JP2016216759A - Three-dimensional molded object and three-dimensional molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a three-dimensional molded object having high productivity and achieving high accuracy in precision molding of a fine profile, and a molding method of the three-dimensional molded object.SOLUTION: The three-dimensional molded object is formed by laminating a second monolayer on a first monolayer comprising a sintered monolayer obtained by irradiating a sintering target material prepared by kneading a metal powder and a binder with energy rays capable of sintering the sintering target material, the second monolayer including at least the above sintered monolayer. The sintered monolayer is formed by assembling sintered materials sintered by irradiation of the energy rays, in which a diameter D of a sintered material in a plan view of the sintered material and a distance P between centers of the sintered materials adjoining to each other satisfy 0.5≤P/D<1.0.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a three-dimensional molded article and a three-dimensional molding method.

Conventionally, a method as disclosed in Patent Document 1 has been disclosed as a manufacturing method for easily forming a three-dimensional shape using a metal material. The manufacturing method of a three-dimensional shaped object disclosed in Patent Document 1 uses a metal paste having a metal powder, a solvent, and an adhesion promoter as raw materials formed in a layered material layer. The layered material layer is irradiated with a light beam to form a sintered metal layer or a molten metal layer, and the sintered layer or the molten layer is formed by repeating the formation of the material layer and the irradiation of the light beam. Lamination is performed to obtain a desired three-dimensional shaped object.

In the manufacturing method of the three-dimensional shaped object of Patent Document 1, in one layer of the layered material layers constituting the three-dimensional shaped object, the light beam irradiation path obtained from the three-dimensional CAD data or the like is taken along. Then, the light beam is scanned by a galvanometer mirror, and the material layer is melted and solidified to obtain a desired sintered layer.

JP 2008-184622 A

In the method of manufacturing a three-dimensional shaped object disclosed in Patent Document 1, in order to improve productivity, the melt solidification width of the material layer in the direction intersecting the scanning of the light beam is increased, or the scanning speed is increased. Is required. On the other hand, when a three-dimensional shaped object includes a fine modeling region, the melt solidification width is narrower and the scanning speed is slowed down, so that a fine modeling can be obtained.

Thus, the improvement of the productivity of the three-dimensional shaped object and the improvement of the precision modeling accuracy of the fine shape part include conflicting elements. However, in the method for manufacturing a three-dimensional shaped object disclosed in Patent Document 1, in order to realize improvement in productivity and precision modeling precision, for example, a light beam that can be molded with a wide melting solidification width, It is necessary to provide a plurality of light beam irradiation means so as to be able to irradiate the modeling light beam, leading to an increase in size of the apparatus or an increase in apparatus cost.

Therefore, with the energy beam irradiated from one energy beam irradiation means, the melt solidification width was widened to obtain high productivity, and precise shaping of fine shapes was also realized with high accuracy.
It is an object to obtain a three-dimensional molded product and a molding method of the three-dimensional molded product.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1] The three-dimensional molded product of this application example can be obtained by irradiating a material to be sintered in which a metal powder and a binder are kneaded with energy rays that enable the material to be sintered to be sintered. 3 formed by laminating at least a second single layer including the sintered single layer on the first single layer including the sintered single layer.
The sintered single layer is formed by aggregating sintered bodies irradiated with the energy rays and sintered, and the sintered body diameter in a plan view of the sintered body is D, When the distance between the sintered body centers of the above-mentioned sintered bodies is P,
0.5 ≦ P / D <1.0
It is characterized by being.

The three-dimensional molded product of this application example is obtained by laminating sintered single layers of metal shaped products obtained by sintering metal powder by irradiation with energy rays. The sintered single layer is formed as an aggregate of a plurality of sintered bodies. In the sintered single layer obtained in this way, when the sintered body diameter in a plan view of the sintered body is D and the distance between the sintered body centers of adjacent sintered bodies is P,
0.5 ≦ P / D <1.0
It is formed while satisfying the relationship.

According to this application example, in the above-described relationship, adjacent sintered bodies are arranged to be separated from each other by bringing P closer to D, that is, by bringing P / D closer to 1.0. Therefore, a sintered single layer can be formed in a short time, and productivity can be improved. Also, P / D is set to 0.
By being close to 5, the adjacent sintered bodies are arranged so as to be close to each other, that is, so as to increase the number of overlapping regions, thereby forming a sintered single layer in which the adjacent sintered bodies are densely assembled. This enables precise modeling.

In this application example, the sintering in the “sinterable” means that energy is supplied to the feed material, the binder constituting the feed material is evaporated by the feed energy, and the remaining metal powder It means that metal bonds with each other by supplied energy. In the present specification, the form in which the metal powder is melt-bonded is also described as sintering as the metal powder is bonded by supplying energy.

Application Example 2 In the application example described above, the sintered single layer includes a first sintered body adjacent to the second sintered body, and a second sintered body.
And the second single layer is the center of the sintered body of the sintered body included in the second single layer is the first single layer. The first sintered body included in the layer, the second sintered body,
And it arrange | positions so that it may overlap with the triangular area | region in planar view comprised connecting the said sintered compact center of each said 3rd sintered compact.

In Application Example 1 described above, when the sintered body centers of the first, second, and third sintered bodies adjacent to each other in the first single layer are arranged at a value close to the value of D, In some cases, an unsintered region may remain between the matching sintered bodies. However, according to the application example described above, the sintered body included in the second single layer is
In a region in a plan view of a triangular region connecting the respective sintered body centers of the adjacent first, second, and third sintered bodies included in the first sintered single layer of the lower layer, Arranged so that the center of the union is overlapped, the energy rays that form the second single-layer sintered body are irradiated to simultaneously sinter the unsintered region remaining in the first single layer. Is done. Thereby, a three-dimensional molded product can be obtained while removing an unsintered region, in other words, a region that can be a defective portion, inside the three-dimensional molded product.

Application Example 3 In the application example described above, the energy beam is a laser.

According to the application example described above, it is possible to accurately control the irradiation of energy at an accurate position and the increase / decrease of the energy amount. And when forming a sintered compact, ON / OFF of an energy ray can be performed in a short time. Therefore, a high-quality three-dimensional molded product can be obtained while having high productivity.

[Application Example 4] The three-dimensional forming method of this application example can be obtained by irradiating a material to be sintered in which metal powder and a binder are kneaded with energy rays that enable the material to be sintered to be sintered. A three-dimensional molding method for obtaining a three-dimensional molded product by laminating at least a second single layer including a sintered single layer on a first single layer including a sintered single layer, wherein the sintered single layer is obtained. Is formed by assembling sintered bodies irradiated with the energy rays and sintered, and the diameter of the sintered body in a plan view of the sintered body is D, and between the sintered body centers of the adjacent sintered bodies. If the distance of P is P,
0.5 ≦ P / D <1.0
It is characterized by being.

The forming method of the three-dimensional molded product of this application example is a method obtained by laminating a sintered single layer of a metal shaped product obtained by sintering metal powder by irradiation with energy rays. The sintered single layer is formed as an aggregate of a plurality of sintered bodies. In the sintered single layer obtained in this way, when the sintered body diameter in a plan view of the sintered body is D and the distance between the sintered body centers of adjacent sintered bodies is P,
0.5 ≦ P / D <1.0
It is formed while satisfying the relationship.

According to this application example, in the above relationship, P is closer to D, that is, P / D is 1
. The adjacent sintered bodies are arranged so as to be separated from each other by approaching zero. Therefore, a sintered single layer can be formed in a short time, and productivity can be improved. Also, P / D is 0.5
By arranging the adjacent sintered bodies so as to be close to each other, that is, so as to increase the number of overlapping regions, a sintered single layer in which the adjacent sintered bodies are densely assembled is formed. This enables precise modeling.

Application Example 5 In the application example described above, the sintered bodies included in the sintered single layer are adjacent to each other.
A sintered body, a second sintered body, and a third sintered body, wherein the second single layer has a center of the sintered body of the sintered body included in the second single layer. , A triangular shape in plan view constituted by the respective sintered body centers of the first sintered body, the second sintered body, and the third sintered body included in the first single layer It is characterized by overlapping with the area.

In the application example 4 described above, when the sintered body centers of the first, second, and third sintered bodies adjacent to each other in the first single layer are arranged at a value close to the value of D, they are adjacent to each other. In some cases, an unsintered region may remain between the matching sintered bodies. However, according to the application example described above, the sintered body included in the second single layer is
In a region in a plan view of a triangular region connecting the respective sintered body centers of the adjacent first, second, and third sintered bodies included in the first sintered single layer of the lower layer, Arranged so that the center of the union is overlapped, the energy rays that form the second single-layer sintered body are irradiated to simultaneously sinter the unsintered region remaining in the first single layer. Is done. Thereby, a three-dimensional molded product can be obtained while removing an unsintered region, in other words, a region that can be a defective portion, inside the three-dimensional molded product.

Application Example 6 In the application example described above, the energy beam is a laser.

According to the application example described above, it is possible to accurately control the irradiation of energy at an accurate position and the increase / decrease of the energy amount. And when forming a sintered compact, ON / OFF of an energy ray can be performed in a short time. Accordingly, a high-quality three-dimensional molded product can be obtained while maintaining high productivity.

FIG. 3 is a schematic cross-sectional view showing an outline configuration and an operation outline of an example of a manufacturing apparatus for forming the three-dimensional molded product according to the first embodiment. The single layer of the three-dimensional molded product which concerns on 1st Embodiment is shown, (a) is an external appearance perspective view, (b) and (c) is a schematic diagram which shows a laser irradiation state. The conceptual diagram explaining arrangement | positioning of the sintered compact contained in the sintering single layer shown in FIG. The conceptual diagram explaining arrangement | positioning of the sintered compact contained in the sintering single layer shown in FIG. The conceptual diagram explaining arrangement | positioning of the sintered compact contained in the sintering single layer laminated | stacked on the sintering single layer shown in FIG. 3 and FIG. Sectional drawing which shows the shaping | molding form of the laminated body containing a three-dimensional molded object. The flowchart which shows the three-dimensional shaping | molding method which concerns on 2nd Embodiment. Sectional drawing which shows the three-dimensional shaping | molding method which concerns on 2nd Embodiment. Sectional drawing which shows the three-dimensional shaping | molding method which concerns on 2nd Embodiment. Sectional drawing which shows the three-dimensional shaping | molding method which concerns on 2nd Embodiment.

  Embodiments according to the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a schematic configuration showing an example of a manufacturing apparatus for forming a three-dimensional molded product according to the first embodiment, and a configuration cross-sectional view showing an operation outline. In addition, the “three-dimensional molded product” in the present specification indicates what is formed as a so-called three-dimensional modeled product, and for example, a flat plate, a so-called two-dimensional molded product has a thickness. If it is a shape, it is contained in a three-dimensional molded product.

A three-dimensional forming apparatus 1000 (hereinafter referred to as a manufacturing apparatus 1000) shown in FIG.
As shown in FIG. 2, a forming frame 1300 provided in an apparatus base (not shown), a forming table 1200 (hereinafter referred to as a table 1200) on which raw materials of a formed product are stacked, and a table 1200 are moved up and down (in the direction of gravity) within the forming frame. Driving means 1100.

As shown in the figure, the forming frame 1300 has a recessed space 1300a in which the table 1200 can move up and down. And the inner wall 1300b of the molding frame 1300 and the table 120
The outer periphery 1200a of 0 forms a gap δ that allows sliding while preventing the raw material of the molded product from leaking.

On the table 1200, the raw material Mp accommodated in the raw material supply means 1400 is supplied by a method described later. The raw material Mp is a material to be sintered in which metal powder and an inder are kneaded. Examples of the metal powder include magnesium (Mg), iron (Fe), cobalt (Co),
A single powder such as chromium (Cr), aluminum (Al), titanium (Ti), nickel (Ni), or a mixed powder of an alloy powder containing one or more of these metals is used. And, as a binder in the metal powder, for example, those having a hydroxyl group such as polyvinyl alcohol (PVA) and nanocellulose (CeNF), or thermoplastic resins such as polylactic acid (PLA), polyamide (PA), polyphenylene sulfide (PPS), etc. Etc. are kneaded,
A powdery raw material Mp is formed.

The raw material Mp is not limited to a powder form, and may be supplied in the form of a slurry by kneading a solvent such as water or a water-soluble solvent in addition to the metal powder and binder described above, or a sheet. You may supply as what is called a green sheet shape | molded in the shape.

The three-dimensional molded product in the present embodiment will be described based on a form formed from a powdery raw material Mp. In order to dispose the powdery raw material Mp supplied from the raw material supply means 1400 on the table 1200 to the table 1200 with a predetermined thickness, a recoater 1500 for a squeegee described later is provided.

FIG. 1B shows a method of forming the second layer molded product on the molded product 101 from the state where the first layer molded product 101 is formed on the table 1200 shown in FIG. This will be described in 1 (d). The molded product 101 of the first layer shown in FIG. 1A includes a sintered portion 101a and an unsintered portion 101b by a sintering means. As shown in FIG.
The raw material supply means 1400 is moved onto the first layer molded product 101 by a driving means (not shown), and the raw material Mp is supplied to the entire formation region of the first layer molded product 101.

In the state where the raw material Mp shown in FIG. 1 (b) is supplied onto the first-layer molded product 101, the second-layer molded product is formed so as not to form an unfilled portion in the second-layer molded product. Is supplied in excess of the amount of raw material Mp required. In order to remove the raw material Mp exceeding the necessary amount of raw material Mp and adjust the thickness of the second layer molded product, the recoater 1500 is moved to scrape unnecessary raw material Mp as shown in FIG. Do a so-called squeegee.

The surplus raw material Mp scraped off by the squeegee is introduced into the surplus raw material discharge unit 1600,
It is accommodated in an exhaust material storage unit (not shown). And as shown in FIG.1 (d), the raw material Mp is irradiated with the laser L from the laser irradiation part 1700 as an energy ray, the raw material Mp of the area | region where the laser L was irradiated is sintered, and metal molding from metal powder It becomes. A three-dimensional molded product can be obtained by repeating the method shown in FIGS.

In this embodiment, although the laser L was illustrated as an energy beam, it is not limited to this.
For example, a hot wire using a high frequency, a halogen lamp, or a method of blowing hot hot air can be applied. By using the laser L as an energy beam, it is easy to control the irradiation of energy at an accurate position, the increase / decrease in the amount of energy can be accurately controlled, and a sintered body described later is formed. In this case, since the laser L is suitable for executing ON / OFF of the energy beam in a short time, it is more preferable to apply the laser L as the energy beam.

FIG. 2 shows a single layer of a three-dimensional molded product molded by the molding method described above. FIG. 2A is an external perspective view of the first layer of the molded product 101 shown in FIG. 1 as an example of the first single layer.
In the following description, the first-layer molded product 101 is referred to as a first single layer 101. However, the first single layer 101 is not limited to the molding layer first formed on the upper surface of the table 1200 described with reference to FIG. 1. For convenience of description, the second single layer 101 described later is formed on the first single layer 101. Single layer is laminated 3
Since a three-dimensional molded product is formed, it is for classifying so-called top-to-bottom relationships of single layers to be laminated, with the lower layer being the first single layer and the upper layer being the second single layer.

As shown in FIG. 2A, the first single layer 101 is formed in the recessed space 1300a of the forming frame 1300 shown in FIG. Unsintered portion 101b. The first sintered single layer 101a can be obtained by irradiating a predetermined region with a laser L for heating and firing the raw material Mp.

FIG. 2B and FIG. 2C schematically show the form of laser L irradiation. FIG. 2 (b)
Shows a state in which the laser irradiation unit 1700 is moved in the order of step 1 (S1) to step 5 (S5) and the laser irradiation is performed, and FIG. 2 (c) shows the state from step 1 (S1). Laser irradiation unit 1700 in step 5 (S5) Laser irradiation unit 1
The movement path (movement amount) of 700 and the irradiation ON and OFF states of the laser L from the laser irradiation unit 1700 are shown. Thereafter, Step 1 (S1) to Step 5 (S5) are changed to S1.
, S2, S3, S4, S5.

First, the state of S1 shown in FIG. 2B, that is, the laser irradiation unit 1700 is in the standby position m1.
It will be in a standby state. At this time, laser irradiation from the laser irradiation unit 1700 is in an OFF state as shown in FIG. Next, the distance T is moved to the state of S2, that is, the irradiation position m2 where the laser irradiation unit 1700 is irradiated with the laser, and stopped. In the stop state, the laser irradiation of the laser irradiation unit 1700 is turned on, and the laser L is irradiated toward the first single layer 101. The raw material Mp is irradiated with the laser L, the metal powder of the raw material Mp is sintered by the heat, and the sintered body 10 is formed. When laser irradiation with a predetermined energy amount is performed, laser irradiation of the laser irradiation unit 1700 is turned off. And the laser irradiation part 1700 moves the distance P1 to the irradiation position m3 which is the next S3, and stops it.

After the laser irradiation unit 1700 reaches the irradiation position m3 and stops in S3, the laser L is irradiated as shown in S4, and the sintered body 10 is formed at the irradiation position m3. Then, as shown in S5, the laser irradiation unit 1700 is moved by the distance P2 to the next irradiation position m4.

As described above, the single layer constituting the three-dimensional molded product according to this embodiment is the laser irradiation unit 1.
The first single layer 101 is formed by repeating the movement of 700, that is, scanning and stopping at the irradiation position and irradiating the laser L to form an aggregate of the formed sintered bodies 10. .

FIG. 3 is a conceptual diagram illustrating the arrangement of the sintered bodies 10 included in the sintered single layer 101a described with reference to FIG. FIG. 3A is a conceptual diagram illustrating the scanning form of the laser L, and FIGS. 3B and 3C.
These are the conceptual diagrams explaining the detailed arrangement | positioning of the sintered compact 10 exemplifying the sintered compact 10 formed in irradiation position m2, m3, m4 shown in FIG.2 (b).

Figure 3 (a), the laser irradiation unit 1700 in arrow F _D direction in this embodiment
The move is irradiated with a laser L, the irradiation in a predetermined region of the F _D direction is completed by moving the laser irradiation unit 1700 FL direction, irradiating the laser L in a predetermined area of the F _D direction, the laser L The scanning form is illustrated. By scanning the laser L in this way, a sintered single layer 101 a as an aggregate of the sintered bodies 10 is formed on the first single layer 101.

The sintered body 10 formed by the scanning of the laser L shown in FIG.
Arranged as shown in c). As shown in FIG. 3B, the sintered body 10 is formed at the irradiation position m3 so as to be adjacent to the sintered body 10 formed at the irradiation position m2. The sintered body 10 at the irradiation position m2 and the sintered body 10 at the irradiation position m3 are formed to have the distance P1 described with reference to FIG. Hereinafter, the distance P1 is referred to as a dot pitch P1.

In the dot pitch P1, an overlapping portion 10a is formed so that an unsintered portion does not occur between the sintered body 10 at the irradiation position m2 and the sintered body 10 at the irradiation position m3. That is, with respect to the formation diameter of the sintered body 10, that is, the sintered body diameter D,
P1 <D
It is preferable to be arranged so as to satisfy the above condition.

FIG.3 (c) shows arrangement | positioning of the sintered compact 10 formed in the irradiation position m4 adjacent to the irradiation position m3 shown in FIG.3 (b). The sintered body 10 at the irradiation position m3 and the sintered body 10 at the irradiation position m4 are formed to have the distance P2 described with reference to FIG. Hereinafter, the distance P2 is referred to as a dot pitch P2. In the dot pitch P2, an overlapping portion 10a is formed so that an unsintered portion does not occur between the sintered body 10 at the irradiation position m3 and the sintered body 10 at the irradiation position m4. That is, for the formation diameter D of the sintered body 10,
P2 <D
It is preferable to be arranged so as to satisfy the above condition.

Thus, the sintered body 10 which is formed in the scanning direction F _D shown in FIG. 3 (a), when the dot pitch of the sintered body 10 adjacent to Pd1,
Pd1 <D
It is preferable to control the scanning of the laser L so as to satisfy the above condition. In addition, in order to widen the sintered area formed by the adjacent sintered bodies 10,
Pd1 ≧ D / 2
It is preferable that That is,
0.5 ≦ Pd1 / D <1.0
It is more preferable to satisfy the condition.

FIG. 4 shows the first row of sintered bodies 1 formed along the scanning direction F _D shown in FIGS.
Against 0, along the scanning direction F _L is the laser irradiation unit 1700 moves the line pitch Q1 minutes is a conceptual diagram illustrating the arrangement of the sintered body in the case of forming the second row of the sintered body.

As shown in FIG. 4A, the sintered body 10 formed at the irradiation position m2 of the first row and the irradiation of the second row adjacent to the sintered body 10 formed at the irradiation position m2 of the first row. The dot pitch Pd2, which is the center-to-center distance between the sintered body 10 formed at the position m22, is similar to the relationship between the adjacent sintered bodies 10 in the first row described above.
Pd2 <D
Satisfied,
Pd2 ≧ D / 2
It is preferable that That is,
0.5 ≦ Pd2 / D <1.0
It is preferable that

Further, the sintered body 10 formed at the irradiation position m3 adjacent to the irradiation position m2 in the first row and the irradiation position of the second row adjacent to the sintered body 10 formed at the sintering position m3 in the first row. The dot pitch Pd3, which is the center-to-center distance between the sintered body 10 formed on m22, is similar to the relationship between the adjacent sintered bodies 10 in the first row described above.
Pd3 <D
Satisfied,
Pd3 ≧ D / 2
It is preferable that That is,
0.5 ≦ Pd3 / D <1.0
It is preferable that

As described above, the sintered bodies 10 formed at the irradiation positions m2, m3, and m22, that is, the dot pitches Pd1, Pd2, and Pd3 of the adjacent sintered bodies 10 are the center of the sintered bodies of the adjacent sintered bodies 10. If the dot pitch P is the distance of
P <D
And
P ≧ D / 2
It is preferable that That is,
0.5 ≦ P / D <1.0
It is preferable that In such a relationship, the sintered body 10 centered on the irradiation positions m2, m3, and m22 can have overlapping portions 10a, 10b, and 10c.

FIG. 4B shows a form in which the sintered body 10 is formed at the irradiation position m23 so as to be adjacent to the sintered body 10 formed at the irradiation position m22 in the second row. As shown in FIG. 4B, the irradiation position m
The sintered body 10 formed at 23 is a sintered body 1 formed at the irradiation position m3 and the irradiation position m22.
It is formed at a position adjacent to zero. Further, the sintered body 10 formed at the irradiation position m23 is formed at a position adjacent to the sintered body 10 formed at the irradiation position m3 and the irradiation position m4.

The center-to-center distance between the irradiation position m23 and the irradiation position m3 is the dot pitch Pd4 and the irradiation position m4.
And the irradiation position m23, the distance between the centers is the dot pitch Pd5, the irradiation position m23 and the irradiation position m.
When the center-to-center distance is 22 and the dot pitch Pd21, the respective relationships satisfy the above-described relationships. That is,
0.5 ≦ Pd4 / D <1.0
0.5 ≦ Pd5 / D <1.0
0.5 ≦ Pd21 / D <1.0
It is. The dot pitches Pd4, Pd5, Pd21 of the sintered bodies 10 adjacent to each other are
When the dot pitch P is the distance between the centers of the adjacent sintered bodies 10,
0.5 ≦ P / D <1.0
It becomes the relationship.

The sintered body 10 can be formed while satisfying the above-described dot pitch relationship, and the sintered single layer 101a as an aggregate can be obtained. The sintered single layer 101a thus obtained is
0.5 ≦ P / D <1.0
By satisfying the above relationship, the dot pitch P can be made closer to the diameter D of the sintered body 10, that is, the P / D can be made closer to 1.0, so that the sintered single layer 101a can be formed in a short time.
Productivity can be increased. Moreover, by making P / D close to 0.5, adjacent sintered bodies 1
The sintered single layer 101a in which 0 is densely assembled can be formed, and precise modeling is possible.

On the first single layer 101 including the sintered single layer 101a described above, the second single layer 102 (FIG.
FIG. 5 shows the formation form of the sintered body 10 in the case of laminating ()). In FIG. 5, for convenience of explanation, the sintered body 10 included in the first single layer 101 is drawn with a two-dot chain line, and the sintered body 10 included in the second single layer 102 is drawn with a solid line. The irradiation position of the sintered body 10 included in the first single layer 101 is indicated by “●”, and the irradiation position of the sintered body 10 included in the second single layer 102 is indicated by “x”.

In the case of forming the second single layer 102 shown in FIG. 5, the first single layer 101 described with reference to FIG.
On the other hand, the sintered compact 10 is arrange | positioned as follows. FIG. 5A illustrates two sintered bodies 10 having a laser L irradiation position n 1 and an irradiation position n 2 as a part of the sintered body 10 included in the second single layer 102. As shown in FIG. 5, the irradiation position n1 included in the second single layer 102
The sintered body 10 is formed at the irradiation position m2 of the sintered body 10 formed at the irradiation position m2 as the first sintered body included in the sintered single layer 101a of the lower first single layer 101. The irradiation position m3 of the sintered body 10 formed at the irradiation position m3 as the second sintered body, and the irradiation position m22 of the sintered body 10 formed at the irradiation position m22 as the third sintered body Are arranged so that the irradiation position n1 overlaps the region in plan view of the triangular region Tr1 connecting the two.

Similarly, the sintered body 10 formed at the irradiation position n2 includes an irradiation position m3, an irradiation position m4, and an irradiation position m23 of the sintered body 10 included in the sintered single layer 101a of the lower first single layer 101. Are arranged so that the irradiation position n2 overlaps the region in plan view of the triangular region Tr2 connecting the two.

Further, the irradiation position n1, the irradiation position n2, and the second sintered single layer (not shown) included in the second single layer 102 (not shown) are similar to the first sintered single layer 101a in the center distance of the irradiation position. That is, the dot pitch P as the center-to-center distance between adjacent sintered bodies 10 is
0.5 ≦ P / D <1.0
It is preferable that the sintered body 10 is disposed so that the above relationship is satisfied at the same time.

Thus, the sintered body 10 formed in the second single layer 102 is, for example, as shown in FIG. 5B, the adjacent sintered bodies 10 in the first single layer 101, in this example, the irradiation position m2. , M3, m2
When the dot pitch P of each of the sintered bodies 10 formed in 2 is arranged at a value close to the value of the diameter D of the sintered body 10, an unsintered region 101c is located between the adjacent sintered bodies 10. May remain.
However, as shown in FIG. 5A described above, the sintered body 10 formed at the irradiation position n1 included in the second single layer 102 is a sintered single layer 101a of the lower first single layer 101. Sintered body 10 included in
By arranging the irradiation position n1 so as to overlap the region in the plan view of the triangular region Tr1 connecting the irradiation position m2, the irradiation position m3, and the irradiation position m22, the laser L is applied to the irradiation position n1. By being irradiated, the unsintered region 101c is also sintered at the same time. As a result, 3
While removing the unsintered area inside the three-dimensional molded product, in other words, the area that can be a defective part, 3
A dimensionally shaped product can be obtained.

After the second single layer 102 is stacked on the first single layer 101 described above, the second single layer 102 is formed.
As a new first single layer 102, a second single layer 103 is formed on the first single layer 102. In this manner, the second single layer is repeatedly formed on the new first single layer, and as shown in FIG. 6, the final N-th second single layer 10N is formed. Laminated body 100
Thus, the laminate 100 includes a three-dimensional molded product 200 that is sintered and formed. 3
Dimensional molded product 200 includes sintered single layers 101a, 101a,.
It is formed as a sintered part 100a as an aggregate of the above. And although mentioned later, laminated body 100
The unsintered portions 101b, 102b,..., 10Nb aggregate 100b are removed, and the sintered portion 100a is taken out, whereby a three-dimensional molded product 200 can be obtained.

(Second Embodiment)
The three-dimensional molding method according to the second embodiment is a method of forming the three-dimensional molded product according to the first embodiment described above. FIG. 7 shows a flowchart showing the manufacturing process of the three-dimensional molded product 200 according to the second embodiment, and FIGS. 8 and 9 show the manufacturing method in the process shown in the flowchart shown in FIG.
And shown in FIG. In addition, the same code | symbol is attached | subjected to the same component as description of the three-dimensional molded product 200 which concerns on 1st Embodiment, and description is abbreviate | omitted.

(3D modeling data acquisition process)
As shown in FIG. 7, the three-dimensional forming method according to the present embodiment is not shown in the manufacturing apparatus 1000 shown in FIG. Three-dimensional modeling data acquisition step (S1) acquired by the control device
0) is executed. The three-dimensional modeling data acquired in the three-dimensional modeling data acquisition step (S10) is the drive means 1 of the table 1200 provided in the manufacturing apparatus 1000 from the control device.
100, raw material supply means 1400 and drive means for raw material supply means 1400 (not shown), laser irradiation unit 1700, drive means (not shown) for driving the recoater 1500, etc.
A predetermined control signal is transmitted.

(Material preparation process)
In the material preparation step (S20), as shown in FIG.
p is supplied from the kneading apparatus (not shown) to the raw material supply means 1400 through the supply path 1410 and stored. The raw material Mp is a material to be sintered in which metal powder and a binder are kneaded. Examples of the metal powder include magnesium (Mg), iron (Fe), cobalt (Co), chromium (Cr), aluminum (Al), titanium (Ti), nickel (Ni), etc. or powders of these metals. A mixed powder of an alloy powder containing one or more is used. And as a binder to metal powder, for example, those having a hydroxyl group such as polyvinyl alcohol (PVA) and nanocellulose (CeNF), polylactic acid (PLA), polyamide (
PA), a thermoplastic resin such as polyphenylene sulfide (PPS), and the like are kneaded to form a powdery raw material Mp.

The three-dimensional forming method in the present embodiment will be described based on the form formed from the powdery raw material Mp. However, the raw material Mp is not limited to the powdery form, and in addition to the metal powder and the binder described above, a solvent, for example, Water, a water-soluble solvent, or the like may be kneaded and supplied as a slurry, or may be supplied as a so-called green sheet formed into a sheet.

(Material supply process)
If the raw material Mp is supplied to the raw material supply means 1400, it will transfer to a material supply process (S30). In the material supply step (S30), as shown in FIG. 8B, the raw material supply means 1400 is moved above the table 1200 provided in the manufacturing apparatus 1000, and a predetermined amount of the raw material Mp is supplied onto the table 1200.

(Squeegee process)
As shown in FIG. 8C, the raw material Mp supplied on the table 1200 by the material supply step (S30) is raised as shown in the supply state Mp ′.
Arranged above. With respect to this supply state Mp ′, the recoater 1500 is moved in a predetermined direction, in this example, in the direction of the arrow shown in the figure, and the raw material Mp exceeding the thickness of the first single layer 101 is recoater 150.
A squeegee step (S40) is performed in which a so-called squeegee is scraped off by zero. The surplus raw material Mp due to the squeegee process (S40) is introduced into a surplus raw material discharge unit 1600 disposed close to the forming frame 1300.

In the squeegee step (S40), a separation distance t1 is set between the squeegee end 1500a of the recoater 1500 and the raw material supply surface 1200b of the table 1200, and the raw material Mp supplied onto the table 1200 while maintaining this separation distance t1. The predetermined thickness t1 of the first single layer 101 can be obtained by moving the recoater 1500 upward. Table 12
00, the upper end surface 1300c of the forming frame 1300, and the relative step s1 are
s1≈t1
Preferably, or
s1 = t1
More preferably, the squeegee is made to contact the upper end surface 1300c with the squeegee end portion 1500a. Therefore, it is preferable to give elasticity to the recoater 1500. For example, it is preferable that the recoater 1500 is made of an elastic material such as plastic or a metal thin plate, or the recoater 1500 is held by an elastic member.

(Laser irradiation process)
As shown in FIG. 9D, the first single layer 101 is formed from the laser irradiation unit 1700 in a state where the first single layer 101 having the thickness t1 is formed on the table 1200 by the squeegee process (S40). Is irradiated with the laser L, and the raw material Mp in the region irradiated with the laser L is fired and sintered, whereby the sintered body 10 is formed.

The laser L irradiates a predetermined region with the laser L based on the data acquired in the three-dimensional modeling data acquisition step (S10), and the first sintered monolayer 1 as an aggregate of the sintered bodies 10 is obtained.
01a is formed. The method for forming the first sintered single layer 101a is the same as that described above with reference to FIGS.

By the laser irradiation step (S50), the first single layer 10 including the first sintered single layer 101a.
1 is obtained, and the above-described single layer formation step (S100) including at least the material supply step (S30), the squeegee step (S40), and the laser irradiation step (S50) is performed. In the present embodiment, the laser L is exemplified as the energy beam, but the present invention is not limited to this. For example, a hot wire using a high frequency, a halogen lamp, or a method of blowing hot hot air can be applied. By using the laser L as an energy beam, it is easy to control the irradiation of energy at an accurate position, the increase / decrease in the amount of energy can be accurately controlled, and the sintered body 10 is formed. In this case, it is more preferable to apply the laser L as an energy ray to execute the ON / OFF of the energy ray in a short time.

(Stacking number comparison process)
Material supply step (S30), squeegee step (S40), laser irradiation step (S50)
When the single layer forming step (S100) including at least is executed, the stacking number comparison step (S6)
0). In the stacking number comparison step (S60), the three-dimensional modeling data acquisition step (S1)
0) to the single layer formation step (S100) immediately before the stacking number comparison step (S60) and the single layer stacking number N required for configuring the three-dimensional molded product 200 included in the modeling data acquired The number j of stacked single layers is compared. In the stacking number comparison step (S60), j <
When determined to be N, the stacking step (S70) for executing the single layer forming step (S100) again.
It is transferred to.

(Lamination process)
The stacking step (S70) is a command step for determining that j <N in the stacking number comparison step (S60) and causing the single layer forming step (S100) to be executed again.
The material supply step (S30), which is the starting step of 0), is executed.

As shown in FIG. 9E, in the material supply step (S30), the raw material Mp is supplied onto the first single layer 101 in accordance with the command of the stacking step (S70). At this time, the table 1200 has a relative step s between the upper end surface 1300c of the forming frame 1300 and the upper surface 101c of the first single layer 101.
2, the squeegee end 1500 a of the recoater 1500, and the upper surface 101.
A separation distance t2 is provided from c.

And as shown in FIG.9 (f), a squeegee process (S40) and a laser irradiation process (S
50), and the second single layer 102 having a thickness t2 is formed. Thereby, the single layer formation process (S100) which forms the 2nd single layer 102 was performed, and it transfers to the lamination number comparison process (S60).

When it is determined that j <N in the stacking number comparison step (S60), the process proceeds to the stacking step (S70) again, and the above-described material supply step (S30), squeegee step (S40), and laser irradiation step (S40). Although not shown, the second single layer 102 is stacked as the first single layer, and the third single layer is stacked as the second single layer. Then, as shown in FIG. 10 (g), the sintered portion 100a which is laminated up to a predetermined number N of layers and becomes the three-dimensional molded product 200 in a state where j = N is determined in the number-of-stacks comparison step (S60). And the laminated body 100 containing the unsintered part 100b can be obtained.

(Unsintered part removal process)
As shown in FIG. 10 (g), when the laminate 100 including the three-dimensional molded product 200 is obtained, the laminate 100 is taken out from the manufacturing apparatus 1000 and the unsintered portion 100b is removed. S80) is executed.

As a method of removing the unsintered portion 100b, a method of removing mechanically, a method of dissolving the binder contained in the unsintered portion 100b with a solvent and removing it in the form of metal powder, etc. can be applied. However, in this embodiment, the removal method by a solvent is illustrated.

As shown in FIG. 10 (h), a solvent tank 2000 having a hydroxyl group such as polyvinyl alcohol (PVA) and nanocellulose (CeNF) used as a binder contained in the raw material Mp, or polylactic acid (PLA), A solvent 3000 for dissolving a thermoplastic resin such as polyamide (PA) or polyphenylene sulfide (PPS) is filled. And
The laminated body 100 is placed on the tray 4000, immersed in the solvent 3000, and the binder contained in the unsintered portion 100b is dissolved, whereby the sintered portion 100a, that is, the three-dimensional molded product 200 remains on the tray 4000. . In addition, the dissolution of the binder is promoted, and the three-dimensional molded product 20
In order to prevent the binder from remaining at 0, the solvent 3000 can be heated to promote dissolution of the binder, or ultrasonic vibration can be applied.

As a method for mechanically removing the unsintered portion 100b, for example, a method of pulverizing the unsintered portion 100b by applying a removal tool having a wedge-shaped tip, or a method of applying strong vibration to the unsintered portion 10b.
A method of shaking off 0b can be applied.

As described above, in the laser irradiation step (S50) in the molding method of the three-dimensional molded product according to the present embodiment, the dot pitch of the sintered body 10 so as to become the three-dimensional molded product 200 according to the first embodiment. P
0.5 ≦ P / D <1.0
By satisfying the above relationship, the dot pitch P can be made closer to the diameter D of the sintered body 10, that is, the P / D can be made closer to 1.0, so that the sintered single layer 101a can be formed in a short time.
Productivity can be increased. Moreover, by making P / D close to 0.5, adjacent sintered bodies 1
The sintered single layer 101a in which 0 is densely assembled can be formed, and precise modeling is possible.

Further, when the single layer is stacked by the stacking step (S70), the sintered body 10 formed in the second single layer 102 is adjacent to the first single layer 101 as shown in FIG. 5B, for example. When the dot pitches Pd of the sintered bodies 10 to be matched, in this example, the sintered bodies 10 formed at the irradiation positions m2, m3, and m22, are arranged at a value close to the value of the diameter D of the sintered body 10, Adjacent sintered body 1
In some cases, the unsintered region 101c may remain between zero. However, as shown in FIG. 5A described above, the sintered body 10 formed at the irradiation position n1 included in the second single layer 102 is a sintered single layer 101a of the lower first single layer 101. In the region in plan view of the triangular region Tr1 connecting the irradiation position m2, the irradiation position m3, and the irradiation position m22 of the sintered body 10 included in the irradiation position n1
Are arranged so as to overlap each other, the laser L is irradiated to the irradiation position n1, and the unsintered region 101c is also sintered at the same time. Thereby, a three-dimensional molded product can be obtained while removing an unsintered portion, in other words, a region that can be a defective portion, inside the three-dimensional molded product.

DESCRIPTION OF SYMBOLS 101 ... Single layer, 1000 ... Three-dimensional shaping | molding apparatus, 1100 ... Drive means, 1200 ... Molding table, 1300 ... Molding frame, 1400 ... Raw material supply means, 1500 ... Recoater, 1600 ... Excess raw material discharge part.

Claims (6)

At least on the first monolayer including a sintered monolayer obtained by irradiating the material to be sintered in which the metal powder and the binder are kneaded with an energy ray that enables the material to be sintered to be sintered. A three-dimensional molded product formed by laminating a second single layer including the sintered single layer,
The sintered single layer is formed by assembling sintered bodies irradiated with the energy rays and sintered,
The sintered body diameter in plan view of the sintered body is D,
When the distance between the sintered body centers of the adjacent sintered bodies is P,
0.5 ≦ P / D <1.0
Is,
A three-dimensional molded product characterized by that. The sintered single layer includes a first sintered body, a second sintered body, and a third sintered body that are adjacent to each other,
The second single layer includes the first sintered body and the second sintered body in which the sintered body center of the sintered body included in the second single layer is included in the first single layer. And a triangle region in a plan view configured by connecting the sintered body centers of the body and the third sintered body,
The three-dimensional molded product according to claim 1. The three-dimensional molded product according to claim 1 or 2, wherein the energy beam is a laser. At least on the first monolayer including a sintered monolayer obtained by irradiating the material to be sintered in which the metal powder and the binder are kneaded with an energy ray that enables the material to be sintered to be sintered. A three-dimensional molding method for obtaining a three-dimensional molded product by laminating a second single layer including the sintered single layer,
The sintered single layer is formed by assembling sintered bodies irradiated with the energy rays and sintered,
The sintered body diameter in plan view of the sintered body is D,
When the distance between the sintered body centers of the adjacent sintered bodies is P,
0.5 ≦ P / D <1.0
Is,
A three-dimensional forming method. The sintered body included in the sintered single layer includes an adjacent first sintered body, a second sintered body, and a third sintered body,
The second single layer includes the first sintered body and the second sintered body in which the sintered body center of the sintered body included in the second single layer is included in the first single layer. And a triangular region in plan view constituted by the sintered body center of each of the body and the third sintered body,
The three-dimensional forming method according to claim 4. The three-dimensional forming method according to claim 4 or 5, wherein the energy beam is a laser.

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