JP2016219817A - Light-emitting device and illumination device - Google Patents

Light-emitting device and illumination device Download PDF

Info

Publication number
JP2016219817A
JP2016219817A JP2016138412A JP2016138412A JP2016219817A JP 2016219817 A JP2016219817 A JP 2016219817A JP 2016138412 A JP2016138412 A JP 2016138412A JP 2016138412 A JP2016138412 A JP 2016138412A JP 2016219817 A JP2016219817 A JP 2016219817A
Authority
JP
Japan
Prior art keywords
flexible substrate
light emitting
emitting device
electrode
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016138412A
Other languages
Japanese (ja)
Other versions
JP6148382B2 (en
Inventor
広次 福本
Koji Fukumoto
広次 福本
豊 高茂
Yutaka Takashige
豊 高茂
若明 糸原
Wakaaki Itohara
若明 糸原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2016138412A priority Critical patent/JP6148382B2/en
Publication of JP2016219817A publication Critical patent/JP2016219817A/en
Application granted granted Critical
Publication of JP6148382B2 publication Critical patent/JP6148382B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device capable of being cut so as to easily cope with an illumination device whose design is changed.SOLUTION: A plurality of electrodes 2 is formed on a flexible substrate 1 on which a plurality of LEDs 3 is mounted. Part of the electrodes 2 is covered by a surface film 6. The LEDs 3 are electrically connected to the electrodes 2 through holes formed in the surface film 6. The LEDs 3 mounted on the flexible substrate 1 and areas where the electrodes 2 are exposed between the LEDs 3 are provided. At the areas, cutting positions of the flexible substrate 1 are set.SELECTED DRAWING: Figure 1

Description

本発明は、照明装置に装着可能な、発光素子を利用した発光装置に関する。   The present invention relates to a light-emitting device using a light-emitting element that can be attached to a lighting device.

近年、照明装置の光源として、低消費電力、長寿命であるLEDが用いられている。蛍光灯のような照明装置にLEDを用いる場合、複数のLEDを一列に並べられた発光装置が使用される。   In recent years, LEDs with low power consumption and long life have been used as light sources for lighting devices. When LEDs are used in an illumination device such as a fluorescent lamp, a light emitting device in which a plurality of LEDs are arranged in a row is used.

発光装置は、照明装置の長さに応じた長さとされる。しかし、照明装置の長さは一定ではないので、照明装置に応じた長さの発光装置を製造しなければならない。そこで、長さの異なる照明装置に対応できるように、所望の長さに切断可能な発光装置が特許文献1に開示されている。   The light emitting device has a length corresponding to the length of the lighting device. However, since the length of the lighting device is not constant, a light-emitting device having a length corresponding to the lighting device must be manufactured. Thus, Patent Document 1 discloses a light-emitting device that can be cut to a desired length so as to be compatible with lighting devices having different lengths.

フレキシブル基板に所定の間隔をおいてLEDが配置され、フレキシブル基板が軟性樹脂で覆われる。LEDは、数個の発光体を一組とした一つのユニットを複数配列することで一つの発光体を構成すると共に、フレキシブル基板の一端部のみに外部電源への配線コードが接続される。各ユニット間に薄板状の電極金具が配置され、電極金具が形成された箇所を切断することにより、発光体の長さを所望の長さに形成可能とされる。   LEDs are arranged on the flexible substrate at a predetermined interval, and the flexible substrate is covered with a soft resin. The LED constitutes one light emitter by arranging a plurality of one unit composed of several light emitters, and a wiring cord to an external power source is connected to only one end of the flexible substrate. A thin plate-shaped electrode metal fitting is disposed between the units, and a portion where the electrode metal fitting is formed is cut, so that the length of the light emitter can be formed to a desired length.

特許第3916651号公報Japanese Patent No. 3916651

上記の発光装置では、等間隔に配置されたユニット毎の電極金具の箇所においてのみ切断される。切断されたフレキシブル基板のユニット数に応じて、発光装置に搭載されるLEDの個数が決まり、発光装置の長さも決まる。そのため、照明装置の設計変更によって長さが変更されたり、LEDの個数が変更されたとき、電極金具の配置やLEDの配置を変更しなければならず、手間がかかる。このように、上記の発光装置では、長さなどの変更に容易に対応できず、製品として汎用性がない。   In the above light emitting device, cutting is performed only at the positions of the electrode fittings for each unit arranged at equal intervals. The number of LEDs mounted on the light emitting device is determined according to the number of units of the cut flexible substrate, and the length of the light emitting device is also determined. Therefore, when the length is changed due to the design change of the lighting device or the number of LEDs is changed, the arrangement of the electrode fittings and the arrangement of the LEDs must be changed, which takes time. As described above, the light-emitting device described above cannot easily cope with a change in length or the like, and is not versatile as a product.

本発明は、上記に鑑み、装着される照明装置に設計変更があっても、容易に対応可能な汎用性の高い発光装置の提供を目的とする。   In view of the above, an object of the present invention is to provide a highly versatile light-emitting device that can easily cope with a change in design of a mounted lighting device.

本発明は、複数の発光素子が実装されるフレキシブル基板に複数の電極が形成され、電極の一部が表面フィルムに覆われ、発光素子は表面フィルムに形成された孔を通じて電極に電気的に接続され、フレキシブル基板に実装された発光素子と発光素子との間に電極が露出した領域が設けられ、前記領域にフレキシブル基板の切断位置が設定されるものである。   In the present invention, a plurality of electrodes are formed on a flexible substrate on which a plurality of light emitting elements are mounted, a part of the electrodes are covered with a surface film, and the light emitting elements are electrically connected to the electrodes through holes formed in the surface film. A region where the electrodes are exposed is provided between the light emitting element mounted on the flexible substrate and the cutting position of the flexible substrate is set in the region.

電極は、フレキシブル基板の一端から他端まで配線される。   The electrode is wired from one end of the flexible substrate to the other end.

複数の発光素子を実装したフレキシブル基板がリール状にされる。   A flexible substrate on which a plurality of light emitting elements are mounted is formed into a reel.

このように、隣り合う発光素子の間に電極が露出した領域が設けられることにより、この領域内において、どこでもフレキシブル基板を切断することができ、切断位置に応じて発光装置の長さを調整することが可能となる。   Thus, by providing the area | region where the electrode was exposed between adjacent light emitting elements, a flexible substrate can be cut | disconnected anywhere in this area | region, and the length of the light-emitting device is adjusted according to a cutting position. It becomes possible.

本発明によると、設計変更により装着する照明装置の長さに変更があっても、容易に対応することができ、汎用性の高い発光装置を実現できる。   According to the present invention, even if there is a change in the length of a lighting device to be mounted due to a design change, it is possible to easily cope with it and to realize a highly versatile light emitting device.

本発明の発光装置の斜視図The perspective view of the light-emitting device of this invention 発光装置の断面図Cross section of light emitting device 分断前の発光装置の斜視図Perspective view of light emitting device before cutting 分断後の発光装置の斜視図Perspective view of light-emitting device after cutting コネクタに接続された発光装置の断面図Cross-sectional view of light-emitting device connected to connector 発光装置を装着した照明装置の分解斜視図Exploded perspective view of lighting device equipped with light emitting device 照明装置のベースフレームの斜視図Perspective view of base frame of lighting device

本実施形態の発光装置を図1に示す。発光装置は、フレキシブル基板1に電極2が形成され、複数の発光素子としてLED3がフレキシブル基板1に実装されたものであり、照明装置に装着される。   The light emitting device of this embodiment is shown in FIG. In the light emitting device, an electrode 2 is formed on a flexible substrate 1, and LEDs 3 are mounted on the flexible substrate 1 as a plurality of light emitting elements, and the light emitting device is attached to a lighting device.

フレキシブル基板1として、柔軟性のあるフレキシブルプリント基板(FPC)が用いられ、フレキシブル基板1が直線の帯状に形成される。フレキシブル基板1は、裏面フィルム5の上に電極2が形成された構造とされる。電極2は、ポリイミド製の裏面フィルム5に銅箔が接着剤により貼り付けられることにより形成される。2本の電極2が平行にフレキシブル基板1に沿って配され、各電極2は、フレキシブル基板1の一端から他端まで直線状に配線される。   As the flexible substrate 1, a flexible flexible printed circuit board (FPC) is used, and the flexible substrate 1 is formed in a linear strip shape. The flexible substrate 1 has a structure in which an electrode 2 is formed on a back film 5. The electrode 2 is formed by bonding a copper foil to the polyimide back film 5 with an adhesive. Two electrodes 2 are arranged in parallel along the flexible substrate 1, and each electrode 2 is wired linearly from one end of the flexible substrate 1 to the other end.

そして、フレキシブル基板1に、電極2を覆う表面フィルム6が形成される。ポリイミド製の表面フィルム6が裏面フィルム5および電極2の上に、接着剤により貼り付けられる。表面フィルム6は、電極2全体を覆わず、電極2の一部を覆う。すなわち、表面フィルム6は、一定間隔に配される。表面フィルム6に覆われない電極2は、外部に露出する。   And the surface film 6 which covers the electrode 2 is formed in the flexible substrate 1. FIG. A surface film 6 made of polyimide is pasted on the back film 5 and the electrode 2 with an adhesive. The surface film 6 does not cover the entire electrode 2 but covers a part of the electrode 2. That is, the surface film 6 is arranged at regular intervals. The electrode 2 not covered with the surface film 6 is exposed to the outside.

LED3は、フレキシブル基板1に沿って一定間隔に一列に並べて配置される。表面フィルム6の中央に、LED3の電気的接続用の孔7が形成され、チップ型のLED3が表面フィルム6に搭載される。LED3のアノード端子およびカソード端子がそれぞれ電極2に半田8により接合されることにより、LED3はフレキシブル基板1に実装される。したがって、各LED3は同じ電極2に接続され、各LED3は直列に接続される。そして、LED3の周囲の電極2が表面フィルム6に覆われ、隣り合うLED3間の電極2は露出している。   The LEDs 3 are arranged in a line along the flexible substrate 1 at regular intervals. A hole 7 for electrical connection of the LED 3 is formed in the center of the surface film 6, and the chip-type LED 3 is mounted on the surface film 6. The LED 3 is mounted on the flexible substrate 1 by bonding the anode terminal and the cathode terminal of the LED 3 to the electrode 2 with solder 8. Therefore, each LED3 is connected to the same electrode 2, and each LED3 is connected in series. And the electrode 2 around LED3 is covered with the surface film 6, and the electrode 2 between adjacent LED3 is exposed.

複数のLED3を実装した長尺のフレキシブル基板1は、エンボステーピング品としてリールから供給される。そして、図3,4に示すように、露出した電極2においてカッター、鋏などの刃物9で切断することにより、フレキシブル基板1が分断される。分断されたフレキシブル基板1は、それぞれ発光装置として使用される。分断されたフレキシブル基板1においても、フレキシブル基板1の両端まで電極2が配線されている。   The long flexible substrate 1 on which a plurality of LEDs 3 are mounted is supplied from a reel as an embossed taping product. 3 and 4, the flexible substrate 1 is divided by cutting the exposed electrode 2 with a cutter 9 such as a cutter or a scissors. Each divided flexible substrate 1 is used as a light emitting device. In the divided flexible substrate 1, the electrodes 2 are wired to both ends of the flexible substrate 1.

図5に示すように、両端の電極2のうち、いずれか一端の電極2にコネクタ10が接続される。コネクタ10には、ZIF(Zero Insertion Force)方式のコネクタ10が用いられる。フレキシブル基板1の端部では電極2が露出しているので、そのままフレキシブル基板1をコネクタ10に差し込む。アクチュエータでフレキシブル基板1を押えることにより、電極2がコネクタ10のターミナルに接触して、フレキシブル基板1がコネクタ10に接続される。   As shown in FIG. 5, the connector 10 is connected to the electrode 2 at one end of the electrodes 2 at both ends. As the connector 10, a ZIF (Zero Insertion Force) type connector 10 is used. Since the electrode 2 is exposed at the end of the flexible substrate 1, the flexible substrate 1 is inserted into the connector 10 as it is. By pressing the flexible substrate 1 with the actuator, the electrode 2 contacts the terminal of the connector 10 and the flexible substrate 1 is connected to the connector 10.

上記構造の発光装置は、蛍光灯型の照明装置に使用される。照明装置の仕様に基づいて、LED3の個数あるいは長さが決定されると、フレキシブル基板の切断位置が決まる。リールから供給されたフレキシブル基板1は切断位置に対応する電極2において切断される。   The light emitting device having the above structure is used in a fluorescent lamp type lighting device. When the number or length of the LEDs 3 is determined based on the specifications of the lighting device, the cutting position of the flexible substrate is determined. The flexible substrate 1 supplied from the reel is cut at the electrode 2 corresponding to the cutting position.

所定の長さあるいは所定の個数のLED3を有する、分断された発光装置が、図6、7に示すように照明装置に装着される。フレキシブル基板1の一端の電極2がコネクタ10に接続され、フレキシブル基板1がベースフレーム11に取り付けられる。取付方法として、例えばフレキシブル基板1の電極2上を跨ぐようにフィルムを被せて、数枚のフィルムでフレキシブル基板1を挟み込み、ベースフレーム11にフィルムをねじ等で固定する。あるいは、可能であれば、フレキシブル基板1を直接ベースフレーム11にねじ、接着剤、両面テープ等で取り付けてもよい。2つの発光装置が照明装置に装着される。各発光装置は、ベースフレーム11の両側に平行に配置される。   A divided light-emitting device having a predetermined length or a predetermined number of LEDs 3 is mounted on a lighting device as shown in FIGS. The electrode 2 at one end of the flexible substrate 1 is connected to the connector 10, and the flexible substrate 1 is attached to the base frame 11. As an attachment method, for example, a film is placed so as to straddle the electrodes 2 of the flexible substrate 1, the flexible substrate 1 is sandwiched between several films, and the film is fixed to the base frame 11 with screws or the like. Alternatively, if possible, the flexible substrate 1 may be directly attached to the base frame 11 with screws, adhesive, double-sided tape, or the like. Two light emitting devices are attached to the lighting device. Each light emitting device is arranged in parallel on both sides of the base frame 11.

コネクタ10から引き出されたケーブル12は電源ユニット13に接続される。電源ユニット13を通じて、直流電源と駆動信号が各LED3に出力され、LED3が点灯する。なお、図6,7中、14は乳白色の外装パネル、15はセンタカバー、16はサイドカバー、17は反射シート、18は調光端子台、19は速結端子台、20はコネクタである。   The cable 12 drawn out from the connector 10 is connected to the power supply unit 13. A DC power supply and a drive signal are output to each LED 3 through the power supply unit 13, and the LED 3 is lit. 6 and 7, 14 is a milky white exterior panel, 15 is a center cover, 16 is a side cover, 17 is a reflection sheet, 18 is a dimming terminal block, 19 is a quick connection terminal block, and 20 is a connector.

このように、フレキシブル基板1から露出した電極2においてフレキシブル基板1が分断可能である。すなわち、LED3毎に切断することが可能となり、任意の個数のLED3を選択することができる。したがって、切断位置によってLED3の個数あるいはフレキシブル基板1の長さが決定される。照明装置の設計変更などによって、発光装置に変更が生じても、発光装置自体の設計をやり直すことなく、切断位置を変更することによって容易に対応できる。   Thus, the flexible substrate 1 can be divided at the electrode 2 exposed from the flexible substrate 1. That is, it becomes possible to cut | disconnect for every LED3 and arbitrary number of LED3 can be selected. Therefore, the number of LEDs 3 or the length of the flexible substrate 1 is determined depending on the cutting position. Even if the light emitting device is changed due to a change in the design of the lighting device or the like, it can be easily handled by changing the cutting position without redesigning the light emitting device itself.

なお、本発明は、上記実施形態に限定されるものではなく、本発明の範囲内で上記実施形態に多くの修正および変更を加え得ることは勿論である。フレキシブル基板は、真っ直ぐな帯状に限らず、湾曲状、渦巻き状、波状、ジグザグ状といった曲がった帯状であってもよい。   In addition, this invention is not limited to the said embodiment, Of course, many corrections and changes can be added to the said embodiment within the scope of the present invention. The flexible substrate is not limited to a straight belt shape, and may be a curved belt shape such as a curved shape, a spiral shape, a wave shape, and a zigzag shape.

また、発光素子として、半導体レーザ、有機EL素子を使用してもよい。実装される発光素子は、一列に限らず、複数列であってもよい。各列は、互いに平行にフレキシブル基板に沿って並べられる。この場合、2本以上の電極がフレキシブル基板に沿って平行に形成される。また、フレキシブル基板の形状に応じて、発光素子が一列から複数列に分岐するような配列であってもよい。さらに、フレキシブル基板が矩形の平板状であってもよく、複数の発光素子がマトリックス状に配置される。電極は、縦横に形成される。   A semiconductor laser or an organic EL element may be used as the light emitting element. The light emitting elements to be mounted are not limited to a single row, and may be a plurality of rows. Each row is arranged along the flexible substrate in parallel with each other. In this case, two or more electrodes are formed in parallel along the flexible substrate. Moreover, the arrangement may be such that the light emitting elements branch from one row to a plurality of rows according to the shape of the flexible substrate. Further, the flexible substrate may be a rectangular flat plate, and a plurality of light emitting elements are arranged in a matrix. The electrodes are formed vertically and horizontally.

1 フレキシブル基板
2 電極
3 LED
5 裏面フィルム
6 表面フィルム
10 コネクタ
1 Flexible substrate 2 Electrode 3 LED
5 Back film 6 Front film 10 Connector

Claims (4)

複数の発光素子が実装されるフレキシブル基板に複数の電極が形成され、電極の一部が表面フィルムに覆われ、発光素子は表面フィルムに形成された孔を通じて電極に電気的に接続され、フレキシブル基板に実装された発光素子と発光素子との間に電極が露出した領域が設けられ、前記領域にフレキシブル基板の切断位置が設定されることを特徴とする発光装置。 A plurality of electrodes are formed on a flexible substrate on which a plurality of light emitting elements are mounted, a part of the electrodes are covered with a surface film, and the light emitting elements are electrically connected to the electrodes through holes formed in the surface film. A light emitting device characterized in that a region where an electrode is exposed is provided between the light emitting device mounted on the light emitting device, and a cutting position of the flexible substrate is set in the region. 電極は、フレキシブル基板の一端から他端まで配線されることを特徴とする請求項1記載の発光装置。 The light emitting device according to claim 1, wherein the electrode is wired from one end to the other end of the flexible substrate. 複数の発光素子を実装したフレキシブル基板をリール状にしたことを特徴とする請求項1または2記載の発光装置。 3. The light emitting device according to claim 1, wherein a flexible substrate on which a plurality of light emitting elements are mounted is formed in a reel shape. 請求項1〜3のいずれかに記載の発光装置が装着されたことを特徴とする照明装置。
A lighting device comprising the light-emitting device according to claim 1.
JP2016138412A 2016-07-13 2016-07-13 Light emitting device and lighting device Active JP6148382B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016138412A JP6148382B2 (en) 2016-07-13 2016-07-13 Light emitting device and lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016138412A JP6148382B2 (en) 2016-07-13 2016-07-13 Light emitting device and lighting device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2015002750A Division JP6001694B2 (en) 2015-01-09 2015-01-09 Manufacturing method of lighting device

Publications (2)

Publication Number Publication Date
JP2016219817A true JP2016219817A (en) 2016-12-22
JP6148382B2 JP6148382B2 (en) 2017-06-14

Family

ID=57579328

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016138412A Active JP6148382B2 (en) 2016-07-13 2016-07-13 Light emitting device and lighting device

Country Status (1)

Country Link
JP (1) JP6148382B2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129953A (en) * 2008-12-01 2010-06-10 Rohm Co Ltd Led lamp and method of manufacturing the same
JP2012084392A (en) * 2010-10-12 2012-04-26 Sharp Corp Light emitting device and lighting system
JP2015079994A (en) * 2015-01-09 2015-04-23 シャープ株式会社 Light-emitting device and luminaire

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129953A (en) * 2008-12-01 2010-06-10 Rohm Co Ltd Led lamp and method of manufacturing the same
JP2012084392A (en) * 2010-10-12 2012-04-26 Sharp Corp Light emitting device and lighting system
JP2015079994A (en) * 2015-01-09 2015-04-23 シャープ株式会社 Light-emitting device and luminaire

Also Published As

Publication number Publication date
JP6148382B2 (en) 2017-06-14

Similar Documents

Publication Publication Date Title
JP5681436B2 (en) Light emitting device and lighting device
TWI413470B (en) Wiring board contributable to reduction in thickness of light emitting apparatus and having high versatility
US8596820B2 (en) LED unit and LED lighting lamp using the LED unit
JP5512744B2 (en) Circuit board for LED mounting, strip-shaped flexible LED light, and LED lighting device using the same
CN103062666B (en) Lamp strip structure
US20040007981A1 (en) Chained led light source structure
RU2009134481A (en) ILLUMINATION DEVICE AND FLAT DISPLAY DEVICE USING IT
JP2013153224A (en) Single piece led light wire
JP2013540338A (en) Low cost multifunction heat sink for LED array
US20100149811A1 (en) Channel letter lighting system using high output white light emitting diodes
JP6001694B2 (en) Manufacturing method of lighting device
JP2007109447A (en) Planar lighting source
JP6148382B2 (en) Light emitting device and lighting device
US8021017B2 (en) LED lamp having improved heat dissipation structure
US8324837B2 (en) Parallel light-emitting circuit of parallel LED light-emitting device and circuit board thereof
JP6058143B2 (en) OLED lighting module
JP2004071342A (en) Illumination device
KR200373227Y1 (en) A luminous-illuminator of interia and sign for advertise ment
JP2006058828A (en) Display device and light source therefor
JP2014086196A (en) Luminaire
JP2006303008A (en) Substrate for light source, and light source unit
JP7384430B2 (en) LED lighting equipment
KR102156475B1 (en) Led plannar lighting device having single layer structure for arraying various light emitting diode
KR20120136612A (en) Organic lihgt emitting devices and light emitting apparatus comprising the same
JP3157746U (en) Parallel LED light emitting circuit

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170307

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170406

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170425

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170518

R150 Certificate of patent or registration of utility model

Ref document number: 6148382

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150