JP2017036508A5 - - Google Patents

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Publication number
JP2017036508A5
JP2017036508A5 JP2016185949A JP2016185949A JP2017036508A5 JP 2017036508 A5 JP2017036508 A5 JP 2017036508A5 JP 2016185949 A JP2016185949 A JP 2016185949A JP 2016185949 A JP2016185949 A JP 2016185949A JP 2017036508 A5 JP2017036508 A5 JP 2017036508A5
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JP
Japan
Prior art keywords
mass
copper alloy
less
chromium
layered object
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JP2016185949A
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Japanese (ja)
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JP2017036508A (en
JP6716410B2 (en
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Priority claimed from JP2016185949A external-priority patent/JP6716410B2/en
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Publication of JP2017036508A5 publication Critical patent/JP2017036508A5/ja
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Claims (4)

積層造形用の銅合金粉末であって、
0.22質量%以上0.51質量%以下のクロムと、
0質量%以上0.1質量%未満の不純物元素と、
残部の銅
からなり、
前記不純物元素はクロム以外の元素である、銅合金粉末。
A copper alloy powder for additive manufacturing,
0.22 mass% or more and 0.51 mass% or less of chromium;
0% by mass or more and less than 0.1% by mass of impurity elements;
Ri copper and Tona of the balance,
The copper alloy powder , wherein the impurity element is an element other than chromium .
請求項1に記載の前記銅合金粉末を含む粉末層を形成する第1工程と、
前記粉末層において、所定位置の前記銅合金粉末を固化させることにより、造形層を形成する第2工程と、を含み、
前記第1工程と前記第2工程とを順次繰り返し、前記造形層を積層することにより、積層造形物を製造する、積層造形物の製造方法。
A first step of forming a powder layer containing the copper alloy powder according to claim 1 ;
A second step of forming a modeling layer by solidifying the copper alloy powder at a predetermined position in the powder layer,
A manufacturing method of a layered object, wherein a layered object is manufactured by sequentially repeating the first step and the second step and laminating the modeling layer.
前記積層造形物を熱処理する熱処理工程をさらに含む、請求項2に記載の積層造形物の製造方法。 The method for manufacturing a layered object according to claim 2 , further comprising a heat treatment step of heat-treating the layered object. 銅合金から構成される積層造形物であって、
前記銅合金は、
0.22質量%以上0.51質量%以下のクロムと、
0質量%以上0.1質量%未満の不純物元素と、
残部
からなり、
前記不純物元素はクロム以外の元素であり、
記銅合金の理論密度に対する相対密度が96%以上100%以下であり、
導電率が30%IACS以上である積層造形物。
A layered object composed of a copper alloy,
The copper alloy is
0.22 mass% or more and 0.51 mass% or less of chromium ;
0% by mass or more and less than 0.1% by mass of impurity elements;
The balance of copper and
The impurity element is an element other than chromium,
The relative density to the theoretical density before kidou alloy is 100% or less than 96%
Conductivity is 30% IACS or more, layered manufacturing thereof.
JP2016185949A 2016-09-23 2016-09-23 Copper alloy powder, manufacturing method of layered product and layered product Active JP6716410B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016185949A JP6716410B2 (en) 2016-09-23 2016-09-23 Copper alloy powder, manufacturing method of layered product and layered product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016185949A JP6716410B2 (en) 2016-09-23 2016-09-23 Copper alloy powder, manufacturing method of layered product and layered product

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2015097974A Division JP6030186B1 (en) 2015-05-13 2015-05-13 Copper alloy powder, manufacturing method of layered object, and layered object

Publications (3)

Publication Number Publication Date
JP2017036508A JP2017036508A (en) 2017-02-16
JP2017036508A5 true JP2017036508A5 (en) 2018-08-02
JP6716410B2 JP6716410B2 (en) 2020-07-01

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Family Applications (1)

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JP2016185949A Active JP6716410B2 (en) 2016-09-23 2016-09-23 Copper alloy powder, manufacturing method of layered product and layered product

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JP (1) JP6716410B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6532497B2 (en) * 2017-04-21 2019-06-19 Jx金属株式会社 Copper powder, method for producing the same, and method for producing a three-dimensional object
JP6491289B2 (en) * 2017-09-06 2019-03-27 電気興業株式会社 Method for producing metal product
JP7317177B2 (en) * 2018-03-27 2023-07-28 Jx金属株式会社 Coated metal powder, method for producing the same, and laminate-molded article using the metal powder
JP7109222B2 (en) * 2018-03-27 2022-07-29 Jx金属株式会社 Coated metal powder, method for producing the same, and laminate-molded article using the metal powder
CA3092015C (en) 2018-12-27 2024-02-13 Jx Nippon Mining & Metals Corporation Pure copper powder having si coating and production method thereof, and additive manufactured object using said pure copper powder
JP6722837B1 (en) * 2018-12-27 2020-07-15 Jx金属株式会社 Manufacturing method of layered product using pure copper powder having Si coating
US20200324372A1 (en) * 2019-04-12 2020-10-15 Hobart Brothers Llc Laser additive manufacturing and welding with hydrogen shield gas

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3428442A (en) * 1966-09-22 1969-02-18 Eutectic Welding Alloys Coated spray-weld alloy powders
JPS61163223A (en) * 1985-01-14 1986-07-23 Sumitomo Electric Ind Ltd Manufacture of copper-chromium alloy product
JP4213134B2 (en) * 2004-04-15 2009-01-21 Jfe精密株式会社 Cu-Cr alloy and method for producing Cu-Cr alloy
JP2016053198A (en) * 2014-09-04 2016-04-14 株式会社コイワイ Metal molded product and metal powder for metal molded product

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