JP2016207370A - LED lighting device - Google Patents

LED lighting device Download PDF

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Publication number
JP2016207370A
JP2016207370A JP2015085749A JP2015085749A JP2016207370A JP 2016207370 A JP2016207370 A JP 2016207370A JP 2015085749 A JP2015085749 A JP 2015085749A JP 2015085749 A JP2015085749 A JP 2015085749A JP 2016207370 A JP2016207370 A JP 2016207370A
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led
translucent cover
light
lighting device
led lighting
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昌明 峯田
Masaaki Mineta
昌明 峯田
和志 酒井
Kazushi Sakai
和志 酒井
泰希 狩野
Yasuki Kano
泰希 狩野
陽子 一丸
Yoko Ichimaru
陽子 一丸
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Iris Ohyama Inc
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Iris Ohyama Inc
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Abstract

PROBLEM TO BE SOLVED: To provide an LED lighting device which has achieved both securing of illuminance on a main irradiation surface, and reduction in illuminance unevenness which can happen in the peripheral region of the main irradiation surface.SOLUTION: An LED lighting device includes: an LED substrate 1 on which a plurality of LED elements 10 whose power consumption is 0.7-1.5 W are arranged; a translucent cover 3 for covering the LED substrate 1 and for passing the light from the LED elements 10 while diffusing it; and a reflection member 4 which has a cylindrical shape having an inlet 40 and an outlet 41 for the light which has passed the translucent cover 3, and whose inner peripheral surface is set to a reflection surface 42. In the translucent cover 3, when viewed via the outlet 41 and the inlet 40 of the reflection member 4, the degree of diffusion of passing light in a peripheral region ARs is set to be higher than that in the central region ARc.SELECTED DRAWING: Figure 4

Description

本開示は、LED照明装置に関する。   The present disclosure relates to an LED lighting device.

近年、環境意識の高まりから、省電力化に優れたLED(Light Emitting Diode;発光ダイオード)素子を光源に使用したLED照明装置が普及している。LED照明装置の一種として、天井に埋め込み設置されるLEDダウンライトが知られている。   2. Description of the Related Art In recent years, LED lighting devices using LED (Light Emitting Diode) elements, which are excellent in power saving, as light sources have become widespread due to increasing environmental awareness. As one type of LED lighting device, an LED downlight that is embedded in a ceiling is known.

例えば、特許文献1には、LED素子が配置されるLED基板と、LED基板を覆う透光性カバーと、透光性カバーを透過した光を反射させる筒状の反射部材と、を有するダウンライトが開示されている。   For example, Patent Document 1 discloses a downlight having an LED substrate on which an LED element is disposed, a translucent cover that covers the LED substrate, and a cylindrical reflection member that reflects light that has passed through the translucent cover. Is disclosed.

特開2014−13706号公報JP 2014-13706 A 特開2008−270096号公報JP 2008-270096 A

近年、LED素子の改良により、ハイパワー(消費電力が0.7W〜1.5W)のLED素子は、広範囲に十分な輝度が確保されるように広角になってきている。   In recent years, due to improvements in LED elements, LED elements with high power (power consumption of 0.7 W to 1.5 W) have become wide-angle so as to ensure sufficient luminance over a wide range.

しかしながら、ハイパワーのLEDは輝度が高いため、ハイパワーのLEDが複数個実装されて形成されたLED光源は、LEDが有る部分とLEDが無い部分でLED光源の輝度ムラが顕著に目立つようになってきた。このようなLED光源の輝度ムラは、透光性カバー及び反射部材の影響を受け、光源で照らされる被照射面に照度ムラを発現させる場合がある。被照射面の照度ムラは、中央側よりも縁側に強く発現する。   However, since high-power LEDs have high luminance, the LED light source formed by mounting a plurality of high-power LEDs so that the luminance unevenness of the LED light source is conspicuously conspicuous between the portion where the LEDs are present and the portion where the LEDs are absent. It has become. Such brightness unevenness of the LED light source is affected by the translucent cover and the reflecting member, and may cause unevenness of illumination on the irradiated surface illuminated by the light source. Irradiance unevenness on the irradiated surface is more strongly expressed on the edge side than on the center side.

このような輝度ムラを低減する手段として、例えば特許文献2には、透光性カバーに拡散処理を施すことが記載されている。しかしながら、ハイパワーのLED素子の輝度ムラを低減するために透光性カバーに拡散処理を強く施すと、被照射面のうち明るく照らされる必要がある中央側の主照射面自体の照度が低下してしまう。   As a means for reducing such luminance unevenness, for example, Patent Document 2 describes performing a diffusion process on a translucent cover. However, if the light-transmitting cover is subjected to a diffusion treatment in order to reduce the luminance unevenness of the high-power LED element, the illuminance of the main irradiation surface itself on the central side that needs to be brightly illuminated among the irradiated surfaces is reduced. End up.

本開示は、このような課題に着目してなされたものであって、その目的では、主照射面の照度の確保と、主照射面の周辺領域に生じうる照度ムラの低減と、を両立したLED照明装置を提供することである。   The present disclosure has been made paying attention to such a problem, and for that purpose, it is possible to achieve both ensuring the illuminance of the main irradiation surface and reducing the illuminance unevenness that may occur in the peripheral area of the main irradiation surface. An LED illumination device is provided.

本開示は、上記目的を達成するために、次のような手段を講じている。   In order to achieve the above object, the present disclosure takes the following measures.

すなわち、本開示のLED照明装置は、消費電力が0.7〜1.5WのLED素子が複数配置されるLED基板と、前記LED基板を覆い、前記LED素子からの光を拡散させつつ通過させる透光性カバーと、前記透光性カバーを通過した光の入口及び出口を有する筒状をなし、内周面が反射面に設定されている反射部材と、を備え、前記透光性カバーは、前記反射部材の前記出口及び前記入口を介して見た場合に、中央領域よりも周辺領域の方が、通過光の拡散度合が高く設定されている。   That is, the LED lighting device according to the present disclosure covers an LED substrate on which a plurality of LED elements with power consumption of 0.7 to 1.5 W are arranged, and covers the LED substrate, and allows light from the LED elements to pass through while diffusing. A translucent cover, and a reflecting member having a cylindrical shape having an entrance and an exit for light that has passed through the translucent cover, and having an inner peripheral surface set as a reflective surface; When viewed through the outlet and the inlet of the reflecting member, the diffusion degree of the passing light is set higher in the peripheral region than in the central region.

拡散度合は、透光性カバーのヘイズ値または表面粗さなどで表すことができる。表面粗さは、透光性カバーの表面に施す粗面化処理(例えばシボ加工等)でコントロールできる。   The degree of diffusion can be represented by the haze value or surface roughness of the translucent cover. The surface roughness can be controlled by a roughening treatment (for example, embossing) applied to the surface of the translucent cover.

反射部材を介さずに直接、被照射面のうち主照射面に照射される光(出射角度が光軸に近い光)が通過する中央領域は拡散度合が低いので高い照度が確保され、反射部材を介して主照射面の周辺領域に照射される光(光軸から大きな角度をもって出射され、反射部材で一回以上反射して被照射面に達した光)が通過する周辺領域は拡散度合が高いので、反射部材に焦点化作用があったとしても、照度ムラを低減又は防止することが可能となる。   The central region through which the light (light whose exit angle is close to the optical axis) directly irradiated on the main irradiated surface among the irradiated surfaces passes directly without passing through the reflecting member, so that high illuminance is secured because the degree of diffusion is low, and the reflecting member The peripheral region through which the light irradiated to the peripheral region of the main irradiation surface (light emitted from the optical axis at a large angle and reflected by the reflecting member one or more times to reach the irradiated surface) has a diffusion degree. Since it is high, it is possible to reduce or prevent illuminance unevenness even if the reflecting member has a focusing effect.

本実施形態のLED照明装置を示す斜視図。The perspective view which shows the LED lighting apparatus of this embodiment. LED照明装置を示す斜視図。The perspective view which shows LED lighting apparatus. LED照明装置を構成する各部材を示す分解斜視図。The disassembled perspective view which shows each member which comprises LED lighting apparatus. LED照明装置の縦断面図。The longitudinal cross-sectional view of a LED lighting apparatus. 透光性カバーの正面図。The front view of a translucent cover.

以下、本開示の一実施形態の照明装置について、図面を用いて説明する。   Hereinafter, an illumination device according to an embodiment of the present disclosure will be described with reference to the drawings.

[基本構成]
図1〜4に示すように、LED照明装置は、LED(Light Emitting Diode;発光ダイオード)を用いたLED素子10が実装される基板1と、基板1が取り付けられる基台2と、基板1を覆う透光性カバー3と、透光性カバー3を通過した光を反射させる反射部材4と、基台2を支持する外筒5と、天井材の埋め込み孔に固定するための複数の固定バネ6と、を有する。LED照明装置は、図1及び図2に示すように、各部1〜5を組み付けた状態で全体として円柱状部と円筒状部を同軸に結合したような形状をなし、円筒状部が下方X2に開口するように天井材の埋め込み孔に埋め込まれ、円筒状部から光を照射する。なお、本明細書において理解を容易にするために、上方X1、下方X2は、天井材への設置状態での方向を意味する。
[Basic configuration]
As shown in FIGS. 1 to 4, the LED lighting device includes a substrate 1 on which an LED element 10 using an LED (Light Emitting Diode) is mounted, a base 2 to which the substrate 1 is attached, and a substrate 1. A translucent cover 3 for covering, a reflecting member 4 for reflecting light that has passed through the translucent cover 3, an outer cylinder 5 for supporting the base 2, and a plurality of fixing springs for fixing to the embedding holes of the ceiling material 6. As shown in FIGS. 1 and 2, the LED lighting device has a shape in which the cylindrical portion and the cylindrical portion are coaxially coupled as a whole in a state where the portions 1 to 5 are assembled, and the cylindrical portion is downward X2. It is embedded in the embedding hole of the ceiling material so as to open, and light is irradiated from the cylindrical portion. In addition, in order to make an understanding easy in this specification, upper X1 and lower X2 mean the direction in the installation state to a ceiling material.

外筒5は、図1〜4に示すように、筒状の外筒本体50と、外筒本体50の下端に設けられ、天井材への設置状態で化粧枠となる化粧フランジ部51と、を有する。本実施形態では、外筒5は、樹脂で形成されているが、金属などの任意の部材で形成してもよい。   1-4, the outer cylinder 5 is provided at the lower end of the cylindrical outer cylinder main body 50 and the outer cylinder main body 50, and as shown in FIGS. Have In this embodiment, the outer cylinder 5 is formed of resin, but may be formed of any member such as metal.

複数の固定バネ6は、金属で形成されており、図1及び図2に示すように、外筒本体50の外周面に軸回りに放射状に取り付けられている。本実施形態では、固定バネ6は4つ形成されているが、数は適宜変更可能であり、好ましくは3つ以上あればよい。固定バネ6は、外力を受けていない自然状態で外筒本体50から径方向外側に延びている。設置前に、固定バネ6は、上方を向くように根本から曲げられ、天井材の埋め込み孔に外筒5と共に挿入される。LED照明装置が埋め込み孔の奥に進むにつれて、固定バネ6は蓄積した弾性反発力によって天井材の裏側にて径方向外側に開き、天井材に係わり合ってLED照明装置を支持する。   The plurality of fixed springs 6 are made of metal, and are attached radially to the outer peripheral surface of the outer cylinder main body 50 as shown in FIGS. 1 and 2. In the present embodiment, four fixing springs 6 are formed, but the number can be changed as appropriate, and preferably three or more. The fixed spring 6 extends radially outward from the outer cylinder body 50 in a natural state where no external force is received. Before installation, the fixing spring 6 is bent from the root so as to face upward, and is inserted together with the outer cylinder 5 into the embedding hole of the ceiling material. As the LED lighting device advances to the back of the embedding hole, the fixed spring 6 opens radially outward on the back side of the ceiling material by the accumulated elastic repulsive force, and engages with the ceiling material to support the LED lighting device.

基台2は、図3及び図4に示すように、LED基板1を取り付けるための基板取付面20を有する円形板状部位を有し、円形板状部位から軸方向に沿って起立する複数の放熱フィン21が形成されている。基台2は、放熱フィン21を含め全体として円柱状に形成されている。基台2の一端面全体が基板取付面20に設定されている。基台2は、ネジなどの締着具vによって外筒5の上端部に固定される。基台2は、熱伝導性を有する金属で形成され、外部に起立する放熱フィン21が一体に形成されている。これにより、基台2は、LED基板1の熱を基板取付面20で受けて放熱フィン21を介して外部に放出する放熱部材としての役割を兼ねている。本実施形態では、基台2は、冷間鍛造によって形成されるが、これに限定されず、例えばダイキャストで製造されていてもよい。基台2は、アルミで構成されているが、熱伝導性を有する材料であれば、アルミに限定されない。   As shown in FIGS. 3 and 4, the base 2 has a circular plate-shaped portion having a substrate mounting surface 20 for mounting the LED substrate 1, and a plurality of standing up from the circular plate-shaped portion along the axial direction. Radiating fins 21 are formed. The base 2 is formed in a columnar shape as a whole including the radiation fins 21. The entire end surface of the base 2 is set to the board mounting surface 20. The base 2 is fixed to the upper end portion of the outer cylinder 5 by a fastener v such as a screw. The base 2 is formed of a metal having thermal conductivity, and heat radiation fins 21 that stand up outside are integrally formed. Thereby, the base 2 also serves as a heat radiating member that receives the heat of the LED board 1 at the board mounting surface 20 and releases it to the outside through the heat radiating fins 21. In this embodiment, although the base 2 is formed by cold forging, it is not limited to this, For example, you may manufacture by die-casting. Although the base 2 is comprised with aluminum, if it is a material which has heat conductivity, it will not be limited to aluminum.

LED基板1は、絶縁性材料で形成され、図3〜5に示すように、複数のLED素子10が表面に実装されている。また、LED基板1の表面には、LED素子10に電力を供給する電線が接続されている。電線は、LED照明装置の外に設けられた電源回路部(天井材の裏に設置される)から電力を受ける。本実施形態において、LED基板1は円形の板状をなしているが、これに限定されない。例えば、楕円状や矩形状でもよい。複数のLED素子10が格子状に配列されているが、これに限定されない。基板1の形状、LED素子10の配列は適宜変更可能である。LED基板1は、基台2に対してネジなどの締着具vで取り付けられており、基板取付面20に直接的又は間接的に密着し、基台2に熱を伝熱する。本実施形態では、LED基板1と基板取付面20との間に、スクリーン印刷した伝熱グリス(熱伝導材)が塗布されているが、これに限定されない。例えば、両者の間に何も介在させずに直接密着させてもよく、また、伝熱シートを介在させてもよい。   The LED substrate 1 is formed of an insulating material, and a plurality of LED elements 10 are mounted on the surface as shown in FIGS. An electric wire that supplies power to the LED element 10 is connected to the surface of the LED substrate 1. The electric wire receives power from a power supply circuit unit (installed behind the ceiling material) provided outside the LED lighting device. In the present embodiment, the LED substrate 1 has a circular plate shape, but is not limited thereto. For example, it may be oval or rectangular. The plurality of LED elements 10 are arranged in a grid pattern, but the present invention is not limited to this. The shape of the substrate 1 and the arrangement of the LED elements 10 can be changed as appropriate. The LED substrate 1 is attached to the base 2 with a fastener v such as a screw, and directly or indirectly adheres to the substrate attachment surface 20 and transfers heat to the base 2. In the present embodiment, screen-printed heat transfer grease (heat conductive material) is applied between the LED board 1 and the board mounting surface 20, but the present invention is not limited to this. For example, it may be in direct contact with nothing between them, or a heat transfer sheet may be interposed.

図3及び図4に示すように、透光性カバー3(図3参照)は、樹脂で形成され、LED素子10からの光を拡散させつつ透過させる。透光性カバー3は、ネジなどの締着具によってLED基板1と共に基台2に取り付けられる。   As shown in FIGS. 3 and 4, the translucent cover 3 (see FIG. 3) is formed of a resin and allows light from the LED element 10 to pass through while diffusing. The translucent cover 3 is attached to the base 2 together with the LED substrate 1 by a fastener such as a screw.

反射部材4は、入口40及び出口41を有する筒状をなし、内周面が反射面42に設定されている。反射部材4は、外筒5の内側に挿入され、LED基板1に接することなく外筒5にネジなどの締着具vによって固定される。反射部材4は、透光性カバー3を通過して入口40に入った光が出口41から出るまでの間に反射面42により反射させる。本実施形態において、反射部材4は、樹脂で形成されているが、これに限定されず、金属で形成してもよい。   The reflecting member 4 has a cylindrical shape having an inlet 40 and an outlet 41, and an inner peripheral surface is set as a reflecting surface 42. The reflecting member 4 is inserted inside the outer cylinder 5 and is fixed to the outer cylinder 5 with a fastener v such as a screw without contacting the LED substrate 1. The reflecting member 4 is reflected by the reflecting surface 42 until the light that has passed through the translucent cover 3 and entered the entrance 40 exits from the exit 41. In the present embodiment, the reflecting member 4 is formed of resin, but is not limited thereto, and may be formed of metal.

電線を介してLED基板1に電力が供給されると、LED素子10が発光する。LED素子10からの光は、透光性カバー3を通過しつつ拡散され、反射部材4の入口40に入る。反射部材4の入口40に入った光は、一部が反射面42で反射されながら出口41から所望の照明対象エリアに向けて照射される。   When electric power is supplied to the LED substrate 1 through the electric wire, the LED element 10 emits light. Light from the LED element 10 is diffused while passing through the translucent cover 3 and enters the entrance 40 of the reflecting member 4. The light that has entered the entrance 40 of the reflecting member 4 is irradiated toward the desired illumination target area from the exit 41 while being partially reflected by the reflecting surface 42.

[詳細な構成]
上記LED照明装置の基本構成に対し、本実施形態では更に以下の構成を有する。
[Detailed configuration]
In contrast to the basic configuration of the LED lighting device, the present embodiment further includes the following configuration.

LED素子10には、消費電力が0.7以上且つ1.5Wであり、いわゆるハイパワーのLED素子を用いている。   As the LED element 10, a so-called high power LED element having a power consumption of 0.7 or more and 1.5 W is used.

図4及び図5に示すように、透光性カバー3は、LED基板1にネジ止めされる環状の鍔部30と、鍔部30から反射部材4側へ盛り上がり、LED素子10からの光を透過させる突出部31とを有する。突出部31は、取り付け状態で反射部材4の入口40よりも反射部材4の内側へ入っている。反射部材4の出口41及び入口40を介して見た場合に、中央領域ARcよりも周辺領域ARsの方が、通過光の拡散度合が高く設定されている。   As shown in FIGS. 4 and 5, the translucent cover 3 includes an annular flange 30 that is screwed to the LED substrate 1, and bulges from the flange 30 toward the reflecting member 4, and transmits light from the LED element 10. And a projecting portion 31 to be transmitted. The protruding portion 31 is located inside the reflecting member 4 from the entrance 40 of the reflecting member 4 in the attached state. When viewed through the outlet 41 and the inlet 40 of the reflecting member 4, the diffusion degree of the passing light is set higher in the peripheral area ARs than in the central area ARc.

拡散度合は、透光性カバーのヘイズ値または表面粗さなどで表すことができる。表面粗さは、透光性カバーの表面に施す粗面化処理(例えばシボ加工等)でコントロールできる。   The degree of diffusion can be represented by the haze value or surface roughness of the translucent cover. The surface roughness can be controlled by a roughening treatment (for example, embossing) applied to the surface of the translucent cover.

本実施形態では、透光性カバー3が樹脂製であり、樹脂の金型のシボ加工処理の度合いを異ならせることで、中央領域ARcと周辺領域ARsの表面粗さを異ならせて、通過光の拡散度合を異ならせている。樹脂材料としては、ポリカーボネートなどが挙げられる。
樹脂材料は光透過性を有するものであればよく、これに限定されない。本実施形態では、金型表面にサンドブラスト処理を施しているが、これに限定されない。
In the present embodiment, the translucent cover 3 is made of resin, and the surface roughness of the central area ARc and the peripheral area ARs is made different by changing the degree of the embossing processing of the resin mold, so that the passing light is different. The degree of diffusion is different. Examples of the resin material include polycarbonate.
The resin material should just have a light transmittance, and is not limited to this. In the present embodiment, the surface of the mold is sandblasted, but the present invention is not limited to this.

中央領域ARcの(Rz)は、2.0以上且つ6.0マイクロメートル以下が好ましく、周辺領域ARsの(Rz)は、6.0以上且つ12マイクロメートル以下が好ましい。周辺領域ARsは、ハイパワーのLED素子10がくっきりと見えないようにするために、(Rz)は、6.0以上且つ12マイクロメートル以下が好ましい。
ここで、Rzは、JIS規格(JIS B0601)で定義された十点平均粗さである。
(Rz) in the central area ARc is preferably 2.0 or more and 6.0 micrometers or less, and (Rz) in the peripheral area ARs is preferably 6.0 or more and 12 micrometers or less. In the peripheral area ARs, (Rz) is preferably 6.0 or more and 12 micrometers or less so that the high-power LED element 10 cannot be clearly seen.
Here, Rz is a ten-point average roughness defined by the JIS standard (JIS B0601).

本実施形態では、中央領域ARcのヘイズ値は18.6%であり、周辺領域ARsのヘイズ値は28.2%であった。中央領域ARcのヘイズ値は、14以上且つ22%以下が好ましく、周辺領域ARsのヘイズ値は、23以上且つ33%以下が好ましい。計測は、透光性カバーをポリカーボネートで厚み4mmとし、観測条件を2度視野、C光源を用いてスポットサイズをφ15mmとし、拡散面を積分球側にセットして測定した。値は自動三回測定の平均値である。なお、ヘイズ値は、次の式で算出可能である。ヘイズ値(%)=Td/Tt×100。Tdは拡散透過率を表し、Ttは全光線透過率を表す。   In the present embodiment, the haze value of the central area ARc is 18.6%, and the haze value of the peripheral area ARs is 28.2%. The haze value of the central region ARc is preferably 14 or more and 22% or less, and the haze value of the peripheral region ARs is preferably 23 or more and 33% or less. The measurement was performed by setting the translucent cover to polycarbonate with a thickness of 4 mm, the observation condition as a field of view twice, a spot size of φ15 mm using a C light source, and setting the diffusion surface on the integrating sphere side. The value is the average of three automatic measurements. The haze value can be calculated by the following formula. Haze value (%) = Td / Tt × 100. Td represents the diffuse transmittance, and Tt represents the total light transmittance.

なお、本実施形態では、透光性カバー3を中央領域ARcと周辺領域ARsに区別して、拡散度合を異ならせているが、中央側から周辺へ向けて徐々に拡散度合が低くなるようにしてもよい。   In the present embodiment, the translucent cover 3 is differentiated into the central area ARc and the peripheral area ARs, and the degree of diffusion is different, but the degree of diffusion gradually decreases from the center side toward the periphery. Also good.

以上のように、本実施形態のLED照明装置は、消費電力が0.7〜1.5WのLED素子10が複数配置されるLED基板1と、LED基板1を覆い、LED素子10からの光を拡散させつつ通過させる透光性カバー3と、透光性カバー3を通過した光の入口40及び出口41を有する筒状をなし、内周面が反射面42に設定されている反射部材4と、を備える。透光性カバー3は、反射部材4の出口41及び入口40を介して見た場合に、中央領域ARcよりも周辺領域ARsの方が、通過光の拡散度合が高く設定されている。   As described above, the LED lighting device of the present embodiment includes the LED substrate 1 on which a plurality of LED elements 10 with power consumption of 0.7 to 1.5 W are arranged, the LED substrate 1, and the light from the LED elements 10. The reflecting member 4 has a translucent cover 3 through which light is diffused and a cylindrical shape having an entrance 40 and an exit 41 for light that has passed through the translucent cover 3, and the inner peripheral surface is set as the reflecting surface 42. And comprising. When the translucent cover 3 is viewed through the outlet 41 and the inlet 40 of the reflecting member 4, the peripheral area ARs is set to have a higher diffusion degree of the passing light than the central area ARc.

反射部材4を介さずに直接、被照射面のうち主照射面に照射される光(出射角度が光軸に近い光)が通過する中央領域ARcは拡散度合が低いので高い照度が確保され、反射部材4を介して主照射面の周辺に照射される光(光軸から大きな角度をもって出射され、反射部材で一回以上反射して被照射面に達した光)が通過する周辺領域ARsは拡散度合が高いので、反射部材4に焦点化作用があったとしても、照度ムラを低減又は防止することが可能となる。   The central region ARc through which the light irradiated to the main irradiation surface among the irradiated surfaces (light whose exit angle is close to the optical axis) passes directly without passing through the reflecting member 4 has a low degree of diffusion, so high illuminance is secured, The peripheral area ARs through which light irradiated to the periphery of the main irradiation surface via the reflecting member 4 (light emitted from the optical axis at a large angle and reflected once by the reflecting member to reach the irradiated surface) passes is Since the degree of diffusion is high, even if the reflecting member 4 has a focusing effect, it is possible to reduce or prevent illuminance unevenness.

なお、主照射面からLED素子10を視認した場合には、LED素子10の輝度ムラが見えるが、ハイパワーのLED素子10を視認しようとする要求は少なく、弊害がない。   In addition, when the LED element 10 is visually recognized from the main irradiation surface, luminance unevenness of the LED element 10 is visible, but there is little demand for visually recognizing the high-power LED element 10, and there is no harmful effect.

樹脂材料に拡散剤を混ぜて透光性カバー3の拡散度合を部位毎に異ならせるのは難しい。   It is difficult to mix the resin material with a diffusing agent to vary the degree of diffusion of the translucent cover 3 for each part.

そこで、本実施形態では、透光性カバー3は、樹脂製であり、中央領域ARcと周辺領域ARsは、シボ加工処理の度合いを異ならせてある。   Therefore, in the present embodiment, the translucent cover 3 is made of resin, and the center region ARc and the peripheral region ARs have different degrees of the texture processing.

このように、シボ加工であれば、金型へのシボ加工処理の度合いによって透光性カバー3の拡散度合をコントロールできるので、一般的な拡散剤を用いる場合に比べて製造が容易となる。   As described above, since the degree of diffusion of the translucent cover 3 can be controlled according to the degree of the embossing process on the mold, the manufacturing becomes easier as compared with the case of using a general diffusing agent.

本開示は上述した実施形態に何ら限定されるものではない。上記の各実施形態で採用している構造を他の任意の実施形態に採用することは可能である。各部の具体的な構成は、上述した実施形態のみに限定されるものではなく、本開示の趣旨を逸脱しない範囲内で種々の改良変更が可能である。   The present disclosure is not limited to the embodiment described above. The structure employed in each of the above embodiments can be employed in any other embodiment. The specific configuration of each unit is not limited to the above-described embodiment, and various improvements and modifications can be made without departing from the spirit of the present disclosure.

1…LED基板
10…LED素子
3…透光性カバー
4…反射部材
40…入口
41…出口
ARc…中央領域
ARs…周辺領域
DESCRIPTION OF SYMBOLS 1 ... LED board 10 ... LED element 3 ... Translucent cover 4 ... Reflective member 40 ... Inlet 41 ... Outlet ARc ... Center area ARs ... Peripheral area

Claims (4)

消費電力が0.7〜1.5WのLED素子が複数配置されるLED基板と、
前記LED基板を覆い、前記LED素子からの光を拡散させつつ通過させる透光性カバーと、
前記透光性カバーを通過した光の入口及び出口を有する筒状をなし、内周面が反射面に設定されている反射部材と、を備え、
前記透光性カバーは、前記反射部材の前記出口及び前記入口を介して見た場合に、中央領域よりも周辺領域の方が、通過光の拡散度合が高く設定されている、LED照明装置。
An LED substrate on which a plurality of LED elements having a power consumption of 0.7 to 1.5 W are disposed;
A translucent cover that covers the LED substrate and allows light from the LED element to pass while diffusing;
A cylindrical member having an entrance and an exit for light that has passed through the translucent cover, and a reflection member having an inner peripheral surface set as a reflection surface; and
When the translucent cover is viewed through the outlet and the inlet of the reflecting member, the peripheral region is set to have a higher diffusion degree of the passing light than the central region.
前記透光性カバーは、樹脂製であり、
前記中央領域と前記周辺領域は、シボ加工処理の度合いを異ならせてある、請求項1に記載のLED照明装置。
The translucent cover is made of resin,
The LED lighting device according to claim 1, wherein the central region and the peripheral region have different degrees of embossing processing.
前記中央領域の十点平均粗さ(Rz)は、2.0以上且つ6.0マイクロメートル以下であり、前記周辺領域の十点平均粗さ(Rz)は、6.0以上且つ12.0マイクロメートル以下である、請求項1又は2に記載のLED照明装置。   The ten-point average roughness (Rz) of the central region is 2.0 or more and 6.0 micrometers or less, and the ten-point average roughness (Rz) of the peripheral region is 6.0 or more and 12.0. The LED lighting device according to claim 1 or 2, wherein the LED lighting device is not more than a micrometer. 前記中央領域のヘイズ値は、14%以上且つ22%以下であり、前記周辺領域のヘイズ値は、23%以上且つ33%以下である、請求項1〜3のいずれかに記載のLED照明装置。   4. The LED lighting device according to claim 1, wherein a haze value of the central region is 14% or more and 22% or less, and a haze value of the peripheral region is 23% or more and 33% or less. .
JP2015085749A 2015-04-20 2015-04-20 LED lighting device Pending JP2016207370A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012209057A (en) * 2011-03-29 2012-10-25 Kurabo Ind Ltd Cover for lighting
WO2012144325A1 (en) * 2011-04-19 2012-10-26 コニカミノルタアドバンストレイヤー株式会社 Led lighting device and lens for led lighting device
JP2012243680A (en) * 2011-05-23 2012-12-10 Sharp Corp Lighting system
JP2014013706A (en) * 2012-07-04 2014-01-23 Panasonic Corp Luminaire

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012209057A (en) * 2011-03-29 2012-10-25 Kurabo Ind Ltd Cover for lighting
WO2012144325A1 (en) * 2011-04-19 2012-10-26 コニカミノルタアドバンストレイヤー株式会社 Led lighting device and lens for led lighting device
JP2012243680A (en) * 2011-05-23 2012-12-10 Sharp Corp Lighting system
JP2014013706A (en) * 2012-07-04 2014-01-23 Panasonic Corp Luminaire

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