JP2012204187A - Lamp and lighting fixture - Google Patents

Lamp and lighting fixture Download PDF

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JP2012204187A
JP2012204187A JP2011068700A JP2011068700A JP2012204187A JP 2012204187 A JP2012204187 A JP 2012204187A JP 2011068700 A JP2011068700 A JP 2011068700A JP 2011068700 A JP2011068700 A JP 2011068700A JP 2012204187 A JP2012204187 A JP 2012204187A
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led
substrate
led lamp
module substrate
light
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Keijiro Tasaka
圭次郎 田坂
Masanao Hieda
正直 稗田
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Toshiba Lighting and Technology Corp
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Abstract

PROBLEM TO BE SOLVED: To provide an LED lamp and a lighting fixture capable of improving luminance at a rear face side of an LED mounting surface of a substrate.SOLUTION: The LED lamp includes: an LED module 5 having a translucent module substrate 5a and LEDs 6 mounted on both sides 5a2, 5a1 of this translucent module substrate; a translucent lamp cover 2 which accommodates the LED module and has supporting lines 2a, 2b for supporting the transparent module substrate; and a light controlling part 13 which is arranged on the lamp cover to face one surface or the other surface of the translucent module substrate and has translucency and light-reflecting property.

Description

本発明の実施形態はLEDランプおよび照明器具に関する。   Embodiments described herein relate generally to an LED lamp and a lighting fixture.

従来から、この種の直管状のLEDランプは知られている。例えば円管状のランプカバー内に、基板上に複数のLED(発光ダイオード)を実装してなるLEDモジュールを収容したLEDランプが知られている(例えば、特許文献1参照)。   Conventionally, this kind of straight tube type LED lamp is known. For example, an LED lamp in which an LED module in which a plurality of LEDs (light emitting diodes) are mounted on a substrate is accommodated in a circular lamp cover is known (for example, see Patent Document 1).

特開2010−123359号公報JP 2010-123359 A

しかしながら、この種のLEDランプでは、LEDモジュール基板のLED実装面に対し垂直方向の光束は多く明るいが、LED実装面の裏面側には殆ど光が回らず暗い。このために、このLEDランプを、天井等に取り付けられる照明器具に組み込み、点灯させた際には、LED実装面に対して垂直方向下方の室内は明るいが、LED実装面の裏側である天井側は暗くなるという課題が考えられる。   However, in this type of LED lamp, the luminous flux in the direction perpendicular to the LED mounting surface of the LED module substrate is large and bright, but the back surface side of the LED mounting surface hardly shines and is dark. For this reason, when this LED lamp is incorporated into a lighting fixture attached to a ceiling or the like and is lit, the room below the LED mounting surface in the vertical direction is bright, but the ceiling side which is the back side of the LED mounting surface The problem of becoming darker is considered.

本発明は、このような事情を考慮してなされたもので、基板のLED実装面の裏面側の明るさの向上を図ることができるLEDランプおよび照明器具を提供することにある。   The present invention has been made in view of such circumstances, and it is an object of the present invention to provide an LED lamp and a luminaire that can improve the brightness of the back side of the LED mounting surface of the substrate.

本実施形態によれば、透光性を有する基板およびこの基板の一面に実装されるLEDを有するLEDモジュールと;LEDモジュールを収容し、基板を支持する支持部を備えた透光性を有するカバーと;を具備している。   According to this embodiment, a light-transmitting substrate and an LED module having an LED mounted on one surface of the substrate; and a light-transmitting cover including a support portion that houses the LED module and supports the substrate And;

また、本実施形態によれば、基板の一面または他面に対向するようにカバーに配設されて透光性と光反射性を有する制光部と;を具備している。   In addition, according to the present embodiment, there is provided a light control portion that is disposed on the cover so as to face one surface or the other surface of the substrate and has translucency and light reflectivity.

本発明の第1の実施形態に係るLEDランプの分解斜視図を示す図3のI−I線断面図。The II sectional view taken on the line of FIG. 3 which shows the disassembled perspective view of the LED lamp which concerns on the 1st Embodiment of this invention. 本発明の第1の実施形態に係るLEDランプの一部切欠外観斜視図。1 is a partially cutaway perspective view of an LED lamp according to a first embodiment of the present invention. ランプカバーから給電用口金とアース用口金を取り外した状態の一部切欠分解斜視図。The partial notch disassembled perspective view of the state which removed the power supply base and the grounding base from the lamp cover. 図1,図3で示すLEDモジュールの一部切欠斜視図。FIG. 4 is a partially cutaway perspective view of the LED module shown in FIGS. 1 and 3. 図4の一部切欠V−V線断面図。FIG. 5 is a cross-sectional view taken along line VV in FIG. 4. 本発明の第2の実施形態に係る照明器具の正面図。The front view of the lighting fixture which concerns on the 2nd Embodiment of this invention.

以下、本発明の実施形態を図面に基づいて説明する。なお、複数の図面中、同一または相当部分には同一符号を付している。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same or an equivalent part in several drawing.

(第1の実施形態)
図2は本発明の第1の実施形態に係るLEDランプの一部切欠外観斜視図、図3は同,一部切欠分解斜視図である。
(First embodiment)
FIG. 2 is a partially cutaway external perspective view of the LED lamp according to the first embodiment of the present invention, and FIG. 3 is a partially cutaway exploded perspective view of the same.

これら図1〜図3に示すようにLEDランプ1は、例えば20W形や40W形等の直管形蛍光ランプ相当の明るさを有し、管径約25.5mm、長さは20W相当形が600mm、40W相当形が1200mmを有し、直状円管状の透光性を有するランプカバー2の軸方向開口両端部に、例えばJEL801で規定されるL形ピン口金GX16t−5の給電用口金3とアース用口金4をそれぞれ嵌合してシリコーン樹脂等の接着剤により固着している。   As shown in FIGS. 1 to 3, the LED lamp 1 has brightness equivalent to a straight tube fluorescent lamp such as a 20 W type or a 40 W type, and has a tube diameter of about 25.5 mm and a length equivalent to a 20 W type. A power supply cap 3 of an L-shaped pin cap GX16t-5 defined by, for example, JEL801, is provided at both ends of the axial opening of the lamp cover 2 having a straight circular tubular translucency having a shape equivalent to 600 mm and 40 W, and having a translucent shape. And the grounding cap 4 are respectively fitted and fixed with an adhesive such as silicone resin.

給電用口金3は、所要電圧の直流(DC)電力を後述する照明器具の給電用ソケット等から受電する口金であり、円管状のランプカバー2の軸方向開口一端部に外嵌される電気絶縁性を有する短軸の有底円筒体よりなる口金本体3aを有し、この口金本体3aの底部外面に、軸方向外方へほぼ平行に突出する導電性の左右一対のL形ピン3b,3bをそれぞれ並設している。口金本体3aの内底面には、軸方向内方へほぼ平行に突出する一対の給電用コネクタ3c,3cを突設している。これら給電用コネクタ3c,3cの内端は一対のL形ピン3b,3bの内端にそれぞれ電気的に接続されている。   The power supply base 3 is a base that receives direct current (DC) power of a required voltage from a power supply socket or the like of a lighting fixture, which will be described later, and is electrically insulated by being fitted on one end of the axial opening of the circular lamp cover 2. A pair of conductive left and right L-shaped pins 3b, 3b projecting substantially parallel outward in the axial direction on the outer surface of the bottom of the base body 3a. Are arranged side by side. On the inner bottom surface of the base body 3a, a pair of power feeding connectors 3c and 3c projecting substantially in parallel in the axial direction is provided. The inner ends of the power supply connectors 3c and 3c are electrically connected to the inner ends of the pair of L-shaped pins 3b and 3b, respectively.

アース用口金4は、ランプカバー2の軸方向開口他端部に外嵌される短軸有底円筒体よりなる口金本体4aを有し、その内面に、LEDモジュール5の軸方向他端を接触させる等により電気的に接続し、口金本体3aの外面のほぼ中央部には、外方に突出する導電性のアースピン4bを突設している。アースピン4bは、照明器具のアース用ソケット等に着脱可能に装着される。   The grounding cap 4 has a base body 4a made of a short-axis bottomed cylindrical body that is fitted on the other end of the lamp cover 2 in the axial direction, and the inner end of the LED module 5 is brought into contact with the inner surface thereof. Electrically connected by, for example, a conductive earth pin 4b projecting outward is provided in a substantially central portion of the outer surface of the base body 3a. The earth pin 4b is detachably attached to a grounding socket or the like of the lighting fixture.

図1,図3に示すようにランプカバー2は、透光性を有する例えばポリカーボネート等の合成樹脂やガラス等から形成され、その内部に、LEDモジュール5の幅方向両端部を、板厚方向で挟持するために内方へそれぞれ突出する図1,図3中、左右一対の角柱状の支持用突条2a,2bを一体に突設している。これら支持用突条2a,2bは、その突出内端部に、LEDモジュール5の透明モジュール基板5aの幅方向両端部を挿脱可能に挿入させる嵌合凹部2a1,2b1をそれぞれ形成している。   As shown in FIGS. 1 and 3, the lamp cover 2 is formed of a synthetic resin such as polycarbonate or glass having translucency, for example, and both end portions in the width direction of the LED module 5 are disposed in the thickness direction in the inside thereof. A pair of left and right prism-shaped supporting protrusions 2a and 2b projecting inward in FIG. 1 and FIG. 3 projecting inward for clamping. These supporting ridges 2a and 2b are formed with fitting recesses 2a1 and 2b1 at the projecting inner ends thereof, in which both end portions in the width direction of the transparent module substrate 5a of the LED module 5 are removably inserted.

これら一対の支持用突条2a,2bは、ランプカバー2の中心軸Oから半径方向一端側(図1,図3では上方)へ所定長偏位し、かつ、この中心軸Oに平行な面(図1,図3では水平面)内において内方へそれぞれ所定長突出し、中心軸Oに平行かつランプカバー2のほぼ全長に形成されている。このように支持用突条2a,2bを一体に形成したランプカバー2は、例えば透光性を有するポリカーボネート等の合成樹脂の押出成形等により一体に形成される。   The pair of supporting protrusions 2a and 2b are deviated by a predetermined length from the central axis O of the lamp cover 2 to one end in the radial direction (upward in FIGS. 1 and 3), and are parallel to the central axis O. (Horizontal plane in FIGS. 1 and 3) project inward by a predetermined length, and are formed substantially parallel to the central axis O and almost the entire length of the lamp cover 2. The lamp cover 2 in which the supporting protrusions 2a and 2b are integrally formed as described above is integrally formed by, for example, extrusion molding of synthetic resin such as polycarbonate having translucency.

LEDモジュール5は、基板の一例である電気絶縁性と透光性を有する例えばガラスエポキシ樹脂製や紙フェノール、紙エポキシ、ガラスコンポジット、アルミナ型であって、ランプカバー2とほぼ等しい長さの長方形平板状の透明モジュール基板5aを有する。この透明モジュール基板5aの表裏両面の幅方向中間部上には、SMD(表面実装形)やCOB(Chip On Board)型等であって、例えば白色発光の複数のLED6,6,…が長手方向に所要のピッチを置いて例えば一列で実装されている。   The LED module 5 is made of, for example, glass epoxy resin, paper phenol, paper epoxy, glass composite, alumina type having electrical insulation and translucency, which is an example of a substrate, and is a rectangle having a length substantially equal to the lamp cover 2. It has a flat transparent module substrate 5a. On the front and back sides of the transparent module substrate 5a, there are SMD (surface mount type), COB (Chip On Board) type, etc., for example, a plurality of white light emitting LEDs 6, 6,. For example, it is mounted in a row at a required pitch.

透明モジュール基板5aは、その両面(図1,図3では上,下両面)に図示省略の回路パターンをそれぞれ形成し、これら回路パターンの図示省略の複数対の電極上に、各LED6の一対の電極をそれぞれ固着して電気的に接続している。これら上下一対の回路パターンの一方が直流電流の往路に形成され、他方が復路に形成されている。   The transparent module substrate 5a is formed with circuit patterns (not shown) on both surfaces (upper and lower surfaces in FIGS. 1 and 3), and a pair of LEDs 6 on a plurality of pairs of electrodes (not shown) of these circuit patterns. The electrodes are fixed and electrically connected. One of the pair of upper and lower circuit patterns is formed in the forward path of the direct current, and the other is formed in the return path.

すなわち、図4,図5に示すように透明モジュール基板5aは、その上下両面に、回路パターンをそれぞれ形成し、これら回路パターン上に、上下一対の大形の透明電極7,8をそれぞれ形成している。これら大形の透明電極7,8は、透明モジュール基板5aの長手方向に所要のピッチを置いて形成されている。また、上下一対の透明電極7,8は複数のLED6,6,…同士間の離間距離よりも透明モジュール基板5aの短手方向に長く延在している。すなわち、透明電極7,8の透明モジュール基板5aの短手方向(幅方向)の長さは、複数のLED6,6,…同士間の離間距離よりも長く形成されている。そして、これら上下一対の各透明電極7,8は透明モジュール基板5aの表裏両面の各平面積の例えば60%〜80%を占める大形に形成され、電極と放熱面としての両機能を有する。これら大形の透明電極7,8の基板長手方向で隣り合う端部間には各LED6の一対の電極が跨るように固着されている。これら透明電極7,8の各外面(図5では上面と下面)には、LED6,6,…同士の中間において、電気絶縁性と透光性を有する透明絶縁層9,10をそれぞれ形成し、透明モジュール基板5aのほぼ全体を透明に形成している。   That is, as shown in FIGS. 4 and 5, the transparent module substrate 5a is formed with circuit patterns on both upper and lower surfaces thereof, and a pair of upper and lower large transparent electrodes 7 and 8 are formed on these circuit patterns. ing. These large transparent electrodes 7 and 8 are formed at a required pitch in the longitudinal direction of the transparent module substrate 5a. Further, the pair of upper and lower transparent electrodes 7 and 8 extend longer in the short direction of the transparent module substrate 5a than the distance between the plurality of LEDs 6, 6,. That is, the length of the transparent modules 7 and 8 in the short direction (width direction) of the transparent module substrate 5a is longer than the distance between the plurality of LEDs 6, 6,. The pair of upper and lower transparent electrodes 7 and 8 are formed in a large size that occupies, for example, 60% to 80% of each flat area of the front and back surfaces of the transparent module substrate 5a, and have both functions as an electrode and a heat dissipation surface. A pair of electrodes of each LED 6 is fixed between the end portions of these large transparent electrodes 7 and 8 adjacent to each other in the longitudinal direction of the substrate. On the outer surfaces (upper and lower surfaces in FIG. 5) of these transparent electrodes 7 and 8, transparent insulating layers 9 and 10 having electrical insulation and translucency are formed in the middle of the LEDs 6, 6,. The entire transparent module substrate 5a is formed transparent.

そして、透明モジュール基板5aは、給電用口金3側の一端部の上下(表裏)面上に、上下(表裏)一対の受電用コネクタ11a,11bを配設している。これら受電用コネクタ11a,11bは、給電用口金3側の給電用コネクタ3c,3cに着脱可能に嵌合されて電気的に接続される。また、各受電用コネクタ11a,11bは、透明モジュール基板5aの図示省略の回路パターンを介して各LED6に接続され、受電用コネクタ11a,11bにより受電した直流電力を各LED6に通電し白色発光させる。   The transparent module substrate 5a is provided with a pair of upper and lower (front and back) power receiving connectors 11a and 11b on the upper and lower (front and back) surfaces of one end portion on the power supply base 3 side. These power receiving connectors 11a and 11b are detachably fitted to and electrically connected to power feeding connectors 3c and 3c on the power feeding base 3 side. Further, each of the power receiving connectors 11a and 11b is connected to each LED 6 through a circuit pattern (not shown) of the transparent module substrate 5a. The DC power received by the power receiving connectors 11a and 11b is supplied to each LED 6 to emit white light. .

また、透明モジュール基板5aは、その上面上に、一対の受電用コネクタ11a,11bの後方(図3では右側)において、図示省略のブリッジダイオードを実装してもよい。ブリッジダイオードは給電用口金3の一対のL形ピン3b,3bにより受電した直流電力の極性が+極、−極のいずれであっても、各LED6に正しい極性の直流電力を給電する。   Further, on the upper surface of the transparent module substrate 5a, a bridge diode (not shown) may be mounted behind the pair of power receiving connectors 11a and 11b (on the right side in FIG. 3). The bridge diode feeds each LED 6 with DC power having the correct polarity regardless of whether the polarity of the DC power received by the pair of L-shaped pins 3b and 3b of the power supply cap 3 is positive or negative.

さらに、透明モジュール基板5aは、アース用口金4側の一端部(図3では右端部)において、給電用口金3側の一端部(図3では左端部)へ折り返す回路パターンを形成しており、透明モジュール基板5aの図3中右端部をアース用口金4の内面に直接接触させ、またはリード線により接続することにより、電気的に接続している。   Furthermore, the transparent module substrate 5a forms a circuit pattern that is folded back to one end portion (left end portion in FIG. 3) on the power supply base 3 side at one end portion (right end portion in FIG. 3) on the ground base 4 side. The right end portion in FIG. 3 of the transparent module substrate 5a is electrically connected by directly contacting the inner surface of the grounding cap 4 or by connecting with a lead wire.

さらに、透明モジュール基板5aの長手方向一端(図2では右端)に、複数の透明モジュール基板5a,5a,…の回路パターン同士を電気的に接続するために、図中左右一対の連結用コネクタ12a,12bを配設してもよい。   Further, in order to electrically connect the circuit patterns of the plurality of transparent module substrates 5a, 5a,... To one end in the longitudinal direction of the transparent module substrate 5a (the right end in FIG. 2), a pair of connecting connectors 12a on the left and right in the figure. , 12b may be provided.

そして、図1に示すようにランプカバー2は、透明モジュール基板5aの裏面(図1,図3では上面)5a1に対向する裏面部2c側の内面に、透光性と反射性を有する制光部13を形成している。   As shown in FIG. 1, the lamp cover 2 has a light-transmitting and reflective light-controlling surface on the inner surface of the transparent module substrate 5a facing the rear surface (the upper surface in FIGS. 1 and 3) 5a1. Part 13 is formed.

制光部13は、ランプカバー2の所要中心角でランプカバー2のほぼ全長に亘って形成され、複数の反射部と透光部を有する。反射部は、白色塗料等の反射塗料をドット状に塗布した所要の形状と寸法の複数の反射部を所要の間隔を置いて所要密度で形成し、LED6,6,…からの白色光を複数の反射部で反射する。透過部は、これら複数の反射部同士の間隙であり、光を透過させる。このために、ドット状の反射部の形状や寸法、形成密度を調整することにより、LEDモジュール5側へ反射させる光量と、ランプカバー2の裏面部2cを透過して外部へ照射される透過光量を制御できる。   The light control part 13 is formed over substantially the entire length of the lamp cover 2 at the required center angle of the lamp cover 2, and has a plurality of reflection parts and light transmission parts. The reflective part is formed with a required density and a plurality of reflective parts having a required shape and dimensions, in which a reflective paint such as a white paint is applied in the form of dots, and a plurality of white lights from the LEDs 6, 6,. Reflected by the reflective part. The transmission part is a gap between the plurality of reflection parts, and transmits light. For this purpose, the amount of light reflected to the LED module 5 side by adjusting the shape, size, and formation density of the dot-shaped reflecting portion, and the amount of transmitted light that is transmitted to the outside through the back surface portion 2c of the lamp cover 2 Can be controlled.

次に、このLEDランプ1の作用を説明する。   Next, the operation of the LED lamp 1 will be described.

LEDランプ1の給電用口金3が後述する照明器具等のソケットに装着されて、この給電用口金3の一対のL形ピン3b,3bに所定電圧の直流電力が給電されると、この直流電力が給電用コネクタ3c,3c、受電用コネクタ11a,11bおよびブリッジダイオードを介してLEDモジュール5の回路パターンに給電される。   When the power supply base 3 of the LED lamp 1 is attached to a socket such as a lighting fixture described later and a pair of L-shaped pins 3b and 3b of the power supply base 3 is supplied with a predetermined voltage, this DC power Is fed to the circuit pattern of the LED module 5 through the power feeding connectors 3c and 3c, the power receiving connectors 11a and 11b, and the bridge diode.

ブリッジダイオードは、給電用口金3が受電した直流電力の極性がLEDモジュール5の回路パターンの極性と相違する場合でも、LEDモジュール5の極性に一致させてLEDモジュール5に給電する。   The bridge diode supplies power to the LED module 5 in accordance with the polarity of the LED module 5 even when the polarity of the DC power received by the power supply base 3 is different from the polarity of the circuit pattern of the LED module 5.

これにより、LEDモジュール5の表裏両面5a2,5a1の複数のLED6,6,…が白色発光する。   Thereby, the plurality of LEDs 6, 6,... On the front and back surfaces 5a2, 5a1 of the LED module 5 emit white light.

図1中、透明モジュール基板5aの表面(図1中下面)5a2側のLED6,6,…の白色発光は、主に、この透明モジュール基板5aの垂直方向下方へ照射され、ランプカバー2を透過して図1中下方へ照射され、残りの白色光は透明モジュール基板5aを透過して裏面(図1では上面)5a1側へ照射され、ランプカバー2の裏面部2cの制光部13に照射される。制光部13では、白色光が複数のドット状の反射部によりLEDモジュール5側へ反射される一方、複数の透光部を透過して外部、すなわち、LEDランプ1の裏面部2c側へ照射される。   In FIG. 1, the white light emitted from the LEDs 6, 6,... On the surface (lower surface in FIG. 1) 5a2 side of the transparent module substrate 5a is mainly irradiated downward in the vertical direction of the transparent module substrate 5a and transmitted through the lamp cover 2. 1 is irradiated downward, and the remaining white light is transmitted through the transparent module substrate 5a and irradiated to the back surface (upper surface in FIG. 1) 5a1 side and irradiated to the light control portion 13 of the back surface portion 2c of the lamp cover 2. Is done. In the light control unit 13, white light is reflected to the LED module 5 side by the plurality of dot-shaped reflection units, and is transmitted to the outside, that is, the back surface 2 c side of the LED lamp 1 through the plurality of light transmission units. Is done.

一方、透明モジュール基板5aの裏面(図1中上面)5a1側のLED6,6,…の白色発光は、主に透明モジュール基板5aの垂直方向上方へ照射され、ランプカバー2の裏面部2c側の制光部13へ照射される。この制光部13では、白色光が複数のドット状の反射部により透明モジュール基板5a側へ反射される一方、透光部を透過してLEDランプ1の裏面側へ照射される。また、残りの光は透明モジュール基板5aを透過して図1中、下方へも照射される。   On the other hand, the white light emitted from the LEDs 6, 6,... On the back surface (upper surface in FIG. 1) 5a1 side of the transparent module substrate 5a is mainly irradiated upward in the vertical direction of the transparent module substrate 5a. The light control unit 13 is irradiated. In the light control unit 13, white light is reflected to the transparent module substrate 5 a side by a plurality of dot-like reflection units, and is transmitted to the back side of the LED lamp 1 through the light transmission unit. The remaining light passes through the transparent module substrate 5a and is also irradiated downward in FIG.

このために、ランプカバー2の裏面部2c側、すなわち、LEDランプ1の裏面側の明るさの向上を図ることができる。   For this reason, it is possible to improve the brightness of the back surface 2c side of the lamp cover 2, that is, the back surface side of the LED lamp 1.

しかも、このLEDランプ1は透明モジュール基板5aの表裏両面5a2,5a1に、LED6,6,…を実装しているので、これら表裏両面5a2,5a1のLED6,6,…の白色発光の光量を増加させることができ、そのために、LEDランプ全体の明るさの均一性を向上させることができる。また、これら表裏両面5a2,5a1のLED6,6,…の白色発光によりLEDランプ1の裏面側を照射するので、この裏面側のさらなる明るさの向上を図ることができる。   Moreover, since the LED lamp 1 has the LEDs 6, 6,... Mounted on the front and back surfaces 5a2, 5a1 of the transparent module substrate 5a, the amount of white light emitted from the LEDs 6, 6,. Therefore, the brightness uniformity of the entire LED lamp can be improved. Moreover, since the back surface side of the LED lamp 1 is irradiated by the white light emission of the LEDs 6, 6,... On the front and back surfaces 5a2, 5a1, it is possible to further improve the brightness on the back surface side.

なお、透明モジュール基板5aの裏面5a1(図1では上面)側のみにLED6,6,…を実装した場合でも、LEDランプ1の裏面側の明るさの向上を図ることができる。   Even when the LEDs 6, 6,... Are mounted only on the back surface 5a1 (upper surface in FIG. 1) side of the transparent module substrate 5a, the brightness on the back surface side of the LED lamp 1 can be improved.

(第2の実施形態)
図6は本発明の第2の実施形態に係る照明器具21の正面模式図である。この照明器具21は上記LEDランプ1と、所要の形状と寸法の器具本体22とを具備している。
(Second Embodiment)
FIG. 6 is a schematic front view of a lighting fixture 21 according to the second embodiment of the present invention. The lighting fixture 21 includes the LED lamp 1 and a fixture main body 22 having a required shape and size.

器具本体22は、例えば天井等に直付けまたは吊設等により配設される板金製等のシャーシ22aを有し、このシャーシ22aには、LEDランプ1,1Aの給電用口金3に所定電圧の直流電力を給電して点灯させる図示省略の電源装置と、この電源装置に電気的に接続されている給電用のソケット、例えば23aと、アース用のソケット23bを保持部材として設けている。   The instrument main body 22 has a chassis 22a made of sheet metal or the like that is directly attached to the ceiling or the like, for example, by being suspended, and the chassis 22a has a predetermined voltage applied to the feeding base 3 of the LED lamps 1 and 1A. A power supply device (not shown) that supplies DC power for lighting and a power supply socket electrically connected to the power supply device, for example, 23a, and a ground socket 23b are provided as holding members.

これらソケット23a,23bはLEDランプ1,1AのJEL801の給電用口金3とアース用口金4に適合するソケットにより構成され、これら口金3,4と着脱可能に装着される。   These sockets 23a and 23b are constituted by sockets suitable for the power supply base 3 and the ground base 4 of the JEL 801 of the LED lamps 1 and 1A, and are detachably attached to the bases 3 and 4.

この照明器具21によれば、上記LEDランプ1を具備しているので、このLEDランプ1と同様にLEDランプ1の裏面部2c側、すなわち、器具本体22側の明るさの向上を図ることができる。このために、LEDランプ1全体の明るさの均一性の向上を図ることができる。   According to this luminaire 21, since the LED lamp 1 is provided, the brightness on the back surface 2 c side of the LED lamp 1, that is, the luminaire main body 22 side can be improved in the same manner as the LED lamp 1. it can. For this reason, the uniformity of the brightness of the whole LED lamp 1 can be improved.

なお、上記実施形態では、透明モジュール基板5aの表裏両面5a1,5a2に、各々1列のLED6,6,…を設ける場合について説明したが、本発明はこれに限定されるものではなく、例えばLED6,6,…を複数列設けてもよい。また、LEDランプ1を環形に形成してもよい。   In the above embodiment, the case where the front and back surfaces 5a1, 5a2 of the transparent module substrate 5a are each provided with one row of LEDs 6, 6,... Has been described, but the present invention is not limited to this. , 6,... May be provided in a plurality of rows. Further, the LED lamp 1 may be formed in a ring shape.

以上、本発明の幾つかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   As mentioned above, although several embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

1…LEDランプ、2…ランプカバー(カバー)、5…LEDモジュール、5a…透明モジュール基板、5a1…透明モジュール基板の裏面、5a2…透明モジュール基板の表面、6…LED、7,8…表裏一対の透明電極、9,10…表裏一対の透明絶縁層。   DESCRIPTION OF SYMBOLS 1 ... LED lamp, 2 ... Lamp cover (cover), 5 ... LED module, 5a ... Transparent module substrate, 5a1 ... Back surface of transparent module substrate, 5a2 ... Front surface of transparent module substrate, 6 ... LED, 7, 8 ... Front and back pair A transparent electrode of 9, 10 ... a pair of front and back transparent insulating layers.

Claims (4)

透光性を有する基板およびこの基板の一面に実装されるLEDを有するLEDモジュールと;
LEDモジュールを収容し、基板を支持する支持部を備えた透光性を有するカバーと;
基板の一面または他面に対向するようにカバーに配設されて透光性と光反射性を有する制光部と;
を具備していることを特徴とするLEDランプ。
An LED module having a light-transmitting substrate and an LED mounted on one surface of the substrate;
A light-transmitting cover having a support portion that houses the LED module and supports the substrate;
A light control portion disposed on the cover so as to face one surface or the other surface of the substrate and having translucency and light reflectivity;
An LED lamp characterized by comprising:
LEDは、基板の両面に実装されていることを特徴とする請求項1記載のLEDランプ。 2. The LED lamp according to claim 1, wherein the LEDs are mounted on both sides of the substrate. LEDモジュールは、基板上の長手方向にLEDが複数個離間して実装されており、LED実装面上に、各LEDを電気的に接続し、LED間の離間距離よりも基板の短手方向に長く延在する透光性の電極を配設したことを特徴とする請求項1または2記載のLEDランプ。 In the LED module, a plurality of LEDs are mounted apart in the longitudinal direction on the substrate. Each LED is electrically connected on the LED mounting surface, and in the shorter direction of the substrate than the distance between the LEDs. 3. The LED lamp according to claim 1, further comprising a translucent electrode extending long. 請求項1ないし3のいずれか一記載のLEDランプと;
LEDランプを通電可能に保持する保持部材を有する器具本体と;
具備していることを特徴とする照明器具。
An LED lamp according to any one of claims 1 to 3;
An instrument body having a holding member for holding the LED lamp in an energizable manner;
A lighting fixture comprising:
JP2011068700A 2011-03-25 2011-03-25 Lamp and lighting fixture Withdrawn JP2012204187A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014093234A (en) * 2012-11-05 2014-05-19 Okamura Corp Illuminating device
CN106090650A (en) * 2016-07-29 2016-11-09 广州依恩施节能科技有限公司 A kind of LED fluorescent lamp and manufacture method thereof
JP2016540345A (en) * 2013-11-11 2016-12-22 フィリップス ライティング ホールディング ビー ヴィ lighting equipment
JP2018078127A (en) * 2018-02-05 2018-05-17 三菱電機株式会社 Luminaire
WO2018193930A1 (en) * 2017-04-19 2018-10-25 アイリスオーヤマ株式会社 Illuminating device
CN111895281A (en) * 2020-08-19 2020-11-06 深圳市维天科技有限公司 Lamp fitting

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014093234A (en) * 2012-11-05 2014-05-19 Okamura Corp Illuminating device
JP2016540345A (en) * 2013-11-11 2016-12-22 フィリップス ライティング ホールディング ビー ヴィ lighting equipment
US9644815B2 (en) 2013-11-11 2017-05-09 Philips Lighting Holding B.V. Luminaire
CN106090650A (en) * 2016-07-29 2016-11-09 广州依恩施节能科技有限公司 A kind of LED fluorescent lamp and manufacture method thereof
WO2018193930A1 (en) * 2017-04-19 2018-10-25 アイリスオーヤマ株式会社 Illuminating device
JP2018181738A (en) * 2017-04-19 2018-11-15 アイリスオーヤマ株式会社 Lighting device
CN110494690A (en) * 2017-04-19 2019-11-22 爱丽思欧雅玛株式会社 Lighting device
JP2018078127A (en) * 2018-02-05 2018-05-17 三菱電機株式会社 Luminaire
CN111895281A (en) * 2020-08-19 2020-11-06 深圳市维天科技有限公司 Lamp fitting

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