JP2017045704A - LED lighting device - Google Patents

LED lighting device Download PDF

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JP2017045704A
JP2017045704A JP2015178934A JP2015178934A JP2017045704A JP 2017045704 A JP2017045704 A JP 2017045704A JP 2015178934 A JP2015178934 A JP 2015178934A JP 2015178934 A JP2015178934 A JP 2015178934A JP 2017045704 A JP2017045704 A JP 2017045704A
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light emitting
led
lighting device
emitting element
color temperature
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辰生 丸山
Tatsuo Maruyama
辰生 丸山
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TORENTA KK
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PROBLEM TO BE SOLVED: To provide a lighting device which does not need to use LED light emitting elements having different color temperatures to attain various color temperatures needed by use application and eliminates a burden caused thereby.SOLUTION: An LED lighting device comprises at least one LED light emitting element 2 and an insulating substrate 1 having light reflectivity. The LED light emitting element 2 is disposed on one surface of the substrate 1. At least part of the LED light emitting element 2 is provided with a coating body 3 comprising a transparent solid body and metal particles dispersed on the transparent solid body. The metal particles are composed of aluminium particles, copper, or copper alloy.SELECTED DRAWING: Figure 2

Description

発明の詳細な説明Detailed Description of the Invention

本発明はLED照明装置に関するもので、特に望みの色温度を簡易に、従って安い原価で、得られるLED照明装置に関する。  The present invention relates to an LED lighting device, and more particularly to an LED lighting device that can obtain a desired color temperature simply and at a low cost.

絶縁性かつ白色の基板の1面にLED発光素子を具えるLED照明装置は近年室内照明等に広く使われるようになった。従来、このようなLED照明装置において望みの色温度を得るには、LED発光素子の構造、LED半導体の組成、併用する蛍光体の組成などを調節して、望みの色温度で発光させるようにしている。  In recent years, an LED lighting device having an LED light emitting element on one surface of an insulating and white substrate has been widely used for indoor lighting and the like. Conventionally, in order to obtain a desired color temperature in such an LED lighting device, the structure of the LED light-emitting element, the composition of the LED semiconductor, the composition of the phosphor to be used in combination are adjusted to emit light at the desired color temperature. ing.

照明装置の用途は多岐にわたり、用途により要求される色温度が異なる。光源に要求される色温度が多様であるため、それぞれの用途に適する色温度のLED発光素子を取りそろえる必要があった。これはLED発光素子(以下、LEDと略記)の設計、製造、在庫管理等いろいろの面で、生産・流通の負担になっている。  The lighting device has various uses, and the color temperature required varies depending on the use. Since the color temperatures required for the light source are diverse, it is necessary to prepare LED light emitting elements having color temperatures suitable for each application. This is a burden of production and distribution in various aspects such as design, manufacture, and inventory management of LED light emitting elements (hereinafter abbreviated as LED).

色温度の異なる2種以上のLEDを組み合わせて所望の色温度を得ることもしばしば行われているが、これも生産・流通の負担は大して変わらない。有色の光を発光するLEDを白色光LEDと組み合わせて所望の色温度を得る方法も実用新案登録3132253(特許文献1)及び特許公開2009−176692(特許文献2)で提案されているが、白色光LEDとともに必要な種類と数の有色発光LEDを用意する必要がある点で、問題は同じである。  Often, a desired color temperature is obtained by combining two or more types of LEDs having different color temperatures, but this also does not greatly change the burden of production and distribution. A method for obtaining a desired color temperature by combining an LED that emits colored light with a white light LED has also been proposed in Utility Model Registration 3132253 (Patent Document 1) and Patent Publication 2009-176692 (Patent Document 2). The problem is the same in that the necessary types and number of colored light emitting LEDs need to be prepared along with the light LEDs.

所望の色温度を得るために、光源の前面に色温度変換フィルターを設ける方法が、例えば特許公開2013−4365(特許文献3)に開示されているが、的確な変換性能をもつ光学フィルターは一般に高価である。色フィルター層を個別のLEDの前面に設けて色温度を調整する工夫も特許公開2009−200021(特許文献4)および特許公開2015−18612(特許文献5)で提案されているが、フィルター層の濃度や厚さの的確な管理が容易でない。色フィルター層はLED光源の使用を続けると色素等が退色し、その分光吸収特性が変化することが大きな欠点である。吸収体として顔料を用いても、LEDからの光束が強いため、退色を防ぐことが困難であった(「LED」略記はここまで)。  In order to obtain a desired color temperature, a method for providing a color temperature conversion filter on the front surface of a light source is disclosed in, for example, Japanese Patent Application Laid-Open No. 2013-4365 (Patent Document 3), but an optical filter having an accurate conversion performance is generally used. Expensive. Japanese Patent Publication No. 2009-200021 (Patent Document 4) and Patent Publication No. 2015-18612 (Patent Document 5) have also been proposed in which a color filter layer is provided on the front surface of each LED to adjust the color temperature. Accurate management of concentration and thickness is not easy. A major drawback of the color filter layer is that when the use of the LED light source is continued, the pigments and the like fade and the spectral absorption characteristics change. Even when a pigment is used as the absorber, it is difficult to prevent fading because the luminous flux from the LED is strong ("LED" abbreviated so far).

実用新案登録3132253  Utility model registration 3132253 特許公開2009−176692  Patent Publication 2009-176692 特許公開2013−4365  Patent Publication 2013-4365 特許公開2009−200021  Patent Publication 2009-200021 特許公開2015−18612  Patent Publication 2015-18612

それ故、照明装置の用途により要求される多様な色温度を得るために、色温度の異なる種々のLED発光素子を取りそろえる必要がなく、そのための負担を解消した照明装置を実現することが、本発明の目的である。  Therefore, in order to obtain various color temperatures required by the use of the lighting device, it is not necessary to prepare various LED light emitting elements having different color temperatures, and it is possible to realize a lighting device that eliminates the burden for that. It is an object of the present invention.

本発明の他の目的は、退色を起こす色フィルター層等を用いないで、所望の色温度の白色光源を得ることにある。  Another object of the present invention is to obtain a white light source having a desired color temperature without using a color filter layer that causes fading.

本発明の上記目的を達成するLED照明装置は、少なくとも1のLED発光素子と絶縁性かつ光反射性の基板とから成り、基板の1面にLED発光素子が配列されたLED照明装置において、LED発光素子の少なくとも一部が、透明固体と、それに分散された金属粒子とから成る被覆体を有することを特徴とする。  An LED illumination device that achieves the above object of the present invention is an LED illumination device comprising at least one LED light emitting element and an insulating and light reflecting substrate, wherein the LED light emitting element is arranged on one surface of the substrate. At least a part of the light-emitting element has a covering made of a transparent solid and metal particles dispersed therein.

LED発光素子として本発明では、通常、所定の色温度の白色光を発する、入手が容易なLED発光素子を用いる。この所定の色温度は、照明装置に求められる(所望の)色温度と異なっていてもよく、これが本発明の大きな特徴である。  In the present invention, an easily available LED light emitting element that emits white light having a predetermined color temperature is used as the LED light emitting element. This predetermined color temperature may be different from the (desired) color temperature required for the lighting device, which is a major feature of the present invention.

LED発光素子は所定の直線に沿って配列されることが多いが、曲線に沿って配列されてもよい。複数の列に沿って配列されてもよい。  The LED light emitting elements are often arranged along a predetermined straight line, but may be arranged along a curved line. It may be arranged along a plurality of columns.

透明固体としては合成樹脂、例えばシリコン樹脂が、好適である。しかし、ガラスその他の無機材料を用いてもよい。シリコン樹脂は、必要に応じてLED発光素子から被覆体を剥がし去ることガできるので、有利である。  As the transparent solid, a synthetic resin such as a silicon resin is suitable. However, glass or other inorganic materials may be used. Silicone resin is advantageous because it can be peeled off from the LED light emitting element as required.

金属粒子としては、アルミニウム、銅、銅合金、金、ニッケル、不銹鋼等の金属粒子を用いることができる。  As the metal particles, metal particles such as aluminum, copper, copper alloy, gold, nickel, and stainless steel can be used.

金属粒子としてアルミニウムを用いると、LED発光素子の発する光より高い色温度の照明装置を提供することができる。適当なアルミニウム合金、例えばジュラルミンを、用いることもできる。  When aluminum is used as the metal particles, an illumination device having a higher color temperature than the light emitted from the LED light-emitting element can be provided. A suitable aluminum alloy such as duralumin can also be used.

金属粒子として銅又はその適当な合金の粒子を用いると、LED発光素子の発する光より低い色温度の照明装置を提供することができる。例えば銅と亜鉛の合金(黄銅)は、耐蝕性もあり有利である。銅と錫の合金(青銅)、銅と銀の合金、銅と金の合金などを用いることもできる。  When particles of copper or an appropriate alloy thereof are used as the metal particles, a lighting device having a color temperature lower than that of light emitted from the LED light emitting element can be provided. For example, an alloy of copper and zinc (brass) is advantageous because it has corrosion resistance. An alloy of copper and tin (bronze), an alloy of copper and silver, an alloy of copper and gold, or the like can also be used.

金属粒子の表面が白色光の長波長成分を吸収(短波長成分を選択的に反射)する分光特性を有すると、LED発光素子の発する光より高い色温度を得ることができる。反対に、金属粒子の表面が白色光の短波長成分を吸収(長波長成分を選択的に反射)する分光特性を有すると、LED発光素子の発する光より高い色温度を得ることができる。  When the surface of the metal particles has a spectral characteristic that absorbs the long wavelength component of white light (selectively reflects the short wavelength component), a higher color temperature than the light emitted from the LED light emitting element can be obtained. On the contrary, when the surface of the metal particles has a spectral characteristic of absorbing the short wavelength component of white light (selectively reflecting the long wavelength component), a higher color temperature than the light emitted from the LED light emitting element can be obtained.

金属粒子のサイズ(通常、等体積球換算直径で表示される)は、透明固体中に容易に分散できる程度であることが好ましく、通常約1mm未満(換算直径)に選ばれるが、0.02ないし0.5mmが有利である。  The size of the metal particles (usually expressed as an equivalent volume sphere equivalent diameter) is preferably such that it can be easily dispersed in a transparent solid, and is usually selected to be less than about 1 mm (equivalent diameter), but 0.02 A thickness of 0.5 to 0.5 mm is advantageous.

透明固体に対する金属粒子の量の比率は、余り高いと金属粒子による光の遮蔽のために照明光の減衰を招くので好ましくない。反対に余り低ければ、所望の色温度を得ることが困難になる。それ故、金属粒子による照明光の減衰が許容できる限度内で、所望の色温度上昇又は低下の効果が得られるような比率に選ばれる。このような比率はLED発光素子の全面を覆う密度より遥かに低く、そのような密度で色温度変化の効果は十分に得られる。  If the ratio of the amount of the metal particles to the transparent solid is too high, the illumination light is attenuated due to light shielding by the metal particles, which is not preferable. On the other hand, if it is too low, it becomes difficult to obtain a desired color temperature. Therefore, the ratio is selected so that the desired effect of increasing or decreasing the color temperature can be obtained within the allowable limit of the attenuation of the illumination light by the metal particles. Such a ratio is much lower than the density covering the entire surface of the LED light emitting element, and the effect of changing the color temperature is sufficiently obtained at such a density.

LED発光素子上の被覆体の厚さについても同様で、照明光の減衰が許容できる範囲で、所望の色温度上昇又は低下の効果が得られるような厚さを選ぶ。個別のLED発光素子上で被覆体の厚さは一様でもよく、場所により異なってもよい。すなわち、被覆体は基板に平行な平面から成る頂面を有してもよいし、被覆体の頂面が凸の曲面(例えば球面)から成ってもよい。  The same applies to the thickness of the cover on the LED light-emitting element, and the thickness is selected so that the desired effect of increasing or decreasing the color temperature is obtained within a range in which the attenuation of the illumination light is acceptable. The thickness of the covering on the individual LED light emitting elements may be uniform or may vary depending on the location. That is, the covering may have a top surface that is a plane parallel to the substrate, or the top surface of the covering may be a convex curved surface (for example, a spherical surface).

LED発光素子上に所望の厚さの被覆体を設けるには、金属粒子を分散した液相の分散系でLED発光素子を覆い、液相を固体化すればよい。高分子の溶液から溶媒を蒸発させてもよいし、液状の高分子を熱硬化または光硬化させてもよい。未硬化又は半硬化のシリコン樹脂等の合成高分子に、アルコール等の溶媒を加えて溶液とし、LED発光素子に塗布または点着し、溶媒を蒸発させてもよい。  In order to provide a cover with a desired thickness on the LED light emitting element, the LED light emitting element may be covered with a liquid phase dispersion system in which metal particles are dispersed to solidify the liquid phase. The solvent may be evaporated from the polymer solution, or the liquid polymer may be thermally cured or photocured. A solvent such as alcohol may be added to a synthetic polymer such as an uncured or semi-cured silicone resin to form a solution, which may be applied or spotted on the LED light-emitting element, and the solvent may be evaporated.

被覆体の厚さと、分散された金属粒子の含有率によって、個々のLED発光素子の色温度の変換の大きさを調整することができる。  Depending on the thickness of the covering and the content of the dispersed metal particles, the degree of conversion of the color temperature of each LED light-emitting element can be adjusted.

本発明の照明装置は、LED発光素子の配列のうち一部のLED発光素子のみに、白色光の長波長成分または短波長成分のいずれかを吸収する金属粒子を分散した被覆体を設け、残余のLED発光素子には被覆体を設けない構成としてもよい。照明装置全体としての色温度を、被覆体を設けたLED発光素子と設けないLED発光素子の比率により所望の値に調整することができる。  The illuminating device of the present invention is provided with a covering in which metal particles that absorb either a long wavelength component or a short wavelength component of white light are dispersed only in some of the LED light emitting elements in the array of LED light emitting elements, and the remainder It is good also as a structure which does not provide a coating body in this LED light emitting element. The color temperature of the entire lighting device can be adjusted to a desired value by the ratio of the LED light emitting element provided with the covering to the LED light emitting element not provided.

LED発光素子の配列のうち一部のLED発光素子の被覆体に、白色光の長波長成分を吸収する金属粒子を用い、残余のLED発光素子の被覆体に、白色光の短波長成分を吸収する金属粒子を用いてもよい。前者又は後者の部分は、それぞれ、配列の中で連続でもよく、あるいは不連続でもよい。いずれの部分も不連続であってもよい。  In the LED light-emitting element array, some of the LED light-emitting element covers use metal particles that absorb the long-wavelength component of white light, and the remaining LED light-emitting element cover absorbs the short-wavelength component of white light. Metal particles may be used. Each of the former and latter portions may be continuous or discontinuous in the sequence. Any part may be discontinuous.

被覆体に2種以上の金属粒子が分散されてもよい(例えば銅と銅合金、銅と金)。  Two or more kinds of metal particles may be dispersed in the covering (for example, copper and copper alloy, copper and gold).

基板上でLED発光素子の周囲の部分にも被覆体が存在してもよい。LED発光素子と周囲の部分の被覆体が一体であってもよく、連続した層を形成してもよい。  A covering may also be present on the periphery of the LED light emitting element on the substrate. The LED light emitting element and the surrounding covering may be integrated, or a continuous layer may be formed.

本発明の照明装置によれば、LED発光素子の少なくとも一部に、透明固体とそれに分散された金属粒子とから成る被覆体を設けることにより、光源の色温度をLED発光素子のそれと異なる所望の値に容易に調整することができる。それ故、用途に応じて要求される色温度を得るために色温度の異なるLED発光素子を種々取りそろえる必要がなくなり、それによる設計、製造、在庫管理等の面での負担が解消され、好ましい演色性をもつ照明装置を、簡易に、従って安価に提供できる。また本発明の照明装置によれば、高価な、あるいは製造上管理の難しい、色フィルター層等を用いないで、所望の色温度の光源を容易に、かつ安定して得ることができる。さらに、色フィルター層の退色(褪色)の問題も回避できる。  According to the illuminating device of the present invention, at least a part of the LED light emitting element is provided with a covering made of a transparent solid and metal particles dispersed therein, so that the color temperature of the light source is different from that of the LED light emitting element. Can be easily adjusted to the value. Therefore, it is not necessary to prepare various LED light-emitting elements with different color temperatures in order to obtain the color temperature required according to the application, thereby eliminating the burden in terms of design, manufacturing, inventory management, etc. A lighting device having color rendering properties can be provided simply and at a low cost. Further, according to the lighting device of the present invention, a light source having a desired color temperature can be obtained easily and stably without using an expensive or difficult-to-manage color filter layer. Furthermore, the problem of fading (fading) of the color filter layer can be avoided.

金属粒子の表面が白色光の長波長成分を吸収する分光特性を有すると、LED発光素子の発する光より高い色温度を得ることができる。反対に、金属粒子の表面が白色光の短波長成分を吸収する分光特性を有すると、LED発光素子の発する光より低い色温度を得ることができる。それ故、分散する金属粒子を選択することにより、用いるLED発光素子の色温度より高い、あるいは低い、所望の色温度を容易に得ることができる。本発明の照明装置によれば、特に効果の大きい場合、用いたLED発光素子自体の色温度に比し3000Kに及ぶ色温度上昇を得ることが可能である。  When the surface of the metal particles has a spectral characteristic that absorbs the long wavelength component of white light, a higher color temperature than the light emitted from the LED light emitting element can be obtained. On the contrary, when the surface of the metal particles has a spectral characteristic that absorbs the short wavelength component of white light, it is possible to obtain a lower color temperature than the light emitted from the LED light emitting element. Therefore, a desired color temperature that is higher or lower than the color temperature of the LED light emitting element to be used can be easily obtained by selecting the metal particles to be dispersed. According to the lighting device of the present invention, when the effect is particularly great, it is possible to obtain a color temperature increase of up to 3000 K compared to the color temperature of the LED light emitting element itself used.

本発明を実施するための第一の形態に相当するLED照明装置の光源部の平面図  The top view of the light source part of the LED lighting apparatus equivalent to the 1st form for implementing this invention 第一の形態のLED照明装置の光源部の断面図  Sectional drawing of the light source part of the LED lighting apparatus of a 1st form 本発明を実施するための第二の形態に相当するLED照明装置の光源部の平面図  The top view of the light source part of the LED lighting apparatus equivalent to the 2nd form for implementing this invention 第二の形態のLED照明装置の光源部の断面図  Sectional drawing of the light source part of the LED lighting apparatus of a 2nd form 本発明を実施するための第三の形態に相当するLED照明装置の光源部の平面図  The top view of the light source part of the LED lighting apparatus equivalent to the 3rd form for implementing this invention 第三の形態のLED照明装置の光源部の断面図  Sectional drawing of the light source part of the LED lighting apparatus of a 3rd form 本発明を実施するための第四の形態に相当するLED照明装置の光源部の平面図  The top view of the light source part of the LED lighting apparatus equivalent to the 4th form for implementing this invention 第四の形態のLED照明装置の光源部の断面図  Sectional drawing of the light source part of the LED lighting apparatus of a 4th form 本発明を実施するための形態に相当するLED照明装置の断面図  Sectional drawing of the LED illuminating device corresponded to the form for implementing this invention

(第一の実施の形態)
図1および図2は、本発明を実施するための第一の形態に相当するLED照明装置の光源部を示す。光源部10は基板1、白色発光ダイオード2、被覆体3から成る。白色発光ダイオード2は基板1の面1aに直線に沿って配列されており、面1aは白色で光反射性である。白色発光ダイオード2の上を覆うように被覆体3が設けられている。
(First embodiment)
1 and 2 show a light source unit of an LED lighting device corresponding to a first embodiment for carrying out the present invention. The light source unit 10 includes a substrate 1, a white light emitting diode 2, and a covering 3. The white light emitting diodes 2 are arranged along a straight line on the surface 1a of the substrate 1, and the surface 1a is white and light-reflective. A covering 3 is provided so as to cover the white light emitting diode 2.

図2は第一の形態の光源部10の、図1の線分XXに沿った断面を示す。白色発光ダイオード2は、その上に被覆体3を有する(場合により分離可能でもよい)。被覆体3はレンズ状で、アルミニウム粒子が透明なシリコン樹脂に分散されている。基板1の面1b(裏面)には、白色発光ダイオード2に適合した電力を供給するための電気部品および配線が設置されるが、簡略のため図示していない。  FIG. 2 shows a cross section of the light source unit 10 of the first embodiment along the line XX of FIG. The white light emitting diode 2 has a covering 3 thereon (may be separable in some cases). The covering 3 has a lens shape, and aluminum particles are dispersed in a transparent silicon resin. On the surface 1b (back surface) of the substrate 1, electrical components and wiring for supplying electric power suitable for the white light emitting diode 2 are installed, but are not shown for simplicity.

アルミニウム粒子がシリコン樹脂に分散された被覆体3の存在により、光源部10の前面では、LED発光素子2自体の発する光より高い色温度を得ることができる。色温度上昇の幅は、白色発光ダイオード2の単位面積当たりのアルミニウム粒子の密度に依存する。  Due to the presence of the covering 3 in which the aluminum particles are dispersed in the silicon resin, a color temperature higher than the light emitted from the LED light emitting element 2 itself can be obtained on the front surface of the light source unit 10. The width of the color temperature rise depends on the density of aluminum particles per unit area of the white light emitting diode 2.

本発明の照明装置は、光源部10を適宜のケースに収め、発光ダイオードに電力を供給するため、基板裏面に配置した電気部品を介して、発光ダイオードを外部電源または駆動回路に配線で接続することにより構成される。  In the illuminating device of the present invention, the light source unit 10 is housed in an appropriate case, and in order to supply power to the light emitting diode, the light emitting diode is connected to an external power source or a driving circuit via an electric component disposed on the back surface of the substrate. It is constituted by.

(第二の実施の形態)
図3および図4は本発明を実施するための第二の形態に相当するLED照明装置の光源部を示す。光源部20は、基板1、白色発光ダイオード2、被覆体23から成り、白色発光ダイオード2の上を覆うように被覆体23が設けられている。それ以外の光源部10と同じ部品については、説明を省く。
(Second embodiment)
3 and 4 show a light source unit of an LED lighting device corresponding to a second embodiment for carrying out the present invention. The light source unit 20 includes a substrate 1, a white light emitting diode 2, and a covering body 23, and the covering body 23 is provided so as to cover the white light emitting diode 2. Description of the other components that are the same as those of the light source unit 10 is omitted.

図4に第二の形態の光源部20の断面を示す。図4は図3の線分YYに沿った断面図である。白色発光ダイオード2は、その上に被覆体23を有する。被覆体23は、シリコン樹脂に黄銅粒子が分散されたものである。  FIG. 4 shows a cross section of the light source unit 20 of the second form. 4 is a cross-sectional view taken along line YY in FIG. The white light emitting diode 2 has a covering 23 thereon. The covering body 23 is made by dispersing brass particles in a silicon resin.

黄銅粒子がシリコン樹脂に分散された被覆体23の存在により、光源部20の前面では、LED発光素子2の発する光より低い色温度を得ることができる。色温度低下の幅は、白色発光ダイオード2の単位面積当たりの黄銅粒子の密度に依存する。  Due to the presence of the covering body 23 in which the brass particles are dispersed in the silicon resin, a color temperature lower than the light emitted from the LED light emitting element 2 can be obtained on the front surface of the light source unit 20. The width of the color temperature decrease depends on the density of the brass particles per unit area of the white light emitting diode 2.

(第三の実施の形態)
図5および図6は、本発明を実施するための第三の形態に相当するLED照明装置の光源部を示す。光源部30は基板1、白色発光ダイオード2(電気的光学的に全く同じ性能の白色発光ダイオード2Cを含む)、被覆体3から成る。白色発光ダイオード2のうち白色発光ダイオード2Cには、その上を覆うように被覆体3が設けられているが、残りの白色発光ダイオード2には被覆体3が設けられていない。光源部10と同様に被覆体3はレンズ状で、アルミニウム粒子が透明なシリコン樹脂に分散されている。図6は、図5の線分ZZに沿った断面図である。光源部10と同じ部品については説明を省く。白色発光ダイオード2Cの数は、望みの色温度によって増減することができる。
(Third embodiment)
5 and 6 show a light source unit of an LED lighting device corresponding to a third embodiment for carrying out the present invention. The light source unit 30 includes a substrate 1, a white light emitting diode 2 (including a white light emitting diode 2 C having the same electro-optical performance), and a cover 3. Of the white light emitting diodes 2, the white light emitting diode 2 </ b> C is provided with a covering 3 so as to cover it, but the remaining white light emitting diodes 2 are not provided with the covering 3. Similar to the light source unit 10, the covering 3 has a lens shape, and aluminum particles are dispersed in a transparent silicon resin. 6 is a cross-sectional view taken along line ZZ in FIG. A description of the same components as the light source unit 10 is omitted. The number of white light emitting diodes 2C can be increased or decreased depending on a desired color temperature.

被覆体3の存在により、光源部30の前面では、LED発光素子2の発する光より高いが、光源部10よりは若干低い色温度を得ることができる。  Due to the presence of the cover 3, a color temperature higher than the light emitted from the LED light emitting element 2 on the front surface of the light source unit 30 but slightly lower than that of the light source unit 10 can be obtained.

本発明の照明装置は、上記の各実施形態で説明した光源部、例えば前述の光源部30を、適宜のケースに収め、発光ダイオードに電力を供給するため、基板裏面に配置した電気部品を介して、発光ダイオードを外部電源または駆動回路に配線で接続することにより構成される。  The illumination device of the present invention includes the light source unit described in each of the above embodiments, for example, the above-described light source unit 30 in an appropriate case and supplies electric power to the light-emitting diode via an electrical component disposed on the back surface of the substrate. Thus, the light emitting diode is connected to an external power source or a driving circuit by wiring.

図7および図8は、本発明を実施するための第四の形態に相当するLED照明装置の光源部を示す。光源部40は、基板1、白色発光ダイオード2A及び同2B、被覆体3A、被覆体3Bから成る。白色発光ダイオード2Aと同2Bは被覆体の相違以外、電気的、光学的に全く同じ性能の発光ダイオードで、白色発光ダイオード2Aにはレンズ状の被覆体3A、白色発光ダイオード2Bにはレンズ状の被覆体3Bが、それぞれ設けられている。それ以外の光源部10と同じ部品については、説明を省く。  7 and 8 show a light source unit of an LED lighting device corresponding to a fourth embodiment for carrying out the present invention. The light source unit 40 includes a substrate 1, white light emitting diodes 2A and 2B, a covering body 3A, and a covering body 3B. The white light emitting diodes 2A and 2B are light emitting diodes having exactly the same electrical and optical performance except for the difference in the covering. The white light emitting diode 2A has a lens-shaped covering 3A, and the white light emitting diode 2B has a lens-like shape. Each of the covering bodies 3B is provided. Description of the other components that are the same as those of the light source unit 10 is omitted.

図8は、図7の線分WWに沿った断面図である。被覆体3Aはシリコン樹脂に銅粒子が、被覆体3Bはシリコン樹脂に黄銅粒子が、それぞれ分散されたものである。  FIG. 8 is a sectional view taken along line WW in FIG. The covering 3A is obtained by dispersing copper particles in silicon resin, and the covering 3B is obtained by dispersing brass particles in silicon resin.

銅粒子がシリコン樹脂に分散された被覆体3Aの存在により、白色発光ダイオード2Aの前面ではLED発光素子の発する光より低い色温度を得ることができる。黄銅粒子がシリコン樹脂に分散された被覆体3Bの存在により、白色発光ダイオード2Bの前面ではLED発光素子の発する光より低いが、白色発光ダイオード2Aの前面よりは高い色温度を得ることができる。光源部40の前方では、これらの光が混合し、全体として両者の中間の色温度の照明光が得られる。  Due to the presence of the covering 3A in which the copper particles are dispersed in the silicon resin, a lower color temperature than the light emitted from the LED light emitting element can be obtained on the front surface of the white light emitting diode 2A. Due to the presence of the covering 3B in which the brass particles are dispersed in the silicon resin, the front surface of the white light emitting diode 2B is lower than the light emitted from the LED light emitting element, but can have a higher color temperature than the front surface of the white light emitting diode 2A. In front of the light source unit 40, these lights are mixed to obtain illumination light having an intermediate color temperature as a whole.

図9は、本発明の照明装置の典型的な構成を示す断面図である。図9では第三の実施の形態の例を示した。基板1、白色発光ダイオード2,2C(LED発光素子)、被覆体3、及び電気部品4により構成される光源部30が、ケース5に収容されている。LED発光素子2に電気配線6で接続された電気部品4は電気配線6aで、図示されない外部電源または駆動回路に接続される。他の実施の形態についても同様に構成される。  FIG. 9 is a cross-sectional view showing a typical configuration of the illumination device of the present invention. FIG. 9 shows an example of the third embodiment. A light source unit 30 including a substrate 1, white light emitting diodes 2 and 2 </ b> C (LED light emitting elements), a covering 3, and an electrical component 4 is accommodated in a case 5. The electric component 4 connected to the LED light emitting element 2 by the electric wiring 6 is connected to an external power source or a driving circuit (not shown) through the electric wiring 6a. The other embodiments are similarly configured.

第一の実施の形態において、白色発光ダイオード2として色温度4200KのLED発光素子を用い、0.03ないし0.1mmの範囲の粒子サイズ分布を有するアルミニウム粉末をシリコン樹脂に分散して、被覆体3とした。アルミニウム粒子/シリコン樹脂分散系は次のような方法で調製した。
エタノール0.5mLにアルミニウム粉末100mg(泰豊トレーディング社製)を加え、よく攪拌してアルミニウム粉末を分散させる。分散液に未硬化シリコン樹脂25gを加えてよく攪拌し、混合する。混合液の小滴で、各LED発光素子(チップ)の頂部にある窪みを満たし、常温で1日乾燥・硬化する。シリコン樹脂としてはモメンティブ・パフォーマンス・マテリアルズ・ジャパン(合)製のTDSSEALを用いた。
In the first embodiment, an LED light-emitting element having a color temperature of 4200 K is used as the white light-emitting diode 2, and aluminum powder having a particle size distribution in the range of 0.03 to 0.1 mm is dispersed in silicon resin, thereby covering It was set to 3. The aluminum particle / silicone resin dispersion was prepared by the following method.
Add 100 mg of aluminum powder (manufactured by Taiho Trading Co., Ltd.) to 0.5 mL of ethanol, and stir well to disperse the aluminum powder. Add 25 g of uncured silicone resin to the dispersion, mix well and mix. The droplets of the mixed solution fill the depressions at the top of each LED light emitting element (chip), and are dried and cured at room temperature for one day. As a silicone resin, TDSSEAL manufactured by Momentive Performance Materials Japan (go) was used.

電気部品4を組み込んだ光源部10を、図9のようにケース5に収容し、電気配線6aを接続して、照明装置を製作した。実施例の照明装置の発する光の色温度は、約6500Kであった。すなわち、被覆体を設けないLED発光素子の場合に比し、約2300Kの色温度上昇が得られた。  The light source unit 10 incorporating the electrical component 4 was accommodated in the case 5 as shown in FIG. 9, and the electrical wiring 6a was connected to manufacture the lighting device. The color temperature of the light emitted from the lighting device of the example was about 6500K. That is, a color temperature increase of about 2300 K was obtained as compared with the case of the LED light emitting element without the covering.

1 基板
1a,1b 面
2 白色発光ダイオード
2A,2B,2C 白色発光ダイオード
3,3A,3B 被覆体
4 電気部品
5 ケース
5a ステップ
6,6a 電気配線
10,20 光源部
23 被覆体
30,40 光源部
DESCRIPTION OF SYMBOLS 1 Board | substrate 1a, 1b Surface 2 White light emitting diode 2A, 2B, 2C White light emitting diode 3, 3A, 3B Cover body 4 Electrical component 5 Case 5a Step 6, 6a Electric wiring 10, 20 Light source part 23 Cover body 30, 40 Light source part

Claims (9)

少なくとも1のLED発光素子と絶縁性かつ光反射性の基板とから成り、
前記基板の1面に前記LED発光素子が配置されたLED照明装置において、
前記LED発光素子の少なくとも一部が、透明固体と、それに分散された金属粒子とから成る被覆体を有することを特徴とする、LED照明装置。
Comprising at least one LED light emitting element and an insulating and light reflecting substrate;
In the LED lighting device in which the LED light emitting element is disposed on one surface of the substrate,
At least a part of the LED light emitting element has a covering made of a transparent solid and metal particles dispersed therein, and the LED lighting device.
前記金属粒子がアルミニウム粒子である、請求項1のLED照明装置。  The LED lighting device according to claim 1, wherein the metal particles are aluminum particles. 前記金属粒子が銅または銅合金から成る、請求項1のLED照明装置。  The LED lighting device according to claim 1, wherein the metal particles are made of copper or a copper alloy. 前記銅合金が銅と亜鉛の合金である、請求項3のLED照明装置。  The LED lighting device according to claim 3, wherein the copper alloy is an alloy of copper and zinc. 前記透明固体が合成樹脂から成る、請求項1、2又は3のLED照明装置。  The LED lighting device according to claim 1, wherein the transparent solid is made of a synthetic resin. 前記合成樹脂がシリコン樹脂である、請求項5のLED照明装置。  The LED lighting device according to claim 5, wherein the synthetic resin is a silicon resin. 前記LED発光素子が所定の色温度の白色光を発するものであり、この所定の色温度よりも高い色温度の光を発する、請求項1のLED照明装置。  The LED lighting device according to claim 1, wherein the LED light emitting element emits white light having a predetermined color temperature, and emits light having a color temperature higher than the predetermined color temperature. 前記LED発光素子が所定の色温度の白色光を発するものであり、この所定の色温度よりも低い色温度の光を発する、請求項1のLED照明装置。  The LED lighting device according to claim 1, wherein the LED light emitting element emits white light having a predetermined color temperature, and emits light having a color temperature lower than the predetermined color temperature. 前記被覆体が、前記基板に平行な平面から成る頂面を有する、請求項1のLED照明装置。  The LED lighting device according to claim 1, wherein the covering has a top surface formed of a plane parallel to the substrate.
JP2015178934A 2015-08-25 2015-08-25 LED lighting device Pending JP2017045704A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112099119A (en) * 2020-09-28 2020-12-18 深圳市隆利科技股份有限公司 Preparation process of reflecting layer for backlight module and backlight module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112099119A (en) * 2020-09-28 2020-12-18 深圳市隆利科技股份有限公司 Preparation process of reflecting layer for backlight module and backlight module

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