JP2017045792A - Coil device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coil device in which cooling efficiency of a conductor can be enhanced.SOLUTION: A coil device 1 includes a coil part 2 including a conductor 10, and a holding member 20 for holding the conductor 10. The holding member 20 is provided with a cooling flow path 30 through which a cooling fluid flows. The holding member 20 has a first region A for holding the conductor 10, and a second region B on the outside of the first region A, and the cooling flow path 30 is provided in the second region B. The first region A is heated by the conductor 10, and the second region B is cooled by the cooling fluid. Consequently, temperature gradient occurs between the first region A and second region B. By this temperature gradient, heat of the conductor 10 is transmitted smoothly to the cooling fluid.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a coil device.

  The non-contact power feeding system includes a coil device for power transmission that is a part of a power transmission device, and a coil device for power reception that is a part of a power reception device, and magnetism between coils such as an electromagnetic induction method and a magnetic field resonance method. Contactless power supply is realized using coupling. In such a coil device, heat is generated by the internal resistance of the coil, and the temperature in the coil device rises. As a result, for example, the coating of the conducting wire is deteriorated and the electrical insulation is lowered.

  As a conventional coil device, a coil device that suppresses a temperature rise of a coil is known (see, for example, Patent Document 1). The coil device described in Patent Literature 1 includes a protective member as a casing for housing the coil. The protective member is provided with a flow path through which a liquid such as water flows in order to cool the heated coil.

JP 2012-228123 A

  In the coil device as described above, the heat generated in the coil (conductive wire) is transmitted to the fluid in the flow path of the protective member after passing through the air existing between the conductive wire and the protective member. That is, air exists in the heat transfer path generated from the conducting wire. For this reason, the cooling efficiency of the conducting wire has been reduced.

  An object of this invention is to provide the coil apparatus which can improve the cooling efficiency of conducting wire.

  A coil device according to an aspect of the present invention includes a coil portion including a conducting wire and a holding member that holds the conducting wire, and the holding member is provided with a cooling channel through which a cooling fluid flows.

  In this coil device, the holding member is provided with a cooling flow path through which a cooling fluid flows. Thereby, the heat generated in the conducting wire is directly transmitted to the cooling fluid in the cooling flow path via the holding member. Therefore, the cooling efficiency of the conducting wire can be improved.

  In some embodiments, the holding member includes a first region that holds the conducting wire and a second region outside the first region, and the cooling flow path is provided in the second region. In this case, the first region is heated by the conducting wire, and the second region is cooled by the cooling fluid. For this reason, a temperature gradient is generated between the first region and the second region. Due to this temperature gradient, the heat of the conductor is smoothly transferred to the cooling fluid. Thereby, the cooling efficiency of conducting wire can be improved reliably.

  In some embodiments, the cooling flow path is provided so as to surround the first region. In this case, the cooling fluid flows around the first region. For this reason, the heat of a conducting wire is transmitted so that it may spread toward the circumference | surroundings of a 1st area | region. Therefore, the cooling efficiency of the conducting wire can be further improved.

  In some embodiments, the holding member includes a first region that holds the conducting wire, and a second region outside the first region, and the cooling flow path extends from the center of the first region to the second region. It reaches. The central part of the first region tends to accumulate heat and tends to increase in temperature. For this reason, for example, by supplying the cooling fluid from the central portion side of the first region, it is possible to cool the central portion of the first region where the temperature is likely to rise while the cooling capacity of the cooling fluid is high. Therefore, the cooling efficiency of the conducting wire can be further improved. Note that the temperature of the outer peripheral portion of the first region is less likely to rise than the central portion of the first region. For this reason, even if it uses the cooling fluid after passing the center part of a 1st area | region, the outer peripheral part of a 1st area | region can fully be cooled.

  In some embodiments, the conducting wire is wound around the holding member and includes a plurality of extending portions adjacent to each other, and the cooling channel is provided between the extending portions of the conducting wire. In this case, since the distance (the length of the heat transfer path) between the conducting wire (extending portion) and the cooling flow path is shortened, the cooling efficiency of the conducting wire can be further improved.

  In some aspects, the conducting wire includes a plurality of extending portions extending in the holding member, and the cooling flow path is provided so as to surround the outer peripheral surface of the at least one extending portion. In this case, the cooling fluid flows around the conductor. For this reason, the heat of a conducting wire is transmitted toward the circumference of a conducting wire. Thereby, the cooling efficiency of conducting wire can be further improved.

  In some embodiments, the cooling channel is composed of a plurality of channel units having different channel diameters. In this case, in the region where the temperature of the holding member is likely to rise, the flow velocity of the cooling fluid can be increased and the cooling efficiency of the conducting wire can be improved by reducing the flow path diameter of the flow path portion. On the other hand, in the region where the temperature of the holding member is difficult to increase, by increasing the flow path diameter of the flow path portion, it is possible to reduce the pressure loss of the cooling flow path and to ensure smooth circulation of the cooling fluid.

  In some embodiments, the apparatus further includes a housing that houses the coil portion, and the cooling channel is in communication with the outside of the housing. In this case, since the cooling fluid is supplied from the outside of the housing, the cooling fluid adjusted to a desired temperature outside the housing can be supplied into the housing. Thereby, the cooling efficiency of conducting wire can be improved reliably.

  According to some aspects of the present invention, the cooling efficiency of the conducting wire can be improved.

1 is an overall configuration diagram of a coil device according to a first embodiment of the present invention. It is a top view of the coil apparatus of FIG. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. It is a top view of the coil apparatus which concerns on 2nd Embodiment of this invention. It is a top view of the coil apparatus which concerns on 3rd Embodiment of this invention. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 5. It is a top view of the coil apparatus which concerns on 4th Embodiment of this invention. It is sectional drawing along the VIII-VIII line of FIG. It is a top view of the coil apparatus which concerns on 5th Embodiment of this invention. FIG. 10 is a cross-sectional view taken along line XX in FIG. 9. It is a top view of the modification of the coil apparatus of FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant descriptions are omitted.
[First Embodiment]

  The coil device 1 according to the first embodiment will be described with reference to FIGS. The coil device 1 is applied to, for example, a non-contact power feeding system. The non-contact power supply system is a system for supplying power from the power transmission device to the power reception device. The power transmitting device and the power receiving device are spaced apart in the vertical direction. The power transmission device is installed in a parking lot or the like, and the power reception device is mounted on an electric vehicle EV. The non-contact power supply system is configured to supply electric power to an electric vehicle EV that has arrived at a parking lot or the like using a magnetic field resonance method or an electromagnetic induction method. The coil device 1 is applied as a coil device for power transmission that is a part of such a power transmission device and / or a coil device for power reception that is a part of the power reception device. Note that, in the coordinates in the drawing, the direction in which the coil device for power transmission and the coil device for power reception face each other during power feeding is defined as the vertical direction Z. A direction orthogonal to the vertical direction Z is defined as a direction X and a direction Y. The direction X and the direction Y are orthogonal to each other.

  As shown in FIG. 3, the coil device 1 includes a flat coil portion 2, a flat magnetic member 6 on which the coil portion 2 is placed, and a housing 7 that houses the coil portion 2 and the magnetic member 6. It is equipped with. The coil unit 2 includes a conducting wire 10 and a holding member 20 that holds the conducting wire 10. The magnetic member 6 directs and aggregates the lines of magnetic force generated from the coil part 2. The magnetic member 6 is, for example, a magnetic body (such as a ferrite plate).

  The housing 7 has, for example, a flat rectangular parallelepiped shape, and includes a flat base 7 a and a cover 7 b that covers the coil portion 2. The coil unit 2 is placed on the base 7a via the magnetic member 6. The base 7a ensures the strength of the coil device 1 and suppresses the magnetic flux caused by the coil portion 2 from leaking to the back side of the base 7a (the side opposite to the cover 7b side). The base 7a is made of, for example, a nonmagnetic and conductive material (copper, aluminum, etc.). The cover 7b has an opening on the base 7a side, and faces the surface of the coil portion 2 (the surface on the cover 7b side). The cover 7b is made of, for example, a nonmagnetic and insulating material (polyphenylene sulfide resin or the like). An accommodation space for the coil portion 2 and the magnetic member 6 is formed by combining the peripheral portion of the base 7a and the peripheral portion of the opening of the cover 7b.

  As shown in FIG. 1, the coil device 1 further includes a heat exchanger 8, a supply pipe 3 and a discharge pipe 4 connected to the heat exchanger 8, and a pump 5. The heat exchanger 8 adjusts the cooling fluid flowing through the interior to a desired temperature. For example, insulating oil is used as the cooling fluid. The cooling fluid is not limited to this and may be a fluid having heat transfer properties. The cooling fluid may be water, for example. The heat exchanger 8 is disposed outside the housing 7. One ends of the supply pipe 3 and the discharge pipe 4 are connected in the heat exchanger 8. The other ends of the supply pipe 3 and the discharge pipe 4 respectively penetrate the cover 7b. The supply pipe 3 and the discharge pipe 4 and the cooling flow path 30 provided in the holding member 20 constitute a circulation flow path for circulating the cooling fluid. The pump 5 is provided in any one of the circulation channels. The pump 5 is provided in the discharge pipe 4, for example. When the pump 5 is driven, the cooling fluid circulates through the circulation channel.

  Next, the conductive wire 10 and the holding member 20 included in the coil unit 2 will be described in detail.

  As shown in FIG. 2, the conducting wire 10 is wound in a plane spiral shape on the surface side of the holding member 20. In FIG. 2, the cover 7b is not shown. The conducting wire 10 is wound in a substantially rectangular shape. The coil part 2 is a circular coil part. In the circular coil portion 2, the conductive wire 10 can be wound in various shapes such as a rectangle, a circle, and an ellipse when viewed from the winding axis direction (vertical direction Z). As the conducting wire 10, for example, a single wire of copper or aluminum, a litz wire, a bus bar or the like is used.

  The conducting wire 10 is preferably a litz wire. In particular, in a non-contact power supply system, a high-frequency (for example, kHz order or more) current may flow through the coil device 1 in order to extend the power transmission distance, improve transmission efficiency, or the like. In general, the higher the frequency of the current flowing through the conducting wire 10, the greater the skin effect produced by the conducting wire 10. As the skin effect increases, the resistance at the conductor 10 increases and heat loss increases. The increase in heat loss leads to a decrease in the power efficiency of the entire non-contact power feeding system (for example, the ratio of the battery input on the power reception device side to the power output on the power transmission device side). In order to suppress the skin effect, litz wire is used. A litz wire is formed by twisting a plurality of conductor wires insulated from each other.

  The arrangement of the conductive wire 10 in the coil part 2 will be described in more detail. The conducting wire 10 includes a plurality of first extending portions 11, a plurality of second extending portions 12, a plurality of third extending portions 13, a plurality of fourth extending portions 14, and a first lead portion 15. , The second lead portion 16. The 1st extension part 11, the 2nd extension part 12, the 3rd extension part 13, and the 4th extension part 14 have made the shape of a straight line, for example. It is composed. The first extension portion 11 and the third extension portion 13 extend along the direction Y. The second extending portion 12 and the fourth extending portion 14 extend along the direction X. Between the first extension part 11 and the second extension part 12, between the second extension part 12 and the third extension part 13, and between the third extension part 13 and the fourth extension part 14. Between the fourth extending portion 14 and the first extending portion 11, bent portions that are curved at substantially right angles are provided. The plurality of first extending portions 11 are parallel to each other and have a predetermined interval. The plurality of second extending portions 12 are parallel to each other and have a predetermined interval. The plurality of third extending portions 13 are parallel to each other and have a predetermined interval. The plurality of fourth extending portions 14 are parallel to each other and have a predetermined interval.

  The first lead portion 15 is drawn from the tip end of the first extension portion 11 located on the innermost side of the conducting wire 10 to the back surface (surface on the base 7 a side) side of the holding member 20. The first lead portion 15 extends substantially parallel to the extending direction of the first extending portion 11 and is drawn to the outside of the holding member 20. The 2nd drawer part 16 is pulled out from the tip of the 3rd extension part 13 located in the outermost side. The second drawing portion 16 extends substantially parallel to the extending direction of the third extending portion 13 and is drawn to the outside of the holding member 20. The 1st drawer | drawing-out part 15 and the 2nd drawer | drawing-out part 16 are pulled out in the same direction, for example to the side in which the 4th extension part 14 is located.

  The holding member 20 has, for example, a rectangular flat plate shape. The holding member 20 includes a first region A that holds the conducting wire 10 and a second region B outside the first region A. The conducting wire 10 is wound around the first region A, and the conducting wire 10 is not wound around the second region B. The first area A is located at the center of the holding member 20, and the second area B is located so as to surround the first area A. Note that the center of the first region A may not exactly coincide with the center of the holding member 20. The center of the first region A may be shifted from the center of the holding member 20.

  More specifically, the holding member 20 includes an upper member 21 and a lower member 22, as shown in FIG. The upper member 21 and the lower member 22 are a pair of rectangular flat plate members having the same size. The upper member 21 and the lower member 22 have a two-layer structure. The holding member 20 is configured by the back surface of the upper member 21 and the surface of the lower member 22 facing each other and coming into contact with each other. The surface of the upper member 21 is the surface of the holding member 20, and the back surface of the lower member 22 is the back surface of the holding member 20. The upper member 21 and the lower member 22 are made of, for example, a nonmagnetic and insulating material (polyphenylene sulfide resin or the like). The first region A of the holding member 20 is configured by the central portion of the upper member 21 and the lower member 22, and the second region B of the holding member 20 is configured by the outer peripheral portions of the upper member 21 and the lower member 22. Yes.

  The upper member 21 is provided with a groove portion 21 a for accommodating the conducting wire 10. The groove portion 21 a is open to the surface side of the holding member 20. The cross-sectional shape perpendicular to the extending direction of the groove 21a is, for example, a substantially rectangular shape with one side open. The cross-sectional shape of the groove 21a is not limited to this, and may be a substantially U-shape or the like. Either the side surface or the bottom surface of the groove 21 a is in contact with the housed conductor 10.

  The holding member 20 is provided with a cooling flow path 30 through which a cooling fluid flows. As shown in FIG. 2, the cooling flow path 30 is a single flow path, and is provided in the second area B so as to surround the first area A. The shape of the cross section perpendicular to the extending direction of the cooling flow path 30 is, for example, a substantially rectangular shape. The cross-sectional shape of the cooling flow path 30 is not limited to this, and may be substantially U-shaped.

  The cooling flow path 30 includes an inflow portion 31 and an outflow portion 37 provided on the first extending portion 11 side, a first straight portion 32 and a second straight portion that continuously extend so as to surround the first region A. 33, a third straight portion 34, a fourth straight portion 35, and a fifth straight portion 36. The first straight portion 32, the second straight portion 33, the third straight portion 34, the fourth straight portion 35, and the fifth straight portion 36 are sequentially continuous between the inflow portion 31 and the outflow portion 37. As a rectangular shape.

  The first straight portion 32 and the fifth straight portion 36 extend along the first extending portion 11 located on the outermost side. The second straight portion 33 extends along the second extending portion 12 located on the outermost side. The third linear portion 34 extends along the third extending portion 13 located on the outermost side. The fourth linear portion 35 extends along the fourth extending portion 14 located on the outermost side. The inflow portion 31, the outflow portion 37, and the connecting portions (that is, the bent portions) of the straight portions 32, 33, 34, 35, and 36 have a curved shape in order to reduce the flow resistance of the cooling fluid. The inflow portion 31 communicates with one end of the supply pipe 3 located in the housing 7. The outflow portion 37 communicates with one end of the discharge pipe 4 located in the housing 7.

  The cooling flow path 30 is formed by a groove portion provided in the lower member 22 and a back surface portion of the upper member 21 that closes an open portion on the front surface side of the groove portion. The cooling channel 30 is built in the holding member 20. Between the upper member 21 and the lower member 22, sealing members (not shown) such as packing and O-rings are provided along the cooling flow path 30 so that the cooling fluid does not leak from the holding member 20. As described above, the cooling flow path 30 is provided in the lower member 22, while the conducting wire 10 is provided in the upper member 21. Therefore, the positions of the conducting wire 10 and the cooling channel 30 in the winding axis direction of the conducting wire 10 are different from each other.

  In the coil device 1 configured as described above, the cooling fluid circulates between the supply pipe 3 and the discharge pipe 4 and the cooling flow path 30 provided in the holding member 20. Specifically, the cooling fluid that has flowed out of the heat exchanger 8 first flows through the supply pipe 3, followed by the inflow portion 31, the straight portions 32, 33, 34, 35, 36, and the outflow portion 37. It flows in order. The cooling fluid flowing out from the cooling flow path 30 returns to the heat exchanger 8 through the discharge pipe 4. At this time, the heat generated in the conductive wire 10 is transmitted to the holding member 20 via at least one of the side surface and the bottom surface of the groove 21a. The heat transmitted to the holding member 20 is transmitted to the cooling fluid flowing in the cooling flow path 30. The cooling fluid whose temperature has risen due to the transfer of heat from the conductor 10 is cooled again by the heat exchanger 8.

  As described above, in the coil device 1, the holding member 20 is provided with the cooling flow path 30 through which the cooling fluid flows. Thereby, the heat generated in the conductive wire 10 is directly transmitted to the cooling fluid in the cooling flow path 30 via the holding member 20. In particular, in the coil device 1, either the side surface or the bottom surface of the groove portion 21 a is in contact with the conductive wire 10. For this reason, air does not intervene in the transmission path of the heat generated in the conducting wire 10. Further, even when air is interposed in the heat transfer path, the ratio of air in the transfer path is small. Therefore, the cooling efficiency of the conducting wire 10 can be improved.

  The holding member 20 has a first region A that holds the conducting wire 10 and a second region B outside the first region A, and the cooling flow path 30 is provided in the second region B. . The first region A is heated by the conducting wire 10 and the second region B is cooled by the cooling fluid. For this reason, a temperature gradient is generated between the first region A and the second region B. Due to this temperature gradient, the heat of the conducting wire 10 is smoothly transferred to the cooling fluid. Thereby, the cooling efficiency of the conducting wire 10 can be improved reliably.

  The cooling flow path 30 is provided so as to surround the first region A. Thereby, the cooling fluid flows around the first region A. For this reason, the heat of the conducting wire 10 is transmitted so as to spread toward the periphery of the first region A. Therefore, the cooling efficiency of the conducting wire 10 can be further improved.

  The cooling flow path 30 communicates with the outside of the housing 7. Thereby, since the cooling fluid is supplied from the outside of the housing 7, the cooling fluid adjusted to a desired temperature outside the housing 7 can be supplied into the housing 7. Therefore, the cooling efficiency of the conducting wire 10 can be improved reliably.

  In addition, the cooling flow path 30 is provided in the second region B. Thereby, the conducting wire 10 can be densely wound in the first region A. As a result, the inductance can be increased and desired power transmission performance can be realized.

  Further, when the cooling channel 30 is provided in the second region B, the second region B does not hold the conducting wire 10, and thus the conducting wire 10 and the cooling channel 30 do not interfere with each other. Therefore, the cooling flow path 30 can be provided not on the lower member 22 but on the upper member 21. For example, a groove portion that opens the back surface of the upper member 21 may be provided in the upper member 21, and the open portion of the upper member 21 may be closed by the surface of the lower member 22. In this case, since the cooling channel 30 is not provided in the lower member 22, the thickness of the lower member 22 can be reduced. Therefore, the conducting wire 10 held by the holding member 20 and the magnetic member 6 can be brought close to each other. Thus, when the conducting wire 10 and the cooling channel 30 are provided at the same position in the vertical direction Z (the cooling channel 30 is provided between the conducting wire 10 and the magnetic member 6 in the vertical direction Z). If not), the lead wire 10 and the magnetic member 6 can be brought close to each other. Thereby, inductance can be enlarged and desired power transmission performance can be realized.

The cooling flow path 30 is built in the holding member 20 and does not protrude toward the cover 7b. That is, the cooling flow path 30 is not provided between the cover 7 b and the conducting wire 10 in the vertical direction Z. If the cooling flow path 30 is provided between the cover 7b and the conducting wire 10, it is necessary to separate the cover 7b and the conducting wire 10 as much as the cooling flow path 30 protrudes toward the cover 7b. That is, it is necessary to expand the accommodation space between the base 7a and the cover 7b, and the thickness of the cover 7b in the vertical direction Z increases. In this case, the coil device on the power transmission side is obstructed by pedestrians, and the coil device on the power reception side is likely to hit the curb and obstacles on the road. Since the cooling flow path 30 does not protrude toward the cover 7b, the thickness of the cover 7b can be reduced, and traffic obstruction and contact with obstacles can be suppressed. Moreover, when setting the space | interval of the coil apparatus for power transmission and the coil apparatus for power reception to a desired value, the distance of the covers of these coil apparatuses may be measured as a distance between coil apparatuses. In this case, if the cover 7b and the conductor 10 are separated from each other, the conductor 10 of the coil device on the power transmission side is separated from the conductor 10 of the coil device on the power receiving side, and the coupling coefficient between the coil devices is reduced. Therefore, power efficiency is reduced. Since the cooling flow path 30 does not protrude toward the cover 7b, a decrease in power efficiency can be suppressed.
[Second Embodiment]

  A coil device 1A according to the second embodiment will be described with reference to FIG. In FIG. 4, the cover 7b is not shown. The cooling flow path 30 of the first embodiment is provided in the second region B so as to surround the first region A. In the present embodiment, the coil device 1 includes two cooling channels 40. In the second region B, the cooling flow path 40 is provided on each of the first extending portion 11 side and the third extending portion 13 side. In this respect, the coil device 1 </ b> A is different from the coil device 1.

  The cooling channel 40 is a substantially U-shaped channel. Specifically, the cooling flow path 40 on the first extending portion 11 side includes the straight portion 42 extending along the outermost first extending portion 11, and the holding member 20 from one end of the straight portion 42. An inflow portion 41 extending toward the edge portion on the first extending portion 11 side and an outflow portion extending from the other end of the linear portion 42 toward the edge portion on the first extending portion 11 side of the holding member 20. Part 43. The cooling channel 40 on the third extending portion 13 side includes a straight portion 42 extending along the third extending portion 13 located on the outermost side, and a third extension of the holding member 20 from one end of the straight portion 42. An inflow portion 41 extending toward the edge on the portion 13 side, and an outflow portion 43 extending from the other end of the linear portion 42 toward the edge on the third extension portion 13 side of the holding member 20. Contains. Each inflow portion 41 communicates with one end portion of the supply pipe 3, and each outflow portion 43 communicates with one end portion of the discharge pipe 4. Thereby, the cooling fluid that has flowed in from the inflow portion 41 flows out from the outflow portion 43 through the straight portion 42.

  Also in the present embodiment, the same effects as in the first embodiment can be obtained. That is, the heat generated in the conducting wire 10 is directly transmitted to the cooling fluid in the cooling flow path 40 via the holding member 20, and as a result, the cooling efficiency of the conducting wire 10 can be improved. Moreover, the cooling flow path 40 is provided in the 2nd area | region B similarly to 1st Embodiment. For this reason, a temperature gradient is generated between the first region A and the second region B. Due to this temperature gradient, the heat of the conducting wire 10 is smoothly transferred to the cooling fluid. Thereby, the cooling efficiency of the conducting wire 10 can be improved reliably.

In the present embodiment, the cooling flow path 40 is provided on each of the first extending portion 11 side and the third extending portion 13 side in the second region B. However, the present invention is not limited to this. For example, it may be provided at any position in the second region B.
[Third Embodiment]

  With reference to FIG.5 and FIG.6, the coil apparatus 1B which concerns on 3rd Embodiment is demonstrated. In FIG. 5, the cover 7b is not shown. The cooling flow path 30 of the first embodiment is located in the second area B so as to surround the first area A. However, the cooling flow path 50 of the present embodiment starts from the center of the first area A. It extends to reach the second region B. The central portion of the first region A is a region surrounded by the innermost extending portions 11, 12, 13, and 14, and the outer peripheral portion of the first region A is the region in the first region A It is an area other than the central part. Moreover, although the conducting wire 10 of 1st Embodiment was accommodated in the groove part 21a open | released by the surface side of the upper member 21, the conducting wire 10 of this embodiment is incorporated in the upper member 21 by insert molding, for example. , It is not exposed from the holding member 20. The coil device 1B is different from the coil device 1 in these points.

  The cooling channel 50 is a channel that communicates from the surface (upper surface) of the holding member 20 to the side surface through the inside. The cooling flow path 50 has a radiating portion 52 that spreads in a plane radial shape substantially parallel to the surface of the holding member 20 on the conducting wire 10 inside the holding member 20, and a frame shape that surrounds each tip of the radiating portion 52 inside the holding member 20 An outer peripheral portion 53, an inflow portion 51 extending from the central portion of the radiating portion 52 to the surface of the holding member 20, and an outflow portion 54 extending laterally from the outer peripheral portion 53 to the end surface of the holding member 20. . Each linear portion extending radially from the central portion of the radiating portion 52 extends from the central portion of the first region A to the second region B.

  More specifically, the inflow portion 51 is a through hole provided in the central portion of the upper member 21. The inflow portion 51 communicates with one end portion of the supply pipe 3. The radiating portion 52, the outer peripheral portion 53, and the outflow portion 54 are formed by a groove portion provided on the surface side of the lower member 22 and a back surface portion of the upper member 21 that closes an open portion on the surface side of the groove portion. Yes. The outflow portion 37 communicates with one end portion of the discharge pipe 4.

  Also in this embodiment, the effect of the first embodiment can be obtained. That is, the heat generated in the conducting wire 10 is directly transmitted to the cooling fluid in the cooling flow path 50 via the holding member 20, and as a result, the cooling efficiency of the conducting wire 10 can be improved.

  In addition, in the present embodiment, the cooling flow path 50 extends from the center of the first region A to the second region B. More specifically, each linear portion extending radially from the central portion of the radiating portion 52 extends from the central portion of the first region A to the second region B. The central portion of the first region A tends to accumulate heat and tends to increase in temperature. For this reason, by supplying the cooling fluid from the central portion side of the first region A, it is possible to cool the central portion of the first region A where the temperature easily rises while the cooling capacity of the cooling fluid is high. Therefore, the cooling efficiency of the conducting wire 10 can be further improved. Note that the temperature of the outer peripheral portion of the first region A is less likely to rise than the central portion of the first region A. For this reason, even if it uses the cooling fluid after passing the center part of 1st area | region A, the outer peripheral part of 1st area | region A can fully be cooled.

The flow direction of the cooling fluid may be appropriately changed according to the temperature distribution of the holding member 20. For example, when the temperature of the outer peripheral portion of the first region A is higher than that of the central portion of the first region A due to the winding method of the conducting wire 10 or the like, the cooling fluid is supplied from the outflow portion 54, The cooling fluid may be discharged from the inflow portion 51.
[Fourth Embodiment]

  A coil device 1 </ b> C according to the fourth embodiment will be described with reference to FIGS. 7 and 8. In FIG. 7, the cover 7b is not shown. The cooling flow path 30 of the first embodiment is located in the second area B so as to surround the first area A, but the cooling flow path 60 of the present embodiment is adjacent to the first extending portion 11. Between the adjacent second extending portions 12, between the adjacent third extending portions 13, and between the adjacent fourth extending portions 14. Moreover, although the conducting wire 10 of 1st Embodiment was accommodated in the groove part 21a open | released by the surface side of the upper member 21, the conducting wire 10 of this embodiment is the groove part opened by the back surface side of the upper member 21, and The groove portion opened to the surface side of the lower member 22 at a position facing the groove portion. For this reason, the conducting wire 10 is built in the holding member 20 and is not exposed from the holding member 20. The coil device 1 </ b> C is different from the coil device 1 in these points.

  The cooling channel 60 is provided in a plane spiral shape substantially parallel to the surface of the holding member 20 inside the holding member 20. The cooling channel 60 is wound, for example, in a substantially rectangular shape. More specifically, the cooling flow path 60 includes a plurality of first straight portions 61, a plurality of second straight portions 62, a plurality of third straight portions 63, a plurality of fourth straight portions 64, and an outflow portion. 65. The first straight part 61, the second straight part 62, the third straight part 63, and the fourth straight part 64 are, for example, linear, and constitute each circumference of the cooling flow path 60 by being sequentially continuous. doing. Between the first straight line portion 61 and the second straight line portion 62, between the second straight line portion 62 and the third straight line portion 63, and between the third straight line portion 63 and the fourth straight line portion 64, respectively, substantially perpendicular to each other. A bent portion is provided. The first straight portion 61 extends between the adjacent third extending portions 13, the second straight portion 62 extends between the adjacent second extending portions 12, and the third straight portion 63 is adjacent. The fourth extending portions 11 extend between the matching first extending portions 11, and the fourth linear portions 64 extend between the adjacent fourth extending portions 14.

  The first linear portion 61 located on the outermost side extends to, for example, the end surface of the holding member 20 on the fourth extending portion 14 side. The first straight part 61 communicates with one end of the supply pipe 3. The third linear portion 63 located on the innermost side communicates with the outflow portion 65. The outflow portion 65 extends to the center of the first region A inside the holding member 20. The outflow part 65 communicates with the discharge pipe 4 positioned below the base 7a through the hole 6a positioned at the center of the magnetic member 6 and the hole 7c positioned at the center of the base 7a. The first straight portion 61, the second straight portion 62, the third straight portion 63, the fourth straight portion 64, and the outflow portion 65 close the groove provided in the lower member 22 and the open portion on the surface side of the groove. And the back surface portion of the upper member 21 to be formed.

  Also in this embodiment, the effect of the first embodiment can be obtained. That is, the heat generated in the conducting wire 10 is directly transmitted to the cooling fluid in the cooling flow path 60 via the holding member 20, and as a result, the cooling efficiency of the conducting wire 10 can be improved.

  In addition, the cooling flow path 60 includes the adjacent first extending portions 11, the adjacent second extending portions 12, the adjacent third extending portions 13, and the adjacent fourth extending portions 14. Are provided respectively. Thereby, the distance (the length of the heat transfer path) between the cooling flow path 60 and the conductor 10 in the first area A is shorter than when the cooling flow path 60 is provided only in the second area B. Therefore, the cooling efficiency of the conducting wire 10 can be further improved.

The cooling flow path 60 is formed between the adjacent first extending portions 11, between the adjacent second extending portions 12, between the adjacent third extending portions 13, and between the adjacent fourth extending portions 14. It may be provided in at least one of them.
[Fifth Embodiment]

  With reference to FIG.9 and FIG.10, coil apparatus 1D which concerns on 5th Embodiment is demonstrated. In FIG. 9, the cover 7b is not shown. Although the cooling flow path 30 of the first embodiment is located in the second area B so as to surround the first area A, the cooling flow path 70 of the present embodiment includes the extending portions 11, 12, 13 and 14 are provided so as to surround the outer peripheral surface 10a. Moreover, the conducting wire 10 of 1st Embodiment was accommodated in the groove part 21a open | released by the surface side of the upper member 21. As shown in FIG. The holding member 20 of the present embodiment further includes an intermediate member 23 between the upper member 21 and the lower member 22, and the conductive wire 10 is incorporated in the intermediate member 23 by, for example, insert molding. That is, the conducting wire 10 is not exposed from the holding member 20. The coil device 1D is different from the coil device 1 in these points.

  The cooling channel 70 is located inside the holding member 20. Specifically, the cooling flow path 70 includes a plurality of inflow portions 71 located above the conducting wire 10, a plurality of relay portions 72 located on the side of the conducting wire 10, and a plurality of outflows located below the conducting wire 10. Part 73. The inflow part 71, the relay part 72, and the outflow part 73 are in order.

  The plurality of inflow portions 71 extend substantially horizontally (in the direction X) from the first extending portion 11 toward the third extending portion 13, and the first extending portion 11 and the third extending portion It is provided at predetermined intervals along the extending direction (direction Y) of the portion 13. The plurality of relay portions 72 are substantially vertical (vertical direction Z) downward from the inflow portion 71 so as to pass through between the adjacent first extending portions 11 and between the adjacent third extending portions 13. ). The outflow portion 73 extends substantially horizontally (in the direction X) linearly from the bottom of the first extension portion 11 to the bottom of the third extension portion, and the extension of the first extension portion 11 and the third extension portion 13. It is provided at predetermined intervals along the current direction (direction Y). As described above, the outer peripheral surfaces 10 a of the first extending portion 11 and the third extending portion 13 are surrounded by the inflow portion 71, the relay portion 72, and the outflow portion 73.

  The inflow portion 71 is formed by a linear groove portion provided in the upper member 21 and a surface portion of the middle member 23 that closes an open portion on the back surface side of the groove portion. The plurality of relay portions 72 are through holes having a predetermined diameter that penetrates the intermediate member 23 in the thickness direction. The outflow portion 73 is formed by a linear groove portion provided in the lower member 22 and a back surface portion of the middle member 23 that closes an open portion on the front surface side of the groove portion.

  The plurality of inflow portions 71 communicate with one end portions of the plurality of branch paths 3a, and the plurality of outflow portions 73 communicate with one end portions of the plurality of branch paths 4a. The branch paths 3 a and 4 a pass through the base 7 a and are exposed to the outside of the housing 7. The branch path 3 a communicates with the supply pipe 3 via the connector 9 outside the housing 7, and the branch path 4 a communicates with the discharge pipe 4 via the connector 9 outside the housing 7.

  Also in this embodiment, the effect of the first embodiment can be obtained. That is, the heat generated in the conducting wire 10 is directly transmitted to the cooling fluid in the cooling flow path 70 via the holding member 20, and as a result, the cooling efficiency of the conducting wire 10 can be improved.

  In addition, the cooling flow path 70 is provided so as to surround the outer peripheral surface 10 a of each of the extending portions 11 and 13. Thereby, the cooling fluid flows around the conducting wire 10. For this reason, the heat of the conducting wire 10 is transmitted toward the periphery of the conducting wire 10. Therefore, the cooling efficiency of the conducting wire 10 can be further improved.

  In the present embodiment, the cooling flow path 70 is provided so as to surround the outer peripheral surface 10a of each extending portion 11, 13, but the outer periphery of all the extending portions 11, 12, 13, 14 is used. It may be provided so as to surround the surface 10a. Alternatively, the cooling flow path 70 may be provided so as to surround at least one extending portion (further, only a part of the extending portion).

  In the present embodiment, each relay unit 72 has a predetermined diameter. For example, each relay unit 72 is made smaller as the diameter of the relay unit 72 closer to the branch path 3a and farther from the branch path 3a. The diameter of the relay portion 72 on the side may be increased. Thereby, the flow rate of the cooling fluid flowing into each relay part 72 can be made uniform, and as a result, the position variation of the cooling efficiency of the conducting wire 10 can be suppressed.

  As mentioned above, although several embodiment of this invention was described, this invention is not limited to the said embodiment.

  In the second embodiment (see FIG. 4), the cooling flow path 40 is provided in the second region B on the first extension portion 11 side and the third extension portion 13 side, respectively. However, for example, as shown in FIG. 11A, the cooling flow paths 40 on the first extending portion 11 side are arranged in parallel, and two cooling flow paths 40 on the third extending portion 13 side are provided. You may arrange in parallel. Thereby, the cooling efficiency of the conducting wire 10 can be further improved.

  In the second embodiment, the cooling flow path 40 includes the inflow portion 41 located on one end side of the straight portion 42 and the outflow portion 43 located on the other end side of the straight portion 42. For example, as illustrated in FIG. 11B, the outflow portion 43 may be provided at the center of the straight portion 42, and the two outflow portions 43 may be provided at each end of the straight portion 42. Thereby, the distance from the inflow part 41 to the outflow part 43 becomes about half compared with the case of 2nd Embodiment. Therefore, the cooling fluid can maintain a high cooling capacity even in the vicinity of the outflow portion 43.

  Moreover, the cooling flow path 40 may be comprised from the several flow path part from which a flow path diameter differs. Specifically, as illustrated in FIG. 11B, the flow path diameter of the straight portion 42 may be smaller than the flow path diameter of the inflow portion 41. In the region where the temperature of the holding member 20 is likely to rise (region close to the conducting wire 10), the flow rate of the cooling fluid can be increased and the cooling efficiency of the conducting wire 10 can be improved by reducing the flow path diameter of the straight portion 42. On the other hand, in the region where the temperature of the holding member 20 is difficult to rise (region far from the conducting wire 10), by increasing the flow path diameter of the inflow portion 41, the pressure loss of the cooling flow path 40 is reduced, and the cooling fluid is smooth. Distribution can be secured.

  Further, as shown in FIG. 11 (c), in the cooling flow path 40 of FIG. 11 (b), the straight portions 42 may be doubled. That is, two straight portions 42 may extend from one outflow portion 43 to the other outflow portion 43. The inflow portion 41 communicates with any of the two straight portions 42 at the central portion of each straight portion 42. Thereby, the cooling efficiency of the conducting wire 10 can be further improved.

  Although only the modification in 2nd Embodiment was shown above, these technical thoughts are not restricted to 2nd Embodiment, You may apply in other said Embodiment.

  In the first and second embodiments, the upper member 21 and the lower member 22 have a two-layer structure. For example, the holding member 20 may have only the second region B in a two-layer structure. In this case, for example, the lower member is a member including a rectangular flat plate-like main body portion and a rectangular protruding portion protruding from the central portion of the main body portion. The upper member is a rectangular frame-shaped member that surrounds the side portion of the protruding portion.

  In the said embodiment, although it was set as the circular type coil part 2, it is not restricted to this. For example, it may be a solenoid type coil portion in which a conducting wire is wound three-dimensionally in a spiral shape. In this case, the shape of the holding member that holds the conducting wire may be any of a flat rectangular tube shape, a cylindrical shape, an elliptical tube shape, and the like.

  In the above embodiment, the pump 5 is provided and the cooling fluid is forced to flow, but a water head difference or the like may be used, and the pump 5 is not necessarily provided. Further, the power source of the pump 5 may be a dedicated power line, but may use non-contact power supply. Since it is necessary to turn the pump 5 only when it generates heat, that is, during power feeding, it is efficient to drive the pump 5 in accordance with power feeding.

  In the above-described embodiment, the supply pipe 3 and the discharge pipe 4 and the cooling flow path provided in the holding member constitute a circulation flow path for circulating the cooling fluid. A non-flow channel may be configured. Further, the cooling flow path is not limited to the configuration of each of the above embodiments, and may be any configuration as long as it is provided in the holding member.

  In the case of cooling the coil device installed in the vehicle, a coolant for cooling the vehicle (for example, an engine) may be used as the cooling fluid. In the case of cooling the coil device installed in the underwater moving body, water (seawater) existing around the underwater moving body may be taken in. Further, the temperature may be adjusted intentionally by adjusting the cooling capacity in response to the positional deviation between the coil devices, and the coil characteristics may be brought close to those suitable for power feeding.

  In addition, a Peltier element including two metal plates and a metal electrode and a semiconductor provided therebetween may be provided. In this case, one metal plate is brought into contact with the cooling flow path of the coil device on the power transmission side. Then, heat is transmitted to one metal plate from the cooling fluid that has absorbed the heat. The other metal plate is exposed to the surrounding environment. As a result, a temperature difference is generated between the two metal plates, and power generation using the Seebeck effect is performed. Therefore, heat energy can be converted into electric energy, and energy can be effectively used.

  Moreover, although the said embodiment demonstrated the case where the coil apparatus of this invention was applied to a non-contact electric power feeding system, it is not limited to a non-contact electric power feeding system, For example, the coil apparatus of this invention is an induction heating system. And may be applied to eddy current flaw detection systems.

DESCRIPTION OF SYMBOLS 1 Coil apparatus 2 Coil part 3 Supply pipe 4 Discharge pipe 5 Pump 6 Magnetic member 6a Hole part 7 Housing 7a Base 7b Cover 7c Hole part 8 Heat exchanger 9 Connector 10 Conductor 10a Outer peripheral surface 11 1st extension part 12 2nd extension Current portion 13 Third extended portion 14 Fourth extended portion 15 First drawn portion 16 Second drawn portion 20 Holding member 21 Upper member 21a Groove portion 22 Lower member 23 Middle member 30 Cooling flow path 31 Inflow portion 32 First linear portion 33 Second linear portion 34 Third linear portion 35 Fourth linear portion 36 Fifth linear portion 37 Outflow portion 40 Cooling flow path 41 Inflow portion 42 Linear portion 43 Outflow portion 50 Cooling flow path 51 Inflow portion 52 Radiation portion 53 Outer peripheral portion 54 Outflow portion 60 Cooling flow path 61 First straight line portion 62 Second straight line portion 63 Third straight line portion 64 Fourth straight line portion 65 Outflow portion 70 Cooling flow path 71 Inflow portion 72 Relay portion 73 Outflow portion A First region B Second region

Claims (8)

A coil portion including a conducting wire and a holding member that holds the conducting wire;
The coil device, wherein the holding member is provided with a cooling flow path through which a cooling fluid flows. The holding member includes a first region for holding the conducting wire, and a second region outside the first region,
The coil device according to claim 1, wherein the cooling flow path is provided in the second region.   The coil device according to claim 2, wherein the cooling flow path is provided so as to surround the first region. The holding member includes a first region for holding the conducting wire, and a second region outside the first region,
The coil device according to claim 1, wherein the cooling flow path extends from a central portion of the first region to the second region. The conducting wire is wound on the holding member and includes a plurality of extending portions adjacent to each other.
The coil device according to claim 1, wherein the cooling flow path is provided between the plurality of extending portions of the conducting wire. The conducting wire includes a plurality of extending portions extending in the holding member,
The coil device according to claim 1, wherein the cooling channel is provided so as to surround an outer peripheral surface of at least one of the extending portions.   The coil device according to any one of claims 1 to 6, wherein the cooling channel is configured by a plurality of channel units having different channel diameters. A housing for accommodating the coil portion;
The coil device according to any one of claims 1 to 7, wherein the cooling flow path communicates with the outside of the housing.

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