JP2017017226A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of checking whether or not a heat conduction member, which conducts heat generated from electronic components to a heat radiation member via a wiring board, is provided between a wiring board and a heat radiation member even after the wiring board is assembled to the heat radiation member.SOLUTION: When a heat radiation member 12 to which a wiring board 11 is assembled is seen from the wiring board 11, heat conduction members 130, 131 can be visually observed via a cut-out part 110 and a hole part 111. Heat conduction members 132, 133 which are coated in the same process as the heat conduction members 130, 131 can be visually observed via a cut-out part 112 and a hole part 113. A heat conduction member 134 which is coated in a region other than a region where the wiring board 11 of the heat radiation member 12 is arranged, and coated in the same process as the heat conduction member 130, 131 can be visually observed. Whether or not the heat conduction members 130, 131 are provided can be checked.SELECTED DRAWING: Figure 1

Description

  The present invention is a wiring board for wiring electronic components, the wiring board is assembled, a heat dissipation member that radiates heat generated by the electronic components via the wiring board, and provided between the wiring board and the heat dissipation member, The present invention relates to an electronic device including a heat conduction member that transfers heat generated by an electronic component to a heat dissipation member via a wiring board.

  Conventionally, a wiring board for wiring electronic components, a wiring board is assembled, a heat dissipating member for dissipating heat generated by the electronic components through the wiring substrate, and provided between the wiring substrate and the heat dissipating member. For example, there is an electronic control device disclosed in Patent Document 1 shown below as an electronic device provided with a heat conduction member that transmits the generated heat to the heat dissipation member via a wiring board.

  The electronic control device includes a heat generating component, a circuit board, a metal casing, and a heat dissipation material. Here, the heat generating component, the circuit board, the metal casing, and the heat dissipation material correspond to an electronic component, a wiring board, a heat dissipation member, and a heat conduction member.

  The heat generating component is a component constituting the control circuit. The circuit board is a plate-like member for wiring the heat generating components. The heat generating component is mounted on one surface of the circuit board. The metal casing is a member that accommodates the circuit board on which the heat generating component is mounted and that radiates the heat generated by the heat generating component through the circuit board. The circuit board is accommodated in the metal casing with the other surface facing the bottom surface of the metal casing, and is assembled to the metal casing. The heat dissipating material is a gel-like member that is provided between the area where the heat generating component of the circuit board is mounted and the metal casing, and transfers the heat generated by the heat generating component to the metal casing through the circuit board. is there. The heat dissipating material is applied to the metal housing, and then the circuit board on which the heat generating component is mounted is assembled to the metal housing, so that the other surface of the circuit board where the heat generating component is mounted and the metal It will be provided in the state which contacted each between the bottom faces of the housings. The heat generating component generates heat during operation. The heat generated by the heat generating component is transmitted to the metal casing through the circuit board and the heat dissipation material, and is radiated from the metal casing.

JP 2014-170868 A

  In the electronic control device described above, after the heat dissipation material is applied to the metal casing, the circuit board is assembled to the metal casing. As a result, a heat dissipation material is provided between the circuit board and the metal casing. For this reason, after the circuit board is assembled to the metal casing, the circuit board is blocked, and it cannot be confirmed whether or not a heat dissipation material is provided between the circuit board and the metal casing.

  The present invention has been made in view of such circumstances, and even after the wiring board is assembled to the heat radiating member, the heat generated by the electronic component is transferred between the wiring board and the heat radiating member. It is an object of the present invention to provide an electronic device that can confirm whether or not a heat conducting member that is transmitted to a heat radiating member via a substrate is provided.

  In order to solve the above problems, the present invention provides an electronic component, a wiring board for wiring the electronic component, and a wiring board on which the electronic component is mounted. The heat dissipating member that dissipates heat is provided in the heat dissipating member in the same process, and then the wiring board on which the electronic component is mounted is assembled to the heat dissipating member, so that at least a part of the electronic component of the wiring board is mounted. And a heat conduction member that is provided between the heat dissipation member and the heat dissipation member and transmits heat generated by the electronic component to the heat dissipation member via the wiring board. When the heat dissipating member assembled with is viewed from the side of the wiring board, at least a part of the heat dissipating member is visible.

  According to this structure, the heat conductive member is provided in the heat radiating member in the same process. And when the heat radiating member with which the wiring board was assembled | attached is seen from the wiring board side, it is provided so that at least one part can be visually observed. Therefore, even after the wiring board is assembled to the heat radiating member, a heat conduction member is provided between the wiring board and the heat radiating member to transmit heat generated by the electronic component to the heat radiating member via the wiring board. It can be confirmed whether or not.

It is the top view seen from the wiring board side of the electronic device in this embodiment. It is II-II arrow sectional drawing in FIG. It is the III-III arrow sectional drawing in FIG.

  Next, the present invention will be described in more detail with reference to embodiments. In this embodiment, an example in which the electronic device according to the present invention is applied to a control device that controls a radiator fan motor mounted on a vehicle will be described. First, the configuration of the control device of the present embodiment will be described with reference to FIGS.

  The control apparatus 1 shown in FIGS. 1-3 is an apparatus which is fixed to the radiator fan motor (not shown) mounted in the vehicle, and controls a radiator fan motor. The control device 1 includes electronic components 100 and 101, a wiring board 11, a heat radiating member 12, and heat conducting members 130 to 134.

  The electronic components 100 and 101 are elements that constitute a control circuit for controlling the radiator fan motor. The electronic components 100 and 101 are elements that generate heat during operation and require heat dissipation.

  The wiring board 11 is a plate-like member made of resin for wiring the electronic components 100 and 101. The wiring board 11 has a wiring pattern formed on the surface and the inner layer. The electronic component 100 is mounted in the vicinity of the edge of one surface of the wiring board 11. The electronic component 101 is mounted closer to the center than the electronic component 100 on one surface of the wiring board 11.

  The heat dissipating member 12 is a plate-like member made of a metal that is assembled with the wiring substrate 11 on which the electronic components 100 and 101 are mounted and radiates heat generated by the electronic components 100 and 101 via the wiring substrate 11. . It is also a member that constitutes a part of a housing for housing the wiring board 11 on which the electronic components 100 and 101 are mounted. For example, a member made of aluminum.

  The heat conducting members 130 to 134 are at least partially provided between the area where the electronic components 100 and 101 of the wiring board 11 are mounted and the heat radiating member, and the heat generated by the electronic components 100 and 101 is transferred to the wiring board. 11 is a member made of an insulating resin that is transmitted to the heat dissipation member 12 through 11. For example, it is a gel-like member made of silicon. The heat conducting members 130 to 134 are applied to the heat radiating member 12 in the same process, and then the wiring substrate 11 on which the electronic components 100 and 101 are mounted is assembled to the heat radiating member 12, so that at least a part of the heat conducting members 130 to 134 11 are provided in contact with each other between the other surface of the region where the electronic components 100 and 101 are mounted and the heat dissipation member.

  The heat conducting members 130 and 131 are provided between the area where the electronic components 100 and 101 of the wiring board 11 are mounted and the heat radiating member 12, and the heat generated by the electronic components 100 and 101 is transmitted via the wiring board 11. It is a member that transmits to the heat dissipation member 12. The heat conducting members 130 and 131 are applied to the heat radiating member 12, and then the wiring substrate 11 on which the electronic components 100 and 101 are mounted is assembled to the heat radiating member 12, whereby the electronic components 100 and 101 of the wiring substrate 11 are assembled. It is provided between the other surface of the mounted region and the heat dissipation member 12 in contact with each other.

  The heat conducting members 132 and 133 are provided between the heat dissipation member 12 and the region excluding the region where the electronic components 100 and 101 of the wiring board 11 are mounted, and the heat conducting members 130 and 131 are applied. It is a member for enabling confirmation. The heat conducting member 132 is provided in the vicinity of the edge of the wiring board 11. The heat conducting member 133 is provided closer to the center than the heat conducting member 132 of the wiring board 11. The heat conductive members 132 and 133 are applied to the heat dissipation member 12, and then the wiring board 11 on which the electronic components 100 and 101 are mounted is assembled to the heat dissipation member 12, whereby the electronic components 100 and 101 of the wiring board 11 are assembled. Between the other surface of the area | region except the area | region where it is mounted, and the thermal radiation member 12, it will be provided in the state which contacted each.

  The heat conducting member 134 is a member that is applied to a region excluding the region where the wiring board 11 of the heat radiating member 12 is disposed, so that it can be confirmed that the heat conducting members 130 and 131 are provided. .

  The wiring board 11 includes notches 110 and 112 and holes 111 and 113. The notches 110 and 112 and the holes 111 and 113 are the heat provided between the wiring board 11 and the heat radiating member 12 when the heat radiating member 12 to which the wiring board 11 is assembled is viewed from the wiring board 11 side. It is a part for making the conductive members 130 to 133 visible.

  The notch 110 is formed in a region around the region where the electronic component 100 is mounted and in a region where the heat conducting member 130 is provided between the heat dissipating member 12. The hole 111 is formed around the area where the electronic component 101 is mounted and in the area where the heat conduction member 131 is provided between the hole 111 and the heat dissipation member 12.

  The notch 112 is an area excluding the area where the electronic components 100 and 101 are mounted, and is formed in an area where the heat conducting member 132 is provided between the heat dissipating member 12. The hole 113 is an area excluding an area where the electronic components 100 and 101 are mounted, and is formed in an area where the heat conducting member 133 is provided between the hole 113 and the heat dissipation member 12.

  Next, the effect of the control device of this embodiment will be described.

  According to this embodiment, the heat conductive members 130 to 134 are applied to the heat dissipation member 12 in the same process. And when the heat radiating member 12 with which the wiring board 11 was assembled | attached is seen from the wiring board 11 side, it can provide visually. Therefore, even after the wiring board 11 is assembled to the heat radiating member 12, the heat generated by the electronic components 100, 101 is transferred between the wiring board 11 and the heat radiating member 12 via the wiring board 11. It is possible to confirm whether or not the heat conducting members 130 and 131 to be transmitted to 12 are provided.

  According to the present embodiment, the wiring substrate 11 includes the notch portion 110 and the hole portion 111. The notch 110 is formed in a region around the region where the electronic component 100 is mounted and in a region where the heat conducting member 130 is provided between the heat dissipating member 12. The hole 111 is formed around the area where the electronic component 101 is mounted and in the area where the heat conduction member 131 is provided between the hole 111 and the heat dissipation member 12. Therefore, when the heat radiating member 12 to which the wiring board 11 is assembled is viewed from the wiring board 11 side, the heat conducting members 130 and 131 can be visually observed through the notch 110 and the hole 111. Therefore, even after the wiring board 11 is assembled to the heat radiating member 12, it is sure to confirm whether or not the heat conducting members 130 and 131 are provided between the wiring board 11 and the heat radiating member 12. Can do.

  According to the present embodiment, the heat conducting members 132 and 133 are provided between the heat dissipation member 12 and a region of the wiring board 11 excluding the region where the electronic components 100 and 101 are mounted. The wiring board 11 includes a notch 112 and a hole 113. The notch 112 is an area excluding the area where the electronic components 100 and 101 are mounted, and is formed in an area where the heat conducting member 132 is provided between the heat dissipating member 12. The hole 113 is an area excluding an area where the electronic components 100 and 101 are mounted, and is formed in an area where the heat conducting member 133 is provided between the hole 113 and the heat dissipation member 12. Therefore, when the heat radiating member 12 to which the wiring board 11 is assembled is viewed from the wiring board 11 side, the heat applied in the same process as the heat conducting members 130 and 131 through the notch 112 and the hole 113. The conductive members 132 and 133 can be visually observed. Therefore, even after the wiring board 11 is assembled to the heat radiating member 12, it is sure to confirm whether or not the heat conducting members 130 and 131 are provided between the wiring board 11 and the heat radiating member 12. Can do.

  According to this embodiment, the heat conducting member 134 is applied to a region excluding the region where the wiring substrate 11 of the heat radiating member 12 is disposed. Therefore, when the heat radiating member 12 to which the wiring board 11 is assembled is viewed from the wiring board 11 side, the heat conducting member 134 applied in the same process as the heat conducting members 130 and 131 can be visually observed. Therefore, even after the wiring board 11 is assembled to the heat radiating member 12, it is sure to confirm whether or not the heat conducting members 130 and 131 are provided between the wiring board 11 and the heat radiating member 12. Can do.

  In the present embodiment, an example is given in which the heat conducting members 130 to 134 are all visible when the heat dissipation member 12 to which the wiring substrate 11 is assembled is viewed from the wiring substrate 11 side, but is not limited thereto. It is not a thing. The heat conductive member should just be provided so that at least one part can be visually observed.

  In the present embodiment, the wiring board 11 is notched in the area around the area where the electronic components 100 and 101 are mounted and the heat conducting members 130 and 131 are provided between the wiring board 11 and the heat dissipation member 12. Although the example provided with the part 110 and the hole part 111 is given, it is not restricted to this. The wiring board 11 only needs to include at least one of the notch 110 and the hole 111.

  In the present embodiment, the wiring board 11 is a region excluding the region where the electronic components 100 and 101 are mounted, and the region where the heat conducting members 132 and 133 are provided between the heat dissipating member 12 and Although the example provided with the notch part 112 and the hole part 113 is given, it is not restricted to this. The wiring board 11 only needs to include at least one of the notch 112 and the hole 113.

DESCRIPTION OF SYMBOLS 1 ... Control apparatus, 100, 101 ... Electronic component, 11 ... Wiring board, 110, 112 ... Notch part, 111, 113 ... Hole part, 12 ... Heat dissipation member, 130 -134 ... Heat conducting member

Claims (4)

Electronic components (100, 101);
A wiring board (11) for wiring the electronic components;
The wiring board on which the electronic component is mounted is assembled, and a heat radiating member (12) that radiates heat generated by the electronic component through the wiring board;
At least a part of the electronic component of the wiring board is mounted by assembling the wiring board on which the electronic component is mounted on the heat radiating member. A heat conducting member (130 to 134) provided between the region and the heat dissipating member and transmitting heat generated by the electronic component to the heat dissipating member through the wiring board;
An electronic device comprising:
The electronic device is characterized in that the heat conducting member is provided so that at least a part of the heat conducting member can be seen when the heat radiating member to which the wiring substrate is assembled is viewed from the wiring substrate side.   The wiring board has a notch (110) in a region around the region where the electronic component is mounted and in the region where the heat conduction member (130, 131) is provided between the wiring substrate and the heat dissipation member. The electronic device according to claim 1, further comprising at least one of a hole and a hole. The heat conducting member (132, 133) is also provided between a region excluding a region where the electronic component of the wiring board is mounted and the heat radiating member,
The wiring board is a region excluding a region where the electronic component is mounted, and a region where the heat conducting member is provided between the heat radiating member and a notch (112) and a hole. The electronic device according to claim 1, comprising at least one of (113).   2. The electronic device according to claim 1, wherein the heat conducting member is provided also in a region excluding a region where the wiring board of the heat radiating member is disposed. 3.

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