and is fixed to the main body 258 of the work head 250 at the upper end so as to extend in the vertical direction. The lower end portion of the bracket 262 extends downward from the lower end portion of the suction nozzle 254 of the mounting unit 252 located at the second station. Further, the correction main body 264 has a plate shape with a plate thickness, and is in a posture that is generally perpendicular to the bracket 262 so as to extend below the suction nozzle 254 of the mounting unit 252 located at the second station. It is fixed to the lower end.

  As shown in FIGS. 22 and 23, the correction main body 264 is formed with a through hole 270 penetrating in the vertical direction. 22 is a view showing the correction main body 264 from a viewpoint from above, and FIG. 23 is a cross-sectional view taken along the line BB of FIG. The through hole 270 includes a first through hole portion 272 that is continuous from the opening of the upper end surface of the correction body portion 264, and a second through hole portion that is continuous from the first through hole portion 272 to the opening of the lower end surface of the correction body portion 264. 274. The first through-hole portion 272 has a tapered shape with an inner diameter that increases toward the upper side, and the second through-hole portion 274 has a shape in which the inner dimension does not change. The second through-hole portion 274 has a shape corresponding to the outer dimension of the electronic component to be held by the suction nozzle 254, that is, a shape slightly larger than the outline of the electronic component. Note that the second through-hole portion 274 is located immediately below the suction nozzle 254 of the mounting unit 252 located at the second station.

  A mounting operation using the working head 250 having such a structure will be described below. Specifically, first, the circuit substrate (see FIG. 24) 230 is transported to the work position by the transport device 50, and is fixedly held by the clamp device 52 at that position. Next, the mark camera 26 moves above the circuit substrate 280 and images the circuit substrate 280. And the controller 190 calculates the information regarding the holding position etc. of the circuit base material 280 based on the imaging data. Further, the component supply device 22 or the bulk component supply device 23 supplies an electronic component (see FIG. 24) 282 at a predetermined supply position. Then, the work head 250 moves above the component supply position, and holds the electronic component 282 by the suction nozzle 254 of the mounting unit 252 located at the first station.

  Subsequently, in the conventional apparatus, the work head 250 holding the electronic component 282 moves above the parts camera 28 and imaging by the parts camera 28 is performed. At this time, the electronic component 282 held by the suction nozzle 254 is imaged, and information on the holding posture of the electronic component 282 by the suction nozzle 254 is calculated based on the imaging data. Then, the mounting unit 252 is rotated based on the calculated holding posture of the electronic component 282. Thereby, the electronic component 282 held by the suction nozzle 254 is corrected to a posture corresponding to the mounting posture on the circuit substrate 280.

  As described above, in the conventional apparatus, the electronic component 282 is imaged every time the electronic component 282 is held by the suction nozzle 254, that is, each mounting operation of one electronic component 282, and based on the imaging data. Thus, the holding posture of the electronic component 282 is corrected. Thereby, it is possible to ensure the mounting of the electronic component 282 in an appropriate posture, but the cycle time is long because it takes time for imaging by the parts camera 28 and correction of the holding posture of the electronic component 282 for each mounting operation. There is a risk of becoming.

  In view of the above, the work head 250 is provided with a component posture correcting tool 260, and the electronic component 282 is mounted on the circuit substrate 280 using the component posture correcting tool 260. Specifically, the work head 250 is moved above the parts camera 28, and the lower surface of the correction main body 264 of the part posture correction tool 260 is imaged by the parts camera 28. At this time, the opening of the through hole 270 to the lower surface side of the correction main body 264 is imaged by the parts camera 28, and the opening of the through hole 270, that is, the opening position on the lower end side of the second through hole 274, Based on the imaging data, the controller 190 calculates. The lower end surface of the correction main body 264 is a polished surface. For this reason, the light at the time of imaging by the parts camera 28 is reflected on the lower end surface of the correction main body 264, and the boundary between the opening of the through hole 270 and the lower end surface of the correction main body 264 becomes clear. Thereby, it becomes possible to calculate appropriately the opening position to the lower end surface of the correction | amendment main-body part 264 of the through-hole 270. FIG.

  Subsequently, when the opening position on the lower end side of the through hole 270 is calculated, the opening position of the through hole 270 and the mounting position of the electronic component 282 on the circuit base material 280 are overlapped in the vertical direction. The operation of the X direction moving device 68 and the Y direction moving device 70 is controlled. Then, the working head 250 is lowered by the operation of the Z-direction moving device 72. Accordingly, as shown in FIG. 24, the second through-hole portion 274 of the through-hole 270 of the correction body portion 264 and the mounting position of the electronic component 282 on the circuit base material 280 are in close contact.

  Next, when the second through hole portion 274 of the through hole 270 is brought into close contact with the mounting position of the circuit base material 280, the mounting unit 252 positioned at the second station is lowered. At this time, when the electronic component 282 is held by the suction nozzle 254 in a posture corresponding to the mounting posture, the electronic component 282 held by the suction nozzle 254 is connected to the second through hole portion 274 of the through hole 270. Inserted inside. However, in the case where the electronic component 282 is held by the suction nozzle 254 in a posture deviated from the mounting posture, the electronic component 282 held by the suction nozzle 254 has the first through hole 270 as shown in FIG. The inner peripheral surface of the 1 through-hole portion 272, that is, the tapered surface is contacted. Then, when the mounting unit 252 is lowered while the electronic component 282 is in contact with the tapered surface of the first through hole portion 272, the electronic component 282 held by the suction nozzle 254 is lowered along the tapered surface. . However, when the electronic component 282 is held by the suction nozzle 254 and descends along the tapered surface, the holding position of the electronic component 282 by the suction nozzle 254 is shifted. For this reason, the holding force by the suction nozzle 254 is reduced at the timing when the electronic component 282 is inserted into the through hole 270 in order to ensure the displacement of the holding position of the electronic component 282 by the suction nozzle 254. That is, the air suction force by the suction nozzle 254 is reduced.

  Then, the electronic component 282 is lowered along the tapered surface while being held by the suction nozzle 254, so that the electronic component 282 is guided to the second through hole portion 274 by the tapered surface, and the second through hole is provided. It is inserted into the portion 274. As a result, even when the electronic component 282 is held by the suction nozzle 254 in a posture deviated from the mounting posture, the electronic component 282 is mounted in an appropriate posture as shown in FIG. It becomes possible to attach to the position. As described above, when the mounting operation is performed using the component posture correcting tool 260, once the lower surface of the correction main body 264 is imaged and the opening position of the through hole 270 is calculated, the through hole 270 is obtained. This opening position can be used continuously during the mounting operation. That is, it is not necessary to perform imaging of the electronic component 282 held by the suction nozzle 254 and correction of the holding posture of the electronic component 282 by the suction nozzle 254 for each mounting operation of one electronic component 282. As a result, it is possible to omit the imaging of the electronic component 282 during the mounting operation, the correction of the holding posture of the electronic component 282, and the like, and the cycle time can be shortened.

  Similarly to the lead wire correction tool 86 of the first embodiment, the component posture correction tool 260 is also detachable from the work head 250, and a plurality of types of component posture correction tools 260 are used depending on the type of electronic component. Is prepared. Then, a component posture correcting tool 260 having a shape corresponding to the type of electronic component to be mounted is attached to the work head 250.

  Incidentally, the component mounting machine 10 is an example of a substrate-based work system. The parts camera 28 is an example of an imaging device. The control device 36 is an example of a control device. The work heads 60 and 62 are examples of work heads. The work head moving device 64 is an example of a moving device. The claw portion 81 and the auxiliary plate 82 are an example of a holder. The elevating device 85 is an example of a lowering device. The lead wire correction tool 86 is an example of a component posture correction tool. The lead component 88 is an example of an electronic component and a lead component. The through hole 97 is an example of a correction tool through hole. The first through hole portion 98 is an example of a first portion. The second through hole 99 is an example of a second part. The through hole 208 is an example of a substrate through hole. The work head 250 is an example of a work head. The suction nozzle 254 is an example of a holder. The component posture correction tool 260 is an example of a component posture correction tool. The through hole 270 is an example of a correction tool through hole. The first through hole 272 is an example of a first part. The second through hole portion 274 is an example of a second portion. The electronic component 282 is an example of an electronic component.

  In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the first embodiment, in the through hole 97 formed in the pair of arms 93, the first through hole portion 98 opens at the upper end surface of the arm 93, and the second through hole portion 99. Are open on the lower end surface of the arm 93, but through holes of different shapes may be formed above the first through hole 98 or below the second through hole 99. That is, a straight hole extending upward from the upper end of the first through hole portion 98 may be formed, and the straight hole may be opened on the upper end surface of the arm 93. In addition, a tapered hole extending downward from the lower end of the second through hole 99 may be formed, and the tapered hole may be opened on the lower end surface of the arm 93. The tapered hole extending downward from the lower end of the second through hole 99 needs to be a tapered hole having an inner diameter that increases toward the lower side.

  In the above embodiment, the lead wire correcting tool 86 is detachably replaced with the component holder 78 and the component posture correcting tool 260 is detachably replaced with the work head 250. In the lead wire correcting tool 86, The pair of arms 93 may be detachably replaced with the bracket 92, and the correction main body 264 may be detachably replaced with the bracket 262 in the component posture correcting tool 260. In this case, the pair of arms 93 and the correction main body 264 are an example of the component posture correction tool of the present invention.

  In the first embodiment, every time the lead wire straightening tool 86 is attached to the component holder 78, the lower end surface of the arm 93 of the lead wire straightening tool 86 is imaged, and the through hole 97 is based on the image data. Although the opening position is calculated, the lower end surface of the arm 93 may be imaged at various timings, and the opening position of the through hole 97 may be calculated based on the imaging data. Specifically, for example, it may be performed immediately before the mounting work by the component mounter 10 is started. Further, when the lead wire correcting tool 86 is mounted on the component holder 78 with good reproducibility, the opening position of the through hole 97 is calculated each time the lead wire correcting tool 86 is mounted on the component holder 78. There is no need to do. This is because the opening position of the through hole 97 does not change when the lead wire correcting tool 86 is mounted on the component holder 78 with good reproducibility.

  In the second embodiment, the work head 250 having a plurality of suction nozzles 254 is employed, but a work head having a single suction nozzle can be employed. However, in the working head having one suction nozzle, the correction main body 264 is disposed below the suction nozzle, so that the correction main body 264 becomes an obstacle when the electronic component is held by the suction nozzle. Therefore, in such a case, it is necessary to employ a structure in which the correction main body 264 temporarily retracts from below the suction nozzle when the electronic component is held by the suction nozzle. Specifically, for example, the correction main body 264 is divided into two like the pair of arms 93 of the first embodiment, and the two divided members are held to be swingable. Then, when the electronic component is picked up, the two divided members are swung so as to be separated from each other, so that when the electronic component is held by the suction nozzle, the correction main body 264 is temporarily retracted from below the suction nozzle. It becomes possible to make it.

  DESCRIPTION OF SYMBOLS 10: Component mounting machine (to board | substrate work system) 28: Parts camera (imaging device) 36: Control device 60: Work head 62: Work head 64: Work head moving device (moving device) 81: Claw part (holding tool) 82 : Auxiliary plate (holding tool) 85: Lifting device (lowering device) 86: Lead wire correction tool (component posture correction tool) 88: Lead component (electronic component) 97: Through hole (correction tool through hole) 98: First penetration Hole part (first part) 99: Second through hole part (second part) 208: Through hole (substrate through hole) 250: Working head 254: Suction nozzle (holding tool) 260: Component posture correcting tool 270: Through hole (Correction tool through-hole) 272: First through-hole part (first part) 274: Second through-hole part (second part) 282: Electronic component

Claims (6)

(A) a holder for holding an electronic component, (B) a component posture correcting tool in which a correction tool through-hole penetrating in the vertical direction is formed and disposed below the holder, and (C) the holder A working head having a lowering device for lowering the electronic component held by the head toward the correction tool through-hole,
A moving device for moving the working head to an arbitrary position;
A control device for controlling the operation of the moving device;
An imaging device for imaging a lower end surface of the component correction tool in which the correction tool through-hole is opened,
The control device is
Based on the imaging data obtained by imaging of the imaging device, the opening position of the correction tool through hole is acquired, and the opening position of the correction tool through hole and the mounting position of the electronic component on the substrate overlap each other. And an operation of the moving device is controlled. The correction tool through hole is
A first part that is an upper part, and a second part that is at least a part between the first part and the opening on the lower end surface side of the component posture correction tool,
The first part has a tapered shape whose inner dimension increases toward the upper side,
The said 2nd part is a shape according to the external dimension of the at least one part of the electronic component hold | maintained by the said holder, The to-board work system of Claim 1 characterized by the above-mentioned. The electronic component held by the holder is a lead component,
The second part has a shape corresponding to a lead diameter of a lead component held by the holder, and the control device includes:
Based on imaging data obtained by imaging of the imaging device, the opening position of the correction tool through hole is acquired, and the opening position of the correction tool through hole and a board insertion hole for lead insertion formed on the board The on-board working system according to claim 2, wherein the operation of the moving device is controlled such that the moving device and the moving device overlap each other.   The said 2nd part is a shape according to the external dimension of the electronic component hold | maintained by the said holder, The to-substrate working system of Claim 2 characterized by the above-mentioned.   5. The substrate working system according to claim 1, wherein a lower end surface of the component correction tool through which the correction tool through-hole opens is a polished surface. The component posture correcting tool is detachable from the working head,
The control device is
2. The opening position of the through hole of the correction tool is acquired based on imaging data obtained by imaging of the imaging device after the component posture correcting tool is mounted on the work head. The board | substrate work system as described in any one of Claim 5.

Images