JP2017054844A - Electronic component - Google Patents

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JP2017054844A
JP2017054844A JP2015175514A JP2015175514A JP2017054844A JP 2017054844 A JP2017054844 A JP 2017054844A JP 2015175514 A JP2015175514 A JP 2015175514A JP 2015175514 A JP2015175514 A JP 2015175514A JP 2017054844 A JP2017054844 A JP 2017054844A
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case
circuit board
caulking piece
electronic component
insertion recess
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JP6522468B2 (en
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和雄 小金平
Kazuo Koganehira
和雄 小金平
眞仁 須山
Masahito Suyama
眞仁 須山
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Teikoku Tsushin Kogyo Co Ltd
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Teikoku Tsushin Kogyo Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an electronic component which prevents a caulking piece of a cover folded to a lower surface of a case from protruding from the lower surface of the case and also prevents a molding defect of the case from being generated and further is capable of reducing a product height.SOLUTION: A rotary electronic component 1-1 comprises: a case 10 which is formed by exposing a circuit board 40 on a bottom face of a housing recess 11 provided on an upper surface; a rotor 60 which is housed in the housing recess 11 in a freely rotatable manner; detection means consisting of a slider 80 or the like which changes an output signal in response to the rotation of the rotor 60; and a cover 100 which is fitted to the upper surface of the case 10 and fixed to the case 10 by folding and locking a caulking piece 103 that extends downwards via an outer peripheral sidewall 15 of the case 10 into a caulking piece insertion recess 21 provided on a lower surface of the case 10. In the caulking piece insertion recess 21 into which the caulking piece 103 is locked, a lower surface 47 of the circuit board 40 is exposed.SELECTED DRAWING: Figure 4

Description

本発明は、回転式電子部品やスライド式電子部品等の電子部品に関するものである。   The present invention relates to an electronic component such as a rotary electronic component or a sliding electronic component.

従来、回転式電子部品の中には、例えば特許文献1に示すように、回路基板(30)をインサート成形したケース(10)の収納凹部(13)内に回転体(50)を回転自在に収納し、その上をカバー(130)で覆い、回転体(50)に取り付けた摺動子(80)を、収納凹部(13)の底面に露出した回路基板(30)の摺接パターン(31)に摺接させることでその電気的出力を変化させる構造のものがある。この種の回転式電子部品の場合、カバー(130)のケース(10)への取り付けは、カバー(130)に設けたカシメ片(143)を、ケース(10)の下面に折り曲げることによって行われる。   Conventionally, among rotating electronic components, for example, as shown in Patent Document 1, a rotating body (50) is rotatable in a housing recess (13) of a case (10) in which a circuit board (30) is insert-molded. The sliding element (31) of the circuit board (30) exposed in the bottom surface of the accommodating recess (13) is accommodated, covered with a cover (130), and attached to the rotating body (50). ) To change its electrical output. In the case of this type of rotary electronic component, the cover (130) is attached to the case (10) by bending the crimping piece (143) provided on the cover (130) to the lower surface of the case (10). .

特開2011−243604号公報JP 2011-243604 A 特開2008−28205号公報JP 2008-28205 A

しかしながら、上記特許文献1の図4に示すように、カバー(130)のカシメ片(143)をケース(10)の下面に折り曲げると、カシメ片(143)の厚み寸法分だけ製品高さが高くなり、回転式電子部品の小型化が阻害されるという問題があった。また、カシメ片(143)はこれを精度よく水平に折り曲げることが困難なため、ケース(10)の下面を実装基板上に載置して面実装する場合、水平でないカシメ片(143)が実装基板上に当接し、その取り付け状態が不安定になる。これを防止するには、ケース(10)の下面から、別途実装基板当接用の脚部等を突出して形成しなければならず、さらに製品高さが高くなってしまう。   However, as shown in FIG. 4 of Patent Document 1 above, when the crimping piece (143) of the cover (130) is bent to the lower surface of the case (10), the product height is increased by the thickness dimension of the crimping piece (143). Thus, there is a problem that miniaturization of the rotary electronic component is hindered. Further, since it is difficult to bend the caulking piece (143) accurately and horizontally, when the lower surface of the case (10) is placed on the mounting substrate and mounted on the surface, the non-horizontal caulking piece (143) is mounted. Abutting on the substrate, the mounting state becomes unstable. In order to prevent this, it is necessary to separately form legs for contacting the mounting substrate from the lower surface of the case (10), which further increases the product height.

ケースの下面からカシメ片を突出させないようにする別の方法として、例えば特許文献2の図2に示すように、ケース(10)の下面に凹状のカシメ片挿入凹部(35)を設け、このカシメ片挿入凹部(35)内にカバー(120)のカシメ片(123)を折り曲げて挿入する構成のものもある。このように構成すれば、製品高さが高くならずにカシメ片(123)がケース(10)の下面から突出せず、この回転式電子部品を実装基板上に載置した際に、その取り付けが不安定になることはない。しかしこのように構成すると、カシメ片挿入凹部(35)を設けた箇所のケース(10)の厚みが薄くなるため、ケース(10)の成形時に、前記薄い部分への成形樹脂の充填不良を起こす可能性がある。特にケース(10)の内部に回路基板をインサート成形し、その回路基板の一部がカシメ片挿入凹部(35)の底面の上部に位置しているような場合は、その底面と回路基板との間の隙間が狭くなるので、上記充填不良の問題は大きくなる。逆に、カシメ片挿入凹部(35)の底面と回路基板との間の成形樹脂の厚み寸法を所定以上の寸法に保つためには、その分ケース(10)全体の厚みが厚くなってしまう。   As another method for preventing the caulking piece from protruding from the lower surface of the case, for example, as shown in FIG. 2 of Patent Document 2, a concave caulking piece insertion recess (35) is provided on the lower surface of the case (10). There is a configuration in which the crimping piece (123) of the cover (120) is bent and inserted into the piece insertion recess (35). With this configuration, the product height does not increase and the caulking piece (123) does not protrude from the lower surface of the case (10), and when the rotary electronic component is placed on the mounting board, the mounting is performed. Does not become unstable. However, when configured in this way, the thickness of the case (10) where the caulking piece insertion recess (35) is provided becomes thin, and therefore, when the case (10) is molded, the thin resin is poorly filled with the molding resin. there is a possibility. In particular, when the circuit board is insert-molded inside the case (10) and a part of the circuit board is located at the upper part of the bottom surface of the caulking piece insertion recess (35), Since the gap between them becomes narrow, the above-mentioned problem of poor filling becomes large. On the other hand, in order to keep the thickness dimension of the molding resin between the bottom surface of the crimping piece insertion recess (35) and the circuit board at a predetermined dimension or more, the thickness of the entire case (10) is increased accordingly.

本発明は上述の点に鑑みてなされたものでありその目的は、ケースの下面に折り曲げたカバーのカシメ片がケースの下面から突出せず、またケースの成形不良が生じることもなく、さらに製品高さを低くすることができる電子部品を提供することにある。   The present invention has been made in view of the above points, and its purpose is to prevent the caulking piece of the cover folded on the lower surface of the case from projecting from the lower surface of the case, and to prevent the molding of the case from occurring. An object of the present invention is to provide an electronic component capable of reducing the height.

本発明は、上面に設けた収納凹部の底面に回路基板を露出してなるケ−スと、前記収納凹部内に移動自在に収納される移動体と、前記移動体の移動に応じて出力信号を変化させる検出手段と、前記ケースの上面に取り付けられ、前記ケースの外周側壁を介して下方向に向かって延びるカシメ片を前記ケースの下面に設けたカシメ片挿入凹部内に折り曲げて係止することでケースに固定されるカバーと、を具備する電子部品において、前記カシメ片を係止するカシメ片挿入凹部に、前記回路基板の下面を露出したことを特徴としている。
ケースのカシメ片挿入凹部内にカバーのカシメ片を挿入・係止するので、カシメ片がケースの下面から突出せず、従ってこの回転式電子部品を実装基板上に載置した際に、その取り付けが不安定になることはない。
そして本発明によれば、回路基板の下面に至るまでカシメ片挿入凹部を形成したので、カシメ片挿入凹部の底面にケース自体を露出させるよりもケースの厚みを薄く構成することができ、これによって電子部品の製品高さを低くすることができる。本発明は、ケースの小型化等の理由によって、ケース内に収納した回路基板の下側にカシメ片挿入凹部の少なくとも一部が位置する場合に用いて好適である。
また本発明によれば、例えば回路基板をケース内にインサート成形する際、カシメ片挿入凹部となる部分の底面を形成する金型面に直接回路基板を当接できるので、回路基板の金型への位置決めを容易且つ確実に行うことができる。また前記直接当接する金型面と回路基板の間に隙間を設ける必要がないので、その隙間内への樹脂の充填不良が生じることもない。
The present invention provides a case in which a circuit board is exposed on the bottom surface of a storage recess provided on an upper surface, a moving body that is movably stored in the storage recess, and an output signal according to the movement of the moving body. A detecting means for changing the position and a caulking piece attached to the upper surface of the case and extending downward through an outer peripheral side wall of the case is bent and locked in a caulking piece insertion recess provided on the lower surface of the case Thus, an electronic component comprising a cover fixed to the case is characterized in that the lower surface of the circuit board is exposed in a caulking piece insertion recess for locking the caulking piece.
Since the caulking piece of the cover is inserted and locked in the caulking piece insertion recess of the case, the caulking piece does not protrude from the lower surface of the case, and therefore, when this rotary electronic component is placed on the mounting board, it is attached. Does not become unstable.
And according to the present invention, since the caulking piece insertion recess is formed up to the lower surface of the circuit board, the thickness of the case can be made thinner than exposing the case itself to the bottom surface of the caulking piece insertion recess, thereby The product height of the electronic component can be lowered. The present invention is suitable for use in the case where at least a part of the caulking piece insertion recess is located on the lower side of the circuit board housed in the case for reasons such as downsizing of the case.
Further, according to the present invention, for example, when the circuit board is insert-molded in the case, the circuit board can be directly brought into contact with the mold surface forming the bottom surface of the portion to be the caulking piece insertion concave portion. Can be easily and reliably positioned. Further, since it is not necessary to provide a gap between the mold surface and the circuit board that are in direct contact with each other, there is no possibility of defective filling of the resin into the gap.

また本発明は、前記回路基板の側面は、前記ケースの外周側壁で囲まれており、これによって前記カシメ片挿入凹部の底面の前記露出する回路基板の下面よりも前記ケースの外周側壁側には、前記ケース自体の下面が露出しており、前記カシメ片の折り曲げ箇所は、前記カシメ片挿入凹部の底面の前記外周側壁側の角部に当接していることを特徴としている。
カシメ片の折り曲げ箇所を、ケース自体に当接させ、回路基板に当接させないように構成したので、カシメ片の取り付けによる回路基板へのストレスを無くすことができ、これによって、検出手段による検出出力の精度の向上を図ることができる。
Further, according to the present invention, the side surface of the circuit board is surrounded by the outer peripheral side wall of the case, whereby the outer peripheral side wall of the case is closer to the lower surface of the exposed circuit board than the bottom surface of the caulking piece insertion recess. The lower surface of the case itself is exposed, and the bent portion of the caulking piece is in contact with the corner on the outer peripheral side wall side of the bottom surface of the caulking piece insertion recess.
Since the bent part of the caulking piece is in contact with the case itself and is not in contact with the circuit board, stress on the circuit board due to the attachment of the caulking piece can be eliminated. The accuracy can be improved.

本発明によれば、ケースの下面に折り曲げたカバーのカシメ片がケースの下面から突出せず、またケースの成形不良が生じることもなく、さらに製品高さを低くすることができる。   According to the present invention, the caulking piece of the cover bent on the lower surface of the case does not protrude from the lower surface of the case, and the molding of the case does not occur, and the product height can be further reduced.

電子部品1−1を上側から見た斜視図である。It is the perspective view which looked at the electronic component 1-1 from the upper side. 回転式電子部品1−1を下側から見た斜視図である。It is the perspective view which looked at the rotary electronic component 1-1 from the lower side. 回転式電子部品1−1を上側から見た分解斜視図である。It is the disassembled perspective view which looked at the rotary electronic component 1-1 from the upper side. 回転式電子部品1−1を下側から見た分解斜視図である。It is the disassembled perspective view which looked at the rotary electronic component 1-1 from the lower side. 図1のA−A断面図である。It is AA sectional drawing of FIG. 図1のB−B断面図である。It is BB sectional drawing of FIG. 電子部品1−2を下側から見た斜視図である。It is the perspective view which looked at the electronic component 1-2 from the lower side.

以下、本発明の実施形態を図面を参照して詳細に説明する。図1は本発明の第1実施形態にかかる電子部品(以下「回転式電子部品」という)1−1を上側から見た斜視図、図2は回転式電子部品1−1を下側から見た斜視図、図3は回転式電子部品1−1を上側から見た分解斜視図(但し、下記する摺動子80は回転体60に取り付けられていて見えない)、図4は回転式電子部品1−1を下側から見た分解斜視図、図5は図1のA−A断面図、図6は図1のB−B断面図である。これらの図に示すように、回転式電子部品1−1は、内部に1枚の回路基板40と3本の端子50とをインサート成形してなるケース10と、ケース10に設けた収納凹部11内に回転自在に収納される回転体本体部61を有する回転体(移動体)60と、回転体本体部61の下面に取り付けられる摺動子80と、ケース10の上面を覆うように取り付けられるカバー100とを具備して構成されている。なお以下の説明において、「上」とはケース10からカバー100を見る方向をいい、「下」とはその反対方向をいうものとする。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view of an electronic component (hereinafter referred to as “rotary electronic component”) 1-1 according to the first embodiment of the present invention as viewed from above, and FIG. 2 is a perspective view of the rotary electronic component 1-1 as viewed from below. 3 is an exploded perspective view of the rotary electronic component 1-1 as viewed from above (however, the slider 80 described below is attached to the rotary body 60 and cannot be seen), and FIG. 4 is the rotary electronic component. FIG. 5 is a sectional view taken along line AA in FIG. 1, and FIG. 6 is a sectional view taken along line BB in FIG. As shown in these drawings, the rotary electronic component 1-1 includes a case 10 formed by insert-molding one circuit board 40 and three terminals 50 therein, and a storage recess 11 provided in the case 10. A rotating body (moving body) 60 having a rotating body main body 61 that is rotatably housed therein, a slider 80 attached to the lower surface of the rotating body main body 61, and an upper surface of the case 10 are attached. The cover 100 is provided. In the following description, “upper” refers to the direction of viewing the cover 100 from the case 10, and “lower” refers to the opposite direction.

ケース10は、合成樹脂の成型品であって略矩形状であり、その上面中央には、前記回転体60の回転体本体部61を収納する寸法形状の収納凹部11が形成されている。収納凹部11の底面には、インサート成形された回路基板40の上面の中央部分が露出している。回路基板40は硬質板(例えば成形板)製であって、その中央には円形の回転体軸支孔41が形成され、また回路基板40の上面の前記回転体軸支孔41の周囲には、同心円状に2本の摺接パターン43,45がスクリ−ン印刷等によって形成されている。内側の摺接パターン43の外周からは1本の引出パターン43aが回路基板40の1外周辺に向けて引き出され、また外側の摺接パターン45の両端からは1本ずつの引出パターン45a,45bが前記1外周辺に向けて引き出されている。そして各引出パターン43a,45a,45bの一端近傍には金属板製の端子50の一端が当接され、その周囲がケース10によって覆われて固定されている。各端子50の他端側は、ケース10の外周側壁15の1辺から外部に突出し、その先端側の部分は真下方向に向けて直角に折り曲げられている。   The case 10 is a molded product of synthetic resin and has a substantially rectangular shape, and a storage recess 11 having a dimension and shape for storing the rotating body main body 61 of the rotating body 60 is formed in the center of the upper surface thereof. The central portion of the upper surface of the insert-molded circuit board 40 is exposed on the bottom surface of the housing recess 11. The circuit board 40 is made of a hard plate (for example, a molded board). A circular rotating body shaft support hole 41 is formed at the center of the circuit board 40, and around the rotating body shaft support hole 41 on the upper surface of the circuit board 40. The two sliding contact patterns 43 and 45 are concentrically formed by screen printing or the like. One lead pattern 43 a is drawn from the outer periphery of the inner sliding contact pattern 43 toward one outer periphery of the circuit board 40, and one lead pattern 45 a, 45 b from each end of the outer sliding contact pattern 45. Is drawn toward the outer periphery of the 1. One end of a metal plate terminal 50 is brought into contact with one end of each of the lead patterns 43a, 45a, 45b, and the periphery thereof is covered and fixed by the case 10. The other end side of each terminal 50 protrudes outward from one side of the outer peripheral side wall 15 of the case 10, and a portion on the tip end side thereof is bent at a right angle toward the right downward direction.

ケース10の中央の前記回路基板40の下面側には、前記回転体軸支孔41に連続するように、それと同一内径の円形の軸支孔17が形成されている。またケース10の上面13の2つの角部近傍には、上方向に向けて突出する一対の小突起からなる係止部19が形成されている。   A circular shaft support hole 17 having the same inner diameter as that of the rotating body shaft support hole 41 is formed on the lower surface side of the circuit board 40 at the center of the case 10. Further, in the vicinity of the two corners of the upper surface 13 of the case 10, a locking portion 19 is formed that is composed of a pair of small protrusions that protrude upward.

一方、ケース10の下面14には、複数(4つ)のカシメ片挿入凹部21が形成されている。各カシメ片挿入凹部21は、ケース10下面の対向する2辺から(即ち外周側壁15の下端辺を切り欠く位置から)内側方向に向けて略直線帯状の凹部を形成することで構成されている。そして各カシメ片挿入凹部21の底面には、回路基板40の下面47の一部が露出している。さらに詳細に説明すれば、回路基板40の外周の側面はケース10の外周側壁15で囲まれており、これによってカシメ片挿入凹部21の底面の前記露出する回路基板40の下面47よりもケース10の外周側壁15側(外側)には、ケース10自体の下面23が露出している。このケース10では、回路基板40の下面47とケース10自体の下面23とは同一面(同一平面)となっている。   On the other hand, a plurality (four) of crimping piece insertion recesses 21 are formed on the lower surface 14 of the case 10. Each caulking piece insertion recess 21 is formed by forming a substantially straight belt-shaped recess from the opposite two sides of the lower surface of the case 10 (that is, from a position where the lower end side of the outer peripheral side wall 15 is cut out) inward. . A part of the lower surface 47 of the circuit board 40 is exposed on the bottom surface of each caulking piece insertion recess 21. More specifically, the outer peripheral side surface of the circuit board 40 is surrounded by the outer peripheral side wall 15 of the case 10, so that the case 10 is located on the bottom surface of the caulking piece insertion recess 21 than the exposed lower surface 47 of the circuit board 40. The lower surface 23 of the case 10 itself is exposed on the outer peripheral side wall 15 side (outside). In this case 10, the lower surface 47 of the circuit board 40 and the lower surface 23 of the case 10 itself are on the same plane (same plane).

またケース10の下面14の所定位置には、この回転式電子部品1−1を図示しない実装基板に取り付ける際の位置決めを行う一対の小突起からなる係止部25が設けられている。さらにケース10の下面の所定位置には、ケース10成形時の樹脂を注入するゲートの接続跡部27や、ケース10を成形する際にその金型内に突出して回路基板40と各端子50間を挟持するピンの挿入跡部29とが形成されている。   Further, a locking portion 25 made up of a pair of small protrusions is provided at a predetermined position on the lower surface 14 of the case 10 for positioning when the rotary electronic component 1-1 is attached to a mounting board (not shown). Further, at a predetermined position on the lower surface of the case 10, there is a connection trace portion 27 of a gate for injecting resin at the time of molding the case 10 and between the circuit board 40 and each terminal 50 projecting into the mold when the case 10 is molded. An insertion trace portion 29 of the pin to be sandwiched is formed.

回転体60は、略円板状であって前記ケース10の収納凹部11に挿入できる寸法の回転体本体部61と、回転体本体部61の上面中央から立設する略円柱状の軸部63と、回転体本体部61の下面中央から突出する略円柱状の軸部65とを一体に成形して構成されている。軸部63の根元近傍部分は、下記するカバー100の軸支部107に回動自在に軸支される寸法に形成されている。軸部65の下端側の部分は、前記回路基板40の回転体軸支孔41とケース10の軸支孔17に回動自在に軸支される寸法に形成されている。また回転体本体部61の下面は摺動子取付面67になっていて、その所定位置には小突起状の摺動子取付部69が形成されている。   The rotating body 60 is substantially disc-shaped and has a size that can be inserted into the housing recess 11 of the case 10, and a substantially cylindrical shaft portion 63 that stands from the center of the upper surface of the rotating body main body 61. And a substantially cylindrical shaft portion 65 protruding from the center of the lower surface of the rotating body main body 61 is integrally formed. A portion in the vicinity of the base of the shaft portion 63 is formed to have a size that is pivotally supported by a shaft support portion 107 of the cover 100 described below. A portion on the lower end side of the shaft portion 65 is formed to a size that is rotatably supported by the rotating body shaft support hole 41 of the circuit board 40 and the shaft support hole 17 of the case 10. The lower surface of the rotating body main body 61 is a slider attachment surface 67, and a small protrusion-like slider attachment portion 69 is formed at a predetermined position.

摺動子80は、弾性金属板を略円板状に形成して構成されており、平板状の基部81の中央に円形であって前記回転体60の軸部65を挿通する挿通孔83を形成し、その周囲に一対の内側摺動冊子85を、さらにその周囲に1つの外側摺動冊子87を形成している。基部81の前記回転体60の摺動子取付部69に対向する位置には小孔からなる取付部89が形成されている。   The slider 80 is configured by forming an elastic metal plate in a substantially disk shape, and has a circular insertion hole 83 in the center of a flat plate-like base portion 81 through which the shaft portion 65 of the rotating body 60 is inserted. A pair of inner sliding booklets 85 is formed around the outer periphery, and one outer sliding booklet 87 is formed around the inner booklet. A mounting portion 89 made of a small hole is formed at a position of the base 81 facing the slider mounting portion 69 of the rotating body 60.

カバー100は、金属板製であって、前記ケース10の上面を覆う寸法形状の略矩形状のカバー本体部101と、カバー本体部101の対向する2辺から下方向に折り曲げられる一対ずつのカシメ片103及び1本ずつの取付部105とを具備して構成されている。カバー本体部101の中央には上方向に向かって突出する円形筒状の軸支部107が形成され、またカバー本体部101の前記ケース10の一対の係止部19に対向する位置には、これら係止部19を挿入する小孔からなる一対の被係止部109が形成されている。カシメ片103の中間位置の左右両側辺には、その幅寸法を小さくして折り曲げを容易とする凹部103aが形成されている。また取付部105はその中間位置よりも先端側の部分の幅寸法を小さくしている。   The cover 100 is made of a metal plate, and has a substantially rectangular cover body 101 having a dimension covering the upper surface of the case 10, and a pair of crimps that are bent downward from two opposite sides of the cover body 101. It comprises a piece 103 and one mounting part 105. A circular cylindrical shaft support portion 107 protruding upward is formed at the center of the cover main body portion 101, and these positions are opposed to the pair of locking portions 19 of the case 10 of the cover main body portion 101. A pair of locked portions 109 formed by small holes into which the locking portions 19 are inserted are formed. On both the left and right sides of the intermediate position of the crimping piece 103, there are formed recesses 103a that can be easily bent by reducing the width dimension. Further, the mounting portion 105 has a smaller width dimension at the tip side than the intermediate position.

次に回転式電子部品1−1を組み立てるには、まず予め、回転体60の摺動子取付面67に摺動子80を載置し、その際回転体60の摺動子取付部69を摺動子80の取付部89に挿入してその先端を熱カシメすることで、摺動子80を回転体60に取り付けておく。そしてケース10の収納凹部11内に、摺動子80を取り付けた回転体60の回転体本体部61を挿入し、その際回転体60の軸部65をケース10の回転体軸支孔41及び軸支孔17に回動自在に挿入する。次に、前記ケース10の上面を覆うように、カバー100のカバー本体部101を載置する。その際、カバー100の軸支部107内に回転体60の軸部63を回動自在に挿入すると共に、カバー100の各被係止部109にケース10の各係止部19を挿入し、同時にカバー100のカシメ片103及び取付部105をケース10の外周側壁15の外側に沿わせる。そして、ケース10の各カシメ片挿入凹部21に対応する位置にある各カシメ片103の先端側の部分(凹部103aよりも先端側の部分)を、各カシメ片挿入凹部21内に入り込むように折り曲げる。折り曲げた各カシメ片103は、図6に示すように、その全体がカシメ片挿入凹部21内に入り込む。これによって回転式電子部品1−1の組み立てが完了する。なお上記組立手順はその一例であり、他の各種異なる組立手順を用いて組み立てても良いことはいうまでもない。   Next, in order to assemble the rotary electronic component 1-1, first, the slider 80 is first placed on the slider mounting surface 67 of the rotating body 60, and at that time, the slider mounting portion 69 of the rotating body 60 is set. The slider 80 is attached to the rotating body 60 by being inserted into the attachment portion 89 of the slider 80 and caulking its tip. Then, the rotating body main body 61 of the rotating body 60 to which the slider 80 is attached is inserted into the housing recess 11 of the case 10, and the shaft portion 65 of the rotating body 60 is inserted into the rotating body shaft support hole 41 of the case 10 and It is rotatably inserted into the shaft support hole 17. Next, the cover body 101 of the cover 100 is placed so as to cover the upper surface of the case 10. At that time, the shaft portion 63 of the rotating body 60 is rotatably inserted into the shaft support portion 107 of the cover 100, and each locking portion 19 of the case 10 is inserted into each locked portion 109 of the cover 100. The caulking piece 103 and the attachment portion 105 of the cover 100 are placed along the outside of the outer peripheral side wall 15 of the case 10. Then, the portion on the tip side of each crimping piece 103 at the position corresponding to each crimping piece insertion recess 21 of the case 10 (the portion on the tip side relative to the recess 103 a) is bent so as to enter into each crimping piece insertion recess 21. . As shown in FIG. 6, each bent crimping piece 103 enters the crimping piece insertion recess 21 as a whole. Thereby, the assembly of the rotary electronic component 1-1 is completed. The above assembling procedure is an example, and it goes without saying that the assembly may be performed using other various assembling procedures.

そして、回転体60を回転すれば、これと一体に摺動子80が回転し、その摺動冊子85,87が摺接パターン43,45上を摺動し、各摺接パターン43,45に接続された各端子50間の検出出力が変化する。   When the rotating body 60 is rotated, the slider 80 is rotated integrally therewith, and the sliding booklets 85 and 87 are slid on the sliding contact patterns 43 and 45, respectively. The detection output between each connected terminal 50 changes.

そしてこの回転式電子部品1−1においては、図6に示すように、ケース10のカシメ片挿入凹部21内にカバー100のカシメ片103を挿入・係止するので、カシメ片103がケース10の下面から突出せず、従ってこの回転式電子部品1−1を図示しない別の実装基板上に載置した際に、その取り付けが不安定になることはない。なお、取付部105は、回転式電子部品1−1を実装基板に固定する際に利用する。   In the rotary electronic component 1-1, the caulking piece 103 of the cover 100 is inserted and locked in the caulking piece insertion recess 21 of the case 10 as shown in FIG. Therefore, when the rotary electronic component 1-1 is placed on another mounting board (not shown), the mounting thereof does not become unstable. The attachment portion 105 is used when the rotary electronic component 1-1 is fixed to the mounting board.

またこの回転式電子部品1−1においては、図6に示すように、カシメ片挿入凹部21(その底面)に回路基板40の下面47を露出しているが、これによってカシメ片挿入凹部21の底面全体にケース10自体を露出させるよりもケース10の厚みを薄く構成することができ、これによってケース10、即ち回転式電子部品1−1の製品高さを低くすることができる。言い換えれば、本発明は、ケース10の小型化等の理由によって、ケース10内に収納した回路基板40の下側にカシメ片挿入凹部21の少なくとも一部が位置する場合に用いて、特に好適である。   Moreover, in this rotary electronic component 1-1, as shown in FIG. 6, the lower surface 47 of the circuit board 40 is exposed to the caulking piece insertion concave portion 21 (the bottom surface thereof). The thickness of the case 10 can be made thinner than exposing the case 10 itself to the entire bottom surface, whereby the product height of the case 10, that is, the rotary electronic component 1-1 can be reduced. In other words, the present invention is particularly suitable for use in the case where at least a part of the caulking piece insertion recess 21 is located below the circuit board 40 accommodated in the case 10 for reasons such as downsizing the case 10. is there.

またこの回転式電子部品1−1においては、回路基板40をケース10内にインサート成形する際、カシメ片挿入凹部21となる部分の底面を形成する金型面に直接回路基板40の下面47を当接することとなる。このため、回路基板40の金型への位置決めを容易且つ確実に行うことができる。さらに言えば、カシメ片挿入凹部21となる部分の底面を形成する金型面と回路基板40の間に隙間を設けて溶融樹脂を充填する必要がないので、その隙間内への樹脂の充填不良を生じることもない。   Further, in the rotary electronic component 1-1, when the circuit board 40 is insert-molded into the case 10, the lower surface 47 of the circuit board 40 is directly formed on the mold surface that forms the bottom surface of the portion that becomes the caulking piece insertion recess 21. It will abut. For this reason, the circuit board 40 can be easily and reliably positioned on the mold. Furthermore, since there is no need to provide a gap between the mold surface that forms the bottom surface of the portion to be the caulking piece insertion recess 21 and the circuit board 40 and to fill the molten resin, poor filling of the resin into the gap Will not occur.

さらにこの回転式電子部品1−1においては、回路基板40の外周側面をケース10の外周側壁15で囲むことによって、カシメ片挿入凹部21の底面の前記露出する回路基板40の下面47よりもケース10の外周側壁15側に、ケース10を構成する合成樹脂自体の下面23を露出させ、これによってカシメ片103の折り曲げ箇所a(図6参照)を、カシメ片挿入凹部21の下面23の外周側壁15側の角部bに当接している。このようにカシメ片103の折り曲げ箇所aを、ケース10自体に当接させ、回路基板40に当接させないように構成すれば、カシメ片103の取り付けによる回路基板40へのストレスを無くすことができ、このため摺動子80と摺接パターン43,45による検出出力の精度が阻害されず、好適である。   Furthermore, in this rotary electronic component 1-1, the outer peripheral side surface of the circuit board 40 is surrounded by the outer peripheral side wall 15 of the case 10, so that the case is smaller than the exposed lower surface 47 of the circuit board 40 on the bottom surface of the caulking piece insertion recess 21. The lower surface 23 of the synthetic resin itself constituting the case 10 is exposed on the outer peripheral side wall 15 side of the outer peripheral side wall 15, and the bent portion a of the crimping piece 103 (see FIG. 6) is thereby It is in contact with the corner b on the 15 side. In this way, if the bent portion a of the crimping piece 103 is brought into contact with the case 10 itself and is not brought into contact with the circuit board 40, stress on the circuit board 40 due to the attachment of the crimping piece 103 can be eliminated. For this reason, the accuracy of detection output by the slider 80 and the sliding contact patterns 43 and 45 is not hindered, which is preferable.

図7は本発明の第2実施形態にかかる電子部品(以下「回転式電子部品」という)1−2を下側から見た斜視図である。同図に示す回転式電子部品1−2において、前記図1〜図6に示す実施形態にかかる回転式電子部品1−1と同一又は相当部分には同一符号を付す(但し、各符号には添え字「−2」を付す)。なお以下で説明する事項以外の事項については、前記図1〜図6に示す実施形態と同じである。但し、この回転式電子部品1−2の場合、回転体60−2の上部側の軸部の高さが低いので、図7では見えていない。   FIG. 7 is a perspective view of an electronic component (hereinafter referred to as “rotary electronic component”) 1-2 according to the second embodiment of the present invention as viewed from below. In the rotary electronic component 1-2 shown in the figure, the same or corresponding parts as those of the rotary electronic component 1-1 according to the embodiment shown in FIGS. Subscript "-2"). Note that matters other than those described below are the same as those in the embodiment shown in FIGS. However, in the case of the rotary electronic component 1-2, since the height of the shaft portion on the upper side of the rotating body 60-2 is low, it cannot be seen in FIG.

図7に示すように、回転式電子部品1−2は、内部に1枚の回路基板40−2と左右2本ずつの端子50−2とをインサート成形してなるケース10−2と、ケース10−2の上面に設けた図示しない収納凹部内に回転自在に収納される回転体(移動体)60−2と、回転体60−2の下面に取り付けられる図示しない摺動子と、ケース10−2の上面を覆うように取り付けられるカバー100−2とを具備し、回転体60−2を回転することで、摺動子が収納凹部の底面に露出している回路基板40−2の図示しない摺接パターン上を摺動してその検出出力が各端子50−2に出力されるように構成されている。カバー100−2は、ケース10−2の外周側壁15−2を介して下方向に向かって延びるカシメ片103−2をケース10−2の下面14−2に設けたカシメ片挿入凹部21−2内に折り曲げて係止することでケース10−2に固定される。   As shown in FIG. 7, the rotary electronic component 1-2 includes a case 10-2 in which one circuit board 40-2 and two right and left terminals 50-2 are insert-molded, and a case 10-2. 10-2, a rotating body (moving body) 60-2 that is rotatably housed in a housing recess (not shown) provided on the upper surface of 10-2, a slider (not shown) attached to the lower surface of the rotating body 60-2, and the case 10 The circuit board 40-2 is provided with a cover 100-2 attached so as to cover the upper surface of -2 and by rotating the rotating body 60-2, the slider is exposed on the bottom surface of the housing recess. The detection output is output to each terminal 50-2 by sliding on the sliding contact pattern. The cover 100-2 is a caulking piece insertion recess 21-2 in which a caulking piece 103-2 extending downward through the outer peripheral side wall 15-2 of the case 10-2 is provided on the lower surface 14-2 of the case 10-2. It is fixed to the case 10-2 by being bent and locked inside.

そしてこの回転式電子部品1−2のケース10−2においては、カシメ片挿入凹部21−2の底面全体に、回路基板40−2の下面を露出している。言い換えれば、回路基板40−2の外周の側面をケース10−2の外周側壁15−2に露出させ、これによってカシメ片挿入凹部21−2の底面全体に回路基板40−2の下面を露出させている。そしてこのケース10−2の場合、カシメ片103−2の折り曲げ箇所a−2を、回路基板40−2の露出する外周側面に当接させている。このように構成した場合、上記ケース10のように、カシメ片103の取り付けによる回路基板40へのストレス解消という効果は有さないが、その代りに、ケース10−2のカシメ片挿入凹部21−2を設けた対向する両外周側壁15−2間の幅寸法の小型化を図ることができる。   And in case 10-2 of this rotary electronic component 1-2, the lower surface of circuit board 40-2 is exposed to the whole bottom face of caulking piece insertion recessed part 21-2. In other words, the outer peripheral side surface of the circuit board 40-2 is exposed to the outer peripheral side wall 15-2 of the case 10-2, thereby exposing the lower surface of the circuit board 40-2 to the entire bottom surface of the caulking piece insertion recess 21-2. ing. In the case 10-2, the bent portion a-2 of the crimping piece 103-2 is brought into contact with the exposed outer peripheral side surface of the circuit board 40-2. When configured in this manner, unlike the case 10, the caulking piece 103 does not have the effect of relieving stress on the circuit board 40, but instead, the caulking piece insertion recess 21-of the case 10-2 is provided. The width dimension between the opposing outer peripheral side walls 15-2 provided with 2 can be reduced.

以上本発明の実施形態を説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲、及び明細書と図面に記載された技術的思想の範囲内において種々の変形が可能である。なお直接明細書及び図面に記載がない何れの形状や構造や材質であっても、本願発明の作用・効果を奏する以上、本願発明の技術的思想の範囲内である。例えば、上記例では回路基板として、硬質の回路基板を用いたが、場合によっては、フレキシブル回路基板を用いても良い。また上記例では、移動体として回転体を用いた回転式電子部品の例を説明したが、移動体がスライド移動するスライド式電子部品にも本発明を適用することができる。なおスライド移動方向は、直線方向のみならず、円弧方向やその他の曲線方向などの各種方向を含む概念である。また上記例では、検出手段として、摺動子と摺接パターンとを用いたが、移動体の移動に応じて出力信号を変化させる検出手段であれば、他の各種構成の検出手段(電気的、磁気的、光学的等を問わない)であっても良い。また上記例では、回路基板をケースにインサート成形した例を示したが、インサート成形でなくても良く、例えば成形したケース内に回路基板を後から組み込む構造等であっても良い。また上記例では、ケースのカシメ片挿入凹部の底面に露出する回路基板の下面とケース自体の下面とを同一面(同一平面)になるように構成したが、両下面は必ずしも同一面でなくてもよい。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. Note that any shape, structure, or material not directly described in the specification and drawings is within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, although a hard circuit board is used as the circuit board in the above example, a flexible circuit board may be used in some cases. In the above example, an example of a rotary electronic component using a rotating body as a moving body has been described. However, the present invention can also be applied to a sliding electronic component in which the moving body slides. The slide movement direction is a concept including not only a linear direction but also various directions such as an arc direction and other curved directions. In the above example, the slider and the sliding contact pattern are used as the detection means. However, any other detection means (electrical) can be used as long as the detection means changes the output signal according to the movement of the moving body. , Magnetic, optical, etc.). In the above example, an example in which the circuit board is insert-molded in the case has been shown. However, the circuit board may not be insert-molded. For example, a structure in which the circuit board is incorporated in the molded case later may be used. In the above example, the lower surface of the circuit board exposed on the bottom surface of the caulking piece insertion recess of the case and the lower surface of the case itself are configured to be on the same plane (same plane), but both the lower surfaces are not necessarily the same plane. Also good.

また、上記各図で示した実施形態は、その目的及び構成等に矛盾がない限り、互いの記載内容を組み合わせることが可能である。また、各図の記載内容は、それぞれ独立した実施形態になり得るものであり、本発明の実施形態は各図を組み合わせた一つの実施形態に限定されるものではない。   Further, the embodiments described in the above drawings can be combined with each other as long as there is no contradiction in the purpose and configuration. Moreover, the description content of each figure may become independent embodiment, respectively, and embodiment of this invention is not limited to one embodiment which combined each figure.

1−1 回転式電子部品(電子部品)
10 ケース
11 収納凹部
14 ケースの下面
15 外周側壁
21 カシメ片挿入凹部
23 ケース自体の下面
40 回路基板
43 摺接パターン(検出手段)
45 摺接パターン(検出手段)
47 回路基板の下面
50 端子
60 回転体(移動体)
80 摺動子(検出手段)
100 カバー
103 カシメ片
a 折り曲げ箇所
b 角部
1-1 Rotary electronic components (electronic components)
DESCRIPTION OF SYMBOLS 10 Case 11 Storage recessed part 14 Case lower surface 15 Outer peripheral side wall 21 Crimp piece insertion recessed part 23 Case lower surface 40 Circuit board 43 Sliding contact pattern (detection means)
45 Sliding contact pattern (detection means)
47 Lower surface of circuit board 50 Terminal 60 Rotating body (moving body)
80 Slider (detection means)
100 Cover 103 Crimp piece a Folded part b Corner

Claims (2)

上面に設けた収納凹部の底面に回路基板を露出してなるケ−スと、
前記収納凹部内に移動自在に収納される移動体と、
前記移動体の移動に応じて出力信号を変化させる検出手段と、
前記ケースの上面に取り付けられ、前記ケースの外周側壁を介して下方向に向かって延びるカシメ片を前記ケースの下面に設けたカシメ片挿入凹部内に折り曲げて係止することでケースに固定されるカバーと、を具備する電子部品において、
前記カシメ片を係止するカシメ片挿入凹部に、前記回路基板の下面を露出したことを特徴とする電子部品。
A case in which the circuit board is exposed on the bottom surface of the storage recess provided on the top surface;
A movable body movably housed in the housing recess;
Detecting means for changing an output signal in accordance with movement of the moving body;
A caulking piece attached to the upper surface of the case and extending downward through the outer peripheral side wall of the case is fixed to the case by bending and locking in a caulking piece insertion recess provided on the lower surface of the case. And an electronic component comprising a cover,
An electronic component, wherein a lower surface of the circuit board is exposed in a caulking piece insertion recess for locking the caulking piece.
請求項1に記載の電子部品であって、
前記回路基板の側面は、前記ケースの外周側壁で囲まれており、
これによって前記カシメ片挿入凹部の底面の前記露出する回路基板の下面よりも前記ケースの外周側壁側には、前記ケース自体の下面が露出しており、
前記カシメ片の折り曲げ箇所は、前記カシメ片挿入凹部の底面の前記外周側壁側の角部に当接していることを特徴とする電子部品。
The electronic component according to claim 1,
A side surface of the circuit board is surrounded by an outer peripheral side wall of the case,
Accordingly, the lower surface of the case itself is exposed on the outer peripheral side wall side of the case from the lower surface of the exposed circuit board on the bottom surface of the caulking piece insertion recess,
An electronic component, wherein the crimped piece is bent at a corner of the bottom surface of the caulking piece insertion recess on the outer peripheral side wall.
JP2015175514A 2015-09-07 2015-09-07 Electronic parts Active JP6522468B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7466183B2 (en) 2020-03-30 2024-04-12 帝国通信工業株式会社 Case with built-in circuit board with terminals

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7466183B2 (en) 2020-03-30 2024-04-12 帝国通信工業株式会社 Case with built-in circuit board with terminals

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