JP2017037926A - Imprint device and method, and method for producing articles - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology for highly accurately deforming a shape of a pattern in a mold without being affected by an individual difference in outer shape of the mold, a change in measurement environment or the like, in an imprint device.SOLUTION: An imprint device includes: a holding part 5 for holding a mold; and a mold deformation mechanism 3 for applying a force to a side surface of the mold held in the holding part to deform the mold. The mold deformation mechanism includes: contact members 10a-10n in contact with the side surface of the mold; a first actuator for driving the contact member in a direction of applying a force to the mold; a measurement part for measuring displacement of the mold; and an adjustment mechanism capable of adjusting a measurement position of the measurement part for measuring displacement of the mold.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an imprint apparatus and method, and an article manufacturing method.

  In an imprint apparatus that forms an imprint material on a substrate using a mold (mold) in which a pattern is formed, a plurality of pressure fingers for applying pressure to the mold from the side surface direction are arranged around the mold. Is done. By applying an external force from the side surface of the mold with the pressure finger, the pattern shape formed on the mold is changed. The pattern shape affects the overlay accuracy of the pattern formed in advance on the substrate and the pattern formed by the imprint apparatus. Therefore, the pattern shape needs to be corrected with high accuracy of several nm or less in order to cope with the miniaturization of the pattern. Therefore, it is necessary to control the driving amount of the pressure finger with high accuracy on the order of nanometers.

  Patent Document 1 discloses a method in which an actuator that applies a compressive force to a side surface of a mold is provided between the side surface of the mold and the support structure, and a drive amount is controlled by a force sensor provided between the support structure and the actuator. Disclosure. Patent Document 2 discloses a technique for measuring a change in the shape of a mold using a plurality of position sensors that are mechanically independent from a mechanism that imparts the change in shape.

Japanese Patent No. 4688872 Japanese Patent No. 5165030

  However, in Patent Document 1, when the driving amount is controlled by the force sensor, the value of the force sensor is affected by the contact friction between the mold and the driving unit. Further, the value of the sensor changes due to the force generated by the imprint operation. For these reasons, a measurement error of the driving amount occurs, and it is difficult to change the pattern shape with high accuracy.

  In Patent Document 2, when the mold is changed and the outer shape of the mold changes, the measurement part of the mold is outside the measurement range of the position sensor and may not be measured. In general, there is a trade-off relationship that the measurement range is narrowed when the measurement accuracy of the measuring instrument is increased, and the measurement accuracy is lowered when the measurement range is widened. When a non-contact displacement sensor is used, the measurement environment may affect the measurement value. For example, when the displacement is measured using a spectroscopic interferometer or the like, the optical path length changes due to a change in the refractive index of air near the measurement unit, resulting in a measurement error.

  Therefore, the present invention provides a technique that can deform the shape of a pattern formed on a mold with high accuracy without being affected by individual differences in the outer shape of the mold, changes in measurement environment, and the like.

  According to one aspect of the present invention, there is provided an imprint apparatus that forms a pattern on an imprint material on a substrate using a mold, the holding unit holding the mold, and the mold held by the holding unit A mold deformation mechanism that applies a force to the side surface of the mold to deform the mold, and the mold deformation mechanism drives a contact member that contacts the side surface of the mold and a direction in which the force is applied to the mold. An imprint apparatus comprising: a first actuator; a measurement unit that measures the displacement of the mold; and an adjustment mechanism that can adjust the measurement position for measuring the displacement of the mold. Provided.

  According to the present invention, the shape of the pattern formed on the mold can be deformed with high accuracy without being affected by individual differences in the outer shape of the mold, changes in the measurement environment, and the like.

FIG. 3 is a diagram illustrating a configuration example of an imprint apparatus according to the embodiment. The figure which shows the structural example of the mold correction mechanism in 1st Embodiment. The flowchart which shows the operation | movement sequence of the mold correction mechanism in embodiment. The figure which shows the structural example of the mold correction mechanism in 2nd Embodiment. The figure which shows the structural example of the mold correction mechanism in 3rd Embodiment. The figure explaining deformation correction of a mold.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited to the following embodiment, It shows only the specific example advantageous for implementation of this invention. Moreover, not all combinations of features described in the following embodiments are indispensable for solving the problems of the present invention.

<First Embodiment>
FIG. 1A shows the configuration of the imprint apparatus 100 according to this embodiment. The light source 1 irradiates the mold 2 with ultraviolet rays during the imprint process. The mold 2 is a mold in which a predetermined pattern 2 a is formed on the surface facing the substrate 6. The mold 2 is made of a material that transmits ultraviolet rays, such as quartz. The mold base 4 in the mold holding unit 5 attracts and holds the mold 2 by vacuum suction force or electrostatic force. The mold head 21 in the mold holding unit 5 includes a mold driving mechanism (not shown) that supports the mold base 4 and drives the mold base 4 toward the substrate 6 for an imprint operation. The mold 2 can be replaced using a mold changer (not shown).

  The substrate stage 7 holds the substrate 6 by, for example, vacuum suction. The dispenser 9 applies an imprint material on the substrate by, for example, an inkjet method. The imprint material is, for example, a photocurable composition having a property of being cured by receiving ultraviolet light, and can be appropriately selected depending on the manufacturing process of the semiconductor device.

  The imprint apparatus 100 irradiates the imprint material with light (ultraviolet rays) from the light source 1 in a state where an imprint material (not shown) applied on the substrate 6 is in contact with the surface of the pattern 2 a of the mold 2. Thus, an imprint process for curing the imprint material is performed. The outline of the imprint process is as follows.

  First, an imprint material is applied onto the substrate 6 by the dispenser 9. Next, the substrate 6 on which the imprint material is applied is moved under the mold 2 by driving the substrate stage 7. Next, the imprint material is filled in the concave portions of the pattern 2 a formed in the mold 2 by a pressing die that brings the imprint material on the substrate 6 into contact with the mold 2. Thereafter, ultraviolet light is emitted from the light source 1 to cure the imprint material. The emitted ultraviolet light passes through the mold 2 and is irradiated onto the imprint material, whereby the imprint material is cured on the substrate 6. After the imprint material is solidified, the mold 2 is released from the cured imprint material (release). Thus, the imprint material on the substrate 6 is formed according to the pattern 2a. In this specification, a series of operations including the above-described pressing and releasing is referred to as an imprint operation. The imprint operation may be realized by moving the mold 2, but may be realized by moving the substrate stage 7, or both of them may be moved. By driving the substrate stage 7, the mold can be pressed at a predetermined position of the substrate 6. After the pattern is formed, the substrate 6 is moved so that the next mold position (shot area) is below the dispenser 9. In this way, by repeating the imprint operation while changing the shot area, a large number of patterns can be formed on one substrate 6. It is possible to form another pattern by exchanging the mold 2 with the mold changer. The contents of the imprint process are as described above.

  If air bubbles remain between the pattern 2a and the imprint material on the surface of the shot area during the stamping, the pattern to be formed is distorted, and a transfer defect occurs depending on the degree. Therefore, the generation of bubbles is suppressed by replacing the air in the space between the mold 2 and the substrate 6 with a gas such as helium or carbon dioxide that is highly soluble in the imprint material. Therefore, in the present embodiment, a gas supply unit 26 that supplies a gas for replacing air between the mold 2 and the substrate 6 is provided in the mold base 4.

  The imprint apparatus 100 presses the side surface of the mold 2 held by the mold holding unit 5 to deform the mold 2, thereby correcting the shape of the pattern 2a formed on the mold (mold deformation mechanism). Have The mold correction mechanism has pressure fingers 10 as a plurality of contact members that are in contact with the side surface of the mold 2 in order to apply pressure to the mold 2 from the side surface direction. FIG. 1B is a view of the mold 2 and its periphery viewed from below in the imprint apparatus 100. The pressure fingers 10 are arranged so as to surround the mold 2 having a rectangular outer shape from four directions, and the end surfaces of the pressure fingers (10a to 10n) pressurize the side surfaces of the mold 2 at independent points. Note that the present invention is not limited to a specific number of pressure fingers.

  FIG. 6 is a schematic view of the surface of the pattern 2a formed on the mold 2 as viewed from the substrate 6 side, and shows a method of correcting the shape distortion of the pattern 2a. The pattern 2a on the mold 2 is positioned relative to the substrate 6 in a strained state. Here, a plurality of pressure fingers 10 are arranged on the side surfaces of the four sides of the mold 2. Each of the pressure fingers 10 has an ability to apply a force to the side surface of the mold 2 with a force of up to 1000 N, for example.

  The mold 2 is generally made of a crystal material such as quartz glass. However, if a force of 1000 N is applied, for example, deformation of several ppm can be caused. Therefore, it is possible to correct the distortion of the mold 2 by controlling the pressure applied by the pressure finger 10. For example, consider a pattern 2a deformed into a barrel shape as shown in FIG. In this case, as shown in FIG. 6B, the side surface of the mold 2 is pressed by the pressure finger 10 in such a distribution that the mold 2 is deformed into a pincushion mold. Thereby, the mold outer shape after pressurization is deformed from the rectangle 28a to the pincushion die 28b, and the shape of the pattern 2a can be corrected from a curve to a straight line. Further, the correction of the pattern shape is not limited to correction from a curve as shown in FIGS. 6A and 6B to a straight line. For example, it is also necessary to change the shape of the mold in accordance with the shape of the shot region previously formed on the substrate. According to the pressure finger 10 of the present embodiment, if the shot region has a distortion, the pattern portion of the mold can be distorted in accordance with the distortion. Such a pressure finger 10 may require precise drive control of 1 nm or less.

  In FIG. 1A, the control unit 25 is electrically connected to each of the above-described units, and executes the process related to imprinting by controlling the above-described units. The control unit 25 can be configured by a computer including a memory such as a CPU, a RAM, and a ROM.

  FIG. 2 shows a detailed configuration example of the mold correction mechanism configured for each of the pressure fingers 10. The mold correction mechanism 3 includes the above-described pressure finger 10, a first actuator 11 that drives the pressure finger 10, a support member 12 that supports the first actuator 11, and a displacement measurement unit 13 that measures the displacement of the mold 2. Including. In the present embodiment, the mold correction mechanism 3 includes a second actuator 14 that drives the displacement measuring unit 13. The pressure finger 10 is in contact with the side surface of the mold 2, and transmits the compressive force applied by the extension of the first actuator 11 to the mold 2. The first actuator 11 can be composed of, for example, a piezo element, a pneumatic actuator, a linear motion motor, or the like.

  The mold correction mechanism 3 has an adjustment mechanism that allows the displacement measurement unit 13 to adjust the measurement position for measuring the displacement of the mold 2. In the present embodiment, the adjustment mechanism includes a second actuator 14 for moving the displacement measuring unit 13 between the measurement position and the retracted position. The displacement measuring unit 13 is held by the second actuator 14 without substantially contacting the pressure finger 10. The displacement measuring unit 13 can measure the position of the mold 2 and its deformation by measuring the center of the pressing unit of the mold 2 without contacting the pressing finger 10. The displacement measuring unit 13 may be configured to measure the displacement by any method of non-contact or contact with the mold 2. When the displacement measuring unit 13 is a non-contact type, for example, an optical type, eddy current type, or capacitance type displacement meter can be used. When the displacement measuring unit 13 is a contact method, for example, the displacement measurement can be performed by measuring the deformation generated in the displacement measuring unit 13 with a strain gauge or the like. Moreover, you may be comprised with the displacement measurement part 13 load cell. The displacement measuring unit 13 can be moved to the measurement position of the mold 2 by the second actuator 14. The second actuator 14 can be constituted by, for example, a piezo element, a pneumatic actuator, a linear motion motor, or the like.

  FIG. 3 is a flowchart showing an operation sequence of the mold correction mechanism. Operation control corresponding to this flowchart is executed by the control unit 25. First, the mold 2 is mounted on the mold base 4 by the mold changer (S101). In this state, as shown in FIG. 2A, the pressure finger 10 and the displacement measuring unit 13 of the mold correction mechanism 3 are not in contact with the mold 2. The mounted mold 2 is centered at an appropriate position by using the first actuator 11 built in the mold correction mechanism 3 (S102).

  Next, as shown in FIG. 2B, the displacement measuring unit 13 for measuring the shape of the mold 2 is moved to a predetermined measurement position by the second actuator 14 (S103). The measurement position may be a position where the measurement value of the displacement measurement unit 13 becomes a predetermined value, for example. In this case, the second actuator 14 is moved to a position where the measurement value of the displacement measurement unit 13 becomes a predetermined value while monitoring the measurement value of the displacement measurement unit 13. The target value of the measurement value of the displacement measuring unit 13 needs to be determined so that the deformation amount required when the mold 2 is deformed by the first actuator is included in the measurable range of the displacement measuring unit 13. Further, it is desirable that the deformation region of the mold 2 is included in a region where the measurement accuracy of the displacement measuring unit 13 is good. Alternatively, for example, the outer shape of the mold 2 may be measured in advance, and the displacement measuring unit 13 may be moved to an appropriate position based on the obtained outer shape information. In this case, it is not necessary to monitor the measurement value of the displacement measuring unit 13 during movement, and the position may be determined by the output of the second actuator 14.

  Next, the displacement measuring unit 13 moved by the second actuator 14 is fixed at the measurement position (S104). The imprint apparatus 100 includes, for example, a fixing unit 24 that fixes the displacement measuring unit 13 at a measurement position. For example, if the second actuator 14 is an actuator whose position changes according to the driver output, such as a piezo element or a pneumatic actuator, the driver output is kept constant. If the actuator requires an output only during driving, such as a linear motor, the driver output is turned off. Then, the displacement measuring unit 13 is mechanically held by the fixing unit 24 and fixed so that the displacement measuring unit 13 does not move with respect to the mold base 4. The fixing by the fixing unit 24 can be realized by, for example, a mechanical clamp, vacuum suction, electrostatic suction, or the like. By fixing the displacement measuring unit 13 moved to an appropriate position with respect to the mold base 4, the displacement measuring unit 13 can more accurately measure the displacement of the mold 2. In addition, since the displacement measuring unit 13 measures displacement instead of force, the displacement measuring unit 13 is less susceptible to hysteresis due to frictional force generated between the mold 2 and the mold base 4 or between the mold 2 and the pressure finger 10. Therefore, the shape of the mold 2 can be measured with higher accuracy.

  Next, as shown in FIG. 2 (c), the first actuator 11 is driven and the side surface of the mold is pressed by the pressure finger 10 to correct the pattern 2 a formed on the mold 2 to have a desired shape. (S105). Specifically, the control unit 25 drives the first actuator 11 so that the output of the displacement measurement unit 13 becomes a target value. At this time, the displacement measuring unit 13 can measure the displacement of the mold 2 without contacting the pressure finger 10. In this step, the displacement measuring unit 13 is fixed and does not move with respect to the mold base 4.

  After the shape of the mold 2 is corrected in S105, an imprint operation is performed (S106). When the imprint operation is completed, it is determined whether there is a next shot (S107). If there is a next shot, the process returns to S105, and the process is repeated for the next shot. When all the shots are completed, the fixing (24) by the fixing unit 24 of the displacement measuring unit 13 is released, and the displacement measuring unit 13 is retracted from the mold 2 by the second actuator as shown in FIG. Thereafter, the mold 2 is recovered (S109).

  In the present embodiment, the first actuator 11 is driven so that the pattern 2a formed on the mold 2 has a desired shape after the displacement measuring unit 13 is moved to an appropriate position. Absent. For example, the first actuator 11 is driven for each pattern formed on the substrate 6 to correct the pattern shape on the mold 2. Therefore, when it is necessary to adjust the position of the displacement measuring unit 13 when the actuator 11 is driven, the driving of the first actuator 11 is temporarily stopped. Based on the output of the displacement measuring unit 13 at that time, the second actuator may be driven to move the displacement measuring unit 13 to an appropriate position, and the first actuator 11 may be driven again.

Second Embodiment
FIG. 4 shows a configuration example of the mold correction mechanism in the second embodiment. In FIG. 4, the displacement measuring unit 13 is held by a linear guide 16 that guides the movement between the measurement position and the retracted position. The first actuator 11 drives the pressure finger 10 as in the first embodiment. Here, in this embodiment, the pressure finger 10 and the displacement measuring unit 13 are connected by a connecting member 15. That is, one end of the connecting member 15 is joined to the pressure finger 10 and the other end is joined to the displacement measuring unit 13. Therefore, the displacement measuring unit 13 is interlocked with the pressure finger 10 along the linear guide 16 by the driving force of the first actuator. However, the connecting member 15 is a member having sufficiently lower rigidity than the pressure finger 10.

  In the state of S101 and S102 in FIG. 3, as shown in FIG. 4A, the pressure finger 10 and the displacement measuring unit 13 are not in contact with the mold 2. This state indicates that the displacement measuring unit 13 is retracted to the retracted position. When the first actuator 11 is driven in S103, the displacement measuring unit 13 is interlocked with the pressure finger 10 by the connecting member 15 along the linear guide 16 and comes into contact with the side surface of the mold 2 (FIG. 4B). ). Here, the displacement measuring unit 13 is fixed to the linear guide 16 by the fixing unit 24 (S104). In step S105, the first actuator 11 is further driven to correct the mold shape (FIG. 4C). At this time, since the connecting member 15 has sufficiently lower rigidity than the pressure finger 10 as described above, when the pressure finger 10 presses the mold 2, the connecting member 15 is elastically deformed according to the pressing force. Therefore, the displacement measuring unit 13 does not unfix the fixing unit 24 and pressurizes the side surface of the mold more than necessary, or the pressing of the pressing finger 10 to the mold 2 is not hindered.

  In the present embodiment, the displacement measuring unit 13 is in contact with the mold 2 by the connecting member 15, but a non-contact type measuring device is used for the displacement measuring unit 13, and the output of the measuring device becomes a predetermined value. The displacement measuring unit 13 may be configured to be fixed to the linear guide 16. Thereby, it is possible to measure with high accuracy using a non-contact type measuring instrument.

<Third Embodiment>
In the case of using a non-contact optical measuring instrument as the displacement measuring unit 13 in the first embodiment or the second embodiment described above, an appropriate fixed position of the displacement measuring unit 13 will be described.

  When performing the imprint operation of S106, a gas such as helium (He) can be supplied from the gas supply unit 26 between the mold 2 and the substrate 6. However, when the gas diffuses from between the mold 2 and the substrate 6 to the vicinity of the displacement measuring unit 13 and the gas concentration in the vicinity of the measuring unit varies, the optical path length changes. When the spatial distance is s and the refractive index is n, the optical path length L is expressed as L = n × s, and when the refractive index changes by Δn, the measurement error due to the change in the optical path length becomes ΔL = Δn × s. For example, when the He (n = 1.0003535) concentration in the air (n = 1.000292) changes by 1%, the refractive index change becomes Δn = 2.57e-6. Accordingly, when the spatial distance s is 1 mm, for example, a measurement error of 2.57 nm occurs. Such a measurement error may be unacceptable in the mold correction mechanism 3 that requires highly accurate correction of several nm or less. This measurement error is proportional to the spatial distance s, that is, the distance between the displacement measuring unit 13 and the mold 2. Therefore, in the present embodiment, the displacement measurement unit 13 is fixed at a position where the distance from the mold 2 is the shortest within the measurement range of the displacement measurement unit 13.

  For example, when the first actuator is driven as shown in FIG. 2, the measurement value of the displacement measurement unit 13 increases when the displacement measurement unit 13 is moved to the shortest measurable distance of the displacement measurement unit 13 in S 103. It may be fixed after being driven by. On the other hand, when the first actuator is driven, the measurement value of the displacement measurement unit 13 decreases. In S103, the actual measurement value is added to the shortest measurable distance of the displacement measurement unit 13. The displacement measuring unit 13 may be moved and fixed as described above. In both cases, the fixed position is determined so that the distance between the displacement measuring unit 13 and the mold 2 does not fall outside the measurement range when the first actuator is driven.

  As described above, when a non-contact type measuring instrument is used for the displacement measuring unit 13, the distance between the displacement measuring unit 13 and the mold 2 is made as short as possible within the measuring range of the displacement measuring unit 13, so that the vicinity of the measuring unit Measurement errors caused by fluctuations in gas concentration can be reduced.

<Fourth embodiment>
In each of the embodiments described above, the displacement measuring unit 13 is disposed at a position for measuring the side surface of the mold 2. However, the measurement position may not be a side surface but a surface facing the mold base 4 of the mold 2 as shown in FIG. In this case, the second actuator 14 is driven in the Z direction, and the displacement measuring unit 13 contacts the mold 2. The displacement measuring unit 13 drives the first actuator 11 in contact with the mold 2 to measure the displacement in the Z direction and the X direction of the mold 2 that is attracted and fixed to the mold base 4.

  FIG. 5B shows another embodiment. The mold 2 has a concave cavity 2b formed on the back surface of the mold (surface opposite to the pattern 2a of the mold 2) in order to deform the pattern 2a portion. In this case, the displacement measuring unit 13 may be arranged so as to perform a measuring operation on the position of the inner side surface of the cavity 2b as illustrated.

<Production method>
The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The manufacturing method includes a step of forming a pattern on a substrate using an imprint apparatus. Further, the manufacturing method may include other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resin peeling, dicing, bonding, packaging, etc.) for processing the substrate on which the pattern is formed. . The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

<Other embodiments>
The present invention supplies a program that realizes one or more functions of the above-described embodiments to a system or apparatus via a network or a storage medium, and one or more processors in a computer of the system or apparatus read and execute the program This process can be realized. It can also be realized by a circuit (for example, ASIC) that realizes one or more functions.

DESCRIPTION OF SYMBOLS 100: Imprint apparatus, 1: Light source, 2: Mold, 5: Mold holding part, 6: Substrate, 7: Substrate stage, 9: Dispenser, 10: Pressure finger, 24: Fixed part, 26: Gas supply part

Claims (13)

An imprint apparatus for forming a pattern on an imprint material on a substrate using a mold,
A holding part for holding the mold;
A mold deformation mechanism for deforming the mold by applying a force to a side surface of the mold held by the holding portion;
With
The mold deformation mechanism is
A contact member that contacts a side surface of the mold;
A first actuator that drives the contact member in a direction to apply force to the mold;
A measuring unit for measuring the displacement of the mold;
An adjustment mechanism capable of adjusting the measurement position for measuring the displacement of the mold;
An imprint apparatus comprising:   The imprint apparatus according to claim 1, wherein the mold deformation mechanism includes a fixing unit that fixes the measurement unit at the measurement position.   The imprint apparatus according to claim 1, wherein the adjustment mechanism includes a second actuator for moving the measurement unit between the measurement position and the retracted position.   The adjustment mechanism includes a linear guide that guides the movement of the measurement unit between the measurement position and the retracted position, and moves the measurement unit along the linear guide by driving the first actuator. The imprint apparatus according to claim 1, wherein the imprint apparatus is characterized by the following.   The said adjustment mechanism contains the connection member which connects the said contact member and the said measurement part, and the said measurement part interlock | cooperates with the said contact member by the drive of a said 1st actuator. Imprint device.   After the measurement unit is moved to the measurement position by driving the first actuator, when the first actuator is further driven to apply a force to the side surface via the contact member, the connecting member is The imprint apparatus according to claim 5, wherein the imprint apparatus is elastically deformed according to a force applied to the.   The imprint apparatus according to claim 1, wherein the measurement unit is a contact-type measurement unit that performs a measurement operation in contact with the mold.   The imprint apparatus according to claim 1, wherein the measurement unit is a non-contact type measurement unit that performs a measurement operation without being in contact with the mold.   The imprint apparatus according to claim 8, wherein the measurement position is a position where a distance from the mold is shortest within a measurement range of the measurement unit.   The imprint apparatus according to claim 1, wherein the measurement unit is arranged to perform a measurement operation on a position of a side surface of the mold at the measurement position. The mold has a concave cavity formed on a surface opposite to the pattern,
The imprint apparatus according to claim 1, wherein the measurement unit is arranged to perform a measurement operation with respect to a position of an inner side surface of the cavity. A control unit for controlling the operation of the mold deformation mechanism;
Before the operation of forming the pattern, the control unit
Move the measurement unit to the measurement position,
The imprint apparatus according to any one of claims 1 to 11, wherein the first actuator is driven so that a measurement value of the measurement unit moved to the measurement position becomes a target value. A step of performing pattern formation on a substrate using the imprint apparatus according to any one of claims 1 to 12,
Processing the substrate on which the pattern has been formed in the step;
A method for producing an article comprising:

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