JP2016203403A - Circuit board, printing material container and printer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a halogen-free substrate reducing a crack and cutting waste and securing reliability.SOLUTION: A circuit board 200 consists of a halogen-free base material, is disposed with a storage device 203 on a second surface SF2, and has a first terminal group TA1 and a second terminal group TA2 on a first surface SF1. The second terminal group TA2 includes a first detection terminal DT1, a second detection terminal DT2 and a terminal VSS for the storage device 203. The first terminal group TA1 includes a first terminal CO1 provided closest to a third side SD3 side and a second terminal CO2 provided closest to a fourth side SD4 side. Wiring connecting the first terminal CO1 and the second terminal CO2 is disposed along a second side SD2, and wiring connected to the terminal VSS is disposed along the third side SD3 and the fourth side SD4. The circuit board reducing occurrence of a crack of the circuit board and cutting waste and securing reliability can be provided by a configuration described above.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a circuit board, a printing material container including the circuit board, and a printing apparatus.

  2. Description of the Related Art Conventionally, printing apparatuses such as inkjet printers that are equipped with cartridges (printing material containers) for a plurality of colors and perform color printing have been known. These cartridges are generally mounted on a carriage on which an ink discharge head (printing head) is installed. At the time of printing, since the plurality of cartridges are integrated with the carriage and reciprocate on paper (print medium), the cartridges are required to be downsized.

In addition, a circuit board on which circuit elements such as an IC chip are mounted for storing information such as the remaining amount of ink is attached to the cartridge. This circuit board was manufactured in a state of a circuit board sheet on which a plurality of circuit boards were imposed, and finally divided individually using press working. The circuit board is also required to be miniaturized, and is designed to be a small size of several mm square. However, there has been a concern about damage to circuit elements due to the impact in the press working described above. On the other hand, in the router processing that does not use press processing, although damage is suppressed, there is a problem that processing costs increase.
Therefore, on the premise of press working suitable for mass production, for example, as described in Patent Document 1, in order to prevent the expansion of cracks generated in the base material during press working, the original wiring pattern There has been known a circuit board around which a reinforcing dummy pattern that is not involved in the operation of the circuit is installed. For example, as described in Patent Document 2, in order to reduce the occurrence of cracks during press working, a circuit board in which a wiring pattern serving as a buffer band is provided on the outer periphery has been known.

Japanese Patent Laid-Open No. 9-130013 Japanese Patent Laid-Open No. 4-94585

  However, the circuit boards described in Patent Document 1 and Patent Document 2 have a problem that chipping is likely to occur when a halogen-free substrate is used as a material (base material). Specifically, halogen-free substrates using halogen-free base materials reduce or replace the flame retardants (chlorine-based or bromine-based halogen compounds) blended in conventional substrates, so compared to conventional substrates. As a result, the toughness decreases and becomes brittle. For this reason, cracks and cutting scraps are likely to occur in the circuit board during press working. In particular, even if there is no problem with the electrical performance of the circuit board, after the cartridge is installed in the printer (during use), the cutting waste generated during cutting during press processing moves into the printer due to vibration during printing. There was a concern that could trigger a bug. Furthermore, in the circuit board described in Patent Document 1, since the dummy pattern is installed outside the original wiring pattern, there is a problem that the outer dimension becomes large. Further, in the circuit board described in Patent Document 2, since the wiring pattern as the buffer band is arranged so as to cover the cut surface of the outer peripheral edge, there is a possibility that metal scraps derived from the wiring pattern may be generated during the press working. was there. In other words, in a circuit board using a halogen-free board, there is a problem that it is difficult to ensure sufficient reliability.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 The circuit board described in this application example is a circuit board that is attached to a printing material container, and the base material of the circuit board is a halogen-free base material, and a storage device that stores the printing material information; A group of terminals having a plurality of storage device terminals connected to the storage device and at least one detection terminal and connected to the terminals on the printing apparatus main body when the printing material container is mounted on the printing apparatus main body And a terminal group is disposed on the first surface of the circuit board on the side of the printing apparatus main body, which is the connection surface side of the terminal, and the storage device is disposed on the second surface, which is the back surface of the first surface of the circuit board. When the second direction is a direction perpendicular to the first direction and the second side is the side opposite to the first side of the circuit board, the terminal group is the first side of the circuit board. A first terminal group in which M terminals are arranged along the first direction on the second direction side; A second terminal group in which N terminals (M and N are integers of 2 or more satisfying M <N) are arranged along the first direction on the second direction side of the one terminal group; When the second terminal group has the first detection terminal and the second detection terminal as at least one detection terminal, and the side facing the third side of the circuit board is the fourth side, The first detection terminal is a terminal provided on the third side of the N terminals of the second terminal group, and the second detection terminal is a terminal of the N terminals of the second terminal group. Of these, the terminals are provided on the fourth side, and the first terminal group includes a first terminal provided closest to the third side and a second terminal provided closest to the fourth side. And a wiring connecting the first terminal and the second terminal is disposed along the second side between the second terminal group of the circuit board and the second terminal group Detection Including a terminal disposed between the child and the second detection terminal for supplying a reference potential to the storage device by the printing apparatus, between the third side and the first terminal, and the fourth side Between the first terminal and the second terminal, a wiring that is connected to a terminal for supplying a reference potential to the storage device by the printing device is arranged.

  According to this application example, on the first surface of the circuit board, the portion along the second side, between the third side and the first terminal, and between the fourth side and the second terminal. In addition, each wiring is installed in a substantially frame shape along the outer shape. This wiring is preferably a solid wiring. A solid wiring means a wiring wider than a general wiring. Thereby, when the circuit board is cut and separated from the circuit board sheet into a single product by pressing, cracks and cutting waste of the halogen-free board can be reduced. This is because the solid wiring covers (reinforces) the outer shape (outer peripheral edge) of the circuit board, which is likely to generate cracks and scraps, in a substantially frame shape. That is, the toughness of the halogen-free substrate can be supplemented. In addition, since the solid wiring is not a dummy pattern but a pattern constituting a circuit is applied, there is no waste and the size can be reduced. Furthermore, it is possible to provide a halogen-free circuit board with improved reliability by suppressing the generation of cutting and metal scraps during press working.

  Application Example 2 In the circuit board described in the application example, the first terminal and the wiring connecting the second terminal, the third side, and the first terminal are arranged along the second side. And the wiring arranged between the fourth side and the second terminal are preferably wider than the wiring drawn from the memory device.

  According to this application example, the solid frame-like wiring that is wider than the wiring drawn from the storage device is disposed on the outer peripheral edge of the circuit board, whereby the substantially frame-shaped reinforcement is further strengthened. As a result, the generation of cracks and cutting waste during pressing in the halogen-free circuit board can be further reduced.

  Application Example 3 In the circuit board according to the application example described above, the second surface includes a position corresponding to the arrangement position of the second terminal group on the first surface and the second side of the circuit board. A circuit element is disposed between the first connection line, one end of which is connected to one end of the circuit element, and the second surface of the circuit board is connected to the other end of the circuit element. The other end of the first connection line is connected to the first detection terminal on the first surface through the first through hole of the circuit board, and the other end of the second connection line. Is preferably connected to the second detection terminal on the first surface via the second through hole of the circuit board.

  According to this application example, when the first and second detection terminals are arranged on both sides of the second terminal group on the first surface of the circuit board, the first and second detection terminals are connected to the first surface. Through the first and second through holes and the first and second connection lines, the circuit elements provided on the second surface of the circuit board can be connected with an efficient layout.

  Application Example 4 It is preferable that the circuit board described in the above application example has a substantially rectangular outer shape and has through holes formed at four corners.

  According to this application example, by providing the through holes at the four corners of the substantially rectangular circuit board, the strength of the circuit board is improved. This is because the through hole forms a cylindrical metal plating layer and serves as a reinforcement in the substrate thickness direction. Moreover, reinforcement can be made to act effectively by arrange | positioning in the four corners which are easy to deform | transform.

  Application Example 5 In the circuit board according to the application example described above, it is preferable that the circuit element is a resistance element, and the first detection terminal and the second detection terminal are mounting detection terminals of the printing material container.

  According to this application example, for example, the first and second detection terminals are arranged on both sides of the storage device terminal of the second terminal group, and the first and second detection terminals and the resistance element are circuits. By using the element, it becomes possible to realize mounting detection of the printing material container.

  Application Example 6 In the circuit board according to the application example described above, the connection line connecting the first terminal and the second terminal is connected from the first terminal to the first detection terminal and the first detection terminal. It is preferable that the second detection terminal and the second detection terminal are connected to the second terminal, and the second detection terminal is connected to the second terminal.

  According to this application example, the first and second detection terminals are provided as the terminals of the second terminal group, and the first and second terminals are provided even when the first and second terminals are provided as the first terminal group. An efficient layout wiring in which the two detection terminals are connected to the circuit element and the first and second terminals are connected via the connection line can be realized.

  Application Example 7 A printing material container according to this application example includes any of the circuit boards described above.

  According to this application example, it is possible to provide a printing material container that is mounted with a circuit board that is small and reduces the generation of cutting scraps and metal scraps and improves reliability.

  Application Example 8 A printing apparatus according to this application example includes the above-described printing material container and a printing apparatus main body.

  According to this application example, it is possible to provide a printing apparatus that operates stably by the printing material container on which the circuit board with improved reliability is mounted.

  Application Example 9 The circuit board described in the application example is a circuit board that is attached to a printing material container, and the base material of the circuit board is a halogen-free base material, and a storage device that stores the printing material information; A group of terminals having a plurality of storage device terminals connected to the storage device and at least one detection terminal and connected to the terminals on the printing apparatus main body when the printing material container is mounted on the printing apparatus main body A terminal group is arranged on the first surface of the circuit board on the side of the connection surface of the terminal on the printing apparatus main body side, and on the second surface which is the back surface of the first surface of the circuit board, When the memory device is arranged, the direction orthogonal to the first direction is the second direction, and the side opposite to the first side of the circuit board is the second side, the terminal group is the first side of the circuit board. On the second direction side of one side, the first terminals are arranged with M terminals along the first direction. On the second direction side of the child group and the first terminal group, a second terminal group in which N terminals (M and N are integers of 2 or more satisfying M <N) are arranged along the first direction. And the second terminal group includes, as at least one detection terminal, a first detection terminal and a second detection terminal, and a side opposite to the third side of the circuit board is a fourth side. In the case of the side, the first detection terminal is a terminal provided on the third side side among the N terminals of the second terminal group, and the second detection terminal is the second terminal group. Among the N terminals of the first terminal group, and the first terminal provided on the third side most of the M terminals of the first terminal group, and the most The second terminal provided on the side of 4 is longer in the first direction than the first detection terminal and the second detection terminal, and between the second terminal group of the circuit board, Wiring connecting the terminal and the second terminal, characterized in that it is disposed along the second side.

  According to this application example, on the first surface of the circuit board, the wiring is installed at the site along the second side, and the first terminal is located at the site along the third side, and the fourth terminal A second terminal is installed at a portion along the side of the terminal with an enlarged terminal area. The wiring is preferably a solid wiring. The solid wiring refers to wiring that is wider than other wiring constituting the circuit board, for example, wiring drawn from the memory device on the second surface. Thereby, when forming the rough outline of each circuit board with a circuit board sheet, or when cutting and separating a circuit board into a single product by press processing, it is possible to reduce cracks and cutting waste of the halogen-free board. This is because the terminals and wirings cover (reinforce) the outer peripheral edge of the circuit board in a substantially frame shape, which is liable to generate cracks and cutting scraps. That is, the toughness of the halogen-free substrate can be supplemented. Therefore, according to this application example, it is possible to provide a halogen-free circuit board that is small in size and suppresses generation of cutting scraps and metal scraps in press processing and has improved reliability.

1 is a configuration diagram (perspective view) of a printing apparatus according to Embodiment 1. FIG. The block diagram (perspective view) of a printing material container. The block diagram (plan view) of a circuit board. The block diagram (plan view) of a circuit board. The block diagram (plan view) of a circuit board. The block diagram (plan view) of a circuit board sheet. The schematic diagram (plan view) which shows single-piece separation of the circuit board from a circuit board sheet | seat. The flowchart figure which shows the manufacturing process of a circuit board sheet | seat and a circuit board. FIG. 3 is a configuration diagram (plan view) illustrating a configuration of a circuit board according to the second embodiment. FIG. 10 is a configuration diagram (perspective view) of a printing apparatus according to a second modification.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the scale of each member is made different from the actual scale in order to make each member recognizable.

(Embodiment 1)
FIG. 1 is a configuration diagram (perspective view) of a printing apparatus according to the present embodiment. The printing apparatus shown in FIG. 1 is an apparatus that forms an image by applying a printing material such as ink to a printing medium such as paper, film, or fabric. For example, an inkjet printer. First, a schematic configuration of the printing apparatus 1000 according to the present embodiment will be described.
<Configuration of printing apparatus and printing material container>
The printing apparatus 1000 includes a container mounting unit 1100 (cartridge mounting unit) on which a printing material container 100 (ink cartridge in a narrow sense) is mounted, a rotatable cover 1200, an operation unit 1300, and the like. The container mounting portion 1100 is called, for example, a “cartridge holder” or simply “holder” of an ink cartridge. In the example shown in FIG. 1, four printing material containers 100 (ink cartridges) are mounted on the container mounting portion 1100. The cover 1200 can be omitted. The operation unit 1300 is an input device for the user to make various instructions and settings to the printing apparatus 1000, and includes a display unit for making various notifications to the user.

  2A and 2B are configuration diagrams (perspective views) of the printing material container 100. FIG. The printing material container shown in FIG. 2 is a container that stores a printing material such as ink therein and supplies the printing material to a printing apparatus. Next, the printing material container 100 according to the first embodiment will be described. The XYZ axes in FIGS. 2A and 2B correspond to the XYZ axes in FIG. That is, the XYZ axes in the printing apparatus of FIG. 1 indicate the depth direction of the printer whose printing apparatus 1000 is the X axis, the Y axis is the width direction of the printer, and the Z axis is the height direction of the printer. The printing material container 100 has a flat, substantially rectangular parallelepiped external shape, and the length L1 (the size in the insertion direction of the container mounting portion 1100) among the length L1, the width L2, and the height L3 in the three directions. ) Is the largest, the width L2 is the smallest, and the height L3 is intermediate between the length L1 and the width L2.

  The printing material container 100 includes a front end surface Sf, a rear end surface Sr, a ceiling surface St, a bottom surface Sb, and two side surfaces Sc and Sd. A printing material storage chamber 120 (ink storage chamber, ink storage bag) is provided inside the printing material container 100, and liquid ink (not shown), which is a printing material, is stored inside the printing material storage chamber 120. Yes. The front end surface Sf has two positioning openings 131 and 132 and a printing material supply port 110 (ink supply port).

  A circuit board 200 is installed on the ceiling surface St. The circuit board 200 is mounted with a storage device (nonvolatile memory) for storing information about the printing material and the printing material container 100 (information about ink and ink cartridge). A concave / convex fitting portion 134 is disposed at a position where the side surface Sd and the front end surface Sf intersect.

<< Schematic configuration of circuit board >>
3, 4, and 5 are configuration diagrams (plan views) of the circuit board 200 according to the first embodiment. A circuit board 200 shown in FIGS. 3, 4, and 5 is an electrical component for fixing and wiring electronic components such as an IC chip and a resistance element. A schematic configuration of the circuit board 200 according to the present embodiment will be described. 3 is a diagram of the circuit board 200 as viewed from the first surface SF1 side (front surface side), and FIGS. 4 and 5 are diagrams of the circuit board 200 as viewed from the second surface SF2 side (back surface side). It is. Here, FIG. 4 is a diagram illustrating a state after the storage device 203 and the circuit element 210 are mounted, and FIG. 5 is a diagram illustrating a state before the storage device 203 and the circuit element 210 are mounted. In the present embodiment, a case will be described in which a double-sided through-hole board having conductor surfaces on both the front and back sides is employed as the circuit board 200.

  The circuit board sheet 190 (see FIG. 6) and the circuit board 200 according to this embodiment use a halogen-free board to which a halogen-free base material is applied as a base material. A halogen-free base material means what was based on the halogen-free copper clad laminated board test method JPCA-ES01 by Japan Electronic Circuit Industry Association. Specifically, the chlorine content is 900 ppm or less, the bromine content is 900 ppm or less, and the total content of chlorine and bromine is 1500 ppm or less by the test method defined above.

  The first surface SF1 of the circuit board 200 is a surface exposed to the outside in a state where the circuit board 200 is attached to the printing material container 100 (FIGS. 2A and 2B). . The second surface SF2 is the back surface of the first surface SF1. Further, a direction DIS in FIG. 3 indicates a mounting direction of the printing material container 100 to the container mounting portion 1100. This mounting direction DIS coincides with the X direction, which is the mounting direction of the printing material container 100 shown in FIGS. 2 (A) and 2 (B).

  The circuit board 200 is provided with a fixing opening HL (boss hole) for attaching the circuit board 200 to the printing material container 100. Further, the circuit board 200 is also provided with fixing grooves NT1, NT2, NT3 (boss grooves).

  Here, in FIGS. 3 to 5, the direction orthogonal to the first direction DR1 is set as DR2 in the second direction. Further, the direction opposite to the first direction DR1 is defined as a third direction DR3, and the direction opposite to the second direction DR2 is defined as a fourth direction DR4. Therefore, the second direction DR2 matches the mounting direction DIS.

  The substantially rectangular circuit board 200 has first to fourth sides SD1 to SD4. The side facing the first side SD1 is the second side SD2, and the side facing the third side SD3 is the fourth side SD4. The first and second sides SD1 and SD2 and the third and fourth sides SD3 and SD4 have a tolerance (orthogonal) at least between their extension lines. The corner portion corresponding to the intersection position of the first side SD1 to the fourth side SD4 has a C-plane shape (notch shape) or a curved shape.

  The circuit board 200 attached to the printing material container 100 includes a storage device 203, a circuit element 210, and a terminal group (TA1, TA2).

  The storage device 203 illustrated in FIG. 4 stores printing material information. This printing material information is information relating to the printing material stored in the printing material container 100, and is, for example, ink amount information (ink consumption amount information or remaining ink information), ink color information, and the like. Further, the storage device 203 can further store printing material container information that is information about the printing material container 100. The printing material container information is, for example, ID (identification) information or manufacturing information of the printing material container 100. The storage device 203 is realized by, for example, a nonvolatile memory (EEPROM or the like).

  The circuit element 210 is an element for various detections, for example, a resistance element (RD). The circuit element 210 may be a passive element (such as a capacitor) or an active element (such as a semiconductor element) other than the resistance element.

  The terminal group (TA1, TA2) illustrated in FIG. 3 includes a plurality of terminals provided on the circuit board 200. Specifically, the terminal group includes a plurality of storage device terminals (RST, SCK, VDD, VSS, SDA) connected to the storage device 203. A terminal VDD (power supply terminal) and a terminal VSS (ground terminal) are power supply potentials, and supply a reference potential to the IC (storage device 203). The terminal group includes at least one detection terminal (DT1, DT2) connected to the circuit element 210. This terminal group is connected to a connector terminal (connector terminal provided on the container mounting part 1100) on the printing apparatus main body side when the printing material container 100 is mounted on the printing apparatus main body (container mounting part 1100). Terminal.

  Then, as shown in FIG. 3, terminal groups (TA1, TA2) are arranged on the first surface SF1 of the circuit board 200. The first surface SF1 is a connection surface side of the connector terminal on the printing apparatus main body side. On the other hand, as shown in FIG. 4, the storage device 203 and the circuit element 210 are arranged (mounted) on the second surface SF <b> 2 that is the back surface of the first surface SF <b> 1 of the circuit board 200.

  Specifically, the terminal group provided on the first surface SF1 of the circuit board 200 includes a first terminal group TA1 and a second terminal group TA2. The first terminal group TA1 is a terminal group in which M terminals are arranged along the first direction DR1 on the second direction DR2 side of the first side SD1 of the circuit board 200. On the other hand, the second terminal group TA2 is a terminal group in which N terminals are arranged along the first direction DR1 on the second direction DR2 side of the first terminal group TA1. Here, M and N are integers greater than or equal to 2 such that M <N, and the number M of terminals in the first terminal group TA1 is smaller than the number N of terminals in the second terminal group TA2. .

  Specifically, the terminals of the first and second terminal groups TA1 and TA2 are formed in a substantially rectangular shape and are arranged so as to form two rows perpendicular (substantially perpendicular) to the mounting direction DIS. For example, of these two rows, the row along the line A1 on the near side of the mounting direction DIS (the row located on the upper side in FIG. 3) is the upper row (first row), and the back side (the mounting direction) of the mounting direction DIS. The row along the line A <b> 2 (the row located in the lower side in FIG. 3) along the line A <b> 2 is defined as the lower row (second row). In this case, the first terminal group TA1 is a terminal group in the upper row along the line A1, and the second terminal group TA2 is a terminal group in the lower row along the line A2. These lines A1 and A2 can also be considered as lines formed by contact portions CP of a plurality of terminals. When the printing material container 100 is mounted on the printing apparatus main body, the contact portion CP is such that a connector terminal provided inside the holder contacts each terminal in order to connect the apparatus-side circuit board and the circuit board 200. It is a part to do.

  That is, each terminal includes a contact portion CP in contact with a corresponding connector terminal among the plurality of connector terminals on the printing apparatus main body side at the center thereof. The contact portions CP of each terminal of the first terminal group TA1 along the line A1 and the contact portions CP of each terminal of the second terminal group TA2 along the line A2 are alternately arranged, so-called staggered. The configuration of the shape. In other words, the terminals of the first terminal group TA1 and the terminals of the second terminal group TA2 are arranged in a staggered manner so that the terminal centers are not aligned in the mounting direction DIS. doing. Unless otherwise specified, the terminals included in the first terminal group TA1 and the second terminal group TA2 have substantially the same surface area and shape of the terminals excluding the wiring portion to be connected.

  In the present embodiment, as shown in FIG. 4, the circuit element 210 is located on the second surface SF <b> 2 corresponding to the position (arrangement position line) of the second terminal group TA <b> 2 on the first surface SF <b> 1 ( Line) and the second side SD2 of the circuit board 200.

  For example, as shown in FIG. 3, the second terminal group TA2 is arranged on the first surface SF1 of the circuit board 200, and the position corresponding to the arrangement position of the second terminal group TA2 is the second terminal. This is a position on the second surface SF2 corresponding to the arrangement position on the first surface SF1 of the group TA2. Further, the contact portions CP of the terminals of the second terminal group TA2 are arranged along the lower line A2. As illustrated in FIG. 4, the circuit element 210 includes, on the second surface SF2, between the line A2 ′ corresponding to the line A2 (arrangement position line) and the second side SD2 of the circuit board 200. Be placed. More specifically, a line connecting the lower end (back side in the mounting direction) of each terminal of the second terminal group TA2 is A3. In this case, as shown in FIG. 4, the circuit element 210 includes a line A3 ′ corresponding to the line A3 (arrangement position line) and the second side SD2 of the circuit board 200 on the second surface SF2. Arranged between. In other words, the circuit element 210 is disposed between the storage device 203 and the second side SD2 on the second surface SF2.

  Thus, in the present embodiment, the circuit element 210 is arranged on the second side SD2 side of the circuit board 200. That is, the circuit element 210 is disposed closer to the second side SD2 than the first side SD1.

  Further, in the present embodiment, the circuit board 200 has a cut surface cut by a cutting process (pressing process) in single-piece separation of the circuit board 200 on a side other than the second side SD2. Taking FIG. 3 as an example, the third side SD3 has the first cut surface CSFA cut in the cutting step, and the fourth side SD4 has the second cut surface CSFB cut in the cutting step. Have Specifically, the third side SD3 of the circuit board 200 has the first cut surface CSFA at a position closer to the first side SD1 than to the second side SD2. In addition, the fourth side of the circuit board 200 has the second cut surface CSFB at a position closer to the first side SD1 than to the second side SD2. A cut surface may be formed on the first side SD1.

  Next, FIG. 6 is a configuration diagram of a circuit board sheet 190 having a structure in which a plurality of circuit boards 200 are connected in an array. FIG. 7 is a schematic diagram showing a state where a single circuit board 200 is separated from the circuit board sheet 190. Each circuit board 200 is separated as a single product by being separated from the circuit board sheet 190, as shown at H1 in FIG. 6 and H2 in FIG. That is, the circuit board 200 is separated by cutting the portions indicated by H3 and H4 in FIG. 7 in the cutting process. In this case, the cut portions indicated by H3 and H4 correspond to the first and second cut surfaces CSFA and CSFB in FIG.

  FIG. 8 is a flowchart showing manufacturing steps of the circuit board sheet 190 and the circuit board 200 according to the present embodiment. Hereinafter, the manufacturing process of the circuit board 200 will be described step by step.

  In step SP11, openings such as the through holes TC1 and TC2 and the fixing opening HL shown in FIG. 3 are formed in the circuit board sheet 190.

  In step SP12, the metal pattern of each terminal and wiring of the first and second terminal groups TA1 and TA2 is formed on the circuit board sheet 190 by, for example, metal plating (electrolytic plating).

  In step SP13, the outer shape of the circuit board 200 is formed by cutting out the gaps indicated by H5, H6, etc. shown in FIG. 6 from the circuit board sheet 190.

  In step SP14, the storage device 203 and the circuit element 210 shown in FIG. 4 are mounted on each circuit board 200.

  In step SP15, the cutting parts indicated by H3 and H4 in FIG. 7 are cut to separate the circuit board 200 from the circuit board sheet 190 and to separate them separately.

  Here, the reason for forming an opening such as a through hole in step SP11 before the metal pattern forming step in step SP12 is that a metal wall surface is formed in the through hole and the first surface SF1 of the circuit board 200 is formed. This is to ensure electrical continuity between the first surface SF2 and the second surface SF2.

  The reason why the metal pattern is formed in step SP12 before the outer shape forming step in step SP13 is to realize the metal pattern formation in step SP12 by electroplating.

  That is, in order to form a metal pattern by electroplating, it is necessary to connect wiring between a plurality of circuit boards 200 in the circuit board sheet 190 of FIG. For this reason, in step SP12 of FIG. 8, a metal pattern of the lead wire for electroplating is formed in a portion corresponding to the gap portion of H5 and H6 of FIG. The lead wires for electroplating are connected to the electroplating connection lines indicated by E1, E2 and the like of the circuit board 200 in FIG. 3, so that a metal pattern of terminals and wiring by electroplating is formed on the circuit board 200. It becomes possible to form. Then, the lead wire for electroplating is removed together with the gap portion when the gap portion is cut out in the outer shape forming step of step SP13 in FIG.

  The reason why the storage device 203 and the circuit element 210 are mounted in step SP14 before the single product separation step in step SP15 is that the large number of storage devices 203 and circuit elements 210 are mounted together in the state of the circuit board sheet 190. This is because it is more efficient. That is, if the storage device 203 and the circuit element 210 are individually mounted on the circuit board 200 after being separated separately, the mounting efficiency is low and the mounting accuracy is also low. On the other hand, if mounting is performed in the state of the circuit board sheet 190, a large number of storage devices 203 and circuit elements 210 can be mounted on the circuit board 200 on the circuit board sheet 190 with high mounting efficiency and high accuracy. It becomes possible to implement.

  And in this embodiment, as shown to step SP15 of FIG. 8, the single-piece separation of the circuit board 200 is performed at the last process. For example, the manufacturer of the printing material container separates the circuit board 200 by cutting the parts shown in H3 and H4 in FIG. 7 of the circuit board sheet 190 delivered from the circuit board sheet supplier. Attach to the printing material container to complete the production of the printing material container. In this case, the circuit board 200 according to the first embodiment can be separated only by the cutting process of H3 and H4 in FIG. 7, so that the process work of the printing material container can be simplified and the cost of the product can be reduced.

  Further, in the circuit board 200 of the present embodiment, as shown in FIG. 3, the number of terminals (M = 4) of the first terminal group TA1 along the line A1 is equal to the second terminal group TA2 along the line A2. Less than the number of terminals (N = 5). That is, when the printing material container 100 to which the circuit board 200 is attached is mounted in the mounting direction DIS of FIG. 3, the connector terminal on the printing apparatus main body side passes from the lower side to the upper side of FIG. It contacts each terminal of the first and second terminal groups TA1, TA2. Therefore, as shown in FIG. 3, the terminals of the first and second terminal groups TA1, TA2 are arranged in a staggered pattern, and the number of terminals of the upper first terminal group TA1 is reduced. .

  In this embodiment, as shown in FIG. 4, the circuit element 210 is disposed closer to the second side SD2 than the first side SD1. Thereby, it is possible to secure a space for wiring a connection line LC that connects a first terminal CO1 and a second terminal CO2, which will be described later. In other words, by arranging the connection line LC of the first and second terminals CO1 and CO2 on the first surface SF1, an empty space is generated on the second surface SF2, and the circuit element is utilized by utilizing the space. 210 can be implemented.

  Here, as shown in FIG. 3, the second terminal group TA2 includes, as at least one detection terminal, a first detection terminal DT1 connected to the circuit element 210 and a second detection terminal DT2. The first detection terminal DT1 is a terminal provided on the third side SD3 side among the N terminals (N = 5) of the second terminal group TA2. That is, it is a terminal provided at a position closest to the third side SD3 (left end side). On the other hand, the second detection terminal DT2 is a terminal provided on the fourth side SD4 side among the N terminals of the second terminal group TA2. That is, it is a terminal provided at a position (right end side) closest to the fourth side SD4. The other terminals VDD, VSS, SDA of the second terminal group TA2 are provided between the first and second detection terminals DT1, DT2.

  As shown in FIG. 4, the second surface SF <b> 2 of the circuit board 200 has a first connection line LD <b> 1 having one end connected to one end of the circuit element 210, and one end connected to the other end of the circuit element 210. The second connection line LD2 connected to is wired. The other end of the first connection line LD1 is connected to the first detection terminal DT1 of the first surface SF1 through the first through hole TC1 of the circuit board 200 as shown in FIG. On the other hand, the other end of the second connection line LD2 is connected to the second detection terminal DT2 of the first surface SF1 through the second through hole TC2 of the circuit board 200.

  In this way, the first detection terminal DT1 electrically connected to one end of the circuit element 210 is disposed on the third side SD3 side, and is electrically connected to the other end of the circuit element 210. The second detection terminal DT2 can be disposed on the fourth side SD4 side. That is, when the circuit element 210 is arranged on the second side SD2 side, which is a position far from the cut planes CSFA and CSFB, the first and second detection terminals DT1 and DT1 connected to both ends of the circuit element 210 are arranged. DT2 is provided on the first surface SF1 side as a terminal of the second terminal group TA2, and can be connected to the connector terminal on the printing apparatus main body side.

  Here, the circuit element 210 is, for example, a resistance element. The first and second detection terminals DT1 and DT2 are mounting detection terminals, and are used to detect whether or not the printing material container 100 is correctly mounted on the container mounting portion 1100.

  In this way, the printing apparatus main body side (voltage application unit) applies the mounting detection voltage to the first and second detection terminals DT1 and DT2, and the current flowing through the resistance element which is the circuit element 210 is generated. By detecting, mounting detection (individual mounting detection) of the printing material container 100 can be realized. In other words, the mounting detection of the printing material container 100 can be realized by the first and second detection terminals DT1 and DT2.

  Further, as shown in FIG. 3, the first terminal group TA1 has a first terminal CO1 and a second terminal CO2. The first terminal CO1 and the second terminal CO2 are connected via a connection line LC. That is, on the first surface SF1 of the circuit board 200, the first and second terminals CO1 and CO2 are short-circuited by the connection line LC.

  By providing such first and second terminals CO1 and CO2, it is possible to detect a short circuit with other terminals, detect the mounting of the printing material container 100 (cartridge out detection), and the like. Become.

  Here, the connection line LC is wired from the first terminal CO1 through the first detection terminal DT1 and the terminal VDD adjacent to DT1, and further adjacent to the second detection terminals DT2 and DT2. Between the first terminal SDA and the second terminal CO2.

  In this case, when the first and second detection terminals DT1 and DT2 are provided as the terminals at both ends of the second terminal group TA2, the first and second terminals as the terminals at the both ends of the first terminal group TA1. The second terminals CO1 and CO2 are provided, and the first and second terminals CO1 and CO2 can be efficiently connected by the connection line LC.

  Further, in the present embodiment, as shown by F1 in FIG. 3, the connection line LC of the first and second terminals CO1 and CO2 is bypassed with the fixing opening HL interposed therebetween. Specifically, the connection line LC includes a main connection line LM1 and a bypass connection line LB1. The main connection line LM1 is wired from the first terminal CO1 to the second terminal CO2 through the second side SD2 of the circuit board 200 and the fixing opening HL. On the other hand, one end and the other end of the bypass connection line LB1 are connected to the main connection line LM1, and are wired between the second terminal group TA2 and the fixing opening HL. Specifically, the bypass connection line LB1 is wired so as to surround the fixing opening HL.

  As described above, the first detection terminal DT1 is connected to one end of the circuit element 210 via the first through hole TC1 and the first connection line LD1, as shown in FIG. The detection terminal DT2 is connected to the other end of the circuit element 210 via the second through hole TC2 and the second connection line LD2.

  In this case, as indicated by F2, the second connection line LD2 is bypass-wired across the fixing opening HL on the second surface SF2 of the circuit board 200. Specifically, the second connection line LD2 includes a main connection line LM2 and a bypass connection line LB2. The main connection line LM2 is wired from the second through hole TC2 to the other end of the circuit element 210 through the second side SD2 of the circuit board 200 and the fixing opening HL. On the other hand, one end and the other end of the bypass connection line LB2 are connected to the main connection line LM2, and pass between the position corresponding to the second terminal group TA2 (line A2 ′ or A3 ′) and the fixing opening HL. Wired. Specifically, the bypass connection line LB2 is routed so as to surround the fixing opening HL.

  Further, as shown in FIG. 3, identification patterns G1 and G2 of the circuit board 200 are formed by connection lines LC connecting the first and second terminals CO1 and CO2. This identification pattern is, for example, at least one pattern of letters, numbers, and patterns. This identification pattern indicates various information such as manufacturing information (manufacturer, manufacturing number) of the circuit board 200.

  That is, the connection line LC connects the first and second terminals CO1 and CO2, and is wired using an empty area below (in the second direction DR2) the second terminal group TA2. The Specifically, the main connection line LM1 of the connection line LC is wired in an empty area below the line A3 in FIG. Further, as shown in FIG. 4, the circuit element 210 is arranged on the second side SD <b> 2 side of the circuit board 200. That is, the circuit element 210 is disposed below the line A3 'corresponding to the line A3. For this reason, as shown in FIG. 3, a relatively free space can be secured below the line A3.

  Therefore, in G1 and G2 in FIG. 3, the vacant space is effectively used to form the identification pattern of the circuit board 200 by the connection line LC between the first and second terminals CO1 and CO2. By doing so, the circuit board 200 can be identified by the identification pattern of the connection line LC while maintaining efficient layout wiring.

<Detailed configuration of circuit board>
Next, details of the circuit board 200 in the present embodiment will be described. As described above, a circuit board using a halogen-free base material is more fragile than a conventional glass epoxy board, and therefore, in the cutting process during manufacturing, damage to circuit board components (terminals, wiring or circuit elements) In addition, there is a concern about the influence such as a decrease in reliability due to cutting stress. Therefore, in the circuit board 200, as described above, the circuit element 210 and the first and second terminals CO1 and CO2 are moved away from the outer peripheral edge to reduce the influence of breakage and reduced reliability. Then, further ingenuity was necessary. Specifically, there is a possibility that the cutting waste of the base material generated in the cutting process may fall into the printing apparatus during operation of the printing apparatus and affect the reliability of the printing apparatus. In view of this point, the circuit board 200 incorporates further ideas in order to reduce the generation of cutting waste. Specifically, terminals and solid wiring are provided for reinforcement in a substantially frame shape along the outer shape (outer peripheral edge) of the circuit board 200. Note that the solid wiring (solid pattern) refers to a wiring wider than a normal wiring width necessary for ensuring electrical characteristics. For example, a circuit board having a wiring width of 0.15 mm is a wiring having a pattern width of 0.30 mm or more. Specifically, the normal wiring width is the width of the wiring J drawn from the storage device 203 (integrated circuit) on the second surface SF2, as shown in FIG. For the solid wiring, a wiring other than the dummy pattern, which has a stable potential connected to the power supply terminal, or a wiring that forms a circuit is used.

  First, a detailed configuration of the first surface SF1 will be described with reference to FIG. On the first surface SF1 of the circuit board 200, as shown in FIG. 3, terminals and wirings are installed over substantially the entire circumference of a substantially rectangular shape.

  In the second side SD2, the main connection line LM1 between the first and second terminals CO1 and CO2 is wired along the entire area of the second side SD2. The wiring width of the main connection line LM1 is about 0.5 mm. In addition, one end of the main connection line LM1 is extended to the intersection position (corner R portion) between the second side SD2 and the third side SD3. On the other hand, the other end of the main connection line LM1 is extended to the intersection position between the second side SD2 and the fourth side SD4 as described above.

  Next, on the third side SD3, the first detection terminal DT1 and the wiring SH1 are installed along almost the entire area of the third side SD3. Here, the first detection terminal DT1 is arranged (wired) in the long side direction along the third side SD3. Further, a through hole TC3 is provided in the vicinity of the intersection position of the third side SD3 and the first side SD1, and the wiring SH1 is connected to the wiring of the second surface SF2 through the through hole TC3. Yes. Then, the wiring SH1 starts from the vicinity of the end of the first detection terminal DT1 on the direction DR4 side, includes the cut surface CSFA, and from the intersection position (C surface) between the third side SD3 and the first side SD1. Further, the region up to a part of the first side SD1 is installed along the third side SD3. The wiring width of the wiring SH1 is about 0.5 mm.

  Here, if a straight line that passes through the center of the fixing opening HL and bisects the circuit board 200 in the third direction DR3 is a center line CL, the fourth side SD4 has the third side SD3. With respect to the arrangement, the second detection terminal DT2 and the wiring SH2 are installed over substantially the entire area of the fourth side SD4 substantially symmetrically with respect to the center line CL. That is, the second detection terminal DT2 is arranged (wired) in the long side direction along the fourth side SD4. Further, a through hole TC4 is provided in the vicinity of the intersection position of the fourth side SD4 and the first side SD1, and the wiring SH2 is connected to the wiring of the second surface SF2 through the through hole TC4. ing. Then, the wiring SH2 starts from the vicinity of the end side on the direction DR4 side of the second detection terminal DT2, includes the cut surface CSFB, and from the intersection position (C surface) between the fourth side SD4 and the first side SD1. The region up to a part of the first side SD1 is installed along the fourth side SD4. Also, the wiring width of the wiring SH2 is about 0.5 mm, similar to the wiring SH1.

  Furthermore, over almost the entire area of the first side SD1, a part of the wirings SH1 and SH2, the wiring of the terminal VSS, and the wiring that surrounds the through holes TC5, TC6, and TC7 connected to the second surface SF2, It is installed in a stepping stone shape. Here, the through hole TC5 is a through hole for connecting the terminal RST to the second surface SF2, and the wiring surrounding the through hole TC5 is a wiring extending from the terminal RST and surrounding the through hole TC5. Is enclosed and connected. The same applies to the through hole TC6 and the terminal VSS, the through hole TC7 and the terminal SCK. Specifically, from the crossing position of the first side SD1 and the third side SD3 toward the direction DR1, the wiring SH1, the electroplating connection line E1 (lead wire) of the terminal VDD, and the wiring surrounding the through hole TC5, A wiring connected from the terminal VSS to the through hole TC6, a wiring surrounding the through hole TC6, a wiring surrounding the through hole TC7, and a wiring SH2 are provided along the first side SD1. That is, as described above, the solid pattern is formed in a substantially frame shape by the terminals and the wirings along the outer peripheral edge of the first surface SF1.

  Here, as a preferred example, the distance g between the second side SD2 of the circuit board 200 and the main connection line LM1 is 0.2 mm. A preferable range of the distance g is 0.05 mm or more and 0.40 mm or less, more preferably 0.10 mm or more and 0.35 mm or less, and further preferably 0.15 mm or more and 0.30 mm or less. This is based on the experimental results of the inventors. By setting the distance g within the above range, the main connection line LM1 is not applied to the outer shape and is not too far apart even when variations in the circuit board manufacturing process are taken into account. Therefore, generation | occurrence | production of a cutting scrap and a metal scrap can be reduced. Also, for the first side SD1, the third side SD3, and the fourth side SD4, which are sides other than the second side SD2, the solid pattern and the distance between the terminal and the outer shape are the same as the above ( Is set).

  Next, a detailed configuration of the second surface SF2 will be described with reference to FIG. On the second surface SF2 of the circuit board 200, as shown in FIG. 5, wirings are installed over substantially the entire circumference of a substantially rectangular outer shape. In other words, a solid pattern is formed along the outer peripheral edge.

  On the second side SD2, wiring extending in the direction DR1 and the direction DR3 from the main connection line LM2 is installed along the entire area of the second side SD2. Further, the above-described wiring extending from the main connection line LM2 is installed to extend along the third side SD3 and the fourth side SD4 to a position exceeding the line A2 ″ in the direction DR4.

  Next, on the first side SD1, a wiring that surrounds and connects the through hole TC6 that is connected to the terminal VSS of the first surface SF1 is provided over the entire area. Specifically, it extends from the solid pattern at the mounting position of the storage device 203 at the center of the circuit board to the outer periphery. Further, the wiring that surrounds and connects the through hole TC6 is also connected to the wiring SH1 of the first surface SF1 through the through hole TC3. Similarly, the wiring SH2 of the first surface SF1 is also connected through the through hole TC4. Furthermore, one end of the wiring is extended in the direction DR2 along the third side SD3 and wired to the vicinity of the end of the main connection line LM2 on the third side SD3. Similarly, the other end of the wiring extends in the direction DR2 along the fourth side SD4 and is wired to the vicinity of the end of the main connection line LM2 on the fourth side SD4.

  Also in the second surface SF2, the solid pattern and the distance between the terminal and the outer shape are designed (set) in the same manner as in the first surface SF1.

As described above, according to the circuit board 200 of the present embodiment, the following effects can be obtained.
The circuit board 200 according to the present embodiment is provided with terminals and wirings along almost the entire sides (outer peripheral edges) of the first surface SF1 and the second surface SF2. These substantially frame-shaped solid patterns can reinforce the cut portions of the circuit board and reduce cracks and cutting debris in the cutting process (press process) during manufacturing. That is, it has an effect of supplementing the toughness of the halogen-free substrate. Therefore, according to the present embodiment, it is possible to provide a circuit board made of a halogen-free base material that reduces the generation of cracks and cutting waste and secures sufficient reliability. Further, according to the present embodiment, it is possible to reduce the size, and the metal scrap generated at the time of manufacturing can be equal to or less than that of the conventional glass epoxy substrate.

  Further, by optimizing the layout of the terminals and the circuit elements and separating the circuit elements from the outer peripheral edge, the circuit elements are prevented from being damaged or malfunctioned during the cutting process. In addition, the solid pattern is a power line connected to the terminal VSS, which is a ground terminal, a connection line between the terminals, and the like, and since the potential is stable, electrical reliability including EMC (Electro Magnetic Compatibility) is included. More improved. Further, since the solid pattern is not a dummy pattern, the circuit board space can be used effectively.

  In the present embodiment, the configuration in which the solid pattern is provided on both the front and back surfaces as a suitable example has been described. Specifically, the outer peripheral edge portion can be reinforced by the solid pattern having a substantially frame shape even in the single-sided arrangement. In particular, by installing the solid pattern on the surface (stripping plate contact surface) where the mold (punch) first hits during the cutting process, the generation of cracks and cutting waste can be suppressed. In addition, if the solid pattern is arranged on both sides, the press workability in the manufacturing process can be further improved.

  Furthermore, since through holes are formed at the four corners of the circuit board 200, the through holes forming the cylindrical metal plating layer reinforce through the thickness direction of the board in a grommet shape. (Rigidity) is improved, and pattern breakage caused by impact or stress can be suppressed.

(Embodiment 2)
FIG. 9 is a configuration diagram (plan view) of the circuit board 300 according to the second embodiment, as viewed from the first surface SF1 side (surface side). Hereinafter, a detailed configuration of the circuit board 300 according to the present embodiment will be described. In addition, about this embodiment, the same code | symbol is used for the component same as Embodiment 1, and the overlapping description is abbreviate | omitted.

  On the first surface SF <b> 1 of the circuit board 300, the first and second terminals CO <b> 3 and CO <b> 4 whose terminal area is enlarged constitute a part of a substantially frame-shaped terminal and a solid pattern. In other words, the first and second terminals CO3 and CO4 are enlarged to the adjacent outer peripheral edge to replace the solid reinforcing pattern, which is different from the first embodiment. Other configurations are the same as those of the circuit board 200 of the first embodiment. Therefore, in the circuit board 300, the through-holes TC3 and TC4 and the wirings SH1 and SH2 of the first embodiment are not provided, and the substantially frame-like reinforcement of the first surface SF1 is configured.

  Here, the number M of terminals in the first terminal group TA1 and the number N of terminals in the second terminal group TA2 satisfy the formula M <N, and both are arranged in a staggered manner as described above. Accordingly, if all the terminals in the first surface SF1 have the same length along the first direction DR1 and the distances between the terminals are substantially the same, the first terminal group TA1 has the second terminal group TA1. Compared with the terminal group TA2, it is arranged away from the third side SD3 and the fourth side SD4 and closer to the center.

  On the other hand, in the circuit board 300 according to the present embodiment, the first terminal CO3 closest to the third side SD3 and the second terminal CO4 closest to the fourth side SD4 in the first terminal group TA1 are provided. , Enlarge the terminal area and install along the outer periphery. Specifically, the lengths of the terminals along the first direction DR1 and the fourth direction DR4 of the first terminal CO3 and the second terminal CO4 are larger than those of the other terminals. Thus, the first terminal CO3 and the second terminal CO4 are close to each side of the adjacent circuit board 300. That is, the first terminal CO3 is along the third side SD3 and the first side SD1, and similarly, the second terminal CO4 is arranged along the fourth side SD4 and the first side SD1. The

  Note that the first terminal CO3 and the second terminal CO4 whose terminal area is enlarged do not have to be exposed on the entire metal surface of the terminal. As shown in FIG. 9, a resist layer is formed on the surface except for a portion (dotted line section) having substantially the same shape as the other terminals in the first surface SF1. Also, a part or all of the substantially frame-shaped solid pattern can be similarly covered with a resist layer. By covering with a resist layer, the cost can be reduced and the surface can be protected.

As described above, according to the circuit board 300 of this embodiment, the following effects can be obtained.
The circuit board 300 according to the present embodiment is provided with terminals and wirings along almost the entire sides (outer peripheral edges) of the first surface SF1 and the second surface SF2. These substantially frame-shaped solid patterns can reinforce the cut portions of the circuit board and reduce cracks and cutting debris in the cutting process (press process) during manufacturing. That is, it has an effect of supplementing the toughness of the halogen-free substrate. Therefore, it is possible to provide the circuit board 300 made of a halogen-free base material that reduces the generation of cracks and cutting waste and ensures sufficient reliability.

  Further, by optimizing the layout of the terminals and the circuit elements and separating the circuit elements from the outer peripheral edge, the circuit elements are prevented from being damaged or malfunctioned during the cutting process. In addition, the solid pattern is a terminal and a connection line between the terminals, and the electric potential is stable, so that electrical reliability including EMC (Electro Magnetic Compatibility) is further improved. Further, since the solid pattern is not a dummy pattern, the circuit board space can be used effectively.

  Furthermore, according to the circuit board 300 in the present embodiment, as described above, in addition to the same effects as in the first embodiment, two through holes are omitted from the first embodiment. The number can be reduced.

  The present invention is not limited to the above-described embodiment, and various changes and improvements can be added to the above-described embodiment. A modification is described below.

(Modification 1)
Hereinafter, a circuit board 400 (not shown) according to Modification 1 will be described. Note that the same reference numerals are used for the same components as those in the first embodiment, and redundant descriptions are omitted.
In the first embodiment, the description has been given using the two-layer substrate (double-sided substrate) having the conductive layers (conductor surfaces) on the front and back surfaces. However, the characteristic configuration of the present application is applied to a multilayer substrate having three or more conductive layers. You may do it. For example, the circuit board 400 according to this modification is a four-layer board having two conductive layers as an intermediate layer inside the board in the thickness direction in addition to the two front and back surfaces. The two intermediate layers include wirings connected to the first surface SF1 or the second surface SF2 by through holes. In particular, the wirings connected to the through holes TC3 and TC4 are arranged in a solid shape along the entire outer peripheral edge of each of the two intermediate layers. In the circuit board 400, as in the first embodiment, the wiring and the terminals are arranged in a solid shape along the outer peripheral edge of the first surface SF1 and the second surface SF2. It should be noted that the above-described reinforcing effect can be obtained if a solid pattern is formed on one or more layers without being limited to the formation of a substantially frame-shaped solid pattern on all the layers of the multilayer substrate.
As described above, according to the circuit board 400 according to this modification, in addition to the effects of the first embodiment, the following effects can be obtained.
In the case of a small circuit board made of a halogen-free base material as in Embodiment 1 above, even when the conductive layer is multilayered for the purpose of further increasing the wiring density, the generation of cracks and cutting chips is reduced, and sufficient A circuit board that ensures reliability can be provided. Specifically, even if the thickness of the circuit board increases due to the multilayering and the press stress of the cutting process increases, the circuit board is reinforced by the solid frame pattern along the outer peripheral edge of the intermediate layer and the surface layer, and cracks are generated. And cutting waste can be reduced.

(Modification 2)
FIG. 10 is a configuration diagram (perspective view) of the printing apparatus 2000 according to the second modification. In order to make the configuration easy to understand, the exterior and the like are omitted. Hereinafter, the printing apparatus 2000 according to this modification will be described. Note that the same reference numerals are used for the same components as those in the first embodiment, and redundant descriptions are omitted.
A printing apparatus 2000 according to the present modification includes a printing material container 2100, a container mounting unit 2200, and the like, and is a so-called on-carriage type ink jet printer. The on-carriage type is characterized in that the container mounting portion 2200 (carriage) and the print head 2110 are integrated. In this on-carriage type, since the container mounting portion 2200 mounted with the printing material container 2100 is supported by the shaft 2500 and performs printing while reciprocating, cutting waste compared to the off-carriage type (for example, Embodiment 1) is achieved. However, it was necessary to reduce cutting waste. Therefore, the circuit board 200 according to the first embodiment is attached to the printing material container 2100.
As described above, according to this modification, even when a circuit board made of a halogen-free base material is applied to an on-carriage type printing material container, the generation and diffusion of cutting scraps are reduced and sufficient. It is possible to provide a printing material container and a printing apparatus on which the circuit board is mounted while ensuring high reliability.

  DESCRIPTION OF SYMBOLS 100, 2100 ... Printing material container, 200, 300 ... Circuit board, 203 ... Memory | storage device, 210 ... Circuit element, 1000, 2000 ... Printing apparatus, TA1 ... 1st terminal group, TA2 ... 2nd terminal group, DT1 ... 1st detection terminal (mounting detection terminal), DT2 ... 2nd detection terminal (mounting detection terminal), CO1, CO3 ... 1st terminal, CO2, CO4 ... 2nd terminal, RST, SCK, VDD, VSS , SDA ... terminal (terminal for storage device), TC1 ... first through hole, TC2 ... second through hole, TC3 ... third through hole, TC4 ... fourth through hole, TC5 ... fifth through hole. , TC6 ... sixth through hole, TC7 ... seventh through hole, SH1, SH2 ... wiring, SD1 ... first side, SD2 ... second side, SD3 ... third side, SD4 ... fourth side , SF1 ... 1 surface, SF2 ... 2nd surface, DR1 ... 1st direction, DR2 ... 2nd direction, DR3 ... 3rd direction, DR4 ... 4th direction, LC ... connection line, LD1 ... 1st connection Line, LD2 ... second connection line, LM1, LM2 ... main connection line, LB1, LB2 ... bypass connection line.

Claims (9)

A circuit board attached to the printing material container,
The base material of the circuit board is a halogen-free base material,
A storage device for storing printing material information;
A plurality of storage device terminals connected to the storage device and at least one detection terminal, and connected to the terminal on the printing apparatus main body side when the printing material container is mounted on the printing apparatus main body. A terminal group, and
On the first surface of the circuit board, which is the connection surface side of the terminal on the printing apparatus main body side, the terminal group is disposed, and on the second surface which is the back surface of the first surface of the circuit board, The storage device is disposed;
When the direction orthogonal to the first direction is the second direction, and the side facing the first side of the circuit board is the second side, the terminal group is:
A first terminal group in which M terminals are arranged along the first direction on the second direction side of the first side of the circuit board;
A second terminal group in which N terminals (M and N are integers of 2 or more satisfying M <N) are arranged along the first direction on the second direction side of the first terminal group; Have
The second terminal group includes:
The at least one detection terminal has a first detection terminal and a second detection terminal,
When the side facing the third side of the circuit board is the fourth side,
The first detection terminal is a terminal provided on the third side of the N terminals of the second terminal group,
The second detection terminal is a terminal provided on the fourth side of the N terminals of the second terminal group,
The first terminal group includes a first terminal provided closest to the third side, and a second terminal provided closest to the fourth side.
Between the second terminal group of the circuit board, a wiring connecting the first terminal and the second terminal is disposed along the second side,
The second terminal group includes a terminal that is disposed between the first detection terminal and the second detection terminal and for supplying a reference potential to the storage device by the printing apparatus;
The terminal for the printing apparatus to supply a reference potential to the storage device between the third side and the first terminal and between the fourth side and the second terminal. A circuit board, wherein wiring is connected to the circuit board. In claim 1,
A wiring arranged along the second side and connecting the first terminal and the second terminal;
The wiring arranged between the third side and the first terminal, and between the fourth side and the second terminal,
A circuit board characterized in that it is wider than wiring drawn from the memory device. In claim 1 or claim 2,
A circuit element is arranged on the second surface of the circuit board between a position corresponding to the arrangement position of the second terminal group and the second side of the circuit board,
The second surface of the circuit board has a first connection line having one end connected to one end of the circuit element, and a second connection line having one end connected to the other end of the circuit element. Wired and
The other end of the first connection line is connected to the first detection terminal on the first surface via a first through hole of the circuit board,
The other end of the second connection line is connected to the second detection terminal of the first surface through a second through hole of the circuit board. In any one of Claims 1-3,
The circuit board according to claim 1, wherein an outer shape of the circuit board is substantially rectangular and through holes are formed at four corners. In claim 3,
The circuit element is a resistance element;
The circuit board, wherein the first detection terminal and the second detection terminal are mounting detection terminals for the printing material container. In claim 1,
The connection line connecting the first terminal and the second terminal passes from the first terminal to between the first detection terminal and a terminal adjacent to the first detection terminal. A circuit board, wherein the circuit board is wired, wired between the second detection terminal and a terminal adjacent to the second detection terminal, and connected to the second terminal.   A printing material container comprising the circuit board according to any one of claims 1 to 6.   A printing apparatus comprising the printing material container according to claim 7 and the printing apparatus main body. A circuit board attached to the printing material container,
The base material of the circuit board is a halogen-free base material,
A storage device for storing printing material information;
A plurality of storage device terminals connected to the storage device and at least one detection terminal, and connected to the terminal on the printing apparatus main body side when the printing material container is mounted on the printing apparatus main body. A terminal group, and
On the first surface of the circuit board, which is the connection surface side of the terminal on the printing apparatus main body side, the terminal group is disposed, and on the second surface which is the back surface of the first surface of the circuit board, The storage device is disposed;
When the direction orthogonal to the first direction is the second direction, and the side facing the first side of the circuit board is the second side, the terminal group is:
A first terminal group in which M terminals are arranged along the first direction on the second direction side of the first side of the circuit board;
A second terminal group in which N terminals (M and N are integers of 2 or more satisfying M <N) are arranged along the first direction on the second direction side of the first terminal group; Have
The second terminal group includes:
The at least one detection terminal has a first detection terminal and a second detection terminal,
When the side facing the third side of the circuit board is the fourth side,
The first detection terminal is a terminal provided on the third side of the N terminals of the second terminal group,
The second detection terminal is a terminal provided on the fourth side of the N terminals of the second terminal group,
Of the M terminals of the first terminal group, the first terminal provided closest to the third side and the second terminal provided closest to the fourth side are the first terminal The direction length is longer than the first detection terminal and the second detection terminal,
A circuit connecting the first terminal and the second terminal between the second terminal group of the circuit board and the second side is disposed along the second side. substrate.

Images