JP2017036508A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2017036508A5 JP2017036508A5 JP2016185949A JP2016185949A JP2017036508A5 JP 2017036508 A5 JP2017036508 A5 JP 2017036508A5 JP 2016185949 A JP2016185949 A JP 2016185949A JP 2016185949 A JP2016185949 A JP 2016185949A JP 2017036508 A5 JP2017036508 A5 JP 2017036508A5
- Authority
- JP
- Japan
- Prior art keywords
- mass
- copper alloy
- less
- chromium
- layered object
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 claims 6
- 239000000843 powder Substances 0.000 claims 6
- 229910052804 chromium Inorganic materials 0.000 claims 4
- 239000011651 chromium Substances 0.000 claims 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 4
- 239000012535 impurity Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 101700034707 IACS Proteins 0.000 claims 1
- 230000000996 additive Effects 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
Claims (4)
0.22質量%以上0.51質量%以下のクロムと、
0質量%以上0.1質量%未満の不純物元素と、
残部の銅と
からなり、
前記不純物元素はクロム以外の元素である、銅合金粉末。 A copper alloy powder for additive manufacturing,
0.22 mass% or more and 0.51 mass% or less of chromium;
0% by mass or more and less than 0.1% by mass of impurity elements;
Ri copper and Tona of the balance,
The copper alloy powder , wherein the impurity element is an element other than chromium .
前記粉末層において、所定位置の前記銅合金粉末を固化させることにより、造形層を形成する第2工程と、を含み、
前記第1工程と前記第2工程とを順次繰り返し、前記造形層を積層することにより、積層造形物を製造する、積層造形物の製造方法。 A first step of forming a powder layer containing the copper alloy powder according to claim 1 ;
A second step of forming a modeling layer by solidifying the copper alloy powder at a predetermined position in the powder layer,
A manufacturing method of a layered object, wherein a layered object is manufactured by sequentially repeating the first step and the second step and laminating the modeling layer.
前記銅合金は、
0.22質量%以上0.51質量%以下のクロムと、
0質量%以上0.1質量%未満の不純物元素と、
残部の銅と
からなり、
前記不純物元素はクロム以外の元素であり、
前記銅合金の理論密度に対する相対密度が96%以上100%以下であり、
導電率が30%IACS以上である、積層造形物。 A layered object composed of a copper alloy,
The copper alloy is
0.22 mass% or more and 0.51 mass% or less of chromium ;
0% by mass or more and less than 0.1% by mass of impurity elements;
The balance of copper and
The impurity element is an element other than chromium,
The relative density to the theoretical density before kidou alloy is 100% or less than 96%
Conductivity is 30% IACS or more, layered manufacturing thereof.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016185949A JP6716410B2 (en) | 2016-09-23 | 2016-09-23 | Copper alloy powder, manufacturing method of layered product and layered product |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016185949A JP6716410B2 (en) | 2016-09-23 | 2016-09-23 | Copper alloy powder, manufacturing method of layered product and layered product |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015097974A Division JP6030186B1 (en) | 2015-05-13 | 2015-05-13 | Copper alloy powder, manufacturing method of layered object, and layered object |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017036508A JP2017036508A (en) | 2017-02-16 |
JP2017036508A5 true JP2017036508A5 (en) | 2018-08-02 |
JP6716410B2 JP6716410B2 (en) | 2020-07-01 |
Family
ID=58048163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016185949A Active JP6716410B2 (en) | 2016-09-23 | 2016-09-23 | Copper alloy powder, manufacturing method of layered product and layered product |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6716410B2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6532497B2 (en) * | 2017-04-21 | 2019-06-19 | Jx金属株式会社 | Copper powder, method for producing the same, and method for producing a three-dimensional object |
JP6491289B2 (en) * | 2017-09-06 | 2019-03-27 | 電気興業株式会社 | Method for producing metal product |
JP7317177B2 (en) * | 2018-03-27 | 2023-07-28 | Jx金属株式会社 | Coated metal powder, method for producing the same, and laminate-molded article using the metal powder |
JP7109222B2 (en) * | 2018-03-27 | 2022-07-29 | Jx金属株式会社 | Coated metal powder, method for producing the same, and laminate-molded article using the metal powder |
CA3092015C (en) | 2018-12-27 | 2024-02-13 | Jx Nippon Mining & Metals Corporation | Pure copper powder having si coating and production method thereof, and additive manufactured object using said pure copper powder |
JP6722837B1 (en) * | 2018-12-27 | 2020-07-15 | Jx金属株式会社 | Manufacturing method of layered product using pure copper powder having Si coating |
US20200324372A1 (en) * | 2019-04-12 | 2020-10-15 | Hobart Brothers Llc | Laser additive manufacturing and welding with hydrogen shield gas |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3428442A (en) * | 1966-09-22 | 1969-02-18 | Eutectic Welding Alloys | Coated spray-weld alloy powders |
JPS61163223A (en) * | 1985-01-14 | 1986-07-23 | Sumitomo Electric Ind Ltd | Manufacture of copper-chromium alloy product |
JP4213134B2 (en) * | 2004-04-15 | 2009-01-21 | Jfe精密株式会社 | Cu-Cr alloy and method for producing Cu-Cr alloy |
JP2016053198A (en) * | 2014-09-04 | 2016-04-14 | 株式会社コイワイ | Metal molded product and metal powder for metal molded product |
-
2016
- 2016-09-23 JP JP2016185949A patent/JP6716410B2/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2017036508A5 (en) | ||
FI3315229T4 (en) | Use of a copper alloy powder, method of producing additively-manufactured article, and additively-manufactured article | |
JP2015226935A5 (en) | ||
JP2017036484A5 (en) | ||
EP3680043A4 (en) | Ni-BASED CORROSION-RESISTANT ALLOY POWDER FOR DEPOSITION MODELING, MULTILAYER MODEL USING THIS POWDER, AND METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR PRODUCTION DEVICES | |
JP2013232935A5 (en) | ||
WO2015093903A8 (en) | Metal encapsulant having good heat dissipation properties, method of manufacturing same, and flexible electronic device encapsulated in said metal encapsulant | |
JP2016529732A5 (en) | ||
WO2014204570A3 (en) | Regenerating an additively manufactured component | |
JP2013138189A5 (en) | Method for manufacturing semiconductor device | |
SG10201803987PA (en) | Interconnect wires including relatively low resistivity cores | |
JP2014063662A5 (en) | Connector terminal, connector terminal material, method for manufacturing connector terminal, and method for manufacturing connector terminal material | |
KR102239261B9 (en) | Copper alloy powder, manufacturing method of laminated sculpture and laminated sculpture | |
JP2009134969A5 (en) | ||
WO2015179035A3 (en) | Production and use of flexible conductive films and inorganic layers in electronic devices | |
JP2017534788A5 (en) | ||
JP2015519747A5 (en) | ||
JP2015008179A5 (en) | ||
JP2019044260A5 (en) | ||
WO2015061817A3 (en) | Material having a multiphase structure | |
JP2014225653A5 (en) | ||
WO2017203717A8 (en) | Laminate-molding metal powder, laminate-molded article manufacturing method, and laminate-molded article | |
JP2014507562A5 (en) | ||
WO2015097684A3 (en) | Molded dielectric nanostructure | |
JP2018006450A5 (en) |