JP2017049749A - Capacitance sensor, touch panel, and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a capacitance sensor with ESD protection and an increased detection area, and to provide a touch panel and electronic device.SOLUTION: A capacitance sensor of the present invention includes; a translucent substrate; transparent electrodes disposed in a detection area on the substrate; wiring disposed in an area outside the detection area and electrically connected to the transparent electrodes; a translucent panel provided to cover the transparent electrodes and the wiring; and conductive shield wiring provided on a side face of the panel.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a capacitive sensor, a touch panel, and an electronic device, and more particularly to a capacitive sensor, a touch panel, and an electronic device that can widen a detection area.

  Patent Document 1 discloses a touch panel in which a sensor substrate and a cover substrate are bonded to each other via a fixed layer. The cover substrate described in Patent Document 1 is provided with a light shielding layer and a conductive layer. The conductive layer is provided in contact with the surface of the light shielding layer and has a width wider than the width of the signal wiring. The conductive layer is made of a metal material, and is made of a low resistance material such as a conductive paste or a silver paste. Furthermore, the conductive layer is provided in a region outside the region facing the signal wiring and extends along the periphery of the sensor electrode and the signal wiring. Therefore, the conductive layer described in Patent Document 1 functions as a guard ring for ESD (Electro Static Discharge) countermeasures.

  Here, in general, the periphery of the sensor electrode and the signal wiring is a region where a fixed layer used when the touch panel is bonded to a housing of the device or the like is provided. In the touch panel described in Patent Document 1, a conductive layer functioning as a guard ring for ESD countermeasures is provided in a region where the fixed layer is provided. Therefore, the touch panel described in Patent Document 1 does not require a new space for the conductive layer in the in-plane layout of the touch panel, and as a result, it is possible to take ESD countermeasures without expanding the frame.

JP 2013-161397 A

  However, in the touch panel described in Patent Document 1, the conductive layer is provided in the peripheral area of the sensor electrode and the signal wiring (area where the fixed layer is provided) and is provided in contact with the surface of the light shielding layer. That is, the conductive layer is provided in a decoration area (non-detection area) formed on the periphery of the detection area of the touch panel. Therefore, while the touch panel described in Patent Document 1 can take ESD countermeasures without widening the frame, it is difficult to narrow the frame to widen the detection area of the touch panel and to take ESD countermeasures.

  The present invention is for solving the above-described conventional problems, and an object of the present invention is to provide a capacitive sensor, a touch panel, and an electronic device that can take ESD countermeasures and expand a detection area.

  In one aspect, the capacitive sensor of the present invention is a translucent substrate, a translucent transparent electrode provided in a detection region on the substrate, and a region outside the detection region. A wiring portion electrically connected to the transparent electrode, a transparent panel provided on the transparent electrode and the wiring portion, and a conductive shield wiring provided on a side surface of the panel And.

  According to the capacitive sensor according to one embodiment of the present invention, since the conductive shield wiring is provided on the side surface of the panel, the wiring portion is prevented from fusing even when ESD occurs. Measures can be taken. In addition, the shield wiring is not provided substantially in parallel with the wiring part, but is provided on the side surface of the panel, so there is no need to provide a space for providing the shield wiring substantially in parallel with the wiring part. , The detection area can be expanded. As described above, according to the capacitive sensor of one embodiment of the present invention, it is possible to take ESD countermeasures and widen the detection area.

  In the capacitance type sensor of the present invention, the outer region further includes a light-blocking decorative layer provided on the surface of the panel facing the wiring portion, and the wiring portion is made of a metal-containing material. It may be formed. According to this, even when a low-resistance metal is used for the wiring portion, the shield wiring can prevent the wiring portion from fusing and can take ESD countermeasures. Moreover, it is not necessary to provide a space for providing the shield wiring substantially in parallel with the wiring portion, and the decoration area formed by the decoration layer can be narrowed, so that the detection area can be widened.

  In the capacitance type sensor of the present invention, the wiring portion may be formed of a transparent conductive material, and the shield wiring may be formed of a black material. According to this, even if the decoration area is not provided, not only can ESD be taken, but the transparent electrode can be arranged in the vicinity of the side surface of the panel. Therefore, the detection area can be expanded. Also, since the shield wiring is made of a black material, it absorbs part of the light emitted from the display panel, for example, and reduces the possibility of light leakage caused by reflection on the shield wiring from the operation surface. Can be made. Therefore, an image from the display panel can be clearly displayed.

  The capacitive sensor of the present invention further includes a flexible printed circuit board electrically connected to the wiring portion, and the shield wiring is electrically connected to a portion of the flexible printed circuit board that is set to a ground potential. It may be connected. According to this, since the shield wiring is electrically connected to a portion of the flexible printed circuit board that is set to the ground potential, even during transportation of the capacitive sensor, for example, a touch panel, an electronic device, etc. Products can be protected from ESD.

  In one aspect, the touch panel of the present invention includes a display panel and a touch sensor provided on the display panel, and the touch sensor is any one of the electrostatic capacitance sensors described above. And According to this, it is possible to provide a touch panel in which an ESD countermeasure is taken and a detection area is widened by the electrostatic capacitance sensor provided on the side surface of the panel and having a conductive shield wiring.

  An electronic apparatus according to the present invention includes the touch sensor described above. According to this, it is possible to provide an electronic device in which an ESD countermeasure is taken and the detection area is widened by the electrostatic capacitance sensor provided on the side surface of the panel and having a conductive shield wiring.

  The electronic device of the present invention may further include a housing for fixing the touch sensor, and the housing may have a protrusion that is in contact with the shield wiring and electrically connected to the shield wiring. . According to this, since the protrusion part of the housing is electrically connected to the shield wiring, for example, the volume of the wiring connected to the portion set to the ground potential can be increased. Therefore, the shielding effect can be enhanced as compared with the case where the protrusion is not electrically connected to the shield wiring.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the electrostatic capacitance type sensor, touch panel, and electronic device which can take a countermeasure against ESD and can expand a detection area.

It is a typical top view showing the electrostatic capacity type sensor concerning this embodiment. It is the typical enlarged view to which area | region A1 represented in FIG. 1 was expanded. It is typical sectional drawing in cut surface AA represented to FIG. It is typical sectional drawing showing the electrostatic capacitance type sensor which concerns on this embodiment. It is typical sectional drawing showing the electrostatic capacitance type sensor which concerns on other embodiment. It is a typical sectional view showing the state where the electrostatic capacity type sensor concerning this embodiment was installed in the case of an apparatus. It is a schematic diagram which shows the application example of the electrostatic capacitance type sensor which concerns on this embodiment. It is a schematic diagram which shows the application example of the electrostatic capacitance type sensor which concerns on this embodiment.

Embodiments of the present invention will be described below with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and detailed description is abbreviate | omitted suitably.
FIG. 1 is a schematic plan view showing a capacitive sensor according to the present embodiment.
FIG. 2 is a schematic enlarged view in which the region A1 shown in FIG. 1 is enlarged.
FIG. 3 is a schematic cross-sectional view taken along a cutting plane AA shown in FIG.
FIG. 4 is a schematic cross-sectional view showing the capacitive sensor according to the present embodiment.
Fig.4 (a) is typical sectional drawing in cut-surface BB represented to FIG. FIG. 4B is a schematic cross-sectional view taken along the cutting plane CC shown in FIG.

  In the present specification, “transparent” and “translucent” refer to a state where the visible light transmittance is 50% or more (preferably 80% or more). Furthermore, the haze value is preferably 6% or less. In the present specification, “light shielding” and “light shielding” refer to a state where the visible light transmittance is less than 50% (preferably less than 20%).

  As shown in FIGS. 1 to 3, the capacitive sensor 1 according to this embodiment includes a base material 2, a first electrode 8, a second electrode 12, a wiring portion 6, and a panel 3. , And shield wiring 18.

  The first electrode 8 is provided in the detection region 11 (a region where an operation can be performed with an operating body such as a finger), and includes a plurality of first transparent electrodes 4. As shown in FIG. 3, the plurality of first transparent electrodes 4 are formed on the surface 2 a of the substrate 2. Each first transparent electrode 4 is connected in the Y1-Y2 direction (first direction) via an elongated connecting portion 7. And the 1st electrode 8 which has the some 1st transparent electrode 4 connected by the Y1-Y2 direction is arranged at intervals in the X1-X2 direction.

  The first transparent electrode 4 and the connecting portion 7 are formed of a transparent conductive material such as ITO (Indium Tin Oxide) by sputtering or vapor deposition. Examples of the transparent conductive material include, besides ITO, metal nanowires typified by silver nanowires, thin metals formed in a mesh shape, or conductive polymers. This also applies to the transparent conductive material described later. The base material 2 has translucency and is formed of a film-like transparent base material such as polyethylene terephthalate (PET), a glass base material, or the like.

  The second electrode 12 is provided in the detection region 11 and has a plurality of second transparent electrodes 5. As shown in FIG. 3, the plurality of second transparent electrodes 5 are formed on the surface 2 a of the substrate 2. Thus, the 2nd transparent electrode 5 is formed in the same surface (surface 2a of the base material 2) as the 1st transparent electrode 4. FIG. As shown in FIGS. 2 and 3, each second transparent electrode 5 is connected to the X1-X2 direction (second direction) via the elongated bridge wiring 10. And the 2nd electrode 12 which has the some 2nd transparent electrode 5 connected with the X1-X2 direction is arranged at intervals in the Y1-Y2 direction. Note that the X1-X2 direction intersects the Y1-Y2 direction. For example, the X1-X2 direction intersects the Y1-Y2 direction perpendicularly.

  The second transparent electrode 5 is formed of a transparent conductive material such as ITO by sputtering or vapor deposition. The bridge wiring 10 is formed of a transparent conductive material such as ITO. Alternatively, the bridge wiring 10 may have a first layer containing a transparent conductive material such as ITO and a second layer made of a transparent metal having a lower resistance than the first layer. When the bridge wiring 10 has a laminated structure of the first layer and the second layer, the second layer is preferably formed of any one selected from the group consisting of Au, Au alloy, CuNi, and Ni. It is. Among these, it is more preferable to select Au. When the second layer is formed of Au, the bridge wiring 10 can obtain good environmental resistance (humidity resistance, heat resistance).

  In FIG. 1, the first transparent electrode 4, the second transparent electrode 5, and the wiring portion 6 formed on the surface 2 a of the base material 2 included in the capacitive sensor 1 are illustrated. However, actually, as shown in FIG. 3, the panel 3 is provided on the surface 2 a side of the substrate 2. The panel 3 has translucency. For example, on the back surface 3b of the panel 3 in the area where the wiring part 6 is provided (the area outside the detection area 11) (the surface facing the wiring part 6: the surface opposite to the operation surface 3a of the panel 3) There is a decorative layer 9. Therefore, when the decoration layer 9 exists, the wiring part 6 cannot be seen from the surface side of the panel 3 (the operation surface 3a side). That is, the decoration layer 9 has a light shielding property. Although the transparent electrode is transparent and cannot be visually recognized, FIG. 1 shows the outer shape of the transparent electrode. Moreover, in this embodiment, the decoration layer 9 does not necessarily need to be provided except the area | region in which the external connection part 27 was provided.

  As shown in FIGS. 2 and 3, an insulating layer 20 is formed on the surface of the connecting portion 7 that connects the first transparent electrodes 4. As shown in FIG. 3, the insulating layer 20 fills the space between the connecting portion 7 and the second transparent electrode 5, and slightly rides on the surface of the second transparent electrode 5. As the insulating layer 20, for example, a novolac resin (resist) is used.

  As shown in FIGS. 2 and 3, the bridge wiring 10 is formed from the surface 20 a of the insulating layer 20 to the surface of each second transparent electrode 5 located on both sides of the insulating layer 20 in the X1-X2 direction. The bridge wiring 10 electrically connects the second transparent electrodes 5.

  As shown in FIGS. 2 and 3, an insulating layer 20 is provided on the surface of the connecting portion 7 that connects the first transparent electrodes 4, and between the second transparent electrodes 5 on the surface of the insulating layer 20. A bridge wiring 10 to be connected is provided. As described above, the insulating layer 20 is interposed between the connecting portion 7 and the bridge wiring 10, and the first transparent electrode 4 and the second transparent electrode 5 are electrically insulated. In this embodiment, the 1st transparent electrode 4 and the 2nd transparent electrode 5 can be formed in the same surface (surface 2a of the base material 2), and thickness reduction of the capacitive sensor 1 is realizable.

  Note that the connecting portion 7, the insulating layer 20, and the bridge wiring 10 are all located in the detection region 11, and have translucency similarly to the first transparent electrode 4 and the second transparent electrode 5.

  In the capacitive sensor 1 shown in FIG. 1, the periphery (outside) of the detection region 11 is a frame-shaped decoration region (non-detection region) 25. While the detection region 11 has translucency, the decoration region 25 does not have translucency. That is, the decoration region 25 has a light shielding property. Therefore, in the capacitance type sensor 1 shown in FIG. 1, the wiring portion 6 and the external connection portion 27 provided in the decoration region 25 are viewed from the surface of the capacitance type sensor 1 (the surface of the panel 3). I can't. Moreover, as shown in FIG. 3, the decoration layer 9 is formed in the back surface 3b of the panel 3 in the decoration area | region 25. As shown in FIG. As described above, the decorative layer 9 is not necessarily provided except for the region where the external connection portion 27 is provided.

  As shown in FIG. 1, a plurality of wiring portions 6 led out from each first electrode 8 and each second electrode 12 are formed in the decoration region 25. Each of the first electrode 8 and the second electrode 12 is electrically connected to the wiring portion 6 via the connection wiring 16. As shown in FIG. 1, the tip of each wiring portion 6 is formed as an external connection portion 27 that is electrically connected to the flexible printed board 29. As shown in FIG. 4B, the external connection portion 27 is electrically connected to the flexible printed circuit board 29 via a conductive paste 28, for example.

  Each wiring part 6 is formed of a material having a metal such as Cu, Cu alloy, CuNi alloy, Ni, Ag, or Au. The connection wiring 16 is made of a transparent conductive material such as ITO, and extends from the detection region 11 to the decoration region 25. The wiring portion 6 is stacked on the connection wiring 16 in the decoration region 25 and is electrically connected to the connection wiring 16. When the decorative layer 9 is not provided in a region other than the region where the external connection portion 27 is provided, each wiring portion 6 is formed of a transparent conductive material such as ITO by sputtering or vapor deposition. The

  As shown in FIG. 3, the panel 3 is joined to the base material 2 through an optical transparent adhesive layer (OCA) 30 provided between the base material 2 and the panel 3. The material of the panel 3 is not particularly limited. As a material of the panel 3, a glass substrate or a plastic substrate is preferably applied. The optical transparent adhesive layer (OCA) 30 is an acrylic adhesive or a double-sided adhesive tape.

  As shown in FIGS. 1 to 3, a shield wiring 18 is provided on the side surface of the panel 3. Specifically, as shown in FIG. 1, the shield wiring 18 is provided on the other side surfaces 3c, 3d, and 3e excluding the side surface 3f in the region where the external connection portion 27 is provided. The shield wiring 18 has conductivity and is formed of a material having a metal such as Cu, Cu alloy, CuNi alloy, Ni, Ag, or Au. The shield wiring 18 is formed of an ink containing a metal material, for example, by screen printing. Alternatively, the shield wiring 18 may be formed of a material having a metal by sputtering or vapor deposition. Alternatively, the shield wiring 18 may be formed of ink containing a carbon-based conductive material, for example, by screen printing.

  As shown in FIGS. 1 and 4A, the shield wiring 18 extends from the side surfaces 3 c and 3 e of the panel 3 to the flexible printed circuit board 29 through the back surface 3 b of the panel 3 on both sides of the external connection portion 27. ing. The connection between the shield wiring 18 provided on the side surfaces 3c and 3e of the panel 3 and the shield wiring 18 provided on the back surface 3b of the panel 3 is formed by an ink containing a metal material, for example, by screen printing or the like. The Alternatively, the connection between the shield wiring 18 provided on the side surfaces 3c and 3e of the panel 3 and the shield wiring 18 provided on the back surface 3b of the panel 3 may be formed by sputtering, vapor deposition, or the like.

  As shown in FIG. 4A, the shield wiring 18 is electrically connected to, for example, a portion of the flexible printed circuit board 29 that is set to the ground potential, for example, via the conductive paste 28.

  In the capacitive sensor 1 shown in FIG. 1, when the finger F is brought into contact with the operation surface 3 a of the panel 3 as shown in FIG. 3, between the finger F and the first transparent electrode 4 close to the finger F, In addition, a capacitance is generated between the finger F and the second transparent electrode 5 close to the finger F. The capacitive sensor 1 can calculate the contact position of the finger F based on the capacitance change at this time. The capacitance type sensor 1 detects the X coordinate of the position of the finger F based on the capacitance change between the finger F and the first electrode 8, and detects the X coordinate between the finger F and the second electrode 12. The Y coordinate of the position of the finger F is detected based on the capacitance change (self-capacitance detection type).

  Alternatively, the capacitive sensor 1 may be a mutual capacitance detection type. In other words, the capacitive sensor 1 applies a driving voltage to one of the first electrode 8 and the second electrode 12, and either the first electrode 8 or the second electrode 12 is applied. A change in capacitance between the other electrode and the finger F may be detected. Thereby, the capacitive sensor 1 detects the Y coordinate of the position of the finger F by the other electrode, and detects the X coordinate of the position of the finger F by the one electrode.

Here, when ESD (Electro Static Discharge) occurs outside the capacitive sensor 1 and a voltage is applied to the capacitive sensor 1, the current is supplied to the side surfaces 3 c, 3 d, 3e (the outermost surface of the capacitive sensor 1) flows through the shield wiring 18 provided. Since the shield wiring 18 is electrically connected to, for example, a portion of the flexible printed circuit board 29 that is set to the ground potential as a reference potential, it is possible to suppress a current from flowing through the wiring portion 6. That is, when a voltage is applied to the capacitance type sensor 1 due to ESD generated outside the capacitance type sensor 1, it is possible to suppress current from flowing to the shield wiring 18 and flowing to the wiring portion 6. . Therefore, it can be suppressed that a large current flows instantaneously into the wiring part 6 and the wiring part 6 generates heat locally and melts.
This is not limited to ESD alone, and the same applies when noise occurs outside the capacitive sensor 1.

  According to the present embodiment, since the shield wiring 18 is provided on the side surfaces 3c, 3d, and 3e of the panel 3, even when ESD occurs, the wiring portion 6 can be prevented from fusing and ESD countermeasures can be taken. it can. Further, the shield wiring 18 is not provided substantially in parallel with the wiring part 6, but is provided on the side surfaces 3 c, 3 d, 3 e of the panel 3. Therefore, it is not necessary to provide a space for providing the shield wiring 18 substantially in parallel with the wiring portion 6, and the decoration region 25 can be narrowed. Thereby, the detection area 11 can be expanded.

  In addition, since the shield wiring 18 is electrically connected to a portion of the flexible printed board 29 that is set to the ground potential as the reference potential, for example, even when the capacitive sensor 1 is being transported, for example, the touch panel And products such as electronic devices can be protected from ESD.

  Furthermore, even when the decorative region 25 is not provided in a region other than the region where the external connection portion 27 is provided, not only can ESD countermeasures be provided by using a low-resistance metal as the material of the shield wiring 18. The first electrode 8 and the second electrode 12 can be disposed up to the vicinity of the side surfaces 3c, 3d, and 3e of the panel 3. Thereby, the detection area 11 can be expanded.

FIG. 5 is a schematic cross-sectional view showing a capacitive sensor according to another embodiment.
FIG. 5 corresponds to a schematic cross-sectional view taken along the section AA shown in FIG. Further, in the capacitance type sensor shown in FIG. 5, the first transparent electrode 4, the second transparent electrode 5, and the wiring portion 6 are omitted for convenience of explanation.

  The capacitive sensor 1a shown in FIG. 5 is provided on the display panel 210. As the display panel 210, for example, a liquid crystal display panel is used. In the capacitive sensor 1a according to the present embodiment, the decorative layer 9 is not provided except for the region where the external connection portion 27 is provided. In other words, the decorative area 25 is not provided in the capacitive sensor 1a according to the present embodiment except for the area where the external connection portion 27 is provided.

  Shield wiring 18 is provided on the side surfaces 3c, 3d, and 3e of the panel 3 (see FIG. 1). The shield wiring 18 of the capacitive sensor 1a is formed by screen printing with an ink of a black material such as carbon, and can be shielded from light.

  As indicated by an arrow A11 shown in FIG. 5, a part of the light emitted from the display panel 210 passes through the capacitive sensor 1a and is emitted to the outside of the capacitive sensor 1a. Further, as indicated by an arrow A <b> 12 illustrated in FIG. 5, another part of the light emitted from the display panel 210 proceeds to the side surface 3 c of the panel 3. Note that another part of the light emitted from the display panel 210 proceeds not only to the side surface 3c but also to the other side surfaces 3d and 3e (see FIG. 1).

  Here, since the shield wiring 18 of the capacitive sensor 1a is formed of a black material such as carbon, for example, the light traveling in the direction of the arrow A12 is easily absorbed by the side surface 3c of the panel 3. For this reason, it is hard to produce reflected light like arrow A13. That is, by forming the shield wiring 18 from a black material, it is possible to reduce the possibility of light leakage as indicated by the arrow A13 shown in FIG. 5 from the operation surface 3a of the panel 3. Therefore, the image from the display panel 210 can be clearly displayed.

FIG. 6 is a schematic cross-sectional view illustrating a state in which the capacitive sensor according to the present embodiment is installed in the housing of the electronic device.
Note that FIG. 6 corresponds to a schematic cross-sectional view taken along the section AA shown in FIG. Further, in the capacitance type sensor shown in FIG. 6, the first transparent electrode 4, the second transparent electrode 5, and the wiring portion 6 are omitted for convenience of explanation.

  The capacitive sensor 1a shown in FIG. 6 is provided on the display panel 210 in the same manner as the capacitive sensor 1a described above with reference to FIG. As the display panel 210, for example, a liquid crystal display panel is used. The capacitive sensor 1a is not provided with the decorative layer 9 and the decorative region 25 except for the region where the external connection portion 27 is provided. The shield wiring 18 provided on the side surfaces 3c, 3d, and 3e of the panel 3 is formed by screen printing with an ink of a black material such as carbon.

  The capacitive sensor 1a and the display panel 210 are fixed to the casing 310 of the electronic device by a fixing member 330 such as a double-sided adhesive tape. The housing 310 has a protrusion 340. The protruding portion 340 is provided on the inner side surface 311 of the housing 310 and is in contact with the shield wiring 18. The protruding portion 340 is formed of a material having a metal such as Cu, Cu alloy, CuNi alloy, Ni, Ag, or Au. Therefore, the protrusion 340 is electrically connected to the shield wiring 18.

  An electronic component 230 such as a substrate or a battery is provided between the display panel 210 and the housing 310.

  According to the present embodiment, since the protrusion 340 provided on the inner side surface 311 of the housing 310 is electrically connected to the shield wiring 18, for example, the wiring connected to the portion set to the ground potential The volume of can be increased. Therefore, the shielding effect can be enhanced as compared with the case where the protrusion 340 is not electrically connected to the shield wiring 18.

Next, an application example of the capacitive sensor 1 according to the present embodiment will be described.
FIG. 7A to FIG. 8B are schematic views showing application examples of the capacitive sensor according to this embodiment.
FIG. 7A illustrates an example in which the capacitive sensor 1 is applied to the touch panel 200. The touch panel 200 includes a display panel 210 and a capacitive sensor 1 provided on the display panel 210. As the display panel 210, for example, a liquid crystal display panel is used. A display panel 210 formed of a liquid crystal display panel includes a drive substrate 211 and a counter substrate 212 that are arranged to face each other, and a liquid crystal layer 213 is provided between the drive substrate 211 and the counter substrate 212. The touch sensor 220 is provided on the front side of the counter substrate 212.

  FIG. 7B illustrates an example of an electronic device 300 that includes the touch panel 200. The electronic device 300 is a television, for example. The electronic device 300 includes a housing 310 and a display unit 320. A touch panel 200 is provided on the surface of the display unit 320. Note that the electronic device 300 is not limited to a television, and may be another device such as a smartphone, a mobile phone, or a tablet terminal.

  FIG. 8A illustrates an example of a computer 400 (a notebook computer) that includes the touch panel 200. The computer 400 includes a display 410, a keyboard 420, an input pad 430, and the like. As illustrated in FIG. 8B, the computer 400 includes a central processing unit 401, a main storage unit 402, a secondary storage unit 403, an input unit 404, an output unit 405, and an interface 406. The keyboard 420 and the input pad 430 are examples of the input unit 404. The display 410 is an example of the output unit 405. Touch panel 200 is included in display 410. The touch panel 200 is an example in which both the input unit 404 and the output unit 405 are used.

  By applying the capacitive sensor 1 of the present embodiment to these devices, it is possible to provide the touch panel 200, the electronic device 300, and the computer 400 that take ESD countermeasures and expand the detection region 11.

  In addition, although this embodiment and its application example were demonstrated above, this invention is not limited to these examples. For example, those in which the person skilled in the art appropriately added, deleted, or changed the design of the above-described embodiments or application examples thereof, or combinations of the features of the embodiments as appropriate are also included in the invention. As long as the gist is provided, it is included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 1, 1a Capacitance type sensor 2 Base material 2a Surface 3 Panel 3a Operation surface 3b Back surface 3c, 3d, 3e, 3f Side surface 4 1st transparent electrode 5 2nd transparent electrode 6 Wiring part 7 Connection part 8 1st Electrode 9 Decoration layer 10 Bridge wiring 11 Detection area 12 Second electrode 16 Connection wiring 18 Shield wiring 20 Insulating layer 20a Surface 25 Decoration area 27 External connection portion 28 Conductive paste 29 Flexible printed circuit board 30 Optical transparent adhesive layer 200 Touch panel 210 Display panel 211 Drive substrate 212 Counter substrate 213 Liquid crystal layer 220 Touch sensor 230 Electronic component 300 Electronic device 310 Housing 311 Side surface 320 Display unit 330 Fixing member 340 Projection unit 400 Computer 401 Central processing unit 402 Main storage unit 403 Sub storage unit 404 Input Part 405 output part 406 Interface 410 Display 420 Keyboard 430 input pad

Claims (7)

A substrate having translucency,
A transparent electrode provided in a detection region on the substrate and having translucency;
A wiring portion provided in a region outside the detection region and electrically connected to the transparent electrode;
A transparent panel provided on the transparent electrode and the wiring portion;
A conductive shield wire provided on the side surface of the panel;
A capacitance type sensor characterized by comprising: Provided on the surface of the panel facing the wiring portion in the outer region, further comprising a decorative layer having a light shielding property,
The capacitance type sensor according to claim 1, wherein the wiring portion is formed of a material having metal. The wiring part is formed of a transparent conductive material,
The capacitive sensor according to claim 1, wherein the shield wiring is formed of a black material. A flexible printed circuit board electrically connected to the wiring portion;
The capacitive sensor according to claim 1, wherein the shield wiring is electrically connected to a portion of the flexible printed circuit board that is set to a ground potential. A display panel;
A touch sensor provided on the display panel;
With
The touch sensor is a capacitive sensor according to claim 1, wherein the touch sensor is a touch panel.   An electronic device comprising the touch sensor according to claim 5. A housing for fixing the touch sensor;
The electronic device according to claim 6, wherein the housing includes a protrusion that contacts the shield wiring and is electrically connected to the shield wiring.