JP2016021435A - Light-emitting module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting module making it easier to feel peace of mind and high-grade sense.SOLUTION: A light-emitting module 1 has a mounting substrate 11, at least one semiconductor light-emitting element 12 mounted on the mounting substrate 11, and a transparent resin member 13 to cover the semiconductor light-emitting element 12. The transparent resin member 13 has light permeability with respect to light emitted from the light-emitting module 1. The transparent resin member 13 contains a particulate filler 14 having light permeability with respect to the light emitted from the light-emitting module 1, and having a particle size of 20 μm or more.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a light emitting module.

A light emitting module using a semiconductor light emitting element as a light source is known. Various proposals have been made to uniformly emit light from such a light emitting module.
For example, the technique described in Patent Document 1 adds unevenness to the surface of the light emitting surface of the light emitting module to uniformly diffuse the light. In the technique described in Patent Document 2, light diffusion particles are added to a sealing portion in which a semiconductor light emitting element is sealed with resin, and light is uniformly diffused by the light diffusion particles. In the technique described in Patent Document 3, a light diffusion layer is added to a part of the light emitting module, and light is uniformly diffused by the light diffusion layer.

JP 2013-042166 A JP 2012-129568 A JP 2010-056337 A

  By the way, the present inventors have paid attention to that it is difficult for humans to feel comfort and luxury from the light only by the light emitting module emitting light uniformly. Light emitting modules that emit light uniformly are preferred in places where workability is a priority, such as offices and laboratories, but light emitting modules that emit light with slight changes are required in places where people can relax, such as living rooms, bedrooms, and hotel lounges. It is done.

  Accordingly, an object of the present invention is to provide a light emitting module that is easy to feel comfort and high quality.

The light emitting module according to the present invention includes:
A mounting substrate;
At least one semiconductor light emitting element mounted on the mounting substrate;
A transparent resin member covering the semiconductor light emitting element;
A light emitting module comprising:
The transparent resin member is light transmissive to light emitted from the light emitting module,
The transparent resin member includes a particulate filler having a particle diameter of 20 μm or more, which is light transmissive with respect to light emitted from the light emitting module.

  According to the light emitting module having the above configuration, the light emitted from the semiconductor light emitting element is refracted, reflected, or blocked by a filler having a large particle size of 20 μm or more, so that the position of the person viewing the light emitting module As a result, a region with high brightness appears or disappears locally. Thereby, the light emitting module appears to emit light with a change, and it is possible to give comfort and a high-class feeling to the person who sees the light emitting module.

  In the light emitting module of the present invention, the filler may have a shape with a flatness ratio of 1.2 or more. According to the light emitting module having the above configuration, since the filler is flat, the light emitted from the semiconductor light emitting element is likely to be blocked or reflected depending on the orientation of the filler. For this reason, a site | part with high brightness | luminance tends to arise locally and it is easy to light-emit a light emitting module with a change.

  In the light emitting module of the present invention, the transparent resin member may include at least one kind of phosphor. According to the light emitting module having the above configuration, the light emitting module can easily emit light in a desired color tone.

  In the light emitting module of the present invention, at least a part of the filler may be exposed from the surface of the transparent resin member. According to the light emitting module having the above-described configuration, it is easy to generate a region with high luminance locally by emitting light from at least a part of the exposed filler to the outside.

  In the light emitting module of the present invention, the filler is 0.01 vol. % To 95 vol. % Or less may be included. According to the light emitting module having the above configuration, the filler is 0.01 vol. % To 95 vol. % Or less, the light emitting module can emit light uniformly with changes.

  ADVANTAGE OF THE INVENTION According to this invention, the light emitting module which is easy to feel comfort and a high-class feeling can be provided.

It is a schematic sectional drawing explaining the structure of the light emitting module which concerns on 1st Embodiment. It is a figure which shows the modification in 1st Embodiment, Comprising: (a)-(d) is a schematic sectional drawing explaining the structure of the light emitting module which concerns on each modification. It is a schematic sectional drawing explaining the structure of the light emitting module which concerns on 2nd Embodiment. It is a figure which shows the modification in 2nd Embodiment, Comprising: (a)-(d) is a schematic sectional drawing explaining the structure of the light emitting module which concerns on each modification. It is a schematic sectional drawing explaining the structure of the light emitting module which concerns on 3rd Embodiment. It is a figure which shows the modification in 3rd Embodiment, Comprising: (a)-(d) is a schematic sectional drawing explaining the structure of the light emitting module which concerns on each modification. It is a schematic sectional drawing explaining the structure of the light emitting module which concerns on 4th Embodiment. It is a schematic sectional drawing explaining the structure of the light emitting module which concerns on 5th Embodiment.

  Hereinafter, an example of an embodiment of a light emitting module according to the present invention will be described with reference to the drawings.

(First embodiment)
First, the basic structure of the light emitting module according to the first embodiment will be described.
FIG. 1 is a schematic cross-sectional view illustrating the configuration of the light emitting module 1 according to the first embodiment.
As shown in FIG. 1, the light emitting module 1 according to the first embodiment includes a mounting substrate 11, at least one semiconductor light emitting element 12 mounted on the mounting substrate 11, and a transparent resin member 13 that covers the semiconductor light emitting element 12. ,have. The transparent resin member 13 is light transmissive with respect to light emitted from the light emitting module 1. The transparent resin member 13 includes a particulate filler 14 having a particle diameter of 20 μm or more, which is light transmissive with respect to light emitted from the light emitting module 1.

Next, a specific configuration of the light emitting module 1 according to the first embodiment will be described.
The light emitting module 1 includes a mounting substrate 11 made of an aluminum substrate, and a semiconductor light emitting element 12 mounted on the mounting substrate 11.

  The semiconductor light emitting element 12 is, for example, an LED (Light Emitting Diode) element that emits light having a wavelength of 450 nm. The semiconductor light emitting element 12 is bonded to the mounting substrate 11 with an adhesive 15 made of silicone resin. The semiconductor light emitting element 12 is wired to the mounting substrate 11 with a gold wire by wire bonding, and is electrically connected to the conductor pattern of the mounting substrate 11. The semiconductor light emitting element 12 is covered with a fluorescent layer 16 made of a silicone resin containing a YAG: Ce phosphor. The phosphor emits light by the light emitted from the semiconductor light emitting element 12. The semiconductor light emitting element 12 and the fluorescent layer 16 are adjusted so that the light emitted from the semiconductor light emitting element 12 and the light emitted from the fluorescent layer 16 are mixed and become white.

  In addition, a control unit 17 is connected to the semiconductor light emitting element 12, and the amount of light emitted from the semiconductor light emitting element 12 can be adjusted by the control unit 17. For example, the control unit 17 controls the current value supplied to the semiconductor light emitting element 12.

The transparent resin member 13 is made of a silicone resin, and a filler 14 having a particle diameter of 20 μm or more is mixed therein. In this example, glass beads having a particle diameter range of 0.106 mm to 0.850 mm are used as the filler 14.
The transparent resin member 13 is light transmissive with respect to light emitted from the semiconductor light emitting element 12 and the fluorescent layer 16. The light emitted from the semiconductor light emitting element 12 and the fluorescent layer 16 preferably has a light transmittance of 60% or more, and more preferably has a light transmittance of 80% or more.
As illustrated, at least a part of the filler 14 may be exposed from the surface of the transparent resin member 13. Further, the filler 14 is 0.01 vol. % To 95 vol. % Or less is included.
The transparent resin member 13 also functions as a cover that protects the semiconductor light emitting element 12.

In order to manufacture the light emitting module 1, first, the semiconductor light emitting element 12 made of an LED element that emits light having a wavelength of 450 nm is bonded to the mounting substrate 11 made of an aluminum substrate with an adhesive 15 made of silicone resin.
Next, the semiconductor light emitting element 12 is electrically connected to the conductor pattern of the mounting substrate 11 with a gold wire by a wire bonder.
Further, a silicone resin containing a YAG: Ce phosphor is potted so as to cover the semiconductor light emitting element 12 to form the fluorescent layer 16.
Thereafter, the transparent resin member 13 is formed by sealing the fluorescent layer 16 with a silicone resin containing a filler 14 made of glass beads having a particle diameter range of 0.106 mm to 0.850 mm. 12 is covered.

  In the light emitting module 1 having the above configuration, when power is supplied to the semiconductor light emitting element 12, the semiconductor light emitting element 12 emits light. The light emitted from the semiconductor light emitting element 12 enters the fluorescent layer 16 and the phosphor in the fluorescent layer 16 emits light. The light emitted from the semiconductor light emitting element 12 and the phosphor is refracted, reflected, or blocked by the filler 14 having a large sensation of 20 μm or more. Thereby, the light emitting module 1 emits white light uniformly uniformly, and a portion having high luminance appears or disappears locally depending on the position of the viewer. Thereby, it seems that the light emitting module 1 emits light with a change, and it is possible to give comfort and a high-class feeling to the person who sees the light emitting module 1.

  Further, by adjusting the amount of light emitted from the semiconductor light emitting element 12 by the control unit 17, the light emitting module 1 can be caused to emit light not only in the position of the viewer but also in time.

  Further, since at least a part of the filler 14 is exposed from the surface of the transparent resin member 13, light is easily emitted from at least a part of the exposed filler 14 to locally generate a high-luminance region. .

  By the way, the content rate of the filler 14 contained in the transparent resin member 13 is 0.01 vol. % To 95 vol. % Or less is preferable. The filler 14 content is 0.01 vol. If it is less than%, it is difficult for the light emitting module 1 to emit light with a change. Moreover, the content rate of the filler 14 is 95 vol. If it is more than%, it is difficult for the light emitting module 1 to emit light uniformly.

  Further, the transparent resin member 13 covering the semiconductor light emitting element 12 also functions as a cover, and the semiconductor light emitting element 12 can be protected.

Next, a modification of the light emitting module 1 according to the first embodiment will be described.
Note that the same components as those of the light emitting module 1 are denoted by the same reference numerals and description thereof is omitted.
FIG. 2 is a diagram illustrating a modification of the first embodiment, and (a) to (d) are schematic cross-sectional views illustrating the configuration of a light emitting module according to each modification.

(Modification 1-1)
As shown in FIG. 2A, in the case of the light emitting module 1A according to the modified example 1-1, the transparent resin member 13 including the filler 14 made of glass beads having a particle diameter range of 0.106 mm to 0.850 mm is used. The fluorescent layer 16 is covered. In the light emitting module 1A, the transparent resin member 13 has a lens shape that protrudes in an arc shape in a sectional view.
Thereby, in this light emitting module 1 </ b> A, the transparent resin member 13 functions as a lens element that controls light emitted from the semiconductor light emitting element 12 and the fluorescent layer 16. Since the transparent resin member 13 is a lens element, the light from the semiconductor light emitting element 12 can be refracted and emitted in a wide range, or condensed and irradiated with light with high luminance in an arbitrary direction.

(Modification 1-2)
As illustrated in FIG. 2B, the light emitting module 1 </ b> B according to the modified example 1-2 includes a film-like transparent resin member 13. The transparent resin member 13 is formed by forming a bead paste made of a silicone resin including a filler 14 into a film shape. The film-like transparent resin member 13 is installed above the semiconductor light emitting element 12 so as to cover the upper surface side of the semiconductor light emitting element 12.
According to this modification 1-2, the structure can be simplified and the light emitting module 1B can be provided at low cost.

(Modification 1-3)
As shown in FIG. 2C, the light emitting module 1C according to the modified example 1-3 includes a film-like transparent resin member 13 as in the light emitting module 1B. In the light emitting module 1 </ b> C, a spacer 21 is provided between the mounting substrate 11 and the transparent resin member 13, and a space is formed between the mounting substrate 11 and the transparent resin member 13 by these spacers 21. . In this space, a diffusion member 22 that diffuses the light emitted from the semiconductor light emitting element 12 and the fluorescent layer 16 is provided. The diffusing member 22 is formed of a transparent resin containing a light diffusing agent such as TiO ₂ .
In addition, in the semiconductor light emitting element 12 shown in FIG.2 (c), the light emitting layer is provided in the surface, and the gold bump as an external electrode is provided in the back surface. Electrical conduction and mechanical connection are achieved by bonding (flip chip bonding) gold bumps provided on the back surface of the semiconductor light emitting element 12 to pads provided on the mounting substrate 11.

  According to the light emitting module 1C according to the modified example 1-3, the diffusion member 22 diffuses the light emitted from the semiconductor light emitting element 12 and the fluorescent layer 16, so that the light is uniformly emitted from the transparent resin member 13 over a wide range. Cheap.

(Modification 1-4)
As shown in FIG. 2D, also in the light emitting module 1 </ b> D according to the modified example 1-4, the spacers 21 are provided between the mounting substrate 11 and the film-like transparent resin member 13. Thus, a space is formed between the mounting substrate 11 and the transparent resin member 13. In this space, a lens member 23 for controlling light emitted from the semiconductor light emitting element 12 and the fluorescent layer 16 is provided.

  According to the light emitting module 1 </ b> D according to the modification 1-4, the light emitted from the semiconductor light emitting element 12 and the fluorescent layer 16 can be controlled by the lens member 23. For example, the lens member 23 can collect light and emit light with high brightness in an arbitrary direction. Alternatively, the lens member 23 can diffuse light and emit light over a wide range.

  Also in the light emitting modules 1A to 1D according to the above modified examples 1-1 to 1-4, when power is supplied to the semiconductor light emitting element 12, white light is emitted from the semiconductor light emitting element 12 and the fluorescent layer 16, and this light is used as a filler. 14 is refracted, reflected, or obstructed, and a region with high luminance appears or disappears locally depending on the position of the viewer. Thereby, it seems that it emits light with a change, and can give a viewer a sense of comfort and luxury.

(Second Embodiment)
A light emitting module according to the second embodiment will be described.
Note that the same components as those of the light emitting module according to the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

FIG. 3 is a schematic cross-sectional view illustrating the configuration of the light emitting module 2 according to the second embodiment.
As shown in FIG. 3, in the light emitting module 2 according to the second embodiment, similar to the light emitting module 1 according to the first embodiment, the particulate filler 14b having a particle diameter of 20 μm or more is included in the transparent resin member 13. ing. The filler 14b of this embodiment is a glass bead having a particle diameter range of 0.106 mm to 0.850 mm. Nickel plating is applied to at least a part of the outer peripheral surface of the glass bead, and the filler 14b has a reflective surface 14a on at least a part of the outer peripheral surface. Thereby, the filler 14b has a reflective function of reflecting light.

In the light emitting module 2 according to the second embodiment, the reflecting surface 14a of the filler 14b reflects the light emitted from the semiconductor light emitting element 12 and the fluorescent layer 16, thereby depending on the position of the person viewing the light emitting module 2. High brightness parts appear and disappear. Thereby, it seems that the light emitting module 2 emits light with a change, and can give comfort and a high-class feeling to the person who sees the light emitting module 2.
Further, in the light emitting module 2, light (for example, sunlight) other than the light emitted from the semiconductor light emitting element 12 is reflected by the reflecting surface 14a of the filler 14b. Appearing or disappearing can give a sense of comfort and luxury to the person viewing the light emitting module 2.

  Also in the second embodiment, instead of the transparent resin member 13 of Modifications 1-1 to 1-4 in the first embodiment, a filler 14b having a reflective surface 14a is included in at least a part of the outer peripheral surface of the glass beads. It can be set as the structure of the following modified examples 2-1 to 2-4 provided with the transparent resin member 13.

  FIG. 4 is a diagram illustrating a modification example of the second embodiment, and (a) to (d) are schematic cross-sectional views illustrating the configuration of a light emitting module according to each modification example.

(Modification 2-1)
As shown to Fig.4 (a), 2 A of light emitting modules which concern on the modification 2-1 are provided with the transparent resin member 13 containing the filler 14b which has the reflective surface 14a. In the present modification, the light can be controlled by the lens-shaped transparent resin member 13, so that the luminance of the light can be increased from the light emitting module 2A and emitted in an arbitrary direction or can be emitted in a wide range.

(Modification 2-2)
As shown in FIG.4 (b), the light emitting module 2B which concerns on modification 2-2 is provided with the film-form transparent resin member 13 containing the filler 14b which has the reflective surface 14a. In this modification, since the structure is simplified, the light emitting module 2B can be provided at low cost.

(Modification 2-3)
As shown in FIG. 4C, the light emitting module 2C according to the modified example 2-3 includes a film-like transparent resin member 13 including a filler 14b having a reflective surface 14a, a semiconductor light emitting element 12, and a fluorescent layer 16. A diffusing member 22 for diffusing light is provided. The light emitted from the transparent resin member 13 can be diffused over a wide range by the diffusion member 22.

(Modification 2-4)
As shown in FIG. 4D, the light emitting module 2D according to the modified example 2-4 emits from the film-like transparent resin member 13 including the filler 14b having the reflective surface 14a, the semiconductor light emitting element 12, and the fluorescent layer 16. The lens member 23 for controlling the emitted light is provided. The lens member 23 can emit light with high luminance from the light emitting module 2D in an arbitrary direction, or can emit light over a wide range.

  Also in the light emitting modules 2A to 2D according to the modified examples 2-1 to 2-4, when power is supplied to the semiconductor light emitting element 12, white light is emitted from the semiconductor light emitting element 12 and the fluorescent layer 16, and the white light is emitted. Is reflected by the filler 14b, and a region with high brightness appears or disappears locally depending on the position of the viewer. Thereby, the light emitting modules 2A to 2D appear to emit light with a change, and can give a viewer a sense of comfort and luxury.

(Third embodiment)
A light emitting module according to a third embodiment will be described.
Note that the same components as those of the light emitting module according to the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

FIG. 5 is a schematic cross-sectional view illustrating the configuration of the light emitting module 3 according to the third embodiment.
As shown in FIG. 5, the transparent resin member 13 of the light emitting module 3 according to the third embodiment includes a silicone resin, a filler 14 made of glass beads having a particle diameter range of 0.106 mm to 0.850 mm, and at least one. More than 25 types of phosphors 25 are included. As the phosphor 25, for example, a CaAlSiN ₃ : Eu phosphor that emits red light, an α-SiAlON: Eu phosphor that emits yellow light, and a β-SiAlON: Eu phosphor that emits green light can be used. In the present embodiment, the transparent resin member 13 has optical transparency with respect to the light emitted from the semiconductor light emitting element 12 and the light emitted from the phosphor 25.

In the light emitting module 3 according to the third embodiment, since the transparent resin member 13 includes at least one type of phosphor 25 together with the filler 14, the light emitting module 3 can easily emit light in a desired color tone. In addition, since the phosphors 25 are widely dispersed, the entire light emitting module 3 emits light uniformly with high luminance.
Also in the light emitting module 3 according to the third embodiment, the filler 14 makes it appear that the light emitting module 3 emits light with a change, and it is possible to give comfort and a high-class feeling to a person viewing the light emitting module 3.

  Also in the third embodiment, instead of the transparent resin member 13 of Modifications 1-1 to 1-4 in the first embodiment, the transparent resin member 13 including at least one kind of phosphor 25 is used together with the filler 14. It can be set as the structure of the following modified examples 3-1 to 3-4 provided.

  FIG. 6 is a diagram illustrating a modification example of the third embodiment, and FIGS. 6A to 6D are schematic cross-sectional views illustrating a configuration of a light emitting module according to each modification example.

(Modification 3-1)
As shown in FIG. 6A, the light emitting module 3 </ b> A according to the modified example 3-1 includes the transparent resin member 13 including the phosphor 25 together with the filler 14. In this modification, since the light can be controlled by the lens-shaped transparent resin member 13, the luminance of the light can be increased from the light emitting module 3A and emitted in an arbitrary direction or in a wide range.

(Modification 3-2)
As illustrated in FIG. 6B, the light emitting module 3 </ b> B according to the modified example 3-2 includes the film-like transparent resin member 13 including the phosphor 25 together with the filler 14. In this modification, since the structure is simplified, the light emitting module 3B can be provided at low cost.

(Modification 3-3)
As illustrated in FIG. 6C, the light emitting module 3 </ b> C according to the modified example 3-3 includes a film-like transparent resin member 13 including a phosphor 25 together with a filler 14, and diffusion that diffuses light from the semiconductor light emitting element 12. And a member 22. The light emitted from the transparent resin member 13 can be emitted in a wide range by the diffusion member 22.

(Modification 3-4)
As illustrated in FIG. 6D, the light emitting module 3 </ b> D according to the modified example 3-4 controls light from the film-shaped transparent resin member 13 including the filler 14 and the phosphor 25 and the semiconductor light emitting element 12. And a lens member 23. The lens member 23 can emit light with high brightness from the light emitting module 3D in an arbitrary direction or can emit light over a wide range.

Also in the light emitting modules 3A to 3D according to the above modified examples 3-1 to 3-4, when power is supplied to the semiconductor light emitting element 12, the phosphor 25 emits light by the light emitted from the semiconductor light emitting element 12. The light emitted from the semiconductor light emitting element 12 and the phosphor 25 is refracted, reflected, or blocked by the filler 14, and a portion with high brightness appears or disappears locally depending on the position of the viewer. In addition, since the transparent resin member 13 contains at least one kind of phosphor 25 together with the filler 14, it is easy to emit light in a desired color tone.
Also in the light emitting modules 3 </ b> A to 3 </ b> D according to the modified examples 3-1 to 3-4, the filler 14 causes a portion with high luminance to appear or disappear locally. Thereby, it seems that it emits light with a change, and can give a viewer a sense of comfort and luxury.

(Fourth embodiment)
Next, a light emitting module according to the fourth embodiment will be described.
Note that the same components as those of the light emitting module according to the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

FIG. 7 is a schematic cross-sectional view illustrating the configuration of the light emitting module 4 according to the fourth embodiment.
As shown in FIG. 7, the light emitting module 4 according to the fourth embodiment includes a plurality (three in this example) of semiconductor light emitting elements 12. These semiconductor light emitting elements 12 are mounted on the mounting substrate 11 at intervals. The mounting substrate 11 is made of a long aluminum substrate on which a plurality of semiconductor light emitting elements 12 can be mounted, and has a conductor pattern that can turn on and off each semiconductor light emitting element 12 individually. . Each semiconductor light emitting element 12 may emit light having the same wavelength, or may emit light having different wavelengths.

  The light emitting module 4 includes a control unit 17 that controls turning on / off of the semiconductor light emitting element 12 and the amount of emitted light. Each semiconductor light emitting element 12 can be turned on and off individually by the control unit 17, and the amount of light emitted from each semiconductor light emitting element 12 can be individually adjusted.

In the light emitting module 4, as in the light emitting module 3 according to the third embodiment, the transparent resin member 13 includes at least one kind of filler 14 made of glass beads having a particle diameter range of 0.106 mm to 0.850 mm. It is comprised with the silicone resin containing the fluorescent substance 25 of this. As the phosphor 25, for example, a CaAlSiN ₃ : Eu phosphor that emits red light, an α-SiAlON: Eu phosphor that emits yellow light, and a β-SiAlON: Eu phosphor that emits green light are used.

  Also in the light emitting module 4 according to the fourth embodiment, due to the filler 14, a region with high luminance appears or disappears locally in the light emitting module 4. Thereby, it seems that the light emitting module 4 emits light with a change, and it is possible to give comfort and luxury to a person who sees the light emitting module 4.

  Furthermore, by supplying power to the semiconductor light emitting elements 12 in order, the place where light with high luminance is emitted moves according to time. Thereby, a different place can be light-emitted with a time change.

  In the light emitting module 4 according to the fourth embodiment, as in the third embodiment, the structure in which the phosphor 25 is included in the transparent resin member 13 together with the filler 14 is described as an example. Similarly to the second embodiment, it may include a filler 14b having a reflective surface 14a.

(Fifth embodiment)
A light emitting module according to the fifth embodiment will be described.
Note that the same components as those of the light emitting module according to the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

FIG. 8 is a schematic cross-sectional view illustrating the configuration of the light emitting module 5 according to the fifth embodiment.
As shown in FIG. 8, in the light emitting module 5 according to the fifth embodiment, a flat filler is used as the filler 14 c included in the transparent resin member 13. This flat filler has a shape with a flatness ratio of 1.2 or more. The flatness referred to here is a value obtained by dividing the diameter of the circumscribed circle of the projected image formed when one filler 14c is projected onto the projection plane by the diameter of the inscribed circle of the projected image.

  In the light emitting module 5 according to the fifth embodiment, since the filler 14c is flat, the light emitted from the semiconductor light emitting element 12 and the fluorescent layer 16 is blocked or reflected depending on the posture of the filler 14c. Cheap. For this reason, it is easy to produce a high-intensity site | part locally, and it is easy to light-emit the light emitting module 5 with a change. Thereby, it seems that light is emitted from different places depending on the viewing angle of the light emitting module 5, and it is possible to give comfort and a high-class feeling to the person who views the light emitting module 5.

  Also in the fifth embodiment, instead of the transparent resin member 13 of Modifications 1-1 to 1-4 in the first embodiment, the transparent resin member 13 includes a filler 14c having a shape with a flatness ratio of 1.2 or more. May be provided. It is good also as a flat-shaped filler provided with the reflective surface like 2nd Embodiment. Moreover, you may comprise so that the transparent resin member 13 may contain the flat filler 14c with the fluorescent substance 25 like 3rd Embodiment. Further, as in the fourth embodiment, a plurality of semiconductor light emitting elements 14 may be covered with an integral transparent resin member 13.

Next, each member of the light emitting module in the above embodiment will be described.
(Semiconductor light emitting device)
The semiconductor light emitting element 12 of the above embodiment is a device that emits light when a voltage is applied to the semiconductor.
The semiconductor 12 may be of any kind as long as it is an intermediate material between a conductor having high electrical conductivity and an insulator that does not conduct electricity. Such materials include gallium arsenide, gallium phosphide, gallium nitrogen, indium phosphide, aluminum gallium nitrogen, indium gallium nitrogen, aluminum indium gallium phosphide, gallium aluminum arsenide, indium gallium arsenide as well as single elements such as silicone, germanium and diamond. And compound semiconductor materials such as indium gallium arsenide phosphorus and zinc oxide. In addition to the inorganic substances described above, organic compounds can also be used.

  The wavelength of light emitted from the semiconductor light emitting element 12 is not particularly limited. Further, the semiconductor light emitting element 12 may be monochromatic light emission or may emit light having a plurality of wavelengths. For example, the semiconductor light emitting elements that emit red / green / blue light may be turned on simultaneously to adjust the light to a desired chromaticity. In order to efficiently emit white light with low power, it is preferable to use a blue light emitting semiconductor light emitting element. Further, it is more preferable to use a semiconductor light emitting element that emits near ultraviolet light in order to obtain a white color with further reduced color unevenness.

Moreover, although the light emitting module which combined the semiconductor light emitting element 12 and fluorescent substance was illustrated in the said embodiment, it is good also as a light emitting module which does not contain fluorescent substance but emits only the light radiate | emitted from the semiconductor light emitting element 12. FIG. In this case, the transparent resin member 13 only needs to be light transmissive with respect to light emitted from the semiconductor light emitting element 12.
Moreover, although the said embodiment demonstrated the example which color-mixes the light radiate | emitted from the semiconductor light-emitting element 12, and the light radiate | emitted from fluorescent substance, and radiate | emits white light, this invention is not limited to this. The light emitted from the semiconductor light emitting element 12 and the light emitted from the phosphor may be mixed to emit light other than white light. In addition, the light emitting module may be configured using a phosphor that emits light having an invisible wavelength such as ultraviolet light from the semiconductor light emitting element 12 and emits visible light by light having this wavelength.

  At least one semiconductor light emitting element 12 is mounted on the mounting substrate 11. All of these semiconductor light emitting elements 12 may be turned on and off collectively. Further, an arbitrary number of semiconductor light emitting elements 12 may constitute a block, and the light may be turned on / off in units of the block. Alternatively, the semiconductor light emitting element 12 can be individually turned on / off. Further, by applying dimming control at the time of turning on / off, it is possible to provide a calm and relaxing light source.

  Further, when the plurality of semiconductor light emitting elements 12 are sequentially turned on and off, the flickering by the filler 14 moves sequentially, so that a light emitting module that produces a novel way of lighting by producing a portion with high brightness in a local place and time Can provide.

(Mounting board)
The material of the mounting substrate 11 of the above embodiment is not limited as long as the semiconductor light emitting element 12 can be mounted. As the mounting substrate 11, a paper-phenol substrate, a glass-epoxy substrate, a ceramics substrate, a polyimide film substrate, a PET film substrate, or other insulating material provided with electrical wiring can be used. Moreover, what electrically wired the semiconductor, such as silicone, gallium nitride, silicon carbide, can also be used. Furthermore, a metal substrate in which electrical wiring is applied to a conductive metal plate via an insulating adhesive can also be used. Examples of the metal include aluminum, copper, iron, nickel, stainless steel, and molybdenum. The mounting substrate 11 may be provided with a through hole penetrating the front surface and the back surface. A plurality of mounting substrates 11 may be stacked.

  In the mounting substrate 11 in the present embodiment, it is preferable that the portion on which the semiconductor light emitting element 12 is mounted and the surface on which the fluorescent layer 16 is disposed have light reflectivity. The mounting substrate 11 more preferably has a reflectance of 70% or more at the wavelength of the secondary light emitted from the phosphor. As a light reflecting material used for the mounting substrate 11, there is a white ink mixed with titanium dioxide particles as a general material. Since this absorbs light on the short wavelength side in the visible light region, for example, when a semiconductor light emitting element that emits light having a wavelength of 400 nm is used, primary light from the semiconductor light emitting element is absorbed. Therefore, the light reflectance of the surface of the mounting substrate is particularly preferably 40% or more with respect to light having a wavelength of 400 nm.

(Transparent resin member)
In the above embodiment, the semiconductor light emitting element 12 is sealed with the transparent resin member 13 in order to protect it from the external environment such as external force and humidity during transportation. It does not matter at all to add various additives such as phosphors and fillers to the transparent resin member 13.

  For the transparent resin member 13, for example, acrylic resin, polycarbonate resin, polycycloolefin resin, polyester resin, epoxy resin, ABS resin, polysilicone resin, polysilsesquioxane, fluorine resin, or the like can be used. Among these, it is particularly preferable that no aromatic substituent is contained in order to transmit light from the semiconductor light emitting device 12.

  The fluorine resin is not particularly limited as long as the fluorine atom is in the molecule, and examples thereof include thermoplastic resins, thermosetting resins, and photocurable resins. For example, polytetrafluoroethylene (PTFE), tetrafluoroethylene / hexafluoropropylene copolymer (FEP), tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (PFA), polychlorotrifluoroethylene (PCTFE), polyfluoride Vinylidene (PVDF), polyvinyl fluoride (PVF), tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer (EPE), ethylene / tetrafluoroethylene copolymer (ETFE), ethylene / chlorotrifluoroethylene copolymer Polymer (ECTFE), fluorine polyimide (FPI), polyperfluoro (4-vinyloxy-1-butene) (BVE), perfluorocyclohexane, tetrafluoroethylene / perf Oro benzodioxole copolymer (TFE / PDD), and the like. Furthermore, the method of manufacturing a transparent resin member from the sol-gel method and polysilazane which used the metal alkoxide as a raw material is mentioned.

Here, there are various raw materials used in the sol-gel method, which can be represented by the general formula (1).
R1nM (OR2) m (1)
R: hydrogen or organic group
M: Element shown below
n: 0 or integer
m: natural number

  By adding water and a catalyst, a sol-gel reaction is caused in a metal alkoxide solvent to produce ceramics.

  Elements that can be used for M in the general formula (1) include Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, Sc, Y, Ti, Zr, Hf, V, Nb, Ta. , Cr, Mo, W, Mn, Fe, Co, Ni, Cu, Zn, Cd, Hg, B, Al, Ga, In, Tl, C, Si, Ge, Sn, Pb, P, As, Sb, Bi , S, Se, Te, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu.

These metal alkoxides are, for example, Al (OC ₃ H ₇ ) ₃ , Ba (OC ₃ H ₇ ) ₂ , La (OC ₃ H ₇ ) ₃ , Pb (OC ₅ H ₁₁ ) ₂ , Si (OC ₂ H ₅ ) ₄ , B (OCH ₃ ) ₃ , Sn (OC ₃ H ₇ ) ₄ , Sr (OC ₃ H ₇ ) ₂ , Ti (OC ₃ H ₇ ) ₄ , Ti (C ₅ H ₁₁ ) ₄ , Zr (OC ₃ H ₇₎ is _{4, Zr (OC 5 H 11} ) 4. Polysilazane is a compound represented by (SiH ₂ NH) n and reacts with moisture in the atmosphere to generate SiO ₂ .

  It is possible to add additives to these transparent resin members 13 as necessary. These transparent resin members 13 can be used as a sealing material in order to protect the semiconductor light emitting element 12 from external force, atmospheric humidity, and ionic impurities. As described in the above-described embodiment, the transparent resin member 13 can be used as a lens for light distribution control such as condensing or diffusing light emitted from the semiconductor light emitting element 12.

(Filler)
The fillers 14, 14 b, 14 c of the above embodiment produce a portion with high luminance at a local place and time. In addition, it is preferable that the fillers 14, 14b, and 14c of the present embodiment do not cause color unevenness. Such a filler 14 may be transparent as long as the composition and type are not limited. At least one filler 14, 14b, 14c can be added. Examples of such fillers 14, 14 b and 14 c that can be used include the following.

The inorganic _{material, SiO 2, CaAl 2 O 4} , CaCO 3, TiO 2, SrTiO 3, Al 2 O 3, LiF, MgF 2, Y 2 O 3, MgO, MgF 2, CaF 2, As 2 S 3, ZnS , NaF, BaF ₂ , PbF ₂ , CdS, ZnSe, NaI, NaCl, KCl, AgCl, TlCl, KBr, AgBr, TlBr, KI, CsBr, CsI, GaN, BN, AlN, C, SiC, and the like.

  Organic materials include polyamide, PTFE (polytetrafluoroethylene), POM (polyacetal copolymer), PC (polycarbonate), PI (polyimide), PPE (polyphenylene ether), PSU (polysulfone), PPS (polyphenylene sulfide), PBT (poly). Butylene terephthalate), PAI (polyamideimide), PAR (polyarylate), PES (polyethersulfone), PEEK (polyetherketone), PEI (polyetherimide), LCP (liquid crystal polymer), PEK (polyetherketone), Epoxy resin, urethane resin, phenol resin, phenol aralkyl resin, furan resin, amino resin, unsaturated polyester resin, diallyl phthalate resin, ADC resin, vinyl ester resin, phenol Shi resins, particles, etc., such as a silicone resin.

  The fillers 14, 14b, and 14c can be subjected to surface treatment such as reflection treatment as necessary. In addition, since the filler 14, 14 b, 14 c changes the traveling direction of light and gives a feeling of sparkling, the size of the filler 14, 14 b, 14 c is the wavelength of light emitted from the semiconductor light emitting element 12 and the phosphor emits. It is better that the light scattering effect by the fillers 14, 14b, 14c is lower than the wavelength of light. Specifically, the particle diameter is preferably 20 μm or more. More preferably, it is 50 μm or more.

  In order to make the change in the traveling direction of light due to the fillers 14, 14b, and 14c random, it is preferable that the shapes of the fillers 14, 14b, and 14c are deviated from a spherical shape. Such shapes include crushed, acicular, mica, star, cube, polyhedron and the like.

  In order to change the traveling direction of light, the refractive index difference between the filler 14 and the transparent resin member 13 is preferably 0.01 or more. In order to change the traveling direction of light, a filler 14 having a light reflecting function may be used. A light reflecting function can be added to the filler 14 by forming a metal thin film or a dielectric thin film on the surface of the inorganic filler or organic filler described above by, for example, plating or vapor deposition. Furthermore, a light reflection function can be added by using metal particles as a filler.

  When such a filler is disposed near the light exiting surface of the light emitting module, a region with high brightness appears or disappears locally, thereby increasing the effect of making it appear to emit light with a change.

(Phosphor)
In the present embodiment, the substance and the composition are not particularly limited as long as the phosphor absorbs primary light emitted from the semiconductor light emitting element and emits light having different wavelengths. The phosphor may be inorganic or organic.

For example, inorganic compounds include oxides and nitrides. Specifically, oxides include Ca ₃ Sc ₂ Si ₃ O ₁₂ : Ce, CaSc ₂ O ₄ : Ce, and Y ₃ Al ₅ O _12. : Ce, (Sr, Ba) ₂ SiO ₄ : Eu, (Si, Al) ₃ (N, O) ₄ : Eu, Ba ₃ Si ₆ O ₁₂ N ₂ : Eu, CaAlSiN ₃ : Eu, BaMgAl ₁₀ O ₁₇ : _{Eu, Y 2 O 2 S:} Eu , and the like.

As nitrides, Y—SiO—N: Ce, La—Si—O—N: Ce, AlN: Eu, SrSi ₆ N ₈ : Eu, SrSi ₉ Al1 ₉ ON ₃₁ : Eu, SrSiAl ₂ O ₃ N ₂ : Eu, SrSi ₅ AlO ₂ N ₇ : Eu, BaSi ₂ O ₂ N ₂ : Eu, BaSi ₂ O ₂ N ₂ : Eu, Sr ₃ Si ₃ Al ₃ O ₂ N ₂₁ : Eu, Sr ₅ Si ₂ 1Al ₅ O ₂ N ₃₅ : Eu, β-SiAlON: Eu, MSi ₂ O ₂ N ₂ : Eu, AlON: Mn, α-SiAlON: Yb, MYSi ₄ N ₇ : Eu, Ba ₃ Si ₆ O ₁₂ N ₂ : Eu , Α-SiAlON: Eu, CaAlSiN ₃ : Ce, CaAlSiN ₃ : Eu, M ₂ Si ₅ N ₈ : Eu, LaSi ₃ N ₅ : Eu, CaSiN ₂ : Eu, CaS iN ₂ : Ce and the like.

  The application destination of the light emitting module according to the present invention is not particularly limited. For example, the light emitting module according to the present invention can be applied to a light source for general illumination, a light source for a vehicle lamp, a light source for a road illumination lamp, and the like.

1, 1A-1D, 2, 2A-2D, 3, 3A-3D, 4, 5: light emitting module, 11: mounting substrate, 12: semiconductor light emitting element, 13: transparent resin member, 14, 14b, 14c: filler, 14a: reflective surface, 16: fluorescent layer, 17: control unit, 25: phosphor

Claims (5)

A mounting substrate;
At least one semiconductor light emitting element mounted on the mounting substrate;
A transparent resin member covering the semiconductor light emitting element;
A light emitting module comprising:
The transparent resin member is light transmissive to light emitted from the light emitting module,
The light emitting module in which the transparent resin member includes a particulate filler having a particle diameter of 20 μm or more, which has light transmittance with respect to light emitted from the light emitting module.   The light emitting module according to claim 1, wherein the filler has a shape with a flatness ratio of 1.2 or more.   The light emitting module according to claim 1, wherein the transparent resin member includes at least one kind of phosphor.   The light emitting module according to any one of claims 1 to 3, wherein at least a part of the filler is exposed from a surface of the transparent resin member. The filler is 0.01 vol. % To 95 vol. % Or less is contained, The light emitting module as described in any one of Claim 1 to 4 contained.

Images