JP2017021640A - Electronic apparatus - Google Patents

Electronic apparatus Download PDF

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Publication number
JP2017021640A
JP2017021640A JP2015139720A JP2015139720A JP2017021640A JP 2017021640 A JP2017021640 A JP 2017021640A JP 2015139720 A JP2015139720 A JP 2015139720A JP 2015139720 A JP2015139720 A JP 2015139720A JP 2017021640 A JP2017021640 A JP 2017021640A
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substrate
antenna
covering member
inlet
main antenna
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JP6399313B2 (en
Inventor
義博 水沼
Yoshihiro Mizunuma
義博 水沼
加賀谷　仁
Hitoshi Kagaya
仁 加賀谷
大石　教博
Norihiro Oishi
教博 大石
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Toppan Edge Inc
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Toppan Forms Co Ltd
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Priority to JP2015139720A priority Critical patent/JP6399313B2/en
Priority to PCT/JP2016/070399 priority patent/WO2017010449A1/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of maintaining communication performance by preventing an antenna from being disconnected even in a high-temperature environment.SOLUTION: An electronic apparatus comprises: an electronic substrate 12 including a substrate 15 made of an insulating inorganic material, a main antenna 11 formed on a first surface 15a of the substrate 15, and an electronic element 16 connected to the main antenna 11; a sub antenna 13 for a booster resonating with the main antenna 11 in a non-contact manner; and a covering member 14 for covering the electronic substrate 12 and the sub antenna 13. In the substrate 15, the area of the first surface 15a is 600 mmor less, and a length ratio (shorter side/longer side) of a shorter side to a longer side of the first surface 15a is a quarter or more.SELECTED DRAWING: Figure 1

Description

本発明は、電子機器に関する。   The present invention relates to an electronic device.

ＲＦＩＤ（Ｒａｄｉｏ Ｆｒｅｑｕｅｎｃｙ ＩＤｅｎｔｉｆｉｃａｔｉｏｎ）用途の情報記録メディアのように、電磁波または電波を媒体として外部から情報を受信し、また、外部に情報を送信できるようにした非接触型データ受送信体などの電子機器としては、例えば、ＩＣタグが挙げられる。ＩＣタグは、例えば、基材と、その一方の面に設けられ互いに接続されたアンテナおよびＩＣチップとから構成されるインレットを備えている。
ＩＣタグは、情報書込／読出装置からの電磁波または電波を受信すると共振作用によりアンテナに起電力が発生し、この起電力によりＩＣタグ内のＩＣチップが起動し、このＩＣチップ内の情報を信号化し、この信号がＩＣタグのアンテナから発信される。 An electronic device such as a non-contact type data receiving / transmitting body that can receive information from the outside using electromagnetic waves or radio waves as a medium, and can transmit information to the outside, such as an information recording medium for RFID (Radio Frequency IDentification) applications For example, an IC tag may be mentioned. The IC tag includes, for example, an inlet including a base material, an antenna provided on one surface thereof, and an antenna and an IC chip connected to each other.
When an IC tag receives an electromagnetic wave or radio wave from an information writing / reading device, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and the information in the IC chip is stored. It is converted into a signal and this signal is transmitted from the antenna of the IC tag.

ＩＣタグは、建設現場、業務用クリーニングなどの過酷な環境で用いられることがあるため、曲げ、衝撃等に対する耐久性が求められている。そのため、インレットを被覆部材で覆う構造のＩＣタグが提案されているが、この構造のＩＣタグでは、屈曲、衝撃等による応力がＩＣチップに集中し、ＩＣチップの破損およびそれに伴う通信への悪影響が生じることがあった。   Since IC tags are sometimes used in harsh environments such as construction sites and commercial cleaning, durability against bending, impact and the like is required. For this reason, an IC tag having a structure in which the inlet is covered with a covering member has been proposed. However, in the IC tag having this structure, stress due to bending, impact, or the like is concentrated on the IC chip, and the IC chip is damaged and adversely affects communication. Sometimes occurred.

従来、インレットとしては、一般的に、ガラスエポキシ樹脂基板と、その一方の面に設けられ互いに接続されたアンテナおよびＩＣチップとから構成されるものが用いられている。このインレットを被覆部材で覆う場合、例えば、ＩＣチップを収容する凹部を有する樹脂製の第一の被覆部材内にインレットを収容し、インレットを覆うように、第一の被覆部材に対して、樹脂製の第二の被覆部材を配置し、これら２つの被覆部材を超音波接合または加熱・加圧接合して、封止する（例えば、特許文献１参照）。   Conventionally, as the inlet, a glass epoxy resin substrate and an antenna and an IC chip which are provided on one surface and connected to each other are generally used. When this inlet is covered with a covering member, for example, the resin is applied to the first covering member so that the inlet is accommodated in the first covering member made of resin having a recess for accommodating the IC chip, and the inlet is covered. The 2nd coating member made from is arrange | positioned, and these two coating | coated members are ultrasonically bonded or heating and pressurizing joining, and are sealed (for example, refer patent document 1).

特開２００９−０９９０１８号公報JP 2009-099018 A

上述のように、第一の被覆部材と第二の被覆部材を封止すると、第一の被覆部材と第二の被覆部材によって形成される内部空間に空気が巻き込まれる。この内部空間に空気が存在すると、例えば、２つの被覆部材を接合する際に発生する熱や外部から加えられる熱により、空気が膨張し、その空気によってインレットに圧力が掛かることがある。また、封止後のインレットを高温の環境で使用した場合にも、同様の現象が現われる。すると、ガラスエポキシ樹脂基板が反り、アンテナに亀裂が生じ、断線することがあった。アンテナが断線した場合、インレットは通信不能となる。   As described above, when the first covering member and the second covering member are sealed, air is entrained in the internal space formed by the first covering member and the second covering member. If air is present in the internal space, for example, the air may be expanded by heat generated when the two covering members are joined or heat applied from the outside, and pressure may be applied to the inlet by the air. The same phenomenon appears when the sealed inlet is used in a high temperature environment. Then, the glass epoxy resin substrate was warped, and the antenna was cracked and disconnected. If the antenna is disconnected, the inlet is unable to communicate.

本発明は、上記事情に鑑みてなされたものであって、高温の環境で使用しても、アンテナが断線することなく、通信性能を維持することができる電子機器を提供することを目的とする。   The present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic device that can maintain communication performance without disconnection of an antenna even when used in a high-temperature environment. .

本発明の電子機器は、絶縁性を有する無機材料からなる基板と、該基板に形成された主アンテナと、該主アンテナに接続された電子素子と、を有する電子基板と、前記主アンテナと非接触で共振するブースター用の副アンテナと、前記電子基板および前記副アンテナを覆う被覆部材と、を備え、前記基板は、面積が６００ｍｍ２以下、長軸と短軸の長さの比（短軸／長軸）が１／４以上である。 An electronic device according to the present invention includes an electronic substrate having a substrate made of an insulating inorganic material, a main antenna formed on the substrate, and an electronic element connected to the main antenna; A booster sub-antenna that resonates upon contact; and a covering member that covers the electronic substrate and the sub-antenna, wherein the substrate has an area of 600 mm 2 or less and a ratio of a major axis to a minor axis length (minor axis) / Long axis) is ¼ or more.

本発明の電子機器において、前記基板の厚みは１ｍｍ以上であることが好ましい。   In the electronic device of the present invention, it is preferable that the thickness of the substrate is 1 mm or more.

本発明の電子機器において、前記基板は、セラミックスまたはジルコニアからなることが好ましい。   In the electronic device of the present invention, the substrate is preferably made of ceramics or zirconia.

本発明によれば、高温の環境で使用しても、アンテナが断線することなく、通信性能を維持することができる電子機器を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, even if it uses it in a high temperature environment, the electronic device which can maintain communication performance can be provided, without an antenna disconnecting.

本発明の電子機器の第１実施形態である非接触型データ受送信体を示す概略図であり、（Ａ）は平面図、（Ｂ）は（Ａ）のＡ−Ａ線に沿う断面図、（Ｃ）は（Ａ）のＢ−Ｂ線に沿う断面図である。BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic which shows the non-contact-type data transmission / reception body which is 1st Embodiment of the electronic device of this invention, (A) is a top view, (B) is sectional drawing which follows the AA line of (A), (C) is sectional drawing which follows the BB line of (A). 本発明の電子機器の第２実施形態である非接触型データ受送信体を示す概略平面図であり、被覆部材の一部を切り欠いた図である。It is a schematic plan view which shows the non-contact-type data transmission / reception body which is 2nd Embodiment of the electronic device of this invention, and is the figure which notched a part of coating | coated member. 本発明の電子機器の第３実施形態である非接触型データ受送信体を示す概略平面図であり、被覆部材の一部を切り欠いた図である。It is a schematic plan view which shows the non-contact-type data transmission / reception body which is 3rd Embodiment of the electronic device of this invention, and is the figure which notched a part of coating | coated member. 本発明の電子機器の第４実施形態である非接触型データ受送信体を示す概略平面図であり、被覆部材の一部を切り欠いた図である。It is a schematic plan view which shows the non-contact-type data transmission / reception body which is 4th Embodiment of the electronic device of this invention, and is the figure which notched a part of coating | coated member. 本発明の電子機器の第５実施形態である非接触型データ受送信体を示す概略平面図であり、被覆部材の一部を切り欠いた図である。It is a schematic plan view which shows the non-contact-type data transmission / reception body which is 5th Embodiment of the electronic device of this invention, and is the figure which notched a part of coating | coated member.

本発明の電子機器の実施の形態について説明する。
なお、本実施の形態は、発明の趣旨をより良く理解させるために具体的に説明するものであり、特に指定のない限り、本発明を限定するものではない。 Embodiments of an electronic device according to the present invention will be described.
Note that this embodiment is specifically described in order to better understand the gist of the invention, and does not limit the present invention unless otherwise specified.

［第１実施形態］
図１は、本発明の電子機器の第１実施形態である非接触型データ受送信体１０を示す概略図であり、（Ａ）は平面図、（Ｂ）は（Ａ）のＡ−Ａ線に沿う断面図、（Ｃ）は（Ａ）のＢ−Ｂ線に沿う断面図である。
図１（Ａ）において、基板１５の長さ方向をＸ方向といい、基板１５の第一面１５ａ（および副アンテナ１３の第一面１３ａ）に沿う面内においてＸ方向と直交する方向をＹ方向（幅方向）という。 [First Embodiment]
FIG. 1 is a schematic view showing a non-contact type data receiving / transmitting body 10 according to a first embodiment of an electronic apparatus of the present invention, where (A) is a plan view and (B) is an AA line of (A). (C) is sectional drawing which follows the BB line of (A).
In FIG. 1A, the length direction of the substrate 15 is referred to as the X direction, and the direction orthogonal to the X direction in the plane along the first surface 15a of the substrate 15 (and the first surface 13a of the sub-antenna 13) is defined as Y. It is called direction (width direction).

図１に示すように、本実施形態の非接触型データ受送信体１０は、主アンテナ１１を有するインレット（電子基板）１２と、主アンテナ１１と非接触で配置されたブースター用の副アンテナ１３と、インレット１２および副アンテナ１３を覆う被覆部材１４とから概略構成されている。
なお、被覆部材１４が、インレット１２および副アンテナ１３を覆うとは、インレット１２および副アンテナ１３の外周が、被覆部材１４で被覆されていることを言う。 As shown in FIG. 1, a non-contact type data receiving / transmitting body 10 according to the present embodiment includes an inlet (electronic board) 12 having a main antenna 11, and a booster sub-antenna 13 arranged in non-contact with the main antenna 11. And a covering member 14 that covers the inlet 12 and the sub-antenna 13.
Note that the covering member 14 covering the inlet 12 and the sub-antenna 13 means that the outer periphery of the inlet 12 and the sub-antenna 13 is covered with the covering member 14.

インレット１２は、基板１５と、基板１５の第一面１５ａに形成された主アンテナ１１と、基板１５の第一面１５ａ上において、主アンテナ１１に接続されたＩＣチップ（電子素子）１６とを有する。   The inlet 12 includes a substrate 15, a main antenna 11 formed on the first surface 15 a of the substrate 15, and an IC chip (electronic element) 16 connected to the main antenna 11 on the first surface 15 a of the substrate 15. Have.

基板１５は、第一面１５ａの面積が６００ｍｍ２以下であり、４４４ｍｍ２以下であることが好ましく、２５０ｍｍ２以下であることがより好ましく、１２７．５ｍｍ２以下であることがさらに好ましい。なお、基板１５の第一面１５ａとは反対側の面（以下、「第二面」と言う。）１５ｂの面積は、第一面１５ａの面積と等しい。
基板１５の第一面１５ａの面積が６００ｍｍ２以下であれば、非接触型データ受送信体１０を高温の環境で使用した場合に、熱により被覆部材１４が厚さ方向に曲げ変形しても、基板１５（インレット１２）は曲げ変形し難いため、基板１５や主アンテナ１１に亀裂が生じない。また、射出成形等により、インレット１２および副アンテナ１３を被覆部材１４で被覆する際に、材料樹脂の圧力により基板１５に厚さ方向の力が加えられても、基板１５の曲げ変形は抑制される。従って、基板１５や主アンテナ１１に亀裂が生じない。また、射出成形等により、インレット１２および副アンテナ１３を被覆部材１４で被覆した後、被覆部材１４が収縮する際に応力が生じても、基板１５（インレット１２）に歪みが生じ難い。従って、基板１５や主アンテナ１１に亀裂が生じない。 Substrate 15, the area of the first surface 15a is a 600 mm 2 or less, preferably 444mm 2 or less, more preferably 250 mm 2 or less, and more preferably 127.5Mm 2 or less. The area of the surface 15b opposite to the first surface 15a of the substrate 15 (hereinafter referred to as “second surface”) 15b is equal to the area of the first surface 15a.
If the area of the first surface 15a of the substrate 15 is 600 mm 2 or less, even if the coating member 14 is bent and deformed in the thickness direction by heat when the non-contact type data receiving / transmitting body 10 is used in a high temperature environment. Since the substrate 15 (inlet 12) is difficult to bend and deform, the substrate 15 and the main antenna 11 are not cracked. Further, when the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, even if a force in the thickness direction is applied to the substrate 15 by the pressure of the material resin, the bending deformation of the substrate 15 is suppressed. The Accordingly, the substrate 15 and the main antenna 11 are not cracked. Moreover, even if stress occurs when the covering member 14 contracts after the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, the substrate 15 (inlet 12) is hardly distorted. Accordingly, the substrate 15 and the main antenna 11 are not cracked.

基板１５を平面視した場合の形状、すなわち、基板１５の第一面１５ａの形状は、その第一面１５ａに主アンテナ１１とＩＣチップ１６を設けることができれば特に限定されないが、例えば、正方形、長方形、円形、楕円形等が挙げられる。本実施形態では、基板１５を平面視した場合の形状は、正方形をなしている。
また、基板１５の第一面１５ａの長軸と短軸の長さの比（短軸／長軸）が１／４以上であり、１／１であることが特に好ましい。 The shape of the substrate 15 in plan view, that is, the shape of the first surface 15a of the substrate 15 is not particularly limited as long as the main antenna 11 and the IC chip 16 can be provided on the first surface 15a. A rectangle, a circle, an ellipse, etc. are mentioned. In the present embodiment, the shape of the substrate 15 in plan view is a square.
Further, the ratio of the length of the major axis to the minor axis of the first surface 15a of the substrate 15 (minor axis / major axis) is ¼ or more, and is preferably 1/1.

基板１５の形状が正方形である場合、第一面１５ａの長軸とは、正方形の一辺のことであり、第一面１５ａの短軸とは、正方形の一辺に隣接し、その一辺と直交する他の辺のことである。この場合、長軸の長さと短軸の長さは等しく、長軸と短軸の長さの比（短軸／長軸）は１／１である。
基板１５の形状が長方形である場合、第一面１５ａの長軸とは、長方形の長辺のことであり、第一面１５ａの短軸とは、長方形の長辺に隣接し、その長辺と直交する短辺のことである。この場合、長軸（長辺）と短軸（短辺）の長さの比（短軸／長軸）は１／４以上である。
基板１５の形状が円形である場合、第一面１５ａの長軸とは、直径（第一の直径）のことであり、第一面１５ａの短軸とは、第一の直径と直交する直径（第二の直径）のことである。この場合、長軸の長さと短軸の長さは等しく、長軸と短軸の長さの比（短軸／長軸）は１／１である。
基板１５の形状が楕円形である場合、第一面１５ａの長軸とは、楕円形の長軸のことであり、第一面１５ａの短軸とは、楕円形の長軸と直交する、楕円の短軸のことである。この場合、長軸（長辺）と短軸（短辺）の長さの比（短軸／長軸）は１／４以上である。 When the shape of the substrate 15 is a square, the major axis of the first surface 15a is one side of the square, and the minor axis of the first surface 15a is adjacent to one side of the square and is orthogonal to the one side. It is the other side. In this case, the length of the major axis is equal to the length of the minor axis, and the ratio of the major axis to the minor axis (short axis / major axis) is 1/1.
When the shape of the substrate 15 is a rectangle, the long axis of the first surface 15a is the long side of the rectangle, and the short axis of the first surface 15a is adjacent to the long side of the rectangle and the long side thereof It is the short side orthogonal to. In this case, the ratio of the length of the long axis (long side) to the short axis (short side) (short axis / long axis) is ¼ or more.
When the shape of the substrate 15 is circular, the major axis of the first surface 15a is a diameter (first diameter), and the minor axis of the first surface 15a is a diameter orthogonal to the first diameter. (Second diameter). In this case, the length of the major axis is equal to the length of the minor axis, and the ratio of the major axis to the minor axis (short axis / major axis) is 1/1.
When the shape of the substrate 15 is elliptical, the major axis of the first surface 15a is the major axis of the ellipse, and the minor axis of the first surface 15a is orthogonal to the major axis of the ellipse. It is the minor axis of the ellipse. In this case, the ratio of the length of the long axis (long side) to the short axis (short side) (short axis / long axis) is ¼ or more.

基板１５の第一面１５ａの長軸と短軸の長さの比（短軸／長軸）が１／４以上であれば、非接触型データ受送信体１０を高温の環境で使用した場合に、熱により被覆部材１４が厚さ方向に曲げ変形しても、基板１５（インレット１２）は曲げ変形し難いため、基板１５や主アンテナ１１に亀裂が生じない。また、射出成形等により、インレット１２および副アンテナ１３を被覆部材１４で被覆する際に、材料樹脂の圧力により基板１５に厚さ方向の力が加えられても、基板１５の曲げ変形は抑制される。従って、基板１５や主アンテナ１１に亀裂が生じない。また、射出成形等により、インレット１２および副アンテナ１３を被覆部材１４で被覆した後、被覆部材１４が収縮する際に応力が生じても、基板１５（インレット１２）に歪みが生じ難い。従って、基板１５や主アンテナ１１に亀裂が生じない。   When the ratio of the length of the major axis to the minor axis of the first surface 15a of the substrate 15 (minor axis / major axis) is 1/4 or more, the non-contact type data transmitting / receiving body 10 is used in a high temperature environment. In addition, even if the covering member 14 is bent and deformed in the thickness direction by heat, the substrate 15 (inlet 12) is not easily bent and deformed, so that the substrate 15 and the main antenna 11 do not crack. Further, when the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, even if a force in the thickness direction is applied to the substrate 15 by the pressure of the material resin, the bending deformation of the substrate 15 is suppressed. The Accordingly, the substrate 15 and the main antenna 11 are not cracked. Moreover, even if stress occurs when the covering member 14 contracts after the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, the substrate 15 (inlet 12) is hardly distorted. Accordingly, the substrate 15 and the main antenna 11 are not cracked.

基板１５の厚みは１ｍｍ以上２０ｍｍ以下であることが好ましく、１ｍｍ以上１０ｍｍ以下であることがより好ましく、２ｍｍ〜５ｍｍであることがさらに好ましい。
基板１５の厚みが１ｍｍ以上であれば、非接触型データ受送信体１０を高温の環境で使用した場合に、熱により被覆部材１４が厚さ方向に曲げ変形しても、基板１５（インレット１２）は曲げ変形し難いため、基板１５や主アンテナ１１に亀裂が生じない。また、射出成形等により、インレット１２および副アンテナ１３を被覆部材１４で被覆する際に、材料樹脂の圧力により基板１５に厚さ方向の力が加えられても、基板１５の曲げ変形は抑制される。従って、基板１５や主アンテナ１１に亀裂が生じない。また、射出成形等により、インレット１２および副アンテナ１３を被覆部材１４で被覆した後、被覆部材１４が収縮する際に応力が生じても、基板１５（インレット１２）に歪みが生じ難い。従って、基板１５や主アンテナ１１に亀裂が生じない。 The thickness of the substrate 15 is preferably 1 mm or more and 20 mm or less, more preferably 1 mm or more and 10 mm or less, and further preferably 2 mm to 5 mm.
If the thickness of the substrate 15 is 1 mm or more, even if the coating member 14 is bent and deformed in the thickness direction by heat when the non-contact type data receiving / transmitting body 10 is used in a high temperature environment, the substrate 15 (inlet 12 ) Hardly bends and deforms, so that the substrate 15 and the main antenna 11 do not crack. Further, when the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, even if a force in the thickness direction is applied to the substrate 15 by the pressure of the material resin, the bending deformation of the substrate 15 is suppressed. The Accordingly, the substrate 15 and the main antenna 11 are not cracked. Moreover, even if stress occurs when the covering member 14 contracts after the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, the substrate 15 (inlet 12) is hardly distorted. Accordingly, the substrate 15 and the main antenna 11 are not cracked.

基板１５としては、絶縁性を有する無機材料からなる基板が用いられる。絶縁性を有する無機材料からなる基板としては、耐熱性に優れ、熱膨張係数が小さいことから、セラミックスからなる基板（以下、「セラミックス基板」と言う。）またはジルコニアからなる基板（以下、「ジルコニア基板」と言う。）が好ましい。
基板１５として、絶縁性を有する無機材料からなる基板を用いることにより、非接触型データ受送信体１０を高温の環境で使用した場合に、熱により被覆部材１４が厚さ方向に曲げ変形しても、基板１５（インレット１２）は曲げ変形し難いため、基板１５や主アンテナ１１に亀裂が生じない。また、射出成形等により、インレット１２および副アンテナ１３を被覆部材１４で被覆する際に、材料樹脂の圧力により基板１５に厚さ方向の力が加えられても、基板１５の曲げ変形は抑制される。従って、基板１５や主アンテナ１１に亀裂が生じない。また、射出成形等により、インレット１２および副アンテナ１３を被覆部材１４で被覆した後、被覆部材１４が収縮する際に応力が生じても、基板１５（インレット１２）に歪みが生じ難い。従って、基板１５や主アンテナ１１に亀裂が生じない。 As the substrate 15, a substrate made of an insulating inorganic material is used. A substrate made of an inorganic material having an insulating property is excellent in heat resistance and has a small coefficient of thermal expansion. Substrate ") is preferred.
By using a substrate made of an insulating inorganic material as the substrate 15, when the non-contact type data receiving / transmitting body 10 is used in a high temperature environment, the covering member 14 is bent and deformed in the thickness direction by heat. However, since the substrate 15 (inlet 12) is difficult to bend and deform, the substrate 15 and the main antenna 11 are not cracked. Further, when the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, even if a force in the thickness direction is applied to the substrate 15 by the pressure of the material resin, the bending deformation of the substrate 15 is suppressed. The Accordingly, the substrate 15 and the main antenna 11 are not cracked. Moreover, even if stress occurs when the covering member 14 contracts after the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, the substrate 15 (inlet 12) is hardly distorted. Accordingly, the substrate 15 and the main antenna 11 are not cracked.

基板１５の曲げ弾性率は、７４ＧＰａ〜４７０ＧＰａであることが好ましい。
基板１５の曲げ弾性率を７４ＧＰａ以上とすることによって、曲げ、衝撃等に対する耐久性を確保することができる。また、基板１５の曲げ弾性率を４７０ＧＰａ以下とすることによって、取扱い性に優れ、かつ安価な基板１５を採用できる。
なお、材質によっては、基板１５の曲げ弾性率はヤング率とほぼ等しくなることがある。その場合にはヤング率の値を曲げ弾性率とみなすことができる。 The flexural modulus of the substrate 15 is preferably 74 GPa to 470 GPa.
By setting the bending elastic modulus of the substrate 15 to 74 GPa or more, durability against bending, impact, and the like can be ensured. In addition, by setting the bending elastic modulus of the substrate 15 to 470 GPa or less, it is possible to employ the substrate 15 that is excellent in handleability and inexpensive.
Depending on the material, the flexural modulus of the substrate 15 may be approximately equal to the Young's modulus. In that case, the value of Young's modulus can be regarded as the bending elastic modulus.

ＩＣチップ１６としては、特に限定されず、主アンテナ１１を介して非接触状態にて情報の書き込みおよび読み出しが可能であり、非接触型ＩＣタグや非接触型ＩＣラベル、あるいは、非接触型ＩＣカードなどのＲＦＩＤメディアに適用可能なものであればいかなるものでも用いることができる。
ＩＣチップ１６は、はんだ等を介して基板１５の第一面１５ａに形成された主アンテナ１１に接続、固定することができる。 The IC chip 16 is not particularly limited, and information can be written and read out in a non-contact state via the main antenna 11. A non-contact IC tag, a non-contact IC label, or a non-contact IC Anything applicable to RFID media such as a card can be used.
The IC chip 16 can be connected and fixed to the main antenna 11 formed on the first surface 15a of the substrate 15 via solder or the like.

また、主アンテナ１１に接続されたＩＣチップ１６は、図示しないセラミックペーストで封止されている。
ＩＣチップ１６をセラミックペーストで封止することにより、非接触型データ受送信体１０を高温の環境で使用した場合に、ＩＣチップ１６が劣化することを防止できる。 The IC chip 16 connected to the main antenna 11 is sealed with a ceramic paste (not shown).
By sealing the IC chip 16 with a ceramic paste, it is possible to prevent the IC chip 16 from deteriorating when the non-contact type data receiving / transmitting body 10 is used in a high temperature environment.

主アンテナ１１は、基板１５の外縁に沿って形成されたループアンテナである。本実施形態では、基板１５を平面視した場合の形状が正方形であるため、主アンテナ１１を平面視した場合の形状は、正方形である。
基板１５を平面視した場合の形状が長方形である場合、主アンテナ１１を平面視した場合の形状は、長方形である。基板１５を平面視した場合の形状が円形である場合、主アンテナ１１を平面視した場合の形状は、円形である。基板１５を平面視した場合の形状が楕円形である場合、主アンテナ１１を平面視した場合の形状は、楕円形である。 The main antenna 11 is a loop antenna formed along the outer edge of the substrate 15. In this embodiment, since the shape when the substrate 15 is viewed in plan is a square, the shape when the main antenna 11 is viewed in plan is a square.
When the shape of the substrate 15 in plan view is a rectangle, the shape of the main antenna 11 in plan view is a rectangle. When the shape of the substrate 15 when viewed in plan is circular, the shape of the main antenna 11 when viewed in plan is circular. When the shape of the substrate 15 in plan view is an ellipse, the shape of the main antenna 11 in plan view is an ellipse.

主アンテナ１１は、図示しない給電点を有し、その給電点に、はんだ等を介してＩＣチップ１６が接続されている。
主アンテナ１１は、導電性材料からなる。 The main antenna 11 has a feeding point (not shown), and an IC chip 16 is connected to the feeding point via solder or the like.
The main antenna 11 is made of a conductive material.

副アンテナ１３は、インレット１２の主アンテナ１１の近傍で、かつ、主アンテナ１１の外縁の少なくとも一部に沿うように設けられる。なお、副アンテナ１３が、主アンテナ１１の外縁に沿うように設けられるとは、主アンテナ１１と副アンテナ１３の間で電気的な接続（電磁界結合）が可能な位置に、両者が互いに配置されていることを言う。本実施形態では、副アンテナ１３は、平面視正方形のループ状の主アンテナ１１の３辺に沿うように設けられ、主アンテナ１１に沿う部分においては、平面視コ字状をなしている。   The sub-antenna 13 is provided in the vicinity of the main antenna 11 of the inlet 12 and along at least a part of the outer edge of the main antenna 11. Note that the sub-antenna 13 is provided along the outer edge of the main antenna 11 that both are arranged at a position where electrical connection (electromagnetic coupling) is possible between the main antenna 11 and the sub-antenna 13. Say that it is. In the present embodiment, the sub-antenna 13 is provided along three sides of the loop-shaped main antenna 11 having a square shape in plan view, and the portion along the main antenna 11 has a U-shape in plan view.

さらに言い換えれば、副アンテナ１３は、インレット１２（主アンテナ１１）の外側に沿うように形成された部分（インレット１２を配置する部分、中央部）１３Ａと、中央部１３Ａから基板１５のＸ方向の両端部まで延在する線状または帯状の放射素子１３Ｂ，１３Ｂとからなるアンテナである。副アンテナ１３の中央部１３Ａは、板状または帯状の導電体が平面視コ字形状をなしている。
副アンテナ１３の中央部１３Ａは、その内側に配されるインレット１２（主アンテナ１１）とほぼ同一の形状に形成されていることが好ましい。さらに、インレット１２（主アンテナ１１）と１３Ａは非接触に設けられているが、両者の間の隙間はできる限り小さくなるように中央部１３Ａを形成し、かつ、両者の間の隙間はできる限り小さくなるように中央部１３Ａ内にインレット１２（主アンテナ１１）を配置することが好ましい。
また、主アンテナ１１と副アンテナ１３の距離は、両者の間で電気的な接続（電磁界結合）が可能な範囲であれば特に限定されない。 In other words, the sub-antenna 13 includes a portion (a portion where the inlet 12 is disposed, a central portion) 13A formed along the outside of the inlet 12 (the main antenna 11), and the X direction of the substrate 15 from the central portion 13A. It is an antenna composed of linear or belt-shaped radiating elements 13B and 13B extending to both ends. The central portion 13A of the sub-antenna 13 has a U-shaped plate-like or belt-like conductor in plan view.
It is preferable that the central portion 13A of the sub-antenna 13 is formed in substantially the same shape as the inlet 12 (main antenna 11) arranged on the inner side. Furthermore, although the inlets 12 (main antenna 11) and 13A are provided in a non-contact manner, the central portion 13A is formed so that the gap between them is as small as possible, and the gap between the two is as much as possible. It is preferable to arrange the inlet 12 (main antenna 11) in the central portion 13A so as to be small.
Further, the distance between the main antenna 11 and the sub antenna 13 is not particularly limited as long as electrical connection (electromagnetic field coupling) is possible between them.

なお、主アンテナ１１は、少なくともその一辺が副アンテナ１３の少なくとも一辺に対して非接触でかつ略平行になるよう配されていればよく、副アンテナ１３にインレット１２（主アンテナ１１）とほぼ形状が同一の中央部４１が形成されていなくてもよい。   The main antenna 11 only needs to be arranged so that at least one side thereof is non-contact and substantially parallel to at least one side of the sub-antenna 13, and the sub-antenna 13 has substantially the same shape as the inlet 12 (main antenna 11). However, the same central portion 41 may not be formed.

副アンテナ１３は、主アンテナ１１と、電磁界結合による電気的な接続を行い、主アンテナ１１のみによって非接触通信を行う場合よりも、通信距離を長くする（長距離通信を可能とする）ためのものである。   The sub-antenna 13 is electrically connected to the main antenna 11 by electromagnetic coupling, so that the communication distance is longer than when non-contact communication is performed using only the main antenna 11 (long-distance communication is possible). belongs to.

副アンテナ１３は、非接触ＩＣカード等の非接触ＩＣモジュールに利用できる極超短波帯〈ＵＨＦ〉やマイクロ波帯の電波帯の周波数（３００ＭＨｚ〜３０ＧＨｚ）の１／２波長に相当する長さとなっている。すなわち、ＩＣチップ１６を中心とする２つの領域に放射素子１３Ｂ，１３Ｂを区分した場合、それぞれの長手方向における長さは、１／４波長に相当する長さとなっている。   The sub-antenna 13 has a length corresponding to a half wavelength of a frequency (300 MHz to 30 GHz) of an ultra-high frequency band <UHF> or a microwave band that can be used for a non-contact IC module such as a non-contact IC card. Yes. That is, when the radiating elements 13B and 13B are divided into two regions having the IC chip 16 as the center, the length in the longitudinal direction is a length corresponding to a quarter wavelength.

副アンテナ１３は、熱膨張係数が小さい材料から構成される、外形が板状または帯状をなす部材である。熱膨張係数が小さい材料としては、例えば、ステンレス鋼、ＪＩＳ Ｇ３１４１「冷間圧延鋼板および鋼帯」に規定される極低炭素の鋼材である普通鋼（ＳＰＣＣ）が挙げられる。   The sub-antenna 13 is a member made of a material having a small thermal expansion coefficient and having an outer shape that is plate-shaped or band-shaped. Examples of the material having a small coefficient of thermal expansion include stainless steel, ordinary steel (SPCC) which is an extremely low carbon steel material defined in JIS G3141 “Cold Rolled Steel Sheet and Steel Strip”.

被覆部材１４は、熱可塑性樹脂からなる。熱可塑性樹脂は、ガラス転移温度または融点以上に加熱することで流動化し、冷却により固化する樹脂である。
熱可塑性樹脂としては、エンプラ（エンジニアリングプラスチック）、スーパーエンプラ（スーパーエンジニアリングプラスチック）等が挙げられる。
エンプラとしては、ナイロン、ポリカーボネート（ＰＣ）、ポリエチレンテレフタレート（ＰＥＴ）等が挙げられる。
スーパーエンプラとしては、ポリフェニレンスルファイド（ＰＰＳ）、ポリエーテルサルフォン（ＰＥＳ）、ポリエーテルエーテルケトン（ＰＥＥＫ）等が挙げられる。
これらの中でも、被覆部材１４を構成する熱可塑性樹脂は、高耐熱性を有するエンプラまたはスーパーエンプラが好ましい。 The covering member 14 is made of a thermoplastic resin. A thermoplastic resin is a resin that is fluidized by heating above the glass transition temperature or melting point and solidified by cooling.
Examples of the thermoplastic resin include engineering plastic (engineering plastic) and super engineering plastic (super engineering plastic).
Examples of engineering plastics include nylon, polycarbonate (PC), and polyethylene terephthalate (PET).
Examples of super engineering plastics include polyphenylene sulfide (PPS), polyether sulfone (PES), and polyether ether ketone (PEEK).
Among these, the thermoplastic resin constituting the covering member 14 is preferably an engineering plastic or super engineering plastic having high heat resistance.

被覆部材１４の厚み、すなわち、基板１５の法線方向の厚みは、特に限定されず、目的とする耐熱性や通信特性に応じて適宜調整される。
なお、本実施形態では、被覆部材１４が、インレット１２および副アンテナ１３の外周に一体に形成されている場合を例示したが、本実施形態はこれに限定されない。被覆部材１４は、インレット１２および副アンテナ１３を収容（嵌合）する収容凹部を有する第一の被覆部材と、インレット１２および副アンテナ１３を収容した第一の被覆部材を封止する第二の被覆部材とから構成されていてもよい。 The thickness of the covering member 14, that is, the thickness of the substrate 15 in the normal direction is not particularly limited, and is appropriately adjusted according to the intended heat resistance and communication characteristics.
In the present embodiment, the case where the covering member 14 is integrally formed on the outer periphery of the inlet 12 and the sub-antenna 13 is illustrated, but the present embodiment is not limited to this. The covering member 14 seals the first covering member having an accommodating recess for accommodating (fitting) the inlet 12 and the sub antenna 13 and the second covering member accommodating the inlet 12 and the sub antenna 13. You may be comprised from the coating | coated member.

次に、本実施形態の非接触型データ受送信体の製造方法の一例を説明する。
（第一工程）
基板１５の第一面１５ａに主アンテナ１１およびＩＣチップ１６を設けることによって、インレット１２を得る。 Next, an example of the manufacturing method of the non-contact type data receiving / transmitting body of the present embodiment will be described.
(First step)
By providing the main antenna 11 and the IC chip 16 on the first surface 15a of the substrate 15, the inlet 12 is obtained.

（第二工程）
予め射出成形等により得た第一の被覆部材の収容凹部に、インレット１２および副アンテナ１３を配置（嵌合）する。この際、第一の被覆部材の収容凹部の底面側に、ＩＣチップ１６を配置する。 (Second step)
The inlet 12 and the sub-antenna 13 are disposed (fitted) in the housing recess of the first covering member obtained in advance by injection molding or the like. At this time, the IC chip 16 is disposed on the bottom surface side of the housing recess of the first covering member.

（第三工程）
次いで、インレット１２および副アンテナ１３を収容した第一の被覆部材を金型内に配置し、基板１５の第二面１５ｂ側に、射出成形によって、インレット１２および副アンテナ１３を収容した第一の被覆部材を封止する第二の被覆部材を形成する。これにより、第一の被覆部材と第二の被覆部材が一体化して被覆部材１４となり、非接触型データ受送信体１０が得られる。
射出成形により、被覆部材１４を形成することにより、インレット１２および副アンテナ１３に対して、被覆部材１４を隙間なく形成することができる。従って、インレット１２および副アンテナ１３と、被覆部材１４との間に、空気を巻き込むことがない。
なお、被覆部材１４の形成方法は、上記の方法に限定されず、一度の射出成型により、金型内に配置されたインレット１２および副アンテナ１３を覆うように被覆部材１４を形成してもよい。 (Third process)
Next, the first covering member that accommodates the inlet 12 and the sub-antenna 13 is disposed in the mold, and the first surface that accommodates the inlet 12 and the sub-antenna 13 is formed on the second surface 15b side of the substrate 15 by injection molding. A second covering member for sealing the covering member is formed. As a result, the first covering member and the second covering member are integrated into the covering member 14, and the non-contact type data receiving / transmitting body 10 is obtained.
By forming the covering member 14 by injection molding, the covering member 14 can be formed without any gap with respect to the inlet 12 and the sub-antenna 13. Therefore, air is not caught between the inlet 12 and the sub-antenna 13 and the covering member 14.
The method for forming the covering member 14 is not limited to the above method, and the covering member 14 may be formed so as to cover the inlet 12 and the sub-antenna 13 arranged in the mold by one injection molding. .

本実施形態の非接触型データ受送信体１０は、絶縁性を有する無機材料からなる基板１５が、第一面１５ａの面積が６００ｍｍ２以下、第一面１５ａの長軸と短軸の長さの比（短軸／長軸）が１／４以上である。そのため、非接触型データ受送信体１０を高温の環境で使用した場合に、熱により被覆部材１４が厚さ方向に曲げ変形しても、基板１５（インレット１２）は曲げ変形し難いため、基板１５や主アンテナ１１に亀裂が生じない。その結果、主アンテナ１１の断線や、主アンテナ１１とＩＣチップ１６の接続不具合等を原因とする非接触型データ受送信体１０の通信性能の劣化を回避できる。
また、射出成形等により、インレット１２および副アンテナ１３を被覆部材１４で被覆する際に、材料樹脂の圧力により基板１５に厚さ方向の力が加えられても、基板１５の曲げ変形は抑制される。従って、基板１５や主アンテナ１１に亀裂が生じない。また、射出成形等により、インレット１２および副アンテナ１３を被覆部材１４で被覆した後、被覆部材１４が収縮する際に応力が生じても、基板１５（インレット１２）に歪みが生じ難い。従って、基板１５や主アンテナ１１に亀裂が生じない。 In the non-contact type data receiving / transmitting body 10 of the present embodiment, the substrate 15 made of an insulating inorganic material has an area of the first surface 15a of 600 mm 2 or less, and the lengths of the major axis and minor axis of the first surface 15a. Ratio (minor axis / major axis) is ¼ or more. Therefore, when the non-contact type data receiving / transmitting body 10 is used in a high temperature environment, even if the covering member 14 is bent and deformed in the thickness direction by heat, the substrate 15 (inlet 12) is not easily bent and deformed. 15 and the main antenna 11 are not cracked. As a result, it is possible to avoid deterioration of the communication performance of the non-contact type data receiving / transmitting body 10 due to disconnection of the main antenna 11 or connection failure between the main antenna 11 and the IC chip 16.
Further, when the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, even if a force in the thickness direction is applied to the substrate 15 by the pressure of the material resin, the bending deformation of the substrate 15 is suppressed. The Accordingly, the substrate 15 and the main antenna 11 are not cracked. Moreover, even if stress occurs when the covering member 14 contracts after the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, the substrate 15 (inlet 12) is hardly distorted. Accordingly, the substrate 15 and the main antenna 11 are not cracked.

射出成形を採用すると、曲げ弾性率が高い、絶縁性を有する無機材料からなる基板１５を使用しても、材料樹脂の圧力により基板１５に曲げ変形が発生する可能性がある。本実施形態の非接触型データ受送信体１０は、この新規な知見に基づき、第一面１５ａの面積が６００ｍｍ２以下、第一面１５ａの長軸と短軸の長さの比（短軸／長軸）が１／４以上の基板１５を使用することによって、基板１５の曲げ変形を原因とする通信性能の劣化を防ぐことができる点に技術的意義がある。 When injection molding is employed, even if a substrate 15 made of an insulating inorganic material having a high flexural modulus is used, bending deformation may occur in the substrate 15 due to the pressure of the material resin. Based on this new knowledge, the non-contact type data transmitting / receiving body 10 of the present embodiment has an area of the first surface 15a of 600 mm 2 or less, and a ratio between the major axis and the minor axis length of the first surface 15a (minor axis). By using the substrate 15 having a / long axis) of 1/4 or more, there is a technical significance in that deterioration of communication performance caused by bending deformation of the substrate 15 can be prevented.

［第２実施形態］
図２は、本発明の電子機器の第２実施形態である非接触型データ受送信体２０を示す概略平面図であり、被覆部材１４の一部を切り欠いた図である。図２において、図１に示した第１実施形態の非接触型データ受送信体１０と同一の構成要素には同一符号を付して、その説明を省略する。
本実施形態の非接触型データ受送信体２０が、上述の第１実施形態の非接触型データ受送信体１０と異なる点は、インレット１２の主アンテナ２１が、それぞれ給電点（ＩＣチップ１６と接続する部分）を有する一対の放射素子２２，２２と、放射素子２２，２２の給電点近傍を短絡する短絡部２３とを備えたダイポールアンテナからなる点である。 [Second Embodiment]
FIG. 2 is a schematic plan view showing a non-contact type data receiving / transmitting body 20 which is a second embodiment of the electronic apparatus of the present invention, and is a view in which a part of the covering member 14 is cut away. In FIG. 2, the same components as those of the contactless data receiving / transmitting body 10 of the first embodiment shown in FIG.
The non-contact type data receiving / transmitting body 20 of the present embodiment is different from the non-contact type data receiving / transmitting body 10 of the first embodiment described above in that the main antenna 21 of the inlet 12 has a feeding point (IC chip 16 and This is a point formed by a dipole antenna including a pair of radiating elements 22 and 22 having a connecting portion) and a short-circuit portion 23 that short-circuits the vicinity of the feeding point of the radiating elements 22 and 22.

本実施形態の非接触型データ受送信体２０においても、上述の第１実施形態の非接触型データ受送信体１０と同様の効果が得られる。   Also in the non-contact type data receiving / transmitting body 20 of the present embodiment, the same effect as the non-contact type data receiving / transmitting body 10 of the first embodiment described above can be obtained.

［第３実施形態］
図３は、本発明の電子機器の第３実施形態である非接触型データ受送信体３０を示す概略平面図であり、被覆部材１４の一部を切り欠いた図である。図３において、図１に示した第１実施形態の非接触型データ受送信体１０と同一の構成要素には同一符号を付して、その説明を省略する。
本実施形態の非接触型データ受送信体３０が、上述の第１実施形態の非接触型データ受送信体１０と異なる点は、インレット１２が、副アンテナ１３の中央部ではなく、基板１５のＸ方向の一端部に配置されている点である。 [Third Embodiment]
FIG. 3 is a schematic plan view showing a non-contact type data receiving / transmitting body 30 which is a third embodiment of the electronic apparatus of the present invention, and is a view in which a part of the covering member 14 is cut away. In FIG. 3, the same components as those of the contactless data receiving / transmitting body 10 of the first embodiment shown in FIG.
The non-contact type data receiving / transmitting body 30 of the present embodiment is different from the non-contact type data receiving / transmitting body 10 of the first embodiment described above in that the inlet 12 is not the central portion of the sub-antenna 13 but the substrate 15. It is the point arrange | positioned at the one end part of a X direction.

本実施形態の非接触型データ受送信体３０においても、上述の第１実施形態の非接触型データ受送信体１０と同様の効果が得られる。   Also in the non-contact type data receiving / transmitting body 30 of the present embodiment, the same effect as the non-contact type data receiving / transmitting body 10 of the first embodiment described above can be obtained.

［第４実施形態］
図４は、本発明の電子機器の第４実施形態である非接触型データ受送信体４０を示す概略平面図であり、被覆部材１４の一部を切り欠いた図である。図４において、図１に示した第１実施形態の非接触型データ受送信体１０と同一の構成要素には同一符号を付して、その説明を省略する。
本実施形態の非接触型データ受送信体４０が、上述の第１実施形態の非接触型データ受送信体１０と異なる点は、副アンテナ４３が、外形が線状をなす部材からなる点である。 [Fourth Embodiment]
FIG. 4 is a schematic plan view showing a non-contact type data receiving / transmitting body 40 according to a fourth embodiment of the electronic apparatus of the present invention, and is a view in which a part of the covering member 14 is cut away. In FIG. 4, the same components as those of the non-contact type data receiving / transmitting body 10 of the first embodiment shown in FIG.
The non-contact type data receiving / transmitting body 40 of the present embodiment is different from the non-contact type data receiving / transmitting body 10 of the first embodiment described above in that the sub-antenna 43 is made of a member whose outer shape is linear. is there.

本実施形態の非接触型データ受送信体４０においても、上述の第１実施形態の非接触型データ受送信体１０と同様の効果が得られる。   Also in the non-contact type data receiving / transmitting body 40 of the present embodiment, the same effect as the non-contact type data receiving / transmitting body 10 of the first embodiment described above can be obtained.

［第５実施形態］
図５は、本発明の電子機器の第５実施形態である非接触型データ受送信体５０を示す概略平面図であり、被覆部材１４の一部を切り欠いた図である。図５において、図１に示した第１実施形態の非接触型データ受送信体１０と同一の構成要素には同一符号を付して、その説明を省略する。
本実施形態の非接触型データ受送信体５０が、上述の第１実施形態の非接触型データ受送信体１０と異なる点は、インレット５２が、平面視楕円形の基板５５と、基板５５の第一面５５ａに形成された平面視楕円形の主アンテナ５１と、基板５５の第一面５５ａ上において、主アンテナ５１に接続されたＩＣチップ（電子素子）５６とを有する点である。また、副アンテナ５３の中央部５３Ａは、板状または帯状の導電体が平面視半楕円形状をなしている点である。 [Fifth Embodiment]
FIG. 5 is a schematic plan view showing a non-contact type data receiving / transmitting body 50 according to the fifth embodiment of the electronic apparatus of the present invention, and is a view in which a part of the covering member 14 is cut away. In FIG. 5, the same components as those of the non-contact type data receiving / transmitting body 10 of the first embodiment shown in FIG.
The non-contact type data receiving / transmitting body 50 according to the present embodiment is different from the non-contact type data receiving / transmitting body 10 according to the first embodiment described above in that the inlet 52 includes a substrate 55 having an elliptical shape in plan view, and a substrate 55. The main antenna 51 has an elliptical shape in plan view formed on the first surface 55 a and an IC chip (electronic element) 56 connected to the main antenna 51 on the first surface 55 a of the substrate 55. The central portion 53A of the sub-antenna 53 is that a plate-like or strip-like conductor has a semi-elliptical shape in plan view.

本実施形態の非接触型データ受送信体５０においても、上述の第１実施形態の非接触型データ受送信体１０と同様の効果が得られる。   Also in the non-contact type data receiving / transmitting body 50 of the present embodiment, the same effect as the non-contact type data receiving / transmitting body 10 of the first embodiment described above can be obtained.

なお、上述した実施形態では、主アンテナ１１，２１（主アンテナ５１）が基板１５（基板５５）の第一面１５ａ（第一面５５ａ）に形成されている例について説明したが、主アンテナは、基板の第二面（例えば、第二面１５ｂ）に形成されていても良く、基板の側面（第一面及び第二面に交差する４つの面）に形成されていても良い。また、上述した実施形態では、ＩＣチップ１６（ＩＣチップ５６）が、基板１５（基板５５）の第一面１５ａ（第一面５５ａ）に設けられている例について説明したが、ＩＣチップは第二面に設けられていても良く、基板の側面に形成されていても良い。   In the above-described embodiment, the example in which the main antennas 11 and 21 (main antenna 51) are formed on the first surface 15a (first surface 55a) of the substrate 15 (substrate 55) has been described. In addition, it may be formed on the second surface (for example, the second surface 15b) of the substrate, or may be formed on the side surfaces (four surfaces intersecting the first surface and the second surface) of the substrate. In the above-described embodiment, the example in which the IC chip 16 (IC chip 56) is provided on the first surface 15a (first surface 55a) of the substrate 15 (substrate 55) has been described. It may be provided on two surfaces or may be formed on the side surface of the substrate.

１０，２０，３０，４０，５０・・・非接触型データ受送信体、１１，２１，５１・・・主アンテナ、１２，５２・・・インレット（電子基板）、１３，４３，５３・・・副アンテナ、１４・・・被覆部材、１５，５５・・・基板、１６，５６・・・ＩＣチップ（電子素子）、２２・・・放射素子。 10, 20, 30, 40, 50 ... non-contact type data receiving / transmitting body, 11, 21, 51 ... main antenna, 12, 52 ... inlet (electronic substrate), 13, 43, 53 ... Sub antenna, 14 ... covering member, 15, 55 ... substrate, 16, 56 ... IC chip (electronic element), 22 ... radiation element.

Claims (3)

絶縁性を有する無機材料からなる基板と、該基板に形成された主アンテナと、該主アンテナに接続された電子素子と、を有する電子基板と、
前記主アンテナと非接触で共振するブースター用の副アンテナと、
前記電子基板および前記副アンテナを覆う被覆部材と、を備え、
前記基板は、面積が６００ｍｍ２以下、長軸と短軸の長さの比（短軸／長軸）が１／４以上であることを特徴とする電子機器。 An electronic substrate having a substrate made of an insulating inorganic material, a main antenna formed on the substrate, and an electronic element connected to the main antenna;
A sub-antenna for booster that resonates in a non-contact manner with the main antenna;
A covering member that covers the electronic substrate and the sub-antenna,
The electronic device is characterized in that the substrate has an area of 600 mm 2 or less and a ratio of a major axis to a minor axis (minor axis / major axis) is ¼ or more. 前記基板の厚みは１ｍｍ以上であることを特徴とする請求項１に記載の電子機器。   The electronic device according to claim 1, wherein the substrate has a thickness of 1 mm or more. 前記基板は、セラミックスまたはジルコニアからなることを特徴とする請求項１または２に記載の電子機器。   The electronic device according to claim 1, wherein the substrate is made of ceramics or zirconia.
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