JP2017041577A - Cooler and cooling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a phase change cooler capable of efficiently cooling a plurality of exothermic bodies even when a calorific value of each of the exothermic bodies varies.SOLUTION: A cooler is configured with first heat receiving means 1, second heat receiving means 2, cooling means 3, first coolant holding means 4, second coolant holding means 5, and coolant volume adjustment means 6. The first heat receiving means 1 changes a coolant from liquid into vapor by using heat from a first exothermic body. The second heat receiving means 2 changes the coolant into vapor by using heat from a second exothermic body. The cooling means 3 cools the coolants which are phase-changed into vapor by the first heat receiving means 1 and the second heat receiving means 2 so as to phase-change the coolants into liquid. The first coolant holding means 4 and the second coolant holding means 5 hold the coolants which are phase-changed into liquid and individually supply the first heat receiving means 1 and the second heat receiving means 2 with the coolants. The coolant volume adjustment means 6 adjusts the volumes of the held coolants between the first coolant holding means 4 and the second coolant holding means 5.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a cooling device, and more particularly, to a cooling device using a phase change of a refrigerant.

  2. Description of the Related Art Semiconductor devices, electronic devices, and the like have increased heat generation during operation due to higher density and higher performance. On the other hand, since heat generation causes a malfunction, it is necessary to operate the semiconductor device or the electronic device in a properly cooled state in order to stably operate the semiconductor device or the electronic device. For this reason, various cooling techniques have been developed in order to stably operate semiconductor devices and electronic devices.

  In cooling a semiconductor device or the like, for example, a method is used in which a heat conductor formed of a material having high thermal conductivity is disposed so as to be in contact with the semiconductor device and cooled by flowing a coolant therein. In the method of cooling using a refrigerant, the refrigerant is circulated between a heat receiving part that absorbs heat and a heat radiating part. For example, a pump is used for circulating the refrigerant.

  Also, a thermal siphon type cooling device that does not use a pump or the like for circulating the refrigerant may be used. The thermal siphon method is a cooling method that uses the principle that vapor collects in the upper part with respect to the direction of gravity due to the density difference between the vapor and liquid of the refrigerant generated by boiling cooling. In the thermal siphon system, cooling can be performed without the need for a pump or the like by disposing a heat receiving part at the lower part of the cooling device and a heat radiating part at the upper part. In addition, such a cooling system for circulating the refrigerant uses the heat of evaporation generated when the refrigerant changes phase from liquid to vapor in the heat receiving portion in contact with the heat generator to cool the heat generator, and the refrigerant vapor is made liquid again. It is also called phase change cooling because the phase is changed and circulated.

  Since the number of semiconductor devices and the like used for downsizing and high performance of information processing devices tends to increase, it is desirable that the size of the cooling mechanism is suppressed as much as possible. For this reason, a phase change cooling device that cools a plurality of heating elements with a single device may be used. However, in such a phase change cooling device that cools a plurality of heating elements with a single device, the amount of solvent to be retained when trying to correspond to the maximum heating value for each heat receiving part corresponding to each heating element And the effect of downsizing the device cannot be obtained. For this reason, when cooling a plurality of heating elements with a single cooling device, it is desirable that the refrigerant can be efficiently cooled while suppressing the amount of refrigerant retained, even if the heating value of each heating element is different.

  From such a background, a phase change cooling device having a plurality of heat receiving portions and capable of efficiently cooling a plurality of heating elements has been studied. In such a phase change cooling device, as a technique for efficiently cooling a plurality of heating elements, for example, a technique as disclosed in Patent Document 1 is disclosed.

  Patent Document 1 relates to a phase change cooling device having a plurality of heat receiving portions. The phase change cooling device of Patent Document 1 connects a plurality of heat receiving units that change the phase of a refrigerant from a liquid to a vapor by heat received from a heating element, and a heat dissipation unit that changes the phase of a refrigerant from a vapor to a liquid by heat dissipation. It has a vapor pipe and a liquid pipe. In addition, the phase change cooling device of Patent Document 1 further includes a bypass pipe that connects the heat receiving units to each other. In patent document 1, when there exists a heat generating body with a high operation rate, in addition to the liquid pipe connected to the heat radiating part, the heat receiving unit corresponding to the heat generating element with a high operation rate from the heat receiving part adjacent through the bypass pipe The refrigerant is supplied to the section. According to Patent Document 1, by providing such a configuration, the refrigerant supply performance is improved, and good cooling performance can be maintained even when the amount of heat generated suddenly changes.

International Publication No. 2011-122332

  However, the technique of Patent Document 1 is not sufficient in the following points. In the phase change cooling device of Patent Document 1, the heat receiving portions are connected by a bypass pipe, and the refrigerant is supplied between the heat receiving portions. For this reason, the phase change cooling device of Patent Document 1 needs to include a bypass pipe between the heat receiving portions provided in a portion in contact with the heating element. In order to obtain a sufficient supply speed when the refrigerant is supplied between the heat receiving portions of the refrigerant, the bypass pipe needs to have a sufficient cross-sectional area with respect to the length of the pipe. However, depending on the arrangement of the heating elements, there is a possibility that the bypass pipe becomes long and a sufficient cross-sectional area cannot be secured. Further, depending on the configuration of the heating element, it may happen that the bypass pipe cannot be disposed between the heat receiving portions. In such a case, there is a possibility that a sufficient amount of refrigerant cannot be supplied to the heat receiving unit corresponding to the heat generating element having a high heat generation amount, and the heat generating element cannot be efficiently cooled. Therefore, the technique of Patent Document 1 is not sufficient as a technique for efficiently cooling the heating element even when the amount of heat generation for each heating element varies.

  In order to solve the above-described problems, an object of the present invention is to provide a cooling device that can efficiently cool a plurality of heating elements even when the amount of heat generation for each heating element varies.

  In order to solve the above problems, the cooling device of the present invention includes a first heat receiving means, a second heat receiving means, a cooling means, a first refrigerant holding means, a second refrigerant holding means, and a refrigerant. A quantity adjusting means is provided. The first heat receiving means changes the phase of the refrigerant from liquid to vapor by the heat of the first heating element. The second heating means changes the phase of the refrigerant from liquid to vapor by the heat of the second heating element. The cooling means cools the refrigerant whose phase has been changed to vapor by the first heat receiving means and the second heat receiving means and changes the phase to liquid. The first refrigerant holding means holds the refrigerant whose phase has been changed to a liquid and supplies the refrigerant to the first heat receiving means. The second refrigerant holding means holds the refrigerant whose phase has been changed to a liquid and supplies the refrigerant to the second heat receiving means. The refrigerant amount adjusting means adjusts the amount of the refrigerant held between the first refrigerant holding means and the second refrigerant holding means.

  In the cooling method of the present invention, the phase of the refrigerant is changed from liquid to vapor by the heat of the first heating element, and the phase of the refrigerant is changed from liquid to vapor by the heat of the second heating element. The cooling method of the present invention cools the refrigerant that has been phase-changed to vapor and changes the phase to liquid, and holds the refrigerant that has been phase-changed to liquid as the first refrigerant and the second refrigerant, respectively. The cooling method of the present invention adjusts the amount of the refrigerant retained between the first refrigerant and the second refrigerant. In the cooling method of the present invention, the first refrigerant is supplied as a refrigerant for cooling the first heating element, and the second refrigerant is supplied as a refrigerant for cooling the second heating element.

  According to the present invention, even when the amount of heat generated for each heating element varies, a plurality of heating elements can be efficiently cooled.

It is a figure which shows the outline | summary of a structure of the 1st Embodiment of this invention. It is a perspective view which shows the outline | summary of a structure of the 2nd Embodiment of this invention. It is a top view which shows the outline | summary of a structure of the 2nd Embodiment of this invention. It is a front view which shows the outline | summary of a structure of the 2nd Embodiment of this invention. It is a figure which shows a part of structure of the apparatus of the 2nd Embodiment of this invention. It is a figure which shows the example of the state of the refrigerant | coolant in the apparatus of the 2nd Embodiment of this invention. It is a figure which shows the example of the state of the refrigerant | coolant in the apparatus of the 2nd Embodiment of this invention. It is a figure which shows the example of the state of the refrigerant | coolant in the apparatus of the 2nd Embodiment of this invention. It is a figure which shows the example of the state of the refrigerant | coolant in the apparatus of the 2nd Embodiment of this invention. It is a figure which shows the example of the state of the refrigerant | coolant in the apparatus of the 2nd Embodiment of this invention. It is a figure which shows the example of the state of the refrigerant | coolant in the apparatus of the 2nd Embodiment of this invention. It is a figure which shows the example of the state of the refrigerant | coolant in the apparatus of the 2nd Embodiment of this invention. It is a perspective view which shows the outline | summary of a structure of the 3rd Embodiment of this invention. It is a top view which shows the outline | summary of a structure of the 3rd Embodiment of this invention. It is a front view which shows the outline | summary of a structure of the 3rd Embodiment of this invention.

(First embodiment)
A first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram showing an outline of the configuration of the cooling device of the present embodiment. The cooling device of the present embodiment includes a first heat receiving means 1, a second heat receiving means 2, a cooling means 3, a first refrigerant holding means 4, a second refrigerant holding means 5, and a refrigerant amount adjustment. Means 6 are provided.

  The first heat receiving means 1 changes the phase of the refrigerant from liquid to vapor by the heat of the first heating element. The second heat generating means 2 changes the phase of the refrigerant from liquid to vapor by the heat of the second heat generating element. The cooling means 3 cools the refrigerant whose phase has been changed to steam by the first heat receiving means 1 and the second heat receiving means 2 and changes the phase to liquid. The first refrigerant holding unit 4 holds the refrigerant whose phase has been changed to a liquid and supplies the refrigerant to the first heat receiving unit 1. The second refrigerant holding unit 5 holds the refrigerant whose phase has been changed to a liquid and supplies the refrigerant to the second heat receiving unit 2. The refrigerant amount adjusting unit 6 adjusts the amount of refrigerant held between the first refrigerant holding unit 4 and the second refrigerant holding unit 5.

  In the cooling device of the present embodiment, the refrigerant amount adjusting means 6 adjusts the amount of refrigerant held between the first refrigerant holding means 4 and the second refrigerant holding means 5. Further, the refrigerant whose amount is adjusted between the first refrigerant holding means 4 and the second refrigerant holding means 5 is supplied to the first heat receiving means 1 and the second heat receiving means 2, respectively, so that the first The heating element and the second heating element are cooled. By adopting such a configuration, even when the amount of heat generated by either the first heating element or the second heating element suddenly fluctuates, the refrigerant is moved from the side with the larger amount of refrigerant to the side with the smaller amount of refrigerant. Can be efficiently cooled. Further, in the cooling device of the present embodiment, it is not necessary to arrange the refrigerant amount adjusting means 6 in the vicinity of the heating element, so that the degree of freedom in design is high and a supply speed when adjusting the amount of refrigerant is sufficiently ensured. It becomes easy. As a result, the cooling device of the present embodiment can efficiently cool a plurality of heating elements even when the amount of heat generation for each heating element varies.

(Second Embodiment)
A second embodiment of the present invention will be described in detail with reference to the drawings. FIG. 2 is a perspective view showing an outline of the configuration of the cooling device of the present embodiment. FIG. 3 is a plan view showing an outline of the configuration of the cooling device of the present embodiment. FIG. 3 is a view of the cooling device according to the present embodiment as viewed from above. FIG. 4 is a front view showing an outline of the configuration of the cooling device of the present embodiment.

  The cooling device of this embodiment is used as a cooling device of a phase change cooling system that cools a heating element such as an electronic component by boiling and liquefying a refrigerant and circulating the refrigerant. For example, a semiconductor device is used as the electronic component.

  The phase change type cooling device of the present embodiment includes a heat receiving unit 11, a heat radiating unit 12, a vapor mixing chamber 13, a refrigerant chamber 14, a vapor pipe 15, a liquid pipe 16, an axial fan 17, and heat dissipation. Fins 18 are provided. The heat receiving unit 11 further includes a steam outlet 21 and a liquid inlet 22. The refrigerant chamber 14 further includes a refrigerant exchange hole 23 and a liquid outlet 24. A plurality of heat receiving portions 11 and refrigerant chambers 14 are provided. The refrigerant chamber 14 is provided corresponding to the heat receiving unit 11. The refrigerant chamber 14 and the heat receiving unit 11 are connected by independent liquid pipes 16. The cooling device of the present embodiment includes two heat receiving portions 11 and two refrigerant chambers 14 corresponding to the respective heat receiving portions 11. Three or more heat receiving units 11 and refrigerant chambers 14 may be provided.

  The heat receiving unit 11 has a function of cooling the electronic component by heat absorption when the refrigerant evaporates. The heat receiving part 11 is a hollow chamber formed of a metal having high thermal conductivity such as copper or aluminum. The heat receiving unit 11 includes a steam outlet 21 on the upper surface. The hollow part of the heat receiving part 11 is connected to the steam pipe 15 via the steam outlet 21. Further, the heat receiving unit 11 includes a liquid inlet 22 on the lower side of the side surface. The liquid inlet is provided at a low position on the side surface of the heat receiving unit 11 in order to use gravity for introducing the refrigerant into the heat receiving unit 11. The heat receiving unit 11 is connected to the liquid pipe 16 via the liquid inlet 22.

  The heat receiving unit 11 is provided so as to be in contact with an electronic component which is a heating element at the bottom surface. The heat receiving unit 11 is in contact with the electronic component via a low heat resistance grease, a heat receiving sheet, or the like.

  A liquid refrigerant is introduced from the liquid inlet 22 into the heat receiving portion 11. The liquid refrigerant evaporates by the heat of the electronic component and becomes a vapor and is discharged from the vapor outlet 21. The heat receiving unit 11 cools the electronic component by heat absorption when the liquid refrigerant undergoes phase change to vapor, that is, heat of evaporation. The vaporized refrigerant is sent to the vapor mixing chamber 13 through the vapor pipe 15.

  The two heat receiving portions 11 of the present embodiment correspond to the first heat receiving means 1 and the second heat receiving means 2 of the first embodiment, respectively.

  The heat dissipating unit 12 has a function of cooling and liquefying vapor, that is, a refrigerant in a gaseous state. The heat dissipating part 12 includes heat dissipating fins 18 inside. Refrigerant vapor is introduced into the heat radiating section 12 from the vapor mixing chamber 13. The refrigerant vapor introduced into the heat radiating section 12 is liquefied by removing heat from the air flowing between the heat radiating fins 18. The refrigerant liquefied inside the heat radiating unit 12 is dropped into the refrigerant chamber 14 provided in the lower part of the heat radiating unit 12. The heat radiating section 12 is provided so as to correspond to the heat receiving section 11 and the refrigerant chamber 14, respectively. In the cooling device of this embodiment, two heat receiving portions 11 and two refrigerant chambers 14 are provided, and thus two heat radiating portions 12 are provided. The heat radiation part 12 of this embodiment is corresponded to the cooling means 3 of 1st Embodiment.

  The steam mixing chamber 13 has a function of mixing a refrigerant in a gaseous state sent from each heat receiving unit 11 via the steam pipe 15. The steam mixing chamber 13 is connected to a steam pipe 15 connected to each heat receiving unit 11. That is, the steam mixing chamber 13 is provided as one common space. The refrigerant in the gaseous state sent from each vapor pipe 15, that is, the vapor of the refrigerant mixes with each other inside the vapor mixing chamber 13. The refrigerant vapor present inside the vapor mixing chamber 13 is introduced into the heat radiating section 12. The refrigerant vapor flows from the vapor mixing chamber 13 to the heat dissipating part 12 as the pressure in the heat dissipating part 12 decreases due to the phase change in which the refrigerant liquefies.

  The efficiency of liquefying the refrigerant is improved by mixing the steam sent from each heat receiving part 11 in the steam mixing chamber 13 and cooling it by each heat radiating part 12. The mixed vapor is liquefied in each heat dissipating section 12 and the refrigerant is supplied to each other in the refrigerant chamber 14 so that the cooling can be efficiently performed even when the amount of heat generated by the heating element varies.

  The refrigerant chamber 14 has a function of holding a liquid refrigerant dripping from the heat radiating unit 12. The refrigerant chamber 14 has a function of adjusting the amount of refrigerant held between the adjacent refrigerant chambers 14. The refrigerant chamber 14 receives and holds the liquid refrigerant liquefied and dropped by the heat radiating unit 12. The refrigerant chamber 14 includes a liquid outlet 24 at the bottom or the lower part of the side surface. The refrigerant liquid held in the refrigerant chamber 14 is supplied to the heat receiving unit 11 via the liquid outlet 24 and the liquid pipe 16. The refrigerant chamber 14 is provided for each heat receiving unit 11 to which liquid refrigerant is supplied.

  The two refrigerant chambers 14 of the present embodiment correspond to the first refrigerant holding means 4 and the second refrigerant holding means 5 of the first embodiment, respectively.

  FIG. 5 schematically shows the positional relationship between the heat receiving unit 11 and the refrigerant chamber 14 of the present embodiment. The heat receiving unit 11 is installed at a position lower than the refrigerant chamber 14. Since the heat receiving part 11 is at a lower position, the liquid refrigerant is supplied from the refrigerant chamber 14 to the heat receiving part 11 through the liquid pipe 16 by gravity. The height difference between the heat receiving unit 11 and the refrigerant chamber 14 is set in a range where the liquefied refrigerant is held in both the heat receiving unit 11 and the refrigerant chamber 14 in a steady state.

  The amount of the refrigerant held in the heat receiving unit 11 and the refrigerant chamber 14 is such that the water level of the refrigerant becomes the same height in the heat receiving unit 11 and the refrigerant chamber 14 if the atmospheric pressure is the same. When the electronic component is being cooled, the refrigerant is boiling in the heat receiving unit 11, so that the air pressure in the heat receiving unit 11 is higher than that in the refrigerant chamber 14. In order to reduce the influence of the difference in atmospheric pressure, it is desirable to make the area of the heat receiving portion 11 smaller than the area of the refrigerant chamber 14.

  The refrigerant chamber 14 includes a refrigerant exchange hole 23 on a side surface with the adjacent refrigerant chamber 14. Between the refrigerant chambers 14, the amount of refrigerant is adjusted through the refrigerant exchange hole 23 so that the liquid level of the refrigerant being held is uniform. The refrigerant exchange hole 23 is opened at a predetermined height from the bottom surface of the refrigerant chamber 14. Therefore, when the liquid level of the refrigerant is lower than the predetermined height at which the refrigerant exchange hole 23 is formed, the refrigerant does not move to the other refrigerant chamber 14.

  When the amount of the refrigerant held in the refrigerant chamber 14 exceeds a certain level and the liquid level of the refrigerant exceeds a predetermined height, the refrigerant is adjacent to the refrigerant via the refrigerant exchange hole 23 in the refrigerant chamber 14. Supplied to the chamber 14. For this reason, when the operating rate of the electronic component of one system is increased and the amount of heat generation is increased, if there is a margin in the amount of refrigerant in the heat receiving part 11 and the refrigerant chamber 14 of the other system, the refrigerant exchange hole 23 is provided. Cooling can be performed efficiently by the refrigerant supplied through the air.

  The predetermined height at which the refrigerant exchange hole 23 is formed is a refrigerant that can cool the electronic component that is in contact with the heat receiving portion 11 of one system without supply of the refrigerant from the other system. It is set to satisfy the amount of. For example, the predetermined height is set to a height at which the amount of refrigerant existing in the heat receiving unit 11, the refrigerant chamber 14, and the liquid pipe 16 of one system is about one third of the total refrigerant amount.

  A plurality of refrigerant exchange holes 23 may be provided. Further, instead of the refrigerant exchange hole 23, the refrigerant may be supplied to each other by not forming a partition between the refrigerant chambers 14 in a region having a predetermined height or higher. Moreover, the refrigerant | coolant exchange hole 23 of this embodiment is corresponded to the refrigerant | coolant adjustment means 6 of 1st Embodiment.

  When three or more heat receiving units 11 and the refrigerant chambers 14 are provided, the refrigerant exchange holes 23 may be provided between the adjacent refrigerant chambers 14. For example, one refrigerant chamber 14 can be configured to be connected to the left and right refrigerant chambers 14 via the refrigerant exchange holes 23, respectively. Moreover, it is good also as a structure by which the refrigerant | coolant chamber 14 of the both ends of right and left is connected by piping etc. When four or more heat receiving portions 11 and the refrigerant chamber 14 are provided, there may be a portion where the refrigerant exchange hole 23 is not formed between the adjacent refrigerant chambers 14. For example, in a configuration including four refrigerant chambers 14, there may be a configuration in which there are two sets of the refrigerant chambers 14 connected to only one of the refrigerant chambers 14 via the refrigerant exchange hole 23.

  The steam pipe 15 has a function as a pipe for sending a gaseous refrigerant from the heat receiving unit 11 to the steam mixing chamber 13. The steam pipe 15 connects the upper part of the heat receiving part 11 and the side surface of the steam mixing part 13. That is, the steam pipe 15 is provided for each heat receiving unit 11. The steam pipe 15 has an inclined structure and is formed so that the steam flow is not affected by the refrigerant liquefied midway.

  The liquid pipe 16 has a function as a pipe for sending a liquid state refrigerant between the refrigerant chamber 14 and the heat receiving unit 11. The liquid pipe 16 connects the liquid inlet 22 at the lower side of the heat receiving part 11 and the liquid outlet 24 at the bottom of the refrigerant chamber 14. The liquid pipe 16 is connected to the bottom surface of the refrigerant chamber 14 and the heat receiving part 11 so as to have a gentle inclination. The refrigerant | coolant currently hold | maintained at the refrigerant | coolant chamber 14 is supplied to the heat receiving part 11 using gravity. The liquid pipe 16 is provided for each combination of the refrigerant chamber 14 and the heat receiving unit 11.

  The axial fan 17 has a function of sending air to the heat radiating fins 18 of the heat radiating unit 12. The axial fan 17 sends air to the radiating fin 18 by the rotation of the fan. The rotational speed of the axial fan 17 is controlled according to the temperature of the heat receiving unit 11. For example, when the heat generation amount is large, the rotational speed of the axial flow fan 17 is set high. By increasing the rotational speed of the fan, the amount of air flowing through the radiating fins 18 is increased, and the speed of liquefaction of the refrigerant is improved. Therefore, cooling can be performed efficiently.

  When the rotational speed of the axial fan 17 is controlled according to the temperature of the heat receiving unit 11, a temperature sensor is installed in the heat receiving unit 11, and the rotational speed is controlled based on the temperature measured by the temperature center. A control unit is provided. The rotational speed of the axial fan 17 may be always constant while the electronic component is operating. Further, instead of a configuration including a temperature sensor, a configuration in which a load of an electronic component or the like is input to the control unit of the axial fan 17 may be employed.

  The heat radiating fins 18 are provided in the heat radiating part 12 and have a function of cooling the inside of the heat radiating part 12. The heat radiating fins 18 are cooled by the air sent from the axial fan 17, thereby cooling the inside of the attached heat radiating portion 12.

  The operation of the phase change cooling device of the present embodiment will be described. When the electronic component starts operation, the temperature of the electronic component gradually increases. When the temperature of the electronic component rises, the refrigerant in each heat receiving part 11 that is in contact with the electronic component that is a heating element starts to vaporize, that is, evaporate. The electronic component is cooled by the heat of evaporation when the refrigerant evaporates.

  Since the vapor of the evaporated and vaporized refrigerant has a small specific gravity, it proceeds from the vapor outlet 21 provided at the upper part of the heat receiving unit 11 to the vapor pipe 15. The refrigerant vapor that has entered the steam pipe 15 passes through the steam pipe 15 having a gentle slope and enters the steam mixing chamber 13.

  The refrigerant vapor that has entered the vapor mixing chamber 13 through each vapor pipe 15 is mixed with the refrigerant vapor that has entered the vapor mixing chamber 13 from the other heat receiving section 11. The mixed refrigerant vapor is supplied to each heat radiating section 12. The refrigerant vapor supplied to the heat radiating section 12 is deprived of heat and liquefied by the air flowing between the heat radiating fins 18. Air flowing between the radiating fins 18 is generated by the axial fan 17. When the refrigerant returns from the vapor to the liquid, the volume decreases, and the pressure in the heat radiating unit 12 decreases. When the pressure in the heat dissipating unit 12 decreases, the refrigerant vapor is further supplied from the vapor mixing chamber 13.

  The supply speed of the steam from the steam mixing chamber 13 to the heat radiating unit 12 varies depending on the magnitude of the pressure drop in the heat radiating unit 12. Therefore, by changing the rotational speed of the axial fan 17, the supply of the vapor of the refrigerant and the liquefaction speed can be changed. When there is a difference in the amount of heat generated for each electronic component, it is possible to make a difference in the amount of refrigerant dropped into the refrigerant chamber 14 by making a difference in the rotational speed of the corresponding axial fan 17. For example, by increasing the rotational speed of the axial fan 17 corresponding to an electronic component that generates a large amount of heat, the amount of refrigerant that is liquefied and dropped into the refrigerant chamber 14 is increased, and the amount of refrigerant supplied to the heat receiving unit 11 is increased. Can do.

  The refrigerant liquefied by the heat radiating unit 12 is dropped into the refrigerant chambers 14 respectively provided at the lower part of the heat radiating unit 12. The refrigerant liquid dripped into the refrigerant chamber 14 is held in the refrigerant chamber 14. When there is a difference in the amount of refrigerant held between the refrigerant chambers 14, the amount of refrigerant is adjusted via the refrigerant exchange hole 23 provided between the refrigerant chambers 14.

  An example of the operation when adjusting the amount of refrigerant through the refrigerant exchange hole 23 will be described. When the refrigerant in the heat receiving unit 11 boils and vaporizes and the amount of refrigerant in the heat receiving unit 11 decreases, the refrigerant held in the refrigerant chamber 14 flows out to the heat receiving unit 11. If the refrigerant is continuously supplied from the heat radiating unit 12 and the refrigerant exchange hole 23 to the refrigerant chamber 14 at a faster speed than the refrigerant moves from the refrigerant chamber 14 to the heat receiving unit 11, the liquid of the refrigerant held in the refrigerant chamber 14. The face rises. When the liquid level of the refrigerant reaches the height of the refrigerant exchange hole 23, the refrigerant flows into and out of the adjacent refrigerant chamber 14 via the refrigerant exchange hole 23.

  When the liquid level of the adjacent refrigerant chamber 14, that is, the counterpart refrigerant chamber 14 is lower than the refrigerant exchange hole 23, the refrigerant flows out to the counterpart refrigerant chamber 14. When the liquid level of the counterpart refrigerant chamber 14 is higher than the refrigerant exchange hole 23, the refrigerant flows in and out through the refrigerant exchange hole 23 until the respective refrigerant amounts are balanced.

  The liquid refrigerant held in the refrigerant chamber 14 is supplied to the heat receiving unit 11 via the liquid pipe 16. The refrigerant supplied to the heat receiving unit 11 is vaporized by heat generation of the electronic component, and the refrigerant circulation operation described above is repeated.

  The amount of refrigerant held in the refrigerant chamber 14 varies depending on the relationship between the amount of refrigerant held in the adjacent refrigerant chamber 14 and the amount of refrigerant held in the heat receiving unit 11. FIG. 6 schematically shows a state in which the amount of refrigerant held in the heat receiving unit 11 is balanced with the amount held in the refrigerant chamber 14. In the state of FIG. 6, the refrigerant does not move between the refrigerant chamber 14 and the heat receiving unit 11.

  FIG. 7 shows a state in which the amount of refrigerant held in the heat receiving unit 11 is smaller than in the state of FIG. 6 where the amount of refrigerant held in the heat receiving unit 11 and the refrigerant chamber 14 is balanced. . In the state of FIG. 7, the refrigerant mainly moves from the refrigerant chamber 14 to the heat receiving unit 11 via the liquid pipe 16. The movement of the refrigerant from the refrigerant chamber 14 to the heat receiving unit 11 continues until, for example, the amount of refrigerant held in the heat receiving unit 11 and the refrigerant chamber 14 is balanced.

  FIG. 8 shows a state where the amount of refrigerant held in the heat receiving unit 11 is larger than that in the state of FIG. 6 where the amount of refrigerant held in the heat receiving unit 11 and the refrigerant chamber 14 is balanced. In the state of FIG. 8, the refrigerant mainly moves from the heat receiving portion 11 to the refrigerant chamber 14 via the liquid pipe 16. This state occurs, for example, due to a decrease in the amount of refrigerant in the refrigerant chamber 14 due to outflow to the adjacent refrigerant chamber 14 via the refrigerant exchange hole 23. The refrigerant flows out of the refrigerant exchange hole 23 into the adjacent refrigerant chamber 14 because the amount of refrigerant held in the heat receiving portion 11 and the refrigerant chamber 14 is larger than the amount of refrigerant held in the adjacent system. It is when it is held. The refrigerant that flows out is a surplus located above the refrigerant exchange hole 23, and even if the refrigerant moves from the heat receiving part 11 to the refrigerant chamber 14, there is no shortage of refrigerant in the heat receiving part 11.

  FIG. 9 shows a state in which the amount of refrigerant held in the refrigerant chamber 14 adjacent to the refrigerant chamber 14 has not reached the position of the refrigerant exchange hole 23. In the state of FIG. 9, the refrigerant does not flow in and out through the refrigerant exchange hole 23.

  FIG. 10 shows a state where the amount of one of the refrigerant chambers 14 adjacent to the refrigerant chamber 14 exceeds the position of the refrigerant exchange hole 23. In the state of FIG. 10, the refrigerant moves from the refrigerant chamber 14 having a large amount of refrigerant to the refrigerant chamber 14 having a small amount mainly through the refrigerant exchange hole 23.

  FIG. 11 shows a state in which the amount of refrigerant held in the refrigerant chamber 14 adjacent to the refrigerant chamber 14 exceeds the position of the refrigerant exchange hole 23 and the refrigerant amounts are balanced with each other. Since the adjacent refrigerant chambers 14 are connected by the refrigerant exchange hole 23 and the vapor mixing chamber 13 above the heat dissipating unit 12, a difference in atmospheric pressure hardly occurs. Therefore, at the time of equilibrium, the height of the coolant level in the coolant chamber 14 is substantially the same. In the state of FIG. 11, the refrigerant does not flow in and out through the refrigerant exchange hole 23.

  FIG. 12 shows a state where the amount of refrigerant held in the refrigerant chamber 14 adjacent to the refrigerant chamber 14 exceeds the position of the refrigerant exchange hole 23 and the refrigerant amount is not balanced. In the state of FIG. 12, the refrigerant moves mainly from the refrigerant chamber 14 having a large amount of refrigerant through the refrigerant exchange hole 23 to the refrigerant chamber 14 having a small amount of refrigerant.

  As described above, the amount of refrigerant is adjusted through the refrigerant exchange hole 23 according to the amount of refrigerant held in each heat receiving portion 11 and the refrigerant chamber 14 and the difference in amount of refrigerant between the refrigerant chambers 14. Thus, even if the heat generation amount of the electronic component changes, it can be sufficiently cooled. Further, by adjusting the amount of refrigerant between the refrigerant chambers 14, it is possible to suppress the amount of refrigerant as much as possible assuming an increase in the amount of heat generated by the electronic components, and thus it is possible to efficiently perform cooling. .

  In the cooling device of the present embodiment, when the amount of refrigerant evaporated in the heat receiving unit 11 increases due to heat generation of the electronic component and the amount of refrigerant in the refrigerant chamber 14 decreases, the refrigerant in the other refrigerant chamber 14 has a predetermined amount. When there are more, the refrigerant is supplied through the refrigerant exchange hole 23. By adjusting the amount of refrigerant in this way, even when the amount of heat generated by an electronic component supported by any one of the heating elements 11 suddenly fluctuates, the refrigerant is changed from the side with the larger amount of retention to the side with the smaller amount. By supplying, cooling can be performed efficiently.

  Further, in the cooling device of the present embodiment, the amount of refrigerant is adjusted between the adjacent refrigerant chambers 14 instead of in the vicinity of the heating element such as an electronic component. High degree of freedom. For example, in the cooling device of this embodiment, the amount of the refrigerant between the refrigerant chambers 14 can be adjusted at a sufficient speed by appropriately designing the height and opening diameter of the refrigerant exchange hole 23. In addition, since the cooling device of the present embodiment does not use a bypass pipe or the like, even when there are other parts between the electronic parts that are the heating elements, the amount of the refrigerant is set at a sufficient speed between the refrigerant chambers 14. The refrigerant can be supplied to the heat receiving portion 11 by adjusting the temperature of the heat receiving portion 11. Therefore, in the cooling device of the present embodiment, it is possible to avoid a state in which the refrigerant is lost in the heat receiving unit 11 and the refrigerant chamber 14 regardless of the arrangement of electronic components, and stable cooling can be performed. As described above, the cooling device of the present embodiment can efficiently cool a plurality of heating elements even when the amount of heat generated for each heating element such as an electronic component varies.

(Third embodiment)
A third embodiment of the present invention will be described in detail with reference to the drawings. FIG. 13 is a perspective view showing an outline of the configuration of the cooling device of the present embodiment. FIG. 14 is a plan view showing an outline of the configuration of the cooling device of the present embodiment. FIG. 14 is a view of the cooling device according to the present embodiment as viewed from above. FIG. 15 is a front view showing an outline of the configuration of the cooling device of the present embodiment.

  In the cooling device of the second embodiment, the axial flow fan is provided for each heat dissipating unit 12, but the cooling device of the present embodiment is characterized by including a common axial fan instead of each heat dissipating unit 12. . The cooling device of this embodiment is a phase change type cooling device similar to the cooling device of the second embodiment.

  The cooling device of the present embodiment includes a heat receiving part 11, a heat radiating part 12, a steam mixing chamber 13, a refrigerant chamber 14, a steam pipe 15, a liquid pipe 16, a radiating fin 18, and an axial fan 19. ing. The heat receiving unit 11 further includes a steam outlet 21 and a liquid inlet 22. The refrigerant chamber 14 further includes a refrigerant exchange hole 23 and a liquid outlet 24. Heat receiving portion 11, heat radiating portion 12, vapor mixing chamber 13, refrigerant chamber 14, vapor pipe 15, liquid pipe 16, heat radiating fin 18, vapor outlet 21, liquid inlet 22, refrigerant exchange hole 23, and liquid flow of this embodiment The configuration and function of the outlet 24 are the same as those of the same name in the second embodiment.

  The axial fan 19 has a function of sending air to the heat radiating fins 18 respectively provided in the heat radiating unit 12. In the cooling device of this embodiment, the vapor of the refrigerant flowing between the heat radiation fins 18 of each heat radiation portion 12 is cooled and liquefied by the air sent from one axial fan 19.

  The operation of the cooling device of this embodiment is the same as that of the cooling device of the second embodiment. The axial fan 19 rotates at the same speed while the apparatus is operating, and sends air to the heat radiating fins 18. In addition, the rotational speed of the axial fan 19 does not always rotate at the same speed, but the temperature of the heat receiving unit 11 is monitored by a temperature sensor so that the rotational speed corresponds to the maximum temperature or the average temperature. It is good also as a structure controlled.

  The cooling device of this embodiment has the same effect as the cooling device of the second embodiment. Moreover, since the cooling device of this embodiment is not provided with the axial fan 19 for every heat radiating part 12, but is provided in common, an apparatus structure can be simplified.

  In the second and third embodiments, examples of cooling a semiconductor device or the like as an electronic component have been described. The phase change cooling devices of the second and third embodiments can be used not only for cooling electronic components such as semiconductor devices but also for devices such as information processing devices, communication devices, projectors, and displays.

  In the cooling devices of the second and third embodiments, a plurality of electronic components are cooled by a plurality of heat receiving units. Instead of such a configuration, a plurality of locations of one electronic component or electronic device may be cooled by each heat receiving unit.

  The cooling devices of the second and third embodiments are provided with a steam mixing chamber, and after the refrigerant vapor sent from each heat receiving part is mixed, it is cooled and liquefied by each heat radiating part. Instead of such a configuration, each steam pipe may be connected to each heat radiating section without providing a steam mixing chamber. By adopting a configuration without the steam mixing chamber, the configuration of the cooling device can be simplified.

  The cooling devices of the second and third embodiments cool the radiating fins of the radiating unit using an axial fan. It may replace with such a structure and may cool a thermal radiation part using ventilation systems other than an axial flow fan. Further, the heat radiating unit may be cooled using another refrigerant, or may be cooled by natural cooling without blowing air or the like.

DESCRIPTION OF SYMBOLS 1 1st heat receiving means 2 2nd heat receiving means 3 Cooling means 4 1st refrigerant | coolant holding means 5 2nd refrigerant | coolant holding means 6 Refrigerant amount adjustment means 11 Heat receiving part 12 Radiating part 13 Steam mixing chamber 14 Refrigerant chamber 15 Steam pipe 16 Liquid pipe 17 Axial fan 18 Radiation fin 19 Axial fan 21 Steam outlet 22 Liquid inlet 23 Refrigerant exchange hole 24 Liquid outlet

Claims (10)

First heat receiving means for changing the phase of the refrigerant from a liquid to a vapor by the heat of the first heating element;
A second heat receiving means for changing the phase of the refrigerant from a liquid to a vapor by the heat of the second heating element;
Cooling means for cooling the refrigerant phase-changed to vapor by the first heat-receiving means and the second heat-receiving means to change the phase to a liquid;
First refrigerant holding means for holding the refrigerant phase-changed to a liquid and supplying the refrigerant to the first heat receiving means;
Second refrigerant holding means for holding the refrigerant whose phase has been changed to a liquid and supplying the refrigerant to the second heat receiving means;
A refrigerant amount adjusting means for adjusting an amount of the refrigerant held between the first refrigerant holding means and the second refrigerant holding means;
A cooling device comprising:   The refrigerant amount adjusting means is held when the liquid level of the refrigerant held by at least one of the first refrigerant holding means or the second refrigerant holding means exceeds a predetermined height. The cooling device according to claim 1, wherein the refrigerant is supplied from a larger amount to a smaller amount.   The cooling means changes the phase of the refrigerant vapor into a liquid and supplies the first refrigerant to the first refrigerant holding means, and changes the phase of the refrigerant vapor into a liquid and holds the second refrigerant. The cooling apparatus according to claim 1, further comprising a second cooling unit that supplies the cooling unit.   The cooling device according to claim 3, further comprising a blowing unit that cools the vapor of the refrigerant of the first cooling unit and the second cooling unit by blowing air.   The air blowing means includes first air blowing means for cooling the refrigerant vapor by blowing in the first cooling means, and second air blowing means for cooling the refrigerant vapor by blowing in the second cooling means. The cooling device according to claim 4.   The apparatus further comprises control means for controlling the first blowing means based on the amount of heat generated by the first heating element, and for controlling the second blowing means based on the amount of heat generated by the second heating element. The cooling device according to claim 5, wherein A first electronic component;
A second electronic component;
The cooling device according to any one of claims 1 to 6,
With
The cooling system cools the first electronic component as the first heating element and cools the second electronic component as the second heating element.
The phase of the refrigerant is changed from liquid to vapor by the heat of the first heating element,
Phase change of the refrigerant from liquid to vapor by the heat of the second heating element;
Each of the refrigerants phase-changed to vapor is cooled and phase-changed to liquid,
Holding the refrigerant phase-changed into a liquid as the first refrigerant and the second refrigerant,
Adjusting the amount of refrigerant held between the first refrigerant and the second refrigerant;
Supplying the first refrigerant as the refrigerant for cooling the first heating element;
A cooling method, wherein the second refrigerant is supplied as the refrigerant for cooling the second heating element. The first refrigerant is changed to a liquid phase by blowing a first wind to the refrigerant vapor,
The blowing method according to claim 8, wherein the second refrigerant is made to change into a liquid phase by blowing a second wind to the refrigerant vapor.   The air flow rate of the first wind is controlled based on the heat generation amount of the first heat generating body, and the air flow rate of the second wind is controlled based on the heat generation amount of the second heat generating body. The cooling method according to claim 9.

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