JP2016507160A5 - - Google Patents

Download PDF

Info

Publication number
JP2016507160A5
JP2016507160A5 JP2015556088A JP2015556088A JP2016507160A5 JP 2016507160 A5 JP2016507160 A5 JP 2016507160A5 JP 2015556088 A JP2015556088 A JP 2015556088A JP 2015556088 A JP2015556088 A JP 2015556088A JP 2016507160 A5 JP2016507160 A5 JP 2016507160A5
Authority
JP
Japan
Prior art keywords
laser diode
circuit board
printed circuit
heat sink
coupler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015556088A
Other languages
English (en)
Japanese (ja)
Other versions
JP6325002B2 (ja
JP2016507160A (ja
Filing date
Publication date
Priority claimed from US13/758,804 external-priority patent/US8958448B2/en
Application filed filed Critical
Publication of JP2016507160A publication Critical patent/JP2016507160A/ja
Publication of JP2016507160A5 publication Critical patent/JP2016507160A5/ja
Application granted granted Critical
Publication of JP6325002B2 publication Critical patent/JP6325002B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015556088A 2013-02-04 2014-01-29 レーザダイオードデバイスにおける熱管理 Active JP6325002B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/758,804 2013-02-04
US13/758,804 US8958448B2 (en) 2013-02-04 2013-02-04 Thermal management in laser diode device
PCT/US2014/013467 WO2014120697A1 (en) 2013-02-04 2014-01-29 Thermal management in laser diode device

Publications (3)

Publication Number Publication Date
JP2016507160A JP2016507160A (ja) 2016-03-07
JP2016507160A5 true JP2016507160A5 (OSRAM) 2017-02-16
JP6325002B2 JP6325002B2 (ja) 2018-05-16

Family

ID=50150789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015556088A Active JP6325002B2 (ja) 2013-02-04 2014-01-29 レーザダイオードデバイスにおける熱管理

Country Status (6)

Country Link
US (1) US8958448B2 (OSRAM)
EP (1) EP2951897B1 (OSRAM)
JP (1) JP6325002B2 (OSRAM)
KR (1) KR102161332B1 (OSRAM)
CN (1) CN104969426B (OSRAM)
WO (1) WO2014120697A1 (OSRAM)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6494532B2 (ja) * 2013-02-28 2019-04-03 ローレンス リバモア ナショナル セキュリティー， エルエルシー コンパクトな高電流高効率レーザダイオードドライバ
JP2015206818A (ja) * 2014-04-17 2015-11-19 日立金属株式会社 光通信モジュール
CN106154703B (zh) * 2015-03-30 2018-01-02 中强光电股份有限公司 投影装置
KR102496479B1 (ko) 2015-10-22 2023-02-06 삼성전자주식회사 3차원 카메라와 투과도 측정방법
US10386486B2 (en) 2016-06-21 2019-08-20 Microsoft Technology Licensing, Llc Systems and methods for time of flight laser pulse engineering
US10051723B2 (en) 2016-07-29 2018-08-14 Microsoft Technology Licensing, Llc High thermal conductivity region for optoelectronic devices
CN108336040A (zh) * 2017-01-19 2018-07-27 深圳奥比中光科技有限公司 芯片嵌入装置
KR102629637B1 (ko) * 2018-04-19 2024-01-30 소니 세미컨덕터 솔루션즈 가부시키가이샤 반도체 레이저 구동 장치 및 그 제조 방법
CN114690338A (zh) * 2020-12-30 2022-07-01 华为技术有限公司 发送光组件、双向光组件、光模块、及光通信设备
US20230106189A1 (en) * 2021-10-01 2023-04-06 Lawrence Livermore National Security, Llc Patterning of diode/substrate interface to reduce thermal lensing

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4752109A (en) 1986-09-02 1988-06-21 Amp Incorporated Optoelectronics package for a semiconductor laser
US4901324A (en) 1988-12-19 1990-02-13 Laser Diode Products, Inc. Heat transfer device for cooling and transferring heat from a laser diode device and associated heat generating elements
JPH11185273A (ja) 1997-12-16 1999-07-09 Sony Corp 光ピックアップ装置
US6285476B1 (en) 1998-06-10 2001-09-04 Lsa, Inc. Laser communication system and methods
US20020097468A1 (en) 2001-01-24 2002-07-25 Fsona Communications Corporation Laser communication system
US6653557B2 (en) 2002-02-27 2003-11-25 Jds Uniphase Corporation Faraday cage and ceramic walls for shielding EMI
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
KR100499005B1 (ko) 2002-12-27 2005-07-01 삼성전기주식회사 다채널 블록형 광원소자가 패키징된 인쇄회로기판
JP2005317925A (ja) * 2004-04-02 2005-11-10 Ricoh Co Ltd 光源装置、記録装置、製版装置及び画像形成装置
US20060018098A1 (en) 2004-07-22 2006-01-26 Adrian Hill PCB board incorporating thermo-encapsulant for providing controlled heat dissipation and electromagnetic functions and associated method of manufacturing a PCB board
EP1624541A1 (en) * 2004-08-06 2006-02-08 Arima Optoelectronics Corporation Laser diode device
US7235880B2 (en) 2004-09-01 2007-06-26 Intel Corporation IC package with power and signal lines on opposing sides
US8412052B2 (en) 2004-10-22 2013-04-02 Intel Corporation Surface mount (SMT) connector for VCSEL and photodiode arrays
US20070158799A1 (en) 2005-12-29 2007-07-12 Chin-Tien Chiu Interconnected IC packages with vertical SMT pads
TWI402952B (zh) * 2007-09-27 2013-07-21 三洋電機股份有限公司 電路裝置及其製造方法
US8376577B2 (en) 2007-11-05 2013-02-19 Xicato, Inc. Modular solid state lighting device
US20100072511A1 (en) 2008-03-25 2010-03-25 Lin Charles W C Semiconductor chip assembly with copper/aluminum post/base heat spreader
US8299604B2 (en) 2008-08-05 2012-10-30 Cooligy Inc. Bonded metal and ceramic plates for thermal management of optical and electronic devices
US8292449B2 (en) * 2009-07-24 2012-10-23 Remote Ocean Systems, Inc. Modular lamp for illuminating a hazardous underwater environment
US8201968B2 (en) 2009-10-05 2012-06-19 Lighting Science Group Corporation Low profile light
US8320621B2 (en) 2009-12-21 2012-11-27 Microsoft Corporation Depth projector system with integrated VCSEL array
JP5516948B2 (ja) * 2009-12-25 2014-06-11 カシオ計算機株式会社 光源装置及びプロジェクタ
US8018980B2 (en) 2010-01-25 2011-09-13 Lawrence Livermore National Security, Llc Laser diode package with enhanced cooling
WO2012015724A1 (en) 2010-07-30 2012-02-02 Corning Incorporated Frequency doubled semiconductor laser having heat spreader on shg crystal
JP2012049315A (ja) 2010-08-26 2012-03-08 Sae Magnetics(H.K.)Ltd 回路基板
CN102412212A (zh) * 2010-09-21 2012-04-11 王维汉 电子/光电组件的散热装置
US8888331B2 (en) 2011-05-09 2014-11-18 Microsoft Corporation Low inductance light source module
EP2772676B1 (de) 2011-05-18 2015-07-08 Sick Ag 3D-Kamera und Verfahren zur dreidimensionalen Überwachung eines Überwachungsbereichs
US8537873B2 (en) 2011-07-20 2013-09-17 Jds Uniphase Corporation High power surface mount technology package for side emitting laser diode

Similar Documents

Publication Publication Date Title
JP2016507160A5 (OSRAM)
USD710318S1 (en) Semiconductor device
USD710317S1 (en) Semiconductor device
JP2012060132A5 (OSRAM)
WO2016100657A3 (en) Method of making a light emitting diode array on a backplane
WO2012069929A8 (en) Optical circuit board
JP2014512093A5 (OSRAM)
JP2017101982A5 (OSRAM)
JP2012109480A5 (OSRAM)
JP2016096292A5 (OSRAM)
JP2014235279A5 (OSRAM)
MX368460B (es) Miembro de enfriamiento para un sistema de iluminacion y/o señalizacion.
JP2016015822A5 (OSRAM)
JP2014053603A5 (OSRAM)
JP2013162031A5 (OSRAM)
US9699886B2 (en) Electronic device
JP2013058663A5 (OSRAM)
CL2014001568A1 (es) Servidor de alimentos o bebidas incluye: un recipiente, un nucleo termico que incluye un cuerpo hueco con al menos un elemento de acoplamiento interno para acoplar al menos un elemento de acoplamiento externo en dicho recipiente para retener dicho nucleo termico en dicho recipiente, una porcion central para la transferencia de calor con dicha base, donde el elemento de acoplamiento externo comprende: un hombro, un segmento roscado externo, una nervadura.
JP2015102648A5 (OSRAM)
JP2013250441A5 (ja) 光デバイス
JP2015513220A5 (OSRAM)
JP2015153823A5 (OSRAM)
JP2016006821A5 (OSRAM)
JP2015228396A5 (OSRAM)
JP2015106663A5 (OSRAM)