JP2017045922A - Teaching method, jig, and substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the work of an operator for teaching, and to achieve more accurate teaching.SOLUTION: In a jig, arrangement of each part is adjusted so that the virtual axis after virtually reflecting the central axis, passing through the center of a spin base when holding a tabular member on a spin chuck and extending in the vertical direction, on the mirror surface of a mirror is aligned with the optical axis of an imaging section. Consequently, the physical relationship of a nozzle moved toward the central axis and the central axis is grasped accurately based on the imaging results. The jig is a member that can be held at a substrate holding section, and is attached to and detached from a substrate processing apparatus, by extremely simple work.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a teaching method, a jig, and a substrate processing apparatus.

  In a manufacturing process of a semiconductor device or a liquid crystal display device, there is a single-wafer type substrate processing apparatus that processes substrates one by one in order to perform processing with a processing liquid on the surface of a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display panel. Sometimes used.

  For example, the substrate processing apparatus described in Patent Document 1 is configured to discharge a processing liquid toward a main surface of a substrate held by the spin chuck and a spin chuck for rotating the substrate while maintaining the substrate in a substantially horizontal posture. And a nozzle moving section that moves the nozzle along a predetermined trajectory passing through the center of the substrate.

JP 2011-77245 A

  In the liquid processing, after the nozzle is moved above the substrate by the nozzle moving unit, the processing liquid may be discharged from a nozzle in a stopped state toward a predetermined position (for example, the rotation center) on the surface of the substrate. In this case, if the nozzle is displaced from the predetermined position, the processing liquid does not spread uniformly on the surface of the substrate, and processing unevenness (unevenness of processing liquid supply) may occur on the substrate.

  In the liquid processing, the processing liquid may be discharged from the nozzle toward the substrate while moving (scanning) the nozzle in a predetermined section on a predetermined movement locus. In this case, if the nozzle moves out of the section, it becomes difficult to perform a desired liquid treatment on the surface of the substrate.

  Therefore, after assembling the nozzle in the processing chamber in which the nozzle is accommodated, teaching work is performed on the control device that controls the operation of the nozzle. In teaching work, the displacement of the nozzle (or the member that holds the nozzle) from the machine origin position to a predetermined reference position on the trajectory and the instruction value given to the nozzle moving unit to move the nozzle to the reference position Are registered in the control device.

  Such teaching work is usually performed manually by the operator. As an example, at the time of teaching, an operator holds a predetermined jig substrate having a predetermined reference position on the upper surface by the substrate holding unit. Further, the operator gives an instruction value (for example, the number of pulses) to the nozzle moving unit (for example, the stepping motor) by inputting an instruction from the input unit, and the nozzle is gradually formed along the trajectory set above the substrate. Move. Then, the nozzle and the reference position are visually aligned with respect to the reference position described on the upper surface of the jig substrate. Then, an operation rule that associates the displacement amount (displacement amount from the origin position) when the nozzle matches the reference position with the instruction value given to the nozzle moving unit is registered in the control device.

  However, the visual teaching work as described above is a very troublesome and time-consuming work, and variations among operators are unavoidable and the accuracy is low.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a teaching method, a jig, and a substrate processing apparatus that can reduce the work burden on an operator for teaching and can realize more accurate teaching. It is.

  In the teaching method according to the first aspect of the present invention, the nozzle is moved from the tip portion of the nozzle while moving the nozzle based on an operation rule that associates the displacement amount of the nozzle with the instruction value of the control signal given to the nozzle moving portion. In a substrate processing apparatus for processing a substrate held horizontally above a base portion of a substrate holder by discharging a processing fluid, the teaching method for setting the operation rule is substantially the same size as the substrate. A plate-like member that can be held horizontally by the substrate holding portion, and a mirror provided at a central position of one main surface that is upper when held by the substrate holding portion among both main surfaces of the plate-like member; When the plate-like member is held on the substrate holding portion, the jig is provided on the one main surface of the plate-like member and has an imaging portion including the mirror surface of the mirror in the imaging range. Arrange each part of the jig so that the virtual axis after the central axis extending in the vertical direction through the center of the mirror part is virtually reflected by the mirror surface of the mirror coincides with the optical axis of the imaging part. A jig adjusting step for adjusting, a jig mounting step for holding the plate-like member by the substrate holding portion, and a displacement amount of the nozzle for making the tip of the nozzle face the central axis An input step for inputting information, a nozzle moving step for transmitting the control signal based on the input information input in the input step, and moving the nozzle along a horizontal direction by the nozzle moving portion, and the tip An imaging step of capturing an image by the imaging unit, and a setting step of setting the operation rule in the horizontal direction based on an imaging result acquired in the imaging step.

  A teaching method according to a second aspect of the present invention is the teaching method according to the first aspect of the present invention, wherein the tip portion extends along a vertical direction, and in the imaging step, the tip portion is The imaging unit picks up an image through the mirror surface.

  A teaching method according to a third aspect of the present invention is the teaching method according to the first aspect of the present invention, wherein the tip end portion extends obliquely downward, and in the imaging step, the tip end portion It is characterized in that at least a part of is directly imaged by the imaging unit.

  A teaching method according to a fourth aspect of the present invention is the teaching method according to any of the first to third aspects of the present invention, wherein the jig has a scale along the horizontal direction. The imaging unit directly images at least a part of the tip and the scale by the imaging unit, and the setting step obtains the imaging result obtained in the imaging step. Based on this, the operation rule for the vertical direction is also set.

  A teaching method according to a fifth aspect of the present invention is the teaching method according to any one of the first to fourth aspects of the present invention, wherein the jig adjusting step is performed in the jig mounting step. A cover attaching step of attaching a jig cover having a through hole at a position where the central axis passes to the one main surface of the jig, and after the cover attaching step, the position of the through hole is a center position of the imaging range. The image pickup unit position adjusting step for adjusting the position of the image pickup unit and a cover removing step for removing the jig cover from the jig are provided.

  A teaching method according to a sixth aspect of the present invention is the teaching method according to any one of the first to fifth aspects of the present invention, wherein, in each of the steps, the tip portion of the nozzle is another It is characterized by being non-contact with each part.

  A jig according to a seventh aspect of the present invention is a jig used in a substrate processing apparatus that includes a base-like base portion and includes a substrate holding portion that horizontally holds a substrate above the base portion. A plate-like member that is substantially the same size as the substrate and can be held horizontally by the substrate holding portion, and a central position of one main surface that is above when held by the substrate holding portion among the two main surfaces of the plate-like member And an imaging unit provided on the one main surface of the plate-like member and including the mirror surface of the mirror in the imaging range, and holding the plate-like member on the substrate holding unit. The virtual axis after virtually reflecting the central axis extending in the vertical direction through the center of the base portion by the mirror surface of the mirror coincides with the optical axis of the imaging unit. .

  A substrate processing apparatus according to an eighth aspect of the present invention receives a control signal from the jig according to the seventh aspect of the present invention, the substrate holding portion, a nozzle that discharges a processing fluid from the tip portion, and the control signal. A nozzle moving unit that moves the nozzle along the horizontal direction based on the control signal, an input unit that receives information related to the amount of displacement of the nozzle, and a control signal based on the input information to the input unit. An operation control unit that transmits and controls the operation of the nozzle moving unit and an operation rule that associates the displacement amount of the nozzle and the indicated value of the control signal based on the imaging result acquired by the jig. And a setting unit configured to set the horizontal direction.

  A substrate processing apparatus according to a ninth aspect of the present invention is the substrate processing apparatus according to the eighth aspect of the present invention, wherein the tip end portion extends along a vertical direction, and the substrate holding portion is the jig. In the state where the plate-like member of the tool is held, information related to the amount of displacement of the nozzle for making the tip end face the central axis is input to the input unit, and based on this input, the nozzle After the moving unit moves the nozzle along the horizontal direction, the imaging unit images the tip portion through the mirror surface.

  A substrate processing apparatus according to a tenth aspect of the present invention is the substrate processing apparatus according to the eighth aspect of the present invention, wherein the tip end portion extends obliquely downward, and the substrate holding portion is In the state where the plate-like member of the jig is held, information related to the amount of displacement of the nozzle for making the tip end face the central axis is input to the input unit. After the nozzle moving unit moves the nozzle along the horizontal direction, the imaging unit directly images at least a part of the tip.

  A substrate processing apparatus according to an eleventh aspect of the present invention is the substrate processing apparatus according to any one of the eighth to tenth aspects of the present invention, wherein the nozzle moving unit is arranged along the vertical direction. The nozzle can be moved, and the jig further includes a scale portion on which a scale along the horizontal direction is drawn, and the substrate holding portion holds the plate-like member of the jig. After the imaging unit directly images at least a part of the tip and the scale, the setting unit sets the operation rule also in the vertical direction based on the imaging result.

  A substrate processing apparatus according to a twelfth aspect of the present invention is the substrate processing apparatus according to any one of the eighth to eleventh aspects of the present invention, wherein the substrate holding unit holds the plate-like member. In this case, a through hole is provided at a position where the central axis passes, and a jig cover that can be attached to the one main surface of the jig is provided, and when the virtual axis coincides with the optical axis, The jig cover is attached to the one main surface of the jig, and the position of the imaging unit is adjusted so that the position of the through hole is the center position of the imaging range, and then the jig cover is attached to the jig. It is characterized by being removed from.

  A substrate processing apparatus according to a thirteenth aspect of the present invention is the substrate processing apparatus according to any one of the eighth to twelfth aspects of the present invention, wherein each step for setting the operation rule is The tip of the nozzle is not in contact with other parts.

  In the first to thirteenth aspects of the present invention, the jig is substantially the same size as the substrate and can be held horizontally by the substrate holding portion, and the substrate holding portion of both main surfaces of the plate member. And a mirror provided at the center position of the one main surface that is upper when held by the lens, and an imaging unit that is provided on the one main surface of the plate-like member and includes the mirror surface of the mirror in its imaging range. In this jig, when the plate-like member is held by the substrate holding part, the virtual axis after virtually reflecting the central axis extending in the vertical direction through the center of the base part by the mirror surface of the mirror is the imaging part. The arrangement of each part of the jig is adjusted so as to coincide with the optical axis.

  Thereby, since the center of the imaging range in the imaging unit coincides with the central axis, the positional relationship between the nozzle moved toward the central axis and the central axis is accurately grasped based on the imaging result. Thus, since the operation rule is set by data processing using the jig after the position adjustment, an error for each operator hardly occurs, and the teaching work can be performed with high accuracy.

  The jig is a member that can be held by the substrate holding unit, and can be attached to and detached from the substrate processing apparatus with an extremely simple operation. For this reason, in the aspect of this invention, compared with the aspect etc. in which an operator grasps | ascertains a nozzle position visually, a work burden may be small.

It is a schematic plan view which shows a substrate processing system typically. It is a figure which shows the structure of a substrate processing apparatus schematically. It is a perspective view of a jig. It is a side view of the substrate processing apparatus in the state where the jig was held by the spin chuck. It is a top view of a jig. It is a figure which shows the imaging range of a jig | tool. It is a perspective view of the jig | tool with which the jig | tool cover was attached. It is a figure which shows an example of the flow of teaching work. It is a top view of the substrate processing apparatus which represents typically the locus of the tip part of a nozzle. It is a figure which shows an example of the operation | movement rule about a horizontal direction. It is a figure which shows an example of the two operation | movement rules about a horizontal direction. It is a figure which shows an example of the flow of a scanning liquid process. It is a side view of the substrate processing apparatus in the state where the jig was held by the spin chuck. It is a top view of the substrate processing apparatus which represents typically the locus of the tip part of a nozzle. It is a figure which shows the imaging range of a jig | tool.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

<1 First Embodiment>
<1.1 Configuration of Substrate Processing System 100>
The configuration of the substrate processing system 100 will be described with reference to FIG. FIG. 1 is a schematic plan view schematically showing the substrate processing system 100.

  The substrate processing system 100 is a system that sequentially processes a plurality of substrates W one by one. In the following description, it is assumed that the substrate W to be processed in the substrate processing system 100 is, for example, a circular semiconductor wafer.

  The substrate processing system 100 includes a plurality of cells arranged in parallel (specifically, the indexer cell 110 and the processing cell 120), a control unit 20 that controls each operation mechanism provided in the plurality of cells 110 and 120, and the like. Is provided.

  The indexer cell 110 is a cell for delivering an unprocessed substrate W received from outside the apparatus to the process cell 120 and carrying out a processed substrate W received from the process cell 120 to the outside of the apparatus. The indexer cell 110 includes a carrier stage 111 on which a plurality of carriers C are placed, and a substrate transfer device (transfer robot) IR that loads and unloads the substrate W with respect to each carrier C.

  A carrier C containing an unprocessed substrate W is carried onto and placed on the carrier stage 111 by OHT (Overhead Hoist Transfer) or the like from the outside of the apparatus. Unprocessed substrates W are taken out from the carrier C one by one and processed in the apparatus, and the processed substrates W that have been processed in the apparatus are stored in the carrier C again. The carrier C containing the processed substrate W is carried out of the apparatus by OHT or the like. Thus, the carrier stage 111 functions as a substrate integration unit that integrates the unprocessed substrate W and the processed substrate W. The form of the carrier C may be a FOUP (Front Opening Unified Pod) for storing the substrate W in a sealed space, or a SMIF (Standard Mechanical Inter Face) pod or the stored substrate W is exposed to the outside air. It may be OC (Open Cassette).

  The transfer robot IR supports the substrate W from below, thereby holding the substrate W in a horizontal posture (a posture in which the main surface of the substrate W is horizontal), a hand driving mechanism 113 for driving the hand 112, Is provided. The transfer robot IR takes out the unprocessed substrate W from the carrier C placed on the carrier stage 111 and transfers the taken-out substrate W to the transfer robot CR described later at the substrate delivery position P. The transfer robot IR receives the processed substrate W from the transfer robot CR at the substrate delivery position P and stores the received substrate W in the carrier C placed on the carrier stage 111.

  The processing cell 120 is a cell for processing the substrate W. The processing cell 120 includes a plurality of substrate processing apparatuses 1 and a substrate transfer apparatus (transfer robot CR) that loads and unloads the substrate W with respect to the plurality of substrate processing apparatuses 1. Here, a plurality of (for example, three) substrate processing apparatuses 1 are stacked in the vertical direction to form one substrate processing apparatus group 130. A plurality (four in the illustrated example) of substrate processing apparatus groups 130 are installed in a cluster so as to surround the transfer robot CR.

  Each of the plurality of substrate processing apparatuses 1 includes a housing 140 that forms a processing space therein. The case 140 is formed with a carry-in / out port 15 for inserting the hand 121 of the transfer robot CR into the case, and the substrate processing apparatus 1 is provided in the space where the transfer robot CR is arranged. 15 are arranged so as to face each other. A specific configuration of the substrate processing apparatus 1 will be described later.

  The transport robot CR includes a hand 121 that holds the substrate W in a horizontal posture by supporting the substrate W from below, and a hand drive mechanism 122 that drives the hand 121. However, as described above, the transfer robot CR (specifically, the base of the transfer robot CR) is disposed in the center of the space surrounded by the plurality of substrate processing apparatus groups 130. The transfer robot CR takes out the processed substrate W from the designated substrate processing apparatus 1 and transfers the taken-out substrate W to the transfer robot IR at the substrate transfer position P. Further, the transfer robot CR receives an unprocessed substrate W from the transfer robot IR at the substrate transfer position P, and transfers the received substrate W to the designated substrate processing apparatus 1.

  The control unit 20 controls each of the transfer robot IR, the transfer robot CR, and the group of substrate processing apparatuses 1. The hardware configuration of the control unit 20 can be the same as that of a general computer. That is, the control unit 20 stores, for example, a CPU that performs various arithmetic processes, a ROM that is a read-only memory that stores basic programs, a RAM that is a readable and writable memory that stores various information, control software, data, and the like. It has a magnetic disk to keep. In the control unit 20, various functional units that control each unit of the substrate processing system 100 are realized by the CPU as the main control unit performing arithmetic processing according to the procedure described in the program. However, some or all of the functional units implemented in the control unit 20 may be implemented by hardware using a dedicated logic circuit or the like.

  The overall operation of the substrate processing system 100 will be described with continued reference to FIG. In the substrate processing system 100, the control unit 20 controls each unit included in the substrate processing system 100 in accordance with a recipe describing the transport procedure and processing conditions of the substrate W, thereby executing a series of operations described below. Is done.

  When the carrier C containing the unprocessed substrate W is placed on the carrier stage 111, the transfer robot IR takes out the unprocessed substrate W from the carrier C. Then, the transfer robot IR moves the hand 112 holding the unprocessed substrate W to the substrate delivery position P, and transfers the unprocessed substrate W to the transport robot CR at the substrate delivery position P. The transfer robot CR that has received the unprocessed substrate W on the hand 121 carries the unprocessed substrate W into the substrate processing apparatus 1 specified in the recipe. The transfer of the substrate W between the transfer robot IR and the transfer robot CR may be performed directly between the hands 112 and 121, or via a placement unit provided at the substrate transfer position P. It may be done.

  In the substrate processing apparatus 1 in which the substrate W is carried in, a predetermined process is performed on the substrate W. Details of the substrate processing apparatus 1 will be described later.

  When the processing on the substrate W is completed in the substrate processing apparatus 1, the transfer robot CR takes out the processed substrate W from the substrate processing apparatus 1. Then, the transfer robot CR moves the hand 121 holding the processed substrate W to the substrate delivery position P, and delivers the processed substrate W to the transfer robot IR at the substrate delivery position P. The transfer robot IR that has received the processed substrate W on the hand 112 stores the processed substrate W in the carrier C.

  In the substrate processing system 100, the transfer robot CR and the transfer robot IR repeatedly perform the transfer operation described above according to the recipe, and each substrate processing apparatus 1 executes a process on the substrate W according to the recipe. As a result, the processing for the substrate W is performed one after another.

<1.2 Configuration of Substrate Processing Apparatus 1>
FIG. 2 is a diagram schematically showing the configuration of the substrate processing apparatus 1. The substrate processing apparatus 1 is a branch-and-leaf type apparatus for performing processing with a processing liquid on the surface of a substrate (for example, a semiconductor wafer).

  In the processing chamber 1, the substrate processing apparatus 1 includes a spin chuck 2 that rotates while holding the substrate W substantially horizontally, and a nozzle 3 that discharges a processing liquid onto the upper surface of the substrate W held by the spin chuck 2. Prepare.

  The spin chuck 2 (substrate holding unit) is fixed to the upper end of the rotation shaft 5 rotated by the chuck rotation drive mechanism 4. The spin chuck 2 has a flat upper surface and a substantially disk-shaped spin base 6 (base-like base portion), and is provided at substantially equal intervals at a plurality of peripheral end portions of the upper surface of the spin base 6. A plurality of clamping members 7 for clamping in a horizontal posture are provided. When the rotation shaft 5 is rotated by the chuck rotation driving mechanism 4 while the substrate W is sandwiched by the plurality of sandwiching members 7, the substrate W is kept in a horizontal posture and the central axis CX of the rotation shaft 5 together with the spin base 6. Rotated around. That is, the central axis of the substrate W held and rotated by the spin base 6 coincides with the central axis CX of the spin base 6.

  In addition to the above-described configuration, for example, a vacuum chucking type (vacuum chuck) that can hold the substrate W in a horizontal posture by vacuum chucking the lower surface of the substrate W may be employed. .

  A supply pipe 8 to which a processing liquid is supplied from a processing liquid supply source is connected to the nozzle 3. A valve 9 for switching between discharge / stop of discharge of the processing liquid from the nozzle 3 is interposed in the middle of the supply pipe 8. The tip portion 31 of the nozzle 3 extends along the vertical direction, and the processing liquid supplied to the nozzle 3 is discharged from the tip portion 31 vertically downward.

  As the processing liquid, a liquid corresponding to the content of processing on the surface of the substrate W is used. For example, in the case of a cleaning process for removing particles from the surface of the substrate W, a cleaning liquid containing a chemical solution such as SC1 (ammonia-hydrogen peroxide mixture) is used. In the case of a cleaning process for etching an oxide film or the like from the surface of the substrate W, a cleaning liquid containing a chemical solution such as hydrofluoric acid or BHF (Buffered HF) is used. In addition, SPM (sulfuric acid / hydrogen peroxide mixture) or SC1 is used in the polymer removal process for removing the resist residue remaining as a polymer on the surface of the substrate W after the resist is removed. A polymer removing solution such as (ammonia-hydrogen peroxide mixture) is used. In addition, chemical treatments such as hydrofluoric acid, SC2 (hydrochloric acid / hydrogen peroxide mixture) and SPM (sulfuric acid / hydrogen peroxide mixture) are used for cleaning to remove metal contaminants. Is used.

  The nozzle 3 is attached to the tip of an arm 10 that extends substantially horizontally above the spin chuck 2. The lower surface of the base end of the arm 10 is fixed to the upper end of the support shaft 11. The support shaft 11 extends substantially vertically on the side of the spin chuck 2. A stepping motor 12 as an arm swing drive mechanism for swinging the arm 10 is coupled to the support shaft 11. A driver circuit 22 for driving the stepping motor 12 is connected to the stepping motor 12. Thus, the stepping motor 12 and the driver circuit 22 constitute a horizontal movement mechanism that moves the nozzle 3 along the horizontal direction. Further, the support shaft 11 is moved up and down by an elevating mechanism (not shown), and accordingly, the arm 10 and the nozzle 3 are also moved up and down. Hereinafter, the horizontal movement mechanism and the lifting mechanism that move the nozzle 3 are referred to as a nozzle movement unit.

  By inputting a rotational driving force from the stepping motor 12 to the support shaft 11 and rotating the support shaft 11 within a predetermined angle range, the arm 10 is swung over the substrate W held by the spin chuck 2. be able to. During this swinging process, the arm 10 moves the nozzle 3 to the home position 23 on the side of the spin chuck 2 (shown by a thin two-dot chain line in FIG. 2) and above the substrate W held by the spin chuck 2 (see FIG. 2 may be arranged as a solid line). As a result, the nozzle 3 is scanned (moved) on the discharge position of the processing liquid on the surface of the substrate W. By driving the stepping motor 12, the nozzle 3 moves along a locus 14 having an arc shape having a center on the support shaft 11.

  Each unit of the substrate processing apparatus 1 is electrically connected to the control unit 20. The control unit 20 includes a motor control unit 21 for controlling the stepping motor 12. The motor control unit 21 (operation control unit) transmits a pulse signal (control signal) corresponding to the displacement amount of the nozzle 3 to the driver circuit 22. The driver circuit 22 receives the pulse signal transmitted from the motor control unit 21 and applies an excitation signal corresponding to the pulse signal to the stepping motor 12.

  The motor control unit 21 registers an operation rule for the horizontal direction. Here, the operation rule is a rule in which the displacement amount of the nozzle 3 is associated with the instruction value of the control signal given to the nozzle moving unit. In the present embodiment, the operation rule in the horizontal direction is a rule in which the amount of displacement of the nozzle 3 in the horizontal direction and the instruction value (number of pulses) of the control signal given to the stepping motor 12 correspond to each other, and the operation in the vertical direction. The rule is a rule in which the amount of displacement of the nozzle 3 in the vertical direction is associated with an instruction value of a control signal given to a motor of a lifting mechanism (not shown). The operation rule may be expressed as a function of the displacement amount and the indicated value, or may be expressed as a table including at least one pair of correspondence relationship between the displacement amount and the indicated value. Such operation rule setting work is referred to as teaching work. In the present embodiment, a case will be described in which a linear function (the operation rule in the horizontal direction shown in FIG. 10) of the displacement amount and the instruction value is registered in the motor control unit 21 by the teaching work.

  Further, the substrate processing apparatus 1 includes an input unit 30 having a configuration including a mouse, a keyboard, a touch panel, and the like. For this reason, the operator of the apparatus can input information related to the displacement amount of the nozzle. The information can be broadly classified into pulse information that designates an instruction value (number of pulses) of the control signal or position information that designates a displacement amount (nozzle position) of the nozzle 3.

  When the input information to the input unit 30 is pulse information, the motor control unit 21 outputs a control signal corresponding to the number of pulses to the driver circuit 22 to rotate the stepping motor 12. Thereby, the horizontal movement operation | movement of the nozzle 3 according to input information is implement | achieved.

  On the other hand, when the input information to the input unit 30 is position information, first, the number of pulses that the motor control unit 21 should give to the driver circuit 22 based on the position information and the operation rule in the horizontal direction. Is calculated. Then, the motor control unit 21 outputs a control signal corresponding to the number of pulses to the driver circuit 22 to rotate the stepping motor 12. Thereby, the horizontal movement operation | movement of the nozzle 3 according to input information is implement | achieved. The case of the vertical movement operation of the nozzle 3 is the same as that of the horizontal movement operation.

  Further, the substrate processing apparatus 1 includes a jig 70 that can be attached to and detached from the spin base 6 in a state where the substrate W is not held. The jig 70 is a measuring instrument used in teaching work. FIG. 3 is a perspective view of the jig 70. FIG. 4 is a side view of the substrate processing apparatus 1 in a state where the jig 70 is held by the spin chuck 2. FIG. 5 is a top view of the jig 70. FIG. 6 is a diagram illustrating an imaging range of the jig 70 in a state where the jig 70 is held by the spin chuck 2.

  The jig 70 is substantially the same size as the substrate W and can be held horizontally by the spin chuck 2, and one of the upper surfaces of the two main surfaces of the plate member 71 when the jig 70 is held by the spin chuck 2. The mirror 72 provided at the center position of the main surface, the image pickup unit 73 provided on one main surface of the plate-like member 71 and including the mirror surface 720 of the mirror 72 in the image pickup range 730, and the image pickup unit 73 disposed in the vicinity of the image pickup unit 73 It has the illumination part 74 which illuminates the mirror 72 side from the part 73 side, and the fixing stand 75 for fixing the position and angle of the mirror 72.

  The plate-like member 71 is a substantially disk-shaped member having a circular through hole 710 at the center thereof and a plurality of recesses 711 and 712 to which the holding member 7 is fitted. In the following, on the outer periphery of the plate-like member 71, there are provided four recesses 711 that are recessed both above and below the plate-like member 71 and four recesses 712 that are recessed only in the lower part of the plate-like member 71. Will be described. In FIG. 3, four concave portions 711 and two concave portions 712 on the near side of the drawing are illustrated.

  As described above, the plate-like member 71 is provided with more recesses 711 and 712 (a total of eight in the present embodiment) than the number of the clamping members 7 in the substrate processing apparatus 1 (six in the present embodiment). As a result, the jig 70 can be held by the spin chucks of a plurality of types of substrate processing apparatuses in which the positions and the number of the clamping members are different. For example, the jig 70 includes two types of substrate processing apparatuses having two clamping members 7 (two types of substrate processing apparatuses in which each part in the apparatus is symmetrically arranged) and two types of substrates having four clamping members. It is configured to be held by a processing apparatus (two types of substrate processing apparatuses in which each part in the apparatus is symmetrically arranged) and a total of four types of substrate processing apparatuses by spin chucks.

  The mirror 72 is fixed to the plate-like member 71 via the fixing base 75 so that the mirror surface 720 is at an angle of 45 degrees with respect to the horizontal plane while the jig 70 is held by the spin chuck 2. Further, the fixed base 75 is a rectangular base, and a scale 750 along the horizontal direction is drawn on a portion (scale portion) where the mirror 72 is not attached on one surface of the fixed base 75 on the imaging unit 73 side. Yes.

  The imaging unit 73 is configured by, for example, a CCD camera or the like, and is installed so that the position of the imaging unit 73 can be adjusted on the plate-like member 71 with the imaging direction as the horizontal direction. By adjusting the position of the imaging unit 73, each part in the jig 70 is adjusted to a specific positional relationship. Here, the specific positional relationship means that when the plate-like member 71 is held by the spin chuck 2, the center axis CX extending in the vertical direction through the center of the spin base 6 is virtually reflected by the mirror surface 720 of the mirror 72. This is a positional relationship in which the virtual axis VX after this coincides with the optical axis of the imaging unit 73. If each part in the jig 70 is adjusted to a specific positional relationship, the center of the imaging range 730 coincides with the central axis CX, and therefore the positional relationship between the nozzle 3 moved toward the central axis CX and the central axis CX is the same. It is accurately grasped based on the imaging result. When making each part of the jig 70 have a specific positional relationship, only the position of the imaging unit 73 may be adjusted as in the present embodiment, and the position of each part in the jig 70 may be different from the present embodiment. May be adjusted respectively.

  Moreover, the illumination part 74 illuminates the mirror 72 side from the imaging part 73 side. For this reason, the imaging unit 73 performs imaging in a state where each illumination other than the illumination unit 74 in the substrate processing apparatus 1 is turned off and only the illumination unit 74 is turned on, so that a plurality of types of substrate processing apparatuses having different configurations can be obtained. Even if the jig 70 is used, an imaging result can be obtained under the same illumination environment.

  The substrate processing apparatus 1 also includes a jig cover 80 that can be attached to one main surface of the jig 70 (the main surface on which the imaging unit 73 and the like are provided). FIG. 7 is a perspective view of the jig 70 to which the jig cover 80 is attached.

  The jig cover 80 is a member having a shape in which two of the three Y-shaped ends are connected in an arc shape, and is an instrument used when adjusting each part of the jig 70 to a specific positional relationship. The jig cover 80 has a through-hole 81 extending in the vertical direction at the center in a horizontal view when attached to one main surface of the jig 70.

  Further, the edge of the jig cover 80 protrudes from the one main surface side. When attaching the jig cover 80 to the jig 70, first, the convex portion of the arc-shaped end edge of the jig cover 80 is pressed against the outer edge of the jig 70. Then, by operating a screw mechanism (not shown) provided in the remaining one end portion having no arc-shaped portion among the three Y-shaped end portions of the jig cover 80, the arc-shaped end portion is operated. It is assumed that not only the convex portion at the edge but also the convex portion at the one end is pressed against the outer edge of the jig 70. Thereby, the jig cover 80 is attached to one main surface of the jig 70. Further, the jig cover 80 is removed from the jig 70 by operating the screw mechanism (not shown) in a loosening direction.

  When the jig cover 80 is attached to one main surface of the jig 70, the through hole 81 is provided at a position through which the central axis CX passes when the plate-like member 71 is held by the spin chuck 2. For this reason, each part in the jig 70 is adjusted to a specific positional relationship by adjusting the position of the imaging unit 73 so that the position of the through hole 81 becomes the center position of the imaging range 730 in the attached state.

<1.3 Teaching work>
<1.3.1 Setting operation rules>
FIG. 8 is a diagram illustrating an example of a teaching work flow. FIG. 9 is a top view of the substrate processing apparatus 1 that schematically represents the locus 14 of the tip portion 31 of the nozzle 3. FIG. 10 is a diagram illustrating an example of an operation rule for the horizontal direction in the present embodiment.

  In the teaching work, first, each part in the jig 70 is adjusted to a specific positional relationship by the above-described method using the jig cover 80 (step ST1: jig adjusting step). Specifically, after the jig cover 80 is attached to one main surface of the jig 70 (cover attachment process), the position of the imaging unit 73 is adjusted so that the position of the through hole 81 becomes the center position of the imaging range 730. (Imaging part position adjustment process). Thereafter, the jig cover 80 is removed from the jig 70 (cover removal process).

  Then, the plate-like member 71 of the jig 70 adjusted to the specific positional relationship is held by the spin chuck 2, and the jig 70 is mounted on the substrate processing apparatus 1 (step ST2: jig mounting step).

  As shown in FIG. 9, the locus 14 of the tip portion 31 of the nozzle 3 is a locus that crosses the upper side of the spin base 6 in the horizontal direction. Hereinafter, an example of teaching work performed by moving the nozzle 3 from the position P0 to the vicinity of the position P1 along the locus 14 will be described. Here, the position P0 is the position of the tip 31 when the arm 10 is disposed at the origin position. The position P1 is a position that coincides with the central axis CX on the locus 14.

  Thereafter, the operator of the apparatus inputs pulse information (that is, the number of pulses in the stepping motor 12) to the input unit 30 (step ST3: input process). More specifically, the operator inputs predetermined pulse information (the number of pulses Xa shown in FIG. 10) for setting the tip portion 31 of the nozzle 3 toward the central axis CX. Here, the number of pulses is a value corresponding to the rotation amount of the motor based on the origin position of the arm 10 (the origin position on the machine).

  The motor control unit 21 outputs a control signal corresponding to the number of pulses to the driver circuit 22 based on the input information input in the input process. Thereby, the stepping motor 12 is rotated according to a predetermined number of pulses, and the nozzle 3 is moved. As a result, the tip 31 of the nozzle 3 is arranged near the position P1 (step ST4: nozzle moving step).

  After the nozzle moving step, the imaging unit 73 of the jig 70 images the tip 31 via the mirror surface 720 and directly images at least a part of the tip 31 and the scale 750. (Step ST5: Imaging step).

  In the imaging result shown in FIG. 6, the center position 311 of the image 310 of the tip 31 projected on the mirror surface 720 of the mirror 72 is shifted by a distance D1 on the left side of the drawing from the center position 731 of the imaging range 730 corresponding to the center axis CX. ing. Thereby, the position of the nozzle 3 in the horizontal direction is grasped.

  Further, in the imaging result shown in FIG. 6, the lower end position of the distal end portion 31 is shifted by a distance D2 in the upward direction of the drawing from the scale 750 provided on the fixed base 75. Thereby, the position of the nozzle 3 in the vertical direction is grasped.

  The control unit 20 sets operation rules for the horizontal direction and the vertical direction by performing arithmetic processing based on the imaging result acquired in the imaging process (step ST6: setting process).

  First, a procedure for setting an operation rule in the horizontal direction will be described. Since the positional relationship between the center position 731 of the imaging range 730 and the center position 311 of the image 310 is obtained from the imaging result, the displacement of the tip 31 along the trajectory 14 from the position P1 to the position P2 based on this imaging result. The amount can be calculated. Therefore, based on the amount of displacement (a constant value) of the tip 31 from the position P0 to the position P1 and the amount of displacement of the tip 31 from the position P1 to the position P2 calculated by measurement, the control unit 20 A displacement amount (displacement amount Fa shown in FIG. 10) of the distal end portion 31 from P0 to the position P2 can be calculated.

  The control unit 20 (setting unit) uses the pair of values of the number of pulses Xa input from the input unit 30 and the horizontal displacement Fa of the tip 31 displaced thereby to operate the horizontal rule ( FIG. 10) is set. When the operation rule is expressed by a linear function of the displacement amount and the indicated value, as shown in FIG. 10, 2 (number of pulses, displacement amount of nozzle) = (0, 0), (Xa, Fa). A linear function passing through the point is set as the operation rule r1.

  Further, the operation rule for the horizontal direction may be set by a procedure different from this procedure. For example, by performing the nozzle movement process and the imaging process in parallel, when the tip 31 is positioned immediately above the central axis CX (that is, the center position 311 of the image 310 matches the center position 731 of the imaging range 730). The number of pulses Xb and the displacement amount Fb of the nozzle 3 may be calculated. In this case, a linear function passing through two points (number of pulses, nozzle displacement) = (0, 0), (Xb, Fb) is set as the operation rule r1.

  Next, a procedure for setting an operation rule in the vertical direction will be described. Since the positional relationship between the lower end position of the tip 31 and the scale 750 provided on the fixed base 75 is obtained from the imaging result, from the height position of the scale 750 to the actual nozzle height position based on the imaging result. The vertical distance can be calculated. Therefore, the vertical distance (constant value) from the origin position of the nozzle 3 to the height position of the scale 750 in the lifting mechanism and the height position of the scale 750 calculated by measurement to the actual nozzle height position. Based on the vertical distance, the controller 20 can calculate the amount of displacement of the tip 31 from the origin position of the nozzle 3 to the actual height position of the nozzle 3 in the lifting mechanism.

  The control unit 20 (setting unit) operates in the vertical direction using a pair of values of the instruction value input to the lifting mechanism at this time and the vertical displacement amount of the tip portion 31 displaced thereby. Set. The operation rule for the vertical direction can be expressed by a linear function or the like, similar to the operation rule for the horizontal direction.

<1.3.2 Re-setting of operation rules>
Hereinafter, an example of teaching work in the case of resetting the operation rule for the horizontal direction will be described. In addition, although the description in the case of resetting the operation rule for the vertical direction is omitted, this case is the same as the case of resetting the operation rule for the horizontal direction.

  FIG. 11 shows the correspondence between the displacement amount of the nozzle and the indicated value (number of pulses) of the control signal in the two operation rules r1 and r2 in the horizontal direction.

  In the motor control unit 21, an operation rule r1 acquired by past teaching work is registered in advance as a reference operation rule. The operation rule r1 is expressed as a linear function passing through two points of (number of pulses, displacement amount of nozzle) = (0, 0), (Xb, Fb).

  Of course, it is not necessary to reset the operation rule for a period during which the operation rule r1 is valid. However, for some reason, there may occur a situation where the operation rule r1 is not effective (more specifically, a situation where the amount of displacement of the nozzle is not Fb although the number of input pulses is Xb). In this way, when the effectiveness of the operation rule registered in advance decreases, the teaching operation is performed again and the operation rule is reset.

  In this resetting, first, a jig adjusting process (step ST1) and a jig mounting process (step ST2) are performed. Thereafter, the pulse number Xb is input from the operator (step ST3: input step). The pulse number Xb is the pulse number associated with the displacement amount Fb (position P1) under the operation rule r1.

  Thereby, the stepping motor 12 is driven and the nozzle 3 is moved (step ST4: nozzle moving step). If the operation rule r1 is valid, the tip 31 should be displaced to the position P1 by step ST4. However, hereinafter, the case where the tip 31 is displaced to a position (position of the displacement amount Fc) different from the position P1 by step ST4 will be described.

  After the nozzle moving process, the imaging unit 73 of the jig 70 images the tip 31 through the mirror surface 720. (Step ST5: Imaging step). And the control part 20 sets the operation rule about a horizontal direction again by performing a calculation process based on the imaging result acquired at an imaging process (step ST6: setting process).

  The control unit 20 (setting unit) uses the pair of values of the number of pulses Xb input from the input unit 30 and the horizontal displacement amount Fc of the distal end portion 31 displaced thereby to operate the operation rule r2 in the horizontal direction. To reset. When the operation rule r2 is expressed by a linear function of the displacement amount and the indicated value, as shown in FIG. 11, (pulse number, nozzle displacement amount) = (0, 0), (Xb, Fc) A linear function passing through two points is reset as the operation rule r2.

  Also, the operation rule for the horizontal direction may be reset by a procedure different from this procedure. For example, by performing the nozzle movement process and the imaging process in parallel, when the tip 31 is positioned immediately above the central axis CX (that is, the center position 311 of the image 310 matches the center position 731 of the imaging range 730). The number of pulses Xc and the displacement amount Fb of the nozzle 3 may be calculated. In this case, a linear function passing through two points (number of pulses, nozzle displacement) = (0, 0), (Xc, Fb) is reset as the operation rule r2.

  By this teaching operation, the operation rule r2 is registered in the motor control unit 21, and thereafter, it becomes possible to generate the pulse signal by applying the operation rule r2 to the position information inputted by the motor control unit 21. For example, when the position P1 is designated as the position information for the motor control unit 21, the motor control unit 21 applies the position P1 to the operation rule r2, and sets the pulse number Xc different from the previous pulse number Xb. Calculate and give to the driver circuit 22.

<1.4 Liquid treatment>
FIG. 12 is a diagram illustrating an example of a scan liquid processing flow. In the following, the tip 31 of the nozzle 3 is moved back and forth between the position corresponding to the position immediately above the end of the substrate W and the position P1 corresponding to the position immediately above the central axis CX of the spin base 6, while A case where the processing liquid is discharged onto the substrate W that is held and rotated will be described as an example.

  First, an unprocessed substrate W is delivered to the spin chuck 2 by a transfer robot (not shown) in a state where the nozzle 3 is disposed at the home position 23 retracted from above the spin chuck 2 (step ST11).

  Then, the operator of the apparatus inputs various processing information to the input unit 30 (step ST12). The processing information includes information related to the rotation speed of the substrate W, information related to the supply amount of the processing liquid, information related to the displacement amount of the tip portion 31, information related to the processing time, and the like.

  In step ST12, as information related to the rotation speed of the substrate W, for example, constant rotation at a predetermined liquid processing rotation speed is input. Further, for example, a predetermined supply amount is input as the information related to the supply amount of the processing liquid. Further, as the information related to the displacement amount of the front end portion 31, for example, the position information corresponding to the position immediately above the end portion of the substrate W and the position P1 are input as the position information of the front end portion 31 to be scanned. The motor control unit 21 determines the number of pulses to be given to the driver circuit 22 based on the position information and the operation rule obtained by teaching work (specifically, the number of pulses corresponding to both positions described above). calculate. Then, the motor control unit 21 outputs a control signal corresponding to the number of pulses to the driver circuit 22.

  Thereby, the chuck rotation driving mechanism 4 is driven, and the substrate W held on the spin chuck 2 is rotated at a constant liquid processing rotation speed at a constant speed (step ST13). In addition, the motor control unit 21 drives the stepping motor 12 to swing the arm 10, and reciprocally scans the nozzle 3 above the substrate W that is in a rotating state (step ST14). Then, the control part 20 opens the valve | bulb 9, and discharges a process liquid from the front-end | tip part 31 of the nozzle 3 (step ST15). The processing liquid discharged vertically downward from the front end portion 31 lands on the upper surface of the substrate W, and then diffuses along the upper surface of the substrate W by the centrifugal force of rotation.

  In the present embodiment, the tip 31 is reciprocated between a position corresponding to the position immediately above the end of the substrate W and a position P1 corresponding to the position immediately above the central axis CX of the spin base 6. The landing position of the treated liquid on the upper surface of the substrate W also varies in the range from the peripheral end position to the central position. As a result, the processing with the processing liquid is performed over the entire upper surface of the rotating substrate W.

  When a predetermined time has elapsed from the start of the processing, the control unit 20 closes the valve 9 and stops the supply of the processing liquid to the nozzle 3 (step ST16). Further, the control unit 20 stops driving the chuck rotation driving mechanism 4 and stops the rotation of the substrate W held on the spin chuck 2 (step ST17). Thereafter, the control unit 20 stops driving the stepping motor 12 at the timing when the nozzle 3 is disposed at the home position retracted from above the spin chuck 2 (step ST18). Thereby, the substrate W that has been subjected to the liquid processing is carried out by a transfer robot (not shown) (step ST19).

<1.5 Effect>
In the jig adjustment step, the arrangement of each part in the jig 70 is adjusted to a specific positional relationship. Thereby, since the center of the imaging range 730 coincides with the central axis CX, the positional relationship between the nozzle 3 moved toward the central axis CX and the central axis CX is accurately grasped based on the imaging result. Further, in the jig adjusting step, a jig cover 80 which is a dedicated instrument for adjusting the arrangement of each part in the jig 70 to a specific positional relationship is used. As described above, since the operation rule is set using the data processing after the position adjustment using the dedicated instrument, an error for each operator hardly occurs and the teaching work can be performed with high accuracy.

  Since the imaging data is used in the teaching work, it is possible to save and utilize the imaging data in a plurality of teaching work (for example, to grasp the positional deviation tendency of the nozzle 3).

  The jig 70 is a member that can be held by the spin chuck 2 and can be attached to and detached from the substrate processing apparatus 1 by an extremely simple operation. For this reason, in the aspect of this embodiment, other aspects (an aspect in which an operator visually grasps the nozzle position, an aspect in which a member provided in the substrate processing apparatus 1 is removed during teaching, and after teaching is reattached to the original position. Work load is smaller than the above.

  Further, as described above, in the imaging step, the image 310 of the tip 31 reflected on the mirror surface 720, the scale 750 drawn on the fixed base 75, and the lower end of the tip 31 are picked up in the horizontal direction and the vertical. Operation rules can be set for both directions at once.

  In each step of the teaching work, the tip 31 of the nozzle 3 is not in contact with the other parts. For this reason, the aspect of this embodiment is different between the nozzle 3 and this member compared with the other aspect which performs the teaching operation | work by making the nozzle 3 contact another member (for example, the scale part on which the scale was drawn). Therefore, it is desirable that the risk of migration of particles of the processing liquid and the risk of damage due to collision between the nozzle 3 and the member are low.

  Moreover, since the front-end | tip part 31 extended in a perpendicular direction is imaged by the imaging part 73 which makes an imaging direction the horizontal direction, it can grasp | ascertain the position of the front-end | tip part 31 correctly by imaging.

<2 Second Embodiment>
FIG. 13 is a side view of the substrate processing apparatus 1 </ b> A in a state where the jig 70 is held by the spin chuck 2. FIG. 14 is a top view of the substrate processing apparatus 1 schematically representing the locus 14A of the tip portion 31A of the nozzle 3A. FIG. 15 is a diagram illustrating an imaging range of the jig 70 in a state where the jig 70 is held by the spin chuck 2. Hereinafter, the substrate processing apparatus 1A according to the second embodiment will be described. However, the same elements as those of the substrate processing apparatus 1 according to the first embodiment are denoted by the same reference numerals, and redundant description will be omitted.

  The difference between the substrate processing apparatus 1 of the first embodiment and the substrate processing apparatus 1A of the second embodiment is the direction of the nozzles in the substrate processing apparatus. Specifically, the tip 31 of the nozzle 3 of the substrate processing apparatus 1 is provided extending along the vertical direction, whereas the tip 31A of the nozzle 3A of the substrate processing apparatus 1A is inclined downward. It extends along. Hereinafter, the difference in teaching work due to this difference will be described.

  Also in the teaching work of the second embodiment, first, a jig adjusting step (step ST1) and a jig mounting step (step ST2) are performed. In the jig mounting step of the second embodiment, the optical axis of the imaging unit 73 is parallel to a straight line connecting the support shaft 11 that is the rotation axis of the nozzle 3 </ b> A and the central axis CX, and the imaging unit 73. Is held by the spin chuck 2 so that is positioned closer to the support shaft 11 than the fixed base 75 (FIG. 14).

  Thereafter, the operator of the apparatus inputs pulse information (that is, the number of pulses in the stepping motor 12) to the input unit 30 (step ST3: input process). More specifically, the operator inputs predetermined pulse information for making the tip portion 31A of the nozzle 3A face the central axis CX. Hereinafter, the position of the nozzle 3A in a state where the tip portion 31A is accurately directed to the central axis CX is referred to as a position P10.

  The motor control unit 21 outputs a control signal corresponding to the number of pulses to the driver circuit 22 based on the input information input in the input process. Thereby, the stepping motor 12 is rotated according to a predetermined number of pulses, and the nozzle 3A is moved. As a result, the tip portion 31A of the nozzle 3A is in a state of facing the vicinity of the central axis CX (step ST4: nozzle moving step). Hereinafter, the position of the nozzle 3A (the position of the nozzle 3A after the actual movement) in a state where the tip 31A faces the vicinity of the central axis CX is referred to as a position P20.

  After the nozzle moving process, the imaging unit 73 of the jig 70 directly images at least a part of the tip 31A and the scale 750. (Step ST5: Imaging step).

  As described above, in the second embodiment, the optical axis of the imaging unit 73 is parallel to a straight line connecting the support shaft 11 that is the rotation shaft of the nozzle 3A and the central axis CX. For this reason, if the nozzle 3A is located at the position P10, the virtual line LA obtained by virtually extending the axis of the tip 31A of the nozzle 3A passes through the center position 731 of the imaging range 730A corresponding to the center axis CX. However, in the imaging result shown in FIG. 15, the virtual line LA is shifted to the left side of the center position 731 in the figure, and the horizontal position of the nozzle 3A (the actual position P20 of the nozzle 3A) is grasped based on this shift amount. The The virtual line LA is calculated from the outer shape of the nozzle 3A imaged in the imaging process.

  Further, in the imaging result shown in FIG. 15, the lower end position of the distal end portion 31 </ b> A is shifted by a distance D <b> 3 in the upward direction of the drawing from the scale 750 provided on the fixed base 75. Thereby, the position of the nozzle 3A in the vertical direction is grasped.

  The control unit 20 sets operation rules for the horizontal direction and the vertical direction by performing arithmetic processing based on the imaging result acquired in the imaging process (step ST6: setting process).

  First, a procedure for setting an operation rule in the horizontal direction will be described. Since the positional relationship between the center position 731 of the imaging range 730A and the virtual line LA is obtained from the imaging result, the displacement amount of the tip 31A along the locus 14A from the position P10 to the position P20 is calculated based on the imaging result. can do. Therefore, based on the displacement amount (constant value) of the tip portion 31A from the position P0 to the position P10 and the displacement amount of the tip portion 31A from the position P10 to the position P20 calculated by measurement, the control unit 20 determines the position. The amount of displacement of the tip 31A from P0 to position P20 can be calculated.

  The control unit 20 (setting unit) sets an operation rule in the horizontal direction using a pair of values of the number of pulses input from the input unit 30 and the amount of displacement of the tip 31A from the position P0 to the position P20. . Further, the operation rule for the horizontal direction may be set by a procedure different from this procedure. For example, the number of pulses and the displacement amount of the nozzle 3 </ b> A when the tip portion 31 </ b> A reaches the position P <b> 10 facing the central axis CX may be obtained by executing the nozzle movement process and the imaging process in parallel.

  Since the procedure for setting the operation rule in the vertical direction and the procedure for resetting the operation rule are easy to understand with reference to the above-described contents, the duplicate description is omitted.

  In the teaching work of the second embodiment, in the jig mounting step, the optical axis of the imaging unit 73 is parallel to the straight line connecting the support axis 11 that is the rotation axis of the nozzle 3A and the central axis CX. It is easy to grasp the position of the nozzle 3A. Even if the optical axis of the imaging unit 73 is not parallel to the straight line connecting the support axis 11 that is the rotation axis of the nozzle 3A and the central axis CX in the jig mounting step, the arrangement of the imaging unit 73 is not limited. It is possible to grasp the position of the nozzle 3A by performing calculation based on the imaging result in consideration.

  Further, in the aspect of the first embodiment in which the image 310 of the tip 31 is reflected on the mirror surface 720 of the mirror 72, the teaching work of the nozzle 3 in the horizontal direction even if the tip 31 is not directly included in the imaging range 730. Can be executed. On the other hand, in the aspect of the second embodiment in which the image of the tip portion 31A is not reflected on the mirror surface 720 of the mirror 72, it is assumed that the tip portion 31A is directly included in the imaging range 730A. Become.

  Also in the second embodiment, the same effects as in the first embodiment can be obtained with respect to the same configuration as in the first embodiment. That is, also in the second embodiment, the teaching work can be performed with high accuracy by using the jig 70 and the jig cover 80. In each step of the teaching work, the tip 31A of the nozzle 3A is different from the other parts. Advantages such as being advantageous in terms of contact are obtained.

<3 Modification>
While the embodiments of the present invention have been described above, the present invention can be modified in various ways other than those described above without departing from the spirit of the present invention.

  In the above-described embodiment, the case where the operation rule is expressed by a linear function has been described. However, the operation rule is not limited to this. May be represented by a table including at least one pair of correspondence relationships.

  In the above-described embodiment, the nozzle is described as an example in which the nozzle is reciprocally scanned between the position corresponding to the position immediately above the end of the substrate W and the position P1 corresponding to the position immediately above the central axis CX of the spin base 6. However, it is not limited to this. As another example, the nozzle may be scanned back and forth in another section. As another example, the nozzle is moved to a predetermined position above the substrate W, and the processing liquid is supplied from the nozzle fixed at the predetermined position toward the substrate W (an aspect in which the nozzle is not scanned during processing). It does not matter.

  Moreover, although the said embodiment demonstrated the aspect which performs teaching operation | work only using the imaging result by the imaging part 73 of the jig | tool 70, it is not restricted to this. The substrate processing apparatus includes, in addition to the imaging unit 73, another imaging unit for grasping the position of the tip of the nozzle. Teaching is performed using the imaging result by the imaging unit 73 and the imaging result by the other imaging unit. It does not matter even if it performs.

  Moreover, although the said embodiment demonstrated the aspect which teaches simultaneously about a horizontal direction and a vertical direction, you may perform a teaching work only about a horizontal direction, for example.

  Moreover, although the said embodiment demonstrated the aspect which grasps | ascertains the position of a front-end | tip part based on the shape of the front-end | tip part of the nozzle obtained by imaging, it is not restricted to this. For example, a positioning mark may be provided at the tip of the nozzle, and the position of the tip may be grasped based on the position of the mark obtained by imaging.

  In the above-described embodiment, the stepping motor 12 has been described as an example of the nozzle moving unit, but other types of motors (for example, a servo motor) may be employed.

  In addition to the mode of discharging the processing liquid from the nozzle, various modes of discharging the processing fluid from the nozzle, such as a mode of discharging the processing gas from the nozzle, a mode of discharging a mixed fluid of the processing liquid and the processing gas from the nozzle, etc. Can be adopted.

  Further, the number of nozzles provided in the substrate processing apparatus is not limited to one, and a plurality of nozzles may be provided. The number of discharge ports provided at the tip of the nozzle is not limited to one, and a plurality of discharge ports may be provided.

  The teaching method, jig, and substrate processing apparatus according to the embodiment and the modifications thereof have been described above, but these are examples of the preferred embodiment of the present invention, and limit the scope of implementation of the present invention. It is not a thing. Within the scope of the invention, the present invention can be freely combined with each embodiment, modified with any component in each embodiment, or omitted with any component in each embodiment.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Spin chuck 3, 3A Nozzle 12 Stepping motor 20 Control part 21 Motor control part 31, 31A Tip part 70 Jig 71 Plate-like member 72 Mirror 73 Imaging part 74 Illumination part 75 Fixing stand 80 Jig cover 81 Through-hole 720 mirror surface 730 imaging range 750 scale r1, r2 operation rule W substrate

Claims (13)

The base portion of the substrate holding portion is configured to discharge the processing fluid from the tip portion of the nozzle while moving the nozzle based on an operation rule that associates the displacement amount of the nozzle with the instruction value of the control signal given to the nozzle moving portion. In a substrate processing apparatus for processing a substrate held horizontally above a teaching method for setting the operation rule,
A plate-like member that is substantially the same size as the substrate and can be held horizontally by the substrate holding portion, and the center of one main surface that is above when held by the substrate holding portion of both main surfaces of the plate-like member A jig having a mirror provided at a position and an imaging unit provided on the one main surface of the plate-like member and including the mirror surface of the mirror in an imaging range thereof, the plate-like member as the substrate holding unit If the center axis extending in the vertical direction through the center of the base portion when being held is virtually reflected by the mirror surface of the mirror, the virtual axis coincides with the optical axis of the imaging unit. A jig adjustment step for adjusting the arrangement of each part of the tool,
A jig mounting step for holding the plate-like member by the substrate holding portion;
An input step of inputting information relating to the displacement amount of the nozzle for making the tip of the nozzle face the central axis;
A nozzle moving step of transmitting the control signal based on the input information input in the input step and moving the nozzle along a horizontal direction by the nozzle moving unit;
An imaging step of imaging the tip by the imaging unit;
Based on the imaging result acquired in the imaging step, a setting step for setting the operation rule in the horizontal direction;
A teaching method comprising: The teaching method according to claim 1,
The tip extends along the vertical direction,
In the imaging step, the tip portion is imaged by the imaging unit through the mirror surface. The teaching method according to claim 1,
The tip extends along a diagonally downward direction,
In the imaging step, at least a part of the tip is directly imaged by the imaging unit. A teaching method according to any one of claims 1 to 3, wherein
The jig further has a scale portion on which a scale along the horizontal direction is drawn,
In the imaging step, the imaging unit directly images at least a part of the tip and the scale,
In the setting step, the operation rule in the vertical direction is also set based on the imaging result acquired in the imaging step. A teaching method according to any one of claims 1 to 4, wherein
The jig adjusting step
A cover attaching step of attaching a jig cover having a through hole at a position where the central axis passes in the jig attaching step to the one main surface of the jig;
After the cover attaching step, an imaging unit position adjusting step of adjusting the position of the imaging unit so that the position of the through hole becomes the center position of the imaging range;
A cover removing step of removing the jig cover from the jig;
A teaching method characterized by comprising: A teaching method according to any one of claims 1 to 5,
In each step, the tip portion of the nozzle is in non-contact with other portions. A jig used in a substrate processing apparatus having a base-like base portion and having a substrate holding portion for horizontally holding a substrate above the base portion,
A plate-like member that is substantially the same size as the substrate and can be held horizontally by the substrate holding portion;
A mirror provided at the center position of one main surface that is above when held by the substrate holding portion of both the main surfaces of the plate-like member;
An imaging unit that is provided on the one principal surface of the plate-like member and includes a mirror surface of the mirror in an imaging range thereof;
Have
When the plate-like member is held by the substrate holding part, the virtual axis after virtually reflecting the center axis extending through the center of the base part in the vertical direction by the mirror surface of the mirror is the imaging A jig that matches the optical axis of the part. A substrate processing apparatus,
A jig according to claim 7;
The substrate holder;
A nozzle that discharges the processing fluid from the tip;
A nozzle moving unit that receives a control signal and moves the nozzle along a horizontal direction based on the control signal;
An input unit for inputting information relating to the displacement amount of the nozzle;
An operation control unit that controls the operation of the nozzle moving unit by transmitting a control signal based on input information to the input unit;
Based on the imaging result acquired by the jig, a setting unit that sets an operation rule for the horizontal direction in correspondence with the displacement amount of the nozzle and the instruction value of the control signal;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 8, comprising:
The tip extends along the vertical direction,
In the state where the substrate holding part holds the plate-like member of the jig, information related to the displacement amount of the nozzle for setting the tip part to face the central axis is input to the input part, The substrate processing apparatus, wherein after the nozzle moving unit moves the nozzle along a horizontal direction based on the input, the imaging unit images the tip portion through the mirror surface. The substrate processing apparatus according to claim 8, comprising:
The tip extends along a diagonally downward direction,
In the state where the substrate holding part holds the plate-like member of the jig, information related to the displacement amount of the nozzle for setting the tip part to face the central axis is input to the input part, The substrate processing apparatus, wherein after the nozzle moving unit moves the nozzle along a horizontal direction based on the input, the imaging unit directly images at least a part of the tip. A substrate processing apparatus according to any one of claims 8 to 10,
The nozzle moving unit is capable of moving the nozzle along a vertical direction,
The jig further has a scale portion on which a scale along the horizontal direction is drawn,
After the imaging unit directly images at least a part of the tip and the scale while the substrate holding unit holds the plate-like member of the jig, the setting unit displays the imaging result. A substrate processing apparatus characterized in that the operation rule is also set in the vertical direction. A substrate processing apparatus according to any one of claims 8 to 11,
A jig cover that has a through hole at a position through which the central axis passes when the plate-like member is held by the substrate holder, and can be attached to the one main surface of the jig;
With
When matching the virtual axis and the optical axis,
The jig cover is attached to the one main surface of the jig, and the position of the imaging unit is adjusted so that the position of the through hole is the center position of the imaging range, and then the jig cover is attached to the jig. A substrate processing apparatus which is removed from the substrate. A substrate processing apparatus according to any one of claims 8 to 12,
In each step for setting the operation rule, the tip portion of the nozzle is in non-contact with other portions.

Images