JP2016201237A - Light-emitting module and light-emitting device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting module preventing deterioration of appearance and capable of adjusting distribution of light radiated from a solid light-emitting element without using a lens, and a light-emitting device using the light-emitting module.SOLUTION: A light-emitting module 2 includes a substrate 21, an LED 22 and a support member. The substrate 21 has a flat mounting surface 210. The LED 22 is mounted on the mounting surface 210 of the substrate 21. The support member supports the LED 22 in a state of being inclined to the mounting surface 210 of the substrate 21.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a light emitting module and a light emitting device using the same, and more particularly to a light emitting module using a solid light emitting element as a light source and a light emitting device using the same.

  Conventionally, a shelf lamp (light emitting device) used for a merchandise display shelf has been provided (see, for example, Patent Document 1). The shelf lamp described in Patent Document 1 includes an LED substrate and a housing. The LED substrate is made of a long glass epoxy substrate, and a plurality of LED elements (solid light emitting elements) are mounted along the longitudinal direction of the substrate.

  The casing is formed in a rectangular parallelepiped shape by extruding an aluminum material. This housing has a front surface portion, a rear surface portion, a top plate, and a side plate, and the front surface portion is bent in the lower surface direction to form a lower surface portion. Further, the rear surface portion side of the lower surface portion is opened, and is an LED light emission opening portion.

  In addition, the housing has a light source housing portion surrounded by the LED placement portion, the light shielding portion, and the inner wall. The LED mounting portion is a face plate that is inclined so as to form a depression angle toward the rear side of the commodity display shelf. Thereby, among the light radiated from the LED element, the product display shelf with respect to the optical axis of the LED element, rather than the light distribution angle of the light emitted toward the front side of the product display shelf with respect to the optical axis of the LED element The light distribution angle of the light radiated to the back side becomes larger.

  Therefore, when this shelf downlight is used for a product display shelf, it can be illuminated to the back side of the product display shelf by the light emitted from the LED elements.

JP 2014-22135 A

  However, in the shelf lamp described in Patent Document 1 described above, since the LED placement portion on which the LED substrate is placed is inclined, the height dimension (vertical size) of the housing is higher than when the LED placement portion is not inclined. ) Is getting bigger. Therefore, when this shelf lamp is attached to the product display shelf, the amount of protrusion toward the shelf (the lower side) on which the product is placed becomes large, which may reduce the appearance.

  It is also possible to illuminate the back of the product display shelf by adjusting the light distribution of the light emitted from the LED element with the lens. In this case, the cost increases by the amount of the lens, and the thickness of the lens. There was a possibility that the luminous flux would decrease due to the reflection loss.

  The present invention has been made in view of the above problems, a light emitting module that makes it difficult to deteriorate the appearance and can adjust the light distribution of light emitted from a solid light emitting element without using a lens, and light emission using the light emitting module An object is to provide an apparatus.

  The light emitting module of the present invention includes a substrate having a flat mounting surface, a solid light emitting element mounted on the mounting surface, and a support member that supports the solid light emitting element in an inclined state with respect to the mounting surface. It is characterized by having.

  The light-emitting device of the present invention includes the above-described light-emitting module and a holding member that holds the light-emitting module.

  The light emitting device of the present invention holds the light emitting module between the light emitting module described above, a mounting member having a mounting surface on which the light emitting module is mounted, and the mounting surface of the mounting member, And a heat dissipating member that dissipates heat generated in the light emitting module.

  The light emitting module of the present invention makes it difficult to reduce the appearance, and can adjust the light distribution of light emitted from the solid light emitting element without using a lens.

  The light emitting device of the present invention makes it difficult to reduce the appearance and can adjust the light distribution of light emitted from the solid light emitting element without using a lens.

1A is a front view of a light emitting device according to Embodiment 1 of the present invention, and FIG. 1B is a right side view of the light emitting device according to Embodiment 1 of the present invention. It is sectional drawing of the case and light emitting module which are used for the light-emitting device which concerns on Embodiment 1 of this invention. It is a perspective view of the end cap used for the light-emitting device concerning Embodiment 1 of the present invention. 4A is a front view of an end cap used in the light emitting device according to Embodiment 1 of the present invention, FIG. 4B is a right side view, FIG. 4C is a rear view, and FIG. 4D is a plan view. 5A is a cross-sectional view of a state in which the light-emitting device according to Embodiment 1 of the present invention is attached to an attachment member, and FIG. 5B is a cross-sectional view of a state in which the light-emitting device of a comparative example is attached to the attachment member. It is a front view of the refrigerated showcase in which the light-emitting device which concerns on Embodiment 1 of this invention is used. FIG. 7A is a plan view showing the main part of the light emitting module according to Embodiment 1 of the present invention, and FIG. 7B is a side view. 8A is a front view of an LED used in the light emitting module according to Embodiment 1 of the present invention, FIG. 8B is a plan view showing the relationship between lands formed on the mounting surface of the substrate and solder portions, and FIG. 8C is the mounting of the substrate. It is another top view which shows the relationship between the land and solder part which are formed in a surface. It is a side view which shows the principal part of the light emitting module which concerns on Embodiment 1 of this invention. 10A to 10C are side views showing the main part of the light emitting module according to Embodiment 1 of the present invention. 11A is a front view of an LED used in the light emitting module according to Embodiment 1 of the present invention, FIG. 11B is a perspective view of a holder used in the light emitting module according to Embodiment 1 of the present invention, and FIG. 11C is an embodiment of the present invention. 2 is a side view showing the main part of the light emitting module according to FIG. 12A is a perspective view of a light emitting device according to Embodiment 2 of the present invention, and FIG. 12B is a partially enlarged view thereof. 13A is a side view schematically showing an example of use of the light emitting device according to Embodiment 2 of the present invention, FIG. 13B is a detailed view of an X portion, and FIG. 13C is a detailed view of a Y portion.

(Embodiment 1)
Hereinafter, the light emitting module 2 and the light emitting device 1 according to Embodiment 1 of the present invention will be specifically described with reference to the drawings. However, the configuration described below is merely an example of the present invention, and the present invention is not limited to the following embodiment. Therefore, various modifications other than this embodiment can be made according to the design and the like as long as they do not depart from the technical idea of the present invention.

  As shown in FIGS. 1A and 2, the light emitting device 1 of the present embodiment includes a light emitting module 2 and a holding member.

  As shown in FIG. 2, the light emitting module 2 includes a substrate 21 formed in a rectangular flat plate shape. A plurality of LEDs 22 (solid light emitting elements) are mounted on the mounting surface 210 (lower surface) of the substrate 21 along the longitudinal direction of the substrate 21 (direction perpendicular to the paper surface in FIG. 2).

  The LED 22 is, for example, a white LED (white light emitting diode) that emits white light. The LED 22 is, for example, a surface mounting chip (SMD chip) formed in a rectangular flat plate shape, and a first electrode 220 and a second electrode 221 are provided on the lower surface of the LED 22 (see FIG. 7B). Here, in the present embodiment, the first electrode 220 is the cathode of the LED 22, and the second electrode 221 is the anode of the LED 22.

  As shown in FIG. 1A, the holding member includes a case 3 and a pair of end caps 4.

  The case 3 is formed in a long cylindrical shape using a synthetic resin material having translucency such as polycarbonate resin. The light emitting module 2 is accommodated inside the case 3 (see FIG. 2). In the following description, the vertical and horizontal directions and the front and rear directions are defined in FIG. Specifically, the longitudinal direction of the case 3 (the direction perpendicular to the paper surface in FIG. 2) is the front-rear direction, the thickness direction of the substrate 21 is the up-down direction, and the short direction of the substrate 21 is the left-right direction.

  The case 3 has a lower wall portion 30, an upper wall portion 31, and a pair of side wall portions 32. The lower wall portion 30 is formed in a semi-cylindrical shape that protrudes downward. Fine irregularities 300 are formed on the inner peripheral surface (upper surface) of the lower wall portion 30 (see FIG. 2). Therefore, the light emitted from the light emitting module 2 is diffused by the unevenness 300 when passing through the lower wall portion 30.

  The pair of side wall portions 32 are formed integrally with the lower wall portion 30 so as to rise upward from both end portions in the left-right direction of the lower wall portion 30. In addition, a V-shaped hooking portion 321 that protrudes outward as viewed from the front-rear direction is formed at the top of each side wall portion 32 (see FIG. 2). Further, a support piece 320 for supporting the substrate 21 is integrally formed on each side wall 32.

  The support piece 320 is formed so as to protrude obliquely upward from a substantially central position in the vertical direction on the inner surface of the side wall portion 32. As shown in FIG. 2, the substrate 21 is supported by the support piece 320 so that the mounting surface 210 faces the lower wall portion 30 and both ends in the short direction are placed on the tip of the support piece 320. The

  The upper wall portion 31 has a long rectangular plate shape and is formed to be connected to the side wall portions 32 at both end portions in the left-right direction. A concave portion 310 that is recessed downward is formed in the center portion in the left-right direction of the upper wall portion 31 along the front-rear direction and over the entire length (see FIG. 1A). A pair of first protrusions 311 are formed on the upper surface of the upper wall portion 31 along the front-rear direction and over the entire length.

  These first protrusions 311 protrude upward from both ends of the recess 310 in the left-right direction (see FIG. 2). Furthermore, a pair of second protrusions 312 are formed on the lower surface of the upper wall portion 31 along the front-rear direction and over the entire length. These second protrusions 312 protrude downward from the vicinity of both ends in the left-right direction (see FIG. 2). The upper wall portion 31 is improved in bending strength in the up-down direction and the left-right direction by the pair of first protrusion 311 and second protrusion 312.

  As shown in FIG. 3, the end cap 4 is formed into a bottomed cylindrical shape by a flexible material such as silicone rubber. The end caps 4 are respectively attached to both ends of the case 3 in the front-rear direction (longitudinal direction) so as to seal the inside of the case 3 (see FIG. 1A). In the following description, the vertical and horizontal directions and the front and rear directions are defined in FIG.

  The end cap 4 includes an end lower wall portion 40, an end upper wall portion 41, a pair of end side wall portions 42, and an end bottom wall portion 43. The end lower wall portion 40 is formed in a semi-cylindrical shape protruding downward. The pair of end side wall portions 42 are formed integrally with the end lower wall portion 40 so as to rise upward from both end portions in the left-right direction of the end lower wall portion 40. However, the upper half of each end side wall portion 42 is formed in a V shape projecting outward as seen from the front-rear direction (see FIG. 4A).

  The end upper wall portion 41 is formed so as to be connected to each end side wall portion 42 at both end portions in the left-right direction. A concave portion 410 that is recessed downward is formed in the center portion in the left-right direction of the end upper wall portion 41 along the front-rear direction and over the entire length (see FIG. 3).

  A pair of third protrusions 411 are formed on the upper surface of the end upper wall portion 41 along the front-rear direction and over the entire length. These third protrusions 411 protrude upward from both ends of the recess 410 in the left-right direction (see FIG. 3). Further, on both the left and right sides of the concave portion 410 on the lower surface of the end upper wall portion 41, grooves 412 having the longitudinal direction as the longitudinal direction are provided.

  The end bottom wall 43 is formed so as to close one end (for example, the rear end) of a cylindrical space surrounded by the end lower wall 40, the end upper wall 41, and the end side wall 42 (see FIG. 4A). On the rear surface of the end bottom wall portion 43, a recess 430 is formed that is cruciform and recessed forward when viewed from the front-rear direction (see FIGS. 4B to 4D).

  A pair of protrusions 431 and protrusions 432 are formed on the inner bottom surface (front surface) of the end bottom wall portion 43 so as to protrude forward (see FIGS. 3 and 4A). Each protrusion 431 is formed in a rectangular parallelepiped shape as shown in FIG. 4A. Further, as shown in FIGS. 3 and 4A, the projecting piece 432 is formed in a shape that is rectangular when viewed in the vertical direction and is curved in an arc.

  The end bottom wall portion 43 is improved in bending strength in the front-rear direction, the up-down direction, and the left-right direction by the protruding piece 432. Of the two end caps 4, a pair of holes 433 through which the covered electric wires of the power cable 5 are inserted pass through the end bottom wall portion 43 of one end cap 4 (FIG. 4A and FIG. 4). 4C).

  The end cap 4 is attached to the case 3 so as to cover the end portion of the case 3 in the front-rear direction from the outside (see FIG. 1A). That is, the end lower wall portion 40 of the end cap 4 is in close contact with the outer surface of the lower wall portion 30 of the case 3, the end upper wall portion 41 of the end cap 4 is in close contact with the outer surface of the upper wall portion 31 of the case 3, The end side wall portion 42 of the end cap 4 is in close contact with the outer surface of the side wall portion 32 of the case 3. As a result, there is an advantage that water or the like hardly enters the case 3 from the gap between the end cap 4 and the end of the case 3.

  As shown in FIG. 1A, the power cable 5 includes two covered electric wires, a protective tube 50 that covers and protects the two covered electric wires, and a plug connector 51 provided at the ends of the two covered electric wires. Have. The protective tube 50 is configured by a cylindrical heat shrinkable tube. Plug connector 51 is detachably connected to a pair of receptacle connectors.

  The receptacle connector is provided at the tip of the output cable of the DC power supply device. The DC power supply device has a conventionally known switching power supply circuit, and converts an AC voltage (effective value 100 [V] or 200 [V]) supplied from the power system into a DC voltage of 24 [V], for example. Configured to output.

  The light emitting device 1 of the present embodiment is assembled by housing the light emitting module 2 in the case 3 and attaching the end caps 4 to both ends of the case 3. The conductors of the two covered wires of the power cable 5 are electrically connected to a terminal block mounted on the substrate 21 of the light emitting module 2. And the light-emitting device 1 of this embodiment light-emits (lights) the light emitting module 2 by supplying DC voltage and a direct current through the power cable 5 from a DC power supply device.

  Here, the light (light flux) emitted from the light emitting module 2 is diffused by the unevenness 300 of the lower wall portion 30 of the case 3. Therefore, the light emitting device 1 according to the present embodiment can improve the uniformity of the light (light flux) irradiated to the illumination space.

  The light-emitting device 1 of this embodiment is installed in arbitrary places using the attachment member 6, as shown to FIG. 5A. The attachment member 6 includes a fixed plate 60, a first spring piece 61, and a second spring piece 62.

  The fixed plate 60 is formed in a rectangular flat plate shape. A circular screw insertion hole passes through the center of the fixing plate 60. The first spring piece 61 is formed in a Z shape and is connected to one end of the fixed plate 60. The first spring piece 61 has a hooking recess 610 that is recessed outward. Similarly to the first spring piece 61, the second spring piece 62 includes a first hooking recess 620 that is recessed outward and a second hooking recess 621 that is also recessed outwardly, and the other end of the fixing plate 60. It is connected with.

  In the light emitting device 1, the hook portion 321 of one side wall portion 32 is hooked on the hook recess 610 of the first spring piece 61, and the hook portion 321 of the other side wall portion 32 is hooked on the first hook recess 620 of the second spring piece 62. It attaches to the attachment member 6 by this (refer FIG. 5A). As shown in FIG. 5A, the case 3 can avoid interference with the head 630 of the fixing screw 63 by the recess 310 provided in the upper wall portion 31.

  Here, it is preferable that the light-emitting device 1 of this embodiment is used for the refrigerated showcase 7 shown in FIG. The refrigerated showcase 7 is installed in a store such as a supermarket or a convenience store, and is configured to refrigerate while displaying products. The refrigerated showcase 7 has a display chamber 70 opened forward. In the display chamber 70, display shelves 71 for displaying commodities are provided in a plurality of stages (four stages in FIG. 6) at intervals in the vertical direction.

  The light emitting device 1 is attached to the front lower surface side of each stage display shelf 71 using a plurality of attachment members 6. In other words, the light emitting device 1 is installed so as to illuminate the products displayed on the display shelves 71 from the front and the upper side of the upper display shelves 71. In this way, by using the light emitting device 1 of the present embodiment for lighting the refrigerated showcase 7, the products displayed on the display shelf 71 can be illuminated uniformly.

  By the way, depending on the manner in which the products are displayed, it may be desired to illuminate the back side of the display shelf 71 of the refrigerated showcase 7. In this case, as shown in FIG. 5B, by attaching the light emitting device 1 to the attachment member 6 in an inclined state, the light distribution of the light emitted from the LEDs 22 can be changed, and the back side of the display shelf 71 is illuminated. be able to.

  However, in this case, the height dimension L2 becomes larger (L2> L1) than when the light emitting device 1 is not tilted (in the case shown in FIG. 5A). Therefore, when this light-emitting device 1 is used for the refrigerated showcase 7, the downward projecting amount increases, and as a result, the appearance may be deteriorated.

  In addition, the light distribution can be adjusted using a lens instead of tilting the light emitting device 1, but in this case, the cost is increased by the amount of the lens, and the luminous flux is reduced due to the thickness of the lens and reflection loss. There was a possibility.

  Therefore, in the light emitting device 1 of the present embodiment, the following configuration is adopted so that the light distribution can be adjusted while it is difficult to reduce the appearance.

  In the light emitting module 2 of the present embodiment, two resistors 23 are mounted side by side on the mounting surface 210 of the substrate 21 as shown in FIGS. 7A and 7B. These resistors 23 are preferably chip resistors whose resistance value is sufficiently smaller than the resistance value when the LED 22 is on. The LED 22 is mounted on the mounting surface 210 of the substrate 21 with its orientation adjusted so that the first electrode 220 is on the resistor 23 side and the second electrode 221 is on the opposite side of the resistor 23.

  At this time, the LED 22 is in a state where the first electrode 220 side rides on the resistor 23 and is inclined with respect to the mounting surface 210 of the substrate 21 (see FIG. 7B). The first electrode 220 is electrically connected to one end of each resistor 23 via the first solder portion 24. The second electrode 221 is electrically connected to a conductor (land) formed on the mounting surface 210 of the substrate 21 via the second solder portion 25.

  In this way, the light distribution of the light emitted from the LED 22 is adjusted by causing the one end side of the LED 22 to ride on the resistor 23 which is another electronic component and tilting it with respect to the mounting surface 210 of the substrate 21. Can do. In addition, as shown in FIG. 5B, the light emitting device 1 does not have to be tilted, so that the height dimension of the light emitting device 1 can be kept low, and as a result, the appearance can hardly be reduced.

  In addition, since a lens for controlling light distribution is not used, it is possible to suppress an increase in cost, and it is possible to suppress a decrease in light flux due to the thickness of the lens and reflection loss. Here, in this embodiment, a support member is comprised by the resistor 23 which is another electronic component.

  Moreover, you may utilize the 1st solder part 24 and the 2nd solder part 25 which electrically connect the board | substrate 21 and LED22 as a supporting member. Hereinafter, it demonstrates concretely, referring FIG. 8A-FIG.

  FIG. 8A is a front view of the LED 22, and in this embodiment, a surface mounting chip (SMD chip) formed in a rectangular flat plate shape is used. A first electrode 220 and a second electrode 221 are provided on the lower surface of the LED 22.

  FIG. 8B is a front view of the first conductor (land) 210 </ b> A and the second conductor (land) 210 </ b> B formed on the mounting surface 210 of the substrate 21. A first solder portion 24 having the same outer shape as the first conductor 210A is formed on the first conductor 210A by using a metal mask having the same opening shape as the outer shape of the first conductor 210A. Moreover, the 2nd solder part 25 smaller than the external shape of the 2nd conductor 210B is formed in the 2nd conductor 210B by using the metal mask which has an opening shape smaller than the external shape of the 2nd conductor 210B.

  Here, the height of the second solder portion 25 is increased by increasing the thickness of the metal mask used when forming the first solder portion 24 rather than the thickness of the metal mask used when forming the second solder portion 25. The height dimension of the first solder portion 24 can be made larger than the dimension. When the LED 22 is mounted on the mounting surface 210 of the substrate 21 through the first solder portion 24 and the second solder portion 25, the first solder portion 24 side is high, as shown in FIG. The solder portion 25 side is lowered, and the LED 22 is inclined.

  As described above, the LED 22 is inclined with respect to the mounting surface 210 of the substrate 21 only by adjusting the height dimensions of the first solder portion 24 and the second solder portion 25 that electrically connect the substrate 21 and the LED 22. Can do. Thereby, the light distribution of the light radiated | emitted from LED22 can be adjusted. In addition, as shown in FIG. 5B, the light emitting device 1 does not have to be tilted, so that the height dimension of the light emitting device 1 can be kept low, and as a result, the appearance can hardly be reduced.

  Moreover, since only the solder amount of the 1st solder part 24 and the 2nd solder part 25 is adjusted, the cheap SMD type LED22 generally used can be used, and cost reduction can be aimed at.

  In addition, the shape of the 1st solder part 24 and the 2nd solder part 25 is not restricted to the shape shown to FIG. 8B, The shape shown to FIG. 8C may be sufficient. In this case, the positional deviation of the LED 22 after reflow can be reduced by making the first solder portion 24 smaller than the first conductor 210A. In this case as well, the LED 22 can be inclined with respect to the mounting surface 210 of the substrate 21 by making the height dimension of the first solder part 24 higher than the height dimension of the second solder part 25. .

  Furthermore, a step portion may be formed on the mounting surface 210 of the substrate 21 and this step portion may be used as a support member. Hereinafter, it demonstrates concretely, referring FIG. 10A-FIG. 10C.

  In the example shown in FIG. 10A, an inclined portion 21C is formed between a thick portion 21A having a relatively large thickness and a thin portion 21B having a relatively small thickness. The LED 22 is mounted on the substrate 21 along the inclined portion 21C. Thereby, LED22 can be inclined with respect to the mounting surface 210 of the board | substrate 21, As a result, the light distribution of the light radiated | emitted from LED22 can be adjusted.

  In the example shown in FIG. 10B, a step portion 21D due to a thickness difference is formed between a thick portion 21A having a relatively large thickness and a thin portion 21B having a relatively small thickness. The LED 22 is mounted on the substrate 21 so as to straddle the thick portion 21A and the thin portion 21B. Thereby, LED22 can be inclined with respect to the mounting surface 210 of the board | substrate 21, As a result, the light distribution of the light radiated | emitted from LED22 can be adjusted.

  Furthermore, in the example shown in FIG. 10C, a semi-ellipsoidal recess 21 </ b> E is formed on the mounting surface 210 of the substrate 21. The LED 22 is mounted on the substrate 21 with one end side in contact with the opening edge of the recess 21E and the other end side in contact with the bottom surface of the recess 21E. Thereby, LED22 can be inclined with respect to the mounting surface 210 of the board | substrate 21, As a result, the light distribution of the light radiated | emitted from LED22 can be adjusted.

  As described above, the inclined portion 21C, the stepped portion 21D, and the recess 21E (stepped portion) are used as support members, and by adjusting the solder amounts of the first solder portion 24 and the second solder portion 25, it is generally used at a low cost. A simple SMD type LED 22 can be used. As a result, cost reduction can be achieved. Further, as shown in FIG. 5B, since the light emitting device 1 does not have to be tilted, the height dimension of the light emitting device 1 can be kept low, and as a result, the appearance can hardly be reduced.

  Further, instead of using another electronic component (resistor 23 in this embodiment) mounted on the mounting surface 210 of the substrate 21 as a support member, a dedicated support member may be used. Hereinafter, a specific description will be given with reference to FIGS. 11A to 11C.

  FIG. 11A is a perspective view of the LED 22, and in this embodiment, a surface mounting chip (SMD chip) formed in a rectangular flat plate shape is used. A first electrode 220 and a second electrode 221 are provided on the lower surface of the LED 22 (see FIG. 11C).

  FIG. 11B is a perspective view of the holder 26 which is a dedicated support member. The holder 26 is integrally formed of a synthetic resin material such as PBT (polybutylene terephthalate) resin with a pair of support portions 260 and a connection portion 261 that connects the pair of support portions 260.

  Each of the pair of support portions 260 is formed in a long rectangular parallelepiped shape, and a groove 2601 into which the edge of the LED 22 is inserted is formed along the longitudinal direction on the inner surfaces facing each other. These grooves 2601 are inclined obliquely so that the height position becomes higher from one end side (side into which the substrate 21 is inserted) in the longitudinal direction of the support portion 260 to the other end side. The holder 26 is formed by connecting a pair of support portions 260 with the groove 2601 sides facing each other by a connecting portion 261, and the shape viewed from the vertical direction is an H-shape.

  The LED 22 is supported by the holder 26 by inserting an edge into the groove 2601 of each support portion 260. And the board | substrate 21 and LED22 are electrically connected through the 1st solder part 24 and the 2nd solder part 25 by letting the LED22 pass through the reflow furnace with the holder 26 supported.

  At this time, the LED 22 is supported by the holder 26 so as to be inclined with respect to the mounting surface 210 of the substrate 21, whereby the light distribution of the light emitted from the LED 22 can be adjusted. Further, by using the holder 26 as a support member, the inclination angle of the LED 22 with respect to the mounting surface 210 of the substrate 21 can be increased as compared with the case where another electronic component having a predetermined height dimension is used as the support member. it can.

  Furthermore, as shown in FIG. 5B, since it is not necessary to incline the light-emitting device 1, the height dimension of the light-emitting device 1 can be kept low, and as a result, the appearance can be hardly reduced.

  In the present embodiment, the resistor 23 is described as an example of another electronic component that constitutes the support member. However, the other electronic component is not limited to the resistor 23, and the electronic component mounted on the mounting surface 210 of the substrate 21. Any parts are acceptable. In the present embodiment, the LED 22 is a solid light emitting element. However, the solid light emitting element is not limited to the LED 22, and may be, for example, an organic EL or a laser diode (LD). Furthermore, what is necessary is just to set suitably the direction which inclines LED22 according to the use environment etc. of the light-emitting device 1. FIG.

  As described above, the light emitting module 2 of the present embodiment includes the substrate 21, the solid light emitting element (LED 22), and the support member. The substrate 21 has a flat mounting surface 210. The solid light emitting element is mounted on the mounting surface 210 of the substrate 21. The support member supports the solid-state light emitting element in an inclined state with respect to the mounting surface 210 of the substrate 21.

  According to this configuration, the solid light-emitting element can be inclined with respect to the mounting surface 210 of the substrate 21 by using the support member, thereby distributing the light emitted from the solid light-emitting element without using a lens. Can be adjusted. Moreover, since the height dimension (vertical dimension) of a housing | casing does not become large like the case where the whole light emitting module 2 is inclined, it can also make it difficult to reduce appearance.

  Further, like the light emitting module 2 of the present embodiment, the support member is preferably one of other electronic components (for example, the resistor 23) mounted on the mounting surface 210 of the substrate 21.

  According to this configuration, it is possible to change the inclination angle of the solid state light emitting device simply by adjusting the position of another electronic component with respect to the mounting surface 210 of the substrate 21. In addition, the tilt angle of the solid state light emitting device can be changed by using an electronic component having a different thickness as the support member.

  Further, like the light emitting module 2 of the present embodiment, the solid light emitting element preferably includes the first electrode 220 and the second electrode 221. In this case, in the solid-state light emitting device, the first conductor 210 </ b> A formed on the mounting surface 210 of the substrate 21 and the first electrode 220 are electrically connected by the first solder portion 24. In the solid-state light emitting device, the second conductor 210 </ b> B formed on the mounting surface 210 of the substrate 21 and the second electrode 221 are electrically connected by the second solder portion 25. The support member includes a first solder part 24 and a second solder part 25. The first solder part 24 is formed so that the dimension in the direction orthogonal to the mounting surface 210 of the substrate 21 is larger than that of the second solder part 25.

  According to this configuration, the inclination angle of the solid state light emitting device can be changed only by changing the thickness of the metal mask between the first electrode and the second electrode of the solid state light emitting device.

  Further, as in the light emitting module 2 of the present embodiment, the support member is composed of stepped portions (inclined portion 21C, stepped portion 21D, recess 21E) formed on the mounting surface 210 of the substrate 21, and the difference in height of the stepped portion is reduced. It is preferable to tilt the solid-state light emitting device by using it.

  According to this configuration, when the solid-state light emitting element is tilted with respect to the mounting surface 210 of the substrate 21, other electronic components or dedicated members are unnecessary, and compared with a case where the tilt is performed by other electronic components or dedicated members. Cost reduction.

  Moreover, like the light emitting module 2 of this embodiment, it is preferable that a support member consists of an exclusive member (for example, holder 26) different from the other electronic components mounted in the mounting surface 210 of the board | substrate 21. FIG.

  According to this configuration, the inclination angle of the solid state light emitting element with respect to the mounting surface 210 of the substrate 21 can be increased as compared with a case where an electronic component whose height dimension is set in advance is used as the support member.

  The light emitting device 1 of the present embodiment includes a light emitting module 2 and a holding member (case 3 and end cap 4) that holds the light emitting module 2.

  According to this configuration, by using the light-emitting module 2 described above, it is difficult to reduce the appearance, and it is possible to adjust the light distribution of the light emitted from the solid light-emitting element without using a lens.

(Embodiment 2)
In the first embodiment described above, the light emitting device 1 used in the refrigerated showcase 7 has been described. However, the technical idea of the present invention may be applied to, for example, the light emitting device 8 that is mounted side by side on the ceiling surface. Hereinafter, it demonstrates concretely, referring FIG. 12A-FIG. In the following description, the vertical and horizontal directions and the front and rear directions are defined in FIG. 12A.

  The light-emitting device 8 of this embodiment is provided with the light-emitting module 2, the attachment member 9, and a pair of heat radiating members 10, as shown to FIG. 12A and 12B. The light emitting device 8 preferably further includes a cover 11 and a pair of end covers 12. The light emitting module 2 is the same as that of the first embodiment, and detailed description thereof is omitted here.

  The attachment member 9 is formed into a long and U-shape by bending a sheet metal, for example, and a bottom wall portion 91 formed in a rectangular flat plate shape that is long in the front-rear direction, and the left-right direction (width direction) of the bottom wall portion 91 And a pair of side wall portions 92 projecting upward from both end portions. Here, since the light emitting module 2 is mounted on the lower surface of the bottom wall portion 91, the mounting surface is configured by the lower surface of the bottom wall portion 91 in the present embodiment.

  Each of the pair of heat radiating members 10 is formed in a long and U shape by bending a sheet metal, for example, and is formed so as to extend outward from the opening edge. The lower surface of these heat radiating members 10 is painted white and has a function as a reflecting plate that reflects light emitted from the LEDs 22 of the light emitting module 2. Further, these heat radiating members 10 also have a function of radiating heat generated by the LEDs 22.

  And these heat radiating members 10 respectively sandwich the end in the left-right direction of the substrate 21 with the bottom wall portion 91 of the mounting member 6 at one end in the left-right direction (end near the substrate 21). The substrate 21 is held together with the mounting member 9. In addition, these heat radiating members 10 are attached to the attachment member 6 by suitable methods, such as a screw and welding, for example. Further, the attachment member 9 and the pair of heat radiating members 10 may be integrally formed.

  The cover 11 is formed in a long box shape whose upper surface is opened with a synthetic resin material having translucency such as polycarbonate. The lower surface (outgoing surface) of the cover 11 has a curved surface shape such that the amount of downward protrusion increases as it approaches the center from both ends in the width direction. Each of the pair of end covers 12 is formed in a semicircular shape with the same material as the cover 11.

  FIG. 13A is a schematic diagram showing a state in which the above-described light emitting device 8 is mounted side by side on the ceiling surface 100. In FIG. 13A, there is a gap between adjacent light emitting devices 8, and light emitted from the light emitting module 2 is difficult to reach the gap, so that the gap becomes dark.

  Therefore, in this embodiment, as shown in FIGS. 13B and 13C, the LED 22 arranged at the end portion on the adjacent light emitting device 8 side is lower on the adjacent light emitting device 8 side and higher on the opposite side to the adjacent light emitting device 8. It is made to incline with respect to the board | substrate 21. The method for inclining the LED 22 may be any method described in the first embodiment.

  Accordingly, the gap can be illuminated by light emitted from the LED 22 arranged at the end on the side of the adjacent light emitting device 8, and the gap that tends to be darker than the case where the LED 22 is not inclined with respect to the substrate 21. Can be brightened. As a result, it is possible to suppress a decrease in appearance due to the gap becoming dark.

  In addition, since a lens for controlling light distribution is not used, it is possible to suppress an increase in cost, and it is possible to suppress a decrease in light flux due to the thickness of the lens and reflection loss.

  Also in the present embodiment, the solid-state light emitting element is not limited to the LED 22, and may be, for example, an organic EL or a laser diode (LD).

  As described above, the light emitting device 8 of the present embodiment includes the light emitting module 2, the attachment member 9, and the heat radiating member 10. The attachment member 9 has a mounting surface (the lower surface of the bottom wall portion 91) on which the light emitting module 2 is mounted. The heat radiating member 10 holds the light emitting module 2 between the mounting surface of the mounting member 9 and radiates heat generated in the light emitting module 2.

  According to this configuration, by using the light-emitting module 2 described above, it is difficult to reduce the appearance, and it is possible to adjust the light distribution of the light emitted from the solid light-emitting element without using a lens.

  Further, like the light emitting device 8 of the present embodiment, the substrate 21 is formed in an elongated shape, and a plurality of solid light emitting elements are mounted along the longitudinal direction of the substrate 21, and a plurality of substrates are arranged in the longitudinal direction of the substrate 21. It is preferable. In this case, among the plurality of solid-state light emitting elements, the solid-state light emitting element disposed at the end in the longitudinal direction of the substrate 21 is inclined so that the side opposite to the end is higher than the end side. 210.

  According to this configuration, since the solid light emitting element disposed at the end portion of the substrate 21 is tilted so that the light emission direction is on the end side, the end is likely to be darker than when the solid light emitting element is not tilted. The club side can be brightened.

DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Light-emitting module 3 Case (holding member)
4 End cap (holding member)
8 Light Emitting Device 9 Mounting Member 10 Heat Dissipation Member 21 Substrate 21C Inclined Part (Stepped Part, Support Member)
21D Stepped part (stepped part, support member)
21E depression (step, support member)
22 LED (solid state light emitting device)
23 Resistor (support member)
24 1st solder part (support member)
25 Second solder part (support member)
26 Holder (support member)
91 Bottom wall (mounting surface)
210 Mounting surface 210A First conductor 210B Second conductor 220 First electrode 221 Second electrode

Claims (8)

  A substrate having a flat mounting surface, a solid light emitting element mounted on the mounting surface, and a support member that supports the solid light emitting element in an inclined state with respect to the mounting surface. Light emitting module.   The light emitting module according to claim 1, wherein the support member is one of other electronic components mounted on the mounting surface. The solid-state light emitting device has a first electrode and a second electrode, the first conductor formed on the mounting surface and the first electrode are electrically connected by a first solder part, and the mounting surface A second conductor formed on the second electrode and the second electrode are electrically connected by a second solder portion;
The support member includes the first solder portion and the second solder portion,
2. The light emitting module according to claim 1, wherein the first solder portion is formed to have a dimension in a direction orthogonal to the mounting surface larger than that of the second solder portion.   The light emitting module according to claim 1, wherein the support member is formed of a stepped portion formed on the mounting surface, and the solid light emitting element is inclined using a height difference of the stepped portion.   The light emitting module according to claim 1, wherein the support member is a dedicated member different from other electronic components mounted on the mounting surface.   A light emitting device comprising: the light emitting module according to claim 1; and a holding member that holds the light emitting module.   The light emitting module according to any one of claims 1 to 5, an attachment member having a placement surface on which the light emission module is placed, and a placement surface before the attachment member. A light-emitting device comprising: a heat-dissipating member that holds and dissipates heat generated in the light-emitting module. The substrate is formed in a long shape, a plurality of the solid light emitting elements are mounted along the longitudinal direction of the substrate, and a plurality of light emitting devices are arranged in the longitudinal direction of the substrate,
Among the plurality of solid-state light-emitting elements, the solid-state light-emitting element disposed at the end in the longitudinal direction of the substrate is mounted on the mounting surface in an inclined state so that the side opposite to the end is higher than the end side. The light-emitting device according to claim 6 or 7.

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