JP2017001927A - Composite particle for polishing, manufacturing method of composite particle for polishing and slurry for polishing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composite particle for polishing by carrying metal oxide on silica particles and capable of providing a smooth polished surface high in polishing rate.SOLUTION: There is provided a composite particle for polishing consisting of a composite silica particles where metal oxide is carried on a surface of silica particles and having a half width of maximum peak in X-ray diffraction using CuKα ray as a radiation source of the metal oxide by a powder X-ray diffraction measurement of over 1.0° and 2.0° or less.SELECTED DRAWING: Figure 1

Description

The present invention relates to an abrasive composite particle, a method for producing an abrasive composite particle, and an abrasive slurry.

Colloidal silica has a uniform particle size and monodisperse particle size distribution, so the surface roughness (Ra) value is small, and high surface quality is required for semiconductor devices, semiconductor devices for wiring boards, alumina hard disks, Used for final polishing of glass hard disks or optical materials. However, since there is no chemical reactivity, there is a problem that the polishing rate is slow and the process takes time. Thus, attempts have been made to support other oxides on the silica surface.

As an example in which a metal oxide is supported on silica, in Patent Document 1, a halide containing a metal or a metalloid is brought into contact with a silica powder in a fluidized state and heated to 25 to 800 ° C. to heat the metal oxide on the surface. It is disclosed that silica particles carrying succinol can be obtained.
In Patent Document 2, the surface of the silica particles contains one or more elements selected from aluminum, zirconium, titanium, iron, manganese, zinc, cerium, yttrium, calcium, magnesium, fluorine, lanthanium, and strontium, and Silica composite particles having an amorphous oxide layer containing aluminum as an essential component are disclosed.

International Publication No. 01/055028 Pamphlet JP 2013-133255 A

The method for producing silica particles disclosed in Patent Document 1 is a method called a dry method, in which silica fine particles are brought into a fluidized state in a gas phase, and a metal salt as a raw material for metal oxide is brought into contact therewith to perform thermal decomposition. This is a method for carrying a metal oxide.
In this method, the metal oxide is supported while the silica is agglomerated, which is not suitable as a method for uniformly supporting the metal oxide on each particle. If the metal oxide is not uniformly supported on each particle, the effect of improving the polishing characteristics (polishing rate, surface roughness) by supporting the metal oxide is not sufficiently exhibited. Further, silica that can be used in this method is silica obtained by a dry method or silica in a dry state, and there is a problem that silica that is dispersed in a solution such as colloidal silica cannot be used.

The silica-based composite particles disclosed in Patent Document 2 are obtained by hydrolyzing polyaluminum chloride on silica particles and coating with aluminum hydroxide, and have an amorphous oxide layer. is there. When the composite particles obtained by this method were observed, the metal oxide was agglomerated and localized and adhered to a part of the surface of the silica particles.
Further, when a glass polishing test was performed using the composite particles, the polishing rate was low and a smooth polished surface could not be obtained.

Based on the above situation, the present invention is a composite particle for polishing comprising a metal oxide supported on silica particles, and the composite particle for polishing capable of obtaining a smooth polishing surface with a high polishing rate. The purpose is to provide.

The present inventors have made various studies on the method of supporting the metal oxide on the surface of the silica particles, and supporting the metal oxide having the maximum half-value width in the X-ray diffraction within a predetermined range on the silica particles. It was. And when it grind | polished using the composite grain | particle, it discovered that a high grinding | polishing rate could be exhibited and a smooth grinding | polishing surface was obtained, and came up with this invention.

That is, the abrasive composite particles of the present invention are composed of composite silica particles having a metal oxide supported on the surface of silica particles, and X of the above metal oxide obtained by X-ray powder diffraction measurement using CuKα rays as a radiation source. The half width of the maximum peak in line diffraction is more than 1.0 ° and not more than 2.0 °.

The composite particle for polishing of the present invention is obtained by supporting a metal oxide having a maximum half-value width in X-ray diffraction of more than 1.0 ° and not more than 2.0 ° on the surface of silica particles.
Silica particles carrying such a metal oxide have a high polishing rate and become composite particles for polishing capable of obtaining a smooth polished surface.
Further, by carrying a metal oxide, chemical polishing is imparted to the silica particles.
Furthermore, when the composite particles for polishing are dispersed in a dispersion medium to make a polishing slurry, the dispersibility is excellent, and D50 of the composite particles for polishing shows a preferable value.
In addition, D50 of the composite particle for polishing here is a particle diameter measured as a secondary particle diameter of the composite particle for polishing in the dispersion medium.
In this specification, D50 is a value obtained by measuring the particle size distribution by a laser diffraction / scattering method. D50 means a 50% cumulative particle diameter on a volume basis, and is also called a median diameter.

In the abrasive composite particles of the present invention, it is desirable that the metal oxide is uniformly supported on the surface of the silica particles.
The metal oxide is preferably supported on the silica particles in a layered or island shape.

In the abrasive composite particles of the present invention, the silica particles are preferably amorphous silica particles.

In the method for producing composite particles for polishing according to the present invention, a metal salt as a raw material for metal oxide is added to a dispersion obtained by dispersing silica particles, and a metal oxide precursor is precipitated on the surface of silica particles by a neutralization reaction. A step in which the flux component is not contained in the particles before heating or firing, or the step of heating and firing at 500 ° C. or more and less than 1000 ° C. with the content of the contained flux component being less than 50 ppm, and the particles after the heating and firing. And crushing.

In the method for producing composite particles for polishing of the present invention, two steps of a step of depositing a metal oxide precursor on the surface of silica particles by a neutralization reaction and a step of heating and firing the deposited metal oxide precursor are performed. Do.
When using a method in which the metal oxide precursor is precipitated on the surface of the silica particles by a neutralization reaction, the metal oxide precursor is uniformly deposited on the surface of the silica particles, so that the localization of the metal oxide is prevented, Polishing composite particles having uniform characteristics can be obtained.
Further, by setting the content of the flux component to less than 50 ppm (including the case where the flux component is not included), the metal oxide precursor is deposited on the surface of the silica particles, and then heated and fired at 500 ° C. or more and less than 1000 ° C. The metal oxide having the half width adjusted to a predetermined range can be supported on the surface of the silica particles.
That is, by the above production method, it is possible to produce composite particles for polishing that have a high polishing rate and can obtain a smooth polished surface.

The polishing slurry of the present invention is characterized in that the polishing composite particles of the present invention are dispersed in a dispersion medium, and the D50 of the polishing composite particles dispersed in the dispersion medium is 3 to 1000 nm.
When D50 is within this range, the surface roughness (Ra) value of the polished surface is small and the surface quality is good.

The composite particle for polishing of the present invention is obtained by supporting a metal oxide having a maximum half-value width in X-ray diffraction of more than 1.0 ° and not more than 2.0 ° on the surface of silica particles.
Silica particles carrying such a metal oxide have a high polishing rate and become composite particles for polishing capable of obtaining a smooth polished surface.
Further, by carrying a metal oxide, chemical polishing is imparted to the silica particles.
Furthermore, when the composite particles for polishing are dispersed in a dispersion medium to make a polishing slurry, the dispersibility is excellent, and D50 of the composite particles for polishing shows a preferable value.

1 is an electron micrograph of the abrasive composite particles produced in Example 1. FIG. FIG. 2 is an electron micrograph of the particles produced in the reference example.

Hereinafter, the abrasive composite particles of the present invention will be described.
The composite particle for polishing of the present invention is composed of composite silica particles having a metal oxide supported on the surface of silica particles, and X-ray diffraction using CuKα rays as a radiation source of the metal oxide by powder X-ray diffraction measurement. The full width at half maximum of the peak is more than 1.0 ° and not more than 2.0 °.

FIG. 1 is an example of an electron micrograph of the abrasive composite particles of the present invention, and is an electron micrograph of the abrasive composite particles produced in Example 1 described later.
The composite particle 1 for polishing shown in FIG. 1 has silica particles 10 as base particles, and a metal oxide 20 is supported on the surface of the silica particles 10.

It is desirable that the metal oxide is uniformly supported on the surface of the silica particles.
Uniformly supported means that the metal oxide is uniformly distributed on the surface of the silica particles without being partially localized as shown in FIG.

The metal oxide is preferably supported on the silica particles in an island shape or a layer shape.

“Island-supported” means that metal oxide particles are supported in a state where the outline of each particle can be distinguished in an electron micrograph, and the metal oxide particles protrude from the surface of silica particles. Means. Specifically, it means that there are metal oxide particles protruding 2 nm or more from the surface of the silica particles.
That is, when the surface of the silica particles is the sea, a state where the metal oxide particles appear to be an island floating in the sea is referred to as an “island shape”.
Examples of the metal oxide that is easily supported in an island shape when supported on silica particles include cerium oxide and zirconium oxide.

“Supported in layers” means a state in which a metal oxide is supported like a film covering the surface of silica particles in a transmission electron micrograph.

Silica particles are not particularly limited in terms of the production method, shape, crystal type and particle size. Amorphous silica particles or crystalline silica particles may be used, but amorphous silica particles are desirable.
The crystallinity of silica particles can be determined by determining whether a tetragonal SiO ₂ (101) peak appears at 2θ = 20.00 to 23.00 ° in the diffraction pattern obtained by X-ray diffraction measurement. it can.

Commercially available silica particles can be used as the silica particles, and the method for producing the silica particles is not particularly limited, but the dry method silica obtained by the arc method or the combustion method, the wet method silica obtained by the precipitation method or the gel method, etc. Is applicable.
In addition, the shape of the silica particles can be spherical, confetti, eyebrows, chain, or the like.
Of these, spherical ones are desirable.

The average particle diameter (average primary particle diameter) of the silica particles is desirably 5 to 1000 nm, more desirably 10 to 500 nm, and further desirably 30 to 200 nm.
A polishing rate can be made higher that the average particle diameter of a silica particle is 5 nm or more. Moreover, the value of the surface roughness (Ra) of a grinding | polishing surface can be reduced as the average particle diameter of a silica particle is 1000 nm or less.

Here, the average particle diameter (average primary particle diameter) of the silica particles is a constant direction diameter (interval between two parallel lines in a fixed direction sandwiching the particles) in a field of view of 20,000 times that of a transmission electron microscope (TEM) photograph. The particle diameter (nm) defined in (1)), and the average value was obtained by measuring the diameter in a fixed direction of 1000 independent particles not overlapping in the TEM photograph.

The metal constituting the metal oxide is not particularly limited, but for example, selected from the group consisting of cerium, zirconium, aluminum, iron, zinc, manganese, tin, titanium, chromium, lanthanum, strontium, and barium. There may be mentioned at least one metal. Of these, cerium is particularly desirable.
Examples of metal oxides that are oxides of the above metals include cerium oxide (ceria), zirconium oxide (zirconia), aluminum oxide (alumina), iron oxide, zinc oxide, manganese oxide, manganese dioxide, tin oxide, and titanium oxide (titania). ), Chromium oxide, lanthanum oxide, strontium oxide and barium oxide. Of these, cerium oxide is desirable.
Further, the valence of the metal in the metal oxide is not particularly limited. For example, the valence of cerium in the cerium oxide particles may be trivalent or tetravalent. It is more preferable to carry cerium oxide particles containing trivalent cerium in view of further chemical polishing. Further, the metal oxide may be a composite oxide containing two or more of the above metals. Examples of the composite oxide include SrZrO ₃ , BaTiO ₃ , SrTiO ₃ , CeLa ₂ O ₃ F ₃ and LaOF etc. are mentioned.

When the metal oxide is deposited on the surface of the silica particles in the form of a metal oxide precursor and becomes a metal oxide by firing to be supported on the surface of the silica particles, the metal oxide precursor raw material is a metal Chlorides, nitrates, sulfates, acetates, peroxoacid salts, carbonates, metal oxoacid salts, metal alkoxides and the like. By adding an acid or an alkali to the aqueous solution of these raw materials, a precipitate such as a hydroxide or an oxalate as a metal oxide precursor is obtained and deposited on the surface of the silica particles. When the metal oxide precursor deposited on the surface of the silica particles is heated and fired, it becomes a metal oxide and is supported on the surface of the silica particles.

The average particle diameter of the metal oxide on the surface of the silica particles is preferably 0.1 to 30 nm, and more preferably 1 to 25 nm.
As shown in FIG. 1, the average particle size of the metal oxide is smaller than the average particle size (average primary particle size) of the silica particles, and the average particle size of the silica particles is equal to the average particle size of the metal oxide. 5 to 50 times is desirable.
The average particle diameter of the metal oxide can be measured by the same method as the average particle diameter (average primary particle diameter) of the silica particles.

The metal oxide in the composite particles for polishing of the present invention has a half-width of the maximum peak in X-ray diffraction using CuKα rays as a radiation source (hereinafter also simply referred to as half-width of metal oxide) of 1.0 °. And 2.0 degrees or less.

When the half width exceeds 1.0 ° and is within a range of 2.0 ° or less, the silica particles supporting such a metal oxide have a high polishing rate and a surface roughness (Ra). The composite particles for polishing can obtain a smooth polished surface with a small value.
Further, by carrying a metal oxide, chemical polishing is imparted to the silica particles.
Furthermore, when the composite particles for polishing are dispersed in a dispersion medium to make a polishing slurry, the dispersibility is excellent, and D50 of the composite particles for polishing shows a preferable value.

The average particle diameter of the composite particles for polishing of the present invention in a powder state is preferably 3 to 1000 nm, and more preferably 30 to 250 nm.
The average particle size of the composite particles for polishing can be measured by the same method as the average particle size (average primary particle size) of the silica particles.

Next, as an example of the method for producing the abrasive composite particles of the present invention, the method for producing the abrasive composite particles of the present invention will be described.
In the method for producing composite particles for polishing according to the present invention, a metal salt as a raw material for metal oxide is added to a dispersion obtained by dispersing silica particles, and a metal oxide precursor is precipitated on the surface of silica particles by a neutralization reaction. A step in which the flux component is not contained in the particles before heating or firing, or the step of heating and firing at 500 ° C. or more and less than 1000 ° C. with the content of the contained flux component being less than 50 ppm, and the particles after the heating and firing. And crushing.

In the above method, first, a dispersion liquid in which silica particles are dispersed in a dispersion medium is prepared.
As the silica particles, the above-described silica particles can be used.
The dispersion medium is not particularly limited, and water or alcohol can be used, but water is desirable from the viewpoint of production cost, and ion-exchanged water is more desirable.

In order to prevent reaggregation of particles during the surface treatment step, a dispersion stabilizer may be included in the dispersion. Dispersion stabilizers include organic polyanionic substances such as polyacrylates, celluloses such as carboxymethylcellulose and hydroxyethylcellulose, water-soluble polymers such as polyvinyl alcohol, ethanol, ethylene glycol, propylene glycol, and glycerin. Water-soluble alcohols such as these, surfactants such as sodium alkylbenzene sulfonate, and organic polyanionic materials such as polyacrylates.

A commercially available colloidal silica slurry (silica sol) is one in which silica particles are already dispersed in a dispersion medium, but a colloidal silica slurry may be purchased and used as a dispersion.
When a commercially available colloidal silica slurry is used as a dispersion, it can also be used after being diluted by adding a dispersion medium.

In addition, when silica particles obtained by dry process silica or other powders are dispersed in a dispersion medium, a metal oxide can be supported on each silica particle by performing wet grinding with a bead mill or the like. It is possible to suppress aggregation of the abrasive composite particles in the subsequent steps.

The silica particle concentration in the dispersion is preferably in the range of 0.01 to 40% by weight. In addition, when the average particle diameter of the silica particles is 200 nm or less, when the silica particle concentration exceeds 20% by weight, the viscosity of the dispersion may be remarkably increased when the metal oxide precursor is precipitated on the surface of the silica particles. Therefore, it is more desirable that the silica particle concentration is in the range of 0.01 to 20% by weight.

Next, a metal salt as a raw material for the metal oxide is added to the dispersion, and the metal oxide precursor is precipitated on the surface of the silica particles by a neutralization reaction.
Specifically, the above process can be performed by a method in which a solution containing a metal salt or a metal salt is added to the dispersion, and then an acid or alkali as a neutralizing agent is added to perform a neutralization reaction.
Alternatively, the above steps can be performed by a method of adding a metal salt while neutralizing by adding an acid or alkali as a neutralizing agent at the same time as adding a solution or metal salt containing the metal salt to the dispersion. it can.

When the neutralization reaction is performed by adding an acid or alkali as a neutralizing agent, it is desirable to adjust the pH within a range where the metal oxide precursor is precipitated. The pH at which precipitation occurs varies depending on the raw material, but it is more desirable to adjust the pH within the range of 5-11.

Examples of the metal salt that is a raw material for the metal oxide include metal chlorides, nitrates, sulfates, acetates, peroxoacid salts, carbonates, metal oxoacid salts, metal alkoxides, and the like.
Examples of the acid used for neutralization include inorganic acids or organic acids such as sulfuric acid and oxalic acid.
Examples of the alkali used for neutralization include alkali metal hydroxides (sodium hydroxide and potassium hydroxide), aqueous ammonia, ammonium salts (ammonium hydrogen carbonate and ammonium carbonate), amine compounds (organic amine compounds) and the like.

The addition amount of the metal oxide raw material is preferably 1 to 100% by weight in terms of the metal oxide with respect to 100% by weight of the silica particles. More preferably, it is 5-50 weight%, More preferably, it is 10-30 weight%.
When the addition amount of the metal oxide raw material is less than 1% by weight in terms of the metal oxide, the supported amount of the metal oxide is insufficient and the polishing rate may be lowered. Further, even if the amount of the metal oxide raw material added exceeds 100% by weight in terms of the metal oxide, a polishing rate commensurate with the increase in the amount added cannot be obtained, and the consumption of the metal oxide increases. Therefore, it is not preferable.

After the metal oxide precursor is precipitated, the silica particles are aggregated due to the precipitation reaction of the metal oxide precursor. Therefore, it is desirable to perform dispersion by wet pulverization using a bead mill or the like.

Thereafter, washing with water is desirable.
Washing with water can be performed by a known method such as pressure filtration, vacuum filtration, or ultrafiltration. When the metal salt or the acid or alkali as the neutralizing agent contains inorganic ions, it remains in the dispersion as an inorganic salt after the neutralization treatment, and thus it is desirable to perform sufficient washing with water.

Furthermore, it is desirable to perform drying and dry pulverization as necessary.
After drying, dry agglomeration can be loosened by dry pulverization with an air mill, jet mill, steam mill or the like, aggregation due to sintering is reduced, and pulverization is facilitated in the pulverization step after firing.

Next, particles obtained by precipitating a metal oxide precursor on the surface of the silica particles are not included in the particles before heating and firing, or the content of the included flux components is less than 50 ppm and 500 ° C. or more. Bake at less than 1000 ° C. Preferably it is 700-950 degreeC, More preferably, it is 800-950 degreeC.
The heating and baking time is preferably 1 to 10 hours.
The firing atmosphere is not particularly limited, and may be an air atmosphere, a nitrogen atmosphere, a vacuum atmosphere, or the like.
Moreover, the kind of heating furnace used for heat-firing is not specifically limited. It is possible to use a method in which a current flows through the resistor to generate heat, a method in which fuel is burned, a method in which heated gas is used, and the like. For example, an electric muffle furnace, a shuttle kiln, a rotary kiln, etc. are mentioned.
By this step, the metal oxide precursor becomes a metal oxide.
By setting the firing temperature to 500 ° C. or higher, the crystallinity of the metal oxide increases. On the other hand, when the firing temperature is 1000 ° C. or higher, the crystallinity of the metal oxide is increased, but it is not desirable because it easily causes sintering of silica particles and deformation of the particles. If the silica particles are sintered or deformed, pulverization becomes difficult in a later step, which causes an increase in surface roughness Ra and generation of scratches.
Further, when the firing temperature is increased to 1000 ° C. or higher, crystallization of silica begins to occur. Those containing 0.1% or more of crystallized silica are designated as substances subject to GHS classification and are not desirable because their use is legally restricted.

The particles before heating and firing do not contain a flux component, or the content of the contained flux component is less than 50 ppm.
Examples of the flux component when the flux component is less than 50 ppm include alkali metal compounds (sodium compounds, potassium compounds, etc.), alkaline earth metal compounds, and sulfates.
As a method for adjusting the content of the flux component, it is possible to reduce the flux component by repeating washing with water. Therefore, the specific resistance of the filtrate is measured when washing with water, and washing is performed until a predetermined specific resistance is obtained. It is done. The content of the flux component is the weight of the flux component element converted to an oxide, and is the weight converted to Na ₂ O in the case of a sodium compound and SO ₃ in the case of a sulfate.

Next, the particles after baking are pulverized.
The pulverization of the particles after heating and firing can be performed by an air mill, a jet mill, a steam mill, a hammer mill or the like.
By performing pulverization and loosening the sintering, it is possible to shorten the dispersion time of the wet dispersion process that is used as a slurry when the composite particles for polishing are used. If the time of the wet dispersion process is long, the supported metal oxide may be peeled off from the silica particles, which is not desirable because it causes a reduction in the polishing rate.

The abrasive composite particles of the present invention can be produced by the above process.
When the manufactured composite particles for polishing are used for polishing, the composite particles for polishing are dispersed in a dispersion medium to obtain a polishing slurry.
The polishing slurry of the present invention comprises the composite particles for polishing of the present invention dispersed in a dispersion medium,
D50 of the abrasive composite particles dispersed in the dispersion medium is 3 to 1000 nm.
Moreover, it is desirable that D50 of the abrasive composite particles dispersed in the dispersion medium is 1 to 6 times the primary particle diameter.

The dispersion medium used for the production of the polishing slurry is not particularly limited, and water or alcohol can be used. However, water is desirable from the viewpoint of production cost, and ion-exchanged water is more desirable.

D50 of the abrasive composite particles dispersed in the dispersion medium is a particle diameter measured as the secondary particle diameter of the abrasive composite particles, and is a laser diffraction / scattering type particle size analyzer (for example, Nikkiso Co., Ltd .: Model No. Microtrack) This is a value obtained by performing particle size distribution measurement using MT3300EX).

When a polishing slurry is prepared by dispersing abrasive composite particles in a dispersion medium, ideally, when the abrasive composite particles are mixed with a dispersion medium, the abrasive composite particles do not aggregate and are polished. It is preferable that the particle size (D50) of the abrasive composite particles becomes a desired value simply by mixing the composite particles for dispersion and the dispersion medium. The D50 value is higher than the desired value. Therefore, the pulverization step is performed after the abrasive composite particles are dispersed in a dispersion medium to form a coarse slurry.
As the pulverizer, for example, a media type pulverizer such as a bead mill, an attritor, a sand mill, or a ball mill can be used. For example, a dyno mill manufactured by Shinmaru Enterprises, an SC mill manufactured by Nippon Coke Industries, Ltd., and the like can be given.
The material for the beads is not particularly limited, and examples thereof include zirconia, glass, alumina, silica, and titania.
Also, a medialess pulverizer can be used as the pulverizer. Examples of the medialess pulverizer include a high-speed stirrer, a high-pressure disperser, and an ultrasonic disperser. Specific examples include a slasher manufactured by Nippon Coke Kogyo Co., Ltd. and an ecogenizer manufactured by Matsubo.

The D50 of the composite particles for polishing is reduced by the pulverization step, but the value of D50 does not change (no further decrease) when the pulverization is repeated.
The time required until D50 of the composite particles for polishing does not change is defined as the dispersion residence time.
Specifically, the particle size distribution of the polishing slurry is measured for each pulverization step, and when the difference from D50 measured after the previous pulverization step becomes 0.02 μm or less, D50 changes. Judge that it has stopped.
It is desirable that the D50 of the abrasive composite particles after the pulverization step does not change in the range of 3 to 1000 nm.
In addition, it is desirable that the composite particles for polishing of the present invention have a dispersion residence time of 9 minutes or less when a polishing slurry is produced.

The dispersion residence time varies depending on the apparatus used in the grinding step and the grinding conditions, but the test conditions for determining whether the dispersion residence time of the abrasive composite particles is 9 minutes or less are as follows. Abrasive composite particles having a dispersion residence time of 9 minutes or less under the following conditions are preferred.

The abrasive composite particles are suspended in ion exchange water to obtain a 30% by weight crude slurry. The obtained coarse slurry is pulverized by supplying it to a continuous horizontal bead mill (Dyno-mill, KDL SPECIAL, mill capacity: 600 mL) using a metering pump.
The particle size distribution of the polishing slurry was measured for each grinding process, and when the difference from D50 measured after the previous grinding process was 0.02 μm or less, it was determined that D50 no longer changed. Stop the distribution.
The dispersion conditions are as follows.
Beads: Glass beads (φ0.8mm)
Bead weight: 795g
Metering pump flow rate: 200 mL / min (residence time in one grinding process: 1.5 min)
Mill peripheral speed: 14m / s
The dispersion time required to stop the dispersion is defined as the dispersion residence time.

When the dispersion residence time of the composite particles for polishing of the present invention is as short as 9 minutes or less, the time required for pulverizing to the desired particle diameter when manufacturing the polishing slurry is short, and the manufacturing of the polishing slurry It means that efficiency is good. It also means that it is highly convenient for users who purchase it as composite particles for polishing and mix it with a dispersion medium themselves immediately before use to prepare a slurry for polishing and use it in the polishing step.

The polishing slurry of the present invention can be used in the polishing step after pulverizing the abrasive composite particles to a desired particle size and further diluting with a dispersion medium as necessary to obtain a desired concentration.

The abrasive composite particles and the abrasive slurry of the present invention can be applied to various objects to be polished.
For example, conventionally, colloidal silica, cerium oxide, chromium oxide, bengara (Fe ₂ O ₃ ), and the like can be applied to an object to be polished.
The object of polishing to which the composite particles for polishing of the present invention are applied is not particularly limited. For example, a glass substrate, a metal plate, a stone, sapphire, silicon nitride, silicon carbide, silicon oxide, gallium arsenide, gallium arsenide, indium arsenide, and Examples thereof include indium phosphide.
Examples of the use of the object to be polished include semiconductor devices for semiconductor substrates and wiring substrates, alumina hard disks, glass hard disks, and optical materials.

The abrasive composite particles and the slurry for polishing of the present invention may be used by appropriately mixing with other components depending on the application.
Examples of other components include acids, alkalis, chelating agents, antifoaming agents, pH adjusting agents, dispersants, viscosity adjusting agents, anti-aggregating agents, lubricants, reducing agents, rust preventing agents, and known polishing materials. Two or more of these may be used in combination as long as the effects of the present invention are not impaired.

Examples of the present invention will be described below, but the present invention is not limited to these examples.

Example 1
Ion exchange water was added to a colloidal silica slurry (40 wt%) having an average primary particle diameter of 75 nm to obtain a slurry having a silica particle concentration of 10 wt%.
The slurry was adjusted to 45 ° C. while stirring, and while maintaining this temperature, 50 mL of an aqueous cerium chloride solution (250 g / L) corresponding to 25% by weight in terms of CeO ₂ per 100% by weight of silica particles. Was added over 180 minutes. At this time, ammonia water was added so as to maintain the pH at 8, and cerium hydroxide was precipitated on the surface of the silica particles. The slurry after cerium hydroxide precipitation was filtered and washed with ion exchange water, and dried at a temperature of 120 ° C. for 8 hours. The obtained dried product was pulverized using an air mill and heated and fired in an air atmosphere at 900 ° C. for 1 hour. Thereafter, grinding was again performed using an air mill to obtain composite particles for polishing.

(Comparative Example 1)
Ion exchange water was added to a colloidal silica slurry (40 wt%) having an average primary particle diameter of 75 nm to obtain a slurry having a silica particle concentration of 10 wt%.
The slurry was adjusted to 45 ° C. while stirring, and while maintaining this temperature, 50 mL of an aqueous cerium chloride solution (250 g / L) corresponding to 25% by weight in terms of CeO ₂ per 100% by weight of silica particles. Was added over 180 minutes. At this time, an aqueous sodium hydroxide solution was added so as to maintain the pH at 8, and cerium hydroxide was precipitated on the surface of the silica particles. The slurry after precipitation of cerium hydroxide was filtered and washed with ion-exchanged water, and washed with water until the specific resistance of the filtrate reached 10,000 Ω · cm to obtain a washed cake. The obtained cake was dried at a temperature of 120 ° C. for 8 hours. The obtained dried product was pulverized using an air mill and heated and fired in an air atmosphere at 300 ° C. for 1 hour. Thereafter, grinding was again performed using an air mill to obtain composite particles for polishing.

(Comparative Example 2)
In Comparative Example 2, abrasive composite particles were obtained in the same manner as in Comparative Example 1, except that the firing temperature in the firing step was changed from 300 ° C. to 1000 ° C. in Comparative Example 1.

(Comparative Example 3)
Comparative Example 3 was the same as Comparative Example 1 except that the firing temperature in the firing step was changed from 300 ° C. to 900 ° C., and the specific resistance of the filtrate in the water washing step was changed to 2000 Ω · cm. Composite particles were obtained.

(Comparative Example 4)
This is a colloidal silica slurry having an average primary particle diameter of 75 nm used in Example 1.

(Reference example)
Ion exchange water was added to a colloidal silica slurry (40 wt%) having an average primary particle diameter of 75 nm to obtain a slurry having a silica particle concentration of 10 wt%.
0.5 L of this slurry was adjusted to 90 ° C., and 298 mL of an aqueous solution of cerium nitrate (42 g / L) corresponding to 25% by weight in terms of CeO ₂ per 100% by weight of silica particles was added with stirring. The slurry was heated at 90 ° C. for 3 hours with stirring while maintaining this temperature. After drying at a temperature of 120 ° C. for 8 hours, the mixture was heated and fired at 900 ° C. in an air atmosphere for 1 hour. Then, it grind | pulverized again using the air mill.
This production method is a method of supporting cerium oxide generated by hydrolysis (thermal decomposition) of cerium nitrate without performing a neutralization reaction.

(Microscopic observation)
The particles produced in Example 1 and Reference Example were observed with an electron microscope using a transmission electron microscope.
1 is an electron micrograph of the abrasive composite particles produced in Example 1. FIG.
FIG. 2 is an electron micrograph of the particles produced in the reference example.
The composite particles for polishing produced in Example 1 are produced through a method of precipitating the metal oxide precursor on the surface of the silica particles by a neutralization reaction, so that the metal oxide is supported uniformly and in an island shape. Has been.
On the other hand, the particles produced in the reference example are only a lump of metal oxide that is localized and attached to a part of the surface of the silica particle, and the metal oxide is uniformly supported on the surface of the silica particle. It could not be said that the composite silica particles were allowed to enter.

(Measurement of powder X-ray diffraction)
With respect to the composite particles for polishing obtained in Example 1 and Comparative Examples 1 to 3, a powder X-ray diffraction pattern (also simply referred to as an X-ray diffraction pattern) was measured under the following conditions.
Use machine: RINT-UltimaIII made by Rigaku Corporation
Radiation source: CuKα
Voltage: 40 kV
Current: 40 mA
Sample rotation speed: non-rotating divergent slit: 1.00 mm
Divergence length restriction slit: 10 mm
Scattering slit: Open light receiving slit: Open scanning mode: FT
Counting time: 2.0 seconds Step width: 0.0200 °
Operation axis: 2θ / θ
Scanning range: 10.000 to 70.0000 °
Integration count: 1 time Cubic CeO ₂ : PDF card 01-089-8436
Tetragonal SiO ₂ : PDF card 01-082-0512

(Measurement of half width)
About the composite particles for polishing obtained in Example 1 and Comparative Examples 1 to 3, the half-value of the maximum peak at 27.00 to 31.00 ° of cubic CeO ₂ from the diffraction pattern obtained by X-ray diffraction measurement The width was measured. In Example 1, a cubic CeO ₂ (111) peak appeared at 2θ = 28.52 °, and the half-value width was 1.90 °. The half widths of other Comparative Examples 1 to 3 are also shown in Table 1.

(Determination of crystallinity of silica particles)
About the composite particles for polishing obtained in Example 1 and Comparative Examples 1 to 3, tetragonal SiO ₂ (101) at 2θ = 20.00 to 23.00 ° from the diffraction pattern obtained by X-ray diffraction measurement. Whether it was crystalline or amorphous was judged by whether or not a peak appeared.
The silica particles of the composite particles for polishing obtained in Example 1 and Comparative Examples 1 to 3 were amorphous.

(Measurement of flux content)
About the composite particle | grains for grinding | polishing obtained in Example 1 and Comparative Examples 1-3, elemental analysis was performed by the EZ scan which is a contained element scanning function of a fluorescent X-ray-analysis apparatus (Rigaku Corporation make: model number ZSX PrimusII). Set the pressed sample on the measurement sample stage and select the following conditions (measurement range: FU, measurement diameter: 30 mm, sample form: oxide, measurement time: long, atmosphere: vacuum), and inclusion of flux components The amount was measured. The results are shown in Table 1.
The content of the flux component to be measured is oxide conversion (Na ₂ O or SO ₃ ).
Moreover, the measurement of flux content was performed with respect to the dried product before baking.
In Example 1, since no flux component is contained, “-” is shown in Table 1.

(Dispersion of particles)
The abrasive composite particles obtained in Example 1 and Comparative Examples 1 to 3 were dispersed in a dispersion medium by the following procedure and then pulverized.
The composite particles for polishing were suspended in ion exchange water to obtain a 30% by weight crude slurry. The obtained coarse slurry was pulverized by supplying it to a continuous horizontal bead mill (Dyno-mill, KDL SPECIAL, mill capacity: 600 mL) using a metering pump. The particle size distribution of the polishing slurry was measured for each pulverization step, and the dispersion was stopped when the difference from D50 measured after the previous pulverization step was 0.02 μm or less.
The dispersion conditions are as follows.
Beads: Glass beads (φ0.8mm)
Bead weight: 795g
Metering pump flow rate: 200 mL / min (residence time in one grinding process: 1.5 min)
Mill peripheral speed: 14m / s
Table 1 shows the dispersion time required to stop the dispersion as the dispersion residence time.

(Measurement of particle size distribution)
The particle size distribution was measured with a laser diffraction / scattering particle size analyzer (manufactured by Nikkiso Co., Ltd .: Model No. Microtrac MT3300EX). First, 60 mL of ion-exchanged water was added to 0.1 g of a sample (crude slurry or slurry after pulverization), and a suspension for measurement was prepared by thoroughly stirring at room temperature using a glass rod. In addition, the dispersion | distribution operation using an ultrasonic wave was not performed. Thereafter, 180 mL of ion-exchanged water is prepared in a sample circulator, and the suspension is dropped so that the transmittance is 0.71 to 0.94, and ultrasonic dispersion is not performed at a flow rate of 50%. The measurement was carried out while circulating.
Table 1 shows the D50 calculated by the particle size distribution measurement as “before dispersion” for D50 of the coarse slurry and “after dispersion” for D50 of the slurry after pulverization.

(Preparation of polishing slurry)
The slurry (Example 1 and Comparative Examples 1 to 3) or colloidal silica slurry (Comparative Example 4) after pulverization is diluted with ion-exchanged water, and the solid content concentration of the abrasive composite particles (or silica particles) is 3 A polishing slurry having a weight% was prepared.

(Glass plate polishing test)
The glass plate was polished using each polishing slurry under the following conditions. In order to match the initial surface properties of the glass, the surface roughness Ra was confirmed to be in the range of 0.7 to 0.8 nm by polishing with cerium oxide in advance.
Glass plate used: Soda lime glass (manufactured by Matsunami Glass Industry Co., Ltd. Size 36 × 36 × 1.3 mm, specific gravity 2.5 g / cm ³ , Ra = 0.7 to 0.8 nm)
Polishing machine: Desktop polishing machine (manufactured by MT Corporation, MAT BC-15C polishing surface plate diameter 300 mmφ)
Polishing pad: Polyurethane foam pad (Nitta Haas Co., Ltd .: MHN-15A, no ceria impregnation)
Polishing pressure: 101 g / cm ²
Plate rotation speed: 70rpm
Supply amount of polishing slurry: 100 mL / min

(Polishing rate evaluation)
The weight of the glass plate before and after the glass plate polishing test was measured with an electronic balance. The thickness reduction amount of the glass plate was calculated from the weight reduction amount, the area of the glass plate, and the specific gravity of the glass plate, and the polishing rate (μm / min) was calculated.
Three glass plates were polished at the same time, and after polishing for 30 minutes, the glass was removed and the weight was measured.
The polishing rate in each example and comparative example is shown in Table 1.

(Surface roughness Ra measurement)
Arithmetic mean roughness (Ra) was measured using a non-contact surface texture measuring apparatus (New View 7100, Zygo Corp., measurement principle: scanning white light interferometry, objective lens: 50 times, measurement field of view 186 × 139 μm).
The surface roughness (Ra) of the glass obtained by the polishing rate evaluation was measured and shown in Table 1.

The composite particles for polishing produced in Example 1 have a high polishing rate because the metal oxide having a half-value width in a predetermined range is supported on the surface of the silica particles, and the surface roughness after polishing for 30 minutes. The value of (Ra) is also small. That is, it can be said that it is a composite particle for polishing that has a high polishing rate and a small surface roughness (Ra) value and can obtain a smooth polished surface.
Further, D50 of the composite particles for polishing dispersed in the dispersion medium when dispersed in the dispersion medium to obtain a polishing slurry shows a preferable value (0.23 μm). Furthermore, the dispersion residence time is 4.5 minutes, which is excellent in the production efficiency of the polishing slurry.

On the other hand, in the composite particles for polishing produced in Comparative Examples 1 to 3, the value of the surface roughness (Ra) after polishing for 30 minutes is increased, and in the composite particles for polishing produced in Comparative Examples 1 and 3, The polishing rate is low.
In Comparative Example 4 in which only silica particles are used as the abrasive particles, the polishing rate is considerably low.

1 Composite particles for polishing 10 Silica particles 20 Metal oxide

Claims (6)

Composed of composite silica particles having a metal oxide supported on the surface of silica particles,
The half-width of the maximum peak in the X-ray diffraction using CuKα ray as a radiation source of the metal oxide by powder X-ray diffraction measurement is more than 1.0 ° and not more than 2.0 °. Composite particles for polishing. The composite particle for polishing according to claim 1, wherein the metal oxide is uniformly supported on a surface of the silica particle. The composite particle for polishing according to claim 1 or 2, wherein the metal oxide is supported on the silica particle in a layered or island shape. The composite particle for polishing according to any one of claims 1 to 3, wherein the silica particle is an amorphous silica particle. Adding a metal salt as a raw material for the metal oxide to the dispersion obtained by dispersing the silica particles, and precipitating the metal oxide precursor on the surface of the silica particles by a neutralization reaction;
The step of heat-firing at 500 ° C. or more and less than 1000 ° C. with the flux component not being contained in the particles before heating or firing, or the content of the contained flux component being less than 50 ppm;
And a step of pulverizing the particles after the heating and baking. The abrasive composite particles according to any one of claims 1 to 4 are dispersed in a dispersion medium,
A polishing slurry, wherein D50 of the polishing composite particles dispersed in the dispersion medium is 3 to 1000 nm.