JP2016203320A5 - - Google Patents

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Publication number
JP2016203320A5
JP2016203320A5 JP2015089218A JP2015089218A JP2016203320A5 JP 2016203320 A5 JP2016203320 A5 JP 2016203320A5 JP 2015089218 A JP2015089218 A JP 2015089218A JP 2015089218 A JP2015089218 A JP 2015089218A JP 2016203320 A5 JP2016203320 A5 JP 2016203320A5
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JP
Japan
Prior art keywords
outer peripheral
peripheral surface
laser beam
present
spot diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015089218A
Other languages
Japanese (ja)
Other versions
JP2016203320A (en
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Publication date
Application filed filed Critical
Priority to JP2015089218A priority Critical patent/JP2016203320A/en
Priority claimed from JP2015089218A external-priority patent/JP2016203320A/en
Publication of JP2016203320A publication Critical patent/JP2016203320A/en
Publication of JP2016203320A5 publication Critical patent/JP2016203320A5/ja
Pending legal-status Critical Current

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Description

特許第3469117号明細書Patent No. 3469117 specification

Claims (1)

前記レーザビームは、前記メインローラの外周面上にて隣接した数条の溝が内在するスポット径を有することを特徴とする請求項１又２に記載のワイヤソー。 3. The wire saw according to claim 1, wherein the laser beam has a spot diameter in which several adjacent grooves are present on the outer peripheral surface of the main roller.
JP2015089218A 2015-04-24 2015-04-24 Wire saw Pending JP2016203320A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015089218A JP2016203320A (en) 2015-04-24 2015-04-24 Wire saw

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015089218A JP2016203320A (en) 2015-04-24 2015-04-24 Wire saw

Publications (2)

Publication Number Publication Date
JP2016203320A JP2016203320A (en) 2016-12-08
JP2016203320A5 true JP2016203320A5 (en) 2018-05-24

Family

ID=57486530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015089218A Pending JP2016203320A (en) 2015-04-24 2015-04-24 Wire saw

Country Status (1)

Country Link
JP (1) JP2016203320A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107901256B (en) * 2017-11-15 2020-01-17 山东大海新能源发展有限公司 Device and method for cutting polycrystalline silicon wafer by diamond wire

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0871911A (en) * 1994-09-01 1996-03-19 Tokyo Seimitsu Co Ltd Traverse device of wire saw
JP3032125B2 (en) * 1994-09-30 2000-04-10 株式会社日平トヤマ Wire saw equipment
JPH1015938A (en) * 1996-07-05 1998-01-20 Tokyo Seimitsu Co Ltd Wire saw
JP3469117B2 (en) * 1999-01-29 2003-11-25 株式会社日平トヤマ Guide roller alignment gauge and wire saw using the same
JP4871769B2 (en) * 2007-03-27 2012-02-08 株式会社フジクラ Roll material winding device

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